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SMART/NPL Process, Design & Reliability Seminar 2017 Compendium

SMART/NPL Process, Design & Reliability Seminar 2017 Compendium
Author: SMART Group and NPL
Publisher: SMTA
Copyright Year: 2017
Non-Member Price: $60.00
Member Price: $50.00

NPL/SMART organized a seminar on November 9th, 2017 at NPL in Teddington, UK, showcasing the latest research and results from NPL projects looking at solder joint and contamination failure, coating thickness measurement, solder joint reliability, high temperature reliability for alternative solders and substrates materials. You can download all ten presentations from the seminar in this compendium.

Presentations include:

  • Whisker Mitigation: 1000 Days of Testing to Evaluate Conformal Coatings
  • Performance and Lifetime of Printed Semiconductors
  • Condensation Failure and Improved Testing for Electronic Assemblies
  • High Temperature Electronics and Their Reliability
  • Factors Affecting Moisture Diffusion in PCBs
  • UV Non-Destructive Coating Thickness Measurement System
  • Coatings for High Temperature Applications
  • Effect of Production Process and laminate Materials on Conductive Anodic Filament (CAF) Failure
  • Best methods to evaluate assembly reliability, how to test and what to expect in terms of failure with different test methods


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