Calendar of Events

   2019      

         Apr                          

April 2019

April 2 - 4

Electronics in Harsh Environments Conference  +

Location
Amsterdam Netherlands


The conference will focus on building reliable electronics used in power electronics and harsh environments.


April 2 - 4

Electronics in Harsh Environments Expo  +

In conjunction with the Electronics in Harsh Environments Conference

Location: Park Plaza Amsterdam Airport
Melbournestraat 1
Lijnden (Amsterdam) NL-1175 RM



Exhibitors

Download the Application

Click Here to Pay in Euros

 

Exhibit Hours:
Tuesday, April 2: Afternoon

Wednesday, April 3: Full Day

Thursday, April 4: Morning

 

Exhibitor Table Top Options:

(Inside the Conference Room - Limit 9)
$1550 | €1350 (+ Dutch VAT)

  • Utilize your time the best by being inside the room! Get in front of our attendees the whole conference and make sure you don’t miss out on the action!
  • Includes: one 3m draped table, two chairs, company table tent, lunch, program listing, and electricity.
  • One complimentary conference registration (a €725 value!)

(In the Foyer – Limit 10)
$1225 | € 1050 (+ Dutch VAT)

  • Promote your company in our private foyer! All refreshment breaks as well as the reception take place here.
  • Includes: one 3m draped table, two chairs, company table tent, lunch, program listing, and electricity.
  • One complimentary conference registration ( a €725 value!)

 

Sponsorship Opportunities:

  • Premier Conference Sponsor - $2000/€1780 (limit 2)
  • Reception Sponsor - $1700/€1525 (limit 2)
  • Keynotes Sponsor -  $700/€625 (limit 1)  SOLD OUT
  • Lunch Sponsor - $500/€425 (limit 3)
  • Refreshment Break Sponsor - $500/€425 (limit 4)
  • Lanyard Sponsor $200/$400 (limit 1)

 

View the Floorplan Here!

*Table top selections are on a first come, first served basis
View the latest floorplan!


April 2

West Penn Expo & Tech Forum  +

Location: DoubleTree Monroeville
101 Mall Plaza Blvd.
Monroeville, PA 15146


Exhibitors

The West Penn Expo & Tech Forum is SOLD OUT! Please contact Expo Manager, Courtney Kalb, to be placed on the waitlist.
 

 

Discounted Hotel Rooms - Available Here:

DoubleTree by Hilton - Monroeville



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Tuesday, April 2, 2019
10:00AM–3:00PM

 

8:00AM

Registration Opens

 

9:00AM - 10:00AM

The X-Factor: How X-Ray Technology is Improving the Electronics Assembly Process

Speaker: Bill Cardoso, Ph.D., Creative Electron, Inc.

It was 1895 when Wilhelm Roentgen discovered a mysterious light that allowed him to see through things – and called it x-rays. Since then, x-rays have been adopted in a wide range of applications in the electronics assembly process. Instead of taking a “deep-dive” in one aspect of x-ray inspection, in this presentation we’ll cover a broad range of applications:

-         Electronic component inspection and failure analysis.

-         Component counting and material management.

-         Reverse engineering.

-         Counterfeit detection.

-         Real-time defect verification.

-         Computed tomography (CT) techniques and how to differentiate between 2D, 2.5D, and 3D x-ray inspection.

-         Design for manufacturing (DFM) and design for x-ray inspection (DFXI).

-         Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC).

We will also discuss how artificial intelligence (AI) is changing the way we think about x-ray inspection. Things we would never dream of doing just a few years ago are now reality by combining AI and x-ray inspection. Moreover, we will show you a series of real-life cases on how our team of AI scientists is using AI to solve the most challenging applications in x-ray inspection. And beyond x-ray inspection, we’ll examine how AI is forever changing the way we manufacture and inspect things.

 

10:00AM

Expo Opens

 

11:00AM-12:00PM

The Four Pillars of Continual Improvement

Speaker: James Emes, New Pig Corporation

How to change your mindset to a culture of proaction and continual improvement using the P-D-C-A principals.  Is your culture reactive or proactive?

-         Evaluate Risk (Planning)

-         Process Approach (Doing)

-         Metrics (Checking)

-         Root Cause, Corrective Action, Improvement (Acting)

This will be a collection of ideas, concepts, and principals to promote the right approach and thought process in your business.  Attempt to change your paradigm.  Whether you are making printed circuit boards or toy trains, the principals are the same.  Plan, Do, Check, Act.  How to do those things effectively to truly change your culture and avoid the disasters that will come if you don’t plan and act appropriately and efficiently. 

