SMTA International Conference and Exhibition

Tuesday At-A-Glance

  Tuesday, September 29
Speaker Breakfast 7:00am - 8:00am
SMTA Annual Meeting and Opening Keynote Address 8:00am - 10:00am
Exhibits Open 9:00am - 5:00pm
L3 1 Come and See Where the Future is Going! 11:00am - 12:30pm
HE4 Electronics Ruggedization Through Coating 11:00am - 12:30pm
APT1 3D IC and PoP Assembly 11:00am - 12:30pm
EMS1 Taking the Cost out of EMS: Getting the Best Return for Lean Initiatives 11:00am - 12:30pm
FSA1 Improved Area Array Component Solder Reliability through Use of Underfills, Edge Bonds and Encapsulants 11:00am - 12:30pm
MFX1 Pathways to Prolific Printing 11:00am - 12:30pm
PS Poster Session 12:00pm - 2:00pm
Chapter Officer's Meeting 12:30pm - 2:00pm
Training Committee Meeting 12:30pm - 2:00pm
International Attendee Meeting 2:00pm - 3:00pm
L3 2 Solder Recycling and Recovery 2:00pm - 3:30pm
APT2 BGA Reliability 2:00pm - 3:30pm
FSA2 New Developments in No-Clean Solder Paste and Flux Technology and Reliability 2:00pm - 3:30pm
MFX2 Challenges in Advanced Package on Package Applications 2:00pm - 3:30pm
HE5 Thermal Management (Get the Heat Out!) 2:00pm - 4:00pm
Great Lakes Chapter Meeting 3:00pm - 3:30pm
MSD Council Meeting 3:00pm - 4:00pm
Ambassador's Meeting 4:00pm - 5:00pm
APT3 Advances in WLP and CSP Interconnect Design and Assembly Processes 4:00pm - 5:30pm
FSA3 The How’s and Why’s of Fluxes in Electronics Assembly 4:00pm - 5:30pm
Retirement Celebration for JoAnn Stromberg 6:00pm - 9:00pm

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