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Failure Modes and Mechanisms in Electronic Packages

Failure Modes and Mechanisms in Electronic Packages
Author: Puligandla Viswanadham
Publisher: Springer
Copyright Year: 1998
Number of Pages: 370
Non-Member Price: $259.00
Member Price: $249.00

This comprehensive guide addresses various aspects of failure modes and mechanisms that are essential to the success of today’s highly complex electronic products. However, failure modes and mechanisms are generally treated in a peripheral manner in most current packaging literature.

This text illustrates the fundamental causes of failures such as design, materials, and manufacturing processes, offers preventative methods through failure analysis, and provides design, material, and process improvements in electronics packaging. A detailed account of the failures of device packages, discrete components connectors, PCB carriers, and PCB assemblies are presented. Real life examples of failures commonly observed in the packaging industry as well as surveys of various failure models are also outlined in this book.

This book can be utilized in many different ways by a diverse audience. The text can be used as an introduction for students and those entering the field of electronic materials and packaging as well as a reference for process engineers and managers. It is also and ideal source book for electronic packaging engineers.


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