 

12:00PM

Complimentary Lunch

 

Thank You to our Lunch & Refreshment Sponsor:

 

1:30PM-2:30PM

Accelerating the Solder Paste Evaluation Process

Speaker: Chrys Shea, Shea Engineering Services

Solder paste can make or break the profitability of SMT processes. Using the proper chemistry is critical to a successful operation.  Because solder pastes have so many different characteristics that affect their assembly line performance, they can be cumbersome and costly to evaluate.  As a result, many assemblers are using mature formulations that have since been improved upon, simply because they don’t have the resources to properly evaluate new, more process- or product-friendly materials.

This paper proposes a new solder paste evaluation regimen that helps engineers assess up to 25 solder paste properties on their assembly line in 5 hours or less.  It uses the new SMTA board that is available off-the-shelf from Practical Components and is part of a full kit developed specifically to help PCB assemblers choose the right solder paste for their operation, as quickly, easily and economically as possible.

 

3:00PM

Expo Closes


April 3

Space Coast (Melbourne FL) Chapter: "Solder Paste - Your SMT Line’s Gray Matter"  +

7505 Technology Drive Melbourne, FL 32904



Space Coast Chapter Tutorial Program: "Solder Paste - Your SMT Line’s Gray Matter"

Learn what it is and how to choose it, print it, reflow it and clean it
 
Instructors: Phil Zarrow & Chrys Shea

April 3, 2019

9:00 a.m. - 4:30 p.m.
Mack Technologies
7505 Technology Drive
Melbourne, FL 32904
(321) 725-6993

Registration Deadline is March 15!
Price:
  • Members: $200
  • Non-Members: $400
  • Space Coast Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $80 

Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
 
The Chrys and Phil Show

Brought to you by two serious industry experts who don't take themselves too seriously, Phil Zarrow and Chrys Shea.  Together, they combine over six decades of SMT experience, hundreds of publications and dozens of awards.  Phil brings vast experience and insight, Chrys brings the data from independent research, and both of them like to deliver their knowledge in fun, interactive environments.

Pre-requisites:

  • Some SMT assembly process experience
  • A working sense of humor

Come to the BRAND NEW Space Coast Tutorial to learn:

Solder Paste

Solder Paste - what is it?

  • How it is made, particle size classifications
  • How it behaves - viscosity, thixotropy, rheology
  • Balancing performance properties and why every formulation is different
  • 25 paste characteristics that affect SMT line performance
  • Finding the right product for the job
  • Environmental and handling considerations

BREAK

Printing

Stencils - aperture rules (5 ball rule, area ratio...)

Stencils - techniques and materials (fine grain ss, nano, etc.)

Printing mechanics

  • Printing considerations and parameters
  • Gasketing
  • Coining
  • Support
  • Stencil cleanliness

Troubleshooting Printing Related defects

Factory Tour of BlueRing Stencils and LUNCH

Solder Paste Inspection

  • SPI Basics
  • Types of SPI technologies
  • Reasons for deploying
  • Implementation tips
  • Setting tolerances
  • Understanding thresholds

BREAK

Reflow Soldering

  • Methodologies:  Vapor phase, convection, laser
  • Profile Objective
  • Profile shapes (Straight ramp, ramp-soak-spike classic, Shoulder)
  • Solder Paste/solder behavior during reflow

Troubleshooting common defects:

  • Shorts
  • Opens
  • Solder balls
  • Tombstones
  • Head-In-Pillow
  • Voiding

Cleaning (time permitting)

  • Why clean - pictures of dendrites and corrosion
  • NC vs OA
  • Why clean the no-clean?
  • ROSE testing vs ion chromatography
  • The importance of monitoring the cleaning process

Q&A



About the Instructors:

Chrys SheaChrys Shea
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is an SMTA “Member of Technical Distinction” and three time SMTAI “Best of Conference” award winner for her research on solder paste printing. Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees.

 


Phil ZarrowPhil Zarrow

Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years.  His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies.  In addition to his background in reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems.  Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throught the world.  During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.

Since forming ITM Consulting in 1993, Phil Zarrow has helped numerous clients in such areas as

  • SMT Implementation and Assembly facility set-up
  • SMT Assembly and Soldering Failure Analysis
  • EMS/Supplier Process and Quality Assessment Audits
  • Counterfeit Component Avoidance and Interception Programs
  • Manufacturing yield improvement
  • Equipment Evaluation and Selection
  • No-clean and lead-free solder paste evaluation and process implementation
  • SMT Manufacturing Process Audits and process improvement
  • On-site training for all levels of personnel
  • Design for Manufacturability (DFM) specification development
  • Reflow of Through-hole feasibility, development and implementation
  • Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
  • SMT process equipment benchmark testing and evaluation
  • SMT product development
  • Lead-free Process Implementation and Optimization
  • Technical evaluations related to business acquisitions and mergers
  • Technical assistance in legal disputes

Mr. Zarrow is a popular speaker and workshop instructor.  He has chaired anbd instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim.  He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books.  He is co-author of the book, "SMT Glossary- Terms and Definitions".  Mr. Zarrow holds two US Patents concerning PCB fabricationa dn assembly processes and audit methodologies.

