Calendar of Events
Dallas Chapter: Understanding the New IPC J-STD 001-G Amendment 1 Cleanliness Testing Standard +
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
Understanding the New IPC J-STD 001-G Amendment 1 Cleanliness Testing StandardSpeaker: Mike Konrad, Founder and President, Aqueous Technologies
Get your tickets!
AbstractMike Konrad, Founder and President, Aqueous Technologies
Mike Konrad is an industry expert on the removal of contamination from circuit assemblies. Mike has been part of the electronic assembly cleaning industry for the past 34 years. Mike has designed several automated cleaning and cleanliness testing machines, has published scores of technical articles on the subject of cleaning and cleanliness assessment has been a member of Editorial Boards for several industry publications.
Mike served on the US Navy’s EMPF manufacturer’s committee and is a featured speaker at industry events and technical workshops worldwide. Mike was honored with Distinguished Speaker status from the electronic assembly trade association’s Surface Mount Technology Association (SMTA) in 2017.
Mike has served as a court-approved Expert Witness in civil litigation matters concerning post-reflow cleanliness assessment and contamination-related failure mechanisms. Mike is the founder of Aqueous Technologies, a manufacturer of automated cleaning and cleanliness testing systems designed for the electronic assembly industry and has served as its CEO/CTO since 1992.
Mike is the Founder and President of Aqueous Technologies and is also the host of the Reliability Matters podcast, available on iTunes, Spotify, and iHeart Radio, Reliability.fm
Wisconsin Chapter: WI SMTA Technical Meeting and SMT Facility Tour- JW Speaker Corporation +
WI SMTA Technical Meeting and Tour at JW Speaker
Please join the WI SMTA as Eric Van Cuyk of Circuit Check
will be presenting on Function Testing Simplification / Flexibility
Cost is $20.00 per SMTA member / $25.00 non- members
Schedule as follows:
5:00pm- Welcome / Dinner
7:00pm- Facility & Mfg Tour
8:00pm- Meeting Adjourned
New England Expo & Tech Forum +
242 Adams Place
Boxboro, MA 01719
The cost to exhibit for corporate members is $450/$550 (Early/Late) and $550/$650 (Early/Late) for non-corporate members.(click here for membership information)
The cost to exhibit includes
- One 10ft pipe & draped booth
- 1 Table
- Two chairs
- Company sign
- Directory listing
- Registrant list.
Discounted registration rates expire on Friday, September 13, 2019!
All spaces will be assigned once we are sold out. If there is another exhibitor you want to be next to please let us know when you sign up.
- Exhibit Application - Hard Copy
- Sponsorship/Ad Form
Please contact SMTA Expo Manager Courtney Kalb with questions or for additional information.
Book Your Hotel with the SMTA Discount: Click Here Use the code "SMTA"
Free Technical Program & Schedule Coming Soon!
Thank You to Our Lunch Sponsor:
Thank You to Our Refreshment Sponsor:
Thank You to Our Technical Sessions Sponsor:
Thank You to Our Tote Bag Sponsor:
7:30AM - 8:10AM
The Basics of SIR and ECM
SIR (Surface Insulation Resistance) and ECM (Electro chemical migration) test the electrically conductive and corrosive nature of a flux residue after being exposed to heat and humidity. These tests are important in the electronics industry and are increasingly being used by paste and electronics manufacturers to determine the long-term reliability of flux residues.
SIR and ECM tests can be used for all types of fluxes including wave flux, solder paste, and rework flux. They are also commonly used for compatibility testing for multiple products that will be combined with different vendors’ products.
Preparation of the coupons for testing is key to obtaining the results that solder material providers have outlined. If not prepared correctly, the results will differ significantly from the paste manufacturer’s results. Contamination can come from a variety of sources and adversely affect the testing.
Knowing the procedures for SIR and ECM, the test parameters for both, and the difference between the revisions of the tests helps ensure accuracy of the results that determine if the flux residue passes or fails the testing.
8:10AM - 8:50AM
Reliability of Robotics for Electronics Manufacturing
Reliability of electrical or electronic soldering has always been paramount for the success of long-term market share and presence for electronics manufacturers. Process control is the key to ensuring manufacturers produce high quality and reliable products within their respective fields. In today’s environment of automation and high tech electronic controls, high reliability in electronics manufacturing is now more critical than ever before.
