Calendar of Events
International Conference for Electronics Enabling Technologies 2019 +
Markham , ON Canada
The International Conference for Electronics Enabling Technologies (ICEET), formerly ICSR, is a highly technical three-day event in Toronto, ON, Canada.
Electronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.
Value Proposition for Participation
- Broaden your knowledge of the wider enabling technologies
- Deepen your skills on traditional soldering and electronics
- Access to local engineering and science talent
- Opportunities for cross-sector collaboration/innovation
- Industry exposure to your work – generate interest, support, awareness & excitement
- Build network and local-ecosystem that aligns various needs and service providers
- Held at ventureLAB, a leading innovation hub in York Region, Canada's densest ICT cluster
- Recognition for Best Conference Paper
FREE Webinar: Improving Reliability of Assemblies from a Soldering Materials Development Standpoint +
Tuesday 4th June @ 9:30am India Time GMT+5:30 (12:00am US Eastern Daylight Time GMT -4)
Presenter: Shantanu Joshi, Koki Solder America Inc.
Free for members - only members will get access to recorded presentation!
Non-members: USD $10
Members must log in to register with no fee. Non-members can pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: firstname.lastname@example.org +919620075752 or Madhukar Rao: +919686098690.
In recent years, a growing number of electronic devices are being incorporated into automotive and other high reliability end products with the challenge to make these devices more reliable. The package size of the devices is largely driven by the consumer industry with their sizes getting smaller making it harder to assemble and be reliable at the same time. For automotive and other high reliability electronics product, it is of the utmost priority to secure high reliability because it directly involves human life and safety. Challenges include selecting an appropriate solder alloy and having good reliability of the solder paste flux residue with the presentation discussing ways to improve lead-free solder joint reliability/robustness. Though SnAgCu solder alloys fulfill most soldering requirements, alternative solders are needed to meet more stringent environmental regulations, requirements for greater mechanical reliability, and more demanding high temperature service environments such as under the-hood in automobiles and in avionics systems. Development was done on alternative lead-free alloys with varying percentages of tin-silver-bismuth-indium in comparison with a number of conventional lead-free solder alloys in soldering evaluations. Accelerated thermal cycling test was performed on boards assembled with various different alternative alloys and the results were compared with conventional lead-free alloys. For the solder paste flux, there is a need in automotive and other high reliability applications to have reliable and high insulation resistance even in an atmosphere of high temperature and high humidity. Development was done on a type of ‘crack free' flux paste to inhibit flux residue cracking under extreme environments making it more reliable to stringent surface insulation resistance and electro-migration criterion from automotive and other high reliability product manufacturers. Testing was done to various industry electro-migration and dew test standards.
About the Presenter
Shantanu Joshi is the Regional Sales Manager for KOKI Solder America. He has a Master of Science degree in Industrial and Systems Engineering from Binghamton University and Bachelor of Engineering degree in Production Engineering from Pune University, India. He also serves as a Secretary on SMTA Ohio Valley Chapter board.
He is currently pursuing Ph.D. in Industrial and Systems Engineering concentrating on High Reliability Lead Free Solder Alloys from Binghamton University. He is published over dozen papers in various national and international conferences over the years. His co-authored paper won the “Best of Proceedings” award in SMTA International 2013. Shantanu has also won 1st prize in the poster competition held at GE Global Research Center, Niskayuna, NY for poster titled "LGA Solder Joints with Superior Reliability".
Long Island Chapter: Long Island SMTA Presents: The “DEADLY SINS” OF SMT ASSEMBLY Presented by Phil Zarrow +
Courtyard Long Island MacArthur Airport, 5000 Express Drive South - Ronkonkoma, NY 11779
Everyone has heard of the “7 Deadly Sins” that will, supposedly, lead one to Hell. There are also the “Deadly Sins” of SMT - there are more than just 7 – and they can make your assembly process a “hell on earth”.
During the course of ITM’s assembly process audits and troubleshooting work, we tend to see trends in the types of errors and problems. In other words, a lot of people are making the same mistakes. The resulting process problems wreak havoc with an impact on assembly yields ranging from 5 to 20%. In addition to this direct cost, there is also additional financial impact with regard to time spent reworking and repairing, the on corrective action by QC, Engineering and Management, and, of course, “do-over”.