Phil is a member of IPC, SMTE, IMAPS, a co-founder of ITM Consulting, and is a past national level officer and national director or the Surface Mount Technology Association (SMTA).  He was also Chairman of the Reflow Committee for SMEMA.  He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders' Award (2000).  Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forfront" and "Better Manufacturing" columms.  He is currently producer and co-host of IPC Update's "Boardtalk" audio program.

 

Contact Karen Frericks at 952-920-7682 with questions.




April 3

Space Coast Chapter Tutorial Program: "Solder Paste - Your SMT Line’s Gray Matter"  +

Learn what it is and how to choose it, print it, reflow it and clean it

Location
Mack Technologies
Melbourne , FL 32904



Instructors: Phil Zarrow & Chrys Shea

April 3, 2019

9:00 a.m. - 4:30 p.m.
Mack Technologies
7505 Technology Drive
Melbourne, FL 32904
(321) 725-6993
Price:
  • Members: $200
  • Non-Members: $400
  • Space Coast Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $80 

Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
 

The Chrys and Phil Show

Brought to you by two serious industry experts who don't take themselves too seriously, Phil Zarrow and Chrys Shea.  Together, they combine over six decades of SMT experience, hundreds of publications and dozens of awards.  Phil brings vast experience and insight, Chrys brings the data from independent research, and both of them like to deliver their knowledge in fun, interactive environments.

Pre-requisites:

  • Some SMT assembly process experience
  • A working sense of humor

Come to the BRAND NEW Space Coast Tutorial to learn:

Solder Paste

Solder Paste - what is it?

  • How it is made, particle size classifications
  • How it behaves - viscosity, thixotropy, rheology
  • Balancing performance properties and why every formulation is different
  • 25 paste characteristics that affect SMT line performance
  • Finding the right product for the job
  • Environmental and handling considerations

BREAK

Printing

Stencils - aperture rules (5 ball rule, area ratio...)

Stencils - techniques and materials (fine grain ss, nano, etc.)

Printing mechanics

  • Printing considerations and parameters
  • Gasketing
  • Coining
  • Support
  • Stencil cleanliness

Troubleshooting Printing Related defects

Factory Tour of BlueRing Stencils and LUNCH

Solder Paste Inspection

  • SPI Basics
  • Types of SPI technologies
  • Reasons for deploying
  • Implementation tips
  • Setting tolerances
  • Understanding thresholds

BREAK

Reflow Soldering

  • Methodologies:  Vapor phase, convection, laser
  • Profile Objective
  • Profile shapes (Straight ramp, ramp-soak-spike classic, Shoulder)
  • Solder Paste/solder behavior during reflow

Troubleshooting common defects:

  • Shorts
  • Opens
  • Solder balls
  • Tombstones
  • Head-In-Pillow
  • Voiding

Cleaning (time permitting)

  • Why clean - pictures of dendrites and corrosion
  • NC vs OA
  • Why clean the no-clean?
  • ROSE testing vs ion chromatography
  • The importance of monitoring the cleaning process

Q&A



About the Instructors:

Chrys Shea Chrys Shea
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is an SMTA “Member of Technical Distinction” and three time SMTAI “Best of Conference” award winner for her research on solder paste printing. Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees.


Phil ZarrowPhil Zarrow

Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years.  His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies.  In addition to his background in reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems.  Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throught the world.  During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.

Since forming ITM Consulting in 1993, Phil Zarrow has helped numerous clients in such areas as

  • SMT Implementation and Assembly facility set-up
  • SMT Assembly and Soldering Failure Analysis
  • EMS/Supplier Process and Quality Assessment Audits
  • Counterfeit Component Avoidance and Interception Programs
  • Manufacturing yield improvement
  • Equipment Evaluation and Selection
  • No-clean and lead-free solder paste evaluation and process implementation
  • SMT Manufacturing Process Audits and process improvement
  • On-site training for all levels of personnel
  • Design for Manufacturability (DFM) specification development
  • Reflow of Through-hole feasibility, development and implementation
  • Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
  • SMT process equipment benchmark testing and evaluation
  • SMT product development
  • Lead-free Process Implementation and Optimization
  • Technical evaluations related to business acquisitions and mergers
  • Technical assistance in legal disputes

Mr. Zarrow is a popular speaker and workshop instructor.  He has chaired anbd instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim.  He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books.  He is co-author of the book, "SMT Glossary- Terms and Definitions".  Mr. Zarrow holds two US Patents concerning PCB fabricationa dn assembly processes and audit methodologies.

