Calendar of Events
Oregon Chapter: Chapter Tutorial +
AOI & X-Ray Masterclass
A fully qualified engineer, Keith has over thirty years’ experience in Electronics Manufacturing. He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews.
He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years’ experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years.
Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.
from 2017 to 2019 he was Global Sales Director of the leading X-ray manufacturer. Recently reverting to a Consultancy role allowing him more freedom to pursue other projects, including i4.0.
He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.
AOI and X-Ray Masterclass
The first half of the course will cover all aspects of X-Ray inspection, we will cover the basics of the Technology, in-line, off-line and at-line comparisons, looking at the positives and negatives of each. The latest hardware and software developments, 2D, 2.5D, and 3D (CT) will be explained and compared, together with images of demanding applications.
The second half of the event will cover all aspects of AOI technology, from basic 2D through to advanced 3D technology and the technologies between. Looking at the latest 3D advances launched at APEX the week before this event and contrasting them to earlier systems.
We will finish with an overview of Industry 4.0 for Inspection and the related Management Information Systems which take inspection into the realms of the SMART Factory of the Future.
All those attending will have the option to download my guide ‘BGA and Area Array Process Defects - Causes & Cures’, when it is released later in February
Webinar: Solder Paste Evaluation & Simple Tricks of the Trade +
Monday 11th February @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)
Presenter: Bob Willis, SMTA Europe
Solder paste quality and performance is significantly important and considerable engineering goes into its production. Selecting the best materials for your product and assembly process is key to high yield and your customers' satisfaction. Solder paste must be compatible with your equipment and other processes you use like cleaning, coating and electrical test. Working with suppliers to achieve the best performance is vital but so is periodic review of materials used.
There are always improvements being made to printing and jetting technology and it is important that engineers consider whether there are technical or commercial reasons to change. We look at common testing methods and some of the simple shop floor techniques used over the years to understand the different types of process failures.
Each delegate will receive a copy of all of the slides presented plus a set of posters on soldering to print on site for future training.
- Solder paste type
- Low & high temperature alloys
- Solder beading
- Solder slump
- Reflow spitting
- Flux condensation
- Printing trials & test boards
- Common paste & print failures
After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.
All webinar times shown are UK time – to check your local time in your countries click here
Pan Pacific Microelectronics Symposium 2019 +
Webinar: BGA and Area Array Process Defects - Causes & Cures - FREE for Members! +
Tuesday, February 12, 2019 | 2:30pm GMT (9:30am US Eastern Time)
Presented by: Keith Bryant, SMTA Europe
Free for members!
What You Can Learn From This Course:
This webinar is FREE for members to attend and is provided by SMTA Europe. The webinar will be presented by Keith Bryant and will also include a brand-new guide to defects produced by Keith and available to SMTA members. During the presentation the methods of detecting defects in manufacture will be discussed and the growing need for more advanced methods.
With many years working in PCB manufacture and assembly Keith has investigated most defect types. As component and substrate technology becomes more advanced, new issues require modification to inspection methods which will be considered during the session.
The BGA & Area Array Defect Guide is a colour booklet featuring both optical and x-ray examples of common and not so common defects. The examples may be cosmetic or electrical failures found during investigation in manufacture. Each defect type is discussed with possible causes and cures. This guide is one of many guides being made available from SMTA.
During the webinar the following will be discussed:
- Area Array Inspection methods
- Inspection criteria
Selected defect types include:
- Head on Pillow
- Solder wicking
- Solder beads
- PCB plating variations
- Plating voids
San Diego Chapter: 02/13/2019 Chapter Meeting "Arthur C Clarke, Conscious Competence, and ESD" +
Heartland (Kansas, Missouri) Chapter: Voiding under BTCs / Solder Preforms +
Zarda Bar-B-Q 11931 W 87th St Pkwy, Lenexa, KS 66215
We are excited to announce the SMTA Heartland Chapter's 1st event of 2019!
It will be on Feb 13th, 2019 at Zarda BBQ in Lenexa, KS and feature guest speaker, Kim Flanagan, Technical Support Engineer at Indium Corporation. Kim will discuss two topics: Voiding under BTCs and Solder Preforms. The meeting will also include a meal catered by Zarda BBQ.
