Calendar of Events

   2020      

                           Oct        

October 2020

October 13 - 15

International Wafer-Level Packaging Conference  +

Bridging the Boundaries: Wafer, Panel and Beyond

Location
DoubleTree San Jose Airport Hotel
San Jose , CA 95110


SMTA and Chip Scale Review are pleased to announce the 17th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.

The IWLPC Technical Committee would like to invite you to submit an abstract for this program.

Abstract Deadline Extended: May 15, 2020


October 13 - 14

International Wafer-Level Packaging Conference Exhibition  +

Location: Double Tree Hotel
2050 Gateway Place
San Jose, CA 95110



Exhibitors

Sponsorship and Exhibitor Information


Dates: October 13-14, 2020
Location: DoubleTree by Hilton Hotel, San Jose, CA

Monday, October 12
Move in: 12:00pm-5:00pm

Tuesday, October 13
10:00am-5:00pm

Wednesday, October 14
10:00am-4:00pm
Move out: 4:00pm-7:00pm

Click here to review Sponsorships and Exhibits

 

How Much is it to Exhibit?

  Early Registration
Before/On July 29th
Regular Registration
After July 29th
One Booth
(8' D x 10' W)
$1500 $1700
One Table
(6' Table)
$1100 $1300


Why Exhibit at IWLPC?

* Reach a focused international audience
* Generate Exposure in this highly competitive marketplace
* Share New Products and concepts to the market
* Enhance Relationships with existing customers and generate new leads
 

What type of attendees will be there?

Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
 

Click here to view the 2020 floorplan



Attendees

Note - If you already registered for the IWLPC conference you do not need to register separately to attend the expo.


October 13

Austin (CTEA) Expo & Tech Forum  +

Location: Norris Conference Center
2525 West Anderson Lane
#365
Austin, TX 78757



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular) (click here for membership information).

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list.

Electricity is an additional $50 per outlet. Early bird pricing ends on September 18, 2020!

Ad/Sponsorship Form
Exhibit Application PDF

Please contact SMTA Expo Manager Courtney Kalb with questions or for additional information.

For inclusion in the official onsite event guide, you must have your company description and other required information updated and sent to courtney@smta.org before Wednesday, September 16, 2020.



Attendees

 


October 15

Additive Electronics TechXchange  +

Location
DoubleTree by Hilton San Jose
San Jose , CA San Jose


Today's increasingly sophisticated electronics challenge designers and fabricators to push the limits of traditional design, fabrication and assembly and think outside of the box. Additive manufacturing enables environmental advantages, opens up design capabilities and end use advantages such as weight reduction, miniaturization and 3 dimensional design. This conference is designed to not only showcase options and processes intended to enable line width and space from .003" to 5 microns, but also to provide information on supporting materials and processes that are being developed to serve all market segments and expose attendees to other new advanced technologies intended to meet the ever increasing challenges of smaller, lighter and  more powerful electronic devices. 

The format of this techXchange is to showcase the needs and requirements of the end users and provide an opportunity for the supply chain to respond.

Submit your abstract today! 

Abstract Submission Deadline: July 1, 2020


October 18 - 20

SMT Processes Certification (Guadalajara, Mexico)  +

Location
Guadalajara , JA Mexico


Location:

Guadalajara, Jalisco MX

Schedule: 

  • October 18- Course (8:30-5pm)
  • October 19- ½ day of course + exam
  • October 20- All day exam (8:30-5pm)
  • Instruction: English/Spanish
    Test: English
    Instructors: Ivan Castellanos, Indium Corporation

 

Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.

Why You Should Participate

  • Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


October 20

Intermountain Utah Expo & Tech Forum  +

Location: Weber State University - in Shepard Union
3910 W. Campus Drive
Ogden, UT 84408



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members.
The cost to exhibit for non corporate members is $450/$550 (early/regular) (click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list.

Electricity is an additional $50 per outlet. Early bird pricing ends on September 30th, 2020!