This workshop identifies the “deadly sins” of SMT assembly, both for Pb-free and “leaded” processes. Besides the symptoms and consequences of each type of error, root-cause, rectification and prevention techniques will be presented. Best Practices will be discussed for each of the key process steps. The workshop will, thus, provide the participant with an understanding of how to identify and correct the most common SMT assembly problems. It will include identification of vendor and source problems including components and materials as well as design related problems.
6/5/19 | Courtyard Long Island MacArthur Airport, 5000 Express Drive South - Ronkonkoma, NY 11779
SMTA Ontario Chapter Expo & Tech Forum +
3600 Steeles Ave. East
Markham, ON L3R 9Z7
The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, and directory listing. Electricity is an additional $25 per outlet. Early bird pricing ends on May 3, 2019!
- Exhibit Application - Hard Copy
- Ad/Sponsorship Form
- Please contact Expo Manager, Courtney Kalb, with questions or for additional information.
Register here to attend the expo only!
Technical conference and workshops not included.
Plan now to join us for free technical presentations, free lunch and the chance to network with leading suppliers to our industry!
You Are Invited to the ReMAP Reception
Tuesday, June 4 | 6:30pm – 9:30pm
All attendees and exhibitors are invited to attend the ReMAP Reception on Tuesday, June 4 from 6:30pm – 9:30pm at ventureLAB. Join fellow technologists, business leaders and researchers for food, fun and networking! This event is free to attend but please RSVP to Jaclyn@smta.org to let us know if we can expect you.
Wednesday, June 5, 2019: 10:00am – 3:00pm
Thank You to our Coffee Break Sponsor:
Thank You to our Refreshment Sponsor:
High Reliability Lead-Free Solder Alloys for High Brightness LED Application
Speaker: Jie Geng, Indium Corporation
Low Temperature Transient Liquid Phase Bonding for Joining SIC Power Modules
Speaker: Jae Pil Jung, University of Seoul, South Korea
Flux Medium and Voiding: an Empirical Study
Speaker: Sirine Bayram, AIM Solder
Keynote: Dealing with the Challenges in the New Advanced Packaging Era
Speaker: Jan Vardaman, TechSearch International, Inc.
Smart Textile Applications in Medical Devices & Senior Care
Speaker: Alex Chen, Celestica, Inc. & Milad Afshar, Myant Inc.
Western Pennsylvania (Pittsburgh) Chapter: West Penn Technical Webinar Sessions +
SMTA West Penn is pleased to announce a web-based series of two technical sessions!
Thursday June 6, 2019 - 2 sessions: 8:00AM to 10:00AM and 3:00PM to 5:00PM. View either session or both, up to you!
Session 1 (8:00 AM to 10:00 AM) - Conformal coating selection, application & cure, testing coatings, inspecting coatings, and the future of coating technology. Speaker is Doug Pauls, Collins Aerospace.
Session 2 (3:00 PM to 5:00 PM) - Moisture Sensitivity (MSL) overview, managing MSL devices, conforming to J-STD-033, long and short duration exposure, double sided PCBA, baking and packaging. Speaker is Greg Benoit, Cogiscan.
This will be a live web-based event. Registerants will recieve links to log in and view the presentation with ability to ask questions in real time.
No cost to SMTA members! $20 for non-members. RSVP at the link below. View one or both sessions - up to you! You will receive login information about a week before the sessions.
Jason Emes, West Penn President
Ohio Valley Chapter: 4th Annual SMTA Member Appreciation Golf Outing +
Raintree Golf & Event Center, Uniontown, Ohio
The SMTA Ohio Valley Chapter is pleased to invite you to participate in our “4th Annual Member Appreciation Golf Outing”. Golf format is a four person scramble with team prizes and skill awards. Skins challenge $5.00 per player ($20.00 team).
Participation is absolutely “FREE” for SMTA Members and Sponsors. Included are green fees, golf cart, practice range, sleeve of golf balls, Continental Breakfast, lunch at the turn and a Prime Rib dinner.
Winning team prizes, Skill Challenge prizes and Team Skins awards will follow dinner.
Hotel: Cambria Hotel & Suites in Uniontown, OH.
Room cost is $109.00 a night for the night of June 10th. For those wishing to stay an additional night , the price will be the same. To make reservations, contact Cambria Hotel at the number below and mention Ohio Valley SMTA Chapter.
