Calendar of Events
Electronics in Harsh Environments Conference +
Space Coast Chapter Tutorial Program: "Solder Paste - Your SMT Line’s Gray Matter" +
Melbourne , FL 32904
|Instructors: Phil Zarrow & Chrys Shea |
April 3, 2019
9:00 a.m. - 4:30 p.m.
7505 Technology Drive
Melbourne, FL 32904
Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
The Chrys and Phil Show
Brought to you by two serious industry experts who don't take themselves too seriously, Phil Zarrow and Chrys Shea. Together, they combine over six decades of SMT experience, hundreds of publications and dozens of awards. Phil brings vast experience and insight, Chrys brings the data from independent research, and both of them like to deliver their knowledge in fun, interactive environments.
- Some SMT assembly process experience
- A working sense of humor
Come to the BRAND NEW Space Coast Tutorial to learn:
Solder Paste - what is it?
- How it is made, particle size classifications
- How it behaves - viscosity, thixotropy, rheology
- Balancing performance properties and why every formulation is different
- 25 paste characteristics that affect SMT line performance
- Finding the right product for the job
- Environmental and handling considerations
Stencils - aperture rules (5 ball rule, area ratio...)
Stencils - techniques and materials (fine grain ss, nano, etc.)
- Printing considerations and parameters
- Stencil cleanliness
Troubleshooting Printing Related defects
Factory Tour of BlueRing Stencils and LUNCH
Solder Paste Inspection
- SPI Basics
- Types of SPI technologies
- Reasons for deploying
- Implementation tips
- Setting tolerances
- Understanding thresholds
- Methodologies: Vapor phase, convection, laser
- Profile Objective
- Profile shapes (Straight ramp, ramp-soak-spike classic, Shoulder)
- Solder Paste/solder behavior during reflow
Troubleshooting common defects:
- Solder balls
Cleaning (time permitting)
- Why clean - pictures of dendrites and corrosion
- NC vs OA
- Why clean the no-clean?
- ROSE testing vs ion chromatography
- The importance of monitoring the cleaning process
About the Instructors:
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is an SMTA “Member of Technical Distinction” and three time SMTAI “Best of Conference” award winner for her research on solder paste printing. Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees.
Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throught the world. During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.
Since forming ITM Consulting in 1993, Phil Zarrow has helped numerous clients in such areas as
- SMT Implementation and Assembly facility set-up
- SMT Assembly and Soldering Failure Analysis
- EMS/Supplier Process and Quality Assessment Audits
- Counterfeit Component Avoidance and Interception Programs
- Manufacturing yield improvement
- Equipment Evaluation and Selection
- No-clean and lead-free solder paste evaluation and process implementation
- SMT Manufacturing Process Audits and process improvement
- On-site training for all levels of personnel
- Design for Manufacturability (DFM) specification development
- Reflow of Through-hole feasibility, development and implementation
- Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
- SMT process equipment benchmark testing and evaluation
- SMT product development
- Lead-free Process Implementation and Optimization
- Technical evaluations related to business acquisitions and mergers
- Technical assistance in legal disputes
Mr. Zarrow is a popular speaker and workshop instructor. He has chaired anbd instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of the book, "SMT Glossary- Terms and Definitions". Mr. Zarrow holds two US Patents concerning PCB fabricationa dn assembly processes and audit methodologies.
Phil is a member of IPC, SMTE, IMAPS, a co-founder of ITM Consulting, and is a past national level officer and national director or the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders' Award (2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forfront" and "Better Manufacturing" columms. He is currently producer and co-host of IPC Update's "Boardtalk" audio program.
Contact Karen Frericks at 952-920-7682 with questions.
San Diego Chapter: 04/10/19 SMTA Chapter Meeting - Gold Planar Bumps for Challenging Flip-Chip Applications and Factory Tour of Palomar Innovation Center +
Palomar Technologies Inc. 2728 Loker Ave West, Carlsbad CA 92010
Palomar Technologies will be presenting and giving a live demo and factory tour...
The semiconductor packaging industry continues a relentless pursuit to make smaller packages with a higher throughput. The industry demand for smaller components requires manufacturers to adapt by developing new processes. This presentation will explore the shrinking specifications of wire bonding requirements in regards to ball bump mashed ball diameter and top heights, and how to achieve them.
RSVP at this link:
Long Island Chapter: Chapter Meeting +
5000 Express Drive South - Ronkonkoma, NY 11779
Phone: 631-612-5000 Fax: 631-612-5001
Research & Development
Please RSVP. https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4685
Rocky Mountain (Colorado) Chapter: Business After Hours at Advanced Circuits +
21101 E. 32nd Parkway Aurora, CO 80011
The SMTA Rocky Mountain Chapter
After Hours Meet & Greet Event on April 11, 2019
Hosted by: Advanced Circuits
Join us for a free SMTA After Hours Meet & Greet event at Advanced Circuits. Enjoy a tour of the facility and a presentation by Isola Group, manufacturer of pre-pregs and laminate materials used in fabricating printed circuit boards. Refreshments will be provided.
