Calendar of Events
Dallas Chapter: Development of a Solder Paste Test Vehicle for Miniaturized Surface Mount Technology +
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
Development of a Solder Paste Test Vehicle for Miniaturized Surface Mount TechnologySpeaker: Dr. Mark Currie, Henkel
Get your tickets!HERE
Consumer demand has accelerated the pace of the electronics miniaturization trend, compelling assemblers to develop robust capabilities for 01005 components and 0.3 mm pitch array packages to remain competitive. The process of acquiring these capabilities can be complex, as they involve numerous interactive factors. To optimize the stencil printing and reflow portions of SMT assembly given the challenging new realities, a process evaluation tool has been developed that provides a turnkey solution for solder paste performance testing.
The evaluation toolkit incorporates PCB design, a complete and costed bill of materials, full documentation for programming, setup and test methods, and step-by-step directions for a designed experiment. It is the product of a cooperative effort among industry specialists that draws on their materials expertise, statistical know-how and process engineering skills, and was specifically developed to make solder paste testing as easy as possible for the PCB assembler.
This paper details the development of the turnkey solder paste evaluation concept from a laboratory test vehicle to the complete off-the-shelf kit. It discusses:
- Component selection to reflect the current state of the market and support a 2-3 year miniaturization roadmap
- Sample size consideration for statistical significance
- DFM of the PCB to manage costs
- Design for solder paste inspection (SPI)
- Nesting of tests to evaluate 22 paste properties in 4 hours or less
- Stencil design considerations
- Full database for programming entire SMT line
- PCB support design, development and testing
The discussion details both user and supplier perspectives on testing methods and highlights key considerations for assemblers. It concludes with opportunities and plans for potential future developments to expand the kit’s analytical capabilities.
Dr. Mark Currie, Henkel
Mark works at Henkel Corporation, and is based in Irvine California as Global Business Director for Solder, and is responsible for their technical development direction across all focus market electronic assembly sectors - dealing with Global OEM’s, Tier 1 and EMS accounts.
Mark draws from his experience of having visited over 1000 customers, lived in 7 different countries, presented at many established international conferences since 1993, and authored over 100 papers. Mark graduated with both a Manufacturing Engineering degree and PhD from the University of Salford, UK. His undergraduate final year project introduced him to solder, which enticed him to follow with ESPRC industry funded Phd on the same subject matter. As such, Mark has been familiar with solder for 28years. In that period, Mark joined Multicore (soon thereafter to be Henkel) and has gone from Academia, to a Research Scientist, to a Process Engineer, and then onto Global Technical, Marketing, Product and Business development positions with Henkel.
Webinar: Solder Paste Evaluation & Simple Tricks of the Trade +
Monday 13th January @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)
Presenter: Bob Willis, SMTA Europe
Solder paste quality and performance is significantly important and considerable engineering goes into its production. Selecting the best materials for your product and assembly process is key to high yield and your customers' satisfaction. Solder paste must be compatible with your equipment and other processes you use like cleaning, coating and electrical test. Working with suppliers to achieve the best performance is vital but so is periodic review of materials used.
There are always improvements being made to printing and jetting technology and it is important that engineers consider whether there are technical or commercial reasons to change. We look at common testing methods and some of the simple shop floor techniques used over the years to understand the different types of process failures.
- Solder paste type
- Low & high temperature alloys
- Solder beading
- Solder slump
- Reflow spitting
- Flux condensation
- Printing trials & test boards
- Common paste & print failures
After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.
All webinar times shown are UK time – to check your local time in your countries click here
SMT Processes Certification (Chonburi, Thailand) +
Cisco Systems (Chonburi) Ltd.
Chon Buri 20230 Thailand
Venue: Holiday Inn & Suites Siracha Laemcabang
12 Moo. 7 Sukhumvit Road, Tambon Tungsukla, Amphur Siracha, Si Racha, Chon Buri 20230, Thailand
- January 14- Course (8:30-5pm)
- January 15- ½ day of course + exam
- January 16- All day exam (8:30-5pm)
- Instruction: English
Instructor: Jim Hall
Space Coast (Melbourne FL) Chapter: FILL THE VOID - Control Voiding Using Inline Vacuum Assisted Reflow +
Oregon Chapter: SMTA OR Chapter, January Technical Meeting, Preparing Soldering Materials for the 5G Environment +
Topic: Preparing Soldering Materials for the 5G Environment
Presenter: Ning-Cheng Lee
Date: Jan 21st, 2020
Place: Axiom Electronics [9845 NE Eckert Drive Suite 200, Hillsboro, OR 97006]
Abstract: 5G is coming, driven by the market need and anticipation. Coming with 5G need also comes the need to upgrade assembly materials to cope with the dramatic increase in the speed of electronic signals as well as the demand for reliability. In this talk, the desired features and directions for soldering materials will be presented, including both flux features and solder alloy requirements.
Biography: Ning-Cheng Lee is the Vice President of Technology of Indium Corporation. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 30 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.
Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received 1991 award from SMT Magazine and 1993 and 2001 awards for best proceedings papers of SMI or SMTA International Conferences, 2008 and 2014 awards from IPC for Honorable Mention Paper – USA Award of APEX conference, and 2010 Best Paper Award of SMTA China South Conference.
