SMTA International Conference and Exhibition

Professional Development Courses

Half day (3.5 hours) educational courses are led by internationally respected professionals with extensive experience in the subject area. Course instructors deliver focused, in-depth presentations on topics of current importance to the industry, based on their research and industry experience. Professional Development Courses are application oriented and structured to combine field experience with scientific research to solve everyday problems. They are offered on Sunday and Monday to provide you the opportunity to attend the conference sessions and visit the exhibit floor.

Course registration includes breaks, course materials, and a Certificate of Attendance.


SUNDAY, September 22, 2019



Vern Solberg, Solberg Technical Consulting
Sunday, September 22 | 8:30am — 12:00pm

This course has been developed to furnish the design professionals, systems engineers and assembly and test engineering specialists with a comprehensive understanding of the materials, fabrication process variations and preferred design practices for developing flexible and rigid-flex circuits. Topics studied will include both flexible and glass reinforced rigid base material variations as well as alternative flexible and rigid-flex circuit fabrication methodologies. Recommendations will be furnished regarding unique SMT land pattern reinforcement criteria, cover layer and fiducial requirements for automated assembly processing will be defined including detailed discussion regarding single and multiple unit panel planning and alternative assembly process variations.

Ray Prasad, Ray Prasad Consultancy Group
Sunday, September 22 | 8:30am — 12:00pm

This course is based on IPC 7530 Guidelines for Temperature Profiling for Mass Soldering Processes chaired by Ray Prasad. The focus of this course is to focus on the dos and dont's of developing thermal profiles for widely used soldering processes in order to reduce soldering defects and improve quality and reliability.

Rajan Ambat, Technical University of Denmark
Sunday, September 22 | 8:30am — 12:00pm

Proposed course aims to development a broader understanding on the humidity robustness issues and contributing factors, and how pro-active design, process control, and other protective measures can be implemented to tackle the issue. Short course will specifically focus on: (i) methods to improve intrinsic humidity robustness of PCBA and (ii) extrinsic strategies to avoid PCBA contact with humidity. In order to elucidate this, following aspects will be discussed: basics of humidity interaction with PCBA surface causing corrosion failures, PCBA production process and cleanliness, influence of PCBA design, and some aspects of device level design in controlling humidity entry into the device.

Robert Hanson, Consultant
Sunday, September 22 | 8:30am — 12:00pm

This tutorial will focus on the main issues of testing today which consist of (a) disciplines of testing the bareboard, (b) testing on the production line for minimum ppm defects, (c) testing for fault detection/fault isolation on the productions line using ICT, flying probe and vision for correcting the processes. Finally at the system level, static and dynamic functional test are performed using embedded firmware, boundary SCAN and functional test equipment. The objective of the course shall be to define and demonstrate how the tests are conducted to successfully obtain a quality testing program.

Chrys Shea, Shea Engineering Services
Sunday, September 22 | 1:30pm — 5:00pm

This is the advanced course that changes every year to include updates on the latest stencil printing research. This year’s syllabus will continue to include defect troubleshooting, stencil troubleshooting, and nanocoatings, with briefer sections on under wiping and automated solder paste inspection, and new sections on stencil stepping, printing 0201M or 008004 imperial components, and the SMTA Miniaturization solder paste test vehicle. If you are already familiar with the solder paste printing process and want to get up to date on the latest technology available, this is the course for you.

Ning-Cheng Lee, Ph.D., Indium Corporation
Sunday, September 22 | 1:30pm — 5:00pm

This course covers the detailed material considerations required for achieving high reliability for lead-free solder joints. The reliability discussed includes joint mechanical properties, development of type and extent of intermetallic compounds (IMC) under a variety of material combinations and aging conditions and how those IMCs affect the reliability. The failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history will be addressed in details, and novel alloys with high reliability and reduced fragility will be presented. Electromigration and tin whisker will also be discussed.

Vern Solberg, Solberg Technical Consulting
Sunday, September 22 | 1:30pm — 5:00pm

This course has been prepared specifically for PCB Designers, Design Engineers and those responsible for semiconductor package and electronic product development. The material presented has been developed to better enable the product designer and manufacturing specialist to have practical guidance and a clear understanding of the principles for embedding components in an organic multilayer circuit board structure. The course will include design guidelines, material selection criteria and termination methodology variations for embedding passive components and process methodologies for preparing, placing and interconnecting semiconductor elements within both rigid-core and coreless substrate structures.

Ray Prasad, Ray Prasad Consultancy Group
Sunday, September 22 | 1:30pm — 5:00pm

The objective of the course is to get away from the trial and error approach and provide you successful design and process practices commonly used by the industry. This course will cover the practical details of BTC design and assembly processes.

