Webinars

SMTA Webinars

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars

May 28, 2020 Optimizing Conformal Coating Coverage for Improved Environmental Corrosion Protection
Jun 2, 2020 iNEMI/SMTA Quantifying Life Cycle Impacts for ICT Products – A Simpler Approach
Jun 2, 2020 SMT Printing Roundtable Discussion
Jun 2, 2020 Knowledge Based Qualification (KBQ) to Address Vibration Induced Interconnect Failures in Automotive Electronics
Jun 8, 2020 Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
Jun 9, 2020 Industry 4.0 for Electronics Assembly
Jun 16, 2020 iNEMI/SMTA Proposed Testing Protocols to Align Connector Reliability with Application Requirements
Jun 18, 2020 Effects of Mixing Solder Sphere Alloys with Bismuth-based Pastes on the Component Reliability in Harsh Thermal Cycling
Jun 23, 2020 Communicating With Impact and Developing Your Authentic Presence
Jul 6, 2020 Solderability Benchmarking, Failures & Production Testing Methods
Jul 8, 2020 Systematic Failure Analysis
Jul 9, 2020 Creating the Best Data Package for PCB Fabrication
Jul 21, 2020 Human Automation: Hands-Free Industry 4.0
Aug 10, 2020 Monitoring & Benchmarking Your Processes & Assembly Yields

Looking for a past webinar? Check the knowledge base.


What Can I Expect?

Pricing varies by webinar. SMTA often co-organizes webinars with chapters and pricing may be determined by the chapter. A minimum of four webinars are planned each year with no cost to members.

Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.

Questions?

If you have any questions, contact webinars@smta.org or +1-952-920-7682.

If you are interested in presenting a webinar complete the proposal form here.






Webinar:
Optimizing Conformal Coating Coverage for Improved Environmental Corrosion Protection

Thursday 28th May @ 11:00am US Eastern Time

Presenter: Chen Xu, Ph.D., Nokia Bell Labs

Free for members! 
Note: A recording will not be available but the slides will be provided to all registered attendees.  

Overview

Conformal coating is widely used to provide environmental protection for electronics in challenging environments with high relative humidity, corrosive gas and dust concentration as well as in coastal environments. Although the physical and chemical properties of conformal coatings are often characterized and studied, very little research has been done to understand the effectiveness of conformal coating in protecting electronics in various harsh environments. This work examines the effect of conformal coating coverage, especially the coating thickness, on the environmental protection of the conformal coating. Results of optimizing coating coverage and quality control will also be presented.

 

About the Presenter

Dr. Chen Xu

Dr. Chen Xu is a Distinguished Member of Technical Staff with Nokia Bell Labs CTO. He has extensive experience in the fields of semiconductor and electronic packaging, electronic manufacturing, surface finishes and coatings, failure mode analysis and reliability assessment. In the last 15 years, he has been focusing on the impact of environmental conditions (such as corrosive, dusty and salty environments) on the reliability and performance of electronic equipment. Chen Xu received his BS Degree in Chemistry from Tong-ji University in Shanghai, China and his Ph.D. in Physical Chemistry from Ruhr-University Bochum, Germany.









iNEMI/SMTA Webinar:
Quantifying Life Cycle Impacts for ICT Products – A Simpler Approach

Free for Everyone!
Register Now

Tuesday, June 2 @ 11:00am US Eastern Time

Presenter: Tom Okrasinski, Nokia Bell Labs

Co-Hosted by iNEMI

Overview

Information and communications technology (ICT) products are key to modern society. A large amount of energy is consumed during the manufacturing, use, and disposal of ICT products, in addition to other environmental impacts. The inherently short life and increasing demand of ICT products worldwide will only worsen the scenario. With today’s climate change challenges, it is incumbent on us, as electronics developers and manufacturers, to take action to reduce the impact. As in similar situations, one needs to be able to measure, to know what path to take. Life cycle assessment (LCA) is the well-recognized methodology to assess environmental impacts through a product’s life (cradle to grave), from raw material extraction to end of life. Performing an LCA for a complex product, such as ICT products, is usually done using large scale LCA software with expert resources. This is expensive and time consuming. This webinar will describe a simplified approach for estimating the eco-impact of ICT equipment which provides a means to more quickly and easily evaluate product concepts and optimize design trade-offs. It uses simplified techniques and algorithms for estimating primarily greenhouse gas emissions in terms of carbon dioxide equivalents. We will also discuss the development of the iNEMI Eco-Impact Estimator, its applicability, validation, along with current and proposed activities to further advance its capabilities for more general use.

