Calendar of Events
Webinar: PCB Outgassing and How to Test Bare or Assembled Boards +
Monday 10th February @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)
Presenter: Bob Willis, SMTA Europe
Printed circuit boards outgas during soldering causing solder voids, solder balls and other process problems. Outgassing can occur in wave, selective and reflow soldering and it’s important first to non-destructively test samples to find the root cause. It’s possible to test bare or assembled boards to examine the potential for failure and eliminate some of the popular misconception in industry. There are some different methods which can easily be conducted in manufacture before proceeding to costly laboratory analysis and we show you how to do it and the typical results you can find!
Outgassing from vias, through holes and solder masks
How to test samples in manufacture
Test method procedures
Type of defects and how they can appear with tin/lead and lead-free alloys
Void formation in wave selective and PIHR joints
Correct specification of your boards
After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.
All webinar times shown are UK time – to check your local time in your countries click here
Pan Pacific Microelectronics Symposium 2020 +
Westin Hapuna Beach Resort
Big Island , HI
The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
Central Texas (Austin) Chapter: CTEA Symposium at National Instruments (NI) - Reminder, Register NOW! +
National Instruments, Bldg-C, 11500 N. Mopac Expy, Austin, TX 78759
Central Texas Electronics Association (Joint Chapter of IMAPS & SMTA Members) Presents:
Electronics Design, Manufacturing & Test Symposium
Tuesday, February 11, 2020
National Instruments (NI), Bldg-C, 11500 N. MoPac Expy, Austin, TX 78759
3:00 - Registration Begins
3:30 - Welcome and Introductions
3:35 - " Test System Avengers: Managing System Level Risks Through Design for Maintainability ”
DJ Loberg, Sr Systems Quality Eng, National Instruments
4:05 - " Peeking Into the Car of the Future ”
Luis Basto, Design Engineer, NXP Semiconductors
4:35 - Break for Networking
4:50 - " Electronics Cooling and Thermal Challenges ” (Part 1 of 3), (Part 2 of 3), (Part 3 of 3)
Dave Rolando, Senior Applications Engineer, ANSYS
5:20 - " Trends in 5G and the Impact on the Electronics Industry ”
Jan Vardaman, President, TechSearch International
5:50 - Door Prizes Drawing & Closing Remarks
6:00 - Food & Refreshments Served and More Networking
RSVP to Bob Baker at: firstname.lastname@example.org (Please respond to Bob Baker only, DO NOT reply via RSVP link!!
There is no charge for SMTA and IMAPS members;
$10 for all non-members >> (Cash or Check ONLY!)
Students can also attend for FREE!
National Instruments, Bldg-C Conference Room, 11500 N. MoPac in North Austin
Near SW corner of Duval Road and MoPac
See Map at: (Map to NI)
In Central Texas, SMTA and IMAPS work together as the Central Texas Electronics Association (CTEA)
Oregon Chapter: SMTA OR Chapter, February Technical Meeting, Comparing PCB Surface Finishes and Their Assembly Process Compatibility +
Topic: Comparing PCB Surface Finishes and Their Assembly Process Compatibility
Presenter: Rob Rowland
Date: Feb 18th, 2020
Place: Axiom Electronics [9845 NE Eckert Drive Suite 200, Hillsboro, OR 97006]
Abstract: PCB (printed circuit board) surface finishes provide several important functions, the most important being solderability protection. The ideal PCB surface finish does not exist today. Every surface finish has some concerns that keep it from being the ideal finish. Surface finish selection has become more challenging as PCBA (printed circuit board assembly) complexity has increased (e.g. fine pitch components, BGAs, use of less active fluxes, etc.).
A PCB surface finish must be compatible enough with the assembly processes and end-use application (i.e. product reliability) to achieve acceptable results. The end-user must select the best overall surface finish for compatibility with their assembly processes and end-use application (e.g. consumer products or space applications). This is not an easy task because there are so many variables. Each variable must be understood to achieve good soldering results and the desired level of reliability.
