Calendar of Events

   2019      

                                   

2019

April 29

Webinar: Flexible Circuit Board Design & Assembly with Lead-Free Alloys  +



Bob WillisMonday 29th April @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Flexible circuits is another packaging technology which has seen a growing and wider acceptance in the electronics industry. The advantages of surface mount reduced weight; decreased size can be further enhanced by flexible circuitry. In many cases, it is a misconception that flexible circuits have to flex, they don't; many flexibles are designed purely to aid the circuit design and assembly into the final product. In this case the substrate is only flexed or formed once. The range of constructions for circuit manufacture are wide but the basics are similar to existing printed circuit production. The design and selection of the manufacturing methods can affect the final cost of the circuit and need to be considered in detail prior to manufacture. Where design departments have limited experience useful reference material is available to engineers worldwide with the release of Flexible Circuit Technology, Third Edition by Joe Fjelstad and other publications.

 

Topics include:

  • Flexible Design for assembly
  • Manual assembly and soldering
  • Automatic assembly process requirements
  • The need for baking flexible circuits
  • Flexible circuit pallets for automatic assembly
  • Screen printing, placement, reflow soldering & AOI
  • Manual hand soldering and de-soldering
  • Rework of conventional and surface mount
  • Solder joint Inspection
  • Process defects on flexible circuits and during assembly

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


May 2

Carolinas Expo & Tech Forum  +

Location: DoubleTree by Hilton - Research Triangle Park
4810 Page Creek Lane
Durham, NC 27703



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on April 1, 2019!

 

Discounted Hotel Rooms - Available Here:

DoubleTree by Hilton - Research Triangle Park



Attendees

Exhibit Hours:
Thursday, May 2, 2019
9:30AM–3:30PM

 

8:00am

Registration Opens

 

9:00am - 9:45am

Impact of Exposing No-Clean Solder Paste Flux Residues to a Water Wash Cleaning Cycle

Speaker: Kim Flanagan, Indium Corporation

Electrical reliability has become increasingly important to SMT in particularly high reliability applications like automotive, medical, and military/aerospace applications. Solder paste suppliers are actively working to develop no-clean fluxes with residues that have the highest reliability performance, demonstrating high electrical resistance for mitigation of dendritic growth. These flux residues are benign when left on the board without cleaning. However, what if the flux residue is “cleaned” insufficiently?

Accidents happen. There may be at least one instance in every SMT manufacturer’s lifetime where a board built with a no-clean solder paste is accidentally mistaken for a water-soluble solder paste and is thrown into a water wash cleaning system. How does rinsing a no-clean flux residue with only water affect the reliability of the assembly?

This presentation will review a series of Surface Insulation Resistance (SIR) tests performed on no-clean flux residues that have been exposed to water wash processes. The results will provide insight as to whether or not exposing no-clean flux residues to water will affect the electrical reliability.

 

9:30am

Exhibit Hall Opens

 

10:00am - 10:45am

Reliability of Robotics for Electronics Manufacturing

Speaker: Bubba Powers, Weller 

 

11:00am - 11:45am

Reliability of Critical Cleaning and Best Practices in Electronics

Speaker: Mike Jones, MicroCare Corporation

Reliability is a continuum of performance based on product complexity and anticipated product life-span. To be successful over the long-term, hardware with demanding performance requirements (e.g., military and medical) or with long service lives (e.g., aerospace, transportation and telecom) need to be engineered from the start with a focus on reliability.

Cleaning enhances reliability, but not every product needs maximum reliability. This means cleaning becomes an important tool in the production engineer’s toolbox. Cleaning offers a simple economic trade-off: it adds manufacturing costs but can speed throughput, slash waste, minimize warranty expenses, extend product service lives or enable new capabilities. Balancing these options properly can enhance profitability.

Most companies are unaware that modern solvent cleaning systems are extremely cost-effective and environmentally benign. This section of the Reliability Workshop will focus on understanding the cost-benefit trade-offs which underpin critical cleaning. In this workshop, the Cleaning Experts from MicroCare will discuss:

1.       Quantifying the Reliability Requirements for a Product

2.       Understanding the Various Types of Contamination and Their Effects

3.       Modern Cleaning Choices Compared

4.       The Hidden Costs of Bad Cleaning

5.       Measuring Cleanliness and Performance

 

Thank You to our Lunch Sponsor:

 

12:00pm - 1:00pm

Complimentary Lunch

 

1:00pm

Hands-On Workshop with MicroCare & Weller

 

1:30pm - 2:15pm

New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBFs and PCBAs

Speaker: Robert Boguski, Datest

Digital Computed Tomography, or CT Scanning, has advanced in equipment and techniquyes to such an extent that it has now become the method of choice in many applications where workmanship, fabrication, and componbent defects are difficult and sometimes otherwise impossible to find.

This presentation will discuss the current state of the technology (hardware as well as software); some of the basic physics underlying the methodology; and relative strengths and weaknesses of CT Scanning versus other methods, from the standpoint of results as well as cost. Numerous examples will be shown, with an emphasis on PCBA and PCBF failure analysis and defect detection.

A related presentation is attached which will be, in part, the basis for this new presentation.

 

3:00pm

Hands-On Workshop with MicroCare & Weller Tools

 

2:30pm - 3:15pm

How AI is Changing the Way we Make and Inspect Things

Speaker: Bill Cardoso, Ph.D., Creative Electron, Inc.

Over the past years, the electronic assembly industry has focused on the development of Industry 4.0, a standard communication protocol that allows production equipment to dialogue. This communication protocol will be a key enabler to improve the quality and efficiency of the production line. This is achieved by creating a feedback loop between inspection and production – thus allowing problems to be identified and corrected as early as possible in the manufacturing line. As a result, the overall cost of manufacturing is reduced as yield increases.

In this presentation, we will share the latest developments of the integrated production line with Industry 4.0. The Connected Factory Exchange (CFX) software, IPC’s answer to Industry 4.0, will be discussed as a powerful solution to factory connectivity. The connectivity of the production line is an important first step in the development of the next generation of electronic manufacturing. The next key technology that will build upon the connected factory and make a tremendous impact in our industry is artificial intelligence (AI). AI will allow us to scale the conversion of data into information – and how this information can be utilized to improve the decision-making factory in the digital factory. We will share examples of state of the art x-ray inspection applications with AI that greatly improve the productivity of electronic manufacturing. As a natural extension of this work, we will present how AI will change the way we manufacture and inspect electronic devices.

 

3:30pm

Exhibit Hall Closes


May 3

Dallas Chapter: LED Do’s and Don’ts  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



LED Do’s and Don’ts

Speaker: Matt Osborne, Regional Territory Manager, Trans-Tec America

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on May 3, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!



Abstract

What to do and not to do with LEDs in a surface mount process including Paste printing, Stencil Design, picking, placing, Reflow, and test.

Biography

Matt Osborne
Trans-Tec America
Territory manager
  • Attended University of Delaware.
  • Worked for Motorola in Shaumburg, IL as a SMT Manufacturing Engineer.
  • Worked for Allied Signal in DOD environment as a SMT Manufacturing Engineer.
  • Worked for Quad Systems as a Field Service Engineer.
  • Engineer for Decatur Electronics in microwave radar.
  • Redesigned to Jugs professional radar gun used by Major League Baseball.
  • Opened his own contract manufacturing business, Contract Assembly Service, Inc.
  • Vice President of American Circuits located in Charlotte, NC.
  • Director of Engineering. The Light Source, Inc. – Design and manufacturing of high-end theatrical stage lighting.
  • Trans-Tec America territory manager.



May 7

Wisconsin Chapter: Milwaukee Brewers Game May 7th  +

1 Brewers Way, Milwaukee WI 53214



Wisconsin SMTA hosts an evening at Miller Park with the Milwaukee Brewers
 
Join WI SMTA Officers for the Brewers Game after the Expo on Tuesday May 7th!
The Milwaukee Brewers play the Washington Nationals at 6:40pm.
We have 30 tickets reserved.  
 Our ticket package is in Section 211.  Row 8-12. 
Price per ticket is $15.00.
Please sign up and pay to secure your ticket.   You must pay to secure your seat.   
Tickets will be handed out at the WI SMTA Expo on May 7th.


