Calendar of Events

   2019      

                  July                 

July 2019

July 6

India -Bangalore Chapter: SMTA India Technical Workshop - Reliable Electronics for the Automotive Industry  +

Sathyam Grand Resorts, Sriperumbudur - Chennai



The SMTA India Chapter is pleased to invite you to participate in a one-day Technical Workshop on:
 
Reliable Electronics for the Automotive Industry
6th July 2019, Chennai
 

Keynote Presentation

Essentials of EV - The EV Technology Trends
Presented by Dr. Allabaksh Naikodi (Mahindra Electric Mobility Ltd.)

Abstract: History of EVs, from their demise to re-emergence. The basic EV architecture will be presented to demonstrate its simplicity, reliability and connectivity, including present and future aggregate technologies such as battery, drive train, on board and off board chargers, vehicle controls, and connectivity. Will also briefly discuss some specific issues and challenges that India faces to meet the mission 2030 of electrification.

Speaker: Dr. Allabaksh Naikodi has more than 32 years of leadership in electronics and is presently heading the Advance Technology Department of Mahindra Electric - the Electric Vehicle Company of Mahindra. He obtained a Ph.D. degree in Electrical Engineering from the Indian Institute of Technology, Madras (Chennai), India in 1995. Prior to joining Mahindra Electric he has worked for ABB, Honeywell, Schneider Electric and Tech Mahindra. He is a member of several technical committees including the expert committee of the Government of India on EV sub-systems development and BIS ETD51 for charging systems. He has many publications, including eleven patent applications in EV Technologies.
 
Star Invited Presentations

Advanced High Reliability Interconnect Technologies in Automotive Electronics
Presented by Dr. Ravi Bhatkal (MacDermid Alpha Electronics Solutions & MacDermid Enthone Industrial Solutions)

Abstract: Electronics content in automobiles is increasing dramatically, with the emergence of “Autonomous-Connected-Electric-Shared” mobility.  Demands on automotive electronics system reliability are significant, calling for high reliability of automotive electronic interconnects.  This paper presents advances in interconnect technology for electronics in various automotive systems.


Speaker: Dr. Ravi Bhatkal currently serves as Managing Director, India, Cookson India Private Limited, and is responsible for the MacDermid Alpha Electronics Solutions and MacDermid Enthone Industrial Solutions businesses in India. Previously he served in various VP and GM positions at Alpha Assembly Solutions, Alent and Cookson Electronics. He is also Member of the Global Board of Directors of iNEMI. He earned a Ph.D. in Materials Science and Engineering and M.B.A. from Rensselaer Polytechnic Institute, an M.S. in Materials Science and Engineering from Vanderbilt University, and a B.E. in Mechanical Engineering from the College of Engineering, Pune, India. He is widely published and is a co-inventor on four granted and four pending patents.
 

Key Design Variables that Impact Electrochemical Reliability of Electronic Devices (live telecast)
Presented by Dr. Mike Bixenman (KYZEN)

AbstractHighly dense Printed Circuit Assemblies build in more functionality using leadless and bottom terminated components. Reliability of these devices requires high level of cleanliness, especially residues that are ionic in nature. Will cover design variables that impact electrochemical reliability of Electronic Devices, including methods for screening materials and processes.


Speaker: Dr. Mike Bixenman is Co-founder and Chief Technology Officer of KYZEN Corporation. He has 30 years working experience, is a prolific author/co-author of more than 100 technical papers, holds four earned degrees, including a Ph.D. in Business Administration.
 

Special Invited Presentations
 
Corrosion Studies with Gold Plated Electrical Contacts
Presented by Prof. Balu Pathangey (IIT Bombay)

HDI Design Challenges and DFMA
Presented by Amba Prasad (Tejas Networks)

Speaker: Amba Prasad is a veteran PCB Designer and architect with more than 30 years designing for the telecommunications industry. He is also a trainer for Certified IPC Designer and Advanced Certified IPC Designer courses.
 

