Calendar of Events
Dallas Chapter: Understanding the New IPC J-STD 001-G Amendment 1 Cleanliness Testing Standard +
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
Understanding the New IPC J-STD 001-G Amendment 1 Cleanliness Testing StandardSpeaker: Mike Konrad, Founder and President, Aqueous Technologies
Get your tickets!
AbstractMike Konrad, Founder and President, Aqueous Technologies
Mike Konrad is an industry expert on the removal of contamination from circuit assemblies. Mike has been part of the electronic assembly cleaning industry for the past 34 years. Mike has designed several automated cleaning and cleanliness testing machines, has published scores of technical articles on the subject of cleaning and cleanliness assessment has been a member of Editorial Boards for several industry publications.
Mike served on the US Navy’s EMPF manufacturer’s committee and is a featured speaker at industry events and technical workshops worldwide. Mike was honored with Distinguished Speaker status from the electronic assembly trade association’s Surface Mount Technology Association (SMTA) in 2017.
Mike has served as a court-approved Expert Witness in civil litigation matters concerning post-reflow cleanliness assessment and contamination-related failure mechanisms. Mike is the founder of Aqueous Technologies, a manufacturer of automated cleaning and cleanliness testing systems designed for the electronic assembly industry and has served as its CEO/CTO since 1992.
Mike is the Founder and President of Aqueous Technologies and is also the host of the Reliability Matters podcast, available on iTunes, Spotify, and iHeart Radio, Reliability.fm
Wisconsin Chapter: WI SMTA Technical Meeting and SMT Facility Tour- JW Speaker Corporation +
WI SMTA Technical Meeting and Tour at JW Speaker
Please join the WI SMTA as Eric Van Cuyk of Circuit Check
will be presenting on Function Testing Simplification / Flexibility
Cost is $20.00 per SMTA member / $25.00 non- members
Schedule as follows:
5:00pm- Welcome / Dinner
7:00pm- Facility & Mfg Tour
8:00pm- Meeting Adjourned
RSVP and pay by Tuesday October 1st!
**Anyone who signs up we ask them to bring (if available) ESD Smock, safety glasses, and ESD shoes or heel grounders.**
Tampa Bay Chapter: SMTA Tampa Bay Chapter Meeting: Operations Factory Tour: Lockheed Martin RMS, Oldsmar, FL +
********The Tampa Bay Chapter is sorry to announce that we are closing out the RSVP link for this event. We have overextended our capacity. Sorry for any inconvenience this may have caused. If you have RSVP'ed, please remember to bring your government issued identification to the event. We will send out an reminder email prior to October 10th. Thank you for your support!**************
SMTA Tampa Bay Chapter presents
Lockheed Martin RMS Oldsmar, FL Operations Factory Tour
Providing affordable CCA’s, Cables, Rack Integration, and Consoles for over 45 years.
Axel Vargas (Bio link) will be discussing:
“pH Neutral Cleaning Agents: Technology and Performance”
pH neutral chemistry cleaning process development and performance review over time in production conditions.
Our meeting this quarter will be held at the following address:
3655 Tampa Rd.
Oldsmar, FL 34677
Thursday October 10th:
5:30- Registration/ Meet and Greet
5:45- 6:00- Introduction factory overview presentation.
6:00-7:00- Factory Tour Presentation
7:15-7:30- Question and answer wrap up.
Cost of Meeting:
We hope to see everyone at the meeting!
******RSVPs required in advance, attendees must be US Citizens or US Permanent Residents. (Deadline to register is 10/7/19 at 5PM) All participants will have to bring a government issued photo ID for entry. The following forms of Photo ID are permissable: Passport, US Permanent Resident Photo ID, US State Issued Driver’s License or US State issued ID card. We can not accept any student IDs, company issued IDs or library cards. No walk-ups will be permitted. ******
Capital (DC) Chapter: SMTA Capital Chapter Meeting - October 10, 2019 +
The SMTA Capital Chapter is hosting a Chapter Meeting on January 10th from 5:00 PM to 7:30 PM at The Test Connection Inc., Hunt Valley, MD. Will Webb, Aster Technologies, will be presenting “Enhanced Manufacturing Services 4.0.”
This presentation will provide an overview of the opportunities for test data to be gathered and looked at from design, manufacturing inspection, manufacturing process test, and functional validation testing. This processes yield some great sources of process feedback that design and production with connection of machines, sensors, devices and people. We will look at convert data into information and explore the Digital Simulation: Create a virtual copy of the physical world. Play with “Whatif” scenarios in the virtual word in order to identify the optimized physical flow. Use theoretical results to control the physical world. Finally, we will aggregate raw data from cyber-physical systems to build and visualize comprehensive information that allow humans to make decisions based on facts.
