Calendar of Events
Dallas Chapter: Development of a Solder Paste Test Vehicle for Miniaturized Surface Mount Technology +
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
Development of a Solder Paste Test Vehicle for Miniaturized Surface Mount TechnologySpeaker: Dr. Mark Currie, Henkel
Get your tickets!HERE
Consumer demand has accelerated the pace of the electronics miniaturization trend, compelling assemblers to develop robust capabilities for 01005 components and 0.3 mm pitch array packages to remain competitive. The process of acquiring these capabilities can be complex, as they involve numerous interactive factors. To optimize the stencil printing and reflow portions of SMT assembly given the challenging new realities, a process evaluation tool has been developed that provides a turnkey solution for solder paste performance testing.
The evaluation toolkit incorporates PCB design, a complete and costed bill of materials, full documentation for programming, setup and test methods, and step-by-step directions for a designed experiment. It is the product of a cooperative effort among industry specialists that draws on their materials expertise, statistical know-how and process engineering skills, and was specifically developed to make solder paste testing as easy as possible for the PCB assembler.
This paper details the development of the turnkey solder paste evaluation concept from a laboratory test vehicle to the complete off-the-shelf kit. It discusses:
- Component selection to reflect the current state of the market and support a 2-3 year miniaturization roadmap
- Sample size consideration for statistical significance
- DFM of the PCB to manage costs
- Design for solder paste inspection (SPI)
- Nesting of tests to evaluate 22 paste properties in 4 hours or less
- Stencil design considerations
- Full database for programming entire SMT line
- PCB support design, development and testing
The discussion details both user and supplier perspectives on testing methods and highlights key considerations for assemblers. It concludes with opportunities and plans for potential future developments to expand the kit’s analytical capabilities.
Dr. Mark Currie, Henkel
Mark works at Henkel Corporation, and is based in Irvine California as Global Business Director for Solder, and is responsible for their technical development direction across all focus market electronic assembly sectors - dealing with Global OEM’s, Tier 1 and EMS accounts.
Mark draws from his experience of having visited over 1000 customers, lived in 7 different countries, presented at many established international conferences since 1993, and authored over 100 papers. Mark graduated with both a Manufacturing Engineering degree and PhD from the University of Salford, UK. His undergraduate final year project introduced him to solder, which enticed him to follow with ESPRC industry funded Phd on the same subject matter. As such, Mark has been familiar with solder for 28years. In that period, Mark joined Multicore (soon thereafter to be Henkel) and has gone from Academia, to a Research Scientist, to a Process Engineer, and then onto Global Technical, Marketing, Product and Business development positions with Henkel.
Webinar: Solder Paste Evaluation & Simple Tricks of the Trade +
Monday 13th January @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)
Presenter: Bob Willis, SMTA Europe
Solder paste quality and performance is significantly important and considerable engineering goes into its production. Selecting the best materials for your product and assembly process is key to high yield and your customers' satisfaction. Solder paste must be compatible with your equipment and other processes you use like cleaning, coating and electrical test. Working with suppliers to achieve the best performance is vital but so is periodic review of materials used.
There are always improvements being made to printing and jetting technology and it is important that engineers consider whether there are technical or commercial reasons to change. We look at common testing methods and some of the simple shop floor techniques used over the years to understand the different types of process failures.
- Solder paste type
- Low & high temperature alloys
- Solder beading
- Solder slump
- Reflow spitting
- Flux condensation
- Printing trials & test boards
- Common paste & print failures
After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.
All webinar times shown are UK time – to check your local time in your countries click here
SMT Processes Certification (Chonburi, Thailand) +
Cisco Systems (Chonburi) Ltd.
Chon Buri 20230 Thailand
Venue: Holiday Inn & Suites Siracha Laemcabang
12 Moo. 7 Sukhumvit Road, Tambon Tungsukla, Amphur Siracha, Si Racha, Chon Buri 20230, Thailand
- January 14- Course (8:30-5pm)
- January 15- ½ day of course + exam
- January 16- All day exam (8:30-5pm)
- Instruction: English
Instructor: Jim Hall
Oregon Chapter: SMTA OR Chapter, January Technical Meeting, Preparing Soldering Materials for the 5G Environment +
Topic: Preparing Soldering Materials for the 5G Environment
Presenter: Ning-Cheng Lee
Date: Jan 21st, 2020
Place: Axiom Electronics [9845 NE Eckert Drive Suite 200, Hillsboro, OR 97006]
Abstract: 5G is coming, driven by the market need and anticipation. Coming with 5G need also comes the need to upgrade assembly materials to cope with the dramatic increase in the speed of electronic signals as well as the demand for reliability. In this talk, the desired features and directions for soldering materials will be presented, including both flux features and solder alloy requirements.
Biography: Ning-Cheng Lee is the Vice President of Technology of Indium Corporation. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 30 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.
Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received 1991 award from SMT Magazine and 1993 and 2001 awards for best proceedings papers of SMI or SMTA International Conferences, 2008 and 2014 awards from IPC for Honorable Mention Paper – USA Award of APEX conference, and 2010 Best Paper Award of SMTA China South Conference.
He was honored as 2002 Member of Distinction from SMTA, 2003 Lead Free Co-Operation Award from Soldertec, 2006 Exceptional Technical Achievement Award from CPMT, 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from SMTA, 2010 Electronics Manufacturing Technology Award from CPMT, 2015 IEEE Senior Member, 2015 Founder’s Award from SMTA, and 2017 IEEE Fellow. He has served on the board of governors for CPMT and SMTA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Components Packaging Manufacturing Technology. He has numerous publications and frequently gives presentations, invited to seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.
SMT Processes Certification (Penang, Malaysia) +
Cisco Systems (Malaysia) Sdn. Bhd
Penang 11950 Malaysia
Hosted at Cisco Penang Office
Cisco Systems (Malaysia) Sdn. Bhd.
No 31-17-1, Level 17, The C.E.O,
Lebuh Nipah 5, Bayan Lepas,
11950 Penang, Malaysia
- January 21- Course (8:30-5pm)
- January 22- ½ day of course + exam
- January 23- All day exam (8:30-5pm)
- Instruction: English
Instructor: Jim Hall