Please contact Jana Esselmann with questions.  262-305-0568
 


May 7

Wisconsin Chapter: 2019 WI SMTA Expo  +

Crown Plaza Milwaukee 6401 S. 13th Street Milwaukee, WI 53221



Join us for the WI SMTA Expo on May 7th! 
Where: Crown Plaza,  6401 S 13th Street  Milwaukee, WI 53221
Hours will be 9:00 am to 3:30pm

What to expect:
Over 50 Exhibitors,  Door Prizes,  Golf sign up,  Raffles,  Lunch,  3 Technical Speakers and more! 
Following the Expo we will have 30 seats to the Brewers 6:40pm game.  Please scroll down the webpage to secure your spot for the Brewers game.

We are pleased to announce our 3 Technical Speakers:
Chrys Shea of Shea Engineering
Michael Sivigny of CeTaQ Americas
Jason Fullerton of Alpha Assembly
 
Come for the Exhibitors and stay for lunch and Networking! We cannot wait to see everyone on May 7th!



May 7

Connecticut Chapter: Stanley Black and Decker: Innovation Center tour and tech talk  +

One Constitution Plaza, Second Floor, Hartford CT



Our first Tech Session of 2019 will include a tour of Stanley Black & Decker’s “Manufactory 4.0” Innovation Center, and include a presentation with Q&A by Eric Cowan who is the Director Industry 4.0, Automation & Robotics at Stanley Black & Decker.   

 
MAY 7, 2019
3:00 pm - 5:00 pm

Stanley Black & Decker:  Innovation Center tour and tech talk

"Industry 4.0 Robotics, Data Layer Management and SMTA Q&A"
Presented by Eric Cowan, Director Industry 4.0, Automation & Robotics at Stanley Black & Decker 

We are thrilled to be the first visitors of the new Stanley Black & Decker Innovation Center!  Stanley Black & Decker has created autonomous, off-site teams  throughout the United States to pursue new ideas and create a culture of innovation.  The state-of-the-art “Manufactory 4.0”in Hartford CT is the epicenter for Stanley Black & Deckers global Industry 4.0 “Smart Factory” and workforce upskilling initiataves – making manufacturing more efficient, productive and adaptable.


About the Speaker (bio):
An innovative leader who excels at creating sustainable processes and delivering complex solutions. Expert in business process re-engineering, project management and creating tools and systems to enhance operations. Expert coach and mentor, change agent, internal consultant, and project manager. Over 18 years experience in high volume electronics manufacturing including 15+ years as a functional manager leading teams and leading leaders in a highly matrixed global organization. A lifelong learner, passionate about continuous improvement with exceptional analytical and problem-solving skills, enjoys solving problems across a broad set of business functions. Skilled communicator with experience presenting to all levels of the organization and conferences.
Certifications: PMP, MBA, CSM, CSPO, SaSP, Jonah, Six Sigma, LEAN

COST:  $25.00 SMTA Members / $35.00 Non-Members

Map of Innovation Center
 


May 7

Wisconsin Expo & Tech Forum  +

Location: Milwaukee Airport Crowne Plaza
6401 S 13th St,
Milwaukee, WI 53221


Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Please contact Steve Stiller at steve@midwestproductionllc.com for questions or for additional information.



Attendees

Attendees can register on the SMTA Wisconsin Chapter page.

Please see the Wisconsin Chapter Page for More Information on Technical Sessions and Expo Materials.


May 8

Mexico - Guadalajara Chapter: SMTA Expo and Tech Forum Chihuahua Edition  +

Salon Villarreal





Te esperamos, registrate en el siguiente link para poder asistir

Registro Aqui / Register Here

Evento gratuito gracias a nuestros patrocinadores, consulta proximamente el listado de empresas participantes en la zona de Expo.


Hotel Convenio: Hilton Garden Inn Chihuahua
Direccion: Av. de La Juventud 5915, Esq. Haciendas del Valle
Chihuahua, Chihuahua, C.P 31216, México
Tarifa Habitacion Estandar: $85 usd
Código de reservación: EXPAI
  • Tarifa incluye Desayuno
  • Las tarifas indicadas no incluyen impuestos (16% de IVA y 4% de Impuesto Sobre Hospedaje).
  • Precio por persona adicional $15 usd
  • Tarifas por habitación, por noche, en ocupación doble o sencilla.
  • Tarifas negociadas en dólares americanos.
  • Tarifas NO comisionables.
  • La tarifa pública está sujeta a cambio y disponibilidad sin previo aviso.
  • Ocupación máxima por habitación 2 adultos.
Contacto:
MARTIN LEDEZMA DEL RIVERO
+52 614-311-25-24     Office
+52 614-239-33-26     Mobile
martin.ledezma@hilton.com

 


May 8

Great Lakes (Chicago) Chapter: Accelerating the Solder Paste Evaluation Process - By Chrys Shea  +

Location
Plexus, 2400 Millbrook Drive, Buffalo Grove, IL 60089



SMTA Great Lakes Chapter Meeting:

Wednesday, May 8th, 2019

Time:  6:00pm – 8:30pm
Location: Plexus – 2400 Millbrook Drive, Buffalo Grove, IL  60089
 

 


ACCELERATING THE SOLDER PASTE EVALUATION PROCESS
 
 
By
Chrys Shea
Shea Engineering Services
East Greenwich, RI, USA
Chrys@sheaengineering.com


 
Abstract
 
Solder paste can make or break the profitability of SMT processes. Using the proper chemistry is critical to a successful operation.  Because solder pastes have so many different characteristics that affect their assembly line performance, they can be cumbersome and costly to evaluate.  As a result, many assemblers are using mature formulations that have since been improved upon, simply because they don’t have the resources to properly evaluate new, more process- or product-friendly materials.

This paper proposes a new solder paste evaluation regimen that helps engineers assess up to 25 solder paste properties on their assembly line in 5 hours or less.  It uses the new SMTA board that is available off-the-shelf from Practical Components and is part of a full kit developed specifically to help PCB assemblers choose the right solder paste for their operation, as quickly, easily and economically as possible.
 

 
About the Speaker:


CHRYS SHEA
President, Shea Engineering Services

Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry.  Chrys is a frequent speaker at industry events, and has three times received the SMTAI “Best of Conference” award for her research on solder paste printing.  In 2012, she was honored with the SMTA “Member of Technical Distinction” award.  Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island.  She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees.

 
When:  Wednesday, May 8th, 2019
 
6:00 pm: Registration & Networking
6:30-7:00 pm: Dinner
7:00 - 8:00 pm: Presentation
8:00 - 8:30 pm: Questions and Adjournment
 
 

Prices for fabulous dinner meeting
$30 for Members - $35 for non-members
free for Displaced Members

You can pay onsite (Cash/Check only!) or via PayPal (a "Buy Now" button will be availble after completing the RSVP process)
 

and invite your friends too……….
 
 
 
RSVP to Gerri by May 7th, 2019
 
Send RSVP by the methods listed below:


Online: RSVP
 
Fax: 847-639-2489
 
e-Mail: gnoble@ntech-inc.com
 
 
(You will be charged for your visit if a No Show occurs)
 
Where: Plexus – 2400 Millbrook Drive, Buffalo Grove, IL  60089



May 9

Huntsville Expo & Tech Forum  +

Location: Stone Event Center/ Campus 805
2620 Clinton Avenue
Huntsville, AL 35805



Exhibitors

The cost to exhibit for corporate members is $375/$475 (early/late) and $450/$550 (early/late) for non-corporate members. The cost to exhibit includes: one 6ft draped table, two chairs, company sign, directory listing and attendee list. Electricity is an additional $30 per outlet. Earlybird pricing expires April 12th, 2019! 

Important Exhibitor Materials:

Book a discounted room rate at the Springhill Suites by Huntsville Downtown  by April 17, 2019.

 745 Constellation Place Drive SW, Huntsville, Alabama 35801 USA

Group Code: SMTA 

256-512-0188

Book Rooms Today!  

 



Attendees

Free Technical Program & Schedule:


8:00AM
Registration Opens

9:00AM
State-Of-The-Art Test Techniques 

Vaughan Carlson, FedEx Logistics

Abstract: The entire electronics industry is ever-changing, and test engineering is no exception.  Whereas In-Circuit Test and Functional Test dominated the industry in the 80s and 90s, what we see today is the use of Automatic Optical Inspection (“AOI”) and Automatic X-Ray Inspection (“AXI”) coupled with perhaps Flying Probe Test, Cluster Tests, Boundary-Scan Test, and occasionally automated Functional Test.  It’s obvious that no one test approach is a perfect solution for all applications. This Tutorial will provide the information about implementing testing in the most effective way for each individual PC Board.
 