This presentation will provide users with a basic overview of the common surface finishes, their advantages, and disadvantages, and some key assembly and reliability attribute to keep in mind when selecting a surface finish. During the presentation, we will also go through a decision matrix that can be used to select the appropriate surface finish based on assembly and end-user requirements.
Biography: Rob Rowland is the Operations Engineering Manager at Axiom Electronics in Hillsboro, Oregon. Rob has over 35 years of experience with surface mount manufacturing technology. Rob was the Technical Program Director of SMTA International for 20 years. He is a recipient of the SMTA Founders Award and the SMTA Member of Technical Distinction Award. Rob is also an active member of numerous IPC committees including IPC-7095, IPC-7093, and IPC-7530. He is a frequent speaker at industry trade events. He received a BS Degree in Manufacturing Engineering from Weber State University.
Capital (DC) Chapter: Jason Fullerton, MacDermid Alpha Electronic Solutions, to Present at SMTA Capital Chapter Meeting on February 20th +
The SMTA Capital Chapter is excited to host a Chapter Meeting on February 20th from 5:00 PM to 7:30 PM at PACE Worldwide in Elkridge, MD. Jason Fullerton, MacDermid Alpha Electronic Solutions, will be presenting “Advances in Lead-Free Solder Technologies for High Reliability Applications.”
This presentation will explore topics relating to lead-free alloy development, enhancements in solder paste performance, and processing differences between these alloys and typical SAC and tin-lead alloys.
In the age of environmental regulations that have driven the electronics industry to widely adopt tin-silver-copper (SAC) lead-free solders, high reliability applications continue to use legacy tin-lead solder alloys. However, evolving designs, service environments, and reliability requirements have driven development of new types of solder alloys. In addition, shrinking package sizes requiring increased power densities have created the need for high electrical reliability and low voiding from solder paste fluxes.
Jason Fullerton has been with MacDermid Alpha Electronics Solutions as a Customer Technical Support Engineer since 2013. He earned his Bachelor's Degree in Manufacturing Engineering from GMI Engineering & Management Institute (now Kettering University) in Flint, MI. He has worked in manufacturing operations in the automotive, high-reliability, and commercial electronics industries since 1993, specializing in SMT and Wave Soldering process engineering. Jason is a member of the SMTA and served as an officer in the Philadelphia chapter from 2011 - 2014. He is also an ASQ Certified Quality Engineer, Six Sigma Black Belt, and Reliability Engineer.
Jason has published and presented at a number of SMTA and IPC meetings and is recognized by the SMTA as a “Distinguished Speaker.” He is a participating member of the IPC J-STD-001 Task Group and received a Distinguished Committee Service Award for work related to development of changes to the ionic cleanliness requirements in J-STD-001G.
Don’t miss out on dinner and a facility tour prior to the presentation. Registration is $20 for members, $10 for students and $30 for non-members. Registration fee will be waived if you join the Capital Chapter during this event!
The evening is scheduled as follows:
5:00-6:00 PM Registration, Networking & Dinner
6:00-6:30 PM Facility Tour
6:30-7:30 PM Presentation
The SMTA Capital Chapter Meeting Location:
6605 Selnick Dr. #C
Elkridge, MD 21075
Puget Sound Chapter: Robotics in Manufacturing: Pitfalls and Best Practices +
Lake Washington Institute of Technology, Room E-155, 11605 132nd Ave NE, Kirkland, WA 98034
11:30 - Lunch and Networking
Noon - Program Begins!