Automation is one approach to achieving the pinnacle of high reliability in electronics manufacturing, as repeatability and traceability are two keys to maintaining optimum process control. However, it is the responsibility of every employee to maintain and control these processes whether they are automated or manual.
In a world of trending automation and artificial intelligence in all of our surroundings, one slight miss can mean the difference in the success or failure of any electronic product. A failure in the manufacturing process could be insignificant if it is a cell phone, a play station or a television, but it can be of major consequence if it affects the electronics in the car that your family is in, the flight that your spouse is on or the technology that your military member is utilizing.
Join us for an overview of the process of automation in the soldering workplace and a discussion of what factors are just as critical for high reliability electronics regardless of whether you are working with a manual or an automated manufacturing environment.
8:50AM - 9:30AM
Perfecting a Cleaning Process for Hi-Rel Electronics
Reliability is a continuum of performance based on product complexity and anticipated product life-span. To be successful over the long-term, hardware with demanding performance requirements (e.g., military and medical) or with long service lives (e.g., aerospace, transportation and telecom) need to be engineered from the start with a focus on reliability.
Cleaning enhances reliability, but not every product needs maximum reliability. This means cleaning becomes an important tool in the production engineer’s toolbox. Cleaning offers a simple economic trade-off: it adds manufacturing costs but can speed throughput, slash waste, minimize warranty expenses, extend product service lives or enable new capabilities. Balancing these options properly can enhance profitability.
Most companies are unaware that modern solvent cleaning systems are extremely cost-effective and environmentally benign. This section of the Reliability Workshop will focus on understanding the cost-benefit trade-offs which underpin critical cleaning. In this workshop, the Cleaning Experts from MicroCare will discuss:
1. Quantifying the Reliability Requirements for a Product
2. Understanding the Various Types of Contamination and Their Effects
3. Modern Cleaning Choices Compared
4. The Hidden Costs of Bad Cleaning
5. Measuring Cleanliness and Performance
12:00PM - 1:00PM
KEYNOTE: Collaborative Robot Use Cases in Electronics Manufacturing
Automate - focused on I40 from an automation perspective.
1. What is I40 and why is it important. Labor is a major issue facing US manufacturing. We can’t hire enough people.
2. SBD I40 organization and Journey
3. How I40 impacts operations Examples of (IIOT, Apps, Analytics, Additive, Cobots/Mobile)
4. Upskilling and what the new manufacturing environment looks like (Manufacturing jobs are High Tech jobs)
2:00PM - 3:30PM
Triple Jeopardy Electronics - Are You Game?
Speakers: Chrys Shea, Shea Engineering Services
Dr. Mark Currie, Henkel Electronics
Dr. Neil Poole, Henkel Electronics
The electronics industry is faced with challenges that often require immediate, yet long term reliable solutions. From a handheld device to a defibrillator, an automobile, or even a space station, each form factor in each of its respective markets expects robust manufacturing processes that create reliable products and sustainable solutions that match the customers’ expectations.
Implementing new, or off the shelf solutions can raise flags. Why? Lack of experience with any given technology naturally generates risk aversion, and in many cases, rightly so. To effectively adopt new solutions for high reliability applications, the strategy should be:
1) understand external forces,
2) overcome the lack of experience (that in essence have made us forget how to transition and improve and implement new technology), and
3) Implement solutions once we understand the application, while avoiding mistakes or oversights at all costs.
Triple jeopardy will seek the questions to answers on topics such as: Regulations; Whiskers; Failure Modes; Process Metrics; Compatibility; Sustainability; Inspection, Reliability; Qualifying new materials, Do’s and Don’ts, and many others, in an interactive session, where the audience understands the symptoms, and the doctors will advise on root cause solutions.....
Tampa Bay Chapter: SMTA Tampa Bay Chapter Meeting: Operations Factory Tour: Lockheed Martin RMS, Oldsmar, FL +
SMTA Tampa Bay Chapter presents
Lockheed Martin RMS Oldsmar, FL Operations Factory Tour
Providing affordable CCA’s, Cables, Rack Integration, and Consoles for over 45 years.