Tours will start at 3:30PM and 4:45PM.
Rochester Institute of Technology Student Chapter Chapter: SMTA - RIT's Student Chapter showcase for MMET prospective students +
On this event we will be showcasing our SMTA student chapter to prospective RIT students. We will talk about the types of work that we do, our Center for Electronics Manufacturing Assembly (CEMA) lab, and the benefits of being members of an industry recognized organization shuch as SMTA.
Huntsville Chapter: Planetary/Centrifugal Mixer - April 2019 HSV Chapter Meeting - Reminder to RSVP by Thursday April 11 +
Reminder to RSVP by Thursday April 11
Huntsville Chapter SMTA and STI welcome you on April 16, 2019 from 5:30-7:30pm to a discussion and DEMO on a NEW PLANETARY/CENTRIFUGAL MIXER.
Thinky Planetary Centrifugal Mixer in the Real World
Thinky Planetary Centrifugal Mixer was first created 35 years ago in Japan in a small shop in Tokyo. Now over 35,000 units have been sold in over 50 countries for an extensive range of applications. Thinky mixes, disperses, and degasses materials (0.5g to 20kg) in minutes with or without the use of vacuum. Easy clean up, setup, and ease of use makes it the industry standard for mixing and degassing.
Kosuke “Ko” Takada is V.P. of Marketing and Business Development at Thinky U.S.A. Inc.
He has spent the first 4 years at Thinky HQ, as the International Sales Manager and have been mainly responsible for the Southern Hemisphere and North American territories. The past 2 years, he has been transferred to Thinky U.S.A. to build better relationships with the customer and help increase the growth of Thinky U.S.A. Kosuke has held over 20 seminars in North America, Europe, Asia, Australia, and Africa and created new distributor channels in several countries.
He has graduated from Embry-Riddle Aeronautical University with a degree in Aeronautical Science. He has his Commercial Aviation License, Certified Flight Instructor License, and have more than 10 years of experience in international sales. As a hobby he likes to listen to music and snowboard.
5:30 – 6:00 networking
6:00 – 6:30 dinner
6:30 – 7:15 intro & presentation
7:15 – 7:30 wrap-up
Location: STI Electronics, 261 Palmer Rd, Madison, AL 35758
Directions From I565:
- Take the Wall-Triana Hwy exit toward Madison Blvd / Madison
- Keep straight onto Sullivan St.
- Turn left onto Palmer Rd
- Arrive at 261 Palmer Rd, Madison, AL 35758
Meeting is free, but boxed meals from Apple Lane Farms and drinks will be available, let us know if you plan to dine with us.
$8 for SMTA Members who RSVP by Thursday April 11, 2019
$10 Non-Members who RSVP by Thursday April 11, 2019
$13 No RSVP
Cash/check at Door
Two ways to RSVP:
- SMTA RSVP Link:
- send email to: HSVSMTA@gmail.com
FREE Webinar: Flux Cleaning from PCB Assembly: Challenges, Methods and Assessment +
Wednesday 17th April @ 9:30am India Time GMT+5:30 (12:00am US Eastern Daylight Time GMT -4)
Presenters: Ansuman Das, Ph.D., MacDermid Alpha Electronics Solutions
Free for members - only members will get access to recorded presentation!
Non-members: USD $10
Members must log in to register with no fee. Non-members can pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: firstname.lastname@example.org +919620075752 or Madhukar Rao: +919686098690.
Although most of the PCB assemblies manufactured today involve no-clean process – many of the applications still demand the flux residue to be removed after soldering due to more stringent electrical requirements or due to the requirement from a downstream process. With the quantum of changes the electronics world has gone through in the past two decades, cleanability requirements for the PCB assembly have also changed to keep up with new requirements. Change in design, materials and manufacturing processes involved in assembling has also made the cleaning process more and more complex. In this presentation we will discuss the challenges faced by today's industry in terms of post soldering flux cleaning from the assembly and how to address such challenges with available methods. Discussion will explain the chemistry involved in cleaning different types of fluxes in different cleaning processes. It will also cover some of the methods to evaluate the cleanliness of the PCB assembly.
About the Presenter
Ansuman Das, Ph.D., is currently a formulation scientist and technology leader for MacDermid Alpha Electronics Solutions at the India Research Centre, Bangalore. He received his Ph.D. in Chemistry from University of Calcutta, India. Dr. Das has more than 14 years of experience in development of soldering fluxes and solder paste for board, substrate and wafer level applications.