About the Presenter:

Tom Okrasinski is a Senior Manager of the Product Environmental Engineering Group in Nokia’s Bell Labs Chief Technology Office. Over his career he has been committed to developing eco-sustainable programs and processes for Information and Communication Technologies product innovation and development. This includes product environmental life cycle assessment, energy efficiency improvement, eco-beneficial materials research & advancement, and eco-sustainability metrics development. Tom is co-leading a project for the International Electronics Manufacturing Initiative (iNEMI) that is updating and expanding the consortium’s previously developed eco-impact estimator tool, which enables extremely efficient and accurate life cycle impact assessment for ICT products.

Prior to Nokia, Tom worked in the telecommunications industry for Alcatel-Lucent and AT&T, and in the energy industry for ExxonMobil. He holds bachelor’s and master’s degrees in civil engineering from Drexel University, and is a licensed professional engineer and planner. He lives in Richmond, Virginia, USA.

 

Registrations are being taken through a third party - Register Now.









Webinar:
SMT Printing Roundtable Discussion

Free for Members!
Register Now

Hosted by: SMTA Wisconsin Chapter

Tuesday, June 2nd @ 4:30pm US Eastern Time

Presenter: Paul Wilson, Rockwell Automation 

The WI SMTA is hosting a SMT Printing Roundtable Discussion Webinar on Tuesday June 2nd at 4:30pm EST. This 90 minute question and answer session will include a panel of hands on experts that can provide insight on solving real world problems.

Our Panel consists of:

  • Paste Manufacturer
  • Stencil Manufacturer
  • Printer Manufacturer
  • SPI Manufacturer

We are looking to answer questions and have an open discussion about printing challenges in the industry.

We will start with a printing 101.  Please take look at this link (https://youtu.be/k_zq8k94zVU) – Printing basic video on SMTA’s website.

Topics we wish to cover:

How to reduce insufficient solders, or excessive solders, high tension stencils, nano coating (life), paste size, pin-and-paste.

We encourage attendees to ask questions and give any real life examples.

Please provide Paul Wilson with any questions in advance.   He can be reached at  pjwilson@ra.rockwell.com 

 

Please RSVP by Friday 5/29/2020. 
A Webinar link will be sent to people who pre-register for this event.
The event is FREE for SMTA Members / $25.00 for Non-Members

We look forward to hearing everyone on the webinar!

To RSVP, please click here, or copy and paste the following address into your web browser:

https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4896&BULK_EMAIL_NO=1

Registrations are being taken through a third party - Register Now.









Webinar:
Knowledge Based Qualification (KBQ) to Address Vibration Induced Interconnect Failures in Automotive Electronics

Free for all!

Open to Members and Non-Members; however ONLY Members will receive a copy of the presentation and recording of the webinar

Hosted by: SMTA India Chapter 

India Chapter

Tuesday, June 3rd @ 9:30am-10:30am (India Time)

Tuesday, June 2nd @ 11:00pm-12:00am (Central Time)

Presenter: Karumbu Meyyappan, Ph.D, Intel Corporation, Assembly & Test Technology Development division

Overview

This presentation intends to address an important gap between reliability test standards and real use conditions of automotive electronic components through a knowledge-based qualification (KBQ) process. With the growth of wide usage of board level electronics in electric and autonomous vehicles, electronic components are exposed to vibration all through their usage life. Relevant vibration-based test standards and field use condition data for this study were chosen and the observed component level failures are analyzed through a physics-based modeling approach. Results from studies show that industry qualification test standards do not adequately reflect the field failure risks.

About the Presenter:

Dr. Karumbu Meyyappan is a senior staff engineer at Intel Corporation in Assembly & Test Technology Development division. In his current role, he leads strategic programs related to the areas of test and next generation interconnectMacFadden solutions. Through his 15 years at Intel he has covered wide areas of reliability physics spanning Silicon back end to board level interconnects, design, predictive modeling, and development of reliability test methods including knowledge-based qualification methods. He has published over 30 peer reviewed articles and has 5 patents. He is also a recipient of the Erle Shobert Prize Paper award in 2014. He received his PhD from University of Maryland College Park, MD, USA.

