Pan Pacific Microelectronics Symposium
 Microelectronics Symposium 

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to our 2017 Supporters!
The atmosphere is very pleasant. The conference is not too big which facilitates the exchanges with other people."

-Tristan Dubois,
IMS Laboratory

June 2016 Newsletter 
Volume 2.2 
Feb. 6-9, 2017
Sheraton Kauai Resort
Kauai, Hawaii

Please enjoy the latest issue of the Pan Pac Press, a quarterly newsletter to keep you updated on the Pan Pacific Microelectronics Symposium happenings throughout the year.

The Pan Pac continues to attract industry leaders such as Yasumitsu Orii of IBM Japan, Tsuyoshi Kawanishi, Vice Chairman of Toshiba (retired), Charles Lin, president of Bridge Semiconductor, Klaus Dieter-Lange, Chairman of Fraunhofer IZM, Rao Tummala, Director of Georgia Tech's NSF Packaging Research Center and many more! While the environment remains informal and comfortable, the recurring theme focuses on strategic issues facing the industry, exploration of new directions in technology and markets, and building a high level network of contacts for ensuring industry wide collaboration on the most critical challenges.  
The 2017 program already includes key players in nano-technology, wearable electronics, the internet of things (IoT), high reliability systems (aerospace, defense and automotive!) and the most advanced integration technologies such as interposers and heterogeneous integration! And a special session captures the full spectrum of industry road maps from Asia, America and Europe. The hard work in getting to the Pan Pac pays off tenfold in positive results for you and your company!

"Pan Pacific is a fantastic conference - great topics of interest and a wide range of attendees. Excellent knowledge gathering and networking."
-Mayson Brooks, AKROMETRIX

Featured Keynote

Jack Peregrim, founder and president of Paragon Development, received his BS in Business Management at University of Scranton. As a strategy and innovation consultant since 1989 Jack helps companies ranging from small enterprises to global organizations effectively bring their innovations to market. A member of MENSA as well as multiple business organizations including Licensing Executives Society, The Conference Board, and the Product Development and Marketing Association Jack brings an extensive leadership background to his work in new products development and introduction, applications for emerging technologies and other innovations, mergers and acquisitions, optimized development portfolios, new value chain strategies, and expansion into new markets. An energetic facilitator, Jack's keynote explores Innovation beyond Invention, i.e. the concept of finding the right applications, markets and business models to maximize the value proposition for new inventions. Solving the challenge of matching inventions with the highest value applications and products faces every new start up and Jack's extensive experience in this field ensures an exciting learning opportunity for all participants in the 2017 Pan Pacific Microelectronics Symposium!!