Cambria Hotel & Suites
1787 Thorne Drive
Uniontown, OH 44685
Enjoy networking with fellow SMTA members and vendors in a relaxing, fun atmosphere.
“Bring a guest.” Guest golfer - not a SMTA Member: $50.00
Not a golfer, no problem. Join us for the day, enjoy riding around the course visiting with the golfers and dinner afterwards.
You may organize your own four-some or we will pair you up. When registering please use the company field (after listing your company) to enter the names of players you wish to play with.
Capital (DC) Chapter: SMTA Capital Chapter/ UP Media Group Tutorial – Supporting High Reliability at the OEM: A PCB Perspective +
SMTA Capital Chapter/ UP Media Group Tutorial – Supporting High Reliability at the OEM: A PCB Perspective
The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor an amazing Chapter Tutorial Program. The tutorial will be held on June 11 and showcase the latest technologies, designs and reliability trends.
Do not miss this full day educational event with presentations by Yaad Eliya and Jim Barry of PCB Technologies. This is your chance to gain knowledge for improvements in reliability, yield and therefore overall product cost. Come learn about PCB advancements from engaging speakers with years of experience and global industry knowledge.
This tutorial is a great value, at half the cost of one at SMTA International and it’s offered right in your backyard! Lunch, coffee breaks, course handouts and a certificate of completion are all included and topics include:
RF/Microwave Design Considerations and Options
Innovative solutions, based on close cooperation between mil/aero designers and the fabricator. Explore implementing air cavity, coin and buried passive components (resistors/ capacitors/ thermocouples/ heaters etc.), in a complex design, including for rigid-flex.
Thermal Mitigations Options at the Raw Card Level
The most extreme temperatures and stress facing the PCBA is often the reflow cycle. However, the “post-reflow” or operating temperatures facing the product in the field can be detrimental and even disastrous. Learn how smaller, more complex designs are creating thermal mismatches and intense temperature. Explore options in design, materials, and “adder options” such as heatsinks and coins to
Reliability: Design for Reliability & Design for Manufacturability
A focus on two parts of the PCB process: the design and how it affects product performance, and what happens once the design reaches the PCB manufacturer. Review nonfunctional pads, via fill, stacked vs. staggered, cross-hatched grounds in rigid-flex, conductor routing, and more. Also, how manufacturer processes affect solderability, looking at DC plating vs. reverse pulse, multiple finishes, edge
plating, and hole placement.
Cost and Registration information HERE!
*Registration deadline is June 1st
Country Inn & Suites
1717 W Nursery Rd.
Linthicum Heights, MD 21090
Capital Chapter Tutorial Program - "Supporting High Reliability at the OEM: A PCB Perspective" +
Country Inn & Suites
Linthicum Heights , MD 21090
|Instructors: Yaad Eliya and Jim Barry, PCB Techologies |
June 11, 2019
9:00 a.m. - 3:00 p.m.
Country Inn & Suites
1717 West Nursery Road
Linthicum Heights, MD 21090
Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
Topics of Discussion:
RF/Microwave Design Considerations and Options; by Yaad Elia
RF/Microwave & high-speed boards required many considerations and aspects for maximizing thermal and electrical performance. Designers for high frequency applications must understand critical parameters at the PWB stage. These parameters must be understood in order to eliminate noise, reliability, poor electrical performance, high price and low yield risks. The presenter will highlight innovative solutions, based on close cooperation between Mil/Aero designers and the PWB vendor. Actual field performance sometimes demands “beyond IPC rules/specification”, and in that respect one must provide innovative solutions such as: implementing air cavity, coin and buried passive components (resistors/ capacitors/ thermocouples/ heaters etc.), in a complex design. This is even more critical, when the hybrid/mixed materials are combined into a rigid flex stack up. Enabling designers to bring an innovation to fruition, with ALL material types in the same stack up, selective final finishes, back drill/deep cone drill/ HDI, so the compatibility between all technical requirements is optimized, will be explored during this discussion.
Thermal Mitigation Options at the Raw Card Level; by Jim Barry
Temperature is and always has been a major factor within the PCB Raw Card level. We know that the most extreme temperatures and stress facing the PCBA today, is often the reflow cycle as seen in some of the recent via stacking issues facing the industry. However, we sometimes forget the “Post Reflow” or Operating temperatures facing the product in the field; this can also be detrimental and even disastrous causing fire or catastrophic failure. The presenter will look at how the shrinkage and complexity of today’s designs are creating thermal mismatch and intense temperature. We will explore what options we have in the design, material choices and “adder options” such as heatsinks and coins to mitigate temperature. If this post thermal factor is ignored – long term effects on the operation and/or life of a product can be severely compromised. Improved thermal performance can also lead to immediate improvements and increase in performance as with thermal imaging.
