Reference books on electronics assembly, packaging, and related technology
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FEATURED BOOKS & PROCEEDINGS
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.
The 22nd Annual Pan Pacific Microelectronics Symposium which took place February 6-9, 2017 at the Sheraton Kauai Resort on Kauai, Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. More than 50 papers from the technical program are available in the proceedings. In addition to several inspiring keynotes, this program features ground-breaking research from global experts on advanced processes, design, embedding and Fan-Out packaging, interposer technology, materials, nanotechnology, quality, reliability, roadmaps and manufacturing strategies.
Sponsored jointly by the SMTA and Chip Scale Review magazine, the 13th annual IWLPC addressed cutting edge topics in 3 key technology tracks: Wafer-Level, 3D, and MEMS packaging. The proceedings contain over 50 technical papers from leading experts in the advanced packaging industry. The conference took place October 18-20, 2016 at the DoubleTree by Hilton San Jose Hotel.
The SMTA International Conference Proceedings contain the latest and highest quality information and research on electronics assembly, lead-free, SMT, Package-on-Package, process control, Embedded Actives/Passives, 3D/TSV, Printed Electronics, and more... You can download over 130 papers from all sessions at SMTA International held September 25 - 29, 2016 in Rosemont, Illinois, including the AIMS/Harsh Environments Symposium, the Lead-Free Soldering Technology Symposium, and the Emerging Technologies Summit.
This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described.
The Printed Circuits Handbook has served as the definitive source for coverage of every facet of printed circuit boards and assemblies for 50 years. And now, for the first time anywhere, the new edition of this essential guide provides time-saving tools for success in the area of printed circuit supply chain management, including an entire new section on the elements of design, supplier identification and qualification, process control, product acceptance processes, and quality and reliability specification and assurance.
The 21st Annual Pan Pacific Microelectronics Symposium which took place January 25-28, 2016 at the Hapuna Beach Prince Resort on the Big Island of Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. More than 50 papers from the technical program are available in the proceedings. Session topics ranged from 3D/Heterogeneous Integration and Nano-Technology to Wearable Electronics and Internet of Things (IoT).
This is your source for the latest and highest quality information and research on electronics assembly, lead-free, SMT, Package-on-Package, process control, Embedded Actives/Passives, 3D/TSV, Printed Electronics, and more... You can download over 130 papers from all sessions at SMTA International held September 27 - October 1, 2015 in Rosemont, Illinois, including the AIMS/Harsh Environments Symposium, the Lead-Free Soldering Technology Symposium, and the Evolving Technologies Summit.
Should you clean your product during manufacturing? If so, when and how? Cleaning is essential for proper performance, optimal quality, and increased sales. Inadequate cleaning of product elements can lead to catastrophic failure of the entire system and serious hazards to individuals and the general public. With 90% new or revised chapters plus supplementary online material, the handbook has grown into two comprehensive volumes, Cleaning Agents and Systems and Applications, Processes, and Controls.
The proceedings from the technical program at the International Conference on Soldering & Reliability, held May 19-21, 2015, at the Hilton Markham Suites in Markham, ON, Canada are now available for download. The technical conference featured 28 presentations on topics including lead-free solders, materials as different as graphene, nanofibers and coatings, stencils for disparate-sized components, and prevention of defects like tin whiskers and head-in-pillow. Speakers represented companies including BAE Systems, Celestica, Creation Technologies, Intel Corporation, Jabil Circuit, Rockwell Collins, Verdant Electronics, and schools including University of Singapore, University of Waterloo, University of Toronto, and SUNY Binghamton.
Three-dimensional molded interconnect devices (MID) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.
The 2015 iNEMI Roadmap is now available for sale in the SMTA BookStore. As the only industry roadmap that looks at the entire supply chain, the iNEMI Roadmap delivers in-depth information about the challenges and opportunities facing the electronics manufacturing industry over the next 10 years. It also provides direction regarding the technologies required to meet the ever-evolving needs of this rapidly diversifying and growing industry.