Bio: Vaughan began his career in the Test Engineering industry over 40 years ago after graduating from Mississippi State University in the 1970s with a Bachelor’s in Electrical Engineering. He continued his education, receiving a Master’s in Electrical Engineering from Southern Methodist University in Dallas in 1982.

In addition to working for General Dynamics on the F-16 Fighting Falcon, Vaughan has worked for the Sanmina-SCI (Huntsville division) and Panasonic. Vaughan is currently employed at FedEx Logistics in Collierville, TN.

 

10:00AM
Expo Opens

10:30AM
KEYNOTE Presentation: Identifying Defects on BTC Assembly with X-ray Analysis

Bill Cardoso, Ph.D., Creative Electron

Abstract: The use of x-ray inspection in the electronics industry has gained wide adoption in the past 20 years, driven mainly by the development and use of bottom terminated components (BTC). The use of ball grid arrays (BGA), for example, allowed the development of standards and guidelines that dictate the maximum void size in each ball. In consequence, x-ray machine manufacturers developed solutions that address these requirements to become an integral part of the quality assurance function of modern electronic manufacturers.

Bio: Bill received his Associate’s degree in Electronics at 13 and went on to achieve a BS, MS, and PhD in Electrical and Computer Engineering. Bill also has his MBA from University of Chicago.  He is a recipient of the Outstanding Alumnus Award from the Illinois Institute of Technology, and sits on the technical committees of SMTA International, SMTA Counterfeit Conference, and SMTA LED Conference, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium. He is a senior IEEE member. Bill is on the board of the SMTA, MiraCosta College, and Illinois Institute of Technology. Bill has written two books and over 150 technical publications. On their spare time, Bill’s family is putting together a 42,000-piece jigsaw puzzle.

12:00PM
Complimentary Lunch

1:00PM
MSFC Engineering Overview

Lisa Watson-Morgan, Ph.D., MFSC NASA

Bio: Dr. Lisa Watson-Morgan will assume the position of Deputy Director of the Engineering Directorate. She began her NASA career as a cooperative education student. Upon her graduation in May 1991, she was assigned to the Mission Operations Laboratory as a data management controller for the ATLAS-3 Spacelab mission. She became a team leader for the Operations Utilization Team in February 1995 and Manager of the Ground Systems Operations Branch in December 2014. In November 2009, she accepted a 1-year detail assignment as Acting Assistant Manager of the Science and Mission Systems (SMS) Office and became SMS Acting Chief Engineer in November 2010.

In August 2011, Dr. Watson-Morgan began her tenure in the Senior Level position of Chief Engineer, Flight Programs and Partnerships Office. She accepted another detail assignment in January 2013 as Associate Technical Director for the Engineering Directorate. She was appointed to the SES in December 2013 as Manager of the Chief Engineer’s Office at Marshall. In November 2015, she was named Director of the Spacecraft and Vehicle Systems Department. She has served in her current role as Associate Director for Operations in the Engineering Directorate since June 2018.

3:00PM
Expo Closes

 

THANK YOU TO OUR REFRESHMENT BREAK SPONSOR:


May 14

Central Texas (Austin) Chapter: CTEA Electronics Symposium at AMD  +

AMD Bldg B500 Auditorium, 7171 Southwest Parkway, Austin, TX



Central Texas Electronics Association

 
Electronics Design, Manufacturing & Test Symposium 
Tuesday, May 14, 2019
AMD Bldg B500 Auditorium at 7171 Southwest Parkway

 
Program:
 
3:00  -   Registration Begins
 
3:30  -   Welcome and Introductions
 
3:35  -   " Packaging Technologies for Advanced Automotive Applications
                 Andrew Mawer, Reliability & Analysis Manager, NXP
                    
4:05  -   " Chip Reverse Engineering Methods
  Carlos Greaves, Sr Vice-President, i-Runway
         
4:35  -   Break for Networking
 
4:50  -   " X-ray Analysis for Electronics ” 
     Stephen Schoppe, President, Process Sciences
 
5:20  -   " Client Reliability Engineering Overview: Best Practices for Commercial PC’s
                 Ed Tinsley, Engineering Manager, Dell
 
5:50  -   Door Prizes Drawing & Closing Remarks
 
6:00  -   Food & Refreshments Served and More Networking
 
 
Registration:
 
RSVP to Bob Baker at:  rjbakeratx@gmail.com
 
No charge for SMTA & IMAPS members;  $10 for all non-members >> (Cash or Check ONLY!)
                            Students can also attend for FREE!
 
Event Location:
 
AMD Bldg B500 Auditorium at 7171 Southwest Parkway in South Austin
near SW Parkway & W. William Cannon Dr  ( Use Parking Garage (1) P300 or (2) P100 )
See Directions to:   (AMD Location)   and   See AMD Campus Map Per Attached Doc
 
In Central Texas, SMTA and IMAPS work together as the Central Texas Electronics Association (CTEA)
 


May 16

Indiana Chapter: NSWC Crane Visit  +

Location
Vistor Center @ 102 Furlong Street, Crane, IN 47522



NSWC Crane Visit of
Surface Mount Tech Association (SMTA) Indiana Chapter
16 May 2019
Purpose: To gain more understanding of NSWC Crane’s technical capabilities.
We will get a chance to tour 3 locations that cover Radar Technology, PCBs, and Failure analysis.
Transportation: 2 - 36 passenger buses
Uniform: Military – Khakis; Civilian – Business Casual
Visitor(s) will be escorted by: Mr. Dean May


To complete your registration the downloard the IDCARD/BASE pdf document. This document MUST be filled out and sent to before May  9, 2019 for citizens and by April 30, 2019 for non-citizens to Michelle Sparks via email or postal carrier using the information below:
  1. Michelle Sparks at michelle.sparks.ctr@navy.mil
  2. Michelle Sparks
Corporate Communications Office
Naval Surface Warfare Center, Crane Division (NSWC Crane)
Building 1, Code 103
300 Highway 361
Crane, IN 47522-5001

Forms must be recieived by April 25, 2019 if you are not a US citizen  and by May 2, 2019 if you are a US citizen.

At the visitor’s center you will have to show:
  1. Valid Identification
    • Show valid identification usually valid driver's license from any REAL ID compliant state.
    • Currently only 5 jurisdictions are not REAL ID compliant: Illinois, Missouri, Minnesota, Washington, and America Samoa. Visitors with driver's licenses from those states will have to present an additional form of identification such as birth certificate or passport, with the exception of visitors who have either a Washington or Minnesota Enhanced Driver's License. Enhanced Driver's Licenses will be accepted as a sole form of identification.
  2.  Show current proof of insurance and vehicle registration (Rental agreement if rented vehicle)

Directions
1. From Bloomington, take I-69 south.
2. Follow I-69 for 26.9 miles to exit 87 at US-231.
3. Take US-231 south to Highway 558. Turn left onto Highway 558.
4. Follow Highway 558 to the Visitors Center on the left.
5. After the Visitors Center follow Highway 558 to the Crane Gate and follow map on next page.
The GPS Address for the Visitor Center is 102 Furlong Street, Crane, IN 47522.



 


May 16

Puget Sound Expo & Tech Forum  +

Location: DoubleTree by Hilton Seattle Airport
18740 International Boulevard
Seattle, WA 98188



Exhibitors

The cost to exhibit for corporate members is $375/$475 (early/late) and $450/$550 (early/late) for non-corporate members. The cost to exhibit includes: one 6ft draped table, two chairs, company sign, directory listing and attendee list. Electricity is an additional $40 per outlet. Earlybird pricing expires April 12th, 2019! 

 

Book Your Room with the SMTA Hotel Rate



Attendees

Parking Information:

Use the code "AA" to get the $8.00 discounted SMTA parking rate.

