Calendar of Events



March 2019

March 6

Carolinas (NC, SC) Chapter: SMTA Carolinas Infosession on Conformal Coating  +

GMI Manufacturing


On 06 March, we will explore Conformal Coating technologies including plasma etch, jetting, and two-part auto mixing with PVA at GMI in Mooresville, NC

Doors will open at 5:30 on Wednesday 06 March 2019

Preregister and save $5 or pay at the door with credit card, check, or cash
East West Manufacturing
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March 6

University of Maryland Student Chapter Chapter: SMTA and IMAPS Student Chapter at UMD Spring Technical Symposium  +

Johns Hopkins Applied Physics Laboratory (APL), Laurel, MD

The SMTA at the University of Maryland Student Chapter cordially invites you to attend:
SMTA and IMAPS Student Chapter at UMD
Spring Technical Symposium
 1. Subramani Manoharan
 2.  Maxim Serebreni
3. Dr. Michael Fish  
The IMAPS Chesapeake Chapter combined with the University of Maryland student chapter of IMAPS and SMTA, will hold its Spring Technical Symposium on March 6th, 2019, at the Applied Physics Laboratory (APL) of Johns Hopkins University. The symposium will focus on emerging trends in electronics packaging and their reliability concerns. This will be the first collaborative meeting between IMAPS and SMTA student chapters, and is expected to attract people with a wide range of background hence providing great networking opportunity for students and professors.
The event will kick off with speeches from eminent speakers on topics covering thermal aspects of power module packaging, bi-metal interface degradation in wire bonds and trends in packaging materials and its reliability. There will also be exhibits showcasing products and services that are of importance to the electronics packaging and reliability personnel. Dinner will be served for all attendees and participants. Selected topics will be presented as posters by the students of University of Maryland during the dinner session.
Wednesday, March 6, 2019
3:00 p.m.-7:00 p.m.
Johns Hopkins Applied Physics Laboratory (APL), Laurel, MD

Deng Yun Chen
In Advance:
  • Students In Advance:             $10
  • Members In Advance:            $25
  • Non-Members In Advance:     $30
At the door
  • Students at the Door :             $15
  • Members at the Door:             $30
  • Non-Members at the Door:     $35
TO REGISTER IN ADVANCE by March 6th 2019!

3:00 PM Registration and Opening Remarks
3:30 PM Interfacial Degradation of Copper Wire Bond in Combined (Thermal Aging + Cycling) Loading Condition
Subramani Manoharan, Center for Advanced Life Cycle Engineering, University of Maryland
4:00 PM The Impact of Glass Style and Orientation on the Reliability of SMT Components
Maxim Serebreni, DfR Solutions
4:30 PM Design Challenges and Opportunities in Package-Integrated Transient Thermal Mitigation
Michael Fish, Army Research Laboratory
5:00 PM Networking and Student Poster Session
5:45 PM Event Wrap up and Closing Remarks
6:00 PM Dinner
Speakers and Abstracts
Speaker: Subramani Manoharan | Presentation Title: Interfacial Degradation of Copper Wire Bond in Combined (Thermal Aging + Cycling) Loading Condition
Abstract: Copper (Cu) wire bonds have become the dominant wire material used in microelectronic packages, which has replaced gold (Au) in majority of applications. Cost savings has been the key factor to drive this transition in wire bond material, although there are other advantages to Cu such as better electrical and thermal conductivity, slower intermetallic compound (IMC) formation and reduced wire sweep during transfer molding. However, two critical reliability concerns exist with Cu wire bonds, namely, growth of electrically resistive and brittle IMCs and fatigue of bond wire, which makes them not suitable for harsh environments such as in industrial, military and automotive electronics.
A review of literature shows fracture at wire neck as the most commonly reported failure mode. However, with the growth of IMC at interface, the location of failure shifts to interfacial separation. This is studied in detail through performing thermal cycling experiments with long dwell times at high temperature that promotes interfacial IMC growth, to replicate actual use condition. Additionally, most of the work presented in literature use lab made wire-bonded specimen in their study on test packages, which may not replicate actual commercial off-the-shelf (COTS) parts which have several different geometrical and material parameters. A unique test approach is adopted to study this two part failure and model its failure time by including the myriad of factors that exists in COTS packages. Additionally, critical factors contributing to failure are identified and studied in detail to establish a physics based model to predict failure.

