Pan Pacific Microelectronics Symposium

Pan Pacific Microelectronics Symposium

The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

Save the Date for Pan Pac 2020!

February 10-13, 2020
The Westin Hapuna Beach Resort
The Big Island of Hawaii

Westin Hapuna Beach Resort

Call for Abstracts

Deadline for Abstracts: September 16, 2019
Start planning now to present your research next year. Abstracts of 500 words should be submitted with title and author contact information.

A Successful Pan Pacific Symposium 2019

February 11-14, 2019
Kauai Marriott Resort & Beach Club
Kauai, Hawaii

The 24th Annual Pan Pacific Microelectronics Symposium that took place February 11-14, 2019, at the auai Marriott Resort & Beach Club on Kauai, Hawaii was well received by attendees from North America, Asia, and Europe. Over thirty papers were presented to attendees from eleven countries. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.

Kauai Marriott

View the 2019 Program

The Pan Pac technical committee has finalized the program for the 2019 Symposium. In addition to several inspiring keynotes, this program features ground-breaking research from global experts on Processing Technologies, Advanced Process, Advanced Design, Cleaning, Harsh Environments Requirements, Materials Technology, Trends in Advanced Packaging & Interconnects, X-Ray, Inspection, and more.

Click here to view the full schedule!

Pan Pacific Microelectronics Symposium 2019 Schedule

Pan Pac Provides You The Latest Research On

  • Advanced Packaging & Processes
  • Automotive Systems & Hardware
  • Cleaning Technologies
  • Heterogeneous Integration
  • Inspection & Test Techniques
  • Interposer & Packaging Technology
  • Materials & Reliability
  • Nanotechnology Applications
  • Trends, Roadmaps, and more...

  • Steering Committee

    Phil Isaacs, IBM Corporation, Chair
    Dag Andersson, Ph.D., Swerea IVF AB
    Charles E. Bauer, Ph.D., TechLead Corporation
    Ross Berntson, Indium Corporation
    Dock Brown, DfR Solutions
    K.N. Chiang, Ph.D., National Tsing Hua University
    Dwight Howard, APTIV LPC
    Joungho Kim, Ph.D., KAIST
    Yasumitsu Orii, Ph.D., NAGASE Group
    David Raby, STI Electronics
    Kirsten Weide-Zaage, Ph.D., University of Hannover

    David Ravy, STI Electronics "Pan Pac is unique because of the high-quality attendees and exceptional presentations it draws, as well as the casual and social atmosphere that permeates the conference."
    David Raby, STI Electronics, Inc.