Calendar of Events

Monday 29th April @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Flexible circuits is another packaging technology which has seen a growing and wider acceptance in the electronics industry. The advantages of surface mount reduced weight; decreased size can be further enhanced by flexible circuitry. In many cases, it is a misconception that flexible circuits have to flex, they don't; many flexibles are designed purely to aid the circuit design and assembly into the final product. In this case the substrate is only flexed or formed once. The range of constructions for circuit manufacture are wide but the basics are similar to existing printed circuit production. The design and selection of the manufacturing methods can affect the final cost of the circuit and need to be considered in detail prior to manufacture. Where design departments have limited experience useful reference material is available to engineers worldwide with the release of Flexible Circuit Technology, Third Edition by Joe Fjelstad and other publications.

Topics include:

• Flexible Design for assembly
• Manual assembly and soldering
• Automatic assembly process requirements
• The need for baking flexible circuits
• Flexible circuit pallets for automatic assembly
• Screen printing, placement, reflow soldering & AOI
• Manual hand soldering and de-soldering
• Rework of conventional and surface mount
• Solder joint Inspection
• Process defects on flexible circuits and during assembly

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

LED Do’s and Don’ts

Event Details

• Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
• When: 11am-1pm on May 3, 2019
• Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
• Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

• FREE for New Members since prior meeting
• $10 for Committee Members
• $20 Members, employees of Corporate member companies, 1st time guests, and students
• $25 non-members, students, & guests – same price
• Cash at the door or credit card on-line

Get your tickets!

• I'll be there - paying at the door (Click here)
• Members: I'll be there - paying now for 10% Early Bird Discount (Click here)
• Non-Members: I'll be there - paying now for 10% Early Bird Discount (Click here)

Abstract

What to do and not to do with LEDs in a surface mount process including Paste printing, Stencil Design, picking, placing, Reflow, and test.

Biography

• Attended University of Delaware.
• Worked for Motorola in Shaumburg, IL as a SMT Manufacturing Engineer.
• Worked for Allied Signal in DOD environment as a SMT Manufacturing Engineer.
• Worked for Quad Systems as a Field Service Engineer.
• Engineer for Decatur Electronics in microwave radar.
• Redesigned to Jugs professional radar gun used by Major League Baseball.
• Opened his own contract manufacturing business, Contract Assembly Service, Inc.
• Vice President of American Circuits located in Charlotte, NC.
• Director of Engineering. The Light Source, Inc. – Design and manufacturing of high-end theatrical stage lighting.
• Trans-Tec America territory manager.

Central Texas Electronics Association

Electronics Design, Manufacturing & Test Symposium 

Tuesday, May 14, 2019

AMD Bldg B500 Auditorium at 7171 Southwest Parkway

1. Michelle Sparks at michelle.sparks.ctr@navy.mil
2. Michelle Sparks

1. Valid Identification
   • Show valid identification usually valid driver's license from any REAL ID compliant state.
   • Currently only 5 jurisdictions are not REAL ID compliant: Illinois, Missouri, Minnesota, Washington, and America Samoa. Visitors with driver's licenses from those states will have to present an additional form of identification such as birth certificate or passport, with the exception of visitors who have either a Washington or Minnesota Enhanced Driver's License. Enhanced Driver's Licenses will be accepted as a sole form of identification.
2.  Show current proof of insurance and vehicle registration (Rental agreement if rented vehicle)

Monday 20th May @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Area Array Technology is part of mainstream electronics but until recently very few good inspection criteria were available in the industry. The assembly process for BGAs is fairly well understood for Tin/Lead alloys but with the move to Lead-free assembly, new QFN and LGA packages have critical issues to consider during inspection. The webinar covers optical and x-ray inspection of solder joints for both Tin/Lead and Lead-free terminations. It includes an introduction to the Lead-free assembly process with specific attention to BGA and area array devices. It provides a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces.