About the Speaker: Subramani Manoharan is a PhD student in Mechanical Engineering at the University of Maryland, College Park. His research focuses on electronics packaging with emphasis on interconnect technology such as wire bonding, lead-free solder and underfills for industrial and commercial applications. His interests also include material characterization and failure analysis of microelectronics. He is member of ASME, IMAPS and IEEE organizations and actively serves as a reviewer for some of their journals.

Speaker:Maxim Serebreni Presentation Title: The Impact of Glass Style and Orientation on the Reliability of SMT Components
Abstract: Printed circuit board (PCB) glass style and orientation can have a significant influence on thermal cycling reliability of surface mounted components.  DfR has conducted thermal cycling (-40°C to 125°C) tests on two PCB glass styles (1080 and 7628).  The in-plane and out of plane Coefficients of Thermal Expansion (CTE) were measured and found to be about 3-4ppm/°C different in the X-Y directions of the boards.  To facilitate the reliability assessment of SMT component reliability four 0-ohm resistor sizes (2512, 1206, 0602 and 0402) were mounted on each board.  Each board had 20 resistors with multiple orientations.  The overall sample size consisted of 32 resistors of each size per glass style.  In addition, the PCBs have two pad sizes.  The purpose of these experiments is to develop a model for validating fatigue life predictions for different laminate materials.  This paper will present the experimental structure, results of the stress tests and variables on the reliability of the chip components and insight into the development of appropriate models.
Speaker: Dr. Michael Fish  | Presentation Title: Design Challenges and Opportunities in Package-Integrated Transient Thermal Mitigation
Abstract: Phase change materials (PCMs) have attracted the attention of researchers for their promise to buffer or mitigate the effects of transient thermal pulses within electronic systems.  While widespread adoption has historically been held back by the by the low thermal conductivity of otherwise attractive materials with relevant transition temperatures, advancements in PCM enhanced composite materials, additive manufacturing, and more recent interest in low melting point metals has tipped the balance towards feasibility in highly transient systems.  One impediment to deploying PCM enhanced packaging is a lack of package-level design tools that can illustrate the tradeoffs between performance, size/weight, and cost that results from integrating phase-change materials and/or their composites.  This work exhibits the extensions made to the Army Research Laboratory’s thermal-mechanical co-design tool, ARL ParaPower, to enable both phase change transient modeling and integration into system-level design tools.  By providing rapid surveying capability within any particular design space, detailed simulation burden is reduced and the most promising demonstrators are prioritized.

About the Speaker: Dr. Michael Fish leads the transient thermal program as part of the Advanced Power Packaging group at the Army Research Laboratory. He has expertise in embedded thermal management, simulation, and thermal test bed development. His current effort is in the management and packaging of highly transient electronic systems, with particular focus on directed energy weapons and vehicle electrification and power conversion.  He holds a doctorate in Mechanical Engineering from the University of Maryland, College Park where he studied thermal phenomena in heterogeneously integrated systems.  He received his BS and MS from the University of Virginia, studying micro/nanoscale heat transport and metrology.
Attendees will learn about current research in the field of electronics. Further, it is a good opportunity for student members to network with industry professionals and learn about the relevant work in the industry.
Students and professionals interested in the field of electronic packaging
Contact Deng Yun Chen at with questions.

March 7

Atlanta Chapter: Chapter Meeting  +


Statistical Trends in Counterfeit Electronic Supply Chains
It’s been over 10 years since the industry as a whole began to address the growing threat of counterfeit product in the electronic supply chain. Numerous standards, dozens of conferences, and untold presentations have been produced in an effort to educate our industry. After all that work, has there been a quantifiable impact across the supply chain or are we trying to address the wrong root causes?
Presentation By: Gary Beckstedt Director of Operations Flip Electronics
Gary Beckstedt heads the quality and inspection labs for the company as well as managing all logistics operations. Gary’s role requires him to institute and direct all quality management programs and processes as well as performing internal audits. Among his many challenges, Gary has the responsibility to ensure that Flip Electronics’ ISO/ANSI standards and certification programs, ESD programs, inspection and counterfeit detection process, and personnel training are all in compliance with their respective requirements and procedures. Gary helps to identify and track industry changes that affect the supply chain and supports the industry as a whole by serving on the G19-D committee that is tasked with maintaining the AS6081 standard. He is the company’s principal spokesperson in matters related to quality and methods of detection and abatement of counterfeit and suspect electronic parts. Gary is a US Air Force veteran, where he began his electronics career in 1989. He operated and maintained RADAR systems to support the Desert Storm and Desert Shield campaigns. He is a graduate of the AS9100D Lead Auditor program and an IPC Certified EMS Program Manager.
When: March 7, 2019
Where, Viscom Incorpoated 
1775 Breckenridge Parkway, #500
Duluth GA. 30096

