Call for Papers
Thank you for submitting an abstract for SMTAI 2017. The program is now being finalized and we are no longer accepting abstracts.
The Abstract Deadline has now passed.
Please contact SMTA about other options for presenting your work.
Acceptance Notification: April 15, 2017 | Final Papers Due: July 7th, 2017
When a paper is accepted by the Technical Committee, it is our expectation that you have budget approval for travel costs and conference registration which is required for speakers.
Advanced Packaging/Components:
2.5/3D Packaging and Integration
BGA/CSP
Biomedical Packaging
Component Storage
Connector Technology
Copper Pillars
Copper Wire Bonding
Diffusion Bonding
Embedded and Miniature Passives
Environmental Testing
Failure Analysis Techniques
Flip Chip
High Temperature Packaging
Lead Finishes
Magnetic Soldering
MEMS and Sensors
Moisture Sensitive Devices (MSD)
Package on Package (PoP)
Photonics
Photovoltaics and Solar
Reliability
Silver Wire-bonding
Stacked Die
System in Package (SiP)
Through Silicon Vias (TSVs)
Tin Whiskers
Wafer Level Packaging (WLP)
Assembly:
01005/03015 Components/Assembly
3D Board Assembly
Additive Manufacturing
SMT Adhesives
Alternate Solder Alloys
BGA/CSP Assembly
Bottom Terminated Components
Cavity Board Assembly
Cleaning, Conformal Coating and Potting
Connector Assembly to PCB
DFX/Design for Six Sigma
Direct Chip Attach to PCB (DCA)
Dispensing & Underfill
Epoxy Fluxes
Facility Layout
Halogen and Halogen-Free
Head on Pillow Defect/Warpage Induced Solder Joint Defects
High Melting Point Solder
Laser Soldering
Leadless Area Array Packages
Lead-Free Soldering/Reliability
Low Temperature Processing
Low Volume/Prototype
Non-Wet Open (NWO) Defects
Package-on-Package Assembly
Part Obsolescence
Placement
Printing
Reflow Soldering/ Wave Soldering
Rework and Repair of QFNs (01005,
Leadless Components, PoP)
Rework Reliability
Robotic Soldering
Selective Soldering
Solder Jetting
Solder Paste/Solder Voids in Joints
Solderless Interconnections
Supplier Engineering
Thermo Compression Bonding
Underfill/ Corner Glue/ Other Polymeric Reinforcements
Vapor Phase Reflow
Yield Improvement
Business/Supply Chain:
Capacity Modeling
Conict Minerals
Contract Manufacturing
Counterfeit Parts
Doing Business in Overseas
Environmental Issues
Lean Manufacturing
Onshoring
Operations Management
Part Obsolescence
RoHS/REACH Compliance
Supplier Management
Technology Roadmaps
Emerging Technologies:
<= 0.3mm Pitch Area Array Technologies
3D Circuits
3D Printing & Design Rules
Advanced Packaging
Assembly to Flex Substrates
Assembly to Glass Substrates
Cavity Assembly
Consumer Applications
Embedded Active Technology
Embedded Passive Technology
Flexible Electronics
High Frequency
Jetting of Solder Pastes
LED Technology/Assembly/Reliability
MEMS/RF/MOEMS
Microsystems Packaging / Modular Microsystems
Nanomaterials
Nanotechnology, Materials, & Electronics
New Materials and Processes
Optoelectronics
Plastic 3D PCB to PCB Technology
Power or Thermal Management
Power Electronics
Printed Electronics Technology
Reliability of Nanodevices
Resin Reinforcement Solder Pastes
Sensors and Manufacturing
Smart Manufacturing Systems
Small Die Size Singulation
Solid State Lighting
Solar Technology
System in a Package
Thermal Interface Materials
Touch Screen Technologies
Virtual Prototyping
Wearable Electronics
Wireless Applications
Harsh Environment Applications
(Military, Aerospace, Automotive, Industrial, Oil & Gas):
Alternate Energy
Battery Prognostics
Components and Reliability
Copper Corrosion
COTS
High Lead Solder Replacement
High Temperature Electronics
Lead-free Issues
Non-Destructive Inspection
Micro-Computed Tomography
Multiphysics Modeling
Substrates and Finishes
Thermal Management
Tin Whiskers
PCB Technology:
Bio-Compatible Substrates
Black Pad and Surface Finish Defects
Conductive Anodic Filament (CAF)
Creep Corrosion
Embedded Passive/Active Components
Halogen Free
HDI
High Power PCBs
Micro-vias (including filled/unfilled)
Moisture Sensitivity
New Laminate Materials
New Surface Finishes & Solderability
Pad Cratering
Soldermask
Substrate Reliability
Process Control:
Acoustic Imaging (C-SAM)
Bene-ts of AOI & SPI
CIM
In-Circuit Test
Process Modeling
Software
Test Strategies
2D/3D X-Ray
Thanks and the SMTAI Technical Committee looks forward to hearing from you!
SMTAI Conference Chair, Rob Rowland, Axiom Electronics
SMTA VP Technical Programs, Raiyo Aspandiar, Ph.D., Intel Corporation
