Calendar of Events
Oregon AOI & X-Ray Masterclass +
Hillsboro , OR 97006
Instructor: Keith Bryant, SMTA Europe
Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
The first half of the course will cover all aspects of X-Ray inspection. We will talk about the basics of the technology, in-line, off-line and at-line comparisons, looking at the positives and negatives of each. The latest hardware and software developments, 2D, 2.5D, and 3D (CT) will be explained and compared, together with images of demanding applications.
The second half of the event will cover all aspects of AOI Technology, from basic 2D through to advanced 3D technology and the technologies between. We'll be looking at the latest 3D advances launched at APEX the week before this event and contrasting them to earlier systems.
We will finish with an overview of Industry 4.0 for Inspection and the related Management Information Systems which take inspection into the realm of the SMART Factory of the Future.
All those attending will have the option to download Mark's guide, "BGA and Area Array Process Defects - Causes & Cures" when it is released later in February.
About the Instructor:
A fully qualified engineer, Keith has over thirty years’ experience in Electronics Manufacturing. He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews.
He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years’ experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years.
Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.
From 2017 to 2019, he was Global Sales Director of the leading X-ray manufacturer. Recently he reverted to a Consultancy role, allowing him more freedom to pursue other projects, including i4.0.
He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.
Contact Karen Frericks at 952-920-7682 with questions.
Puget Sound Chapter: February Chapter Meeting - Recent Advances in X-ray and Industry 4.0 for Inspection +
Applied Technical Services (ATS) 6300 Merrill Creek Parkway #A100 Everett, WA 98203
|A fully qualified engineer, Keith has over thirty years’ experience in Electronics Manufacturing. He started his career with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years’ experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years.
Keith is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles. Between 2014 and 2017 he was working as a technology consultant assisting many of the major industry names.
In July 2017, he joined YXLON International as Global Director Electronics Sales.
He has been Chairman of the SMART Group for over 10 years, this is the leading Electronics Manufacturing Technology Association in Europe.
Webinar: Solder Paste Evaluation & Simple Tricks of the Trade +
Monday 11th February @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)
Presenter: Bob Willis, SMTA Europe
Solder paste quality and performance is significantly important and considerable engineering goes into its production. Selecting the best materials for your product and assembly process is key to high yield and your customers' satisfaction. Solder paste must be compatible with your equipment and other processes you use like cleaning, coating and electrical test. Working with suppliers to achieve the best performance is vital but so is periodic review of materials used.
There are always improvements being made to printing and jetting technology and it is important that engineers consider whether there are technical or commercial reasons to change. We look at common testing methods and some of the simple shop floor techniques used over the years to understand the different types of process failures.
Each delegate will receive a copy of all of the slides presented plus a set of posters on soldering to print on site for future training.
- Solder paste type
- Low & high temperature alloys
- Solder beading
- Solder slump
- Reflow spitting
- Flux condensation
- Printing trials & test boards
- Common paste & print failures
After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.
All webinar times shown are UK time – to check your local time in your countries click here
Pan Pacific Microelectronics Symposium 2019 +
Central Texas (Austin) Chapter: CTEA Electronics Symposium at Virtex +
Central Texas Electronics Association
Electronics Design, Manufacturing & Test Symposium
Tuesday, February 12, 2019
Virtex Enterprises at 12234 N. I-35 & W. Yager Lane, Bldg A
2:00 - Registration Begins
2:30 - Welcome and Virtex Enterprises Factory Overview
2:35 - Virtex Enterprises Factory Tours
3:35 - " Cybersecurity Considerations in a Manufacturing Environment ”
Brad Heath, CEO, Virtex Enterprises
4:05 - " When Artificial Intelligence (AI) Meets Human Intelligence (HI): A Road to World Wide
Intelligence (WWI) "
Adil Dalal, Solution Architecture Director, Hitachi Global Digital Holdings
4:35 - Break & Networking
4:50 - " Can Electrolytic Capacitors Meet the Demands of High Reliability Applications? ”
Greg Caswell, Sr Member of Technical Staff, DfR Solutions
5:20 - " Running Reliably: The World Through the Lens of a Globetrotting Reliability Engineer "
Cheryl Tulkoff, Corporate Quality & CI Director, National Instruments
5:50 - Door Prizes Drawing & Closing Remarks
6:00 - Food & Refreshments Served and More Networking
RSVP to Bob Baker at: firstname.lastname@example.org
No charge for SMTA and IMAPS members; $10 for all non-members >> (Cash or Check ONLY!)