Doors will open at 5pm and the meeting will start at 5:30pm.
Price is $15 for members and $25 for non-members.
Please RSVP as soon as possible.
Kim Flanagan is a Technical Support Engineer based at the Indium Corporation who serves customers in the South-West and South-East US, and also Eastern Canada and Puerto Rico.
Kim provides technical support, including guidance and recommendations to customers related to process steps, equipment, techniques, and materials. In addition, she delivers technical training to staff and industry partners.
Kim is a Certified SMT Process Engineer recognized by the Surface Mount Technology Association. She has a background in Physics and has held previous positions in Quality Engineering.
Space Coast (Melbourne FL) Chapter: Study of Void Formation During Soldering +
Mack Technologies 7505 Technology Drive Melbourne, FL 32904
Space Coast (Melbourne FL) Chapter: 2019 Winter Golf Classic +
Duran Golf Club
The links style characteristics and wide open playability allows golfers to "Play golf" rather than beating the bushes looking for stray golf balls. Check out the course details on the link above. Consider being a sponsor for this event !
Capital (DC) Chapter: SMTA Capital Chapter Meeting - Nondestructive BGA/Area Array component rework BGA live demonstration at PACE +
PACE - Elkridge Engineering & Training Center
This is a Surface Mount Technology Event for Government Specification Industry Organizations, Engineers, Sales, Production Control, Marketing, and Manufacturing.
Its our pleasure to invite you to our Surface Mount Technology Event on February 19th 2019 at PACE. You will get to see a live demonstration as well as an excellent presentation. There will also be great food! Do not miss this event. Do not hesitate to get in touch with us should you have any questions. We hope to see you there.
SMTA Capital Chapter Team!!!
Non-Destructive BGA/Area Array Component Rework
Abstract: In the past 20 years, such mundane operations as soldering, desoldering and component replacement have become complicated by extreme micro-miniaturization, the use of lead-free solders, new thermally challenging pc boards, heat-sinking bottom terminated components and intricate component packages that are difficult to rework or install. One area that presents unique challenges is BGA/Area Array rework. Modern boards that use these components are more technically demanding than ever, requiring skilled operators who are highly competent at accomplishing delicate, intricate soldering and rework tasks. Unfortunately, many operators will cause more damage to the assembly or components due to his/her rework actions. As a result, many manufacturers struggle to repair or rework boards, opting to throw away lower value boards or hire outside contractors to perform the more difficult repairs. This presentation will review current techniques and procedures for performing highly reliable, high-quality rework and repair on some of the more difficult BGA packages, and will include live demonstrations of BGA rework using available convective and infrared heating techniques. The presentation will address typical BGA/area array components, heating technologies (convection and infrared), the importance of bottom side preheating, flux application, solder paste stenciling, device alignment methods and thermal profiling techniques, followed by a live demonstration of BGA rework.
Aaron Caplan Biography: Aaron Caplan is the Director of Marketing & Training for PACE Worldwide, a company solely focused on providing innovative, cost-effective solutions in hands-on soldering, rework and repair of advanced electronics to companies and government around the globe for well over 50 years. Mr. Caplan has been involved in electronics manufacturing technology since the 80's and is an acknowledged expert in Miniature/Microminiature Electronics Repair. A CIT in IPC-7711/IPC 7721, he provides technical expertise in teaching of non-destructive PCB rework/repair techniques, educating industry on how to properly utilize these techniques. In addition to his marketing duties, Mr. Caplan also coordinates the Training Department and Video Production Team, providing direction for a wide variety of video production projects.
Webinar: BGA Reballing- Theory and Hands On +
Tuesday, February 19, 2019 1:00pm to 2:30pm Eastern
Presented by: Bob Wettermann, BEST Inc.