Silicon Valley (San Jose) Chapter: SMTA TECHNICAL MEETING #1 FOR 2019 +
SMTA SILICON VALLEY CHAPTER MEMBERSHIP DRIVE & TECHNICAL PRESENTATION MEETING HELD AT INTEL CORPORATION!
Theme: New Challenges and Opportunities in Packaging, Manufacturing Process for High-Density Multi-Chips
Date: Thursday, April 18, 2019
Time: Sign In/Registration: 2:15pm-3:00pm
Presentations: 3:00pm – 6:00pm(Reception to follow)
Location: INTEL SC 12
3600 Juliette Ln, Santa Clara, 95054
(Light refreshments to be served during breaks and registration.)
CLICK HERE TO REGISTER TODAY!
The Datacenter – Integrated Photonics Manufacturing and Technology
Speaker: Robert Blum
Intel Silicon Photonics
Santa Clara, CA
Abstract: The rapid growth in data center traffic is driving the need for increased performance and overall bandwidth of networking equipment, including optical interfaces and Ethernet switches, which are based on pluggable transceivers today. But looking just a few years ahead, bandwidth scalability challenges are looming in terms of density, cost, and power; challenges that require tighter integration of optics and networking silicon. We will review motivation for integration and the enabling technology elements, and discuss how co-packaged Silicon Photonics enables higher density, reduced power per bit, and ultimately the continued scalability of network bandwidth and performance.
BIOGRAPHY: Robert Blum is Director of Strategic Marketing and Business Development for Intel’s Silicon Photonics Product Division. Prior to joining Intel, Robert was Director of Strategic Marketing at Oclaro Inc., and held various Director of Product Management and Marketing roles for Oclaro’s telecommunications products and consumer laser portfolio. Before joining Oclaro, Robert was Product Line Manager for optical transmission components at JDS Uniphase Corporation and held various engineering and marketing management roles at Gemfire Corporation, all in California. Robert worked at Deutsche Telekom’s research labs in Darmstadt, Germany, while completing his master’s thesis and holds a doctorate degree in Physics from the University of Technology in Hamburg. He has also studied and done research at Ecole Polytechnique Fédérale in Lausanne, Switzerland, and at Stanford University, California.
Packaging - More Choices, More Complexity
Speaker: Ken Brown
Senior Director- Packaging at Intel, Santa Clara
Abstract: Back in the “old” days of packaging, the REALLY old days, you just had a few choices. You went with a standard leadframe package or tooled up a custom leadframe if your volumes were high enough, dropped your chip on it, did the wirebonding and molding, and voila ! you had your packaged chip. Or alternatively, you got a hunk of ceramic, printed a circuit on it with thick film metal and dielectric, attached and wirebonded your chips, and once again you had your product. Not to turn this into a packaging history lesson, but then we started surface mounted packaging, at least doubling the choices with thru-hole packages and surface mount. Next came along limited and then broad application of flip chip packaging, migration from ceramic to organic flip chip packaging, and the growth continued. The growth of packaging has really followed the growth and diversity of the product needs for the chips. There is no end in sight, which I guess for the packaging engineer is a good thing ! This presentation will discuss the growth, diversity, and increasing complexity of packaging.
BIOGRAPHY: Ken Brown is the Senior Director for Packaging at Intel’s Silicon Photonics Product Division, and splits his time between Santa Clara, California, and Chandler, Arizona. Ken joined Intel in 1998 following Intel’s acquisition of the Digital Equipment Corporation (DEC) semiconductor business in Massachusetts. At Intel, Ken has held a variety of positions, with 20 years in Intel’s Assembly and Test Technology Development (ATTD) group - as Director of ATTD-Asia responsible for packaging development of Intel’s Communication and Wireless products in China, Malaysia, and the Philippines; as ATTD Senior Director of Package Design; and prior to his current role, as Senior Director of Packaging for Intel’s Custom Foundry business. Before joining Intel, he had worked in a variety of positions over 17 years at DEC in assembly, boards, advanced development, and semiconductor packaging, He has been in the electronic packaging field for more than 30 years. Ken holds degrees in Mechanical Engineering and an MBA from the University of Massachusetts at Amherst and Northeastern University. He also holds several Packaging Patents, chaired the Semiconductor Research Corporation Packaging Committee, and has authored packaging chapters for University texts. Outside of Intel, Ken is an award winning photographer, and was fortunate enough to receive an Intel “Sustainability in Action” grant to create the world’s largest full-color, high resolution, underwater photograph of the Bloody Bay Wall reef in the Cayman Islands to highlight the reef’s changing biodiversity.
Changing Market Requirements Bring New Challenges and Opportunities in Packaging
Speaker: Herb Reiter
eda 2 asic Consulting, Inc.
