Calendar of Events
Atlanta Chapter: The X-Factor - How X-ray Technology is Improving the Electronics Assembly Process +
Georgia Institute of Technology Student Chapter Chapter: "X-factor" Tech Talk Event by Dr. Bill Cardoso +
Marcus Nanotechnology Research Center Auditorium
- Electronic component inspection and failure analysis.
- Component counting and material management.
- Reverse engineering.
- Counterfeit detection.
- Real-time defect verification.
- Computed tomography (CT) techniques and 2D, 2.5D, and 3D X-ray inspection.
- Design for manufacturing (DFM) and design for x-ray inspection (DFXI).
- Incorporation of AI (Artifiicial Intelligence) in X-ray inspection.
This is a co-host event with SMTA Atlanta Chapter. To RSVP, please check out the link: https://www.smta.org/chapters/rsvp.cfm?bee_id=4835
Space Coast (Melbourne FL) Chapter: What IPC Specification is right for me ? +
Mack Technologies, 7505 Technology Dr, West Melbourne, FL 32904
Tampa Bay Chapter: SMTA Tampa Bay Chapter Meeting +
Jabil Circuit 10560 Dr. MLK Jr. Street N St. Petersburg, FL 33703
Please save the date for our next chapter meeting at Jabil Circuit on March 5, 2020.
Our speakers are Bob Doetzer, President, and Jason Lambert, MIT, from Circuit Technology. Here is an overview of the presentation:
Title: Which IPC specification is right for me-understanding the alphabet soup of IPC specifications”
Summary: The IPC specifications are the industry standard which virtually all companies worldwide use as their quality standard. When trained in them, operators are more effective, confident and capable of performing their specific job function. However, some of the IPC acronyms and terminology can cause confusion, resulting in selecting the wrong training or avoiding certification altogether. This presentation explores the 5 IPC assembly specifications with examples from each so that you can make a more informed decision regarding the best training to optimize your process. The IPC specifications are:
- IPC-J-STD-001 – Requirements for Soldered Electronical & Electronic Assemblies
- IPC-7711/7721 – Rework, Modification and Repair of Electronic Assemblies
- IPC-A-610 – Acceptability of Electronic Assemblies
- IPC/WHMA-A-620 – Requirements & Acceptance for Cable & Wire Harness Assemblies
- IPC-A-600 – Acceptability of Printed Boards
When selecting the correct training and certification, employees gain valuable knowledge and increase their level of expertise resulting in higher efficiency, lower cost and higher profit.
In addition, we will have a Master IPC trainer there to demonstrate some of the techniques used in the soldering and reworking today’s complex PCB’s. He is also available to help develop a soldering or rework process for your challenging applications. So bring your problem soldering and rework boards and let us help turn that bone pile into cash.
San Diego Chapter: FILL THE VOID V - MITIGATION OF VOIDING FOR BOTTOM TERMINATED COMPONENTS +
Hughes Circuits Inc., 546 S Pacific St, San Marcos, CA 92078
Join the San Diego Chapter Meeting for a presentation by:
Philadelphia Chapter: SMTA Philadelphia Chapter Reformation Technical Meeting and Celebration Event +
Lutron Electronics, Inc.
SMTA Philadelphia Chapter
We believe in our ability to rise like a phoenix and become brighter and stronger than ever before. Members of the SMTA Philadelphia Chapter invite you to attend our first 2020 Chapter event on 12 March 2020 at Lutron Corporation World Headquarters, Coopersburg, PA 18036.
Event Value Proposition:
If you were not able to attend APEX 2020 in San Diego we will bring it to you!
Mr. Greg Smith, BlueRing Stencils, will present “Root Cause Stencil Design for SMT Components thermal lands”. This paper was presented at APEX 2020 technical conference. The presentation will explore recent studies on stencil design to minimize voiding on quad flat no lead (QFN) thermal lands and specifically explores the effect of the window pane design on void area percentage after reflow for surface mount technology (SMT) component thermal pads without introducing float to the component. Specific window pane gap sizes, total area printed and distance of the outer pane edges to the copper thermal land edge will be varied to determine guidelines for thermal pad stencil design.
Mr. Jason Fullerton, MacDermid Alpha Electronics Solutions, will present “Advances in Lead-free Solder Technologies for High Reliability Applications”. This presentation will explore topics relating to lead-free alloy development, enhancements in solder paste performance, and processing differences between these alloys and typical SAC and tin-lead alloys. In the age of environmental regulations that have driven the electronics industry to widely adopt tin-silver-copper (SAC) lead-free solders, high reliability applications continue to use legacy tin-lead solder alloys. However, evolving designs, service environments, and reliability requirements have driven development of new types of solder alloys. In addition, shrinking package sizes requiring increased power densities have created the need for high electrical reliability and low voiding from solder paste fluxes.
