Calendar of Events



May 2019

May 3

Dallas Chapter: LED Do’s and Don’ts  +

Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080

LED Do’s and Don’ts

Speaker: Matt Osborne, Regional Territory Manager, Trans-Tec America

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on May 3, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!


  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!


What to do and not to do with LEDs in a surface mount process including Paste printing, Stencil Design, picking, placing, Reflow, and test.


Matt Osborne
Trans-Tec America
Territory manager
  • Attended University of Delaware.
  • Worked for Motorola in Shaumburg, IL as a SMT Manufacturing Engineer.
  • Worked for Allied Signal in DOD environment as a SMT Manufacturing Engineer.
  • Worked for Quad Systems as a Field Service Engineer.
  • Engineer for Decatur Electronics in microwave radar.
  • Redesigned to Jugs professional radar gun used by Major League Baseball.
  • Opened his own contract manufacturing business, Contract Assembly Service, Inc.
  • Vice President of American Circuits located in Charlotte, NC.
  • Director of Engineering. The Light Source, Inc. – Design and manufacturing of high-end theatrical stage lighting.
  • Trans-Tec America territory manager.

May 7

Wisconsin Chapter: Milwaukee Brewers Game May 7th  +

1 Brewers Way, Milwaukee WI 53214

Wisconsin SMTA hosts an evening at Miller Park with the Milwaukee Brewers
Thank You to everyone who signed up for the Brewers game of May 7th!  
We are now at capacity.


 Our ticket package is in Section 211.  Row 8-12. 
Price per ticket is $15.00. 
Tickets will be handed out at the WI SMTA Expo on May 7th.

May 7

Wisconsin Chapter: 2019 WI SMTA Expo  +

Crown Plaza Milwaukee 6401 S. 13th Street Milwaukee, WI 53221

Join us for the WI SMTA Expo on May 7th! 
Where: Crown Plaza,  6401 S 13th Street  Milwaukee, WI 53221
Hours will be 9:00 am to 3:30pm

What to expect:
Over 50 Exhibitors,  Door Prizes,  Golf sign up,  Raffles,  Lunch,  3 Technical Speakers and more! 
Following the Expo we will have 30 seats to the Brewers 6:40pm game.  Please scroll down the webpage to secure your spot for the Brewers game.

We are pleased to announce our 3 Technical Speakers:
Chrys Shea of Shea Engineering
Michael Sevigny of CeTaQ Americas
Jason Fullerton of Alpha Assembly
Come for the Exhibitors and stay for lunch and Networking! We cannot wait to see everyone on May 7th!

May 7

Connecticut Chapter: Stanley Black and Decker: Innovation Center tour and tech talk  +

One Constitution Plaza, Second Floor, Hartford CT

Our first Tech Session of 2019 will include a tour of Stanley Black & Decker’s “Manufactory 4.0” Innovation Center, and include a presentation with Q&A by Eric Cowan who is the Director Industry 4.0, Automation & Robotics at Stanley Black & Decker.   

MAY 7, 2019
3:00 pm - 5:00 pm

Stanley Black & Decker:  Innovation Center tour and tech talk

"Industry 4.0 Robotics, Data Layer Management and SMTA Q&A"
Presented by Eric Cowan, Director Industry 4.0, Automation & Robotics at Stanley Black & Decker 

We are thrilled to be the first visitors of the new Stanley Black & Decker Innovation Center!  Stanley Black & Decker has created autonomous, off-site teams  throughout the United States to pursue new ideas and create a culture of innovation.  The state-of-the-art “Manufactory 4.0”in Hartford CT is the epicenter for Stanley Black & Deckers global Industry 4.0 “Smart Factory” and workforce upskilling initiataves – making manufacturing more efficient, productive and adaptable.