Sign in and networking - 4:30
Dinner - 5:00 - 6:00
Presentation - 6:00 - 7:00


March 11

Wisconsin Chapter: Technical Meeting / Dinner Dave Vicari & Packaging Technologies and the Alternative Methods for Assembly  +

Fox Valley Technical College- DJ Bordini Center

Please Join us on March 11th for a Technical meeting and dinner at Fox Valley Technical College.   Dave Vicari from Universal Intruments wil be discussing Packaging Technologies and the Alternative Methods for Assembly.   Check in / Registration is at 5:15pm,  Dinner at 6pm,  7pm Technical meeting and 8pm FVTC Campus Tour.

The electronics design, packaging and assembly industries are being challenged to adapt to the needs of mature industry sectors such as the military/aerospace/defense segment to the fast changing requirement of the wearables, IoT segments.  The result is the revolution of new materials that may or may not suitable for its intended application.  The AREA consortium and the APL lab have characterized and implemented these new materials in novel end products along with conducting applied research to understand the impact on manufacturing techniques.  This roadmap discussion reviews and discusses the materials, alternative assembly processes and the reliability that will enable manufacturers to produce novel devices to the market.


March 13

San Diego Chapter: 03/13/19 San Diego Chapter Meeting -fcLGA Package Assembly Qualification for Mobile Applications  +

PSemi, 9369 Carroll Park Dr San Diego, CA 92121

fcLGA Package Assembly Qualification for Mobile Applications
Presented by
 Mumtaz Bora Sr. Staff Packaging Engineer at pSemi Corporation
Flip Chip Land Grid Array (fcLGA) packages are widely used in Mobile product applications due to their thin form factor and performance. Assembly process qualification requires careful selection of materials and optimization of reflow processes to make consistent and reliable product. The fcLGA typically uses an organic substrate on which the die is reflowed instead of the copper lead frame used in QFN packages. This requires assessment of CTE mismatch and controlled reflow processes to prevent bump separation .The paper reviews the selection of substrate, optimization of assembly process and reliability testing conducted for fcLGA package qualification. 
Speaker: Mumtaz Y. Bora has a B.S. in Chemistry and Material Sciences from University of Mumbai, India and University of Ottawa, Canada. She has a Master of Science in Interactive Telecommunications from University of Redlands, California. She has over 25 years of PWB, SMT assembly and advanced packaging development experience at IBM Endicott and IBM Austin, TX.  She has worked in new product development, and qualification of high volume handset assemblies at Qualcomm and Kyocera-Wireless Corporation.  She has worked with suppliers and subcontractors in several parts of Asia.  She is currently a Sr. Staff Packaging Engineer at pSemi for qualification of RFIC packages for wireless, broadband Automotive and Power applications. She is a member of IPC standardization committees and contributes to the standards development. She has 18 publications and 3 patents. She is the Past President of the SMTA San Diego chapter and Co-chair of the Moisture Sensitive Devices Council. She is currently the Publicity Chair for  IMAPS San Diego Chapter and Vice President of Communications at SMTA San Diego chapter.

RSVP by: 03/11/19
Members $5, Non-Members $15 (cash or check at the meeting)
Location:                   pSemi Corporation, 9369 Carroll Park Drive, San Diego, CA, 92121     (map)
Registration:            5:30PM
Dinner:                      5:45PM-6:45PM
Presentation:           6:45PM

March 14

Ohio Valley Chapter: SMTA Ohio Chapter - Selective Soldering Workshop  +

Crown Equipment Corporation New Bremen, OH

 Technical program:
  • Pillarhouse - Jonathan Wol: Understanding fluxes and how they impact the selective soldering process.
  • Kurtz Ersa - Ernie Grice: Fundamentals of the soldering process as pertained to wave and selective soldering and outline why selective soldering is poised to become the standard for thru-hole soldering versus antiquated, black art of wave soldering.      
  • Laserssel - Denis Barbini: A Novel and Enabling Solution For Reflowing Challenging Mainstream and Alternative Electronics.  Presentation will provide step-by-step process development, material compatibility, reliability and productivity of this area laser selective reflow technique for mainstream and unique electronics designs.
  • MTA Automation - Will Hunter: Induction and Micro-Flame soldering and when to use them.
  • Facility tour of Crown Equipment Corporation electronic assembly operations.

