SMTA International Conference and Exhibition

Call for Abstracts

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SECTION A: Contact Information
(* Required fields)
Ph.D.
Professor
P.E.
Other:

Students:

You are required to provide the following Advisor information
Advisor's Name:
Advisor's Phone Number:
Advisor's Email:

SECTION B: Abstract Information
Yes
No

If yes, where?

Advanced Packaging Technology
Flux/Solder/Adhesive
Harsh Environments
Inspection (AOI, X-Ray, Other)
Lead-Free (Reliability)
Manufacturing Excellence
Substrates
Technical Innovation

Process Improvement
Reliability/Quality Improvement
New Technology
Cost Reduction

Yes
No

If no, when do you expect to complete it? Research must be completed by the time the final paper is due. If you have any questions, please contact SMTA staff at smtai_abstract@smta.org or +1 952-920-7682.

Keywords:
(Comma-Separated)

Related IPC Standards:


SECTION C: Other Presentation Opportunities
Please contact me regarding these additional opportunities to present my paper:
Present in a Poster Session at SMTAI (no technical paper required)

Publish in the Journal of SMT

Present at a Local Chapter Meeting

Present as a Webinar/Webtorial

SECTION D: Submit Your Abstract

* I have read and accept the required Speaker Roles and Responsibilities

If you are not redirected to a Thank You page after clicking the button below, please re-submit.





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