The 20th Annual Pan Pacific Microelectronics Symposium which took place February 2-5, 2015 at the Sheraton Poipou Resort in Kauai, Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. More than 50 papers from the technical program are available in the proceedings. Session topics ranged from Power Electronics and Nano-Technology to Wearable Electronics and 2.5/3D Interposers.
Sponsored jointly by the SMTA and Chip Scale Review magazine, the 11th annual IWLPC addressed cutting edge topics in 3 key technology tracks: Wafer-Level, 3D, and MEMS packaging. The proceedings contain over 50 technical papers from leading experts in the advanced packaging industry. The conference took place November 11-13, 2014 at the DoubleTree San Jose Airport Hotel.
In 2014 INEMI, MEPTEC, and SMTA joined forces to host the Medical Electronics Symposium September 18-19, 2014 in Portland, Oregon. The presentations focus on advances in electronic technologies and advanced manufacturing, specifically targeting medical and bioscience applications. The symposium covered three tracks: Components and Designs for Higher Density Functionalities, Solutions for Best-in-Class Assembly and Volume Manufacturing, and Next Generation Microelectronics for Changing Healthcare Markets. Over 30 presentations are included in the proceedings.
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Topics covered in the book include various theories or mechanisms of adhesion, surface (physical or chemical) characterization of materials as it pertains to adhesion, surface cleaning as it pertains to adhesion, ways to improve adhesion, unraveling of interfacial interactions using an array of pertinent techniques, characterization of interfaces / interphases, polymer-polymer adhesion, metal-polymer adhesion (metallized polymers), polymer adhesion to various substrates, adhesion of thin films, underfills, molding compounds, and different dielectric materials, delamination and reliability issues in packaged devices, interface mechanics and crack propagation, and adhesion measurement of thin films and coatings.
This is your source for the latest and highest quality information and research on electronics assembly, lead-free, SMT, Package-on-Package, process control, Embedded Actives/Passives, 3D/TSV, Printed Electronics, conflict minerals, and more... The flash drive includes over 130 papers from all sessions at SMTA International held September 28 - October 2, 2014 in Rosemont, Illinois, including the AIMS/Harsh Environments Symposium, the Lead-Free Soldering Technology Symposium, and the Evolving Technologies Summit.
A set of 15 colour wall charts available covering inspection and process defects in High Temperature assembly. The photographic poster guide is ideal reference source in your organisation and is provided as an Acrobat pdf file. The individual sheets can be printed at A4 for bench top reference or as A3 colour posters for display for operator reference or as a training aid. The posters cover different solder alloys through hole and selective soldering to leads and chip terminations.
The HT Photo Album provide process, quality engineers, marketing or editorial staff with a unique source of photographs which may be used in company inspection documents, technical presentations and web sites. The photographs can also be used in marketing and advertising material or in technical articles. They may be simply pasted into any Word or PowerPoint document for in house company use. Photographs on the CD are normally provided in .jpg format. This Photo CD-ROM contains over 100 images including through hole and surface mount solder joints, microsections, x-ray images, conformal coating and the different types of process failures that may be found during assembly and equipment operation.
This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 13-15, 2014, at the Four Points by Sheraton Toronto Airport Hotel in Toronto, ON, Canada. There are 25 technical papers on topics ranging from Tin Whisker testing and micro-Alloying to Bottom Termination Component voiding and High Temperature, High Reliability lead-free solder issues. Research was compiled from a variety of companies including Alpha, BAE International, BlackBerry, Celestica Inc., DfR Solutions, IBM Corporation, Indium Corporation, Kyzen Corporation, Nihon Superior Company, Ltd, Rockwell Collins, Universal Instruments Corporation, several renowned universities, and more.
Although test has always been thought of as a necessary evil, in reality it is the single best way to ensure that a product meets the needs of your customer. Throughout the development process test is used to reduce the risk that the design, theory, and final product, reality, are as close to each other as possible. The SMTA Testability Guidelines TP-101E were developed by various Task Forces, each concentrating on its own discipline. The work of the various Task Forces is featured as separate chapters. The Guidelines were intended to assist the reader in dealing with the testability considerations that need to go into the design, development, and test of a product.