He was honored as 2002 Member of Distinction from SMTA, 2003 Lead Free Co-Operation Award from Soldertec, 2006 Exceptional Technical Achievement Award from CPMT, 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from SMTA, 2010 Electronics Manufacturing Technology Award from CPMT, 2015 IEEE Senior Member, 2015 Founder’s Award from SMTA, and 2017 IEEE Fellow. He has served on the board of governors for CPMT and SMTA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Components Packaging Manufacturing Technology. He has numerous publications and frequently gives presentations, invited to seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.
SMT Processes Certification (Penang, Malaysia) +
Cisco Systems (Malaysia) Sdn. Bhd
Penang 11950 Malaysia
Hosted at Cisco Penang Office
Cisco Systems (Malaysia) Sdn. Bhd.
No 31-17-1, Level 17, The C.E.O,
Lebuh Nipah 5, Bayan Lepas,
11950 Penang, Malaysia
- January 21- Course (8:30-5pm)
- January 22- ½ day of course + exam
- January 23- All day exam (8:30-5pm)
- Instruction: English
Instructor: Jim Hall
Rocky Mountain Expo & Tech Forum +
1701 Bryant Street
Denver, CO 80204
Hilton Garden Inn Denver Downtown
Group Code: SMTA20
Address: 1400 Welton Street, Denver, CO 80202
Discounted Rate: $169/night plus tax.
The cost to exhibit for corporate members is $375/$475 (Early/Late) and $450/$550 (Early/Late) for non-corporate members.(click here for membership information)
The cost to exhibit includes:
1 6 ft. Table
Discounted registration rates expire on Monday, January 6, 2020!
All spaces will be assigned once we are sold out. If there is another exhibitor you want to be next to please let us know when you sign up.
Please contact Expo Manager, Courtney Kalb, for questions or additional information.
Backstage Tour of Mile High Stadium
As a special treat, we will have a backstage tour of Mile High Stadium for 25 attendees. Registrations are limited so book early. Cost for the tour is $25 per person – a bargain for the opportunity to go behind the scenes of the Denver Broncos. Tour will run at 1:00pm.
Tolerance Mistaken: Impacts of not properly addressing limitations of material, industry standards and assembly process limitations
Electronic assemblies today are smaller, lighter with increased functionality per unit area and/or volume. The rate of new technology adoption is increasing through develop ever smaller packages with finer lead spacing and substrates with finer lines and spaces. However, design methods, industry standards, materials and manufacturing processes utilized during the product development and production process have not progressed to meet these new demands and thus many of the tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products. This presentation will highlight issues with today’s electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately address during design, PCB fabrication, assembly and test.
Additively Manufactured Electronic (AME) Circuits and Devices: Technology and Performance
Electronic circuits and devices have been manufactured by the layering, drilling (laser) printing the conductive pattern process followed by component mounting: from IC, to capacitors, coils, and transformers . These are commonly known as Printed Circuit Boards (PCB). Additive manufacturing offers a different approach that enables the manufacturing of electronic circuits and devices not only with enhanced-, but also with unique- functionality that is not possible in PCBs or the cost is too high. This presentation will discuss the technology, applications, and electrical characterization for AMEs (Additively Manufactured Electronic) circuits and devices. This includes the manufacturing process compared to PCBs, new characterization techniques, reliability, and applications from DC to several GHz. Reliability testing using thermal, humidity, and vibration cycles shows no degradation on the electrical performance of the AME circuits. The AME applications to be shown include in AME power transformers, built in DC and RF capacitors, RF transmission lines, in AME coax “cable”, Internet of Things, coils and antennas, etc. In RF applications, the in AME circuit capacitors show superior performance compared to similar devices produced by mounting commercial capacitors on PCBs, in addition these AME capacitors exhibit less than 1% variability from AME to AME circuit with breakdown voltages in excess of 1KV. Similarly, IoT AME transmitters and receivers show over 10% points better transmission rate success as compared to same commercially available PCB designs.
Backstage Tour of Mile High Stadium - $25 - Must Register!
From Industry 3.0 to 4.0: Data Deluge to Value-Realization
Industry 3.0 brought computers to the manufacturing floor, the ability to program in sequences of steps and have them executed automatically. It also brought the ability to automatically write and log historical records in principle useful for all new levels of organization and efficiency. But a lasting artifact of Industry 3.0 are machines with all varying levels of 'smartness' i.e. different extents of computer use, different operating systems, different interfaces, different languages. On top of this, manufacturers created sprawling processes. Operators naturally used different naming schemes, units, recipes, etc. This created a data deluge of non-standard information that has given more headaches than help to most manufacturers. Yet some are creating standardization on top of legacy and incompatible machines, implementing data exchanges that take this raw data and convert it into new standards. They are then using this clean, ready-data to drive end-to-end process automation and predictive analytics, the bedrocks of Industry 4.0. How are they doing it? The presentation will review emerging trends in machine interfaces, data transformations, and data exchanges and how they are accelerating value-creation in industry 4.0.
Raffle Prize Giveaway!
Meet & Greet with the Best in the Business!
Join us after the show for networking and celebration!
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