Pan Pacific Microelectronics Symposium

The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

The 25th Annual Pan Pac is Almost Here!

February 10-13, 2020
The Westin Hapuna Beach Resort
The Big Island of Hawaii

Westin Hapuna Beach Resort

A Successful Pan Pacific Symposium 2019

The 24th Annual Pan Pacific Microelectronics Symposium that took place February 11-14, 2019, at the Kauai Marriott Resort & Beach Club on Kauai, Hawaii was well received by attendees from North America, Asia, and Europe. Over thirty papers were presented to attendees from eleven countries. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.

Speakers at Pan Pac 2019

View the 2019 Program

Pan Pac Provides You The Latest Research On

  • Advanced Packaging & Processes
  • Automotive Systems & Hardware
  • Cleaning Technologies
  • Heterogeneous Integration
  • Inspection & Test Techniques
  • Interposer & Packaging Technology
  • Materials & Reliability
  • Nanotechnology Applications
  • Trends, Roadmaps, and more...

  • Steering Committee

    Phil Isaacs, IBM Corporation, Chair
    Charles E. Bauer, Ph.D., TechLead Corporation
    Dock Brown, DfR Solutions
    Keith Bryant, Independent Consultant
    Dwight Howard, APTIV LPC
    Ronald Lasky, Ph.D., P.E., Indium Corporation
    Yasumitsu Orii, Ph.D., NAGASE Group
    David Raby, STI Electronics
    Kirsten Weide-Zaage, Ph.D., University of Hannover