About the Speaker (bio):
An innovative leader who excels at creating sustainable processes and delivering complex solutions. Expert in business process re-engineering, project management and creating tools and systems to enhance operations. Expert coach and mentor, change agent, internal consultant, and project manager. Over 18 years experience in high volume electronics manufacturing including 15+ years as a functional manager leading teams and leading leaders in a highly matrixed global organization. A lifelong learner, passionate about continuous improvement with exceptional analytical and problem-solving skills, enjoys solving problems across a broad set of business functions. Skilled communicator with experience presenting to all levels of the organization and conferences.
Certifications: PMP, MBA, CSM, CSPO, SaSP, Jonah, Six Sigma, LEAN

COST:  $25.00 SMTA Members / $35.00 Non-Members

Map of Innovation Center

May 8

Mexico-Guadalajara Chapter: SMTA Expo and Tech Forum Chihuahua Edition  +

Salon Villarreal

Te esperamos, registrate en el siguiente link para poder asistir

Registro Aqui / Register Here

Evento gratuito gracias a nuestros patrocinadores, consulta proximamente el listado de empresas participantes en la zona de Expo.

Hotel Convenio: Hilton Garden Inn Chihuahua
Direccion: Av. de La Juventud 5915, Esq. Haciendas del Valle
Chihuahua, Chihuahua, C.P 31216, México
Tarifa Habitacion Estandar: $85 usd
Código de reservación: EXPAI
  • Tarifa incluye Desayuno
  • Las tarifas indicadas no incluyen impuestos (16% de IVA y 4% de Impuesto Sobre Hospedaje).
  • Precio por persona adicional $15 usd
  • Tarifas por habitación, por noche, en ocupación doble o sencilla.
  • Tarifas negociadas en dólares americanos.
  • Tarifas NO comisionables.
  • La tarifa pública está sujeta a cambio y disponibilidad sin previo aviso.
  • Ocupación máxima por habitación 2 adultos.
+52 614-311-25-24     Office
+52 614-239-33-26     Mobile


May 8

Great Lakes (Chicago) Chapter: Accelerating the Solder Paste Evaluation Process - By Chrys Shea  +

Plexus, 2400 Millbrook Drive, Buffalo Grove, IL 60089

Due to speaker illness, this event is canceled.  Please stay tuned for information about possible rescheduling at a later date.

SMTA Great Lakes Chapter Meeting:

Wednesday, May 8th, 2019

Time:  6:00pm – 8:30pm
Location: Plexus – 2400 Millbrook Drive, Buffalo Grove, IL  60089


Chrys Shea
Shea Engineering Services
East Greenwich, RI, USA

Solder paste can make or break the profitability of SMT processes. Using the proper chemistry is critical to a successful operation.  Because solder pastes have so many different characteristics that affect their assembly line performance, they can be cumbersome and costly to evaluate.  As a result, many assemblers are using mature formulations that have since been improved upon, simply because they don’t have the resources to properly evaluate new, more process- or product-friendly materials.

This paper proposes a new solder paste evaluation regimen that helps engineers assess up to 25 solder paste properties on their assembly line in 5 hours or less.  It uses the new SMTA board that is available off-the-shelf from Practical Components and is part of a full kit developed specifically to help PCB assemblers choose the right solder paste for their operation, as quickly, easily and economically as possible.

 About the Speaker:

President, Shea Engineering Services

Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry.  Chrys is a frequent speaker at industry events, and has three times received the SMTAI “Best of Conference” award for her research on solder paste printing.  In 2012, she was honored with the SMTA “Member of Technical Distinction” award.  Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island.  She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees.

When:  Wednesday, May 8th, 2019
6:00 pm: Registration & Networking
6:30-7:00 pm: Dinner
7:00 - 8:00 pm: Presentation
8:00 - 8:30 pm: Questions and Adjournment

Prices for fabulous dinner meeting
$30 for Members - $35 for non-members
free for Displaced Members

You can pay onsite (Cash/Check only!) or via PayPal (a "Buy Now" button will be availble after completing the RSVP process)

and invite your friends too……….
RSVP to Gerri by May 7th, 2019
Send RSVP by the methods listed below:

Online: RSVP
Fax: 847-639-2489
(You will be charged for your visit if a No Show occurs)
Where: Plexus – 2400 Millbrook Drive, Buffalo Grove, IL  60089

