SMTA International Conference and Exhibition

Wednesday At-A-Glance

  Wednesday, September 30
Speaker Breakfast 7:00am - 8:00am
Exhibitor Appreciation Breakfast 8:00am - 9:00am
FSA4 The Influence and Impact of Materials & Process Selection on Reliability 8:00am - 9:30am
INS1 X-ray Inspection: The Growing Complexity of Applications and Capability Needs for Tomorrow’s PCB’s 8:00am - 9:30am
MFX3 Cleaning Parameters and Cleanliness Monitoring of Electronics Assemblies 8:00am - 9:30am
SUB1 Investigating Surface Finish Reliability and Attributes Outside of Solderability 8:00am - 9:30am
L3 3 Factory Automation – Optimizing to Reduce Cost and Increase Reliability and Yield 8:00am - 10:00am
APT4 Improvements in Voiding and Reliability of BTCs 8:00am - 10:00am
Exhibits Open 9:00am - 4:00pm
Membership Committee Meeting 10:00am - 11:30am
L3 4 Real World SMT Production Problems, Investigations and Solutions 10:30am - 11:30am
FSA5 Solder Joint Reliability Assessment 10:30am - 12:00pm
INS2 PCB Quality Management 10:30am - 12:00pm
MFX4 Ruggedization Technologies & Materials to Meet Today's Electronic Requirements 10:30am - 12:00pm
SUB2 Emerging Topics on Design and Process Technologies of Printed Circuit Boards 10:30am - 12:00pm
APT5 Advances in Electronics Failure Analysis 10:30am - 12:30pm
Users Solution Lunch 11:45am - 12:45pm
L3 5 Product Life Cycle 2:00pm - 3:00pm
APT6 Solder-Joint Reliability 2:00pm - 3:30pm
FSA6 Test Optimization for Improved Quantification of Material and Assembly Quality 2:00pm - 3:30pm
INS3 Advances in Process Control 2:00pm - 3:30pm
MFX5 Innovation and Process Control for Liquid Soldering Processes 2:00pm - 3:30pm
SUB3 Surface Finish Parameters that Impact Interconnect Reliability 2:00pm - 3:30pm
APT7 Ceramic Column Grid Arrays – Applications, Materials and Optimization 4:00pm - 5:30pm
SUB4 Influence of Finishes on Printed Circuit Board (PCB) Reliability 4:00pm - 5:30pm
Technical Committee Meeting 5:30pm - 6:30pm

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