Phil is a member of IPC, SMTE, IMAPS, a co-founder of ITM Consulting, and is a past national level officer and national director or the Surface Mount Technology Association (SMTA).  He was also Chairman of the Reflow Committee for SMEMA.  He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders' Award (2000).  Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forfront" and "Better Manufacturing" columms.  He is currently producer and co-host of IPC Update's "Boardtalk" audio program.

 

Contact Karen Frericks at 952-920-7682 with questions.


April 9

Empire (Rochester, NY) Chapter: SMTA EMPIRE Chapter EXPO 2019  +

Location
Holiday Inn Syracuse-Liverpool (I-90 Exit 37)



We are delighted to welcome IPC Hall of Famers Dave Hillman and Doug Pauls from COLLINS AEROSPACE (formerly Rockwell Collins) as the featured speakers at our 2019 EMPIRE Expo Event!  The finalized Expo program agenda is provided in the table below.  NOTE the "Young Professionals" event (scheduled before exhibits formally open) is targeted towards students and newly employed individuals upon invitation only.  Please contact us if you wish to attend this special breakfast session.
Expo Registration:  https://www.smta.org/expos/#empire

About our featured speakers:


To register as an attendee or exhibitor, please visit:
https://www.smta.org/expos/#empire

 


April 9

Empire Expo & Tech Forum  +

Location: Holiday Inn Syracuse/Liverpool
441 Electronics Parkway
Liverpool, NY 13088



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early registration expires on March 8th, 2019!

Important Exhibitor Materials:

Book a discounted room rate at the Holiday Inn Syracuse-Liverpool by March 9, 2019.

Group Code: SMTA

315-457-1122

Book Rooms Today!  



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Tuesday, April 9, 2019
10:00AM–4:00PM

8:30am

Registration Opens for Expo & Tech Forum

 

9:30am

Expo Opens

 

10:00am - 10:45am

Doug Pauls, Collins Aerospace

Hold My Circuit Board and Watch This!  The Consequences of Poor Design and Assembly Decisions for High Performance Electronics

Bio: Principal Materials and Process Engineer with Collins Aerospace, an Aerospace OEM, in Cedar Rapids, Iowa.  Doug holds a B.A. in Chemistry and Physics and a B.S. in Electrical Engineering, but has morphed into a materials engineer over his career.  He has worked for the Naval Avionics Center in Indianapolis, Indiana as a Materials Engineer and as Technical Director of Contamination Studies Laboratories, Kokomo, Indiana, before joining Rockwell Collins in 2000.  Doug has been an active IPC Chairman for 35 years, serving as the Chairman of the Cleaning and Coating Committees for 10 years and chairing the Technical Activities Executive Committee from 2012-2014.  In addition to his goofy sense of humor, Doug is most notably known for his expertise in surface insulation resistance testing, cleaning and cleanliness assessment, conformal coatings, and how to qualify manufacturing processes.  He has been a U.S. representative to ISO and IEC working groups on SIR, electromigration, and cleanliness reliability standards.  He has participated in numerous national and international consortia on electronics manufacturing materials and processes.  He has led a group of industry subject matter experts to revise the ionic cleanliness provisions of J-STD-001, culminating in J-STD-001 Revision G, Amendment 1.  And to top it off, in 2017 Doug received IPC's highest honor service recognition, the Raymond E. Prichard Hall of Fame Award.

 

11:15am - 12:00pm

Dave Hillman, Collins Aerospace

QFN Reliability and Voids

Bio: David D. Hillman is a Metallurgical Engineer in the Advanced Operations Engineering Department of Collins Aerospace in Cedar Rapids, Iowa.  Mr. Hillman graduated from Iowa State University with a B.S. (1984) and M.S. (2001) in Material Science & Engineering.  In Dave’s early career he served as a Metallurgical Engineer at the Convair Division of General Dynamics with responsibility in material testing and failure analysis.  In his present assignment at Collins he serves as a consultant to manufacturing on material and processing problems.  Some of Dave’s notable industry contributions include serving as a Subject Matter Expert (SME) for the Lead-free Manhattan Project in 2009 and publishing numerous technical papers, with the 2011 SMTAI Conference paper being selected as "Best of Proceedings Paper."  He continues to serve today in the role of Chairman on the IPC JSTD-002 Solderability committee.  He is also a member of the American Society for Metals (ASM), the Minerals, Metals & Materials Society (TMS), Surface Mount Technology Association (SMTA), and the Institute for Interconnecting and Packaging of Electronic Circuits (IPC).  Dave’s outstanding contributions to his company and service to industry are deservedly recognized as named a Rockwell Collins Fellow in 2016 and recipient of the prestigious IPC Raymond E. Prichard Hall of Fame Award in 2018.