Students can also attend for FREE!
Virtex Enterprises at 12234 North I-35 & W. Yager Lane, Bldg A, Austin, Texas
See Map at: (Map to Virtex)
In Central Texas, SMTA and IMAPS work together as the Central Texas Electronics Association (CTEA)
Webinar: BGA and Area Array Process Defects - Causes & Cures - FREE for Members! +
Tuesday, February 12, 2019 | 2:30pm GMT (9:30am US Eastern Time)
Presented by: Keith Bryant, SMTA Europe
Free for members!
What You Can Learn From This Course:
This webinar is FREE for members to attend and is provided by SMTA Europe. The webinar will be presented by Keith Bryant and will also include a brand-new guide to defects produced by Keith and available to SMTA members. During the presentation the methods of detecting defects in manufacture will be discussed and the growing need for more advanced methods.
With many years working in PCB manufacture and assembly Keith has investigated most defect types. As component and substrate technology becomes more advanced, new issues require modification to inspection methods which will be considered during the session.
The BGA & Area Array Defect Guide is a colour booklet featuring both optical and x-ray examples of common and not so common defects. The examples may be cosmetic or electrical failures found during investigation in manufacture. Each defect type is discussed with possible causes and cures. This guide is one of many guides being made available from SMTA.
During the webinar the following will be discussed:
- Area Array Inspection methods
- Inspection criteria
Selected defect types include:
- Head on Pillow
- Solder wicking
- Solder beads
- PCB plating variations
- Plating voids
San Diego Chapter: 02/13/2019 Chapter Meeting -ESD Control in the SMT Assembly EPA +
HME, 2848 Whiptail Loop Carlsbad, CA 92010
ESD Control in the SMT Assembly EPA
Presented by– Gregg Heckler -Regional Sales Manager Desco & Henry Salgado -Regional Manager SCS.
Until the invention of surface mounted electronic components and the automated equipment to place them, ESD control was mostly confined to operators sitting at a work station. SMT devices are not only smaller, and in most cases more ESD Sensitive, but the environment in which they are handled requires more operator mobility.
While there are multiple Technical Requirements in a complete ANSI/ESD S20.20-2014 ESD Plan, proper mobile personnel grounding, cart grounding, ionization, and ground monitoring should be a focus and is essential in an SMT EPA. In addition, due to the greater ESD sensitivity (lower Class) and automation assembly speed, ESD Event Detection and data acquisition is also becoming a necessary to reduce ESD damage and increase yields. You may have all or most of the ESD control you think you need, but do you know if it works?
The vendor presentation will cover the above topics and help you to not only create the best ESD control in your SMT area but verify its performance as well.
Gregg Heckler, Western Regional Sales Manager for Desco, has been with the company for 24 years. He was one of Desco’s independent sales reps before that. Gregg has 38 years of experience in ESD control for electronics assembly. He has also worked for other manufacturers of static control products such as Richmond Technology, Tech Spray, and ESD Systems. Gregg is an iNARTE Certified ESD Technician who specializes in helping electronics manufacturers develop and implement ESD control programs.
Henry Salgado Regional Manager for Western US and Mexico based in Chino, CA, has been with SCS Static Control Solutions since 2016. He is a former marine and has 16 years in GI/Bill related education administrative roles.
Heartland (Kansas, Missouri) Chapter: Voiding under BTCs / Solder Preforms +
Zarda Bar-B-Q 11931 W 87th St Pkwy, Lenexa, KS 66215
We are excited to announce the SMTA Heartland Chapter's 1st event of 2019!