Ad/Sponsorship Form
Exhibitor Application PDF


Important Exhibitor Materials:

  • Please contact an SMTA Expo Manager with questions or for additional information.

For inclusion in the official onsite event guide, you must have your company description and other required information updated and sent to expos@smta.org before Wednesday, September 23, 2020.



Attendees

Free Parking Information for Attendees and Exhibitors:

Park in the Pay Lot, which is right by the Shepard Union where the expo is located. You will receive a business card from a SMTA staff member when you leave. You will then take the card and the stub you get when you pulled in and put them in the yellow envelope that will be on your car. This will give you FREE parking, if you do not follow this then you will have to pay $8.

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Tuesday, October, 20, 2020
10:00AM–4:00PM

More on the Technical Sessions to Follow.....



October 21 - 22

Guadalajara Expo & Tech Forum  +

Location: Expo Guadalajara
Av. Mariano Otero
#1449, CP
Verde Valle, Guadalajara, Jal. 44550



Exhibitors

Exhibitor Information: 

Prices below are per 3x3 Meter Booth:

  Before April 30, 2020 After April 30, 2020
Corporate Member $1,000 USD / $20,000 MXN $1,350 USD / $27,000 MXN
Non-Corporate Member $1,200 USD / $24,000 MXN $1,500 USD / $30,000 MXN

 

Please Contact Expo Manager, Courtney Kalb, with questions or for additional information.

 



Attendees

More information coming soon!

 



October 27

Dallas Chapter: Dallas Expo & Tech Forum  +

Location
Plano Event Center, 2000 E. Spring Creek Pwky, Plano, TX 75074



Location: Plano Event Center
2000 E. Spring Creek Pkwy
Plano, TX 75074 

 

Attendees
 
 

Event Schedule:
Postponed to October 27th
Setup is October 26th, 12:00pm - 4:00pm
 
October 27th

  • 8:00 Registration opens
  • 8:30 Speaker 1
  • 9:15 Keynote Speaker 2
  • 10:00 EXPO Opens
  • 11:00 Speaker 3
  • 12:00 Lunch starts
  • 1:30 Speaker 4
  • 3:00 EXPO Closes
  • 3:30 Happy Hour Starts (with Jeopardy Game)
  • 3:45 Live! Jeopardy (A Fun Game with a Technical Format)
    • Moderator: Dr. Mark Currie - Director of Solder (Henkel)
    • Judge: Chrys Shea, Shea Engineering Services
    • Judge: Dr. Neil Poole - Chemistry Fellow (Henkel)
    • Contestants: 4 of the leading DFW Process Engineers

First Expo Speaker:

CT Scanning: 3 Case Studies

Speaker: Rob Boguski, Datest

Digital Computed Tomography, or CT Scanning, has advanced in both equipment as well as techniques in recent years, such that it has now become the method of choice in many applications where workmanship, fabrication, process, and component-related defects are difficult, and often otherwise virtually impossible to find. Nevertheless misconceptions linger concerning the suitability of CT scanning as a nondestructive test and failure analysis methodology. This presentation will address some of those misconceptions by featuring 3 specific and recent applications of CT scanning, illustrating its wide potential for use as a diagnostic tool. Examples will be shown from the medical/biotech, military/aerospace, and electronics sectors. In each case we will state the specific problem to be addressed; highlight some significant, if not decisive images; and show conclusions drawn from compilation and analysis of the images, with any applicable lessons learned along the way.


 

Second Expo Speaker:

The Future of the Digital Thread - Industry 4.0

Speaker: Dr. Don Kinard, Lockheed Martin Senior Fellow

For the past 20 years the Digital Thread has enhanced development of manufacturing technologies including robotics, automation, graphical work instructions, AR, optical/laser projection, and more recently, the introduction of laser and structured light scanning. This digital thread has also brought industry to the foothills of the next industrial revolution, Industry 4.0, the revolution of data. The introduction of integrated IT architectures, the application of analytics and AI, as well as the focus on data strategy and data automation will dramatically change the landscape of corporations as they look for these new technologies to provide improved unprecedented insight into performance and the ability to predict and mitigate disruptions. As with previous revolutions some companies will fail to embrace the technology and flounder, and others will ride the data wave to secure their future.  
 