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly

Organized by SMTA Europe

Hosted by: SMTA Europe Chapter 

Monday 8th June @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Bob WillisPresenter: Bob Willis, SMTA Europe

Overview

Most of the industry worldwide has been running no clean processes for many years and often, understandably, neglected important issues like design for cleaning, selecting compatible components and compatibility between cleaning materials and flux residues. With increased miniaturisation and the demands of modern circuits cleaning has come back to eliminate selected failures. Conformal coating is another process which has demanded special levels of surface cleanliness to guarantee coating adhesion and long-term reliability. Although there are high reliability producers that use coating with no clean, others want that extra confidence.

Topics included:

  • Testing boards, components and assemblies
  • International specifications and reference books
  • Ionic testing & non-ionic testing
  • Surface insulation measurement
  • Ion Chromatography (IC) test techniques
  • Shop floor test methods
  • Testing frequency during PCB fabrication & assembly
  • Cleanliness failure types

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example, they would like cover in the webinar it will need to be provided in advance of the session

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Industry 4.0 for Electronics Assembly

Organized by SMTA Europe

Hosted by: SMTA Europe Chapter 

Tuesday 9th June @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenters: Liam Mills (MTC), Stuart Saunders (MTC) & Nigel Burtt (Renishaw)

Free for members!

Overview

Improving operational efficiencies has reached the point where only marginal gains can be achieved and therefore full business system and process transformations are required in order for businesses to stay competitive. Increased autonomy, connected devices & data, and digitalisation must be leveraged by businesses to become more agile and efficient, and by utilising the data and autonomy effectively this can lead to increased productivity, increased flexibility of products and reduced product quality variability. Businesses are at different stages on their Industry 4.0 journeys and there are a number of solutions available on the market to support businesses. In partnership with its members, the Manufacturing Technology Centre (MTC) in the UK has been implementing a Smart Factory demonstration test bed for Electronics Assembly, where upgrading legacy equipment with smart capability has been the primary focus, using these off-the-shelf solutions where possible, and open source tools like the IPC-CFX standard as the machine to machine communication language, that can save huge amounts of time and investment.

Topics included:

  • Overview of the MTC
  • Overview of Industry 4.0
  • IPC-CFX and Hermes
  • Focus on Smart Factory for legacy equipment
  • Future project opportunities

Who should attend?
Production Engineering, Process Engineering, Business Improvement, Continuous Improvement, Automation Engineering, Digital Engineering/Transformation Engineers.

The webinar will run for between 30-45min with question and answer session. The webinar is limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide

Registrations are being taken through the SMTA Online Registration System.









iNEMI/SMTA Webinar:
Proposed Testing Protocols to Align Connector Reliability with Application Requirements

Free for Everyone!
Register Now

Tuesday, June 16 @ 11:00am US Eastern Time

Presenter: Vincent C. Pascucci, TE Connectivity’s Aerospace, Defense, and Marine Business Unit

Co-Hosted by iNEMI

 

Overview

Since the 1980s there has been enormous growth in the use of electronic devices which has driven similar, if not greater, growth in the number of electrical interconnects. As we become more dependent on these devices the need to ensure their reliability becomes more important. Two factors complicate this effort. The first is the reduction in size of electrical contacts and the commensurate reduction in contact normal force available to ensure a stable interface. The other factor is that reliability is not free. Thus, as the number of interconnects increases, cost considerations drive a need to ensure the reliability of connectors is matched to the needs of their specific applications. Testing protocols to help achieve this match will be discussed in this presentation. 

 

About the Presenter:

Vincent C. Pascucci is Senior Principal Engineer, managing the Failure Analysis and Reliability Engineering group within TE Connectivity’s Aerospace, Defense, and Marine business unit. He has worked with TE Connectivity, and previously AMP, since 1984.

Vincent serves as US Technical Advisor to IEC committees TC48 and SC48B and covenor (chair) of SC48B Working Group 5 responsible for electrical and electronic connector testing standards. He has authored papers on connector reliability topics presented at IEEE Holm and American Society for Quality conferences, along with the International Conference on Electrical Connectors, and others.

He is an American Society for Quality Certified Reliability Engineer and a graduate of the University of Rochester with degrees in Mechanical and Geomechanical Engineering. 

