Calendar of Events
Dallas Chapter: New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA’s and PCBF’s +
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA's and PCBF'sSpeaker: Robert Boguski, President, Datest
Get your tickets!HERE
AbstractRobert Boguski, President, Datest
1981 graduate of The University of San Francisco (BA Economics). Robert has worked in the electronics packaging and interconnect manufacturing and testing business, primarily in management positions, since he was a teenager (1975). 22 years in the bare board business, 12 years in the EMS business, and 14 years in the testing and test engineering business (Some overlap with EMS). Robert is the Owner and President of Datest, a test engineering and failure analysis company located in Fremont, California. Robert and/or his Company, Datest, are members of SMTA, IPC, and IEEE. Datest is also a member of the American Society for Nondestructive Testing (ASNT) as well as the Eurpoean Institute of Printed Circuits (EIPC). Since 2013 Robert has co-authored the Test and Measurement column for Circuits Assembly Magazine. Robert is also currently the President of the SMTA Silicon Valley Chapter.
Wisconsin Chapter: WI SMTA comes to Madison area ! Pro Active Engineering hosts Dale Lee on Wednesday November 6th +
Hello WI SMTA Members and Friends,
The WI SMTA Officer team is excited to be bringing a technical presentation and tour to the Madison area! Please join us on Wednesday November 6th when we welcome Dale Lee to present on BGA’s, LGA’s, QFN/DFN’s – Oh My, Can Traditional DFM Survive .
The detailed agenda is below. Please note that dinner and the technial presentation is off site from Pro Active at The Round Table and the facility tour will take place after (around 7pm)
- 4:30pm Registration and Networking
- 5:00 pm Welcome and Dinner
- 6:00pm BGA’s, LGA’s, QFN/DFN’s – Oh My, Can Traditional DFM Survive, Presented by Dale Lee
- 7:00 pm Facility Tour at Pro Active Engineering (350 Business Park Dr. Sun Prairie WI)
- 8:00 pm Meeting adjourned
Please spread the word for this great Technical Presenter and come see the Pro Active Engineering facility!
Ohio Valley Chapter: Encapsulates and Coatings Technical Meeting +
Lorain County Community College (DEC 132 A/B - 151 Innovation Dr, Elyria, OH 44035)
Building: Desich Entrepreneurship Innovation Center
Room: DEC 132 A/B
Date: Wednesday, November 6th 2019
- 9:00 am - 9:30 am Registration Check-in
- 9:30 am - 10:30 am Mike Skinner of Dow : General Overview of Tech. in Coatings
- 10:30 am - 11:30 am Jeff Bowin of Henkel: Low Pressure over mold
- 11:30 am - 12:30 pm Lunch
- 12:30 pm - 1:30 pm Jim Stockhausen of ELANTAS PDG Inc: Trends and Developments in Electronic Protection Materials
- 1:30 pm - 2:00 pm Johnny Vanderford : MEMS Programs and Updates
- 2:00 pm - 3:00 pm Facility Tour: LCCC Electronic Assembly Manufacturing Center (Sneak Peak)
Hotels and Accomodations:
- Homewood Suites by Hilton on RT 254, just call reservation and mention you are visiting LCCC.
- The Hampton Inn & Suites by the old Midway Mall is a sister property of the Homewood Suites so they may offer extended pricing for LCCC involved travelers. Mention -LCCC they should receive our rate or if they are a public organization a government rate may be available.
- A more ‘active’ area the DoubleTree by Hilton in Westlake provides good rates we work with Kim Barker and she can be reached at firstname.lastname@example.org or 440-617-2361.
- Stocker Center uses the Country Inn & Suites (Griswold Rd) for performers and they can be reached at email@example.com or 440-324-0099.