May 14

Central Texas (Austin) Chapter: CTEA Electronics Symposium at AMD  +

AMD Bldg B500 Auditorium, 7171 Southwest Parkway, Austin, TX

Central Texas Electronics Association

Electronics Design, Manufacturing & Test Symposium 
Tuesday, May 14, 2019
AMD Bldg B500 Auditorium at 7171 Southwest Parkway

3:00  -   Registration Begins
3:30  -   Welcome and Introductions
3:35  -   " Packaging Technologies for Advanced Automotive Applications
                 Andrew Mawer, Reliability & Analysis Manager, NXP
4:05  -   " Chip Reverse Engineering Methods
  Carlos Greaves, Sr Vice-President, i-Runway
4:35  -   Break for Networking
4:50  -   " X-ray Analysis for Electronics ” 
     Stephen Schoppe, President, Process Sciences
5:20  -   " Client Reliability Engineering Overview: Best Practices for Commercial PC’s
                 Ed Tinsley, Engineering Manager, Dell
5:50  -   Door Prizes Drawing & Closing Remarks
6:00  -   Food & Refreshments Served and More Networking
RSVP to Bob Baker at:
No charge for SMTA & IMAPS members;  $10 for all non-members >> (Cash or Check ONLY!)
                            Students can also attend for FREE!
Event Location:
AMD Bldg B500 Auditorium at 7171 Southwest Parkway in South Austin
near SW Parkway & W. William Cannon Dr  ( Use Parking Garage (1) P300 or (2) P100 )
See Directions to:   (AMD Location)   and   See AMD Campus Map Per Attached Doc
In Central Texas, SMTA and IMAPS work together as the Central Texas Electronics Association (CTEA)

May 16

Indiana Chapter: NSWC Crane Visit  +

Vistor Center @ 102 Furlong Street, Crane, IN 47522

NSWC Crane Visit of
Surface Mount Tech Association (SMTA) Indiana Chapter
16 May 2019
Purpose: To gain more understanding of NSWC Crane’s technical capabilities.
We will get a chance to tour 3 locations that cover Radar Technology, PCBs, and Failure analysis.
Transportation: 2 - 36 passenger buses
Uniform: Military – Khakis; Civilian – Business Casual
Visitor(s) will be escorted by: Mr. Dean May

To complete your registration the downloard the IDCARD/BASE pdf document. This document MUST be filled out and sent to before May  9, 2019 for citizens and by April 30, 2019 for non-citizens to Michelle Sparks via email or postal carrier using the information below:
  1. Michelle Sparks at
  2. Michelle Sparks
Corporate Communications Office
Naval Surface Warfare Center, Crane Division (NSWC Crane)
Building 1, Code 103
300 Highway 361
Crane, IN 47522-5001

Forms must be recieived by April 25, 2019 if you are not a US citizen  and by May 2, 2019 if you are a US citizen.

At the visitor’s center you will have to show:
  1. Valid Identification
    • Show valid identification usually valid driver's license from any REAL ID compliant state.
    • Currently only 5 jurisdictions are not REAL ID compliant: Illinois, Missouri, Minnesota, Washington, and America Samoa. Visitors with driver's licenses from those states will have to present an additional form of identification such as birth certificate or passport, with the exception of visitors who have either a Washington or Minnesota Enhanced Driver's License. Enhanced Driver's Licenses will be accepted as a sole form of identification.
  2.  Show current proof of insurance and vehicle registration (Rental agreement if rented vehicle)

1. From Bloomington, take I-69 south.
2. Follow I-69 for 26.9 miles to exit 87 at US-231.
3. Take US-231 south to Highway 558. Turn left onto Highway 558.
4. Follow Highway 558 to the Visitors Center on the left.
5. After the Visitors Center follow Highway 558 to the Crane Gate and follow map on next page.
The GPS Address for the Visitor Center is 102 Furlong Street, Crane, IN 47522.