It will be on Feb 13th, 2019 at Zarda BBQ in Lenexa, KS and feature guest speaker, Kim Flanagan, Technical Support Engineer at Indium Corporation. Kim will discuss two topics: Voiding under BTCs and Solder Preforms. The meeting will also include a meal catered by Zarda BBQ.
Doors will open at 5pm and the meeting will start at 5:30pm.
Price is $15 for members and $25 for non-members.
Please RSVP as soon as possible.
Kim Flanagan is a Technical Support Engineer based at the Indium Corporation who serves customers in the South-West and South-East US, and also Eastern Canada and Puerto Rico.
Kim provides technical support, including guidance and recommendations to customers related to process steps, equipment, techniques, and materials. In addition, she delivers technical training to staff and industry partners.
Kim is a Certified SMT Process Engineer recognized by the Surface Mount Technology Association. She has a background in Physics and has held previous positions in Quality Engineering.
Capital (DC) Chapter: SMTA Capital Chapter Meeting - Presentation and Live Demo on “Non-Destructive BGA/Area Array Component Rework” +
PACENTER Training Facility
Date: February 19, 2019 @ 5pm
Director of Marketing & Training
PACENTER Training Facility
6605 Selnick Drive #C
Elkridge, MD 21075
- 5:30 – 6:15: Registration/Dinner
- 6:15 – 7:15: Presentation
- 7:15 – 7:45: Demonstration
“Non-Destructive BGA/Area Array Component Rework.”
In the past 20 years, such mundane operations as soldering, desoldering and component replacement have become complicated by extreme micro-miniaturization, the use of lead-free solders, new thermally challenging pc boards, heat-sinking bottom terminated components and intricate component packages that are difficult to rework or install. One area that presents unique challenges is BGA/Area Array rework. Modern boards that use these components are more technically demanding than ever, requiring skilled operators who are highly competent at accomplishing delicate, intricate soldering and rework tasks. Unfortunately, many operators will cause more damage to the assembly or components due to his/her rework actions. As a result, many manufacturers struggle to repair or rework boards, opting to throw away lower value boards or hire outside contractors to perform the more difficult repairs. This presentation will review current techniques and procedures for performing highly reliable, high-quality rework and repair on some of the more difficult BGA packages and will include live demonstrations of BGA rework using available convective and infrared heating techniques. The presentation will address typical BGA/area array components, heating technologies (convection and infrared), the importance of bottom side preheating, flux application, solder paste stenciling, device alignment methods and thermal profiling techniques, followed by a live demonstration of BGA rework.
About the Speaker:
Aaron Caplan is the Director of Marketing & Training for PACE Worldwide, a company solely focused on providing innovative, cost-effective solutions in hands-on soldering, rework and repair of advanced electronics to companies and government around the globe for well over 50 years. Mr. Caplan has been involved in electronics manufacturing technology since the 80's and is an acknowledged expert in Miniature/Microminiature Electronics Repair. A CIT in IPC-7711/IPC 7721, he provides technical expertise in teaching of non-destructive PCB rework/repair techniques, educating industry on how to properly utilize these techniques. In addition to his marketing duties, Mr. Caplan also coordinates the Training Department and Video Production Team, providing direction for a wide variety of video production projects.
Massachusetts (Boston) Chapter: Printing and Cleaning +
ITW EAE (Electrohic Assembly Equipment; 35 Parkwood Drive, Suite 10; Hopkinton, MA 01748
“Conquering Your Latest Challenge in Miniaturization”
- High quality stencils with nanocoatings
- Board support and snugging
- Proper alignment between PCB and stencil
- Underwiping solvents and textiles
- High quality solder paste
- The importance of separation parameters on paste release
- Live demonstrations of printing on the SMTA Miniaturization Test Vehicle
- Automated Solder Paste Inspection
- Visual inspection under a digital microscope
- Videos of solder paste release from the stencil
Chrys Shea, of Shea Engineering Services will be available to answer questions about the new SMTA test board, the DOES embedded in it for smaller components, and update the commercial launch schedule of the board through Practical Components.
