SMTA International Wafer-Level Packaging Conference (IWLPC) 2014 Proceedings on USB Flash Drive
Copyright Year: 2014
Non-Member Price: $160.00
Member Price: $150.00
Sponsored jointly by the SMTA and Chip Scale Review magazine, the 11th annual IWLPC addressed cutting edge topics in 3 key technology tracks: Wafer-Level, 3D, and MEMS packaging. The proceedings contain over 50 technical papers from leading experts in the advanced packaging industry. The conference took place November 11-13, 2014 at the DoubleTree San Jose Airport Hotel.