SMTA International Conference and Exhibition

Monday At-A-Glance

  Monday, September 28
Speaker Breakfast 7:00am - 8:00am
HE1 Reliability of Components in Harsh Environments 8:00am - 10:00am
T9 Failure Analysis: Analytical Techniques and What They Tell You About Your Failure 8:30am - 12:00pm
T10 3D Packaging for the SMT Specialist 8:30am - 12:00pm
T11 Solder Joint Reliability – Principles and Applications 8:30am - 12:00pm
T12 SMT and Through Hole Defect Analysis and Process Troubleshooting - Part 1 8:30am - 12:00pm
T13 ZEN and Science of Electronic Assembly - Best Practices in SMT Assembly - Part 1 8:30am - 12:00pm
ET1 Alternate Alloys 9:00am - 10:30am
HE2 Electronics in Corrosive Environments 10:30am - 12:30pm
ET2 Alternate Alloys (Continued) 11:00am - 12:30pm
MarCom Committee Meeting 11:30am - 12:30pm
ETKN ET Keynote Lunch 12:30pm - 1:30pm
HEKN HE Keynote Lunch 12:30pm - 1:30pm
ET3 Wearable Electronics Technology Development 1:30pm - 3:00pm
HE3 Materials for Harsh Environments 1:30pm - 3:00pm
T14 Reliability of Electronics – the Role of Intermetallic Compounds 1:30pm - 5:00pm
T15 "Tipping Point" Cleaning and Deflux 1:30pm - 5:00pm
T16 Design for Manufacturing (DFM): Today's Design Challenges Require New Assembly Methods 1:30pm - 5:00pm
T17 SMT and Through Hole Defect Analysis and Process Troubleshooting - Part 2 1:30pm - 5:00pm
T18 ZEN and Science of Electronic Assembly - Best Practices in SMT Assembly - Part 2 1:30pm - 5:00pm
Certification Committee Meeting 2:00pm - 3:00pm
ET4 Evolving Technologies Panel 3:30pm - 5:00pm
Chapter Leadership Committee Meeting 4:30pm - 6:00pm
Women's Networking Connection 5:00pm - 6:30pm







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