Call for Abstracts SMTA Members: Log in to auto-fill your contact info and save time! Member ID: Password: SECTION A: Contact Information (* Required fields) * First Name: * Last Name: Suffix: Ph.D. Professor P.E. Other: * Job Title: * Company: * Address: PO, MS, Dept. or Suite: * City: State: * Country: * Zip Code: * Phone: * Email: Students: You are required to provide the following Advisor information Advisor's Name: Advisor's Phone Number: Advisor's Email: SECTION B: Abstract Information * Paper Title: List Co-Authors (if any): * Has this paper been presented before? Yes No If yes, where? If your abstract was recruited by a Technical Committee member, please provide their name: * Suggested Track Assignment (Select One): Advanced Packaging Technology Flux/Solder/Adhesive Harsh Environments Inspection (AOI, X-Ray, Other) Lead-Free (Reliability) Manufacturing Excellence Substrates Technical Innovation Subject Focus: Process Improvement Reliability/Quality Improvement New Technology Cost Reduction * Describe the Project or Process (250 words max.) * Is the research and/or process development completed? Yes No If no, when do you expect to complete it? Research must be completed by the time the final paper is due. If you have any questions, please contact SMTA staff at firstname.lastname@example.org or +1 952-920-7682. * Summarize the Results (100 words max.) Keywords: (Comma-Separated) Related IPC Standards: SECTION C: Other Presentation Opportunities Please contact me regarding these additional opportunities to present my paper: Present in a Poster Session at SMTAI (no technical paper required) Publish in the Journal of SMT Present at a Local Chapter Meeting Present as a Webinar/Webtorial SECTION D: Submit Your Abstract * I have read and accept the required Speaker Roles and Responsibilities Type these letters ** If you are not redirected to a Thank You page after clicking the button below, please re-submit.