May 20

Webinar: Successful X-Ray & Optical Inspection in a Tin/Lead or Lead-Free Process  +

Bob WillisMonday 20th May @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe


Area Array Technology is part of mainstream electronics but until recently very few good inspection criteria were available in the industry. The assembly process for BGAs is fairly well understood for Tin/Lead alloys but with the move to Lead-free assembly, new QFN and LGA packages have critical issues to consider during inspection. The webinar covers optical and x-ray inspection of solder joints for both Tin/Lead and Lead-free terminations. It includes an introduction to the Lead-free assembly process with specific attention to BGA and area array devices. It provides a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces.


Topics include:

  • Procedures for inspection joints optically and by x-ray
  • Inspection criteria for joints
  • Identification of key joint features
  • Other indicators of possible failures
  • Common BGA & bottom mounted failures


In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

May 21

Massachusetts (Boston) Chapter: Understanding the requirements of IPC-J-STD-001  +

Radisson Hotel Nashua - 11 Tara Boulevard, Nashua, NH 03062

Understanding the requirements of IPC-J-STD 001 Requirements for Soldered Electrical and Electronic Assemblies click here to download slides 
Abstract:  The presentation will cover many elements of the J-STD-001 document which are problematic in the understanding of the criteria. 
For example here are a few of the most misunderstood elements of the document:
  • Understanding the definition of the requirements, especially for the differentiation of the various criteria of acceptable, process indicators, no requirements, and defective conditions.
  • Conflict resolution. As is written it is very difficult to interpret the results of an inspection if the contract states, that the product will be built and inspected to the requirements of J-STD-001. This document is a soldering document.
  • Interpretation of the differences between, conductor and wire diameter as this was a difficult concept to understand my many in the industry.
  • Review the meaning of Objective Evidence and this is a problematic area to substantiate a point and criteria.
  • In the materials section, the need to qualify the materials being used or face rejection of the product as it was not build with qualified materials.
  • The conversion to lead-free solders and other alloys and the due diligence to qualify those materials.
  • Thermal profiles and the need of such.
  • The solder connection.
  • The definition of soldering a wire to a terminal and the new explanation of the visuals.
  • Lead Trimming and the impact of cutting leads after soldering.
  • The physical soldering requirements.
  • The term discernible and what it means.
  • Component with no class 3 requirements
  • Section 8 cleaning section being re-written
 Speaker:  Leo Lambert – Vice President, Technical Director, Consultant – EPTAC Corporation
•    B.S.M.E. Lowell Technological Institute, now University of Massachusetts, Lowell
•    Vice President/Technical Director for EPTAC Corp. Manchester, New Hampshire
        *    Text “Soldering for Electronic Assemblies”, published by Marcel Dekker 1987
        *    Published and presented numerous papers relative to the subject of Soldering and Cleaning at various Technical Seminars and Exhibitions worldwide.
        *    Edited books on soldering for Van Nonstrand Publishers, and Society of Metals,
        *    Former member of the Editorial Review board for Circuit Assembly Magazine 
        *    Develop, published and conducted seminars Deadline to Lead Free Seminars and Thriving in a RoHS/WEEE Environment.
        *    IPC President Award 1989, for work conducted on solderable coatings for printed wiring boards. 
        *    TAEC chair 2008-2010
        *    IPC Hall of Fame 2019
        *    Charter member of the J-STD-001 and 610 committees
        *    Active participant in following IPC committees. 
        *    J-STD-001 and Handbook
        *    IPC-A-610 and 820 Handbook
        *    IPC-A-600
        *    IPC-6012
        *    IPC/WHMA –A-620
        *    Develop and wrote first IPC-A-600 training program
        *    Recipients of many Distinguished Committee Service Awards and Leadership Awards and Special Recognition Awards for the development of training programs
Other Activities:
        *    Charter Member on UNEP (United Nation Environmental Program) Technical Solvent Options Committee, overseeing worldwide activities in reducing CFC from use as cleaning material in Electronic Manufacturing. Part of Montreal Protocol
        *    Member of ICOLP (Industry Cooperative for Ozone Layer Protection)
        *    Past IPC Chairman of many committees relating to soldering and cleaning.
        *    Conducted many soldering seminars worldwide.
        *    Member of Mechanical Engineering advisory board, University of Massachusetts, Lowell MA.
        *    Member of Advisory Board for Greater Lowell Vocational School