The review and revision to J-STD-001 on ionic cleanliness has a new protocol. The new standard changes how we qualify the cleanliness of our assemblies.
Cleaning expert Debbie Carboni will present: (Click here to download this presentation)
· An overview of the new protocol
· What the changes mean for assemblers
· The impact on process qualification and process control
· Generating “Objective Evidence” for level 1 and level 2 qualification
All attendees will see:
· New test coupons for qualifying, optimizing and monitoring cleanliness
· Passed and Failed test coupons
An open Question and Answer session will enable attendees to discuss their specific process needs and changes to gain compliance with the new standard.
|Date:||Tuesday, Feb. 19, 2019|
|Time:||5:00 PM to 9:00 PM|
|Location:||35 Parkwood Drive, Suite 10; Hopkinton, MA 01748|
|Cost:||SMTA/iMAPS/IEEE Members $25 ($30 after Thursday, Feb. 14, 2019)
Non-Member $30 ($35 after Thursday, Feb. 14, 2019)
Retired-Unemployed Member $20 ($25 after Thursday, Feb. 14, 2019)
Student Member $10 ($15 after Thursday, Feb. 14, 2019)
|5:00 PM||Registration, Socializing, Networking|
|5:00 – 6:00 PM||Dinner, Socializing, Networking|
|5:45 – 6:00 PM||Announcements, Future Events, and Printing Intro.|
|6:00 – 6:45 PM||Printing Presentation (Featured 0201 Chip Size)|
|6:45 – 6:50 PM||IPC J-STD-001 Intro.|
|6:50 – 7:35 PM||IPC J-STD-001, Revision G, Amendment 1|
|7:35 – 7:45 PM||Q&A|
|7:45 -8:30 PM
|Printing Demo & Tour
Our 2018 Expo Sponsors:
President : Michael G. Jansen (Raytheon Company)
Vice President : Peter Bigelow (IMI Inc.)
VP of Technical Programs : Joe Kwong (Draper)
iMAPS NE - March 12, 2019 - "Extending Copper Plating Technology to New Sturcutures in Advanced Packaging" at the Boxboroguh Regency Hotel & Conference Center, Boxborough, MA - for more info visit: http://events.r20.constantcontact.com/register/event?oeidk=a07eg3jrnszf9fc4f73&llr=dntnvbkab
SMTA - Tuesday March 19, 2019 - Photo Etch Technology, Lowell, MA
iMAPS NE - May 7, 2019 – 46th Symposium & Expo
SMTA - Tuesday Oct. 8, 2019 - 4th New England Expo
Webinar: BGA Reballing- Theory and Hands On +
This webinar has been cancelled!
Tuesday, February 19, 2019 1:00pm to 2:30pm Eastern
Presented by: Bob Wettermann, BEST Inc.
What You Can Learn From This Course:
This webinar is a “how to” guide for reballing intended for PCB rework and repair depots as well as device reclaimers. These sessions will take those interested in reballing devices through the entire process of setting up the equipment, developing and verifying the process. The first topic will cover the need for reballing of BGAs, CSPs and other devices. The second section will focus on the equipment set recommended for reballing and the third section the various process steps for reballing a device. A variety of different methods for both deballing and reballing will be discussed with the various advantages and disadvantages discussed to each approach. Both plastic-packaged parts as well as ceramic parts reballing will be discussed. Inspection of the reballed components, the type of reliability testing data currently publicly available will be reviewed as well as some ideas for developing your own specifications if you want to outsource this activity.
This webinar is designed for process engineers, rework technicians and others interested in repairing electronics.
Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.
Carolinas (NC, SC) Chapter: SMTA Carolinas Chapter 2019 Kickoff Mixer +
Fullsteam Brewery in Durham, NC
Join your newly elected Carolinas Chapter Board of Directors as they welcome 2019 with some local craft beers and light fare.
