SMTA Webinars

Webinars

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars

Jul 15, 2019 Vapour Phase & Convection Reflow with Lead Free – Selecting the Reflow Process
Aug 7, 2019 Recent Advances in X-Ray Technology
Aug 12, 2019 Conformal Coating - Successful Implementation & Quality Control
Sep 10, 2019 Electronic Hardware Corrosion
Sep 16, 2019 Manual Cleaning of PCB Assemblies – Successful Tricks of the Trade
Oct 14, 2019 Practical Failure Analysis Methods in Printed Board Assembly
Nov 11, 2019 Low Temperature Solder Benefits and Process Concerns
Dec 2, 2019 QFN/LGA Design, Assembly Process Issues & Reliability Failures

Looking for a past webinar? Check the knowledge base.


What Can I Expect?

Free Webinars (4 per year!)
One session lasting 30-60 minutes
Cost: Free for SMTA members
$25USD for non-members

Paid Webinars:
One session lasting 90 minutes
Cost: $25USD for SMTA members
$95USD for non-members

Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.

Questions?

If you have any questions, contact Ryan Flaherty, ryan@smta.org +1-952-920-7682.

If you are interested in presenting a webinar submit your abstract here.






Webinar:
Vapour Phase & Convection Reflow with Lead Free – Selecting the Reflow Process

Bob WillisMonday 15th July @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Having grown up with IR and Vapour Phase Soldering (VPS) during the introduction of surface mount technology it's safe to say that some processes never die, they just get better. Convection reflow took over from IR technology and changed the way industry looked at vapour phase but now it's back. For some companies VPS never went away, a simple one profile process. In Japan, high-end application used VPS during the introduction of lead-free technology.

Both convection and vapour phase can produce reliable lead-free assemblies, there are advantages and disadvantages to any technology, but they both work well and can be very cost effective, that is what our surveys have said. We also bring ten years of experience with lead-free using both techniques.

In this webinar the instructor will look at all aspects of the different processes, soldering performance and yield from different joint terminations, solder finishes and joint structures. Each delegate will also receive a FREE set of Bob Willis Inspection Wall Charts covering reflow soldering of lead-free terminations and common defects found in manufacture.

 

Topics include:

  • Vapour phase and convection reflow overview
  • Process parameters
  • Nitrogen/inert environment myths
  • Advantages & disadvantages of the process options
  • Design and layout considerations for VP
  • PCB solder finishes for VP & convection
  • Vapour phase materials and cost
  • Batch or inline operation
  • User experiences with VP materials and equipment
  • Profiling boards assemblies in both processes
  • Solder paste requirements
  • Comparing single and double sided reflow yields
  • Soldering flexible assemblies
  • Inspection results for reflow soldering

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here









Webinar:
Recent Advances in X-Ray Technology

Organized by SMTA India - Bangalore Chapter

Wednesday 7th August @ 10:00am India Time GMT+5:30 (12:30am US Eastern Daylight Time GMT -4)

Presenter: Keith Bryant, SMTA Europe

Only members will get access to the recorded presentation!
Members: USD $10 
Non-members: USD $20 

Members must log in to register at the member rate. Pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: smtaindiachapter@gmail.com +919620075752 or Madhukar Rao: +919686098690.

Overview

Taking x-ray images goes back over 100 years. Since then, there have been numerous advances in x-ray technology and these have been increasingly applied in helping the manufacturing of electronic components and assemblies, as well as in their failure analysis.

Most recently, this has been rapidly driven by the reduction in device and feature size and the movement to using newer, lower density materials within the structures, such as copper wire replacing gold wire as the interconnection material of choice within components. Another driver for developments is the engineering of single 3D packages with multiple chips stacked vertically one on top of the other, which results in smaller and more efficient packaging of devices.

In order to meet these challenges and those in the future, there have been a number of recent key improvements to the vital components within x-ray systems.