Reliability – Design for Reliability & Design for Manufacturability; by Yaad Elia & Jim Barry
The presentation will focus on two parts of the PCB Process; the first being the design and how it can directly affect the performance of the product such as a result of decisions made in the design phase. Getting your supplier(s) involved early will prevent time, save cost and provide a base for a robust design that is manufacturable. Items such as non-functional pads, via fill, stacked vs. staggered, cross-hatched grounds in Rigidflex, conductor routing, PTH preparations, pad sizes, pad/pad spacing, blind/ buried and more. The premise is to balance needs of the designer, whilst trying to maintain a reliable and robust build.
The second part of this discussion focuses on what happens to the design once it hits the PCB Manufacturer. What you specify on your design can significantly affect cost, reliability and lead-time – items such as IPC classification, compensation factors and tolerances needed and material choices. We will discuss how, as a manufacturer, processes can affect solderability issues at the assembler. Things such as DC plating vs. reverse pulse, multiple finishes, edge plating, hole placement on a rigidflex, etc.
Note about the presenters and the topics:
The goal of this technical meeting is to share our knowledge as a PCB Manufacturer, with the designer and the OEM, as well as the contract assembler (EMS). PCB Technologies builds some of the world's most demanding designs and has nearly 40 years of manufacturing experience. We are not presenting to sell but hoping to share our knowledge of the process and thus gain improvements in the reliability, yield and therefore cost of the products we all touch every day.
About the Instructors:
CTO, R&D and Technology Manager
- Working in PCB Technologies for the last 12 years
- B.Sc. Engineering at Ben-Gurion University of the Negev
- Electronic Materials Expert, especially with Rigid Flex, RADAR/Microwave and RF applications
- Process and machinery design & architecture manager, in the PCB industry
- Responsible for R&D and special application development, for Medical/Space & Military segments
- Expert as "tailor made" in design stage application, and a leader in all prototypes when move from R&D to mass production
- Background and experience - TOWER Semiconductor/Engineering & Photolithography Expert (MUV/DUV)
Solutions Architect and North American Sales Manager - PCBT
- Printed Circuit Industry veteran for over 39 years - proficient within the disciplines of Engineering, Manufacturing & Sales... PCB Technologiest including Design, Assembly and Box build...
- Experienced professional; trained in mechanical engineering, PCB applications, materials and failure analysis. Working knowledge of IPC, MIL NADCAP, AS9100 and other applicable industry specifications
- Held various positions within the PCB Industry ranging from Manufacturing, R&D, Sales & Marketing, Engineering, as well as Corporate and Executive levels within various companies
- Today working as a lead consultant for the world's leading Israeli PCB/PCBA manufacturing operation of High-Density Electronics for Mil/Aero & medical applications
Sponsored jointly by SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine
Contact Karen Frericks at 952.920.7682 with questions.
Atlanta Chapter: Chapter Meeting +
Leading Successful Change
Organizations today must have targeted strategies for leading change both within their company as well as in their marketplace. There is no place for merely throwing out ideas and seeing what sticks.
Leadership must practice more than wishful thinking and dreaming. They must have more than a vision and direction. Leading successful change requires a strategy driven by a clear understanding of the current reality coupled with the resources to build for the future.
Leadership is tasked with making a difference from the inside-out. This requires a measured, proven methodology. Strategies for leading and communicating successful change initiatives are the centerpiece of this presentation.
Presented By: Don R. Witzel
Don R. Witzel is an independent organization development coach with over 40 years’ experience. He has held key leadership positions in the public and private sectors on a nationwide basis with responsibilities for the development and performance improvement of people and organizations. Don has a Bachelor of Arts degree in Communications, a Master of Arts degree in Adult Education, and a Doctor of Education degree in Adult Learning. In addition to the above, Don has extensive experience in managing and leading large, dynamic organizations through complex change and growth.