 

12:00pm

Complimentary Lunch

 

1:00pm - 1:45pm

Dave Hillman, Collins Aerospace

Utilization of Lead-Free Ball Grid Arrays (BGAs) in a Tin/Lead Soldering Process

 

2:15pm - 3:00pm

Doug Pauls, Collins Aerospace

Residue Assessment, Impact and Control in Manufacturing High-Performance Products

 

3:00pm

Reception of Show Floor

 

4:00pm

Expo Closes


April 10

San Diego Chapter: 04/10/19 SMTA Chapter Meeting - Gold Planar Bumps for Challenging Flip-Chip Applications and Factory Tour of Palomar Innovation Center  +

Location
Palomar Technologies Inc. 2728 Loker Ave West, Carlsbad CA 92010



Palomar Techologies will be presenting and giving a live demo and factory tour...


Topic: Gold Planar Bumps for Challenging Flip-Chip Applications
Speaker:  Evan Hueners, Product Marketing Manager




The semiconductor packaging industry continues a relentless pursuit to make smaller packages with a higher throughput. The industry demand for smaller components requires manufacturers to adapt by developing new processes. This presentation will explore the shrinking specifications of wire bonding requirements in regards to ball bump mashed ball diameter and top heights, and how to achieve them.


Date: 04/10/19
Registration: 4:45 PM
Social/Dinner: at 5:00PM
Presentation: 5:30PM

Factory Tour: 6:30PM
$5 Members and $15 Non Members
Location: Palomar Technologies Inc., 2728 Locker Ave West, Carlsbad CA 92010
 


April 10

Long Island Chapter: Chapter Meeting  +

Courtyard Long Island MacArthur Airport, 5000 Express Drive South - Ronkonkoma, NY 11779



Wednesday, April 10th   2019  ... 5:30 PM.... see below to RSVP on Line
Courtyard Long Island MacArthur Airport
5000 Express Drive South - Ronkonkoma, NY 11779
Phone: 631-612-5000 Fax: 631-612-5001
 
SMTA Long Island Chapter Presents
 
Solder Jet Printing Technology
Presented by 
 
Gustaf Martensson 
Mycronic's
Expert on Complex Fluids
Research & Development 
 
 
Viktor Olsson 
 Mycronic's Product Manager for
Assembly Solutions
This presentation will focus on Jet Printing from an application and technological perspective. 
 
The lecture will cover the basics of jet printing, deposition and material trends, applications and specific advantages, and component variations/shortage. The course will be concluded with a look into the future with reference to what materials and technologies will be needed to fulfill the needs of the electronics industry. 
 
Meeting and Dinner Buffet (Cash Bar):
 
For Individual and Corporate Participating Members: 
$0.00...Great Deal! ...our way of saying "Thanks" for all your support!
 
Non Members:   
Dinner and meeting only without membership...$35.00
 
 Join the SMTA...Individual Membership $95
Enrollment includes 1 year SMTA membership; free attendance and dinner at this meeting... This is a great deal! 
 
 Due to room size we may be limited to 50 attendees...
Please RSVP. 
https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4685
 



April 11

Atlanta Chapter: Atlanta SMTA 23RD Annual EXPO  +

Location
*******NEW LOCATION***** TECH PARK ATLANTA 107 Technology Pkwy NW, Peachtree Corners, GA 30092 *******NEW LOCATION*****



SMTA EXPO, April 11, 2019
For 22 years the SMTA Atlanta Chapter has worked very hard to organize a best-in-class event for our local and regional  SMTA exhibitors and visitors. Our chapter is well known for many reasons and our Expo has always been on top of the list. Every year Atlanta SMTA chapter officers and volunteers put their heads together to try and create a show with something for everyone. The combination of business and networking opportunities is a proven recipe for success  - and this year will be no different.
 
Our traditional venue at the Infinite Energy Center is going through some major renovations and for that reason, among others, we are relocating in 2019 to Atlanta Tech Park.  Conveniently located in the Peachtree Corners/Norcross area where “Atlanta high-tech” began back in the 70's, the facility is new and spacious. Exciting new features for exhibitors include video monitors throughout the show floor where your ads can be running continuously during the show. 

