Pan Pacific Microelectronics Symposium

Pan Pacific Microelectronics Symposium

Plan to join us at the Hapuna Beach Prince Hotel on the Big Island of Hawaii.
February 5-8, 2018

The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

2018 Program Finalized

The Pan Pac technical committee has finalized the program for the 2018 Symposium. In addition to several inspiring keynotes, this program features ground-breaking research from global experts on Advanced Packaging & Processes, Automotive Systems & Hardware, Cleaning Technologies, Heterogeneous Integration, Inspection & Test Techniques, Interposer & Packaging Technology, Materials & Reliability, Nanotechnology Applications, and more.

Click here to view the full schedule!

Pan Pacific Microelectronics Symposium 2018 Schedule




Pan Pac Provides You The Latest Research On

  • Advanced Packaging & Processes
  • Automotive Systems & Hardware
  • Cleaning Technologies
  • Heterogeneous Integration
  • Inspection & Test Techniques
  • Interposer & Packaging Technology
  • Materials & Reliability
  • Nanotechnology Applications
  • Trends, Roadmaps, and more...



  • Steering Committee

    Phil Isaacs, IBM Corporation, Chair
    Denis Barbini Ph.D., Universal Instruments Corporation
    Charles E. Bauer, Ph.D., TechLead Corporation
    Ross Berntson, Indium Corporation
    Dock Brown, DfR Solutions
    Dwight Howard, Delphi
    Soeren Noerlyng, MICRONSULT
    Yasumitsu Orii, Ph.D., NAGASE Group
    David Raby, STI Electronics


    David Ravy, STI Electronics "Pan Pac is unique because of the high-quality attendees and exceptional presentations it draws, as well as the casual and social atmosphere that permeates the conference."
    David Raby, STI Electronics, Inc.