March 14

Mexico-Juarez Chapter: SMTA Juarez First Technical Seminar - 2019  +

Centro de convenciones Cuatro Siglos


¡El Capítulo de SMTA Juárez está de vuelta! Estamos organizando una gran reunión técnica el Jueves 14 de Marzo del 2019 para celebrar y nos gustaría invitarle a USTED a asistir.


Los usuarios de tecnología SMT (OEM, EMS, fabricantes contratados) están especialmente invitados a asistir. Si este capítulo va a sobrevivir en el futuro, necesitaremos su apoyo.



Fecha: Jueves, Marzo 14, 2019

Hora: 5:30-9:00 p.m.  

Nota especial: Las puertas se abrirán a las 5:00. Tendremos varios sorteos para los Miembros Usuarios. ¡Llegue temprano para aumentar sus posibilidades de ganar un premio fabuloso!

Ubicación: Centro de Convenciones Cuatro Siglos

Direccion: Boulevard Juan Pablo II (Blvd. Cuatro Siglos) y Av. Arizona.

Ciudad Juárez 32402


  • 5:00 p.m. - Doors Open
  • 5:30 p.m. - Welcome & 1st Raffle
  • 6:00 p.m. - 2nd Raffle
  • 6:05-6:10 p.m. – SMTA Chapter Juarez Committee Presentation  
  • 6:10-6:25 p.m. - Universidad Tecnologica - Presentation of Programs -  M.C.M. Alecia Torres, Ing. Ricardo Perez
  • 6:25-6:30 p.m. - SMTA Certification Program – Ing. Alejandro Valles / Ing. Moises Gonzalez
  • 6:30-6:50 p.m. – Presentation: "Técnica para reducción de voids en componentes QFN mediante la modificación de aperturas del esténcil” / Part 1 – Ing. David Solís
  • 6:50-7:05 p.m. - ITCJ - Nodes Program - Mtro. Mario Macario Ruiz
  • 7:05-7:20 p.m. - CIITA-CIA - Dr. Jose Mireles
  • 7:20-7:40 p.m. - Presentation "Técnica para reducción de voids en componentes QFN mediante la modificación de aperturas del esténcil “/ Part 2 – Ing. David Solís
  • 7:40-8:00 p.m. - Awards Presentation
  • 8:00-9:00 p.m. - Dinner


March 14

Tampa Bay Chapter: SMTA Tampa Bay Chapter Meeting- March14th  +

Jabil Circuit 10560 MLK St. Petersburg, FL 33716

This is a reminder to save the date for our next chapter meeting at Jabil Circuit Inc. on 3/14/19. 
Our speaker is Axel Vargas, (see attached bio)  Senior Manufacturing Engineer at Lockheed Martin RMS Oldsmar, FL.
Axel will be discussing the following topic:

Rinsing Study Based on Inline and Batch Cleaning Processes
How different cleaning agents, under similar equipment, perform over time on a rinsing perspective. How often you audit your wash application performance? Does the process gets an impact on performance over time? Which are the correct tools to monitor the wash and rinse process efficiency over time?
All of these topics will be discussed on this presentation.

Our meeting this quarter will be held at the following address:
Jabil Circuit
10560 MLK Blvd
St. Petersburg, FL 33716

This is the four story buidling in the center of the campus.  You can enter from either Roosevelt or MLK and go to the center buidling by following the signs.

Thursday March 14th:
5:30- Registration/ Meet and Greet
5:30- Dinner
5:45- Introduction of Speaker
5:50-6:30- Topic Presentation
6:30-6:45- Question and Answer Time

Cost of Meeting:
Members- $15.00
Non-Members- $20.00

We hope to see everyone at the meeting!