Massachusetts (Boston) Chapter: Evening Meeting at Raytheon Company in Andover, MA +
Raytheon Company, 350 Lowell Street, Andover, MA 01810
|Date:||Wednesday, November 6, 2019|
|Time:||4:00 PM to 9:00 PM|
350 Lowell Street, Andover, MA 01810
|Cost:||SMTA/IEEE/IMAPs Members $25; Non-Member $30|
|4:00 – 6:00 PM||
Registration and Sign in, Socializing, Networking
|4:15 – 6:00 PM||
Factory Tours: (every 15 min; duration 45 min.)
|6:00 – 7:00 PM||Dinner and Announcements (SMTA/IEEE/iMAPS)|
|7:00 – 7:15 PM||Raytheon Welcome by John Powers – Ops Mgr.|
|7:15 – 7:35 PM||Failure Analysis Capabilities - Recent Case Studies|
|7:35 – 8:00 PM||Using IPC Standards to Mitigate Counterfeit Risks|
|8:00 – 8:45 PM||Technical Presentation: QFN Voiding|
|9:00 PM||Raffle - Adjourn|
Failure Analysis Capabilities - Recent Case Studies
Prisco Tammaro, at Raytheon
Using IPC Standards to Mitigate Counterfeit Risks Click here to download this presentation
Cameron Shearon, Principal Materials Engineer at Raytheon
Cameron Shearon is a Principal Materials Engineer at Raytheon’s IDS Division, co-chair of IPC 1782, and a SMTA Distinguished Speaker. Cameron has given invited speeches at many international events. He earned a BS and MS in Materials Science and Engineering from North Carolina State University. He obtained a Physics minor for his BS and a Solid State Science minor for his MS.
Cameron initiated and chaired the development of IPC 1782, a global component traceability standard that contains four traceability levels for materials and four independent traceability levels for the process that was completed in record time with the help of many outstanding contributors, IPC Staff support, and his leadership. As a result of his contribution to this standard, Cameron received a Committee Leadership Award from IPC at IPC APEX EXPO 2017.
Prior to his current role, he has worked as a Process Engineer in a Wafer Fab, Failure Analysis Engineer and Product Safety Engineer in an R&D Environment, a Lead Quality Engineer with AT&T’s Global Supply Chain, and a Reliability Engineer with AT&T Labs.
Norman Armendariz, Ph.D. Engineering Fellow at Raytheon
Dr. Armendariz is an Engineering Fellow at Raytheon responsible for materials engineering design, materials analysis, process equipment development, and production support associated with the manufacturing of CCA- circuit card assemblies used in missiles, smart munitions, ground based radars, and mobile sensors across multiple US and international sites. Norm has over 20 years of industrial experience, having worked for Lockheed/NASA, Motorola, TI and Intel, and as Director of Labs / Asst. Engr. Prof. at American University. He holds an interdisciplinary PhD in Chemical Engr. from New Mexico State University, MS in Materials Science Engr. from the University of Illinois at Urbana-Champaign, and BS Metallurgical Engr. from Colorado State University, with 9 US patents and 27 peer-reviewed publications.
Our 2019 Expo Sponsors:
For more information visit: https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=22
To register for this event visit: Click Here or copy this address to your browser: https://smta.org/chapters/rsvp.cfm?BEE_ID=4790
Please use your full name when registering including your middle name in the first name block of the registration form. Registration dead line is Friday, Nov. 1st, 2019.
Additional Info: Safety eyewear are required to be worn in specific areas (safety glass will be provided for use while in these areas).
Atlanta Chapter: Chapter Meeting & Social +
Atlanta SMTA Patrons we want to say THANK YOU for your patronage and Non-Members we have a special just for YOU!
Come join us on November 7, 2019 at the latest addition to Atlanta’s growing Brew Masters Anderby Brewing https://anderbybrewing.com
This will be a social gathering and our technical presentation will be presented by Preston Smelt on Brewing and DRINKING Beer!
Individual Members this event is 100% FREE, you will get 2 Pints of your choosing from their taps and snacks.
Non-Member we would love to have you come join us. If you prefer to stay a Non-Member that’s okay, the event is $25 BUT if you sign up on or before the event to become an Individual Member, well you guessed it IT’S FREE! Sign up to be an individual member at https://www.smta.org/membership/
The Date and Time:
November 7, 2019 4:30-8PM
Peachtree Corners, GA 30092
Georgia Institute of Technology Student Chapter Chapter: Atlanta Chapter Meeting & Social Thursday +
Penang Expo and Tech Forum +
1 Solok Bayan Indah, Queensbay
11900 Bayan Lepas
Please see the Penang Chapter Page for More Information on Technical Sessions and Expo Materials.
Please see the Penang Chapter Page for More Information on Technical Sessions and Expo Participation.