Registration is $20 for members and $30 for non-members. Registration fee will be waived if you join the SMTA during this event!
Hurry up to register! The first 10 to register and attend our meeting would receive SMTA tumblers.
The evening is scheduled as follows:
5:15-6:15 PM Registration, Networking & Dinner
6:15-7:45 PM Presentation
SMTA Philadelphia Chapter:
Gregory K Arslanian
SMTA Philadelphia Chapter Meeting Location:
Lutron Electronics, Inc.
7200 Suter Rd,
Coopersburg, PA 18036
Silicon Valley (San Jose) Chapter: SMTA Silicon Valley Chapter meeting (POSTPONED) +
This meeting is planned to be rescheduled for April but no date has been finalized yet!
This year's 1st SMTA Silicon Valley chapter meeting was planned to be held on Thursday March 12th 2020 at Meritronics in Milpitas, CA. It will cover 3D Printing/Additive Manufacturing. Further details and the link to RSVP, are below.
PLACE: Meritronics, 500 Yosemite Drive #108, Milpitas, CA 95035.
TIME: Sign In/Registration: 2:45pm-3pm
SMTA Members: Free; Non-Members: $20 (By cash or check payable to ‘SMTA Silicon Valley Chapter’ at the door)
Membership Drive Event: SMTA Member can bring a non-member for free to this meeting.
SMTA Membership (Membership sign up at www.smta.org)
Philip DeSimone - Chief Customer Officer, Co-Founder, Carbon Inc.
Digital Manufacturing and 3D Printing at Scale
Bio: Philip DeSimone is a part of the founding team at Carbon and he currently serves as the company’s Chief Customer Officer. He has worked since the company’s inception on partnerships with brands such as like Adidas and Riddell, as well as lead its global sales organization. In this role he is responsible for customer success, retention and acquisition as well as managing the company’s strategic relationships and customers. As a Co-Founder, he helped to institute a customer-first approach for the success of customers. He was previously the company’s VP of Business Development where he managed partnerships and key customer accounts. In 2016, he was named to the Forbes 30 under 30 list and has been quoted and featured in key digital manufacturing media.
Tom Lopez, Business Development Manager, Loctite 3DP
The Missing Link…Materials
Abstract: The widespread adoption of Additive Manufacturing is at the tipping point. One of the hurdles facing adoption is the lack of “open source” materials needed to make functional parts. In this discussion, we will explore how the company is working change the landscape of printable materials. With our recent acquisition of a technology-driven company focused on discovery and product innovation in the additive manufacturing space we are working to rapidly develop new materials with unique properties for the Additive Industry.
Bio: With over 15 years of experience with the company, Tom has recently been named the North America Director of Additive Manufacturing Education and Training for Sales Engineers and the Distribution network. The company sales engineers interface with thousands of customers weekly working to increase manufacturing throughput with innovative solutions and help to spread the message that Additive Manufacturing is much more than creating prototypes and the new materials exist for the printing of “end use” functional parts.
Robert Coffron - Business Development Manager, West Coast, Ultimaker
Bio: With more than 10 years experience in Additive Manufacturing Business Development, Robert has an understanding of the different technologies and how they are used in Manufacturing and the R&D space. He is experienced at integrating additive technology on the factory floor.
Webinar: BGA & Area Array Failures, Causes & Corrective Actions +
Monday 16th March @ 2:30pm - 4:00pm UK Time (10:30am - 12:00pm US Eastern Time)
Presenter: Bob Willis, SMTA Europe
Ball Grid Array or area array packages have been used in the industry for many years and are widely available for commercial and military applications. Everyone blames the BGA for failure, often because you can’t see under the package but is it the real failure in your process? Bob will outline the correct assembly process, the most common failure modes and corrective action. Just like surface mount, the use of BGAs can affect printed board layout, assembly, inspection and repair process. However, BGAs provide significant advantages over fine pitch components on assembly yield.
Modern Lead-Free Assembly Processes
Issues with Plastic BGA, Ceramic BGA, Column Grid Array, Land Grid Arrays
Lead-free and tin/lead paste
Effect of incorrect profiling
Head in or on Pillow
Hot tearing of joints
Voiding in solder joints
After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.
All webinar times shown are UK time – to check your local time in your countries click here
Massachusetts (Boston) Chapter: Monthly Evening Meeting Status Update +
To All Our Industry Colleagues
With the significant limitations of being able to meet and hold technical sessions that the COVID-19 (Corona) Virus has forced upon everyone the SMTA Boston Chapter will be postponing our regular monthly technical meetings until health officials indicate that the risk of contracting the virus has subsided and gatherings and meetings are again safe for all. In the mean time we hope that everyone is safe and healthy during these difficult times. Equally, we have several Technical Sessions and facility tours ready to go as soon as it is safe and prudent to do so. Stay tuned for announcements about and the dates of our future meetings, hopefully later this spring. Most of all we hope that the Coronavirus will prove to impact fewer people and subside much faster than predicted.