Registrations are being taken through a third party - Register Now.









Webinar:
Effects of Mixing Solder Sphere Alloys with Bismuth-based Pastes on the Component Reliability in Harsh Thermal Cycling

Free for all!
Register Now

Hosted by: SMTA Atlanta Chapter

Thursday, June 18th @ 4:00pm US Eastern Time

Presenter: Francy Akkara, Auburn University

Overview

Reliability of the new solder alloys has been a serious concern, especially in the harsh environment. Aging at elevated temperature alters the structural and mechanical properties of the solder joint and leads to the coarsening of the precipitates in the bulk solder and growth of the intermetallic compound layer, which in turn deteriorates the solder joint.  Various new elements such as bismuth, antimony, and nickel are micro-alloyed into the SnAgCu based alloys to slow down this deterioration process and improve the reliability. There haven’t been many studies about the effect of solder sphere alloys with bismuth pastes on the harsh thermal reliability. In this paper, the effect of mixing solder sphere alloys (SAC105, SAC305, matched solder sphere - paste) with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied.  Three surface finishes including OSP, ImAg, and ENIG are considered. The test vehicle consists of 15mm and 6mm Ball Grid Array (BGA) components. The assembled test boards were isothermally aged at 125oC for 12 months, which are then thermally cycled between -40oC to +125oC for 5800 cycles. It was observed that ENIG surface finish improves the component reliability comparing to OSP and ImAg. It is also observed that matching solder sphere with solder paste alloys improves the reliability in several cases, but a significant improvement was not observed when compared with the SAC305 solder spheres.   

About the Presenter:

Francy Akkara is pursuing his doctoral degree in Industrial and Systems Engineering at Auburn University. He has been working on electronics reliability for the past four years with focus on component reliability in thermal cycling. Francy has Masters degree in Electrical Engineering (Microelectronics) from Auburn University and is currently interning at Western Digital as  RAMP SSD Assembly Development Engineer. His research interests include reliability test design, effect of solder alloy composition and surface finishes, failure analysis, thermal cycling/mechanical shock reliability and defects in SMT assembly.

Registrations are being taken through a third party - Register Now.









Webinar:
Communicating With Impact and Developing Your Authentic Presence

Free for all!

Tuesday, June 23rd @ 11:00am US Eastern Time

Stephanie GoetzPresenter: Stephanie Goetz, Goetz Communications

Overview

The way you communicate and how you're perceived have a much bigger impact on your bottom line and your leadership than you think. But the good news is these are skills that anyone can refine and master with proper training and practice. In this webinar, you'll learn the best techniques of excellent communication and influential presence from renowned communication expert Stephanie Goetz of Goetz Communications. Stephanie coaches C-suite leaders and executives at Fortune 500 companies on how to be more dynamic, influential and impactful. You'll learn the skills of influencing your team, leading people in turbulent times, and the keys to having lasting influence.  

About the Presenter:

Stephanie Goetz is an award-winning journalist, executive speaker coach, pilot, philanthropist, and professional trainer. This Emmy-nominated broadcaster anchored and reported more than 5,000 newscasts at NBC, CBS, and ABC affiliates over 10 years. She is the founder and owner of Goetz Communications where she works with C-suite leaders, top executives and all walks of life to develop communications skills, media training, brand influence, and speaker effectiveness in preparing them for engagements with any size of audience. Her client list includes Fortune 500 companies like Microsoft,  Nike, T-Mobile, Cessna Aircraft, Thomson Reuters, Northwestern Mutual, Mastercard and more.

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Solderability Benchmarking, Failures & Production Testing Methods

Organized by SMTA Europe

Monday, 6th July @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)Bob Willis

Presenter: Bob Willis, SMTA Europe

Overview

The webinar provides an introduction and a better understanding of the soldering process and the effect of poor solderability on modern manufacture. Surface mount components can be a problem area, as are some of the surface finishes used on printed circuit boards. The online session aims to provide a basic understanding of solderability failure including ageing, test methods, both theoretical and practical, for circuit boards and components. It also shows how to test BGAs, LGA, CSP, PoP and flip chip packages on the shop floor in 10min

The webinar gives practical hands-on experience of solderability testing of different solder finishes and assessment of results. Using the instructor’s unique video material many process faults will be demonstrated. In process testing non laboratory testing is illustrated as well as the correlation with real process conditions.