The choice of available technologies, however, means selecting the tube/detector combination, which is optimum for a particular electronics inspection application, is no longer so clear-cut. For example, one configuration may provide certain benefits that are applicable for one area of electronics inspection, whilst being less valid for others. This paper will review the various x-ray tube and detector types that are available and explain the implications of these choices for electronics inspection in terms of what they provide for inspection regarding image resolution, magnification, tube power, detector pixel size and the effects of detector radiation damage, amongst others.

 

Keith BryantAbout the Presenter

A fully qualified engineer, Keith has over thirty years’ experience in Electronics Manufacturing.  He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews.

He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years’ experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years.

Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.

Since 2017 he has been Global Sales Director of the leading X-ray manufacturer. He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe.

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Conformal Coating - Successful Implementation & Quality Control

Bob WillisMonday 12th August @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Conformal coating has provided benefits to industry for many years either in the high reliability market sector or where products have to deal with extreme environmental conditions. Different industries like telecommunications, automotive and consumer products benefit from the use of selective coating.

This session will provide a simple guide to the use of coatings, their application and process, product benefits, inspection and quality control. A practical session will also allow delegates to examine coated boards using different materials and inspect the coating application. Bob Willis will outline the most common coating problems, solutions and address your specific issues in this webinar session.

 

Topics include:

  • Why Conformal Coat
  • Coating Process Options
  • Cost of coating assemblies
  • Correct design for coating
  • Inspection & Quality Control of Coating
  • In-house or Contracting Services
  • Inspection of coatings & methods

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Electronic Hardware Corrosion

Organized by SMTA India - Bangalore Chapter

Tuesday 10th September @ 9:30am India Time GMT+5:30 (12:00am US Eastern Daylight Time GMT -4)

Presenter: PJ Singh, Ph.D., IBM Corporation

Only members will get access to the recorded presentation!
Members: USD $10 
Non-members: USD $20 

Members must log in to register at the member rate. Pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: smtaindiachapter@gmail.com +919620075752 or Madhukar Rao: +919686098690.

Overview

Corrosion-related electronic hardware failures manifest themselves as electrical opens or shorts. The common modes of corrosion are: (a) electrical opens due to the corrosion of silver terminations in surface-mount resistors; and (b) electrical shorts on printed-circuit boards due to creep corrosion. An ASHRAE conducted survey of data centers concluded that these failures generally occurred when the air quality in data centers was such that the copper and silver corrosion rates were greater than 300 and 200 angstroms/month, respectively. Recent design corrective actions have significantly reduced these failures. Ion migration, another common corrosion-related failure mode that causes electrical shorts, occurs under high humidity condition, even in environments relatively free of gaseous contamination. Yet another failure mode, somewhat related to corrosion, that is becoming quite common is the deliquescence of deposited particulate matter short circuiting neighboring features on printed-circuit boards when the relative humidity in a data center is greater than the deliquescence relative humidity of the settled particulate matter.  The webinar will present these and related topics in detail.

 

PJ Singh, Ph.D.About the Presenter

Prabjit Singh is a Senior Technical Staff Member in the Materials and Processes Department in IBM Poughkeepsie, New York, with 40 years of experience in the metallurgical engineering aspects of mainframe computer power, packaging, cooling and reliability. He has 76 issued patents, and is an IBM Master Inventor.

PJ Singh received a B. Tech. from the Indian Institute of Technology, Kharagpur, a MS and Ph.D. from the Stevens Institute of Technology, all in the field of metallurgical engineering. Recently, he received a MS in micro-electronic manufacturing from RPI and a MS in electrical engineering from the National Technological University.

PJ Singh is active in ASHRAE, iNEMI and IPC technical societies researching printed circuit board creep corrosion and the acceptable limits of air contamination in mission-critical data centers. He is an adjunct professor of electrical engineers at the State University of New York at New Paltz.

