Webinars

SMTA Webinars

Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price.

Upcoming Webinars

Oct 14, 2019 Practical Failure Analysis Methods in Printed Board Assembly
Oct 30, 2019 FREE Advances in X-Ray for Demanding Applications
Nov 11, 2019 Low Temperature Solder Benefits and Process Concerns
Dec 2, 2019 QFN/LGA Design, Assembly Process Issues & Reliability Failures

Looking for a past webinar? Check the knowledge base.


What Can I Expect?

Free Webinars (4 per year!)
One session lasting 30-60 minutes
Cost: Free for SMTA members
$25USD for non-members

Paid Webinars:
One session lasting 90 minutes
Cost: $25USD for SMTA members
$95USD for non-members

Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.

After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.

Questions?

If you have any questions, contact Ryan Flaherty, ryan@smta.org +1-952-920-7682.

If you are interested in presenting a webinar complete the proposal form here.






Webinar:
Practical Failure Analysis Methods in Printed Board Assembly

Bob WillisMonday 14th October @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Different levels of failure analysis exist, from the very basic with virtually no equipment, to the use of a full failure analysis laboratory. Often simple analysis methods can point engineers in the right direction, but proving the root cause of failure often needs the electronic pathologist with all his investigation tools. When conducting any failure analysis, it is important the results prove the cause of the fault. The true reason for failure needs to be clear and proven with hard facts, not just opinions.

 

Topics include:

  • Optical and X-ray inspection
  • Solder joint crack detection
  • Microsectioning
  • Component opening techniques
  • Surface analysis
  • Shear testing
  • Question and answer session

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









FREE Webinar:
Advances in X-Ray for Demanding Applications

Organized by SMTA Penang Chapter
Register Now

Wednesday 30th October @ 2:00pm Penang Time UTC+8
(2:00am US Eastern Time UTC-4)

Presenter: Keith Bryant, Chairman SMTA Europe

Free for all – only members will get access to slides and recorded presentation!

Overview

The taking of x-ray images goes back over 100 years, since then there have been numerous advances in x-ray tube and detector technology and these have been increasingly applied into helping with the manufacturing of electronic components and assemblies, as well as in their failure analysis. Most recently, this has been driven partly by the continued reduction in circuit board, device and feature size and the movement to using lower density materials within the structures, such as copper wire replacing gold wire as the interconnection material of choice within components.

However, due to the solar and battery advances, where heat transfer is critical and voiding is a huge problem, we are also seeing an increasing amount of high-density and thick materials which need to be imaged and worse still, low-density materials in combination with high-density ones. In order to meet these most recent challenges and those in the future, there have been a number of key improvements to the vital components within x-ray systems, which will be covered in the presentation.
 
The choice of available technologies, however, means selecting the tube/detector combination, which is optimum for electronics inspection is no longer so clear-cut. For example, one configuration may provide certain benefits that are applicable for one area of electronics inspection, whilst being less valid for others. This presentation will look at both ends of the spectrum of demanding applications, low-power applications using LED's as a subject and high-power applications showcasing IGBTs. 

 

About the Presenter

Keith Bryant

A fully qualified engineer, Keith has over thirty years' experience in Electronics Manufacturing.  He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews. 

He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years' experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years. 

Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.
from 2017 to 2019 he was Global Sales Director of the leading X-ray manufacturer. Recently reverting to a Consultancy role allowing him more freedom to pursue other projects, including i4.0.

He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.

Registrations are being taken through a third party - Register Now.









Webinar:
Low Temperature Solder Benefits and Process Concerns

Bob WillisMonday 11th November @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

The use of low temperature soldering is gaining interest in the industry to reduce cost, prevent component and PCB damage and improve reliability. It’s different but that does not mean it cannot be introduced into your process with existing process equipment. Generally speaking, solders used regally in assembly reflow at over 220°C, low temperature solders reflow at under 180°C. There are some organisations predicting a large growth in low temperature materials in the next two to three years for multistep soldering.

Many companies have been using tin/bismuth alloys for some years reducing cost on PCBs and energy. Other companies have been using tin/indium for rework of lead-free area array packages with success. There are savings to be made even if the cost of the solder alloy is much more expensive provided you consider the total cost of manufacture. We produced the first book, video and interactive CD-ROM on pin in hole intrusive reflow, so we believe we are in a good position to help engineers achieve high yields with low temperature materials.

Topics include:

  • Why use low temperature solder
  • Benefit over lead-free alloys
  • Materials available
  • Reflow soldering and rework results
  • Reliability with mixed alloys
  • Inspection results

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.









Webinar:
QFN/LGA Design, Assembly Process Issues & Reliability Failures

Bob WillisMonday 2nd December @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

New components often provide challenges to design, process and quality engineers. Solder joint failure, voiding plus contamination & corrosion are just a few of the problems experienced so far. Any large area component with a low stand off which needs to be reflow soldered to a substrate can be a challenge but at ever decreasing pitch the need for good process validation and correct design is vital for high yields.

Having had hands on experience with these parts since conducting design reviews, setting up processes, conducting failure analysis we may not have all the answers, but we do know the right questions to ask in manufacture.

Provided FREE with this webinar are Bob Willis QFN inspection and quality control wall charts to use in your own manufacturing and training facility.

 

Topics include:

  • Design options to reduce failures
  • Process improvements in design and assembly
  • Void reduction
  • Improvements in joint reliability
  • Simple 5min solderability assessment
  • Improved cleaning performance
  • Results in cleaning and SIR on QFN packages
  • Process results from vapour phase and convection reflow
  • Solder joint reliability
  • IPC design and process guidelines

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. If you have a process example you would like covered in the webinar it will need to be provided in advance of the session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Registrations are being taken through the SMTA Online Registration System.




All cancellation requests must be received prior to the start time of the event.


Copyright and Indemnification

The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.
Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.


Technical Support

  • As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar questions panel to send your questions to the organizer during the event.
  • For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (877) 582-7011 (US and Canada, toll free).
  • Test your connection to make sure you can access the webinar.
  • Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.
  • SMTA Headquarters
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    Eden Prairie, MN 55344 USA

    Phone +1 952.920.7682
    Fax +1 952.926.1819