The new venue also allows us to choose our own catering company which means a hot buffet lunch and a beer/wine reception at the end of the show. No more box lunches.
 
We are finalizing the technical program and should have details soon. Pete Waddell will be back with his Designers Round Table plus more technical sessions to be announced.


We are very excited about our local charity partner this year. Canine Assistance has been training service dogs for over 27 years in Alpharetta. They have an incredible history and story to tell. Come to the Expo to meet some of their beautiful furry students!  


 
 
 
SPACE IS GOING FAST – SIGN UP TO EXHIBIT TODAY!


 
 


April 11

Rocky Mountain (Colorado) Chapter: Business After Hours at Advanced Circuits  +

Location
21101 E. 32nd Parkway Aurora, CO 80011



SAVE THE DATE!
The SMTA Rocky Mountain Chapter
After Hours Meet & Greet Event on April 11, 2019
3:00-6:00PM
Hosted by: Advanced Circuits

  




Join us for a free SMTA After Hours Meet & Greet event at Advanced Circuits.  Enjoy a tour of the facility and a presentation by Isola Group, manufacturer of pre-pregs and laminate materials used in fabricating printed circuit boards.  Refreshments will be provided. 
Tours will start at 3:30PM and 4:45PM.



April 11

Atlanta Expo  +

Location: *NEW LOCATION* Atlanta Technology Park
107 Technology Parkway
Peachtree Corners, GA 30092



Exhibitors

The cost to exhibit for corporate members is $375/$475 (Early/Late) and $450/$550 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Early registration expires on March 8th, 2019!

Important Exhibitor Materials:

Book a discounted room rate at the Hyatt Place by March 13, 2019.

5600 Peachtree Parkway Norcross, Georgia, United States, 30092

Group Code: SMTA 

770-416-7655

Book Rooms Today!  



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Show Hours: 10:00AM – 4:00PM

THANK YOU TO OUR REFRESHMENT BREAK SPONSOR:

9:00AM:

Registration Opens

10:00AM:

Expo Opens

10:30AM:

Bill Cardoso, Ph.D., Creative Electron

10 Years of iPhone X-Rays – What Have We Learned

Abstract: It’s been over 10 years since Steve Jobs introduced the iPhone to the world. Much has happened since then. Over this past decade, the iPhone became a reference design, and the object of desire of a legion of fans who wait anxiously for every launch of the Cupertino company. Undoubtedly the most advanced smartphone in the market today, the iPhone is a technology marvel. The double stacked boards, dual battery, and a face recognition sensor bring the iPhone to a whole different level. 


In this presentation, we’ll explore these technological advances by a live teardown of several iPhones. The teardown will be followed by a detailed coverage of the technical details of critical parts of the device. This live teardown will be accompanied by x-ray and CT images of the iPhones, so the audience will get unprecedented insights on what makes this iPhone tick. More importantly, we will explore the assembly process utilized to put these devices together – and how this process has changed in the past decade. This presentation is targeted at a wide technical audience looking for a better understanding on how advance consumer electronics are designed and assembled. 

Bio: Our benevolent overlord is an overeducated Brazilian who became an electronics technician at 13, continued in life to get a BS, MS, and PhD in Electrical Engineering, and topped off with an MBA. While taking way too many classes, Bill ran a top engineering design department at Fermilab, the leading high energy and nuclear physics research lab in the USA. After almost a decade in Chicago, Bill moved to San Diego in search of perpetual summers. In San Diego, Bill founded Creative Electron, where he obsesses about building the best x-ray machines in the world. When not on a plane, Bill spends time on the beach listening to Car Talk with his beautiful wife and three kids.

 

THANK YOU TO OUR LUNCH SPONSOR: 

ITS

12:00PM:

Complimentary Lunch

 

12:15PM:

KEYNOTE LUNCH PRESENTATION:

Heinz Wegener, Cross Technologies, Inc., Todd Peneguy, and Gary Webb, Tiger Labs Corporation

Yesterday, Today, Tomorrow

Wegener is an early Icon of electronics manufacturing in Atlanta and he is speaking on the Early beginnings of Electronics in Atlanta, Gary is heavily engaged in Today’s industry and Todd has an announcement about tomorrow and it should be a jaw dropper!

WegenerBios: Heinz Wegener is President and Owner of Cross Technologies, Inc., a private company which manufactures electronic equipment for the satellite and telecommunications markets. Heinz earned a bachelor of science degree (summa cum laude) from Indiana Institute of Technology in 1970. He is a member of the Institute of Electrical and Electronic Engineers (IEEE), a past member of the Executive Committee of the Southeast Council of the American Electronics Association (AEA), and served as Chairman of the Southeast Council of the AEA in 1992. He was also a past member of the Board of Advisors of Technology Executive Roundtable.