Pre-registration for Participation
 
Registration Fees: Rs. 1300 (SMTA non-members) and Rs.750 (SMTA members)
 
Registration includes: Lunch, coffee breaks, and desktop exhibition by leading companies at the technical session venue
 
Register by e-mail, including your name, company and contact details: smtaindiachapter@gmail.com
Contact: Ankan Mitra (SMTA India Chapter President)
Questions? Call +91 96200 75752 



July 10

San Diego Chapter: SMTA San Diego Chapter Meeting  +

Location
Creative Electron, 201 Trade St., San Marcos, CA 92078



Topic:  Industry 4.0 the Next Industrial Revolution - The Smart Factory
Speaker:  MB Allen, KIC

Industry 4.0, IIoT, IoT, Smart Factory, Made in China 2025. It’s all the buzz but what are these trends?
Do they relate to me and my manufacturing environment? Is this something we Must implement? What would the benefit be to my company? How does it all come together?
These questions and more will be covered during this presentation and will include an example of ‘Smart Factory’ technology.

MB Allen Bio -
MB Allen is a Manager for KIC’s Applications & Sales in the Americas and Europe.  Formerly as Product Manager she coordinated the advancement of new products and features to accommodate customer needs as KIC added to its portfolio for the electronics industry. Her technical expertise, relationships with valued partners and customers, and many years of sales experience aid KIC in the future development, improvement and sales of the company's product offerings.
MB has worked in the electronics industry for 31 years and been associated with KIC for 30 years with both national and international positions.

Registration:  4:45 PM   
Social/Dinner:  5:00 PM
Technical Session:  5:30 PM


We're trying somethign new!
This meeting will be streamed live online. Register for the virtual meeting here.


 


July 15

Webinar: Vapour Phase & Convection Reflow with Lead Free – Selecting the Reflow Process  +


Bob WillisMonday 15th July @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Having grown up with IR and Vapour Phase Soldering (VPS) during the introduction of surface mount technology it's safe to say that some processes never die, they just get better. Convection reflow took over from IR technology and changed the way industry looked at vapour phase but now it's back. For some companies VPS never went away, a simple one profile process. In Japan, high-end application used VPS during the introduction of lead-free technology.

Both convection and vapour phase can produce reliable lead-free assemblies, there are advantages and disadvantages to any technology, but they both work well and can be very cost effective, that is what our surveys have said. We also bring ten years of experience with lead-free using both techniques.

In this webinar the instructor will look at all aspects of the different processes, soldering performance and yield from different joint terminations, solder finishes and joint structures. Each delegate will also receive a FREE set of Bob Willis Inspection Wall Charts covering reflow soldering of lead-free terminations and common defects found in manufacture.

 

Topics include:

  • Vapour phase and convection reflow overview
  • Process parameters
  • Nitrogen/inert environment myths
  • Advantages & disadvantages of the process options
  • Design and layout considerations for VP
  • PCB solder finishes for VP & convection
  • Vapour phase materials and cost
  • Batch or inline operation
  • User experiences with VP materials and equipment
  • Profiling boards assemblies in both processes
  • Solder paste requirements
  • Comparing single and double sided reflow yields
  • Soldering flexible assemblies
  • Inspection results for reflow soldering

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


July 17

Space Coast (Melbourne FL) Chapter: Moisture Sensitivity Considerations in Surface Mount Processing  +

Mack Technologies



"July 17, 2019 SMTA Space Coast Chapter Technical Meeting
View this email in your browser
 
 
SMTA Space Coast Chapter
Is proud to present a Technical Meeting

"Moisture Sensitivity Considerations in Surface Mount Processing"
 
 
As electronics packaging rapidly advances, novel device packaging and materials are being introduced at unprecedented rates.  Thus, more than ever before mitigation of the risks associated with “moisture sensitivity”, the potential for damage to components, printed circuit cards, and circuit card assemblies due to trapped moisture during solder reflow operations, must be integral to any robust surface mount assembly process.  Guidance for these practices for handling, storage and drying are provided in various industry specifications, but adapting these to the surface mount assembly process are not trivial.  This tech session will review the factors affecting material sensitivity in electronics packaging, highlight the most essential best practices for managing moisture sensitive components, and present a case study involving the investigation of a surprising source of moisture-related failures.
 