Please complete the registration form and return to
Webinar: Low Temperature Solder Benefits and Process Concerns +
Monday 11th November @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)
Presenter: Bob Willis, SMTA Europe
The use of low temperature soldering is gaining interest in the industry to reduce cost, prevent component and PCB damage and improve reliability. It’s different but that does not mean it cannot be introduced into your process with existing process equipment. Generally speaking, solders used regularly in assembly reflow at over 220°C, low temperature solders reflow at under 180°C. There are some organisations predicting a large growth in low temperature materials in the next two to three years for multistep soldering.
Many companies have been using tin/bismuth alloys for some years reducing cost on PCBs and energy. Other companies have been using tin/indium for rework of lead-free area array packages with success. There are savings to be made even if the cost of the solder alloy is much more expensive provided you consider the total cost of manufacture. Bob produced the first book, video and interactive CD-ROM on pin in hole intrusive reflow, so he is in a good position to help engineers achieve high yields with low temperature materials.
- Why use low temperature solder
- Benefit over lead-free alloys
- Materials available
- Reflow soldering and rework results
- Reliability with mixed alloys
- Inspection results
In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.
All webinar times shown are UK time – to check your local time in your countries click here
productronica 2019 +
Future technologies, industry trends, growth markets. Investment decision-makers, industry experts. From around the world. At the right time and the right place. Only at the World's Leading Trade Fair for Electronics Development and Production. Welcome to productronica 2019.
Experience innovations up close and at a very early stage at the world’s leading trade fair. The two trend topics of this year's industry platform are Smart Maintenance and Smart Factory.
Houston Chapter: Houston/Gulf Coast Chapter November, 2019 Meeting +
Georgia Institute of Technology Student Chapter Chapter: Tech Talk by Eric Lange on “Engineering in Product Development” +
Indiana Chapter: SMTA Indiana's Final 2019 Symposium +
8225 E 56th St, Indianapolis, IN 46216
SMTA Indiana's Final 2019 SymposiumOur final symposium of 2019 takes place on November 19th, 2019 at Indesign Product Engineering and Development LLC. The purpose of this symposium is to delve into topics related to DFM for PCBs. The symposium will cover topics:
- DFM in PCB prototyping - by Michael Kidd - Mike is a PCB designer with over 30 years’ experience in new product development as a Senior Electrical Designer at Indesign and as a Member of the Technical Staff at AT&T Bell Labs. He has experience in multi-layer, double-sided, single-sided, blind and buried via printed circuit board technologies, as well as carbon inks, silver inks, flex circuits and surface mount technologies (Fine-pitch, BGAs). Mike also has experience with Cadence Allegro, OrCAD CIS and Mentor Graphics systems. He has designed PCBs for manufacture in many factories around the world and is well-versed in DFM and DFT. He is the team leader for Indesign’s ECAD group and serves at as the Engineering Services manager at Indesign. He has an A.S. degree in Industrial Drafting from Vincennes University. Mike is a Certified Interconnect Designer – CID.
- Low Temperature Solder: Developing a Mixed Alloy for property fusion - by Claire Hotvedt - Claire Hotvedt is a Product Development Specialist for the PCB Assembly business unit based at Indium Corporation Headquarters in Clinton, NY. She is responsible for facilitating the transition of new solder paste products from developmental stages into fully launched and marketable solutions. Claire al¬¬so oversees product characterization and creation of marketing material to assist the sales team.
Prior to joining Indium Corporation in 2018, Hotvedt held two engineering positions one at Orthogonal, Inc. and one at Bristol-Myers Squibb.
- Lean Six Sigma in relation to Continuous Improvement - by Tom Watson - Tom is the Continuous Improvement Manager at the Kimball Electronics Jasper, Indiana facility. Kimball Electronics is a leading contract manufacturer of durable goods electronics serving a variety of industries on a global scale.Tom will be speaking about how Kimball Electronics uses Lean Six Sigma to drive productivity improvements throughout the company. Tom has a Bachelor of Engineering in Marine Engineering from the State University of New York Maritime College and an MBA from Regis University. Tom is a Certified Master Black Belt.Tom is also the Chair of the Evansville-Owensboro Chapter of ASQ and holds the ASQ Certified Quality Engineer Certification.