 

 

Todd PeneguyTodd Peneguy is a Sales and Marketing professional with a Degree, in Speech Communications, from the University of Georgia. Todd was a founding member of both the TAG Mobility Board, the TAG Cloud Board and was the Executive Charmain of the First TAG Internet of Things Symposium. 

 

 

 

Gary WebbGary Webb began his journey in product development in Atlanta at Georgia Power and two pioneering technology firms, DC Hayes Microcomputers and Quadram. Upon graduation from Georgia Tech, Mr Webb spent a few years in Boca Raton FL where he was a member of The Original IBM PC development teams and later designed dozens of IBM servers out of Raleigh, NC.He and his Skunkworks™ Tiger Labs team have designed over 100 products ranging from small sensors and gateways through award-winning high performance data storage devices and enterprise servers. He has consulted senior executives in companies tlike The Home Depot and his products and designs have generated over 4B$ of revenue for both small and large organizations such as IBM, Dell, and Seagate. He has been awarded 6 patents with several pending. Mr Webb is currently engaged in over a dozen state-of-the-art IOT and M2M product development programs, some in early concept stages with others entering volume manufacturing.

 

THANK YOU TO OUR SNACK SPONSOR:

 

2:00PM:

Industry Roundtable

Moderated by Pete Waddell, technical editor, PRINTED CIRCUIT DESIGN & FAB and president, UP Media Group (UPMG) and Ken Holmes, Holmes Electronics

Abstract: An informal Industry Roundtable that will focus on challenges within the PCB supply chain. This promises to be a lively look at the world of PCB design, fabrication, assembly…and beyond. Be ready to tell us “what keeps you up at night” and to share your industry experience with fellow professionals.

Bio: Prior to launching UP Media Group in 2002, Pete Waddell had been publisher and editor-in-chief of Printed Circuit Design Magazine, publisher of PC FAB, and conference director of the PCB Design Conferences. He spent over 20 years as a draftsman and designer in the electronics industry, working for some of the largest military and commercial contractors in the US.

 

 

THANK YOU TO OUR RECEPTION SPONSOR: 

3:00PM:

Reception on Show Floor

4:00PM

Expo Closes

 

2019 CHARITY RAFFLE INFORMATION


The Atlanta Chapter is holding a charity raffle again this year with drawings for great prizes throughout the day.

Canine Assistantsmission is to educate dogs and the people who need them so they may improve the lives of one another. We believe that dogs who are asked to improve the lives of people deserve to be treated with the utmost respect and kindness. We want the relationships we facilitate between people and their working dogs to serve as the model for all relationships between dogs and people.

We place Service and Companion Dogs with people who have mobility difficulties, type I diabetes, epilepsy, and other medical needs. We also place Facility Dogs who provide therapy and intervention services to children and adults. We provide a Disabilities Awareness Education Program and K-9 Kids Reading Program for school-age children as well as Animal Assisted Therapy and Interventions.

Exhibitors are invited to donate raffle prizes. Raffle tickets will be sold the day of the Expo, with all proceeds benefiting Canine Assistants. For information on how to donate contact SMTA at hannah@smta.org!

 

THANK YOU TO OUR RAFFLE DONORS:

UP MEDIA GROUP- $50 LOWE's gift card

I. Technical Services, LLC - Thompson 31Fifty wine

Amitron Corporation - 2 $50 gift certificates 

Viscom - $100 gift card


April 16

Massachusetts (Boston) Chapter: Selecting High Tech Adhesives  +

Location
Honle UV America, Inc. 261 Cedar Hill Street, Bldg C, Marlboro, MA 01752



SMTA Boston Chapter evening meeting on Tuesday, April 16, 2019 at Honle UV America, Inc. in Marlboro, MA.
What You Need To Consider Before Selecting High Tech Adhesives
 
Abstract:  Choosing the best adhesive for a specific application can be complex. There are many variables to be considered and numerous types of chemistries, all with different capabilities. An understanding of the most important parameters will help to narrow the choices.  The discussion will cover some of the more important issues and chemistries needed for choosing the best adhesive.  These parameters are applicable to macro and micro applications for all industries.
Speaker:   Barry Siroka – Business Development Manager – EpoxySet Inc.
Bio:  Barry Siroka started in the chemical industry as a urethane production chemist and moved into technical service of specialty materials in 1980.  Over the course of his 40+ year career, he has worked for several polymer manufacturers and distributors in various technical service/sales/marketing roles.  He has been responsible for training in the use of adhesives to sales personnel, distributors and engineers in most high tech industries. His emphasis is in customer service and solving material problems.  Barry has continued his marketing/sales/customer relationship efforts as the Business Development Manager since joining EpoxySet in 2015.
 