 

Thank You to our Technical Sessions Sponsor

 

9:30am

Registration Opens

 

10:00am

AR and VR 101: Attributes and Opportunities in the AR and VR Industries

Speaker: Marco Micheletti, Pike Product Services

This discussion is intended to provide an overview of the main players leading development and launching products in the AR and VR space, cover key technologies that make up AR and VR products and help identify opportunities to support the local AR and VR ecosystem.  We will cover the differences in the customers, applications and use cases of example products, as well as providing a break down and taxonomy of the key enabling technologies, subsystems, and features of AR and VR products.  Lastly, we will talk about the concerns, desires and current market opportunities facing the AR and VR OEMs and ask how can the local ecosystem of product development and manufacturing companies take advantage of this rising industry.

 

11:00am

Expo Opens

 

12:00pm

Complimentary Lunch

 

1:00pm

Industry 4.0 the Next Industrial Revolution - The Smart Factory

Speaker: MB Allen, KIC

Industry 4.0, IIoT, IoT, Smart Factory, Made in China 2025. It’s all the buzz but what are these trends?
Do they relate to me and my manufacturing environment? Is this something we Must implement? What
would the benefit be to my company? How does it all come together?
These questions and more will be covered during this presentation and will include an example of
‘Smart Factory’ technology.

 

3:00pm

Expo Closes


May 20

Webinar: Successful X-Ray & Optical Inspection in a Tin/Lead or Lead-Free Process  +



Bob WillisMonday 20th May @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Area Array Technology is part of mainstream electronics but until recently very few good inspection criteria were available in the industry. The assembly process for BGAs is fairly well understood for Tin/Lead alloys but with the move to Lead-free assembly, new QFN and LGA packages have critical issues to consider during inspection. The webinar covers optical and x-ray inspection of solder joints for both Tin/Lead and Lead-free terminations. It includes an introduction to the Lead-free assembly process with specific attention to BGA and area array devices. It provides a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces.

 

Topics include:

  • Procedures for inspection joints optically and by x-ray
  • Inspection criteria for joints
  • Identification of key joint features
  • Other indicators of possible failures
  • Common BGA & bottom mounted failures

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


May 21

Massachusetts (Boston) Chapter: IPC-610 Updates  +

Location
Radisson Hotel Nashua - 11 Tara Boulevard, Nashua, NH 03062



SMTA Boston Chapter cordially invites you to an evening meeting on Tuesday, May 21st, 2019 at the Radisson Hotel Nashua in Nashua, NH.
“TBD - (IPC-A-610 Updates)
 
Abstract:  TBD
Speaker: Leo Lambert Vice President, Technical Director, Consultant EPTAC Corporation
Bio:  As Technical Director for EPTAC Corporation, Leo oversees content of course offerings and provides customers with expert consultation
  • More than forty years’ experience.
  • Specific expertise in soldering, metallurgy and cleaning processes
  • Co-author of the industry’s most popular publications, including the IPC-A-600 Training Program, “The Acceptability of Printed Boards”
  • Author of “Soldering for Electronic Assemblies”, Published by Marcel Dekker, 1987
  • Published/Presented numerous papers on Soldering and Cleaning
  • Recipient of IPC President Award
  • Recipient of Distinguished Committee Service Award for contributions to
    • IPC-A-610 & J-STD-001 specifications
    • The development of Surface Mount and Plated Through-Hole solder joint evaluation videos
    • Master Instructor for IPC-A-610, IPC-6012 and IPC-A-600
 
“Rework and Assembly Processes for IPC-A-610 & J-STD-001”
 
Abstract:  Hand soldering in the electronics industry is increasingly considered a reliability risk in electronics manufacturing.  Control over pc assembly with new software systems in placement, reflow and automated inspections has given engineering better control and traceability, improving yields and reliability.  These improvements have made the difference between automated assembly and hand soldering more apparent.   Some OEM manufactures have eliminated hand soldering by disposal of nonconforming product.  This is not practical when the pc assemblies have a high value.  
In companies with expensive assemblies there is a need to extend the control to the bench assembly.  JBC Tools has developed new software systems that work in conjunction with the soldering equipment for improving controls and providing traceability. IPC J-STD 610 sets standards for soldering that can be used as a basis for setting processes for rework and assembly. This standard can be used in the JBC QST software system; we will explain how this software can be used in the J-STD.

The presentation will provide the audience with a demonstration on how the system works and give examples of how it was implemented.
 
Speaker:   Sean Torrens, US Sales Manager, Business and Engineering in LaSalle School in Barcelona & Manhattan College in New York. Sean has successfully implemented the QST system in class 3 companies all over the US; upgrading their control and traceability process for hand soldering.
 
Date: Tuesday, May 21, 2019
Time: 5:00 PM to 8:45 PM
Location: Radisson Hotel Nashua
11 Tara Boulevard, Nashua, NH 03062
Cost: Members $25 ($30 after Thursday, May16, 2019)
Non-Member  $30 ($35 after Thursday, May 16, 2019)
Meeting Agenda:
5:00 – 6:00 PM Registration and Sign in, Socializing, Networking
5:45 – 6:46 PM Dinner and Announcements
6:45 – 7:30 PM Feature IPC-610 Update Presentation
7:30 – 7:45 PM Q&A
7:45 – 8:15 PM Feature: JBC Rework Presentation
8:15 – 8:45 PM Q&A: Demo
8:45 PM Adjourn
 
Sponsor for this event:

Our 2018 Expo Sponsors:
   


For more information visit: https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=22

To register for this event visit: https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4701

Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598
Vice President : Peter Bigelow (IMI Inc.)
Phone: 978-373-9190


Future Events:
iMAPS NE – Tuesday May 7, 2019 – 46th Symposium & Expo at the Boxboro Regency Hotel & Conference Center, Boxborough, MA
IEEE Boston REL - Wednesday May 8, 2019 - An Introduction to Use Case 7 at MIT Lincoln Laboratory 3 Forbes Road, Lexington, MA 
Click here to register for this event
SMTA - Tuesday Oct. 8, 2019 - 4th New England Expo at the Boxboro Regency Hotel & Conference Center, Boxborough, MA
 


May 21

Medical Electronics Sponsorship and Table Top Exhibit  +




Exhibitors

 

Sponsorship Information

Sponsoring this event will provide a valuable opportunity to promote your company brand and product/service message to attendees, while supporting your business development and positioning goals. For benefits and pricing click on the link below. For more information contact SMTA, medical@smta.org or call 952-920-7682.

View Sponsorship Benefits

 

Advertising Opportunities

Include your ad in our show directory to get more exposure for your company. Full page and half page ad space is available, black and white only. The deadline to submit your ad is April 15, 2019. *If you wish to pay through our secure server please use the "Register to Sponsor or Exhibit" button above. For a printable application form, click here.

 

Exhibiting Information

The conference will include an exhibition area featuring 25+ tabletop displays that will be open during conference breaks plus after hours.

Exhibit benefits:

  • 1 admission to symposium
  • 6 ft. Draped table
  • Two chairs
  • Attendee list
  • Company sign
  • Breakfast, Lunch & Breaks
  • Copy of the electronic conference proceedings

 

Exhibit Pricing:
Member: $550
Non-member: $650


Exhibit Hours:
May 21: 10:00am – 5:00pm


Please note that exhibit traffic will be minimal while symposium is in session. Please e-mail SMTA at medical@smta.org or +1-952-920-7682 for sponsorship or exhibitor information.



Attendees

 

Exhibit Hall Hours:

May 21: 10:00am – 5:00pm
To Register for the technical conference, click here.


May 21 - 22

Medical Electronics Symposium  +

Location
The Tudor Arms Hotel Cleveland
Cleveland , OH 44106


May 21-22, 2019
The Tudor Arms Hotel, Cleveland, Ohio
 

Crystal Ballroom

The human body is an extremely complex "electrical (neurological) system", with companies continuing their quest to understand and improve capability as related to neural interface, basically connecting the human body directly into computers! There is no question, capabilities in smart phone/watch technologies connected to the internet erases any doubt of the potential to connect people to computers.

With the brain being the human equivalent of the "MicroProcessor", semiconductor companies such as IBM, Intel, MicroChip and MicroSemi have been well aware of potential for connectivity. Others have taken knowledge of neural interface to help humans manage their internal electrical systems, including Medtronic, Philips and Abbott, with a range of pacemakers, defibrillators and neural therapies.