This course is based on Surface Mount Technology: Principles by Ray Prasad and Practice and IPC 7093 Design and Assembly Process Guidelines for BTCs also co-chaired Ray. This course identifies many of the characteristics that influence the successful implementation of robust and reliable BTC assembly processes.





Monday, September 23, 2019



Jennie Hwang, Ph.D., H-Technologies Group
Monday, September 23 | 8:30am - 12:00pm

The course emphasizes on practical, working knowledge, yet balanced and substantiated with science by outlining the critical “players” of solder joint reliability (e.g., manufacturing process, PCB/ component coating surface finish, solder alloys), and the solder joint reliability fundamentals in fatigue and creep damage mechanisms via ductile, brittle, ductile-brittle fracture. Likely solder joint failure modes of interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced and surface cracks will be illustrated. To withstand harsh environments, the strengthening metallurgy to further increase fatigue resistance and creep resistance, and the power of metallurgy and its ability to anticipate the relative performance will be illustrated by discussing the comparative performance vs. metallurgical phases and microstructure. The question on whether existing life-prediction models can assure reliability will be highlighted. A relative reliability ranking among commercially available solder systems, as well as the scientific, engineering and manufacturing reasons behind the ranking will be outlined. Attendees are encouraged to bring their own selected systems for deliberation.

Chrys Shea, Shea Engineering Services
Monday, September 23 | 8:30am - 12:00pm

This half-day workshop focuses on solder paste and how to select the best one for an operation using the new SMTA Miniaturization Test Vehicle. Solder pastes have over 20 individual characteristics that must be considered during the selection process. Moreover, some characteristics conflict with each other and the tradeoffs must be carefully considered when determining the best process chemistry in order to avoid surprises on the production line. Many operations delay updating their soldering materials because of the high cost, lost production time, and complexity of the materials. These concerns have been met with a low-cost evaluation kit that minimizes line time, maximizes test efficiency, and demonstrates the tradeoffs in performance characteristics. The kit includes pre-designed PCB boards and components; an active spreadsheet to configure the PCB population, cost and sample sizes; stencil and vacuum board support designs; ODB++ database; placement files; SPI files; step-by-step directions for a 30-print DOE; an SMT soldering reference manual; directions for statistical reduction; and the customizable Score Card, which helps assemblers understand the tradeoffs involved and chose the best possible product. The hardware for the kit is available for purchase from commercial suppliers; the documentation and user files are available for FREE download from a website. This course discusses each characteristic of solder paste, how it impacts the SMT process, how the kit tests it, and how and why the board was designed.

Charles Bauer, Ph.D., TechLead Corp
Monday, September 23 | 8:30am — 12:00pm

Excitement around 3D printing continues full speed ahead whether in electronics, consumer goods or industrial systems. Understanding the capabilities, limitations and most importantly the complexities of 3D printing remains challenging despite significant progress in both equipment and materials. This tutorial on 3D printing introduces the application of 3D printing in and around the world of electronics, whether for prototyping, pilot production or manufacturing.

Phil Zarrow & Jim Hall, ITM Consulting
Monday, September 23 | 8:30am — 12:00pm (Part 1 - PDC12)
Monday, September 23 | 1:30pm — 5:00pm (Part 2 - PDC13)

We don't assemble electronics in a "perfect world." Defects happen! This course examines Failure and Root Cause analysis of PCBA defects. Detection and determination methodologies and procedures will be discussed. Cause and effect of defects relative to specific processes and equipment centers as well as materials are presented. Key causes of assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing Failure and Root Cause analysis and defect resolution including managers, engineers and others in manufacturing, quality and design. Presented by Jim Hall and Phil Zarrow of ITM Consulting, industry experts on SMT Processes and Troubleshooting who have been there, done that, and own the ripped tee-shirts!

Dock Brown, ANSYS; Stephen Golemme, X, The Moonshot Factory
Monday, September 23 | 1:30pm — 5:00pm

This course is taught by the co-chairs of the IPC DFX Committee which recently released the new IPC-2231 DFX Guideline document. The course will provide an outline of the eight DFX practices with particular emphasis on design for fabrication, assembly, and reliability.

Dale Lee, Plexus Corp.
Monday, September 23 | 1:30pm — 5:00pm

Electronic assemblies today are smaller, lighter with increased functionality per unit area and/or volume. The rate of new technology adoption is increasing through develop ever smaller packages with finer lead spacing and substrates with finer lines and spaces. However, design methods, industry standards, materials and manufacturing processes utilized during the product development and production process have not progressed to meet these new demands and thus many of the tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products. This presentation will highlight issues with today’s electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately address during design, PCB fabrication, assembly and test.





Home | Top

Organized by SMTA