Webinar Content:

  • What is solderability ?
  • Component and printed board storage life
  • Storage conditions for longer life
  • Artificial ageing tests and impact on yields
  • International specifications and test methods
  • Cost of Gold, Copper, Palladium, Silver, tin etc
  • Protective coatings and effects of soldering operations
  • Solderability reflow wetting patterns
  • Solderability tests:

                Dip and inspect, wetting balance, rotary dip test

                Simple production reflow test methods and criteria

                Wetting balance measurements

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like covered in the webinar, it will need to be provided in advance of the session

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here









Webinar:
Systematic Failure Analysis

Organized by SMTA Europe

Hosted by: SMTA Europe Chapter 

Wednesday 8th July @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Stefan Strixner, ZESTRON Europe

Free for members!

Stefan StrixnerOverview

In case of malfunctions of electrical assemblies in the field a proper failure analysis to identiy its root cause and define future avoiding measures is mandatory. This presentation will give each delegate a step by step practical procedure to execute a proper failure analysis and introduces meaningful examination methods on field cases.


Topics included:
•    Definition: "Failure/Damage"
•    Field cases
•    Methodology for Arranging and Systematical Processing of Information for the Damage Event
•    Practical tips
•    Potential Examination methods
•    Data Collection
•    Hypotheses and Key Figures
•    Practical Examples

 

Stefan Strixner has a Master of Science in Technical Chemistry and supports customers since foundation of ZESTRON. He has supported the implementation of hundrets of post soldering cleaning process and consults and trains partners and ZESTRON subsidiaries in Europe and Asia in terms of cleanliness, reliability and failure analysis.

 

The webinar will run for between 60-90min with question and answer session. The webinar is limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Creating the Best Data Package for PCB Fabrication

Free for SMTA & PCEA Members!

In association with: PCEA (Printed Circuits Electronics Association)

PCEA

Thursday, July 9th @ 11:00am US Eastern Time

Presenters: Stephen Chavez, Collins Aerospace & Mike Creeden, Insulectro

Overview

With this presentation attendees will learn what it takes to create a good manufacturing Data Package. A good data package starts with having good circuit data. Today’s circuit engineer must meet 3 Competing Perspectives for Success.  

Design For:

  • DFSolvability
  • DFPerformance
  • DFManufacturability

One must understand the end user’s requirements. These include cost targets, build quantities, performance, environment, testing, compliance, quality, and reliability goals. Manufacturing support starts with a partnership between your company and your supply chain. Early collaboration ensures that all expectations and requirements are established at the beginning of the development phase, prior to design completion. All these issues play a part of the design, manufacturing and performance of our end products.

Attendees will receive an understanding of how to create good design-data, allowing for manufacturing tolerance allowances. The goal is to ensure that the design data is correct by construction, can be manufactured with high producibility, high-yield, low-cost, and high-reliability.

Formats:

• Standard, non-intelligent data, such as Gerber files, NC Drill data, NC Rout Profile, Multi-up Array information; Fabrication & Assembly Drawings with all applicable materials, processes, manufacturing tolerances and acceptance criteria.

• ODB++ or IPC-2581 – Intelligent data output (With controlled settings).

Creation of manufacturing output should be a tightly controlled and accurate event providing exactly what the manufacturer needs to complete the build. 

About the Presenters:

Mike has over 43 years of industry experience: as an Educator, PCB designer, applications engineer and business owner.  

• Insulectro - Technical Director Design Education; helping OEM’s & fabricators to achieve design success for best material utilization  

• Executive Board, Vice Chairman - PCEA Printed Circuit Engineering Association

• Master Instructor CID+ IPC Designer Certification program 

• Primary Contributor for the CID+ curriculum 

• Currently teaching IPC-CID/CID+ curriculum with EPTAC  

• Founder of San Diego PCB Designs (Nationally recognized design center, sold in 2016) 

Steph Chavez

 