March 18

Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects  +

Bob WillisMonday 18th March @ 2:30pm - 4:00pm GMT (10:30am - 12:00pm US Eastern Time)

Presenter: Bob Willis, SMTA Europe


The presentation provides a better understanding of solder paste selection and the use of stencil printing in modern fine pitch manufacture. Surface mount components are now at lead spacing of below 0.020″, only the correct selection of solder paste and specification of stencils can lead to effective printing. The session aims to provide a basic understanding of the design, production and quality control issues, both theoretical and practical issues of printing conventional surface mount and through hole for intrusive reflow.

Topics include:

  • Design of lands and apertures for fine pitch SMT & BGA
  • Through hole printing requirements
  • Selection of stencils
  • Evaluation of solder pastes
  • Practical machine set-up and trial prints
  • Elimination of board wash-off
  • Assessment of paste and stencil combinations
  • Solder paste inspection, measurement and quality control
  • Stencil Inspection and quality control
  • Cleaning stencils
  • Printed board requirements for printing fine pitch

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

March 19

Dallas Chapter: Dallas Expo and Tech Forum - March 19  +

Plano Event Center

Register Now!

Click Here to Register for the Dallas Expo and Tech Forum!

Are you a...
  • Manager of Design or Manufacturing
  • Process engineer
  • Design Engineer
  • Supply Chain Professional
  • Purchasing
  • Test Engineer
  • Manufacturing or Test Technician

The Dallas Expo has everything you need to do with Design and Manufacturing of Electronics!

Event Details

  • Date: Tuesday, March 19, 2019
  • Time: Doors open at 8am
  • Location: Plano Event Center (2000 E. Sprint Creek Parkway, Plano, TX 75074)
  • Food: Complementary Lunch Buffet
  • More info:
  • Questions? Call Hannah Terhark at 952-920-7682

Technical Sessions

You Design & You Manufacture Complex Multilayer Circuits with 3D Printing 

Speaker: Ofer Maltiel, Nano Dimension
My driving passion in life is to help people succeed. The client’s goal is my first priority. Whether it's connecting them with an important contact or sharing from my 10 years’ experience as a hardware design engineer, I do whatever I can to help my clients thrive. Over the past 10 years, I've learned how to bring a product from the inception stage to life in various industries, cultivating lifelong relationships.

Abstract: The presentation will discuss innovative 3D printed electronics capabilities, including:
  • The role of additive electronics manufacturing in Industry 4.0
  • The increasing synergy between the additive manufacturing of electronics and the IoT
  • Industry timelines for production-scale 3D printed electronics
On-Going Cleanliness Testing on Production Hardware

Speaker: Mike Bixenman, Kyzen
 Dr. Michael Bixenman (aka Dr. Mike) is known to many as the world’s leading expert in cleaning electronic circuit assemblies and advanced packages.  He is also one of the industry’s leading authorities on the design of electronic assembly, cleaning materials and process integration. In fact, Dr. Mike literally wrote the book on electronics manufacturing process cleaning standards (Cleaning & Contamination Process Guide).  
Abstract: The performance and cost advances over the past 20 years have enabled technologies to advance beyond what anyone could have imagined. In spite of these technology advances, the cleanliness standards that contractors rely on to ensure the design, production, and quality of next-generation Class 2 & 3 electronic hardware has remained unchanged. As technologies advance, the companies who build the device need guidance on what to do and how to do it.  
Flux residues trapped under low standoff leadless components on Pb-Free assemblies may still be active due to blocked outgassing channels, even when using a no-clean solder paste. Quantifying the risk of site-specific residues under problematic components is commonly done during the materials and process validation using chemical and electrical test methods. Process verification and validation are done to characterize and prove out the process on the materials used to build production hardware. Once the printed circuit assembly is placed into production, process control test methods to assure conformance are lacking. 

’s, QFN/DFN’s – Oh My, Can Traditional DFM Survive 
Speaker: Dale Lee, Plexus Corporation
Dale is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields.
Abstract: Today’s electronic product designs are rapidly increasing the use of bottom terminated components (BTC’s), whether they are collapsible/non-collapsible ball grid array (BGA), solder bump grid array (BGA?), land grid array (LGA), quad-flatpack no-lead (QFN) or dual-flatpack no-lead (DFN) component packaging technologies.  However, with some BTC package designs vary greatly in solder pad design and pitch within the same package.  This variability impacts the ability to incorporate good DFM practices and selection of applicable assembly workmanship rules for these and other standard BTC component package designs. This presentation will highlight impact elements these component technologies have on the assembly, cleaning and inspection processes and what actions can be made during the DFM and NPI process to minimize yield impacts on the manufacturing process.