Will Webb has worked in the manufacturing test industry for over 20 years and is now employed by ASTER Technologies as the Technical Director of the ASTER USA office. Will is responsible for technical support and creating new business opportunities for the ‘TestWay’ Electrical DFT and Fault Coverage Analysis tools. Prior to working for Aster Technologies, Will has worked for a number of different OEMs and CM’s in the manufacturing test field, responsible for DFT analysis, test coverage analysis, test development and overseas deployment of manufacturing tests.
The evening is scheduled as follows:
5:00-6:00 PM Registration, Networking & Dinner
6:00-6:30 PM Facility Tour
6:30-7:30 PM Presentation
The SMTA Capital Chapter Meeting Location:
The Test Connection Inc.
112 Lakefront Drive
Hunt Valley, MD 21030
Webinar: Practical Failure Analysis Methods in Printed Board Assembly +
Monday 14th October @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)
Presenter: Bob Willis, SMTA Europe
Different levels of failure analysis exist, from the very basic with virtually no equipment, to the use of a full failure analysis laboratory. Often simple analysis methods can point engineers in the right direction, but proving the root cause of failure often needs the electronic pathologist with all his investigation tools. When conducting any failure analysis, it is important the results prove the cause of the fault. The true reason for failure needs to be clear and proven with hard facts, not just opinions.
- Optical and X-ray inspection
- Solder joint crack detection
- Component opening techniques
- Surface analysis
- Shear testing
- Question and answer session
In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.
All webinar times shown are UK time – to check your local time in your countries click here
SMTA Europe Selective Soldering Workshop +
Massachusetts (Boston) Chapter: Joint Meeting ESD and Fires and Explosions at BAE Systems in Nashua, NH +
BAE Systems, 65 Spit Brook Road, Nashua, New Hampshire 03060
Many of us understand the hazards of electrostatic discharge to electronics. This talk covers the basics of electrostatic ignition, its sources and methods for prevention. It will also cover the issues of personnel comfort/ dangers around extreme charging situations such as moving webs. Case studies of fires, explosions and personnel injuries will be included. It is intended to present the issues of dangers from ESD. The result of attending this talk should be a safer environment both in the workplace and at home.
Stephen L. Fowler of Fowler Associates, Inc.
Stephen L. Fowler - President, Fowler Associates, Inc.
With over 50 years of electrical engineering experience, 45 years of radiation engineering experience and 35 years of electrostatic engineering experience. Mr. Fowler is considered a leading international expert in electrical engineering, radiation processing technology, radiation safety, electrostatic control and packaging. He attended the University of South Carolina and graduated, cum laude, with a BS in Electrical Engineering. Mr. Fowler served with the United States Air Force during the Vietnam War in electronic communications.
He has published papers, given speeches, seminars and lectures on radiation engineering, radiation safety, packaging, static control and static test methods. He is used by several television programs (such as Inside Edition and Dateline) as an expert in electrical and radiation engineering.
Mr. Fowler was previously the Electrostatic Plastics Marketing Manager for the Cryovac Division of W.R. Grace and Company. He was also the Manager of Radiation Engineering for Cryovac.
Mr. Fowler is the holder of several patents. He is or has been a member of the ASTM, EIA, ESD Association, AATCC and the Health Physics Society. He is Chairman of the AATCC Static Committee (RA-32) and Past Chairman of the Electronic Industries Association's Packaging ESD Committee (PEPS)
Mr. Fowler holds registrations in North Carolina, South Carolina, New Jersey and Oregon to provide radiation consultation and training. He is a NARTE Certified ESD Control
Engineer no. ESD-00010-NE, a Registered Radiation Protection Technologist (NRRPT) and a Registered Radiation Safety Officer (IRRSO)
Steve has been used by media outlets as an expert in electrical, electrostatic and radiation issues:
Dateline: Russian Spy Death from Polonium 210, Gasoline Refueling Fire
Gasoline Refueling Fires
Electrocutions in the Streets
Cell Phone Electrocutions in the Bath Tub
Hover Board Fires
Foot Bath Fakes
Night Hawk Minerals Radioactive Rocks Cure for Cancer
Hand Sanitizer Burns in the Hospital
Lights in Children Shoes Fires
|Date:||Wednesday, Oct. 16, 2019|
|Time:||5:00 PM to 8:00 PM|
65 Split Brook Road, Nashua, NH 03060
|5:30 PM||Registration, Networking, and Refreshments|
|6:00 PM||Opening and Announcements|
|6:10 – 7:45 PM||Technical Presentation|
|7:45 – 8:00 PM||Q&A|
Our 2019 Expo Sponsors:
For more information visit: https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=22
This event is open to active members only and please have your membership number handy when you register for this event.