What You Can Learn From This Course:
This webinar is a “how to” guide for reballing intended for PCB rework and repair depots as well as device reclaimers. These sessions will take those interested in reballing devices through the entire process of setting up the equipment, developing and verifying the process. The first topic will cover the need for reballing of BGAs, CSPs and other devices. The second section will focus on the equipment set recommended for reballing and the third section the various process steps for reballing a device. A variety of different methods for both deballing and reballing will be discussed with the various advantages and disadvantages discussed to each approach. Both plastic-packaged parts as well as ceramic parts reballing will be discussed. Inspection of the reballed components, the type of reliability testing data currently publicly available will be reviewed as well as some ideas for developing your own specifications if you want to outsource this activity.
This webinar is designed for process engineers, rework technicians and others interested in repairing electronics.
Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.
Empire (Rochester, NY) Chapter: Member Appreciation Annual AHL Hockey Game +
Blue Cross Arena (Rochester, NY)
The SMTA EMPIRE Chapter has again secured tickets for "Party Deck" glass level viewing of the Rochester Americans AHL Hockey Team as they take on the Cleveland Monsters. Join us for this social mid-week gathering where you will literally come face to face with players crashing the boards!!
A limited number of FREE tickets are available. Claim yours today using the RSVP link below!
Rocky Mountain Expo & Tech Forum +
1701 Bryant Street
Denver, CO 80204
Mark your calendars and plan to attend what is expected to be the Rocky Mountain event of the year. The SMTA Rocky Mountain Chapter is now taking registration for their 2019 Expo. We are expecting a sold out event, connecting exhibitors, and bringing the latest technology to the Rocky Mountain region while presenting impactful and meaningful technical sessions for your continued professional growth. Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Backstage Tour of Mile High Stadium
As a special treat, we will have a backstage tour of Mile High Stadium for 25 attendees. Registrations are limited so book early. Cost for the tour is $25 per person – a bargain for the opportunity to go behind the scenes of the Denver Broncos. Tour will run at 1:00pm.
Click Here for Parking Information
- Exhibit Application
- Ad/Sponsor Application
- Please contact Expo Manager, Courtney Kalb, for questions or additional information.
Thursday, February 21, 2019
THANK YOU TO OUR TOTE BAG SPONSOR:
Free Technical Program & Schedule:
THANK YOU TO OUR REFRESHMENT SPONSOR:
Speaker: Bill Hargin, Z-zero
Everything that happens in the production of a PCB works against signal quality. The purpose of this session is to introduce design teams to the process of evaluating and selecting the right laminates early in the design process, prior to signal-integrity simulation, creating PCB stackups that meet the requirements of multi-layer boards that work right the first time, with reproducible results across multiple fabricators.
Attendees will be introduced to PCB laminate tradeoffs, the laminate-materials market, and will be exposed to cost-effective strategies for controlling loss and glass-weave skew.
Expo Hall Opens
Speaker: Chip Spangler, Ph.D., Aspen Microsystems, LLC
Micro BGA technology has reduced the size of the die package to be only slightly large than the die itself. At the heart of Micro BGA technologies is a combination of advanced materials combined with more wafer-level processing. While each of the major semiconductor assembly companies has their own variation on Micro BGA technology, many can be grouped into Fan-In or Fan-Out Wafer-Level Packaging (FI/FOWLP). The primary difference in these technologies is related to the size of the die vs the number and density of BGA solderballs. This paper reviews some of the major approaches to manufacturing MicroBGAs and discusses how these differences impact their use in an SMT process.
THANK YOU TO OUR LUNCH SPONSORS:
Tour of the Stadium
Speaker: Jason Fullerton, Alpha Assembly Solutions
As the demands from users push the electronics in the direction of “smaller, faster, better” in a number of applications, hardware designs are requiring SMT processes to use devices with continually decreasing pitch. This presentation will discuss the devices that are considered ultra-fine pitch technology, including leaded and leadless packages, area array packages, and passive devices. The effects on assembly materials and PCB technology will be discussed, as well as how these devices impact traditional SMT processes and advanced assembly processes that can be used in combination with or in lieu of traditional SMT.
Expo Hall Closes
Hosted Happy Hour by SMTA and the SMTA Rocky Mountain Chapter.
Cash Bar to follow from 4:00-4:30pm. Everyone is welcome!