“Rework and Assembly Processes for IPC-A-610 & J-STD-001” 
Abstract:  Hand soldering in the electronics industry is increasingly considered a reliability risk in electronics manufacturing.  Control over pc assembly with new software systems in placement, reflow and automated inspections has given engineering better control and traceability, improving yields and reliability.  These improvements have made the difference between automated assembly and hand soldering more apparent.   Some OEM manufactures have eliminated hand soldering by disposal of nonconforming product.  This is not practical when the pc assemblies have a high value.  
In companies with expensive assemblies there is a need to extend the control to the bench assembly.  JBC Tools has developed new software systems that work in conjunction with the soldering equipment for improving controls and providing traceability. IPC J-STD 610 sets standards for soldering that can be used as a basis for setting processes for rework and assembly. This standard can be used in the JBC QST software system; we will explain how this software can be used in the J-STD. The presentation will provide the audience with a demonstration on how the system works and give examples of how it was implemented.

Speaker:   Sean Torrens, US Sales Manager, Business and Engineering in LaSalle School in Barcelona & Manhattan College in New York. Sean has successfully implemented the QST system in class 3 companies all over the US; upgrading their control and traceability process for hand soldering.

Meeting Photos:

Sponsor for this event:

For more information visit:
Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598
Vice President : Peter Bigelow (IMI Inc.)
Phone: 978-373-9190

Future Events:
SMTA - Tuesday Oct. 8, 2019 - 4th New England Expo at the Boxboro Regency Hotel & Conference Center, Boxborough, MA


May 21

Medical Electronics Sponsorship and Table Top Exhibit  +

Cleveland, OH



Sponsorship Information

Sponsoring this event will provide a valuable opportunity to promote your company brand and product/service message to attendees, while supporting your business development and positioning goals. For benefits and pricing click on the link below. For more information contact SMTA, or call 952-920-7682.

View Sponsorship Benefits


Advertising Opportunities

Include your ad in our show directory to get more exposure for your company. Full page and half page ad space is available, black and white only. The deadline to submit your ad is April 15, 2019. *If you wish to pay through our secure server please use the "Register to Sponsor or Exhibit" button above. For a printable application form, click here.


Exhibiting Information

The conference will include an exhibition area featuring 25+ tabletop displays that will be open during conference breaks plus after hours.

Exhibit benefits:

  • 1 admission to symposium
  • 6 ft. Draped table
  • Two chairs
  • Attendee list
  • Company sign
  • Breakfast, Lunch & Breaks
  • Copy of the electronic conference proceedings


Exhibit Pricing:
Member: $550
Non-member: $650

Exhibit Hours:
May 21: 9:00am – 5:00pm

Please note that exhibit traffic will be minimal while symposium is in session. Please e-mail SMTA at or +1-952-920-7682 for sponsorship or exhibitor information.



Exhibit Hall Hours:

May 21: 10:00am – 5:00pm
To Register for the technical conference, click here.

May 21 - 22

Medical Electronics Symposium  +

The Tudor Arms Hotel Cleveland
Cleveland , OH 44106

This year's technical program was absolutely outstanding and our exhibiting companies saw a considerable amount of face to face interaction with our expo and conference attendees! 

Sincere appreciation to our hard working technical committee for bringing together these spectacular presentations!

Crystal Ballroom

May 28 - 30

Mexico-Guadalajara Chapter: Programa de Certificación SMTA - SMTA Program Certification  +

Hotel RIU, Guadalajara.

The most respected sign of approval in the electronics assembly industry 

Each SMTA Certification program is a three-day offering consisting of a 1.5-day workshop on topics in SMT Processes or Lean Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination (SMT Processes) and open book examination (Lean Six Sigma Green Belt.)

This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Lean Six Sigma Green Belt.