(if your membership expires between and the event, please renew your membership before this event or your registeration will be rejected)
To register for this event visit: click here to register for this event or copy this URL to your browser: https://events.vtools.ieee.org/event/register/203485
Note: Registration is required and no walk-ins are allowed at this event. Event is being held in the un-secure area of BAE Systems so any active member can attend this event but registration is required for all visitors. Seating is limited to 80 seats so each engineering organization are limited to 20 seats each first come first served.
President : Michael G. Jansen (Raytheon Company)
Vice President : Peter Bigelow (IMI Inc.)
Sept. 30 to Oct. 3, 2019 iMAPS – 52nd International Symposium on Microelectronics at the Boston Hynes Convention Center, Boston, MA. http://www.imaps.org/imaps2019/SMTA – Tuesday, Oct. 8, 2019 – New England Expo & Tech Forum at the Boxboro Regency, Boxborough, MA https://www.smta.org/expos/#newengland
iMAPS NE – Tuesday Oct. 11, 2019 – at the Boxboro Regency Hotel & Conference Center, Boxborough, MA
Carolinas (NC, SC) Chapter: 2019 SMTA Carolinas Golf Tournament +
Georgia Institute of Technology Student Chapter Chapter: GT Student Chapter Meeting +
Huntsville Chapter: FARO Arm Demonstration +
Huntsville Chapter SMTA and Adtran welcome you on Oct 22, 2019 from 5:30-7:30pm for a DEMO of the FARO Arm, a portable 3D Measurement Arm.
Feel free to bring your own parts, CAD, or anything that want to see measured. The system will demonstrate both inspection, probing, scanning, and reverse engineering.
FARO is the world’s most trusted source for 3D measurement technology. The Company develops and markets computer-aided measurement and imaging devices and software. Technology from FARO permits high-precision 3D measurement, imaging and comparison of parts and compound structures within production and quality assurance processes. The devices are used for inspecting components and assemblies, production planning, documenting large volume spaces or structures in 3D, surveying and construction, as well as for investigation and reconstruction of accident sites or crime scenes.
Alex Green is a seasoned professional in the 3D measurement and digitization industry. With over 10 years of experience, Alex has quickly become a well-known and respected expert of the industry. He specializes in CAD to part comparisons, GD&T inspections, Reverse Engineering, project planning and training in the aerospace, automotive, military and defense sector as well as various other high precision industries.
Alex has been with FARO® Technologies for over 6 years.
- Arrive / Set up from 5:30 – 6:00.
- Demo / question and answer 6:00-7:00.
- Pack up and out by 7:30.
Location: Adtran, 901 Explorer Blvd, Huntsville, Al
ADTRAN’s Waterside Conference Room in the Mark C. Smith Conference Center.
Conference (2nd Floor, East Tower)
All attendees should park in the area on the South side of the East Tower (taller L-shaped building) – see red circle on map, and enter through the South entrance (as in times before). Turn right at security desk, and go up the stairs, then follow the arrows to the room as shown below.
Hors d'oeuvres :
The meeting is Free, but if you would like to snack with us. Let us know for planning purposes.
$5 SMTA Members
Cash/check at Door
Two ways to RSVP:
- SMTA RSVP Link:
- send email to HSVSMTA@gmail.com
Since this is a Demo, for members who cannot attend in person, we will not be able to offer a GoToMeeting option. Please contact us at HSVSMTA@gmail.com
Oregon Chapter: SMTA Oregon Chapter: October Technical Meeting. Evaluation for 3D Printed Resins: Applications in Engineering and Manufacturing +
This study aims to characterize 3D printed Resins from an applications perspective within engineering and manufacturing. 3D printing technology has grown enormously over the past decade, and is starting to make a transition from being a prototype technology to one that can be used in everyday applications around the factory floor. With the increase in technology and expansion of materials that can be used, the range for applications has increased dramatically. The aim of this study was to help create a selection guide of materials to use, by characterizing each resulting resin with the appropriate mechanical properties. A multi factorial Design of Experiments was used in order to optimize the post processing settings, to achieve maximum desired mechanical properties (Ultimate Tensile Strength, Hardness, Impact, etc…). I end goal is to provide both engineering and manufacturing another option for fabrication, as well as having an easy selection and processing guide for materials used in the factory.