Our meeting this quarter will be held at the following address:
3655 Tampa Rd.
Oldsmar, FL 34677
Thursday October 10th:
5:30- Registration/ Meet and Greet
5:45- 6:00- Introduction factory overview presentation.
6:00-7:00- Factory Tour Presentation
7:15-7:30- Question and answer wrap up.
Cost of Meeting:
We hope to see everyone at the meeting!
******RSVPs required in advance, attendees must be US Citizens or US Permanent Residents. (Deadline to register is 10/7/19 at 5PM) All participants will have to bring a government issued photo ID for entry. The following forms of Photo ID are permissable: Passport, US Permanent Resident Photo ID, US State Issued Driver’s License or US State issued ID card. We can not accept any student IDs, company issued IDs or library cards. No walk-ups will be permitted. ******
Capital (DC) Chapter: SMTA Capital Chapter Meeting - October 10, 2019 +
The SMTA Capital Chapter is hosting a Chapter Meeting on January 10th from 5:00 PM to 7:30 PM at The Test Connection Inc., Hunt Valley, MD. Will Webb, Aster Technologies, will be presenting “Enhanced Manufacturing Services 4.0.”
This presentation will provide an overview of the opportunities for test data to be gathered and looked at from design, manufacturing inspection, manufacturing process test, and functional validation testing. This processes yield some great sources of process feedback that design and production with connection of machines, sensors, devices and people. We will look at convert data into information and explore the Digital Simulation: Create a virtual copy of the physical world. Play with “Whatif” scenarios in the virtual word in order to identify the optimized physical flow. Use theoretical results to control the physical world. Finally, we will aggregate raw data from cyber-physical systems to build and visualize comprehensive information that allow humans to make decisions based on facts.
Will Webb has worked in the manufacturing test industry for over 20 years and is now employed by ASTER Technologies as the Technical Director of the ASTER USA office. Will is responsible for technical support and creating new business opportunities for the ‘TestWay’ Electrical DFT and Fault Coverage Analysis tools. Prior to working for Aster Technologies, Will has worked for a number of different OEMs and CM’s in the manufacturing test field, responsible for DFT analysis, test coverage analysis, test development and overseas deployment of manufacturing tests.
The evening is scheduled as follows:
5:00-6:00 PM Registration, Networking & Dinner
6:00-6:30 PM Facility Tour
6:30-7:30 PM Presentation
The SMTA Capital Chapter Meeting Location:
The Test Connection Inc.
112 Lakefront Drive
Hunt Valley, MD 21030
Webinar: Practical Failure Analysis Methods in Printed Board Assembly +
Monday 14th October @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)
Presenter: Bob Willis, SMTA Europe
Different levels of failure analysis exist, from the very basic with virtually no equipment, to the use of a full failure analysis laboratory. Often simple analysis methods can point engineers in the right direction, but proving the root cause of failure often needs the electronic pathologist with all his investigation tools. When conducting any failure analysis, it is important the results prove the cause of the fault. The true reason for failure needs to be clear and proven with hard facts, not just opinions.
- Optical and X-ray inspection
- Solder joint crack detection
- Component opening techniques
- Surface analysis
- Shear testing
- Question and answer session
In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.
All webinar times shown are UK time – to check your local time in your countries click here
Europe Chapter: Selective Soldering Workshop +
Henkel, Hemel Hempstead, UK
Lead-Free & Tin/lead Selective Soldering, Design, Quality Control & Practical Defect Solutions
Instructed by: Bob Willis, SMTA EuropeFor many organisations, through-hole components will remain a reality for many years. More and more surface mount components are used in design and through-hole is in decline; however, the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products. So what is the most reliable and cost effective solution for through-hole soldering in a lead-free environment?
Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities with lead-free and high temperature solder alloys?
This workshop will look at systems, materials and process but also design for manufacture along with the most common defects and cures. Delegates can bring thier boards or example defects for discussion.
- Why use selective soldering
- PCB design rules for selective soldering
- Flux requirements for selective soldering
- Compatibility of solder masks and lead-free solder
- Setting up lead-free profiles, you must profile a selective process!!!