In addition, we will get a chance to tour Indesign's Indianapolis facility. See our itinerary below:
|10:00 AM – 10:05 AM||Chapter Welcome||Mike Young|
|10:05 AM – 10:30 AM||InDesign Welcome||Ron Kern|
|10:30 AM – 11:10 AM||DFM in PCB prototyping||Michael Kidd
|11:10 AM – 11:20 AM||Break|
|11:20 AM – 12:00 PM||Durafuse LT: Developing a mixed alloy process for property fusion||Claire Hotvedt
|12:00 PM – 12:40 PM||Lunch|
|12:40 PM – 1:20 PM||Lean Six Sigma in relation to Continuous Improvement||Tom Watson
|1:20 PM – 1:30 PM||Break|
|1:30 PM – 2:00 PM||Indesign Facility Tour|
To RSVP please click here or copy the link below into your browser. Once you have RSVPed you will be redirected to PayPal. Once at PayPal you can use your personal PayPal account or pay via credit card as a guest. Please see the table below for the cost of attendance.
Cost of attendance and payment
|Before November 17, 2019||Early Registration|
|After November 18, 2019||Late Registration|
Please RSVP first and once you have done so you will be redirected to PayPal.
Indesign is located on the NE side of Indianapolis at 8225 East 56 Street. See map below
Advanced Electronics Assembly Conference +
Great Lakes (Chicago) Chapter: SMTA Great Lakes – Fuji America Corporation Tour & Head-In-Pillow Presentation +
Thursday, November 21st, 2019
|Location:||Fuji America Corporation|
|171 Corporate Woods Parkway|
|Vernon Hills, IL 60061|
|3:00-3:30 pm||Fuji America Corporation Tour/Demo|
|3:30-4:00 pm||Presentation: “Test Method for Head in Pillow” – Gene Dunn|
|4:00-4:30 pm||Presentation: “Recent Advances in the 2d and 3d X-ray technology for detection of Head-In-Pillow and other common SMT defects” – Evstatin Krastev, Ph.D.|
|**Pay via Cash/Check (onsite) or Credit Card (via PayPal - see button during RSVP process)|
By Gene Dunn – Plexus Corporation
About the Speaker:
By Evstatin Krastev, Ph.D. – Nordson Dodge
The need to non-destructively inspect electronic components and assemblies is the main driver behind the development and advancements of the X-ray inspection technology for the electronics industry. In many cases, X-ray inspection is the only available technique for non-destructive inspection of optically hidden solder joints like BGA, QFN, Through Hole components. In this talk we will discuss the latest developments in the 2D and 3D X-ray technology for detecting Head-In-Pillow and other common SMT defects. Real life examples and cases will be discussed in detail.
About the Speaker:
Evstatin Krastev, Ph.D.
Director of Applications
Dr. Krastev is Director of Applications at Nordson Dage responsible for the X-Ray and Bondtester lines. He holds a Master degree in Electrical Engineering and Ph.D. in Physics from Michigan State University. He has also valuable experience working as a software engineer and hardware design engineer.
During the last 25 years Dr. Krastev has been actively involved in the fields of testing and inspection for the microelectronics and NDT industries. During the last 14 years at Nordson Dage, Evstatin was instrumental building a strong global applications team supporting customers and sales.
Evstatin has published numerous articles in leading magazines discussing advanced topics in the spheres of bond testing, 2D and 3D X-ray inspection. He is a well-known expert in the industry and is working closely with key customers and consortia developing new standards and testing techniques.
RSVP to Gerri Noble at firstname.lastname@example.org or via the SMTA Great Lakes Chapter Webpage or by clicking HERE.
Oregon Chapter: SMTA Oregon Chapter: November Technical Meeting. Tolerance Mistaken +
Tolerance Mistaken: Impacts of not properly addressing limitations of material, industry standards and assembly process limitations
Electronic assemblies today are smaller, lighter with increased functionality per unit area and/or volume. The rate of new technology adoption is increasing through develop ever smaller packages with finer lead spacing and substrates with finer lines and spaces. However, design methods, industry standards, materials and manufacturing processes utilized during the product development and production process have not progressed to meet these new demands and thus many of the tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products. This presentation will highlight issues with today’s electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately address during design, PCB fabrication, assembly and test.