Our 2019 Expo Sponsors:
Oregon Chapter Tutorial Program - DFM to DFX: The World of Shrinking Electronics (HELD VIA WEBINAR) +
ATTENTION: DUE TO RECENT EVENTS AND VIRUS CONCERNS, THIS EVENT WILL NOW BE HELD BY WEBINAR!
Instructor: Dale Lee, Plexus Corp.
March 17 and 19, 2020
Great Value! Half the cost of a tutorial at SMTA International and you never need to leave the comfort and safety of your home or office. Upon request, a certificate of completion will be sent to you via email at the conclusion of the 2nd session.
Today's electronic component packaging technologies of smaller packages (0201/01005/008004), finer lead pitch (0.4/0.35/0.3/...), bottom terminated components (QFN/DFN/LGA) and printed circuit board designs (high layer counts, finer lines, via in pad plated over (VIPPO), multiple copper thicknesses, copper routing, ...), increased thermal sensitivity, fabrication and assembly industry standards have impacted traditional assembly processes with addition of tight solder application, component placement, thermal management and soldering constraints. Using traditional, simplified mass production techniques are not sufficient to address tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products. This course will highlight issues with today's electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately address during design, PCB fabrication, assembly and test. In addition, the concept of manufacturing, test, reliability by design will be presented.
What you will learn:
• Industry Standards Limitations (IPC/JEDEC)
• Component packaging impacts
• PCB design
1) Laminate Limitations – Rigid/Rigid-Flex/Flex
2) Via hole closure
3) Trace routing size/copper etching effects
• SMT and PTH solder design impacts
• Components with thermal management impacts:
1) Component design
2) PCB Thermal balance: X, Y and Z axis
3) Trace routing/solder mask/silk screen
4) Equipment limitation/tolerance
5) PCB array tolerance
6) Process tooling design
• Process control impacts
• Paste volume, thermal shock SMT and PTH, reflow process warpage
• Compatibility issues, low stand-off components
• Cleaning impacts
• Test and inspection impacts
About the Instructor:
Dale is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields.
Dale has been involved in surface mount design, package & process development and production for over thirty years in various technical and managerial positions. These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of Chip Scale Package (CSP) & Ball Grid Array (BGA) packages, PCB & PCBA support, DFM/DFX analysis of flex, rigid-flex & rigid PCB/PCBA’s including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications for consumer products, defense/aerospace and medical devices.
Dale has authored multiple technical articles and papers and is a frequent instructor/presenter globally on topics including PCB and SMT design, assembly, cleaning, and DFM/DFX. He is a past recipient of the Surface Mount Technology Association’s “Excellence in Leadership” award and IPC's "President's Award." He has been or is very involved with multiple industry associations (SMTA, IPC, INEMI), industry standards development, and symposium/ conference technical development committees.
Contact Karen Frericks at 952-920-7682 with questions.
Mexico-Juarez Chapter: Chihuahua Expo & Tech Forum (POSTPONED) +
Great Lakes (Chicago) Chapter: Great Lakes Chapter - Rauland Plant Tour & Advanced NANO By STENTECH Presentation (Postponed) +
Rauland, 1802 W. Central Road, Mount Prospect, IL, 60056
|Location:||Rauland, A Division of Ametek|
|1802 W. Central Road|
|Mount Prospect, IL 60056-2230|
|3:30-4:00 pm||Rauland Corporation Tour/Demo|
|4:00-5:00 pm||Presentation: “Advanced NANO By STENTECH” – TBD, Stentech|
|Cost:||(Half Price Event! Don't Miss Out!)|
|**Pay via Cash/Check (onsite) or Credit Card (via PayPal - see button during RSVP process)|
By Brent Nolan
A newly developed Stencil coating that delivers significantly increased adhesion which results in better mechanical abrasion resistance. The coating is thermally cured and completely cured within minutes post coat.
- Coatings purpose – 10 min
- Coating data – 10 min
- Coating advantages over current market coatings – 10 min
- Video presentation 10 min
About the Speaker:
Brent Nolan will be presenting “Advanced Nano” used on Laser cut stainless steel Stencils and Eform Ni stencils.
Brent’s background includes owning a printed Circuit board shop for 20 years in Dallas Texas before moving into the stencil and pallet arena which he has served for 7 years. Brent has participated in the development of several coatings over the past 6 years but believes Advanced Nano is the best coating he has tested thus far.