Why You Should Participate

Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Lean Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience

The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level. The title earned by Certified SMT Process Engineers is CSMTPE or Lean Six Sigma Green Belt Engineer for Six Sigma.

​​​​​Duracion: Del 28 al 30 de Mayo, 2019.
Lenguaje: Ingles/Español 
Examen: Ingles 
Instructores: Jim Hall, ITM Consulting e Ivan Castellanos, Indium Corporation  

May 30

Upper Midwest (Minnesota, Iowa & Dakotas) Chapter: May 30th: SMTA Upper Midwest Chapter presents “What Worked Yesterday Won’t Work Tomorrow” At John Deere Electronic Solutions – Fargo, ND  +

John Deere Electronic Solutions, Fargo, ND

Upper Mid-west Chapter is hosting a “You Drive, We Buy” event for the following topic:

“What Worked Yesterday Won’t Work Tomorrow”
Speaker: James A. Springer – Manager, Quality, Product Environmental and Safety Compliance – John Deere Electronic Solutions
Presentation Overview: 
Join many of your colleagues to hear tales from yesterday that worked, some that didn’t and some of the big changes over the years in technology and why what worked then won’t work now, or will it. From wave solder machines with foam fluxers, bottom only preheat into thin air and a wave that kind-a rolled as the assembled board pushed through the molten solder to wave solder machines where every parameter is controlled to very tight tolerances, the process has advanced but the principles remain the same. Many Engineers have overcome new manufacturing needs with various on the fly DOE’s, trial and error efforts, and other tricks to do new things. That may have worked in the past but will not today. The need for process control, Gage R&R’s and use of six sigma tools have never been more important. Join us for some history, present day knowledge and one leader’s opinion of where the future may go and why he believes the best days of technology are still to come. 
Date:     Thursday, May 30th, 2019
Cost:      FREE for Members / $20 Non-members (make checks payable to SMTA)
                        (Also FREE for non-members who become a Member at the Event!!)
  • 11:30 AM to 12:00 PM - Registration
  • 12:00 PM to 12:30 PM – Lunch
  • 12:30 PM to 1:30 PM – Presentation
  • 1:30 PM to 3:30 PM – Q&A / Tour
Lunch will be provided by the SMTA Upper Midwest Chapter.
RSVP by May 27th to guarantee a spot for this session.
Address/Directions to John Deere Electronic Solutions:
John Deere Electronic Solutions
1441 44th St. NW
Fargo, ND 58102

James Springer Biography: 
Manager, Quality, Product Environmental and Safety Compliance
John Deere Electronic Solutions 
1979 – Electronics Technology, Hesston Jr. College
1980 – General Studies, Goshen College
1986 – Computer Programming and Operations, Control Data Institute
Career Highlights:
2010   John Deere Electronic Solutions
           Manager, Quality, Product Environmental and Safety Compliance
2006   John Deere Electronic Solutions
           Quality Assurance Manager
2002   John Deere Electronic Solutions
           Manager, Advanced Technology
1999   Phoenix International - Springfield
           Operations Manager
1999   Phoenix International - Springfield
           Manager Advanced Technology
1999   Phoenix International
           Manager Manufacturing Engineering
Career Highlights:
           Installing first automated SMT line in Kansas City area - 1985
           Innovation Award Nomination and Patent for Heatsink Attachment to PCB
           Starting the MS-Lab – 2002

May 30

Silicon Valley (San Jose) Chapter: SMTA Silicon Valley Chapter Meeting May 30th  +

COMET GROUP LAB ONE 3055 Orchard Drive., Suite 150, San Jose, CA 95134
cordially invites you to attend:
Date:  Thursday, May 30, 2019
Time:  Sign In/Registration:  2:15pm-3:00pm
Presentations:   3:00pm – 6:00pm
Location:  Comet Group Lab One
3055 Orchard Dr., Suite 150, San Jose, CA 95134
(Light refreshments to be served during breaks and registration.)
Note: Topic 4 has been added