Speaker: Andrew Daya - BIO:
Andrew started his journey into electronics manufacturing under the mentorship of Dr. S. Manian Ramkumar at the Rochester Institute of Technology in Rochester, New York. The research he did at RIT, was recognized by the SMTA in 2013, where Andrew was awarded the Charles Hutchin’s Educational Grant for his research on Package on Package Technology. After graduating, Andrew moved to Houston, Texas and joined Schlumberger as an eDFM engineer. After a couple years, Andrew moved to Salem, Oregon to join Garmin in his current role as a Process Engineer in their Aviation Segment. Andrew’s interests are 3D Printing, Hiking with his Dog Lucy, and exploring new areas (to him) around the Pacific Northwest.
International Wafer-Level Packaging Conference +
DoubleTree San Jose Airport Hotel
San Jose , CA
SMTA and Chip Scale Review are pleased to announce the 16th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.
San Diego Chapter: Octoberfest +
KARL STRAUSS BREWING COMPANY-SORRENTO MESA 9675 Scranton Rd San Diego, CA 92121
SMTA San Diego Chapter
IPC Designers Council San Diego Chapter
IMAPS San Diego Chapter
KARL STRAUSS BREWING COMPANY-SORRENTO MESA
Thursday, October 24, 2019 | 5:30-7:30 PM
Re-connect with old friends and make new connections in San Diego electronics industry! Look for the SMTA/IPC/IMAPS sign to find us.
Additive Electronics Conference: PCB Scale to IC Scale +
DoubleTree by Hilton San Jose
San Jose , CA 95110
Today's increasingly sophisticated electronics challenge designers and fabricators to push the limits of traditional design, fabrication and assembly and think outside of the box. Additive manufacturing enables environmental advantages, opens up design capabilities and end use advantages such as weight reduction, miniaturization and 3 dimensional design. This conference is designed to not only showcase options and processes intended to enable line width and space from .003" to 5 microns, but also to provide information on supporting materials and processes that are being developed to serve all market segments and expose attendees to other new advanced technologies intended to meet the ever increasing challenges of smaller, lighter and more powerful electronic devices.
Great Lakes (Chicago) Chapter: SMTA Great Lakes Solder Paste Roundtable Event +
Plexus, 2400 Millbrook Drive, Buffalo Grove, IL 60089
Tuesday, October 29th, 2019
|2400 Millbrook Drive|
|Buffalo Grove, IL 60089|
|**Pay via Cash/Check (onsite) or Credit Card (via PayPal - see button during RSVP process)|
By Dr. Mark Currie – Henkel Corporation
Due to the widespread popularity in mobile devices such as wearable devices and smartphones, demand for miniaturized or micro surface mount components, such as 0201 metric chip, flip chip packages, and fine-pitch surface mount land patterns to accommodate them are increasing. Consequently, solder paste is required to be compatible with this high-density surface mount technology.
When printing paste for 0402 metric chip components, stencil apertures of approximately 0.2mm diameter are used whereas for 0201 metric chip components, stencil apertures of the dimension 0.1mm diameter are needed. This presents challenges for both good printability and solderability. Conventional solder paste technology seems to be lacking in coping up with these stringent requirements.
Precise printability and optimum solder reflow parameters were evaluated on ultra-fine pitch surface mount board pads using conventional solder paste and a newly developed solder paste to understand compatibility with 0201 and 03015 metric chip components.
A test vehicle was used with 0402, 03015 and 0201 metric chip components. Type 51） (10-25um) and Type 6 (5-20um) no-clean lead-free Sn3Ag0.5Cu solder pastes were evaluated with two different stencil thicknesses,50um and 80um. The area apertures ratios varied from 0.28 to 0.94. The measurements of paste volume after printing were recorded using production solder paste inspection equipment.
After printing reflow studies were conducted on assembled 03015R and 0201C metric chip components to understand reflow behavior. The solder paste development included flux improvement to increase stencil release rate of the solder paste through the stencil apertures for the challenging stencil area aperture ratios used. The newly engineered heat resistant flux chemistry in the solder paste helped to reduce solder graping during reflow even with the small paste deposits on the board. Continual solder paste print studies as well as print to pause studies were conducted with the developed solder paste on 0201 metric and 0.3mm pitch QFP board land pads to understand the use of the solder paste in production. The results of the work will be discussed in detail.
By Tony Lentz – FCT Assembly
The surface finishes commonly used on printed circuit boards (PCBs) have an effect on solder paste performance in the surface mount process (SMT). Some surface finishes are non-planar like hot air solder level (HASL) which can lead to inconsistencies in solder paste printing. Other surface finishes are difficult to wet during reflow like organic solderability preservative (OSP). What is the overall effect of surface finish on solder paste performance? Which solder paste is best for each surface finish? It is the goal of this paper to answer these questions.
