The technical conference was very well-received and continued the SMTAI tradition of having the strongest technical conference in the industry. Lee Smith of Amkor Technology gave a rousing opening session presentation on the future of Package-on-Package technology. The Lead-Free Symposium was once again a big draw, covering findings from the NASA-DoD Lead-Free Electronics Project. Over 130 speakers presented technical papers on topics including electronics assembly, lead-free reliability, SMT, Package-on-Package, process control, flip chip, BGA, Embedded Component Technology, harsh environment electronics, and more during the conference.
The riveting Keynote Address by Mark Medlen, Riverwood Solutions, provided an inside look at how a company can develop a supply chain that is as competitive as it is responsive. All technical papers from the conference are available on the conference proceedings CD which can be purchased in the SMTA BookStore.
Attendees got a true taste of southern hospitality this year during the Party at Billy Bob's, organized by the SMTA Dallas Chapter. Complete with tasty Texas barbecue, line dancing, mechanical bull riding, a quick-draw contest, and tons of unforgettable photo opportunities, the party was very well-received and definitely a memorable experience for everyone.
Enjoy these photos from the 2011 SMTA International Conference and Exhibition:
Click on a photo to view the larger image.
Over 120 exhibiting companies filled the sold-out exhibit hall. Exhibitors expressed satisfaction with the quality of attendees while selecting booth space for 2012. Events on the show floor included a Poster Session, free lunch, Celebrity Electronics Jeopardy, presentations on Conflict Materials, QFN Device Process, iNEMI Roadmap, Thin Heat Spreader, Automated Inspection, Solar Manufacturing, TLP Stress on ESD Design, and several drawings for great prizes.