Women in the Electronics Industry

Speaker: Billi Curtin, ITW Contamination Control Electronics
Women can’t be truly successful in the electronics industry, can they?  Billi Curtin sure thinks so. As a Regional Sales Manager for ITW Contamination Control Electronics, manufacturers of the Chemtronics, Techspray, and Plato brands, Billi is responsible for developing and executing the sales strategy of precision cleaners and associated consumables within the electronics market.

Abstract: It is not easy being a woman in the electronics industry.  We are strong ladies who have chosen to flaunt convention and work in a traditionally male-dominated field.  However in doing so, we often struggle with feelings of isolation, frustration, and anger. But why? Is it due to the patronizing comments from male coworkers, the gender wage gap, the lack of work-life balance, or simply because the “thick skin” you’ve had to develop over the years isn’t really that impervious?Regardless of the reasons, tapping into sources of empowerment, not blame, are key.

Completely bypassing social commentary on gender issues, this presentation will focus on tools and techniques to identify personal strengths and leverage them to neutralize gender-bias, silence your critics, avoid gender-based pitfalls without ostracism in the workplace, influence and lead (even without authority), and gain recognition and respect from your male counterparts.

Rework 101
 Viswam Puligandla
Get an exclusive look at the latest SMTA online training course, Rework 101, to close out the expo!
Bio: Industry veteran, Viswam Puligandla, Ph.D., will step through the basic rework process for both SMT and through-hole components. 
Abstract: Learn about critical temperature and moisture considerations, heating methods, types of acceptance criteria, and more. This course is intended for entry-level technicians or operators, engineers new to the industry, or even someone who has been away from the process for a while.
Topics Covered:

  • Rework, Repair and Modification Definitions
  • Rework Temperature Considerations
  • Moisture Sensitivity
  • Rework Equipment
  • Basic Process Steps
  • Rework Process Flow Chart Examples
  • Rework of Surface Mount Components
  • Rework of Insertion Mount Components
  • Board Repair
  • Acceptance Criteria

Thank you, sponsors!

Breakfast Sponsor - Precision Technology, Inc.

Technical Sessions Sponsor - Kurtz Ersa

Lunch Buffet Sponsor - NPI Technologies

Door Prize Sponsor - SVTronics

Tote Bag Sponsor - Element

March 21

Houston Chapter: Houston Expo & Tech Forum  +

Stafford Center

Please join us for our 2019 Houston SMTA Expo & Tech Forum at the Stafford Centre, 10505 Cash Road, Stafford, Texas 77477.  If you look forward to seeing the latest products and services in the industry and an opportunity to enjoy presentations by experts in our profession, you won’t want to miss this show!


Come see over 60 local and national tabletop exhibitors. Free lunch from 12:00 Noon to 12:45 P.M catered by Kelley's Country Cookin and lots of chances to win door prizes. We’ll also have drawings after each technical session. You must be present to win.


This is a free show for attendees. We are pleased to offer another outstanding technical program with information and technology presented by industry leaders to keep your skills up to date!


To register for the show, go to and register in the attendee section.

March 25

FREE Pre-Conference Webinar: Harsh Environment Failure - Causes & Cures  +

Organized by SMTA Europe Chapter

Monday 25th March at 2.30pm UK Time (10:30am US Eastern Daylight Time)

Join Keith Bryant & Bob Willis to find out more about the demands on Electronics in Harsh Environments as they showcase the  challenges faced by design and process engineers worldwide. Including some of the key issues that are faced in Power Electronics, Automotive, High Voltage, Assembly and High Reliability Products.

For the third year running SMTA Europe present the Electronics in Harsh Environments Conference and Exhibition 2-4th April in Amsterdam for more information visit:

Still unsure if you should be in Amsterdam or need more info to convince your boss.  This is an ideal way of seeing in advance some of the people you will meet and things you will learn from industry experts, plus you will be able to show examples of what you have learned on the different failure modes in electronics.

By attending this FREE webinar, you also have the opportunity of winning a FREE pass to attend one day of the conference!