Expanding the potential scope of linking the brain to computers and to the internet has attracted the likes of Amazon, Apple, Facebook, Google, MicroSoft, Neuralink and others, adding to the list that already includes J&J, G.E., T.I., Stryker, and Edwards. MicroProcessors and other ASIC Chips, coupled with MEMS and Sensors, are now seen as the “next big thing” over the next 5 years looking at the Internet of Things.

 

This event will bring together experts to cover topics such as:

* Forecasting and Analytics

* MEMS, Sensors and Integrated Circuits

* Implantable Devices and Neural Interface

* Medical Robotics, Equipment, and Prosthetics

* Advanced Materials and Reliability

 


May 28 - 30

Mexico - Guadalajara Chapter: SMTA Certification - SMT Processes  +

Guadalajara, Jalisco



The most respected sign of approval in the electronics assembly industry 

Each SMTA Certification program is a three-day offering consisting of a 1.5-day workshop on topics in SMT Processes or Lean Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination (SMT Processes) and open book examination (Lean Six Sigma Green Belt.)

This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Lean Six Sigma Green Belt.


Why You Should Participate

Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Lean Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience

The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level. The title earned by Certified SMT Process Engineers is CSMTPE or Lean Six Sigma Green Belt Engineer for Six Sigma.


​​​​​Duracion: Del 28 al 30 de Mayo, 2019.
Lenguaje: Ingles/Español 
Examen: Ingles 
Instructores: Jim Hall, ITM Consulting e Ivan Castellanos, Indium Corporation  

Costo:  USD$1220 miemberos , USD$1385 no miembros.

¿Estas interesado? Registrate aqui



May 30

Upper Midwest (Minnesota, Iowa & Dakotas) Chapter: May 30th: SMTA Upper Midwest Chapter presents “What Worked Yesterday Won’t Work Tomorrow” At John Deere Electronic Solutions – Fargo, ND  +

Location
John Deere Electronic Solutions, Fargo, ND




Upper Mid-west Chapter is hosting a “You Drive, We Buy” event for the following topic:

“What Worked Yesterday Won’t Work Tomorrow”
Speaker: James A. Springer – Manager, Quality, Product Environmental and Safety Compliance – John Deere Electronic Solutions
 
Presentation Overview: 
Join many of your colleagues to hear tales from yesterday that worked, some that didn’t and some of the big changes over the years in technology and why what worked then won’t work now, or will it. From wave solder machines with foam fluxers, bottom only preheat into thin air and a wave that kind-a rolled as the assembled board pushed through the molten solder to wave solder machines where every parameter is controlled to very tight tolerances, the process has advanced but the principles remain the same. Many Engineers have overcome new manufacturing needs with various on the fly DOE’s, trial and error efforts, and other tricks to do new things. That may have worked in the past but will not today. The need for process control, Gage R&R’s and use of six sigma tools have never been more important. Join us for some history, present day knowledge and one leader’s opinion of where the future may go and why he believes the best days of technology are still to come. 
 
Date:     Thursday, May 30th, 2019
Cost:      FREE for Members / $20 Non-members (make checks payable to SMTA)
                        (Also FREE for non-members who become a Member at the Event!!)
 
Time/Agenda:
  • 11:30 AM to 12:00 PM - Registration
  • 12:00 PM to 12:30 PM – Lunch
  • 12:30 PM to 1:30 PM – Presentation
  • 1:30 PM to 3:30 PM – Q&A / Tour
 
Lunch will be provided by the SMTA Upper Midwest Chapter.
 
RSVP by May 27th to guarantee a spot for this session.
 
Address/Directions to John Deere Electronic Solutions:
John Deere Electronic Solutions
1441 44th St. NW
Fargo, ND 58102


James Springer Biography: 
 
Manager, Quality, Product Environmental and Safety Compliance
John Deere Electronic Solutions 
 
Education: 
1979 – Electronics Technology, Hesston Jr. College
1980 – General Studies, Goshen College
1986 – Computer Programming and Operations, Control Data Institute
 
Career Highlights:
2010   John Deere Electronic Solutions
           Manager, Quality, Product Environmental and Safety Compliance
2006   John Deere Electronic Solutions
           Quality Assurance Manager
2002   John Deere Electronic Solutions
           Manager, Advanced Technology
1999   Phoenix International - Springfield
           Operations Manager
1999   Phoenix International - Springfield
           Manager Advanced Technology
1999   Phoenix International
           Manager Manufacturing Engineering
            
Career Highlights:
           Installing first automated SMT line in Kansas City area - 1985
           Innovation Award Nomination and Patent for Heatsink Attachment to PCB
           Starting the MS-Lab – 2002





June 4 - 6

International Conference for Electronics Enabling Technologies 2019  +

Location
Markham , ON Canada


The International Conference for Electronics Enabling Technologies (ICEET), formerly ICSR, is a highly technical three-day event in Toronto, ON, Canada.

Electronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.

 

Value Proposition for Participation

  • Broaden your knowledge of the wider enabling technologies
  • Deepen your skills on traditional soldering and electronics
  • Access to local engineering and science talent
  • Opportunities for cross-sector collaboration/innovation
  • Industry exposure to your work – generate interest, support, awareness & excitement
  • Build network and local-ecosystem that aligns various needs and service providers
  • Held at ventureLAB, a leading innovation hub in York Region, Canada's densest ICT cluster
  • Recognition for Best Conference Paper

 


June 4

FREE Webinar: Improving Reliability of Assemblies from a Soldering Materials Development Standpoint  +

Organized by SMTA India - Bangalore Chapter

Location
Bangalore India



Tuesday 4th June @ 9:30am India Time GMT+5:30 (12:00am US Eastern Daylight Time GMT -4)

Presenter: Shantanu Joshi, Koki Solder America Inc.

Free for members - only members will get access to recorded presentation!
Non-members: USD $10 

Members must log in to register with no fee. Non-members can pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: newprojs_ankan@yahoo.com +919620075752 or Madhukar Rao: +919686098690.

Overview

In recent years, a growing number of electronic devices are being incorporated into automotive and other high reliability end products with the challenge to make these devices more reliable. The package size of the devices is largely driven by the consumer industry with their sizes getting smaller making it harder to assemble and be reliable at the same time. For automotive and other high reliability electronics product, it is of the utmost priority to secure high reliability because it directly involves human life and safety. Challenges include selecting an appropriate solder alloy and having good reliability of the solder paste flux residue with the presentation discussing ways to improve lead-free solder joint reliability/robustness. Though SnAgCu solder alloys fulfill most soldering requirements, alternative solders are needed to meet more stringent environmental regulations, requirements for greater mechanical reliability, and more demanding high temperature service environments such as under the-hood in automobiles and in avionics systems. Development was done on alternative lead-free alloys with varying percentages of tin-silver-bismuth-indium in comparison with a number of conventional lead-free solder alloys in soldering evaluations. Accelerated thermal cycling test was performed on boards assembled with various different alternative alloys and the results were compared with conventional lead-free alloys. For the solder paste flux, there is a need in automotive and other high reliability applications to have reliable and high insulation resistance even in an atmosphere of high temperature and high humidity. Development was done on a type of ‘crack free' flux paste to inhibit flux residue cracking under extreme environments making it more reliable to stringent surface insulation resistance and electro-migration criterion from automotive and other high reliability product manufacturers. Testing was done to various industry electro-migration and dew test standards.

 

About the Presenter

Shantanu Joshi is the Regional Sales Manager for KOKI Solder America. He has a Master of Science degree in Industrial and Systems Engineering from Binghamton University and Bachelor of Engineering degree in Production Engineering from Pune University, India. He also serves as a Secretary on SMTA Ohio Valley Chapter board.

He is currently pursuing Ph.D. in Industrial and Systems Engineering concentrating on High Reliability Lead Free Solder Alloys from Binghamton University. He is published over dozen papers in various national and international conferences over the years. His co-authored paper won the “Best of Proceedings” award in SMTA International 2013. Shantanu has also won 1st prize in the poster competition held at GE Global Research Center, Niskayuna, NY for poster titled "LGA Solder Joints with Superior Reliability".

 


June 5

SMTA Ontario Chapter Expo & Tech Forum  +

In conjunction with the International Conference for Electronics Enabling Technologies (ICEET)

Location: ventureLAB
3600 Steeles Ave. East
C-C106
Markham, ON L3R 927



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, and directory listing. Electricity is an additional $25 per outlet. Early bird pricing ends on May 3, 2019!  

