Pan Pacific Microelectronics Symposium

Pan Pacific Microelectronics Symposium

February 11-14, 2019
Kauai Marriott Resort & Beach Club
Kauai, Hawaii

The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

2019 Program Finalized

The Pan Pac technical committee has finalized the program for the 2019 Symposium. In addition to several inspiring keynotes, this program features ground-breaking research from global experts on Processing Technologies, Advanced Process, Advanced Design, Cleaning, Harsh Environments Requirements, Materials Technology, Trends in Advanced Packaging & Interconnects, X-Ray, Inspection, and more.

Click here to view the full schedule!

Pan Pacific Microelectronics Symposium 2019 Schedule




Pan Pac Provides You The Latest Research On

  • Advanced Packaging & Processes
  • Automotive Systems & Hardware
  • Cleaning Technologies
  • Heterogeneous Integration
  • Inspection & Test Techniques
  • Interposer & Packaging Technology
  • Materials & Reliability
  • Nanotechnology Applications
  • Trends, Roadmaps, and more...



  • Steering Committee

    Phil Isaacs, IBM Corporation, Chair
    Dag Andersson, Ph.D., Swerea IVF AB
    Charles E. Bauer, Ph.D., TechLead Corporation
    Ross Berntson, Indium Corporation
    Dock Brown, DfR Solutions
    K.N. Chiang, Ph.D., National Tsing Hua University
    Dwight Howard, APTIV LPC
    Joungho Kim, Ph.D., KAIST
    Yasumitsu Orii, Ph.D., NAGASE Group
    David Raby, STI Electronics
    Kirsten Weide-Zaage, Ph.D., University of Hannover


    David Ravy, STI Electronics "Pan Pac is unique because of the high-quality attendees and exceptional presentations it draws, as well as the casual and social atmosphere that permeates the conference."
    David Raby, STI Electronics, Inc.