SMTA Members: Free; Non-Members: $20
(By cash or check payable to ‘SMTA Silicon Valley Chapter’ at the door)

SMTA Membership 
(Individual: $95 per year, Membership sign up at

Topic 1
Two Materials, One Board: High Frequency Hybrid Constructions

Speaker:  Jonathan Weldon – Principal Investigator, Du Pont Electronics and Imaging


Abstract: The ever-increasing demand for higher data rates and higher operating frequencies in traditional applications has pushed PCB materials to their performance limit.  Additionally, introduction of advanced technologies such as phased array antennas or millimeter wave radars into the consumer market has created a plethora of similar performance, cost, and supply chain challenges.  Technical concerns such as high latency (high dielectric constant), skew (glass reinforcement), and high insertion loss (high loss tangent and copper roughness) are just some of the issues that must be overcome when designing with traditional laminates.  Solving these problems often requires either high cost materials, yield losses in manufacturing, or a complete redesign of the high frequency PCB section; all of which is highly undesirable in a cost sensitive application.  The question at hand then, is not just how do we solve these problems, but how do we solve these problems without breaking the bank or designing something not manufacturable?  To that end, this topic will discuss design concepts and material choices for hybrid PCB constructions that will not only satisfy performance requirements but also help minimize cost through deliberate combination of both high performance and commodity grade materials.
Biography:  Jonathan Weldon is a Principal Investigator in DuPont’s Electronics and Imaging business.  In this role, he focuses on the characterization of high frequency materials along with the design of RF systems and interconnects.  Jonathan received his B.S. in Electrical Engineering from Texas Christian University and his M.S. in Electrical Engineering from Wright State University. He has more than a decade of experience in the development of radio frequency (RF) systems for defense applications through his time as an officer in the United States Air Force and an engineer at Sandia National Laboratories.

Topic 2
Materials and Techniques for Soldering in 5G Architecture 

Speaker: Seth Homer – Indium

Abstract:- This presentation discusses key soldering material selections as well as techniques that are critical to the performance and reliability of 5G architecture. Topics to be discussed include paste and preform selections and a hybrid solution for QFN voiding.

Biography:  Seth Homer has worked with Indium Corporation for more than 25 years, serving in both manufacturing operations and marketing roles. He is responsible for many of the products within the engineered solders product offering especially as it relates to RF Infrastructure and Power Electronics industries. He travels to customer sites globally to gain industry insight and works closely with Indium Corporation’s manufacturing teams to help support current production demand and future product development.
Topic 3
5G - Tackling some real life problems
 Speaker: Eran Dor – CEO of CRadar.Ai

Abstract: The 5th generation of cellular communications holds countless promises that many people are looking forward to. However, once the hype fades away and the dust settles, it will be time to deliver on these promises and scrutinize the tradeoffs. This talk will examine the pro's and con's associated with the different frequency bands in terms of RF performance, the risks and benefits of drastically increasing the amount of 5G base stations / small cells as well as examining how PCB manufacturing and SMT assembly may influence RF performance.
Biography:  Entrepreneur, wireless enthusiast, mentor and tirelessly curious synergy creator, Eran Dor has spent more than 20 years driving innovation in various wireless industry verticals and is currently the CEO of CRadar.Ai, revolutionizing how Radars see the world. In addition, Eran serves on advisory boards of other startups. Eran previously led large scale complex multi-radio designs for Wi-Fi/IoT networks, Point-to-Point radio links and Satellite payloads valued at over $1B. Eran also studies and practices leadership and mentoring skills with the goal of bringing out the best in people and teams.

Topic 4
5G Challenges for Inspection Systems
 Speaker: Keith Bryant Chairman SMTA Europe
Abstract: TBA
Keith Bryant Bio, May 2019
A fully qualified engineer, Keith has over thirty years’ experience in Electronics Manufacturing.  He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews.
He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years’ experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years.
Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.
from 2017 to 2019 he was Global Sales Director of the leading X-ray manufacturer. Recently reverting to a Consultancy role allowing him more freedom to pursue other projects, including i4.0.
He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.


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