International Wafer-Level Packaging Conference (IWLPC) 2017 Proceedings Download
Copyright Year: 2017
Non-Member Price: $160.00
Member Price: $150.00
Sponsored jointly by the SMTA and Chip Scale Review magazine, the 14th annual IWLPC brought together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The proceedings contain research in the form of technical papers from leading experts in advanced packaging. The conference took place October 24 - 26, 2017 at the DoubleTree by Hilton San Jose Hotel.