- Solder alloy choices
- Copper dissolution with selective
- Flux contamination and corrosion issues
- Automated through hole inspection
- Soldering defects on selective - Causes and Cures
Price to Attend:
SMTA Member price is £85 plus VAT
Non member price is £175 plus VAT
Book Delegate Places Here!
The workshop will be held at Henkel, Technologies House, Wood Lane End, Hemel Hempstead HP2 4RQ
Tuesday 15th October starting at 10.00am with coffee and tabletops from 9.30am
Table Tops Exhibition Space
Table Top Booking price is £350 +VAT for SMTA Corporate or Global members and £500 + VAT for non members
A limited number of tables are available.
Register for a table top space here!
Additional Training Opportunities:
During the workshop delegates will be able to see examples of the latest online training courses offered by SMTA and ask questions on their use by members
Onsite training is also available from SMTA Europe. For a list of the topics covered and the costs contact Ryan Flaherty SMTA firstname.lastname@example.org
Thank you for supporting SMTA Europe.
SMTA Europe Selective Soldering Workshop +
SMT Processes Certification (Melbourne, FL) +
Melbourne , FL 32904
- October 15 - Course (8:30-5pm)
- October 16 - ½ day of course + exam
- October 17 - All day exam (8:30-5pm)
- Instruction: English
Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
- Enhance your stature in our industry
- Increase marketing value for your company
- Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.
Austin (CTEA) Expo & Tech Forum +
2525 West Anderson Lane
Austin, TX 78757
The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 15, 2019!
- Ad/Sponsorship Form
- Exhibit Application - Hard Copy
- Please contact SMTA Expo Manager Courtney Kalb with questions or for additional information.
Thank You to our Beer Cart Sponsor:
"Preparing for 5G and Collaborative Technologies in Austin"
Modern cities and municipalities are confronted with an increasing need for real-time response and advanced measures to provide a smart & safe environment and provide residents with well-being and a quality of life.
Collaboration, standards, and a risk-based approach leveraging disruptive technologies such as 5G, IoT, Analytics are becoming the future platform for launching an innovative and collaborative approach for smart connectivity, capabilitie,s and smart solutions targeting key use cases.
This presentation will address key technological concepts of disruptive technologies and applications spanning sensing & surveillance, intelligent software and services, high-speed communications networks to harmonizing multi-source systems, and AI/data analytics for key verticals. This will transform the city/municipality towards a scalable and sustainable Smart and Safe environment. Several examples and benefits will be highlighted followed by an outline for successful implementation, deployment, and adoption.
"Identifying Defects on BTC Assemblies with X-Ray Analysis"
The use of x-ray inspection in the electronics industry has gained wide adoption in the past 20 years, driven mainly by the development and use of bottom terminated components (BTC). The use of ball grid arrays (BGA), for example, allowed the development of standards and guidelines that dictate the maximum void size in each ball. In consequence, x-ray machine manufacturers developed solutions that address these requirements to become an integral part of the quality assurance function of modern electronic manufacturers.
However, as new x-ray technologies are introduced – from new algorithms to new hardware – users are faced with a growing range of options to choose from. Users need a solid technical background to understand these options to make an educated decision when acquiring x-ray inspection capabilities. For example, what level of resolution is necessary for a specific application? Is an open tube or sealed source the most appropriate technology to deploy?
The goal of this presentation is to give the audience the tools needed to avoid making mistakes when acquiring x-ray inspection capabilities. Instead of focusing on the x-ray technology per se, this work starts from the application needs of the electronic industry and ties it back to the available technology offerings available in the market today. The goal is to set the record straight and clearly define critical concepts in x-ray inspection. The different x-ray modalities, 2D, 2.5D, and 3D x-ray inspection will be explained in details at the user level – no math involved. Most importantly, this presentation will cover when each modality must be utilized for a successful quality assurance program. A rich set of images and videos will be used to illustrate the advantages and disadvantages of each x-ray inspection modality.
