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3D Microelectronic Packaging: From Fundamentals to Applications

3D Microelectronic Packaging: From Fundamentals to Applications
Author: Yan Li and Deepak Goyal
Publisher: Springer
Copyright Year: 2017
Number of Pages: 463
Non-Member Price: $239.00
Member Price: $229.00

Sorry, this item has been discontinued and is no longer available in the SMTA BookStore. Contact us if you need info about the publisher.

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