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Manual Cleaning of PCB Assemblies – Successful Tricks of the Trade

Bob WillisMonday 16th September @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

After rework, modification or second stage assembly cleaning may need to be considered. Ideally a no clean flux, gel or solder paste should be used to avoid the need to clean selected areas. If manual cleaning is to be conducted every effort should be made to use materials or application methods that result in the minimum residues from the soldering process.

Planning and training staff in manual cleaning are very important to get the best possible result visually and to maintain product reliability. This is one of the first training sessions to cover manual cleaning of board assemblies, highlighting the problems and solutions to manual cleaning.

 

Topics include:

  • Why clean
  • Material selection
  • Manual cleaning techniques
  • Testing cleanliness
  • Inspection requirements
  • Component compatibility
  • Reliability test techniques

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Practical Failure Analysis Methods in Printed Board Assembly

Bob WillisMonday 14th October @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Different levels of failure analysis exist, from the very basic with virtually no equipment, to the use of a full failure analysis laboratory. Often simple analysis methods can point engineers in the right direction, but proving the root cause of failure often needs the electronic pathologist with all his investigation tools. When conducting any failure analysis, it is important the results prove the cause of the fault. The true reason for failure needs to be clear and proven with hard facts, not just opinions.

 

Topics include:

  • Optical and X-ray inspection
  • Solder joint crack detection
  • Microsectioning
  • Component opening techniques
  • Surface analysis
  • Shear testing
  • Question and answer session

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
Low Temperature Solder Benefits and Process Concerns

Bob WillisMonday 11th November @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

The use of low temperature soldering is gaining interest in the industry to reduce cost, prevent component and PCB damage and improve reliability. It’s different but that does not mean it cannot be introduced into your process with existing process equipment. Generally speaking, solders used regally in assembly reflow at over 220°C, low temperature solders reflow at under 180°C. There are some organisations predicting a large growth in low temperature materials in the next two to three years for multistep soldering.

Many companies have been using tin/bismuth alloys for some years reducing cost on PCBs and energy. Other companies have been using tin/indium for rework of lead-free area array packages with success. There are savings to be made even if the cost of the solder alloy is much more expensive provided you consider the total cost of manufacture. We produced the first book, video and interactive CD-ROM on pin in hole intrusive reflow, so we believe we are in a good position to help engineers achieve high yields with low temperature materials.

 

Topics include:

  • Why use low temperature solder
  • Benefit over lead-free alloys
  • Materials available
  • Reflow soldering and rework results
  • Reliability with mixed alloys
  • Inspection results

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
QFN/LGA Design, Assembly Process Issues & Reliability Failures

Bob WillisMonday 2nd December @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

New components often provide challenges to design, process and quality engineers. Solder joint failure, voiding plus contamination & corrosion are just a few of the problems experienced so far. Any large area component with a low stand off which needs to be reflow soldered to a substrate can be a challenge but at ever decreasing pitch the need for good process validation and correct design is vital for high yields.

Having had hands on experience with these parts since conducting design reviews, setting up processes, conducting failure analysis we may not have all the answers, but we do know the right questions to ask in manufacture.

Provided FREE with this webinar are Bob Willis QFN inspection and quality control wall charts to use in your own manufacturing and training facility.

 

Topics include:

  • Design options to reduce failures
  • Process improvements in design and assembly
  • Void reduction
  • Improvements in joint reliability
  • Simple 5min solderability assessment
  • Improved cleaning performance
  • Results in cleaning and SIR on QFN packages
  • Process results from vapour phase and convection reflow
  • Solder joint reliability
  • IPC design and process guidelines

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. If you have a process example you would like covered in the webinar it will need to be provided in advance of the session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.




All cancellation requests must be received prior to the start time of the event.


Copyright and Indemnification

The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.
Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


Technical Support

  • As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar questions panel to send your questions to the organizer during the event.
  • For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (877) 582-7011 (US and Canada, toll free).
  • Test your connection to make sure you can access the webinar.
  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.
  • SMTA Headquarters
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    Phone +1 952.920.7682
    Fax +1 952.926.1819