Trade Show Opens
"A Strategic Approach to Innovation - Yes, You Can Find Opportunities without Wasting Time or Money"
Innovation is often exciting and profitable, but it also can be expensive and distracting. Does every new idea send you and your colleagues fleeing runaway brainstorms, out-of-control costs, and unrealistic expectations? What if there was a logical, organized approach to your company’s innovation process? Not surprisingly, many successful large companies have instituted a system to manage innovation processes for the highest return. Tools include competitive intelligence, tech scouting, stage-gates and innovation pipelines. These strategic components help them avoid surprises, wasted effort, extra expenses, and erratic cash flows. The best news is that these tools can be used by any size company, even by individuals.
In this presentation, we will answer questions about these methods and systems including: How do these tools work? What are their specific benefits? Would they benefit your company and how? How would you implement some or all of these methods?
Door Prize Drawings and More Networking
"Not Just for Software - Innovation Frameworks for the Hardware/IoT"
From design thinking to lean startup to agile methodologies, a number of innovation processes have become standard operating procedure for many who are building software companies. But what if your product or service involves hardware? Come learn how the latest tools and frameworks can be adapted to meet the needs of the hardware and IoT sector.
Trade Show Closes
Massachusetts (Boston) Chapter: Joint Meeting ESD and Fires and Explosions at BAE Systems in Nashua, NH +
BAE Systems, 65 Spit Brook Road, Nashua, New Hampshire 03060
Many of us understand the hazards of electrostatic discharge to electronics. This talk covers the basics of electrostatic ignition, its sources and methods for prevention. It will also cover the issues of personnel comfort/ dangers around extreme charging situations such as moving webs. Case studies of fires, explosions and personnel injuries will be included. It is intended to present the issues of dangers from ESD. The result of attending this talk should be a safer environment both in the workplace and at home.
Stephen L. Fowler of Fowler Associates, Inc.
Stephen L. Fowler - President, Fowler Associates, Inc.
With over 50 years of electrical engineering experience, 45 years of radiation engineering experience and 35 years of electrostatic engineering experience. Mr. Fowler is considered a leading international expert in electrical engineering, radiation processing technology, radiation safety, electrostatic control and packaging. He attended the University of South Carolina and graduated, cum laude, with a BS in Electrical Engineering. Mr. Fowler served with the United States Air Force during the Vietnam War in electronic communications.
He has published papers, given speeches, seminars and lectures on radiation engineering, radiation safety, packaging, static control and static test methods. He is used by
several television programs (such as Inside Edition and Dateline) as an expert in electrical and radiation engineering.
Mr. Fowler was previously the Electrostatic Plastics Marketing Manager for the Cryovac Division of W.R. Grace and Company. He was also the Manager of Radiation
Engineering for Cryovac.
Mr. Fowler is the holder of several patents. He is or has been a member of the ASTM, EIA, ESD Association, AATCC and the Health Physics Society. He is
Chairman of the AATCC Static Committee (RA-32) and Past Chairman of the Electronic Industries Association's Packaging ESD Committee (PEPS)
Mr. Fowler holds registrations in North Carolina, South Carolina, New Jersey and Oregon to provide radiation consultation and training. He is a NARTE Certified ESD Control
Engineer no. ESD-00010-NE, a Registered Radiation Protection Technologist (NRRPT) and a Registered Radiation Safety Officer (IRRSO)
Steve has been used by media outlets as an expert in electrical, electrostatic and radiation issues:
Russian Spy Death from Polonium 210
Gasoline Refueling Fire
Gasoline Refueling Fires
Electrocutions in the Streets
Cell Phone Electrocutions in the Bath Tub
Hover Board Fires
Foot Bath Fakes
Night Hawk Minerals Radioactive Rocks Cure for Cancer
Hand Sanitizer Burns in the Hospital
Lights in Children Shoes Fires
|Date:||Wednesday, Oct. 16, 2019|
|Time:||5:00 PM to 8:00 PM|
65 Split Brook Road, Nashua, NH 03060
|5:30 PM||Registration, Networking, and Refreshments|
|6:00 PM||Opening and Announcements|
|6:10 – 7:45 PM||Technical Presentation|
|7:45 – 8:00 PM||Q&A|
Our 2019 Expo Sponsors:
Our 2018 Expo Sponsors:
For more information visit: https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=22
This event is open to active members only and please have your membership number handy when you register for this event.