Site licenses are available for multiple users to access the SMTA Testability Guidelines electronically.
Originally conceived as a supplement to the SMTA Certification Program, this book is a must-have reference manual for all process engineers working in the electronics industry as well as anyone just entering the industry. The book provides an in-depth understanding of the entire electronic assembly process. Chapter topics include soldering and materials, printed wiring boards, components, paste-print stencil, component placement, assembly line design and optimization, solder reflow, wave soldering, dispensing, and inspection and test.
This book describes in detail modern technologies for printed electronics, explaining how nanotechnology and modern printing technology are merging to revolutionize electronics fabrication of thin, lightweight, large, and inexpensive products. Readers will benefit from the explanations of materials, devices and circuits used to design and implement the latest applications of printed electronics, such as thin flexible OLED displays, organic solar cells, OLED lighting, smart wallpaper, sensors, logic, memory and more.
The 19th Annual Pan Pacific Microelectronics Symposium that took place February 11-13, 2014, at the Hapuna Beach Prince Resort on the Big Island of Hawaii was well received by attendees from North America, Asia, and Europe. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world. More than 50 papers from the technical program are featured here. Topics included Interposers, Roadmaps and Industry Trends, Embedded Assemblies, Assembly Challenges, 3D and TSV Technologies, Prognostics and Health Management, Business Strategies, Power Electronics, Reliability and Failure Analysis, Manufacturing Paradigms, Statistics and Probability, Connection Taxonomy, Simulation and Modeling.
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
This thesis work is designed to clarify and control the fundamental mechanisms that govern whisker formation. The research focuses on reproducible "laboratory" created whiskers under a variety of rigorously controlled environmental factors such as film thickness, film stress, substrate material, gas environment, and humidity exposure, which are known to play a significant role in whisker production. The ultimate question of how to impede and/or prevent whisker growth is also addressed and shows that whisker prevention is possible via hard metal capping films, which are impenetrable by whiskers.
Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics.
Design-for-Environment (DfE) is a methodology that has revolutionized the way engineers approach electronics products, increasing their efficiency and decreasing their environmental and social impacts. The many business advantages of DfE include a 1%-5% reduction in Cost of Goods Sold (COGS), increased reliability (80% of DFE principles increase reliability), and increased competitive edge and customer loyalty. As the regulatory burden on electronics products grows, the demand for DfE-trained engineers has increased. With DfE OnlineTM, this methodology is now available to you in a time-efficient, self-paced package, saving you hundreds of hours of research.
DfE OnlineTM will teach you DfE principles to develop products that are in compliance, more efficient and less costly to produce. DfE OnlineTM provides you hundreds of tools, tips, case studies, videos, and interactive exercises, as well as a professional Forum.
This study guide provides an Overview for Experienced SMT Professionals in Preparation for the SMTA Six Sigma Green Belt Certification Program. Purchasing this study guide in advance is a good way to review and ensure you are prepared for the workshop and exam.
This study guide provides an Overview for Experienced SMT Professionals in Preparation for the SMTA Certification Program. The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level. Purchasing this study guide in advance is a good way to review and ensure you are prepared for the workshop and exam.
As in all industries profit is the motive for the electronics assembly industry. Therefore, understanding assembly cost should be a prime concern. The stakes are indeed great as approximately 10 to 15% of the $1.5 trillion electronics industry is assembly cost. Surprisingly, there does not appear to be a systematic approach to cost estimating in the industry.
Featuring ProfitPro(TM), an Excel®-based software application that calculates the cost and profit related to PWB assembly, the SMTA Cost Estimating Guidelines for electronic assembly will review some efforts to remedy this situation. ProfitPro(TM) is user-friendly in that it has "default" values of cost metrics if the user does not know them, and it can calculate "what-if scenarios."