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Extreme Environment Electronics

Extreme Environment Electronics
Author: John Cressler and H. Alan Mantooth
Publisher: Taylor & Francis Group LLC (CRC Press - Marcel Dekker - Routledge)
Copyright Year: 2012
Number of Pages: 1041
Non-Member Price: $209.95
Member Price: $199.95

  • Presents design techniques for analog, digital, and RF devices, circuits, and systems operating in extreme environments such as space
  • Provides techniques for device, circuit, and system modeling and validation
  • Discusses considerations for long-term reliability of extreme environment electronics
  • Covers electronic packaging techniques for long-term survivability
  • Includes full-chip and multi-chip analog/mixed-signal verification techniques for complex systems in extreme environments
  • Includes more than 975 illustrations and an eight-page color insert

    Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space.

    The Definitive Guide to Extreme Environment Electronics

    Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics.

    Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material.

    With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.



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