(if your membership expires between and the event, please renew your membership before this event or your registeration will be rejected)
To register for this event visit: click here to register for this event or copy this URL to your browser: https://events.vtools.ieee.org/event/register/203485
Note: Registration is required and no walk-ins are allowed at this event. Event is being held in the un-secure area of BAE Systems so any active member can attend this event but registration is required for all visitors. Seating is limited to 80 seats so each engineering organization are limited to 20 seats each first come first served.
President : Michael G. Jansen (Raytheon Company)
Vice President : Peter Bigelow (IMI Inc.)
Sept. 11, 2019, 5:30-7:30PM, IEEE – Introduction to Thermal Imaging using Infrared Technology, Jeff Steele – FLIR Systems at MIT Lincoln Laboratory 3 Forbs Road, Lexington, MA 02421. For more info visit: http://ewh.ieee.org/r1/boston/rl/events.html
Sept. 30 to Oct. 3, 2019 iMAPS – 52nd International Symposium on Microelectronics at the Boston Hynes Convention Center, Boston, MA. http://www.imaps.org/imaps2019/SMTA – Tuesday, Oct. 8, 2019 – New England Expo & Tech Forum at the Boxboro Regency, Boxborough, MA https://www.smta.org/expos/#newengland
iMAPS NE – Tuesday Oct. 11, 2019 – at the Boxboro Regency Hotel & Conference Center, Boxborough, MA
Long Island Expo & Tech Forum +
1350 Walt Whitman Road
Melville, NY 11747
Please contact Sharon Dietrich with questions or for additional information.
Please see the Long Island Chapter Page for More Information on Technical Sessions and Expo Materials.
Mexico - Guadalajara Chapter: SMT Processes Certification / 21-23 Oct 2019 +
Carolinas (NC, SC) Chapter: 2019 SMTA Carolinas Golf Tournament +
2019 SMTA Carolinas Golf Tournament
Registration begins at 8:30 am - Shotgun Start: 10:00 a.m.
Mill Creek Golf Club
1700 St Andrews Way
Mebane, NC 27302
All golfers receive:
• Box Lunch on course • 1 raffle ticket for prizes (unless you buy Mulligan Package)
• Free range balls for warmup • Chance to win Closest to the pin and long drive contest
• Goodie Bags • Dinner after play
• Chance to win Closest to the pin and long drive contest • Free Beer and Wine during play and after (No Liquor included)
Title Sponsor $1000 ($900 for Members) (1 Available)
Two foursomes-Sponsor name placement at the top of all banners/tournament promotional literature/cart goody bags-8 mulligans per foursomes-Hole sign with company logo-8 raffle tickets per player
Corporate Sponsor $500 ($400 for Members) (17 Available)
One foursome-Sponsor name placement on all banners/tournament promotional literature/cart goody bags-Hole sign with company logo-4 raffle tickets per player Donations/Awards: ($250)
Hole Sponsor ($300) Sign with company logo on tee box
Team Cost (4 players): $400 ($375 for members) One raffle ticket per player
Single Player: $100 ($75 for members)
Mulligan Package ($20/player additional) Includes: 2 extra raffle tickets, 1 red tee box shot on any hole, 4 mulligans (Pay at the time of registration)
All proceeds supports SMTA-Carolinas Programs
SMT Processes Certification (Guadalajara, Mexico) +
Hotel Riu Plaza Guadalajara
Guadalajara , JA Mexico
Av. Adolfo López Mateos Sur 830
Chapalita, 44500 Guadalajara, Jal., Mexico
- October 21- Course (8:30-5pm)
- October 22- ½ day of course + exam
- October 23- All day exam (8:30-5pm)
- Instruction: English/Spanish
Instructors: Ivan Castellanos, Indium Corporation
Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.
Why You Should Participate
- Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
- Enhance your stature in our industry
- Increase marketing value for your company
- Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.
International Wafer-Level Packaging Conference +
DoubleTree San Jose Airport Hotel
San Jose , CA
SMTA and Chip Scale Review are pleased to announce the 16th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.
Guadalajara Expo & Tech Forum +
Av. Mariano Otero
Verde Valle, Guadalajara, Jal. 44550
Prices below are per 3x3 Meter Booth:
|Before April 30, 2019||After April 30, 2019|
|Corporate Member||$1,000 USD / $20,000 MXN||$1,350 USD / $27,000 MXN|
|Non-Corporate Member||$1,200 USD / $24,000 MXN||$1,500 USD / $30,000 MXN|
Please Contact Expo Manager, Courtney Kalb, with questions or for additional information.