 



Attendees

Register here to attend the expo only!
Technical conference and workshops not included.

Plan now to join us for free technical presentations, free lunch and the chance to network with leading suppliers to our industry!

 

Exhibit Hours:
Wednesday, June 5, 2019: 10:00am – 3:00pm

 

Thank You to our Coffee Break Sponsor:

 

Thank You to our Refreshment Sponsor:

9:00am

Registration Opens

 

10:00am

Expo Opens

 

10:30am-11:00am

High Reliability Lead-Free Solder Alloys for High Brightness LED Application

Speaker: Jie Geng, Indium Corporation

 

11:00am-11:30am

Low Temperature Transient Liquid Phase Bonding for Joining SIC Power Modules

Speaker: Jae Pil Jung, University of Seoul, South Korea

 

11:30am-12:00pm

Flux Medium and Voiding: an Empirical Study

Speaker: Sirine Bayram, AIM Solder

 

12:00pm-1:00pm

Complimentary Lunch

 

1:00pm-1:45pm

Keynote: Dealing with the Challenges in the New Advanced Packaging Era

Speaker: Jan Vardaman, TechSearch International, Inc.

 

1:45pm-2:15pm

Smart Textile Applications in Medical Devices & Senior Care

Speaker: Alex Chen, Celestica, Inc. & Milad Afshar, Myant Inc.

 

3:00pm

Expo Closes


June 7

Dallas Chapter: New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA’s and PCBF’s  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA’s and PCBF’s

Speaker: Robert Boguski, President, Datest

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on June 7, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!

Abstract

Digital Computed Tomography, or CT Scanning, has advanced in equipment and techniques to such an extent that it has now become the method of choice in many applications where workmanship, fabrication, and component defects are difficult and sometimes otherwise impossible to find.
This presentation will discuss the current state of the technology (hardware as well as software); some of the basic physics underlying the methodology; and relative strengths and weaknesses of CT Scanning versus other methods, from the standpoint of results as well as cost. Numberous examples will be shown, with emphasis on PCBA and PCBF failure analysis and defect detection.


Biography

Robert Boguski, President, Datest

1981 graduate of The University of San Francisco (BA Economics).  Robert has worked in the electronics packaging and interconnect manufacturing and testing business, primarily in management positions, since he was a teenager (1975).  22 years in the bare board business, 12 years in the EMS business, and 14 years in the testing and test engineering business (Some overlap with EMS).  Robert is the Owner and President of Datest, a test engineering and failure analysis company located in Fremont, California.  Robert and/or his Company, Datest, are members of SMTA, IPC, and IEEE.  Datest is also a member of the American Society for Nondestructive Testing (ASNT) as well as the Eurpoean Institute of Printed Circuits (EIPC).  Since 2013 Robert has co-authored the Test and Measurement column for Circuits Assembly Magazine.  Robert is also currently the President of the SMTA Silicon Valley Chapter.



June 11

Ohio Valley Chapter: 4th Annual SMTA Member Appreciation Golf Outing  +

Location
Raintree Golf & Event Center, Uniontown, Ohio



The SMTA Ohio Valley Chapter is pleased to invite you to participate in our “4th Annual Member Appreciation Golf Outing”.  Golf format is a four person scramble with team prizes and skill awards.  Skins challenge $5.00 per player ($20.00 team).

Participation is absolutely “FREE” for SMTA Members and Sponsors.  Included are green fees, golf cart, practice range, sleeve of golf balls, Continental Breakfast, lunch at the turn and a Prime Rib dinner.

Winning team prizes, Skill Challenge prizes and Team Skins awards will follow dinner.

Enjoy networking with fellow SMTA members and vendors in a relaxing, fun atmosphere.
 
“Bring a guest.”  Guest golfer - not a SMTA Member: $50.00

Not a golfer, no problem. Join us for the day, enjoy riding around the course visiting with the golfers and dinner afterwards.

 
You may organize your own four-some or we will pair you up.  When registering please use the company field
(after listing your company) to enter the names of players you wish to play with.

 


June 11

Capital Chapter Tutorial Program - "Supporting High Reliability at the OEM: A PCB Perspective"  +

Location
Country Inn & Suites
Linthicum Heights , MD 21090



Instructors: Yaad Eliya and Jim Barry, PCB Techologies

June 11, 2019

9:00 a.m. - 3:00 p.m.
Country Inn & Suites
1717 West Nursery Road
Linthicum Heights, MD 21090
(443) 577-1036
 
Price:
  • Members: $200
  • Non-Members: $400
  • Capital Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $80

Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!


Topics of Discussion:

RF/Microwave Design Considerations and Options; by Yaad Elia

RF/Microwave & high-speed boards required many considerations and aspects for maximizing thermal and electrical performance. Designers for high frequency applications must understand critical parameters at the PWB stage. These parameters must be understood in order to eliminate noise, reliability, poor electrical performance, high price and low yield risks. The presenter will highlight innovative solutions, based on close cooperation between Mil/Aero designers and the PWB vendor. Actual field performance sometimes demands “beyond IPC rules/specification”, and in that respect one must provide innovative solutions such as: implementing air cavity, coin and buried passive components (resistors/ capacitors/ thermocouples/ heaters etc.), in a complex design. This is even more critical, when the hybrid/mixed materials are combined into a rigid flex stack up. Enabling designers to bring an innovation to fruition, with ALL material types in the same stack up, selective final finishes, back drill/deep cone drill/ HDI, so the compatibility between all technical requirements is optimized, will be explored during this discussion.

Thermal Mitigation Options at the Raw Card Level; by Jim Barry

Temperature is and always has been a major factor within the PCB Raw Card level. We know that the most extreme temperatures and stress facing the PCBA today, is often the reflow cycle as seen in some of the recent via stacking issues facing the industry. However, we sometimes forget the “Post Reflow” or Operating temperatures facing the product in the field; this can also be detrimental and even disastrous causing fire or catastrophic failure. The presenter will look at how the shrinkage and complexity of today’s designs are creating thermal mismatch and intense temperature. We will explore what options we have in the design, material choices and “adder options” such as heatsinks and coins to mitigate temperature. If this post thermal factor is ignored – long term effects on the operation and/or life of a product can be severely compromised. Improved thermal performance can also lead to immediate improvements and increase in performance as with thermal imaging. 

Reliability – Design for Reliability & Design for Manufacturability; by Yaad Elia & Jim Barry

The presentation will focus on two parts of the PCB Process; the first being the design and how it can directly affect the performance of the product such as a result of decisions made in the design phase. Getting your supplier(s) involved early will prevent time, save cost and provide a base for a robust design that is manufacturable. Items such as non-functional pads, via fill, stacked vs. staggered, cross-hatched grounds in Rigidflex, conductor routing, PTH preparations, pad sizes, pad/pad spacing, blind/ buried and more. The premise is to balance needs of the designer, whilst trying to maintain a reliable and robust build.

The second part of this discussion focuses on what happens to the design once it hits the PCB Manufacturer. What you specify on your design can significantly affect cost, reliability and lead-time – items such as IPC classification, compensation factors and tolerances needed and material choices. We will discuss how, as a manufacturer, processes can affect solderability issues at the assembler. Things such as DC plating vs. reverse pulse, multiple finishes, edge plating, hole placement on a rigidflex, etc.

 

Note about the presenters and the topics:

The goal of this technical meeting is to share our knowledge as a PCB Manufacturer, with the designer and the OEM, as well as the contract assembler (EMS).  PCB Technologies builds some of the world's most demanding designs and has nearly 40 years of manufacturing experience.  We are not presenting to sell but hoping to share our knowledge of the process and thus gain improvements in the reliability, yield and therefore cost of the products we all touch every day. 


