SMTA International Conference and Exhibition

Call for Papers

On behalf of the SMTA International Technical Committee, you are invited to submit an abstract for the 2019 conference. Professional Development Courses (1/2 day - 3.5 hours) proposals are also being solicited.

Materials must be original, unpublished and non-commercial in nature. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data.

There are many benefits to participating!

You will:
1. Make a contribution to our industry by sharing your work.
2. Network with industry colleagues and showcase your company's position in the industry as an author and speaker,
3. Receive a discount on your conference registration.
4. Be eligible for cash prizes for best paper awards:
     Top 3 for best of proceedings/paper = $1000/$500/$500
     Best of conference (panels excluded) = $1000
     Best student paper = $500

Abstract Deadline: February 15, 2019
Acceptance Notification: May 2019 | Final Papers Due: July 26th, 2019

When a paper is accepted by the Technical Committee, it is our expectation that you have budget approval for travel costs and conference registration which is required for speakers.







Advanced Packaging/Components:
  • 2.5/3D Packaging and Integration
  • BGA/CSP
  • Biomedical Packaging
  • Component Storage
  • Connector Technology
  • Copper Pillars
  • Copper Wire Bonding
  • Diffusion Bonding
  • Embedded and Miniature Passives
  • Environmental Testing
  • Failure Analysis Techniques
  • Flip Chip
  • High Temperature Packaging
  • Lead Finishes
  • Magnetic Soldering
  • MEMS and Sensors
  • Moisture Sensitive Devices (MSD)
  • Package on Package (PoP)
  • Photonics
  • Photovoltaics and Solar
  • Reliability
  • Silver Wire-bonding
  • Stacked Die
  • System in Package (SiP)
  • Through Silicon Vias (TSVs)
  • Tin Whiskers
  • Wafer Level Packaging (WLP)


    • Assembly:
  • 01005/03015 Components/Assembly
  • 3D Board Assembly
  • Additive Manufacturing
  • SMT Adhesives
  • Alternate Solder Alloys
  • BGA/CSP Assembly
  • Bottom Terminated Components
  • Cavity Board Assembly
  • Cleaning, Conformal Coating and Potting
  • Connector Assembly to PCB
  • DFX/Design for Six Sigma
  • Direct Chip Attach to PCB (DCA)
  • Dispensing & Underfill
  • Epoxy Fluxes
  • Facility Layout
  • Halogen and Halogen-Free
  • Head on Pillow Defect/Warpage Induced Solder Joint Defects
  • High Melting Point Solder
  • Laser Soldering
  • Leadless Area Array Packages
  • Lead-Free Soldering/Reliability
  • Low Temperature Processing
  • Low Volume/Prototype
  • Non-Wet Open (NWO) Defects
  • Package-on-Package Assembly
  • Part Obsolescence
  • Placement
  • Printing
  • Reflow Soldering/ Wave Soldering
  • Rework and Repair of QFNs (01005,
  • Leadless Components, PoP)
  • Rework Reliability
  • Robotic Soldering
  • Selective Soldering
  • Solder Jetting
  • Solder Paste/Solder Voids in Joints
  • Solderless Interconnections
  • Supplier Engineering
  • Thermo Compression Bonding
  • Underfill/ Corner Glue/ Other Polymeric Reinforcements
  • Vapor Phase Reflow
  • Yield Improvement


    • Business/Supply Chain:
  • Capacity Modeling
  • Conict Minerals
  • Contract Manufacturing
  • Counterfeit Parts
  • Doing Business in Overseas
  • Environmental Issues
  • Lean Manufacturing
  • Onshoring
  • Operations Management
  • Part Obsolescence
  • RoHS/REACH Compliance
  • Supplier Management
  • Technology Roadmaps


    • Emerging Technologies:
  • <= 0.3mm Pitch Area Array Technologies
  • 3D Circuits
  • 3D Printing & Design Rules
  • Advanced Packaging
  • Assembly to Flex Substrates
  • Assembly to Glass Substrates
  • Cavity Assembly
  • Consumer Applications
  • Embedded Active Technology
  • Embedded Passive Technology
  • Flexible Electronics
  • High Frequency
  • Jetting of Solder Pastes
  • LED Technology/Assembly/Reliability
  • MEMS/RF/MOEMS
  • Microsystems Packaging / Modular Microsystems
  • Nanomaterials
  • Nanotechnology, Materials, & Electronics
  • New Materials and Processes
  • Optoelectronics
  • Plastic 3D PCB to PCB Technology
  • Power or Thermal Management
  • Power Electronics
  • Printed Electronics Technology
  • Reliability of Nanodevices
  • Resin Reinforcement Solder Pastes
  • Sensors and Manufacturing
  • Smart Manufacturing Systems
  • Small Die Size Singulation
  • Solid State Lighting
  • Solar Technology
  • System in a Package
  • Thermal Interface Materials
  • Touch Screen Technologies
  • Virtual Prototyping
  • Wearable Electronics
  • Wireless Applications


    • Harsh Environment Applications
    (Military, Aerospace, Automotive, Industrial, Oil & Gas):
  • Alternate Energy
  • Battery Prognostics
  • Components and Reliability
  • Copper Corrosion
  • COTS
  • High Lead Solder Replacement
  • High Temperature Electronics
  • Lead-free Issues
  • Non-Destructive Inspection
  • Micro-Computed Tomography
  • Multiphysics Modeling
  • Substrates and Finishes
  • Thermal Management
  • Tin Whiskers


    • PCB Technology:
  • Bio-Compatible Substrates
  • Black Pad and Surface Finish Defects
  • Conductive Anodic Filament (CAF)
  • Creep Corrosion
  • Embedded Passive/Active Components
  • Halogen Free
  • HDI
  • High Power PCBs
  • Micro-vias (including filled/unfilled)
  • Moisture Sensitivity
  • New Laminate Materials
  • New Surface Finishes & Solderability
  • Pad Cratering
  • Soldermask
  • Substrate Reliability


    • Process Control:
  • Acoustic Imaging (C-SAM)
  • Bene-ts of AOI & SPI
  • CIM
  • In-Circuit Test
  • Process Modeling
  • Software
  • Test Strategies
  • 2D/3D X-Ray



    • Thanks and the SMTAI Technical Committee looks forward to hearing from you!

    SMTAI Conference Chair, Rob Rowland, Axiom Electronics
    SMTA VP Technical Programs, Richard Coyle, Ph.D., Nokia



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