International Wafer-Level Packaging Conference (IWLPC) 2018 Proceedings Download
Copyright Year: 2018
Non-Member Price: $310.00
Member Price: $300.00
Sponsored jointly by the SMTA and Chip Scale Review magazine, the 15th annual IWLPC brought together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The proceedings contain research in the form of technical papers from leading experts in advanced packaging. The conference took place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose Hotel.