About the Instructors:
Yaad EliyaYaad Eliya
CTO, R&D and Technology Manager

  • Working in PCB Technologies for the last 12 years
  • B.Sc. Engineering at Ben-Gurion University of the Negev
  • Electronic Materials Expert, especially with Rigid Flex, RADAR/Microwave and RF applications
  • Process and machinery design & architecture manager, in the PCB industry
  • Responsible for R&D and special application development, for Medical/Space & Military segments
  • Expert as "tailor made" in design stage application, and a leader in all prototypes when move from R&D to mass production
  • Background and experience - TOWER Semiconductor/Engineering & Photolithography Expert (MUV/DUV)

Jim BarryJim Barry
Solutions Architect and North American Sales Manager - PCBT

  • Printed Circuit Industry veteran for over 39 years - proficient within the disciplines of Engineering, Manufacturing & Sales...  PCB Technologiest including Design, Assembly and Box build...
  • Experienced professional; trained in mechanical engineering, PCB applications, materials and failure analysis.  Working knowledge of IPC, MIL NADCAP, AS9100 and other applicable industry specifications
  • Held various positions within the PCB Industry ranging from Manufacturing, R&D, Sales & Marketing, Engineering, as well as Corporate and Executive levels within various companies
  • Today working as a lead consultant for the world's leading Israeli PCB/PCBA manufacturing operation of High-Density Electronics for Mil/Aero & medical applications

 

Sponsored jointly by SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine

SMTA Capital Chapter    Circuits Assembly


Contact Karen Frericks at 952.920.7682 with questions.
 



June 17

Webinar: Lead-Free Selective Soldering, Design, Quality Control & Practical Defect Solutions  +



Bob WillisMonday 17th June @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

For many organisations through hole components will remain a reality for many years. More and more surface mount components are used in design, through hole is in decline, however the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products. So what is the most reliable and cost effective solution to through hole soldering in a lead-free environment? Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities with lead-free and high temperature solder alloys.

 

Topics include:

  • Why use selective soldering
  • PCB design rules for selective soldering
  • Flux requirements for selective soldering
  • Compatibility of solder masks and lead-free solder
  • Setting up lead-free profiles, you must profile a selective process!!!
  • Solder alloy choices
  • Copper dissolution with selective
  • Soldering defects on selective – Causes and Cures

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here



June 18 - 20

SMT Processes Certification (Mequon, WI)  +

Location
Rockwell Automation
Mequon , WI 53092-4400


Hosted at Rockwell Automation

  • June 18- Course (8:30-5pm)
  • June 19- ½ day of course + exam
  • June 20- All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall


June 20 - 21

eSMART Factory Conference  +

Location
The Dearborn Inn
Dearborn , MI 48124


Software Systems & Processes • Robotics • 3D Printing

eSMART Factory 2019 conference will bring together the key technologies shaping the electronics manufacturing industry and addressed by EMS companies, OEMs and Contract Manufacturers.

 


June 25 - 27

Symposium on Counterfeit Parts and Materials 2019  +

Location
College Park Marriott Hotel & Conference Center
College Park , MD


The technical program is posted and registration is now open!

 

Counterfeit Symposium Panel Discussion

Dr. Michael Azarian, CALCE, speaks during the panel discussion 'How is AS6171 Being Flowed Down? Challenges with AS671 Accreditation--Can it Handle Obsolete Part?' at the 2018 Symposium.

 


 

Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

 


 

About the Symposium

The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.


June 25 - 26

Symposium on Counterfeit Parts and Materials-Tabletop Exhibition  +

Location: College Park Marriott Hotel and Conference Center
3501 University Blvd East
Hyattsville, MD 20783



Exhibitors

Sponsorship Opportunities:

**All sponsorships require an exhibit booth reservation**
 

Lanyard Sponsorship (Limit 1) - $500 - Company to provide lanyards SOLD!
Provide your company lanyards and they will be the official lanyard for the conference. You will receive logo recognition in the show directory, conference website and signage.

Tote Bag Sponsorship (Limit 1) - $400 (if provided by company/$800 if produced by SMTA) SOLD!
Provide your logo on all of the conference attendee bags! If you would like SMTA to produce the tote bags, it will be an extra $400. There will also be recognition in the show directory and website.

Lunch Sponsorship Day 1 or Day 2 (Limit 2)-$750 SOLD!
Signage upon entrance to exhibit hall lunch and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

Refreshment Sponsorship Day 1 or Day 2 (Limit 2)-$750
Signage during PM refreshment breaks upon entrance to exhibit hall and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

 

Exhibitor Information:

Contact SMTA for available booth space. 952-920-7682 or counterfeit@smta.org Please note that exhibit traffic will be minimal while symposium is in session.



Exhibit space entitles you to:

  • 6 ft. Draped table
  • One conference pass
  • Attendee list
  • Breakfast, Lunch & Breaks
  • One copy of the conference proceedings


Download a hard copy of the registration form


Cost to exhibit:
Rates increase $100 after May 31, 2019

Booth type CALCE/SMTA Members Non-Members
One table
includes access to Electrical Outlet
$550 $650
One table
no access to Electrical Outlet
$500 $600


 

 



Attendees

Exhibit Attendees: 

Come and visit the exhibits for FREE! Plan to network with leading suppliers working to stop the proliferation of counterfeit parts in the electronics supply chain.

Show Hours Each Day: 10:00am - 3:00pm

Your expo pass gives you access to:

  • FREE Panel Discussion
  • FREE Lunch
  • FREE Refreshment Breaks


    If you would like to attend other conference sessions, please register for the conference here.

Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.


June 27

Upper Midwest Expo & Tech Forum  +

Location: DoubleTree by Hilton Minneapolis - Park Place
Park Ballroom
1500 Park Place Blvd.
Minneapolis, MN 55416



Exhibitors

The cost to exhibit for corporate members is $375/$475 (Early/Late) and $450/$550 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Early registration expires on May 31, 2019!

Important Exhibitor Materials:

 



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Thursday, June 27th, 2019
9:00AM–3:00PM

 

 


July 15

Webinar: Vapour Phase & Convection Reflow with Lead Free – Selecting the Reflow Process  +



Bob WillisMonday 15th July @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Having grown up with IR and Vapour Phase Soldering VPS during the introduction of surface mount technology its fail to say that some processes never die they just get better. Convection reflow took over from IR technology and changed the way industry looked at vapour phase but now its back. For some companies VPS never went away a simple one profile process, in Japan high end application used VPS during the introduction of lead-free technology

Both convection and vapour phase can produce reliable lead-free assemblies, there are advantages and disadvantage to any technology but they both work well and can be very cost effective that is what our surveys have said. We also bring ten years of experience with lead-free using both techniques to the conference

In this webinar the instructor will look at all aspects of the different processes, soldering performance and yield from different joint terminations, solder finishes and joint structures. Each delegate will also receive a FREE set of Bob Willis Inspection Wall Charts covering reflow soldering of lead-free terminations and common defects found in manufacture 

 

Topics include:

  • Vapour phase and convection reflow overview
  • Process parameters
  • Nitrogen/inert environment myths
  • Advantages & disadvantages of the process options
  • Design and layout considerations for VP
  • PCB solder finishes for VP & convection
  • Vapour phase materials and cost
  • Batch or inline operation
  • User experiences with VP materials and equipment
  • Profiling boards assemblies in both processes
  • Solder paste requirements
  • Comparing single and double sided reflow yields
  • Soldering flexible assemblies
  • Inspection results for reflow soldering

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


July 18

Heartland Expo & Tech Forum  +

Location: Marriott Kansas City Overland Park
10800 Metcalf Avenue
Overland Park, KS 66210



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on June 7, 2019!

 

 

Book Your Room with the SMTA Hotel Rate

or call: 800-228-9290 to book your room with the SMTA room block.

 



Attendees


August 8

Ohio Expo & Tech Forum  +

Location: Holiday Inn Cleveland Strongsville
15471 Royalton Road
Strongsville, OH 44136



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early registration pricing ends on July 8, 2019!
 

 

Book Your Room with the SMTA Hotel Rate



Attendees


August 12

Webinar: Conformal Coating - Successful Implementation & Quality Control  +



Bob WillisMonday 12th August @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Conformal coating has provided benefits to industry for many years either in the high reliability market sector or where products have to deal with extreme environmental conditions. Different industries like telecommunications, automotive and consumer products benefit from the use of selective coating.

This session will provide a simple guide to the use of coatings, their application and process, product benefits, inspection and quality control. A practical session will also allow delegates to examine coated boards using different materials and inspect the coating application. Bob Willis will outline the most common coating problems, solutions and address your specific issues in this webinar session.

 

Topics include:

  • Why Conformal Coat
  • Coating Process Options
  • Cost of coating assemblies
  • Correct design for coating
  • Inspection & Quality Control of Coating
  • In-house or Contracting Services
  • Inspection of coatings & methods

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here



August 15

Queretaro Expo & Tech Forum  +

Location: Misión Grand Juriquilla, Queretaro
Blvd Villas Del Meson 56
Juriquilla, QR 76230



Exhibitors

The cost to exhibit is $450/$550 (early/regular) for corporate members. The cost to exhibit for non corporate members is $550/$650 (early/regular).(click here for membership information).


