Materials must be original, unpublished and non-commercial in nature. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data.
There are many benefits to participating!
You will:
1. Make a contribution to our industry by sharing your work.
2. Network with industry colleagues and showcase your company's position in the industry as an author and speaker,
3. Receive a discount on your conference registration.
4. Be eligible for cash prizes for best paper awards:
Top 3 for best of proceedings/paper = $1000/$500/$500
Best of conference (panels excluded) = $1000
Best student presentation = $500
Abstract Deadline: February 28, 2020 Acceptance Notification: May 2020 | Final Papers Due: July 24, 2020
When a paper is accepted by the Technical Committee, it is our expectation that you have budget approval for travel costs and conference registration which is required for speakers.
Advanced Packaging/Components:
2.5/3D Packaging and Integration
BGA/CSP
Biomedical Packaging
Component Storage
Connector Technology
Copper Pillars
Copper Wire Bonding
Diffusion Bonding
Embedded and Miniature Passives
Environmental Testing
Failure Analysis Techniques
Flip Chip
High Temperature Packaging
Lead Finishes
Magnetic Soldering
MEMS and Sensors
Moisture Sensitive Devices (MSD)
Package on Package (PoP)
Photonics
Photovoltaics and Solar
Reliability
Silver Wire-bonding
Stacked Die
System in Package (SiP)
Through Silicon Vias (TSVs)
Tin Whiskers
Wafer Level Packaging (WLP)
Assembly:
01005/03015 Components/Assembly
3D Board Assembly
Additive Manufacturing
SMT Adhesives
Alternate Solder Alloys
BGA/CSP Assembly
Bottom Terminated Components
Cavity Board Assembly
Cleaning, Conformal Coating and Potting
Connector Assembly to PCB
DFX/Design for Six Sigma
Direct Chip Attach to PCB (DCA)
Dispensing & Underfill
Epoxy Fluxes
Facility Layout
Halogen and Halogen-Free
Head on Pillow Defect/Warpage Induced Solder Joint Defects
High Melting Point Solder
Laser Soldering
Leadless Area Array Packages
Lead-Free Soldering/Reliability
Low Temperature Processing
Low Volume/Prototype
Non-Wet Open (NWO) Defects
Package-on-Package Assembly
Part Obsolescence
Placement
Printing
Reflow Soldering/ Wave Soldering
Rework and Repair of QFNs (01005,
Leadless Components, PoP)
Rework Reliability
Robotic Soldering
Selective Soldering
Solder Jetting
Solder Paste/Solder Voids in Joints
Solderless Interconnections
Supplier Engineering
Thermo Compression Bonding
Underfill/ Corner Glue/ Other Polymeric Reinforcements