 A senior-level Printed Circuit Engineer with 29 years’ experience, Stephen Chavez has spent the last 10 years as a Staff Engineer and Technical Lead of PCB design for the Electronic Systems Center (ESC) division of Collins Aerospace. He is an acknowledged and recognized Subject Matter Expert (SME) in PCB design globally within the industry, and within Collins Aerospace. He is the Chairman of the PCEA, an IPC Certified Master Instructor Trainer (MIT), and an IPC Certified Advanced PCB Designer (CID+) for PCB Design. He has been an active IPC member and an industry contributor since 2003. He created an industry column in both Iconnect007 (PCBDesign007) magazine called “The Digital Layout” and in UP Media (Printed Circuit Design & Fabrication) magazine called the “The Digital Route”. As Chairman of PCEA, he continues to write under both these two columns, but under the sections “Message From The Chairman”. He has a very strong and extensive background regarding PCB design within the diverse fields of commercial, aerospace, military, space and medical electronics industries. He has Principal level industry experience which covers the full spectrum of PCB design, fabrication, and assembly. His experience ranges from simple two layer prototypes through complex multi-layer HDI and micro HDI technology PCBs where the structures ranged from rigid, flex, rigid-flex, and hybrids, with circuits containing analog, digital, RF, mixed signal, high speed, high power, and high voltage PCBs. He is a veteran of the United States Marine Corps, where he served five years as an Avionics Technician, and holds an A.S. degree in mathematics.

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Human Automation: Hands-Free Industry 4.0

Free for Members!

Tuesday, July 21st @ 11:00am US Eastern Time

Michael FordPresenter: Michael Ford, Aegis Software, UK

Overview

So many examples already exist of the utilization of Augmented Reality (AR), as it relates to assembly manufacturing operations. The vast majority of these are demos, carefully and painstakingly crafted to show the potential of the technology. Others are somewhat niche cases of real applications, again however, supported by significant customization and preparation behind the scenes, for each and every application instance.

This is only the first step however for Augmented Reality technology, which has a central part to play in our standards-driven Industry 4.0 Smart digital factory. AR provides hands-free, fully focused assembly support, when properly integrated into the latest digital MES tools. Providing interactive step by step guidance, allows operators to be fully flexible, without the need to be experts or specifically experienced in what they are doing.

This presentation details how AR technology available today, is to be a critical part of any Smart digital Industry 4.0 factory, sooner than you may think.

About the Presenter:

Working for Aegis Software, provides Michael the opportunity to apply his years of electronics assembly manufacturing experience, to drive both business process and technology solution innovation with customers and partners, that satisfies evolving needs in digital manufacturing, in a way that is value-driven and sustainable.

Starting his career with Sony, including eight years working in Japan, Michael has been instrumental in creating and evolving leading software solutions for assembly manufacturing, that meet the most demanding expectations, leading industry forward.

Today, Michael is an established thought leader for Industry 4.0 and digital Smart factories, an active contributor to IPC industry standards, including the Connected Factory Exchange (CFX) and IPC-1782 traceability standard, as well as helping promote and position others that together form IPCs digital manufacturing “best practices”. Michael regularly contributes articles, columns and blogs in several leading industry publications.

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Monitoring & Benchmarking Your Processes & Assembly Yields

Organized by SMTA Europe

Bob Willis

Hosted by: SMTA Europe Chapter 

Monday, 10th  August @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

There are no easy methods for companies to compare their manufacturing yields with other similar businesses. A common question asked by many company managers is "How does my process compare with other companies in terms of yield"? The information does not exist or is not easily available to small and medium volume companies

The most commonly used method of illustrating yield is Part Per Million (PPM) Defective. This provides a measure of the defect level against a process stage or a specific product compared against a known number of opportunities for defects to occur. There are IPC and IEC documents and procedures which do exist to monitor a process. This webinar will show how to implement a defect monitoring project in your company and the yield data produced. Bob Willis ran the SMART Group PPM Monitoring project supported by DTI and helped implement the LEADOUT project. these were the first project or their type in the world

Topics included in our webinar:

  • Why monitor your process for yield?
  • PPM, DPM or DPU
  • Collecting Inspection Data
  • Screen Printing
  • Inspection Criteria
  • Common Defects
  • Component Placement
  • IPC Inspection Criteria
  • Reflow Soldering
  • IPC Inspection Criteria
  • Wave Soldering
  • Collaborative Data Collection
  • Assembly Types
  • Comparing company yields

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like covered in the webinar, it will need to be provided in advance of the session

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.




All cancellation requests must be received prior to the start time of the event.


Copyright and Indemnification

The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.
Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


Technical Support

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  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.
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