Abstract: The increasing demand for higher performance per Watt, integration of heterogeneous functions, smaller form-factors, lower unit and development cost as well as shorter times to profit are just a few of the reasons why the semiconductor industry is making significant changes to traditional strategies and practices.
The most visible and impactful of these changes is our focus on advanced packaging technologies. They are shifting a major part of the value creation from single-die SoCs to multi-die (sub)system solutions in a package. Unlike multi-chip modules (MCMs) in the past, today's multi-die packages are becoming more and more cost-effective and, thanks to the emerging die-package-board design flows, much easier to develop, manufacture and deploy.
This presentation outlines major market changes, explains the resulting challenges for our industry and shows how innovative companies turn these challenges into opportunities for growing revenues and profits.
BIO: After 10 years as board-level and system designer, Herb worked for about two decades for ASIC and EDA companies in both Europe and California. In 2002 he founded his own company " eda 2 asic Consulting, Inc." to focus on reducing the gap between the IC design and manufacturing camps. Since 2008, when he started the GSA's 3D-IC Working Group, Herb consulted on 2.5/3D-IC design and manufacturing topics with SEMATECH, Si2 and EDAC/ESD Alliance to contribute to the industry's transition from single-die SoCs to multi-die solutions in advanced packages. Herb frequently blogs about multi-die IC-related topics at 3D InCites, see http://www.3dincites.com/3d-context/ . He earned an MSEE and MBA in Austria, an MBA at San Jose State University and attended 40+ Continuing Education Courses at Stanford University.
Manufacturing Process for very high density multi-chip modules utilizing Liquid Crystal Polymer in multi-layer constructions
HSIO Technologies, LLC
Abstract: The company developed a new method for production of very high density multi-chip modules and circuits utilizing high performance Liquid Crystal Polymer (LCP) material sets in multi-layer constructions not possible with historical fabrication methods. The presentation describes the basic process sequences compared to conventional circuit fabrication methods, and identify unique design rules to enable much higher density and performance than previous use of LCP and like dielectric materials. Heterogeneous Integration examples aligned with the DARPA (Defense Advanced Research Projects Agency) CHIPS program will be described and demonstrated with high layer count LCP SiP substrates with sophisticated Micro-Electronics Assembly techniques extending from surface mount through embedded active semiconductors with passive device integration. A manufacturing relationship with a contract manufacturer and a RF Technology company focused on a RF and High Speed Design Innovation Center which will be described to illustrate the manufacturing process highlighting Test at Assembly technology highlighting the importance of Known Good Die (KGD) for any multi-die assembly especially when devices are embedded within internal layers of a high layer count substrate. The presentation will use true to industry relevant examples of high density modules developed to validate process, performance and reliability requirements for high reliability applications in the Mil/Aero/Defense/Sat/Auto and Tele/Comm/Mobile/Computing industries. Signal Integrity analysis normalized from empirical measurement data from DC to 112 gbs and 110 GHz RF will be explained to highlight the benefits of LCP versus conventional material sets.
BIOGRAPHY: James is the founder and President of HSIO Technologies, located in Maple Grove MN near Minneapolis. He was previously the founder of Gryphics, Inc. which was sold to Cascade Microtech in 2007. James is the author of over 80 patents related to high speed electrical interconnect and circuit fabrication and is responsible for advanced technology development at HSIO. James has over 30 years of semiconductor industry experience, and attended Marquette University's College of Engineering.
Webinar: Flexible Circuit Board Design & Assembly with Lead-Free Alloys +
Monday 29th April @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)
Presenter: Bob Willis, SMTA Europe
Flexible circuits is another packaging technology which has seen a growing and wider acceptance in the electronics industry. The advantages of surface mount reduced weight; decreased size can be further enhanced by flexible circuitry. In many cases, it is a misconception that flexible circuits have to flex, they don't; many flexibles are designed purely to aid the circuit design and assembly into the final product. In this case the substrate is only flexed or formed once. The range of constructions for circuit manufacture are wide but the basics are similar to existing printed circuit production. The design and selection of the manufacturing methods can affect the final cost of the circuit and need to be considered in detail prior to manufacture. Where design departments have limited experience useful reference material is available to engineers worldwide with the release of Flexible Circuit Technology, Third Edition by Joe Fjelstad and other publications.
- Flexible Design for assembly
- Manual assembly and soldering
- Automatic assembly process requirements
- The need for baking flexible circuits
- Flexible circuit pallets for automatic assembly
- Screen printing, placement, reflow soldering & AOI
- Manual hand soldering and de-soldering
- Rework of conventional and surface mount
- Solder joint Inspection
- Process defects on flexible circuits and during assembly
In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.
All webinar times shown are UK time – to check your local time in your countries click here