2:00pm - Program Concludes
Robotics in Manufacturing: Pitfalls and Best Practices with Pete Vaca
This presentation will provide guidance to manufacturers on best practices on how to implement robotics into their unique processes as well as how to avoid some common pitfalls and misconceptions regarding robot automation. As the mature technology of robotics and others such as machine vision have earned their place on manufacturing floor, each on their own merit as well as in complimentary roles, the blending of the two was inevitable. Learn how the integration of these two technologies in particular, combined with the market needs for maximum efficiencies along with close human interaction have ushered in a new era of collaborative and smart robotics. The benefits from such innovation is having positive repercussions from the customer/end user that realizes increased productivity, ease of use and flexibility to the system integrator having at their disposal a truly multipurpose automation platform. The presentation will include a demonstration of a collaborative robot.
“The most fulfilling part of my job is helping the customer solve something by sharing what others and experience has taught me, shared knowledge is what we can leave behind”. Pete Vaca
Massachusetts (Boston) Chapter: Joint Chapter SMTA, iMAPS and IEEE Evening Meeting - Copper Plating of PC Boards +
Boxborough Regency, Boxborough, MA
|Date:||Tuesday, February 25, 2020|
|Time:||5:30 PM to 8:30 PM|
|Location:||Boxboro Regency Hotel
242 Adams Place, Boxboro, MA 01719
|Cost:||Students $15 register before 2/20/2020, $20 register after.
SMTA/iMAPS/IEEE Members $30 before 2/20/2020, $35 after.
Non-Member $35 before 2/20/2020, $40 after.
Retired/Un-employ $25 before 2/20/2020, $30 after.
|5:30 PM||Registration and Sign in, Socializing, Networking|
|6:30 PM||Dinner and Announcements|
|7:30 PM||Feature Presentation|
“Challenges and Opportunities in Shrinking RDL Features: Microstructure Control of Copper Deposits for Improved Fill and Reliability”
Advanced Materials are key enablers of new Advanced Packaging & Interconnect Technology Architectures, particularly in FO-WLP (Wafer-Level Fan-Out Packaging). Circuit miniaturization and densification hinges upon extending thermomechanical and feature fill capabilities of Copper Chemistries. We will highlight the renewed focus of plating chemistry suppliers on revamping their RDL products to increase fill uniformity over large ranges in feature shape and size. We will focus on limitations of traditional plating additive-based approaches and emerging feature fill approaches that extend via fill to aspect ratios below 0.1, then the mechanical challenges that arise from finer L/S dimensions and the opportunities to improve reliability performance. We will review the debate over re-engineering copper microstructure and provide new approaches to mechanical integration. Finally, we will demonstrate how adjacent challenges in seed etching and PR resolution limits can be addressed in the medium-term by exploiting highly tailored copper deposits that enable unparalleled control over line shape during plating.
Click here for more information about this event or copy this URL to your internet browser: http://events.r20.constantcontact.com/register/event?oeidk=a07egwink4z926dee29&llr=dntnvbkab
Click here to register for this event or copy this URL to your internet browser: https://events.r20.constantcontact.com/register/eventReg?oeidk=a07egwink4z926dee29&oseq=&c=&ch=
iMAPS Contact: Matt Bracy (MSD Sales)
2020 SMTA Chapter Officer's Leadership Forum +
Marriott Lakeside Orlando Hotel
Orlando , FL
February 28 - March 1 - Domestic Officers
February 28 - March 2 - Student & International Officers
Join us at the 13th Chapter Officer’s Leadership Forum
Develop leadership skills, learn from focused breakout sessions, network with your peers, and chart your course as effective leaders in your career, community, and as an SMTA chapter officer.
REGISTRATION HAS CLOSED
Due to space constraints, all Forum events are restricted to SMTA Officers and Board of Directors only.
DRESS CODE: The Forum weekend dress code is casual
HOTEL MEETING SITE
Marriott Lakeside Hotel
7419 Augusta National Drive
Orlando, FL 32822
Complimentary airport shuttle to the Marriott Lakeside Orlando Hotel
Make your hotel reservations through the registration website. Do NOT reserve directly with the Marriott!
SMTA Gratefully Acknowledges our 2020 Forum Sponsors: