Pan Pacific Microelectronics Symposium

Call for Papers

The Program Committee invites you to submit your recent results for presentation at the Symposium on any of the topics listed below.

Pan Pacific Call for Papers

Abstracts of 500 words should be submitted with title and author contact information. Let us know if you want an official letter in support of management approval for your paper submission!

Abstracts due September 16, 2019

You will be notified by October 2019 if your abstract has been accepted and scheduled for presentation. All accepted papers will be published in the conference proceedings, SMTA Knowledge Base and submitted to the IEEE Xplore Digital Library.

We solicit your submissions in any topical area including the following:

3D/Heterogeneous Integration

  • Build Up/Blind & Buried Via PWBs
  • Cu Pillars & Posts
  • MCM/SiP Advances
  • Module Stacking Origami Flex Packages
  • Package on Package (PoP)
  • Shaped Circuits
  • Thru Si Vias (TSV)

    Emerging Technologies

  • Advanced Connectors
  • Embedded Assembly (Passive & Active)
  • Interposer Technologies (Si, Glass, etc.)
  • Structural Electronics
  • Thermal Management

    Green Electronics

  • Environmental Impact Analysis
  • Green Manufacturing (Pb/Halogen-free, etc.)
  • Large Area/Module Assembly
  • Photovoltaics
  • Power Control/Conversion/Distribution
  • Power Packaging
  • Solar Thermal Conversion

    High Performance Low I/O

  • Chip on Glass (CoG)
  • Compact Florescent Systems
  • Display Drivers
  • Flat Panel Processes
  • LED Packaging & Assembly
  • Lighting & Displays
  • OLED Developments
  • Optoelectronics


  • Edge Devices
  • Flexible Electronics
  • Medical and Healthcare devices
  • Printed Electronics
  • Sensor Technology
  • Wearable Electronics

    Material Advances

  • Connections (Adhesives, Solders, etc.)
  • Integrated Passive Devices
  • Interconnect Taxonomy
  • Interface Metallurgy (FC, WB, TAB, Pb Free Solder, etc.)
  • Phosphors & Light Absorption
  • Thermal Interface Materials (TIMs)
  • Thin & Thick Film Systems


  • Applications in Electronics
  • Materials
  • Processes & Handling
  • Smart Devices


  • Fabrication
  • Integration Techniques

    Reliability, Quality

  • Failure Analysis
  • Quality Assessment
  • Reliability Physics
  • Test & Measurement
  • Yield Projection

    Strategic Direction/ Industry Roadmaps

  • Economics & Cost Analysis
  • Health & Prognostics
  • Manufacturing Management & Control
  • Penetration Strategies
  • Supply Chain & Operations Management
  • Technology Drivers
  • Trends, Forecasts & Roadmaps

  • Papers should be 6-10 pages in length including graphics, and they should offer non-commercial research results on any of the topics listed above.

    Steering Committee

    Phil Isaacs, IBM Corporation, Chair
    Charles E. Bauer, Ph.D., TechLead Corporation
    Ross Berntson, Indium Corporation
    Dock Brown, DfR Solutions
    Keith Bryant, Independent Consultant
    Dwight Howard, APTIV LPC
    Yasumitsu Orii, Ph.D., NAGASE Group
    David Raby, STI Electronics
    Kirsten Weide-Zaage, Ph.D., University of Hannover