Thanks to the support of our sponsors, we are able to provide two (2) drink tickets and food without any cost to the attendees.
Doors will open at 5:30 on Wednesday 20 Feb 2019
What's more, this event is only two week before our first info session.
On 06 March, the Chapter will explore Conformal Coating technologies including plasma etch, jetting, and two-part auto mixing with PVA at GMI in Mooresville, NC
More information to come...
Huntsville Chapter: HSV Chapter SMTA - ASQ-1503 Joint Meeting Nanotechnology Applications +
The Huntsville Chapter SMTA, ASQ-1503, and Adtran welcome you on Feb 26, 2019 from 5:30-7:30pm to bring a discussion on Nanotechnology Applications.
Speaker Info: Ms. Jennifer Miller
Holds a BS degree in Media Communications and is working on a BS degree in Physics from UAH. She has been researching nanoparticles of materials' reflected light in order to determine material Composition and identification.
Keynote Speaker Info:
Dr. Eugene Edwards
Rocket Scientist (Retired)/University Research Advisor/Minister
Founder, Save The Youth Inc. (Bessemer, Alabama)
Dr. Eugene Edwards was born in Fairfield (Alabama). He grew up in Bessemer (Alabama) where he was a product of Charles F. Hard Elementary School and a graduate of Jackson Solomon Abrams High School.
Dr. Edwards received a
- Bachelor of Science degree in Electrical Engineering Technology from Alabama A&M University (Huntsville, Alabama);
- Master of Science degree in Electrical Engineering from Howard University (Washington, D.C.);
- PhD in Ministerial Education from KME University (Athens, Alabama)/Freedom Bible College of Arkansas.
- Certification in Fiber Optics Manufacturing from California State Polytechnic University (Pomona, California)
- Certification in Optical Fiber Engineering from George Washington University (Washington, D.C.)
- And served as a Professor of Electrical Engineering at Alabama A&M University (Huntsville, Alabama).
Dr. Edwards was previously a Research Fellow at NASA’s Marshall Space Flight Center (Huntsville, Alabama), and retired as a Rocket Scientist at the U.S. Army Aviation Missile Research Development and Engineering Center (Huntsville, Alabama), where he has many patents/inventions, numerous journal papers, and was co-author of two books on Nanotechnology.
Dr. Edwards is Founder, Pastoral Leader, and/Chief Executive Officer for Save The Youth Incorporated, Headquartered in Bessemer (Alabama), where he provides oversight for education, youth programs, and parental counseling.
He is a Music Director and Gospel Recording Artist that has appeared with numerous major recording artists including
- Walter Hawkins
- The Mississippi Mass Choir
- Dottie Peoples
- Luther Barnes
- Mighty Clouds of Joy
- Edwin Hawkins (performer of the hit song “OH HAPPY DAY”)
- The Platters
- and many others
5:30 – 6:00 networking
6:00 – 6:30 dinner
6:30 – 7:15 intro & presentation
7:15 – 7:30 wrap-up
Location: Adtran, 901 Explorer Blvd, Huntsville, Al
ADTRAN’s Fountain View Conference (2nd Floor, East Tower)
All meeting attendees must enter through the South entrance (adjacent to shipping dock).
Directions from I565:
- Take exit 14B to Al-255N/Research Park Blvd
- Take exit Bradford Drive West
- Turn left Explorer Blvd (heading south)
- Turn right into parking lot, merge left and follow parking lot to pond
- Building entrance will be on north of parking lot
Dinner: Catered by Adtran Café:
Chicken Carbonara Pasta Bake
Caesar Salad or Toss Salad
Sautéed Squash and Zucchini
Sweet tea, Un-Sweet tea, and water
SMTA Members: $10 with RSVP
SMTA Non-Members: $13 with RSVP
No RSVP – Cash at the Door - $15
For members who cannot attend in person, we would like to offer a GoToMeeting option. Please contact us at HSVSMTA@gmail.com
Two ways to RSVP SMTA:
RSVP ASQ-1503: Brian Dunbar at email@example.com