Don received his Quality Management System training from Georgia Institute of Technology. Don has helped numerous companies or divisions obtain their QMS credentials during their first certification audit. Don also serves as an outsourced internal auditor for several organizations. In addition to the above training, Don received his training and certification as ISO Lead Auditor from Georgia Technical Institute as well as AS9100 Internal Auditor training and certification.
Some companies with which Don has coached and consulted are: BellSouth, Gwinnett County Public Schools, Gwinnett County Tax Commissioner, AMI Technologies, EMS Technologies, CIBA Vision, Lucent Technologies, Rooms To Go, Johnson & Johnson, Verizon Telecommunications, Volt Information Sciences, Marriott Hotel Properties and with work in many other industries.
3975 Lakefield Ct suite 106,
Suwanee, GA 30024
Mexico - Juarez (Formation) Chapter: SMTA Juarez - Technical seminar +
Centro de Convenciones Cuatro Siglos
¡Anunciamos el próximo evento SMTA-Juarez!
Fecha: Jueves, Junio 13, 2019
Hora: 5:30-9:00 p.m.
Ubicación: Centro de Convenciones Cuatro Siglos
Dirección: Boulevard Juan Pablo II (Blvd. Cuatro Siglos) y Av. Arizona.
Ciudad Juárez 32402
a) Inspección con rayos-x para identificar voids y HiP
b) Cómo prevenir los voids y los HiP a través de mejoras en el Proceso
Dallas Chapter: New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA’s and PCBF’s +
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA’s and PCBF’sSpeaker: Robert Boguski, President, Datest
Get your tickets!
AbstractRobert Boguski, President, Datest
1981 graduate of The University of San Francisco (BA Economics). Robert has worked in the electronics packaging and interconnect manufacturing and testing business, primarily in management positions, since he was a teenager (1975). 22 years in the bare board business, 12 years in the EMS business, and 14 years in the testing and test engineering business (Some overlap with EMS). Robert is the Owner and President of Datest, a test engineering and failure analysis company located in Fremont, California. Robert and/or his Company, Datest, are members of SMTA, IPC, and IEEE. Datest is also a member of the American Society for Nondestructive Testing (ASNT) as well as the Eurpoean Institute of Printed Circuits (EIPC). Since 2013 Robert has co-authored the Test and Measurement column for Circuits Assembly Magazine. Robert is also currently the President of the SMTA Silicon Valley Chapter.
University of Texas at Arlington Student Chapter Chapter: SMTA UT Arlington Student Chapter Speaker Event +
Webinar: Lead-Free Selective Soldering, Design, Quality Control & Practical Defect Solutions +
Monday 17th June @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)
Presenter: Bob Willis, SMTA Europe
For many organisations through hole components will remain a reality for many years. More and more surface mount components are used in design, through hole is in decline, however the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products. So what is the most reliable and cost effective solution to through hole soldering in a lead-free environment? Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities with lead-free and high temperature solder alloys.
- Why use selective soldering
- PCB design rules for selective soldering
- Flux requirements for selective soldering
- Compatibility of solder masks and lead-free solder
- Setting up lead-free profiles, you must profile a selective process!!!
- Solder alloy choices
- Copper dissolution with selective
- Soldering defects on selective – Causes and Cures
In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.
All webinar times shown are UK time – to check your local time in your countries click here
Intermountain (ID, UT) Chapter: SMTA Intermountain Chapter Utah Golf Tournament - June 18, 2019 +
Wisconsin Chapter: 2019 SMTA Certification Course with Jim Hall +
This course is sponsored by SMTA National Training program.
For more information on Jim click below:
· Two years of college (or equivalent).
· 2-3 years of experience in all aspects of SMT, including process optimization.
· Knowledge of all process and systems steps, including calculations from screen printing and dispensing through test and inspection.
All applicants must pass a combined open and closed book exam focusing on the following curriculum:
· SMT Materials Component Placement
· SMT Components Reflow Soldering
· Stencil Printing Wave Soldering
· Dispensing Test and Inspection
· Line Balancing (Downtime, line design)
To register for the 2019 SMT Certification please follow the link below.
SMT Processes Certification (Mequon, WI) +
Houston Chapter: Houston Chapter Meeting +
eSMART Factory Conference +
The Dearborn Inn
Dearborn , MI 48124
Software Systems & Processes • Robotics • 3D Printing
eSMART Factory 2019 conference will bring together the key technologies shaping the electronics manufacturing industry and addressed by EMS companies, OEMs and Contract Manufacturers.