RSVP to Gerri Noble at email@example.com or via the SMTA Great Lakes Chapter Webpage or by clicking HERE.
Coronavirus - Visitor Precaution:
Houston Chapter: SMTA Houston Expo CANCELLED for May 26, 2020 +
The health and safety of our friends and community is our major concern. We are following current local health agency emergency recommendations as well as government travel advisories. Since most major functions in our area have been cancelled or postponed, we feel that it is better to postpone the SMTA Houston Expo to a later date. We apologize for the inconvenience this cancellation has caused and will reschedule our Expo in late August.
Mexico-Guadalajara Chapter: CANCELLED - 1st Technical Day - 2020 +
Huntsville Chapter: Huntsville Chapter Technical Meeting (Postponed) +
STI Electronics Inc., 261 Palmer Road, Madison, AL 35758
Save the Date and Mark your calendars
March 26, 2020 @ 3:00PM
STI Electronics Inc., 261 Palmer Road, Madison, AL 35758
How does one collect “Objective Evidence” to meet the new J-STD-001 Section 8.1 on electronic assembly cleanliness?
The presentation will explore why this IPC standard came about and why the current “ROSE” test methodology is not enough anymore. It will explore different tools and techniques as well as discuss how to gather objective evidence needed to meet the specification. Mark will also discuss how to ensure on-going process control and repeatability on lot-to-lot acceptance to show compliance going forward. The objective is to show the how and test methodologies that can be used to show that you know how clean your electronic assemblies are built to on a consistent basis. There will be an actual demonstration of the equipment and test reports that are generated by the SIR test equipment along with the actual hardware that generates the test data that supports “Objective Evidence” for review. Do you know how “clean or dirty” your electronic assemblies are built to?
Mark T. McMeen joined STI Electronics Inc. as Vice President of Engineering Services in July of 2000. Prior to joining STI, Mr. McMeen was the Vice President of Engineering and Technical Director of Component Intertechnologies, Inc. He currently oversees the day to day operations of the Engineering Services division of STI which incorporates three entities: Analytical lab, Prototype and Manufacturing Lab and Microelectronics Lab. He has over 30 years of experience in the manufacturing and engineering of printed circuit boards, both flexible and rigid, as well as in the manufacture of electronic assemblies. He has automotive electronic experience (instrumentation clusters) and military electronic hardware. He has spent most of his early years in electronic manufacturing in the packaging of electronic components and multi-chip modules and their integration onto printed circuit boards. He currently holds two co-patents in the fabrication of flexible circuit boards and the processes necessary to imbed integrated circuits inside rigid printed circuit boards. He is also one of the co-inventers in the development of the Magnalytix (a joint venture between STI Electronics and Kyzen Corp) in the development of commercially available SIR test equipment.
FREE Webinar: Optimizing Conformal Coating Coverage for Improved Environmental Corrosion Protection +
Friday 27th March @ 10:00am Penang Time UTC+8
(10:00pm US Eastern Time UTC-4)
Presenter: Chen Xu, Ph.D., Nokia Bell Labs
Free for all – only members will get access to slides!
Note: A recording will not be available but we will plan to arrange another session at a time convenient for American and European time zones.
Conformal coating is widely used to provide environmental protection for electronics in challenging environments with high relative humidity, corrosive gas and dust concentration as well as in coastal environments. Although the physical and chemical properties of conformal coatings are often characterized and studied, very little research has been done to understand the effectiveness of conformal coating in protecting electronics in various harsh environments. This work examines the effect of conformal coating coverage, especially the coating thickness, on the environmental protection of the conformal coating. Results of optimizing coating coverage and quality control will also be presented.
About the Presenter
Dr. Chen Xu is a Distinguished Member of Technical Staff with Nokia Bell Labs CTO. He has extensive experience in the fields of semiconductor and electronic packaging, electronic manufacturing, surface finishes and coatings, failure mode analysis and reliability assessment. In the last 15 years, he has been focusing on the impact of environmental conditions (such as corrosive, dusty and salty environments) on the reliability and performance of electronic equipment. Chen Xu received his BS Degree in Chemistry from Tong-ji University in Shanghai, China and his Ph.D. in Physical Chemistry from Ruhr-University Bochum, Germany.
Wisconsin Chapter: WI SMTA Technical Meeting at Wago (Cancelled - Watch for Webinar Details) +
For the health and safety of our industry we have decided to postpone the first Technical meeting of 2020. We do plan to make this a webinar in the upcoming weeks. Refunds will be made through paypal as soon as we can.
With Fuji America presenting at Wago
N120W19129 Freistadt Rd. Germantown, WI
“Challenging Component Placement Technology including
LED, Odd Form components, automating the manual part insertion process”