The Presenter:

Jeffrey M. Jennings, PhD
Materials & Processes Laboratory, Harris Corporation
 
 
 
 
 
 
Come join us July 17, 2019 at 11:00am at

(321) 725-6993
7505 Technology Drive
Melbourne, FL 32904

Mack Technologies
 
Lunch is included in the admission price.

BEST DEAL PRICING
Members in Advance: $15 • Non-Members in Advance: $25
AT THE DOOR PRICING
Members: $20 • Non-Members: $30

Registration fee will be waived if you join SMTA during this event.
Click Here to Join!!!
 
                                        SCHEDULE

                  TIME:             11:30AM                     LUNCH
                                          12-1:00PM                  Presentation           
                                             
For options of payment, please read the section below for details.
 
RSVP to Jack Reinke or call (404) 290-6744



July 18

Tampa Bay Chapter: SMTA Tampa Bay Chapter Meeting- July18th  +

Location
Jabil Circuit 10560 MLK Blvd St. Petersburg, FL 33716



Save the date for our next chapter meeting on July 18th, 2019.

Our speaker will be Gregory K. Arslanian,
Global Segment Manager, Electronics Packaging, Assembly and Test (EPAT).
Gregory will be presenting on the “Benefits of Inert Atmospheres for Electronics Assemblies”.


Our chapter meeting will be held at:
Jabil Circuit 10560 MLK Blvd St. Ptersburg, FL 33716
Thursday, July 18, 2019
5:30- Registration/ Meet and Greet
5:30 Dinner
5:45- Introduction of speaker
5:50-6:30 Topic Presentation

6:30- 6:45 Question and Answer Time

Cost of Meeting:
Members-$15.00
Non-Members- $20.00

We hope to see everyone at the meeting!



 



July 25

Rocky Mountain (Colorado) Chapter: Summer Technical Session 2019  +

Location
1811 Pike Rd # 2F, Longmont, CO 80501



So, you have to clean your board?

Join us on July 25, 2019 from 9:00 AM-3:00 PM for the Rocky Mountain Chapter's 2019 Summer Technical Meeting.  The meeting will revolve around PCBA Cleaning.  How do you do it well?  Which chemistries work best?  How do you tell if a product is clean enough?  These questions and more will be answered by our three expert presenters.

9:30 AM – 10:30 AM - J-STD001G Amendment 1 is now active. What's New? What Stays the Same?
Presenter: Mike Konrad - President of Aqueous Technologies
Cleanliness quantification requirements have largely remained the same for over forty years. The historical pass/fail limits assigned to circuit assemblies have long been incompatible with long-term reliability.
IPC has recently released an amendment to J-STD001-G which dramatically changes the cleanliness testing requirements for post-reflow circuit assemblies. Gone are the historical pass/fail limits. The new cleanliness testing requirements require ionic process monitoring backed by an objective evidence standard.
This presentation will outline the reasons behind the new cleanliness testing standard by presenting modern residue-related failure mechanisms and the environmental and physical factors which may influence an assembly’s residue tolerance. This presentation will also outline the major elements of the new cleanliness testing standard and how it affects everyday production. This presentation will reference J-STD001-G, Amendment 1 and IPC-WP-019A.
 
About Mike:
Mike Konrad is an industry expert on the removal of contamination from circuit assemblies. Mike has been part of the electronic assembly cleaning industry for the past 33 years. Mike has designed several automated cleaning and cleanliness testing machines, has published scores of technical articles on the subject of cleaning and cleanliness assessment has been a member of Editorial Boards for several industry publications.
Mike served on the US Navy’s EMPF manufacturer’s committee and is a featured speaker at industry events and technical workshops worldwide. Mike was honored with Distinguished Speaker status from the SMTA in 2017.
Mike has served as a court-approved Expert Witness in civil litigation matters concerning post-reflow cleanliness assessment and contamination-related failure mechanisms. Mike is the founder of Aqueous Technologies; a manufacturer of automated cleaning and cleanliness testing systems designed for the electronic assembly industry and has served as its CEO/CTO since 1992.
Mike is the host of the Reliability Matters podcast, available on iTunes, Spotify, and iHeart Radio.
 