Third Expo Speaker:

See the Heat - Troubleshooting PCB & Electronic Product Design with Thermal Imaging

Speaker: Desmond Lamont, FLIR Systems Inc.

As electronic circuit boards and components get smaller and more powerful, inherent heat can cause failures and significant damage. FLIR Business Development Manager for Science, Jerry Feeney, compares traditional temperature measurement devices with infrared imaging. He uses real-world infrared images and examples to detail how infrared thermography can more easily identify hot spots, allowing for improved thermal management and greater advances in circuit board design.

 

Fourth Expo Speaker:

Tolerance Mistaken: Impacts of not properly addressing limitations of material, industry standards and assembly process limitations

Speaker: Dale Lee, Plexus Corporation

Electronic assemblies today are smaller, lighter with increased functionality per unit area and/or volume.  The rate of new technology adoption is increasing through develop ever smaller packages with finer lead spacing and substrates with finer lines and spaces.  However, design methods, industry standards, materials and manufacturing processes utilized during the product development and production process have not progressed to meet these new demands and thus many of the tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products.  This presentation will highlight issues with today’s electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately address during design, PCB fabrication, assembly and test.

 

Thank You to Our Door Prize Sponsor:

 

 

Thank You to Our Breakfast Sponsor:

 

Thank You to Our Happy Hour Sponsor:



Other Sponsors:





October 27

Dallas Expo & Tech Forum  +

Location: Plano Event Center
2000 E. Spring Creek Pkwy
Plano, TX 75074



Exhibitors

The Dallas Expo & Tech Forum has been postponed for Tuesday, October 27, 2020.

The cost to exhibit includes:
 - One 6 ft. Table
 - Two chairs
 - Company Sign
 - Lunch
 - Directory Listing
 - Attendee List

Please contact Courtney, SMTA Expo Manager, with questions or for additional information.

Plano Convention Center - Dallas

 

 

 

 

 

 

See You at the Plano Centre! 2000 E. Spring Creek Pkwy, Plano, TX 75074



Attendees

Exhibitor Set-Up:

October 26, 12:00pm - 4:00pm

 

Event Schedule:

8:00am

Registration Opens

 

8:30am

CT Scanning: 3 Case Studies

Speaker: Rob Boguski, Datest

Digital Computed Tomography, or CT Scanning, has advanced in both equipment as well as techniques in recent years, such that it has now become the method of choice in many applications where workmanship, fabrication, process, and component-related defects are difficult, and often otherwise virtually impossible to find. Nevertheless misconceptions linger concerning the suitability of CT scanning as a nondestructive test and failure analysis methodology. This presentation will address some of those misconceptions by featuring 3 specific and recent applications of CT scanning, illustrating its wide potential for use as a diagnostic tool. Examples will be shown from the medical/biotech, military/aerospace, and electronics sectors. In each case we will state the specific problem to be addressed; highlight some significant, if not decisive images; and show conclusions drawn from compilation and analysis of the images, with any applicable lessons learned along the way.

 

9:15am

The Future of the Digital Thread - Industry 4.0

Speaker: Dr. Don Kinard, Lockheed Martin Senior Fellow

For the past 20 years the Digital Thread has enhanced development of manufacturing technologies including robotics, automation, graphical work instructions, AR, optical/laser projection, and more recently, the introduction of laser and structured light scanning. This digital thread has also brought industry to the foothills of the next industrial revolution, Industry 4.0, the revolution of data. The introduction of integrated IT architectures, the application of analytics and AI, as well as the focus on data strategy and data automation will dramatically change the landscape of corporations as they look for these new technologies to provide improved unprecedented insight into performance and the ability to predict and mitigate disruptions. As with previous revolutions some companies will fail to embrace the technology and flounder, and others will ride the data wave to secure their future. 

