SMTA International Conference on Soldering & Reliability Proceedings on CD, 2014
Copyright Year: 2014
Non-Member Price: $60.00
Member Price: $50.00
This CD-ROM features the proceedings from the technical program at the International Conference on Soldering & Reliability, held May 13-15, 2014, at the Four Points by Sheraton Toronto Airport Hotel in Toronto, ON, Canada. There are 25 technical papers on topics ranging from Tin Whisker testing and micro-Alloying to Bottom Termination Component voiding and High Temperature, High Reliability lead-free solder issues. Research was compiled from a variety of companies including Alpha, BAE International, BlackBerry, Celestica Inc., DfR Solutions, IBM Corporation, Indium Corporation, Kyzen Corporation, Nihon Superior Company, Ltd, Rockwell Collins, Universal Instruments Corporation, several renowned universities, and more.
Electronic products, particularly consumer products have become more complex with greater circuit density, finer lines and spacings and more functionality. Reliability issues continue to be a major concern for industrial, bio-medical, aerospace and automotive applications and require materials, manufacturing, test and quality engineers and scientists to be creative in planning for the future. Challenges such as the use of finer powders in solder paste, the greater need for heat dissipation, the use of novel components and technologies are included. Due to cost considerations, new low silver or silver free alloys are being studied. The use of tailored alloy systems, the variety of alloy choices, and smaller passive components are among the concerns being addressed. Now, a new group of engineers and scientists involved in the design and manufacture of (a) medical devices, and (b) monitoring and control instruments must be ready for the requirements of RoHS recast, also known as RoHS 2. This EU directive officially required that it be made into national laws by January 2, 2013 and these two new categories of electronics required compliance by July 22, 2014. Soldering and reliability professionals came together to share their knowledge and their vision for addressing these challenges.