South East Asia Technical Conference on Electronics Assembly

Keynote Speakers

When Coating Hits the Fan - Consequences of Poor Ruggedization

Jason Keeping, P.Eng., Celestica, Inc.

Jason Keeping

With products in both the current and near future being designed to have more and more capabilities, there is one factor that is most commonly overlooked and that is the environment that the product will operate within. This keynote will show you real life examples along with processes that can mitigate this from occurring.

Jason Keeping is the Global Process Subject Matter Expert for Ruggedized Electronics within the Advanced Corporate Development team at Celestica. He holds a B.A.Sc in Electrical Engineering from the University of Ryerson, is a Six Sigma/Lean Professional and a licensed professional engineer. Jason has focused his career on assessing the manufacturability and capabilities of conformal coating, potting, underfill chemistries & their interactions, dispensing technologies/processes and on assembly-level cleaning for the past twelve years. Jason is the recipient of several awards, including the 2016 SMTA Excellence in International Leadership Award, the Shingo prize for Celestica’s site in Monterrey, Mexico in 2007, and has contributed to Celestica’s Frost & Sullivan awards in 2005, 2009, 2012 & 2013. Jason is the co-chair of the IPC-HDBK-830 handbook; author for conformal coating chapter of the Printed Circuits Handbook and was featured in the cover of Circuits Assembly in May 2008 and is currently the vice-chair of the 5-30 Cleaning and Coating Committee.

Advanced Semiconductor IC Packaging

John Lau, Ph.D., ASM Pacific Technology

John Lau

Recent advances in the following semiconductor packaging technologies will be presented.

  • Flip chip technology such as wafer bumping, package substrate, assembly, and underfill/reliability.
  • Fan-out wafer/panel-level packaging such as chip-first (die-down), chip-first (die-down), and chip-last (RDL-first).
  • 3D IC integration such as HMC (hybrid memory cube), HBM (high bandwidth memory), 3D IC/MEMS integration, and 3D IC/CIS integration.
  • Embedded hybrid 3D integration such as the VCSEL, driver chip, and serializer in an optical polymer waveguide PCB.
  • 2.5D IC integration and TSV-less interconnection such as CoWoS (chip on wafer on substrate), SLIT (silicon-less interconnect technology), and EMIB (embedded multi-die interconnect bridge).
  • Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended.

    With more than 37 years of R&D and manufacturing experience in semiconductor packaging, John has published more than 440 peer-reviewed papers, 30 issued and pending patents, and 18 textbooks on, e.g., Advanced MEMS Packaging (McGraw-Hill Book Company, 2010), Reliability of RoHS compliant 2D and 3D IC Interconnects (McGraw-Hill Book Company, 2011), TSV for 3D Integration, (McGraw-Hill Book Company, 2013), and 3D IC Integration and Packaging (McGraw-Hill Book Company, 2016). John is an elected ASME Fellow and has been an IEEE Fellow since 1994.

    IoE – Next Gen Supply Chain Ecosystems

    Nasrudin Bin Abdul Muthalib, Cisco Systems (Malaysia) Sdn. Bhd.

    Nasrudin Bin Abdul Muthalib

    In a fast-paced and highly competitive market, an innovative, adaptable and scalable supply chain is a differentiator. Although less than 1% of things in the physical world are connected, technological advancements are now connecting the physical with the digital world through billions of context-aware devices. The Internet of Everything (IoE) is connecting people, processes, data and things. This disruption creates new demands and opportunities that a successful supply chain must leverage in order to deliver business outcomes and values. This presentation is about IoE and the new opportunities and applications facing the Next Generation Supply Chain in the High Tech Industry.

    Graduated from University Technology Malaysia, Kuala Lumpur, Malaysia, B.Eng. (Hons), Electrical Engineering (Electronics and Telecommunication), Certified Six Sigma Green Belt and holds 3 US Technical Patents.

    Questions? Contact Conference Organizer Jenny Ng, or call +1-952-920-7682.

    Cancellation Policy: Registration fees will be refunded (less a $75 processing fee) if written notice is postmarked two weeks prior to the event date. Cancellations received within two weeks prior to event date will not be refunded to cover costs incurred.