SMTA International 2017Conference: September 17-21, 2017
Exhibition: September 19-20, 2017
Donald Stephens Convention Center
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Technical Program Finalized and Registration Now Open!
If you want to get the latest research to help you reduce defects and control your processes, look no further than the SMTA International Technical Conference. Choose from four days of session tracks including Advanced Packaging Technology; Flux, Solder, Adhesives; Inspection Technologies; Manufacturing Excellence; and Substrates/PCB Technology, as well as the Harsh Environments Symposium, Technical Innovations Symposium, and the Lead-Free Soldering Technology Symposium. Microsoft Corporation's Rune Jensen will keynote Tuesday morning with his presentation "Experiencing Mixed Reality - using the Microsoft HoloLens." Twenty half-day educational workshops are offered Sunday and Monday from expert instructors on topics including Fan-Out Wafer-Level Packaging and 3D Packaging, DfX, Cleaning, Ball Grid Array (BGA) issues, Flex Circuits, Reliability, Inspection, Temperature Profiling, Reflow Soldering, Stencil Printing, Surface Finishes, Process Troubleshooting and more.View the program
Learn about the latest equipment and technology from over 170 exhibiting companies. Bring your boards so you can see first-hand how you can increase yield!