Wisconsin Chapter: PCBA Workshop - Workshop +
Join us on Tuesday June 25th, 2019 for a one day workshop!
The workshope will cover DFM, Selective Soldering, Conformal Coating, Cleaning and Flux chemistries.
Check in to begin at 8am. Lunch will be served.
Bring any current industry challenges to be discussed. Lets make this an interactive workshop!
Check in is at : 8am, Workshop 8:30am- 4:00pm
SMTA Members: $50 / Non- SMTA Members $60
Selective soldering: Joe Clure, Ersa
Conformal coating: Chad Showalter, Humiseal
Cleaning Chemistries : Mike Bixenman, Kyzen
Flux chemistries and flux reliability: Denis Jean, Kester
Symposium on Counterfeit Parts and Materials 2019 +
College Park Marriott Hotel & Conference Center
College Park , MD
The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.
Dr. Michael Azarian, CALCE, speaks during the panel discussion 'How is AS6171 Being Flowed Down? Challenges with AS671 Accreditation--Can it Handle Obsolete Part?' at the 2018 Symposium.
Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.
Symposium on Counterfeit Parts and Materials-Tabletop Exhibition +
3501 University Blvd East
Hyattsville, MD 20783
**All sponsorships require an exhibit booth reservation**
Lanyard Sponsorship (Limit 1) - $500 - Company to provide lanyards SOLD!
Provide your company lanyards and they will be the official lanyard for the conference. You will receive logo recognition in the show directory, conference website and signage.
Tote Bag Sponsorship (Limit 1) - $400 (if provided by company/$800 if produced by SMTA) SOLD!
Provide your logo on all of the conference attendee bags! If you would like SMTA to produce the tote bags, it will be an extra $400. There will also be recognition in the show directory and website.
Lunch Sponsorship Day 1 or Day 2 (Limit 2)-$750 SOLD!
Signage upon entrance to exhibit hall lunch and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.
Refreshment Sponsorship Day 1 or Day 2 (Limit 2)-$750
Signage during PM refreshment breaks upon entrance to exhibit hall and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.
Contact SMTA for available booth space. 952-920-7682 or email@example.com Please note that exhibit traffic will be minimal while symposium is in session.
Exhibit space entitles you to:
- 6 ft. Draped table
- One conference pass
- Attendee list
- Breakfast, Lunch & Breaks
- One copy of the conference proceedings
Cost to exhibit:
Rates increase $100 after May 31, 2019
|Booth type||CALCE/SMTA Members||Non-Members|
|One table |
includes access to Electrical Outlet
|One table |
no access to Electrical Outlet
Come and visit the exhibits for FREE! Plan to network with leading suppliers working to stop the proliferation of counterfeit parts in the electronics supply chain.
Show Hours Each Day: 10:00am - 3:00pm
Your expo pass gives you access to:
- FREE Panel Discussion
- FREE Lunch
- FREE Refreshment Breaks
If you would like to attend other conference sessions, please register for the conference here.
Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.
Upper Midwest (Minnesota, Iowa & Dakotas) Chapter: 2019 SMTA Upper Midwest Expo & Tech Forum +
DoubleTree by Hilton Minneapolis - Park Place Minneapolis, MN 55416
Upper Midwest Expo & Tech Forum +
1500 Park Place Blvd.
Minneapolis, MN 55416
The cost to exhibit for corporate members is $375/$475 (Early/Late) and $450/$550 (Early/Late) for non-corporate members.(click here for membership information)
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Early registration expires on May 31, 2019!
Important Exhibitor Materials:
- Hard Copy of Exhibitor Application
- Click here for Ad and Sponsorship opportunities!
- Please contact SMTA Expo Manager Hannah Terhark with questions or for additional information.
Book a discounted room rate at the Doubletree by Hilton Minneapolis - Park Place.
1500 Park Place Blvd Minneapolis, MN 55416
Group Code: UME
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Free Technical Program & Schedule:
Thursday, June 27th, 2019
Advanced Inspection and Automation Solutions for Today's Smarter Factory
Speaker: Brad Ward, Omron
Hot to Buy PCBs Better & Smarter
Speaker: Greg Papandrew, Better Board Buyer
Impact of Storage Conditions on the Integrity of a No Clean Solder Paste
Speaker: Dave Sbiroli, Indium Corporation
Awards, Door Prize Drawing, & Announcements