In the initial work, several different surface finishes were tested in the surface mount process including: HASL, OSP, electroless nickel immersion gold (ENIG), immersion tin, and immersion silver. Several different types of solder pastes were tested along with each surface finish including: lead-free no-clean and water soluble, and leaded no-clean and water-soluble solder pastes. Each combination of surface finish and solder paste was evaluated for print performance, wetting, solder balling, graping, and voiding. The results of this testing were quantified and summarized. Recommendations pairing the optimal solder paste with each surface finish were given.
Subsequent work explored some of the surface finish & solder paste combinations in more detail with an expanded set of SMT parameters. Three surface finishes were studied including electroless nickel immersion gold (ENIG), organic solderability preservative (OSP), and immersion silver (ISilver). Two solder pastes were used including a no clean SAC305 solder paste and a water soluble SAC305 solder paste. Three different reflow conditions were tested including a ramp-to-spike (RTS) profile, a ramp-soak-spike (RSS) profile, and simulation of the double-sided surface mount process by reflowing two times through a RTS profile. Print speeds were varied at 25, 50, and 100 mm/second and printed solder paste volumes were measured. Reflow performance was measured and quantified including wetting, solder balling, and graping data. Quad flat no lead (QFN) components were placed and voiding was measured in the solder joints of the QFN thermal pads.
All of the test results, including data from the first study, are summarized, compared and contrasted. Discussion of the strengths and weaknesses of each combination of surface finish and solder paste are given with respect to the various SMT parameters. Recommendations are made for optimal combinations of surface finish and solder paste.
About the Speakers:
Dr. Mark Currie – Henkel Corporation
Shantanu Joshi - Koki Solder America Inc.
Shantanu Joshi is the Regional Sales Manager for KOKI Solder America. He has a Master of Science degree in Industrial and Systems Engineering from State University of New York at Binghamton and Bachelor of Engineering degree in Production Engineering from Pune University, India. He is currently pursuing Ph.D in Industrial and Systems Engineering concentrating on High Reliability Lead Free Solder Alloys from State University of New York at Binghamton. He is published over dozen papers in various national and international conferences over the years. His current work extends from optimizing printing parameters for the stencil printing process to root cause analysis of complex electronic assemblies by understanding the material science of lead-free solder alloys.
Tony Lentz – FCT Assembly
Tony Lentz has worked in the electronics industry since 1994. He entered the industry as a process engineer at a circuit board manufacturer and worked there for 5 years. Since 1999, Tony has worked for FCT Companies as a chemical laboratory manager, production facility manager, and most recently a field application engineer. Since 2013, Tony has focused on field application and R&D for FCT Assembly solder and stencil products. Tony has extensive experience doing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. He has published and presented many papers at industry events. Tony is a speaker of distinction with SMTA. Tony holds B.S. and M.B.S. degrees in Chemistry.
FREE Webinar: Advances in X-Ray for Demanding Applications +
Wednesday 30th October @ 2:00pm Penang Time UTC+8
(2:00am US Eastern Time UTC-4)
Presenter: Keith Bryant, Chairman SMTA Europe
Free for all – only members will get access to slides and recorded presentation!
The taking of x-ray images goes back over 100 years, since then there have been numerous advances in x-ray tube and detector technology and these have been increasingly applied into helping with the manufacturing of electronic components and assemblies, as well as in their failure analysis. Most recently, this has been driven partly by the continued reduction in circuit board, device and feature size and the movement to using lower density materials within the structures, such as copper wire replacing gold wire as the interconnection material of choice within components.
However, due to the solar and battery advances, where heat transfer is critical and voiding is a huge problem, we are also seeing an increasing amount of high-density and thick materials which need to be imaged and worse still, low-density materials in combination with high-density ones. In order to meet these most recent challenges and those in the future, there have been a number of key improvements to the vital components within x-ray systems, which will be covered in the presentation.
The choice of available technologies, however, means selecting the tube/detector combination, which is optimum for electronics inspection is no longer so clear-cut. For example, one configuration may provide certain benefits that are applicable for one area of electronics inspection, whilst being less valid for others. This presentation will look at both ends of the spectrum of demanding applications, low-power applications using LED's as a subject and high-power applications showcasing IGBTs.
About the Presenter
A fully qualified engineer, Keith has over thirty years' experience in Electronics Manufacturing. He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews.
He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years' experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years.
Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.
from 2017 to 2019 he was Global Sales Director of the leading X-ray manufacturer. Recently reverting to a Consultancy role allowing him more freedom to pursue other projects, including i4.0.
He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.