I. Industry Standards Limitations (IPC/JEDEC)
II. Component Package Technology
A. New Packaging Technologies
B. Units of Measure (Metric vs Imperial)
C. Land Pattern Design
III. PCB Design
A. Laminate Limitations
B. Via hole closure
C. Copper etching effects (pad/trace size)
D. Solder mask design
IV. Leadless Component Packages (DFN, QFN, LGA, Chip)
A. Solder mask/silk screen
B. Thermal balance
C. Thermal expansion/shrinkage
V. Assembly Technology
A. Material compatibility
B. Tolerances - assembly/tooling
Senior Staff DFX Strategy Engineer
Plexus Engineering Solutions
Dale is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields.
Dale has been involved in surface mount design, package & process development and production for over thirty years in various technical and managerial positions. These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of Chip Scale Package (CSP) & Ball Grid Array (BGA) packages, PCB & PCBA support, DFM/DFX analysis of flex, rigid-flex & rigid PCB/PCBA’s including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications for consumer products, defense/aerospace and medical devices.
Dale has authored multiple technical articles and papers and is a frequent instructor/presenter globally on topics including PCB and SMT design, assembly, cleaning, and DFM/DFX. He is a past recipient of the Surface Mount Technology Association’s “Excellence in Leadership” award. He has been or is very involved with multiple industry associations (SMTA, IPC, INEMI), industry standards development, and symposium/ conference technical development committees.
Advanced Electronics Assembly Conference +
India-Bangalore Chapter: SMTA India Technical Workshop - Designing and Manufacturing Telecommunications Hardware for the Next Decade and Beyond +
Designing and Manufacturing Telecommunications Hardware for the Next Decade and Beyond
25th November 2019, Bangalore
Post Moore's Law and Quantum Electronics - An Unparalleled Opportunity for Indian Scientific, Engineering and Industrial Organizations
Presented by Prof. Rao R. Tummala (Georgia Institute of Technology, USA)
Abstract: As Moore’s Law begins to come to an end, for not only fundamental reasons but also for computing performance, power, cost, and investments, it is becoming clear that a different vision for electronics systems must emerge. The new era of artificial intelligence mimicking the human brain, with several orders better computer performance than with the current electronics, is yet another reason for the end of Moore’s Law. A typical human brain has about 90 billion nerve cells interconnected by trillions of synapses providing trillions of pathways for the brain to process the information along with petabyte memory. New Moore’s La w, therefore, must duplicate this architecture. The packaging or I/Os has historically evolved dramatically from dual-in-line ceramic packages in the 1970s with 16 I/Os to silicon packages approaching 200,000 I/Os. Currently, the best Moore’s Law for packaging is with wafer-based silicon packaging. But silicon-based packaging has many limitations at the material, device, circuit, and system levels.
This talk describes a vision for post Moore's Law Electronics from Moore’s Law for ICs to electronic and photonic interconnections and eventually to DNA and quantum computing. Post Moore’s Law electronics is highly interdisciplinary, requiring a team of scientists and engineers to work together from electrical, mechanical, thermal, optical, bio and nanomaterials, and chemical process disciplines. The Post-Moore’s Law electronics provides a new opportunity for India to be a global player, in contrast to old Moore’s Law.
About the Speaker: Dr. Rao Tummala is a Distinguished and an Endowed Chair Professor in Electrical and Computer Engineering and in Materials Science and Engineering at Georgia Tech. He is also the Founding Director of the Microsystems Packaging Research Center (PRC) pioneering the Second Law of Electronics (the first being Moore ’s Law) by his System-On-Package (SOP) vision. Prior to joining Georgia Tech, Professor Tummala was a Fellow at IBM Corporation where he invented a number of major technologies for IBM's products for displaying, printing, magnetic storage, and packaging. He was the lead materials scientist pioneering the industry’s first flat panel display in the 1970s; Technical leader and Program Manager for the industry’s first R&D in multi-chip-module (MCM) leading to the first 61-layer, low-temperature, co-fired ceramic (LTCC) in 1980s, and the Director of IBM ’s Advanced Packaging Research laboratory. He has published over 320 technical papers, holds 71 U.S. patents and inventions, and authored the first modern reference book for microsystems packaging in 1988.
