Calendar of Events
SMT Processes Certification (Bangkok, Thailand) +
Cisco Systems (Thailand) Ltd.
Khwaeng Pathum Wan 10330 Thailand
Hosted at Cisco Bangkok Office
Cisco Systems (Thailand) Ltd.
999/9 Rama I Rd, Khwaeng Pathum Wan, Pathum Wan District, Bangkok 10330, Thailand
- January 14- Course (8:30-5pm)
- January 15- ½ day of course + exam
- January 16- All day exam (8:30-5pm)
- Instruction: English
Instructor: Jim Hall
Oregon Chapter: SMTA OR Chapter, January Technical Meeting, Preparing Soldering Materials for the 5G Environment +
Topic: Preparing Soldering Materials for the 5G Environment
Presenter: Ning-Cheng Lee
Date: Jan 21st, 2020
Place: Axiom Electronics [9845 NE Eckert Drive Suite 200, Hillsboro, OR 97006]
Abstract: 5G is coming, driven by the market need and anticipation. Coming with 5G need also comes the need to upgrade assembly materials to cope with the dramatic increase in the speed of electronic signals as well as the demand for reliability. In this talk, the desired features and directions for soldering materials will be presented, including both flux features and solder alloy requirements.
Biography: Ning-Cheng Lee is the Vice President of Technology of Indium Corporation. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 30 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.
Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received 1991 award from SMT Magazine and 1993 and 2001 awards for best proceedings papers of SMI or SMTA International Conferences, 2008 and 2014 awards from IPC for Honorable Mention Paper – USA Award of APEX conference, and 2010 Best Paper Award of SMTA China South Conference.
He was honored as 2002 Member of Distinction from SMTA, 2003 Lead Free Co-Operation Award from Soldertec, 2006 Exceptional Technical Achievement Award from CPMT, 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from SMTA, 2010 Electronics Manufacturing Technology Award from CPMT, 2015 IEEE Senior Member, 2015 Founder’s Award from SMTA, and 2017 IEEE Fellow. He has served on the board of governors for CPMT and SMTA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Components Packaging Manufacturing Technology. He has numerous publications and frequently gives presentations, invited to seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.
SMT Processes Certification (Penang, Malaysia) +
Cisco Systems (Malaysia) Sdn. Bhd
Penang 11950 Malaysia
Hosted at Cisco Penang Office
Cisco Systems (Malaysia) Sdn. Bhd.
No 31-17-1, Level 17, The C.E.O,
Lebuh Nipah 5, Bayan Lepas,
11950 Penang, Malaysia
- January 21- Course (8:30-5pm)
- January 22- ½ day of course + exam
- January 23- All day exam (8:30-5pm)
- Instruction: English
Instructor: Jim Hall
Rocky Mountain Expo & Tech Forum +
1701 Bryant Street
Denver, CO 80204
Hotel Room Block: Closes on January 3, 2020
1/22/2020 - 1/24/2020
Address: 1400 Welton Street, Denver, CO 80202
Discounted Rate: $169/night plus tax.
The cost to exhibit for corporate members is $375/$475 (Early/Late) and $450/$550 (Early/Late) for non-corporate members.(click here for membership information)
The cost to exhibit includes:
1 6 ft. Table
Discounted registration rates expire on Wednesday, January 2, 2020!
All spaces will be assigned once we are sold out. If there is another exhibitor you want to be next to please let us know when you sign up.
Please contact Expo Manager, Courtney Kalb, for questions or additional information.
Backstage Tour of Mile High Stadium
As a special treat, we will have a backstage tour of Mile High Stadium for 25 attendees. Registrations are limited so book early. Cost for the tour is $25 per person – a bargain for the opportunity to go behind the scenes of the Denver Broncos. Tour will run at 1:00pm.
Tolerance Mistaken: Impacts of not properly addressing limitations of material, industry standards and assembly process limitations
Electronic assemblies today are smaller, lighter with increased functionality per unit area and/or volume. The rate of new technology adoption is increasing through develop ever smaller packages with finer lead spacing and substrates with finer lines and spaces. However, design methods, industry standards, materials and manufacturing processes utilized during the product development and production process have not progressed to meet these new demands and thus many of the tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products. This presentation will highlight issues with today’s electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately address during design, PCB fabrication, assembly and test.
Additively Manufactured Electronic (AME) Circuits and Devices: Technology and Performance
Electronic circuits and devices have been manufactured by the layering, drilling (laser) printing the conductive pattern process followed by component mounting: from IC, to capacitors, coils, and transformers . These are commonly known as Printed Circuit Boards (PCB). Additive manufacturing offers a different approach that enables the manufacturing of electronic circuits and devices not only with enhanced-, but also with unique- functionality that is not possible in PCBs or the cost is too high. This presentation will discuss the technology, applications, and electrical characterization for AMEs (Additively Manufactured Electronic) circuits and devices. This includes the manufacturing process compared to PCBs, new characterization techniques, reliability, and applications from DC to several GHz. Reliability testing using thermal, humidity, and vibration cycles shows no degradation on the electrical performance of the AME circuits. The AME applications to be shown include in AME power transformers, built in DC and RF capacitors, RF transmission lines, in AME coax “cable”, Internet of Things, coils and antennas, etc. In RF applications, the in AME circuit capacitors show superior performance compared to similar devices produced by mounting commercial capacitors on PCBs, in addition these AME capacitors exhibit less than 1% variability from AME to AME circuit with breakdown voltages in excess of 1KV. Similarly, IoT AME transmitters and receivers show over 10% points better transmission rate success as compared to same commercially available PCB designs.
Backstage Tour of Mile High Stadium - $25 - Must Register!
From Industry 3.0 to 4.0: Data Deluge to Value-Realization
Industry 3.0 brought computers to the manufacturing floor, the ability to program in sequences of steps and have them executed automatically. It also brought the ability to automatically write and log historical records in principle useful for all new levels of organization and efficiency. But a lasting artifact of Industry 3.0 are machines with all varying levels of 'smartness' i.e. different extents of computer use, different operating systems, different interfaces, different languages. On top of this, manufacturers created sprawling processes. Operators naturally used different naming schemes, units, recipes, etc. This created a data deluge of non-standard information that has given more headaches than help to most manufacturers. Yet some are creating standardization on top of legacy and incompatible machines, implementing data exchanges that take this raw data and convert it into new standards. They are then using this clean, ready-data to drive end-to-end process automation and predictive analytics, the bedrocks of Industry 4.0. How are they doing it? The presentation will review emerging trends in machine interfaces, data transformations, and data exchanges and how they are accelerating value-creation in industry 4.0.
Meet & Greet with the Best in the Business!
Join us after the show for networking and celebration!
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