The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $55 per outlet. Early registration pricing ends on July 12th, 2019!

Important Exhibitor Materials:

 

 

Booths are assigned in the order they are received. 

Important Exhibitor Materials:

  •  In the case of bank transfers, the dollar exchange rate must be calculated on the basis of the interbank purchase price and not the selling price. All transfers require an additional $50 USD.    
  • To pay by wire transfer please contact SMTA HQ. 1-952-920-7682 or hannah@smta.org
  • Please contact SMTA Expo Manager Hannah Funk with questions or for additional information.



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Please see the Queretaro Chapter Page for More Information on Technical Sessions.

Free Technical Program & Schedule:
Exhibit Hours:
Thursday, August 15, 2019
11:00AM–6:00PM

 


August 22

Capital Expo & Tech Forum  +

Location: Johns Hopkins University/Applied Physics Lab
Kossiakoff Center
11100 Johns Hopkins Road
Laurel, MD 20723



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early Bird pricing ends August 2nd, 2019!

Important Exhibitor Materials:



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry! Exhibit Hours:
Thursday, August 22nd, 2019
9:00AM–3:00PM
Registration Opens at 8:00AM
 




September 22 - 26

SMTA International 2019  +

Location
Donald E Stephens Convention Center
Rosemont , IL


Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering manufacturing and assembly of electronics, advanced packaging/components, inspection technologies, processes, substrates/PCB technology, soldering, quality and reliability.


September 24 - 25

SMTA International Electronics Exhibition  +

Location: Donald E. Stephens Convention Center
Rosemont, IL


Exhibitors Register Now
Exhibitors

SMTA International delivers value to you and your organization through our goal to bring our members and visitors together to focus, exchange ideas and share the newest technologies. Last year we welcomed over 1600 attendees from 21 different countries.


September 24 - 26

SMT Processes Certification (SMTA International - Rosemont, IL)  +

Location
Donald Stephens Convention Center
Rosemont , IL


Co-located with SMTA International Conference.

  • September 24 - Course (8:30-5pm)
  • September 25 - ½ day of course + exam
  • Spemteber 26 - All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


October 8

New England Expo & Tech Forum  +

Location: Boxboro Regency Hotel & Conference Center
242 Adams Place
Boxboro, MA 01719



Exhibitors

The cost to exhibit for corporate members is $450/$550 (Early/Late) and $550/$650 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 8ft pipe & draped table, two chairs, company sign, lunch, directory listing and registrant list. Early bird rates expire on September 13, 2019!

All spaces will be assigned once we are sold out. If there is another exhibitor you want to be next to please let us know when you sign up. 

 



Attendees

Free Technical Program & Schedule Coming Soon!

 

Thank You to Our Lunch Sponsor:


October 10

Mexico - Querétaro Chapter: Design for Manufacturing - Symposium  +

UTEQ



Call for Papers ! 
Now accepting papers for review.
SMTA Members please log in to auto-fill your contact info and save time ! 
or email to 
Guillermo Maldonado  gmaldonado@ste-latinoamerica.com
Marco Solis  Marco.Solis@gmx.com
 


October 15

Austin (CTEA) Expo & Tech Forum  +

Location: Norris Conference Center
2525 West Anderson Lane
#365
Austin, TX 78757



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 15, 2019!



Attendees

October 17

Long Island Expo & Tech Forum  +

Location: Melville Marriott Long Island
1350 Walt Whitman Road
Melville, NY 11747


Exhibitors

Please contact Sharon Dietrich with questions or for additional information.



Attendees
Attendees Register Now

Please see the Long Island Chapter Page for More Information on Technical Sessions and Expo Materials.

 


October 22 - 24

International Wafer-Level Packaging Conference  +

Advanced Packaging in the New Connected World

Location
DoubleTree San Jose Airport Hotel
San Jose , CA


SMTA and Chip Scale Review are pleased to announce the 16th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.


October 23 - 24

Guadalajara Expo & Tech Forum  +

Location: Expo Guadalajara
Av. Mariano Otero
#1449, CP
Verde Valle, Guadalajara, Jal. 44550



Exhibitors

Exhibitor Information: 

Prices below are per 3x3 Meter Booth:

  Before April 30, 2019 After April 30, 2019
Corporate Member $1,000 USD / $20,000 MXN $1,350 USD / $27,000 MXN
Non-Corporate Member $1,200 USD / $24,000 MXN $1,500 USD / $30,000 MXN

 

Please Contact Expo Manager, Courtney Kalb, with questions or for additional information.


October 23 - 24

International Wafer-Level Packaging Conference Exhibition  +

Location: Double Tree Hotel
2050 Gateway Place
San Jose, CA 95110



Exhibitors

Sponsorship and Exhibitor Information


Dates: October 22-23, 2019
Location: DoubleTree by Hilton Hotel, San Jose, CA

Monday, October 21
Move in: 12:00pm-5:00pm

Tuesday, October 22
10:00am-5:00pm
5:00pm-6:00pm (Networking Reception)

Wednesday, October 23
10:00am-5:00pm
Move out: 5:00pm-7:00pm

Click here for the latest floorplan


IWLPC Expo Prospectus

 

How Much is it to Exhibit?

  Early Registration
Before/On July 30th
Regular Registration
After July 30th
One Booth
(8' D x 10' W)
$1500 $1700
One Table
(6' Table)
$1100 $1300


Why Exhibit at IWLPC?

* Reach a focused international audience
* Generate Exposure in this highly competitive marketplace
* Share New Products and concepts to the market
* Enhance Relationships with existing customers and generate new leads
 

What type of attendees will be there?

Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
 



Attendees

Note - If you already registered for the IWLPC conference you do not need to register separately to attend the expo.


October 24 - 25

Additive Electronics Conference: PCB Scale to IC Scale  +

Location
DoubleTree by Hilton San Jose
San Jose , CA 95110


Today's increasingly sophisticated electronics challenge designers and fabricators to push the limits of traditional design, fabrication and assembly and think outside of the box.  Additive manufacturing enables environmental advantages, open up design capabilities and end use advantages such as weight reduction, miniaturization and 3 dimensional design.   This conference is designed to not only showcase options and processes intended to enable line width and space from .003" to 5 micron, but also provide information on supporting materials and processes that are being developed to serve all market segments and expose attendees other new advanced technologies intended to meet the ever increasing challenges of smaller, lighter and  more powerful electronic devices.

 


October 28

Intermountain (ID, UT) Chapter: SMTA Intermountain Chapter Utah Expo  +

TBD



Utah Vendor Expo actual date and location TBD.  Will not be at U of U this year.


November 5

San Diego Expo & Tech Forum  +

Location: California Center for the Arts Escondido
340 N. Escondido Blvd.
Escondido, CA 92025



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 7, 2019!



Attendees


November 7

LA/Orange County Expo & Tech Forum  +

Location: The Grand Event Center
4101 E Willow Street
Long Beach, CA 90815



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 7, 2019!



Attendees

November 20

Space Coast Expo & Tech Forum  +

Location: Melbourne Auditorium
625 East Hibiscus Blvd
Melbourne, FL



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).


The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list.Electricity is an additional $30 per outlet. Early bird pricing ends on October 15th, 2019!

Important Exhibitor Materials:

 

Book a discounted room rate at the Hilton Melbourne Rialto Place!

200 Rialto Place, Melbourne, FL 32901

Group Code: SMTA 

321-768-0200

Book Rooms Today!  



Attendees

Exhibit Hours:
Wednesday, November 20, 2019
Technical Sessions: 9:00AM-4:00PM
Expo: 10:00AM–4:00PM
Registration: Opens at 8:00AM


Free Technical Program & Schedule:
 


December 4

Silicon Valley Expo & Tech Forum  +

San Jose, CA 95131



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on November 15th, 2019!

For more information please contact Hannah Terhark, Hannah@smta.org or 952-920-7682

 



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Wednesday, December 4, 2019
10:00AM-3:00PM

Free Technical Program & Schedule:
Information to follow...



Looking for a local chapter event? Check the Chapter News page for more events.
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819