Star Invited Presentations
Customization and Personalization in a Connected Ecosystem (Live Telecast)
Presented by Girish Wable (Strategic Capabilities, Jabil Cicuits, USA)
Abstract: The digital revolution is upon us and connected devices are ubiquitous as part of the digital transformation. Integrating both the hardware data collection and analytics layers of the IOT ecosystem across different domains (smart retail, hospitality, health & safety) can help enhance the ROI of the solution. Such “devicification” leads to customized and personalized solutions enabled by additive manufacturing processes like: 3D printing, printed electronics, consumer packaging, and flexible hybrid electronics. These manufacturing innovations create opportunities where the benefits of functional integration are realized and can potentially impact manufacturing processes, reducing assembly steps and fostering supply chain simplification. Materials and sensor developments have a large role to play in advancing this field.
About the Speaker: Mr. Girish Wable is currently Sr. Manager of Strategic Capabilities at Jabil Circuits, USA. He is a Mechanical Engineer with a Master of Science in Industrial Engineering. Technology, operations, sourcing and business solutions strategist for Jabil. +25 years of global experience in electronics manufacturing, high performance coatings, material handling, automation, additive manufacturing, printed electronics and digital transformation. Leads up strategic business and technical initiatives for Jabil. Keynote speaker with multiple patents and publications.
Special Invited Presentations
Presented by Dr. Morgana Ribas (MacDermid Alpha Electronics Solutions, India Research Centre, Bangalore, India)
Abstract: The assembly material industry is continually adapting to meet the evolving needs of the markets it serves. In recent years, the reliability requirements have continued to increase beyond the capabilities of SAC305 toward more complex microstructures that enable increased thermal-mechanical performance in harsh environments. This presentation will explore topics ranging from Pb-solder alloy design, enhancements in solder paste chemistry, and processing differences between SnPb and Pb-free solders.
About the Speaker: Dr. Ribas is currently a Sr. R&D Manager at MacDermid Alpha India Research Centre in bangalore. She has Bachelor and Master's degrees in Metallurgical Engineering from UFRGS, Brazil, and Ph.D. from the Mechanical Engineering & Materials Science department at Rice University, USA. +20 years R&D experience, > 65 publications in journals, conference proceedings and patents.
Intra and Inter System's Connection Through Cables and Connector Arrangements Signal And Mechanical Constraints
Presented by N. S. Krishna Kumar (Sr. Consultant and Trainer, Bangalore)
About the Speaker: Mr. N. S. Kumar is an industry veteran on manufacturing of cable assemblies. He was Heading manufacturing of cable assemblies for Tyco Electronics (then AMP). Presently Sr. Consultant and Trainer in process improvements. Trainer for IPC India Wiring Harness Manufacturers Association (WHMA) standards.
Questions? Call +91 96200 75752
Webinar: Overcoming Challenging X-Ray Problems +
Monday 25th November @ 2:30pm - 4:00pm UK Time
(9:30am - 11:00am US Eastern Time)
Presenter: Keith Bryant, Chairman SMTA Europe
As with all inspection technology, x-ray has to evolve to keep pace with the advances in components and products. Most recently, this has been driven by the continued reduction in board, device and feature size and the movement to using newer, lower density materials within the structures, such as copper wire replacing gold wire as the interconnection material of choice within components and dies becoming thinner and thinner. But we also see an increase at the other end of the spectrum with IGBTs, super capacitors and battery applications requiring high power and high-resolution images for Failure Analysis and inspection.
In order to meet these challenges and those in the future, there have been a number of recent key improvements to the vital components within x-ray systems. In particular, there is a new x-ray tube type that permits high magnification inspection at improved resolution yet retains high tube power and stability under these conditions, allowing good x-ray flux for inspection of the smallest features and excellent repeatability of measurements and auto inspections.
This presentation will look at various x-ray tube and detector types that are available and explain the implications of these choices in terms of what they provide for inspection regarding image resolution, magnification, tube power, and detector pixel size, amongst others. We will look at x-ray images at both ends of the spectrum, high power with high-resolution and low power with high-resolution, using IGBTs and LEDs as examples.
About the Presenter
A fully qualified engineer, Keith has over thirty years' experience in Electronics Manufacturing. He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews.
He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years' experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years.
Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.
from 2017 to 2019 he was Global Sales Director of the leading X-ray manufacturer. Recently reverting to a Consultancy role allowing him more freedom to pursue other projects, including i4.0.
He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.