 

10:00am

Expo Opens

 

11:00am

See the Heat - Troubleshooting PCB & Electronic Product Design with Thermal Imaging

Speaker: Desmond Lamont, FLIR Systems Inc.

As electronic circuit boards and components get smaller and more powerful, inherent heat can cause failures and significant damage. Desmond Lamont compares traditional temperature measurement devices with infrared imaging. He uses real-world infrared images and examples to detail how infrared thermography can more easily identify hot spots, allowing for improved thermal management and greater advances in circuit board design.

 

12:00pm

Complimentary Lunch

 

1:30pm

Tolerance Mistaken: Impacts of not properly addressing limitations of material, industry standards and assembly process limitations

Speaker: Dale Lee, Plexus Corporation

Electronic assemblies today are smaller, lighter with increased functionality per unit area and/or volume. The rate of new technology adoption is increasing through develop ever smaller packages with finer lead spacing and substrates with finer lines and spaces. However, design methods, industry standards, materials and manufacturing processes utilized during the product development and production process have not progressed to meet these new demands and thus many of the tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products. This presentation will highlight issues with today’s electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately address during design, PCB fabrication, assembly and test.

 

3:30pm

Happy Hour Starts!

 

3:45pm

LIVE ! Jeopardy (A Fun Game with a Technical Format)

Moderator: Dr. Mark Currie - Director of Solder (Henkel)

Judge: Chrys Shea, Shea Engineering Services

Judge: Dr. Neil Poole - Chemistry Fellow (Henkel)

Contestants: 4 of the leading DFW Process Engineers

The electronics industry is faced with challenges that often require immediate, yet long term reliable solutions. From a handheld device to a defibrillator, an automobile, or even a space station, each form factor in each of its respective markets expects robust manufacturing processes that create reliable products and sustainable solutions that match the customers’ expectations.

Implementing new, or off the shelf solutions can raise flags. Why? Lack of experience with any given technology naturally generates risk aversion, and in many cases, rightly so. To effectively adopt new solutions for high reliability applications, the strategy should be:

1. Understand external forces,

2. Overcome the lack of experience (that in essence have made us forget how to transition and improve and implement new technology), and

3. Implement solutions once we understand the application, while avoiding mistakes or oversights at all costs.

Triple jeopardy will seek the questions to answers on topics such as: Regulations; Whiskers; Failure Modes; Process Metrics; Compatibility; Sustainability; Inspection, Reliability; Qualifying new materials, Do’s and Don’ts, and many others,  in an interactive session, where the audience understands the symptoms, and the doctors will advise on root cause solutions.

 

Thank You to Our Sponsors:

 

 

 


October 29

New England Expo & Tech Forum  +

Location: Boxboro Regency Hotel & Conference Center
242 Adams Place
Boxboro, MA 01719



Exhibitors

The cost to exhibit for corporate members is $450/$550 (Early/Late) and $550/$650 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: 10 ft. x 10 ft. partitioned exhibit space, one draped table, two chairs, company sign, lunch, directory listing and registrant list.

Early registration expires on: October 2, 2020!

Electricity is an additional $100 per outlet.

The cost to exhibit includes:
 - One 6 ft. Table
 - Two chairs
 - Company Sign
 - Lunch
 - Directory Listing
 - Attendee List
 

All spaces will be assigned once we are sold out. If there is another exhibitor you want to be next to please let us know when you sign up.
Exhibit Application PDF
Sponsorship/Ad Form PDF

For additional information or questions, please contact McKenna, SMTA Expo Manager.

For inclusion in the official onsite event guide, you must have your company description and other required information updated and sent to mckenna@smta.org before Wednesday, October 7, 2020.



Attendees

Free Technical Program, Schedule and Exhibitor List Coming Soon!

 


Looking for a local chapter event? Check the Chapter News page for more events.
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819