2018 Conference At-A-Glance
Conference sessions are 1.5-2 hour programs in which three or four technical papers are presented under the direction of a chairperson. Each paper is presented by the author on a topic related to the main subject of the session, and is followed by audience questions. The objective of a technical session is to bring new scientific and technical developments to light. Emphasis is placed on original, previously unpublished papers.
Conference tracks and symposiums:
Advanced Packaging Technology (APT)
Flux, Solder, Adhesives (FSA)
Harsh Environment Applications (HE)
Inspection / Counterfeit Electronics (INS)
Lead-Free Soldering Technology (LF)
Manufacturing Excellence (MFX)
Substrates/PCB Technology (SUB)
Technical Innovations (TI)
Professional Development Courses (PDCs) are not included in standard conference registration.
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