Date: Tuesday, April 16, 2019
Time: 5:00 PM to 9:00 PM
Location: Honle UV America, Inc.
261 Cedar Hill Street, Bldg C, Marlboro, MA 01752
Cost: Members $25 ($30 after Thursday, April 11, 2019)
Non-Member  $30 ($35 after Thursday, April 11, 2019)
Meeting Agenda:
5:00 – 6:00 PM Registration and Sign in, Socializing, Networking
6:00 – 7:30 PM Factory Tour – Adhesive Curing Demo
6:30 – 7:30 PM Dinner and Announcements
7:30 – 8:30 PM Feature Adhesive Presentation
8:30 -8:45 PM Q&A
8:45 PM Adjourn
 
Our 2018 Expo Sponsors:
   

For more information visit: https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=22
 
To register for this event visit: https://smta.org/chapters/rsvp.cfm?BEE_ID=4680
Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598
Vice President : Peter Bigelow (IMI Inc.)
Phone: 978-373-9190


Future Events:
iMAPS NE – Tuesday May 7, 2019 – 46th Symposium & Expo at the Boxboro Regency Hotel & Conference Center, Boxborough, MA
SMTA –May 21 or 22, 2019 – IPC Standard Update & JBC Rework Station, TBD
SMTA - Tuesday Oct. 8, 2019 - 4th New England Expo at the Boxboro Regency Hotel & Conference Center, Boxborough, MA


April 17

FREE Webinar: Flux Cleaning from PCB Assembly: Challenges, Methods and Assessment  +

Organized by SMTA India - Bangalore Chapter

Location
Bangalore India



Wednesday 17th April @ 9:30am India Time GMT+5:30 (12:00am US Eastern Daylight Time GMT -4)

Presenters: Ansuman Das, Ph.D., MacDermid Alpha Electronics Solutions

Free for members - only members will get access to recorded presentation!
Non-members: USD $10 

Members must log in to register with no fee. Non-members can pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: newprojs_ankan@yahoo.com +919620075752 or Madhukar Rao: +919686098690.

Overview

Although most of the PCB assemblies manufactured today involve no-clean process – many of the applications still demand the flux residue to be removed after soldering due to more stringent electrical requirements or due to the requirement from a downstream process. With quantum of changes electronics world has gone through in past two decades cleanability requirements for the PCB assembly have also changed to keep up with new requirements. Change in design, materials and manufacturing processes involved in assembling has also made the cleaning process more and more complex. In this presentation we will discuss the challenges faced by todays industry in terms of post soldering flux cleaning from the assembly and how to address such challenges with available methods. Discussion will explain the chemistry involved in cleaning of different types of fluxes in different cleaning processes. It will also cover some of the methods to evaluate the cleanliness of the PCB assembly.

 

About the Presenter

Ansuman Das, Ph.D., is currently a formulation scientist and technology leader for MacDermid Alpha Electronics Solutions at the India Research Centre, Bangalore. He received his Ph. D in Chemistry from University of Calcutta, India. Dr. Das has more than 14 years of experience in development of soldering fluxes and solder paste for board, substrate and wafer level applications.

 


April 29

Webinar: Flexible Circuit Board Design & Assembly with Lead-Free Alloys  +



Bob WillisMonday 29th April @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Flexible circuits is another packaging technology which has seen a growing and wider acceptance in the electronics industry. The advantages of surface mount reduced weight; decreased size can be further enhanced by flexible circuitry. In many cases, it is a misconception that flexible circuits have to flex, they don't; many flexibles are designed purely to aid the circuit design and assembly into the final product. In this case the substrate is only flexed or formed once. The range of constructions for circuit manufacture are wide but the basics are similar to existing printed circuit production. The design and selection of the manufacturing methods can affect the final cost of the circuit and need to be considered in detail prior to manufacture. Where design departments have limited experience useful reference material is available to engineers worldwide with the release of Flexible Circuit Technology, Third Edition by Joe Fjelstad and other publications.

 

Topics include:

  • Flexible Design for assembly
  • Manual assembly and soldering
  • Automatic assembly process requirements
  • The need for baking flexible circuits
  • Flexible circuit pallets for automatic assembly
  • Screen printing, placement, reflow soldering & AOI
  • Manual hand soldering and de-soldering
  • Rework of conventional and surface mount
  • Solder joint Inspection
  • Process defects on flexible circuits and during assembly

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


Looking for a local chapter event? Check the Chapter News page for more events.
SMTA Headquarters
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Phone 952.920.7682
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