Topics include:

  • High Temperature
  • Condensing Environments
  • Water Immersion
  • Mechanical Strain
  • Corrosive Environments

March 29

Penang Chapter: SMTA Penang Chapter Free Webinar  +


Presenters: Dr. Mike Bixenman and Debbie Carboni, KYZEN Corporation
Highly dense Printed Circuit Assemblies build in more functionality using leadless and bottom terminated components. As these components reduce in size, the distance between conductors narrows. Reliability of these devices requires a high level of cleanliness, especially residues that are ionic in nature. The cleanliness question has been a topic area of concern over the past five years. To address this growing concern IPC – J-STD-001G, Amendment requires objective evidence to establish acceptable and unacceptable levels of residues on production hardware.
This webinar will teach important design variables that impact electrochemical reliability of Electronic Devices. The significant elements of influencing residues levels include:
•           Flux or flux-bearing materials
•           Cleaning agents
•           Changes in manufacturing suppliers
•           Changes in solder mask
•           Changes in printed board fabrication processes or surface metallization
•           Geographic change in manufacturing location
The webinar will identify and teach methods for screening materials and processes. From these methods, the attendees will gain a better understanding toward identifying and analyzing risks associated with contamination. They will learn about advanced control measures to eliminate these risks and their effects. The webinar will teach new methods for monitoring the effectiveness of these controls.

March 29

FREE Webinar: Key Design Variables that Impact Electrochemical Reliability of Electronic Devices  +

Organized by SMTA Penang Chapter

Penang Malaysia

Friday 29th March @ 11:00am Penang Time GMT+8
(Thursday, March 28 @ 11:00pm US Eastern Daylight Time GMT -4)

Presenters: Dr. Mike Bixenman and Debbie Carboni, KYZEN Corporation

Free for all – only members will get access to recorded presentation!


Highly dense Printed Circuit Assemblies build in more functionality using leadless and bottom terminated components. As these components reduce in size, the distance between conductors narrows. Reliability of these devices requires a high level of cleanliness, especially residues that are ionic in nature. The cleanliness question has been a topic area of concern over the past five years. To address this growing concern IPC – J-STD-001G, Amendment requires objective evidence to establish acceptable and unacceptable levels of residues on production hardware.

This webinar will teach important design variables that impact electrochemical reliability of Electronic Devices. The significant elements of influencing residues levels include:

  • Flux or flux-bearing materials
  • Cleaning agents
  • Changes in manufacturing suppliers
  • Changes in solder mask
  • Changes in printed board fabrication processes or surface metallization
  • Geographic change in manufacturing location

The webinar will identify and teach methods for screening materials and processes. From these methods, the attendees will gain a better understanding toward identifying and analyzing risks associated with contamination. They will learn about advanced control measures to eliminate these risks and their effects. The webinar will teach new methods for monitoring the effectiveness of these controls.


About the Presenters

Dr. Mike BixenmanDr. Michael Bixenman, Chief Technology Officer (CTO) and cofounder of KYZEN, has over 30 years of experience in the design of electronic assembly cleaning materials and process integration. Sharing his research, knowledge and experience is Mike’s passion as he is the author and co-author of over 100 technical papers and presentations presented all over the world. He believes in the power of collaboration, by working with others to solve problems quickly. An active member of several industry associations, he has chaired and led many committees, symposiums, and task groups that are committed to understanding the cleaning and reliability challenges of today’s ever-changing electronics industry. Dr. Bixenman holds four earned degrees, including a Doctorate in Business Administration (DBA).


Debbie CarboniDebbie Carboni's involvement in the electronics industry started more than 20 years ago and has encompassed a diverse set of experiences that give her a deep knowledge of cleaning chemistry, equipment and processes. Having been with KYZEN for over 10 years, Debbie is dedicated to providing customers and partners with the highest quality customer support and service as well as ensuring that they receive the best technical solutions. Her extensive real world experience helps guide engineers during qualification to ensure success in production conditions. Debbie’s dedication to the electronics industry has included a number of roles and voluntary positions in many of the industry’s leading associations, and is currently serving her second term on the SMTA Board of Directors as the Vice President of Expo. After attending Northern Arizona University, Debbie remains knowledgeable through numerous technical conferences and leading-edge research. Debbie has authored and co-authored several papers related to cleaning solutions and regularly presents at and attends industry events such as; SMTA International, Cleaning and Coating Symposium, ICSR, Apex. Always willing to share, Debbie is an excellent resource with lots of experience and passion.

Looking for a local chapter event? Check the Chapter News page for more events.
SMTA Headquarters
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Phone +1 952.920.7682
Fax +1 952.926.1819