11:00 AM – 12:00 AM – Cleaning Process Do's and Don’ts.  Avoiding common pitfalls...
Presenter: Debbie Carboni - Global Product Line Manager (Electronics), KYZEN Corporation
The standard cleaning approach and technology continues to evolve to meet the changes of in market.  The last 10 years has brought new challenges and improved practices.    What once was common may not be enough to meet the new standards, or new form factors.   Mastering the capabilities of your cleaning process is critical to establishing complete process stability.  
Cleaning expert Debbie Carboni will present:
  • Modern Cleaning and Equipment
  • Board Design Considerations
  • Overcoming Environmental Challenges
  • Common machine set up blunders
  • Common Process Control blunders.
  • Common board fixturing blunders
  • Is your rinse effective enough?
  • How to effectively clean to meet the new standards, be reliable and prove it.
Attendees will see:
  • Videos illustrating different nozzle configurations and pressures and their impact on the cleaning rate.
  • New test assemblies for qualifying, optimizing and monitoring cleanliness
  • Passed and Failed test coupons 
An open Question and Answer session will enable attendees to discuss their specific process needs and changes to successfully implement or maintain a robust cleaning process.
About Debbie:
Debbie Carboni’s involvement in the electronics industry started more than 20 years ago and has encompassed a diverse set of experiences that give her a deep knowledge of cleaning chemistry, equipment and processes. Having been with KYZEN for over 10 years, Debbie is dedicated to providing customers and partners with the highest quality customer support and service as well as ensuring that they receive the best technical solutions. Her extensive real-world experience helps guide engineers during qualification to ensure success in production conditions. Debbie’s dedication to the electronics industry has included a number of roles and voluntary positions in many of the industry’s leading associations. She is currently serving her second term on the SMTA Board of Directors as the Vice President of Expo. After attending Northern Arizona University, Debbie remains knowledgeable through numerous technical conferences and leading-edge research. Debbie has authored and coauthored several papers related to cleaning solutions and regularly presents at and attends industry events such as; SMTA International, Cleaning and Coating Symposium, ICSR, Apex. Always willing to share, Debbie is an excellent resource with lots of experience and passion.
 
1:00 PM – 2:00 PM - pH Neutral & Alkaline Cleaning Agents – Market Expectation & Field Performance
Presenter: Kalyan Nukala, M.S.Ch.E. - Application Engineer, ZESTRON Americas
In recent years, significant changes in solder paste formulations and assembly processes have occurred. Post reflow residues are now more difficult to remove.  While modern aqueous alkaline cleaning agents effectively remove these flux residues, achieving satisfactory results often requires an increase in temperature, exposure time, chemical concentration, and mechanical energy. Are pH Neutral cleaning agents a solution?
This presentation details cleanliness test results of a two-phase DOE comparing pH Neutral and Alkaline cleaning agents. In Phase 1, the material compatibility effect of the cleaning agents was assessed for exposure under the worst-case scenarios with particularly sensitive materials. In Phase 2, cleanliness performance of each cleaning agent was assessed utilizing industry standard and IPC-B-52 tests vehicles populated with numerous low standoff components that have been soldered with commonly used leaded and lead-free solder pastes.  A customer case study is also presented.
 
About Kalyan:
Kalyan Nukala, M.S.Ch.E., is an Application Engineer at ZESTRON Americas, the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry.
Mr. Nukala is an active member of the SMTA as well as the IPC and has presented the findings of ZESTRON’s research papers at numerous industry events.
Furthermore, Mr. Nukala has contributed to multiple case studies performed in collaboration with major cleaning equipment manufacturers. He was instrumental in the extensive technical paper series “DI-Water vs. Chemistry” as well as the lead-free and eutectic screening series completed at ZESTRON’s Technical and Analytical Center in Manassas, VA.
Mr. Nukala graduated with a bachelor’s degree in Chemical Engineering from Jawaharlal Nehru Technological University, India, and a master’s degree in Chemical & Natural Gas Engineering from Texas A&M University, Kingsville, TX. Prior to joining ZESTRON, he worked as a Process Engineer for Usha Chemicals. He has been with ZESTRON America since 2009.


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