Click HERE for the Guadalajara Expo Live Floor Plan
Attendee registration will be available onsite.
Technical program coming soon...
Thank You to our Sponsors:
International Wafer-Level Packaging Conference Exhibition +
2050 Gateway Place
San Jose, CA 95110
Sponsorship and Exhibitor Information
Dates: October 22-23, 2019
Location: DoubleTree by Hilton Hotel, San Jose, CA
Monday, October 21
Move in: 12:00pm-5:00pm
Tuesday, October 22
5:00pm-6:00pm (Networking Reception)
Wednesday, October 23
Move out: 4:00pm-7:00pm
How Much is it to Exhibit?
|Early Registration |
Before/On July 30th
|Regular Registration |
After July 30th
|One Booth |
(8' D x 10' W)
|One Table |
Why Exhibit at IWLPC?
* Reach a focused international audience
* Generate Exposure in this highly competitive marketplace
* Share New Products and concepts to the market
* Enhance Relationships with existing customers and generate new leads
What type of attendees will be there?
Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
Note - If you already registered for the IWLPC conference you do not need to register separately to attend the expo.
Additive Electronics Conference: PCB Scale to IC Scale +
DoubleTree by Hilton San Jose
San Jose , CA 95110
Today's increasingly sophisticated electronics challenge designers and fabricators to push the limits of traditional design, fabrication and assembly and think outside of the box. Additive manufacturing enables environmental advantages, opens up design capabilities and end use advantages such as weight reduction, miniaturization and 3 dimensional design. This conference is designed to not only showcase options and processes intended to enable line width and space from .003" to 5 microns, but also to provide information on supporting materials and processes that are being developed to serve all market segments and expose attendees to other new advanced technologies intended to meet the ever increasing challenges of smaller, lighter and more powerful electronic devices.
Intermountain Utah Expo & Tech Forum +
3910 W. Campus Drive
Ogden, UT 84408
The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 30th, 2019!
Important Exhibitor Materials:
- Hard Copy of Exhibitor Application
- Click here for Ad and Sponsorship opportunities!
- Please contact SMTA Expo Manager Hannah Terhark with questions or for additional information.
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Tuesday, October, 29, 2019
Information on the Technical Sessions to follow...
FREE Webinar: Advances in X-Ray for Demanding Applications +
Wednesday 30th October @ 2:00pm Penang Time UTC+8
(2:00am US Eastern Time UTC-4)
Presenter: Keith Bryant, Chairman SMTA Europe
Free for all – only members will get access to slides and recorded presentation!
The taking of x-ray images goes back over 100 years, since then there have been numerous advances in x-ray tube and detector technology and these have been increasingly applied into helping with the manufacturing of electronic components and assemblies, as well as in their failure analysis. Most recently, this has been driven partly by the continued reduction in circuit board, device and feature size and the movement to using lower density materials within the structures, such as copper wire replacing gold wire as the interconnection material of choice within components.
However, due to the solar and battery advances, where heat transfer is critical and voiding is a huge problem, we are also seeing an increasing amount of high-density and thick materials which need to be imaged and worse still, low-density materials in combination with high-density ones. In order to meet these most recent challenges and those in the future, there have been a number of key improvements to the vital components within x-ray systems, which will be covered in the presentation.
The choice of available technologies, however, means selecting the tube/detector combination, which is optimum for electronics inspection is no longer so clear-cut. For example, one configuration may provide certain benefits that are applicable for one area of electronics inspection, whilst being less valid for others. This presentation will look at both ends of the spectrum of demanding applications, low-power applications using LED's as a subject and high-power applications showcasing IGBTs.
About the Presenter
A fully qualified engineer, Keith has over thirty years' experience in Electronics Manufacturing. He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews.
He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years' experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years.
Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.
from 2017 to 2019 he was Global Sales Director of the leading X-ray manufacturer. Recently reverting to a Consultancy role allowing him more freedom to pursue other projects, including i4.0.
He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.