Topics include:

• Procedures for inspection joints optically and by x-ray
• Inspection criteria for joints
• Identification of key joint features
• Other indicators of possible failures
• Common BGA & bottom mounted failures

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

• More than forty years’ experience.
• Specific expertise in soldering, metallurgy and cleaning processes
• Co-author of the industry’s most popular publications, including the IPC-A-600 Training Program, “The Acceptability of Printed Boards”
• Author of “Soldering for Electronic Assemblies”, Published by Marcel Dekker, 1987
• Published/Presented numerous papers on Soldering and Cleaning
• Recipient of IPC President Award
• Recipient of Distinguished Committee Service Award for contributions to
  • IPC-A-610 & J-STD-001 specifications
  • The development of Surface Mount and Plated Through-Hole solder joint evaluation videos
  • Master Instructor for IPC-A-610, IPC-6012 and IPC-A-600

Sponsor for this event:

Our 2018 Expo Sponsors:
   

May 21-22, 2019
The Tudor Arms Hotel, Cleveland, Ohio
 

The human body is an extremely complex "electrical (neurological) system", with companies continuing their quest to understand and improve capability as related to neural interface, basically connecting the human body directly into computers! There is no question, capabilities in smart phone/watch technologies connected to the internet erases any doubt of the potential to connect people to computers.

With the brain being the human equivalent of the "MicroProcessor", semiconductor companies such as IBM, Intel, MicroChip and MicroSemi have been well aware of potential for connectivity. Others have taken knowledge of neural interface to help humans manage their internal electrical systems, including Medtronic, Philips and Abbott, with a range of pacemakers, defibrillators and neural therapies.

Expanding the potential scope of linking the brain to computers and to the internet has attracted the likes of Amazon, Apple, Facebook, Google, MicroSoft, Neuralink and others, adding to the list that already includes J&J, G.E., T.I., Stryker, and Edwards. MicroProcessors and other ASIC Chips, coupled with MEMS and Sensors, are now seen as the “next big thing” over the next 5 years looking at the Internet of Things.

This event will bring together experts to cover topics such as:

* Forecasting and Analytics

* MEMS, Sensors and Integrated Circuits

* Implantable Devices and Neural Interface

* Medical Robotics, Equipment, and Prosthetics

* Advanced Materials and Reliability

The most respected sign of approval in the electronics assembly industry 

Each SMTA Certification program is a three-day offering consisting of a 1.5-day workshop on topics in SMT Processes or Lean Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination (SMT Processes) and open book examination (Lean Six Sigma Green Belt.)

This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Lean Six Sigma Green Belt.

Why You Should Participate

• Enhance your stature in our industry
• Increase marketing value for your company
• Obtain proof of your knowledge and experience

The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level. The title earned by Certified SMT Process Engineers is CSMTPE or Lean Six Sigma Green Belt Engineer for Six Sigma.

​​​​​Duracion: Del 28 al 30 de Mayo, 2019.
Lenguaje: Ingles/Español 
Examen: Ingles 
Instructores: Jim Hall, ITM Consulting e Ivan Castellanos, Indium Corporation  
Costo:  USD$1220 miemberos , USD$1385 no miembros.

• 11:30 AM to 12:00 PM - Registration
• 12:00 PM to 12:30 PM – Lunch
• 12:30 PM to 1:30 PM – Presentation
• 1:30 PM to 3:30 PM – Q&A / Tour

The International Conference for Electronics Enabling Technologies (ICEET), formerly ICSR, is a highly technical three-day event in Toronto, ON, Canada.

Electronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.

Value Proposition for Participation

• Broaden your knowledge of the wider enabling technologies
• Deepen your skills on traditional soldering and electronics
• Access to local engineering and science talent
• Opportunities for cross-sector collaboration/innovation
• Industry exposure to your work – generate interest, support, awareness & excitement
• Build network and local-ecosystem that aligns various needs and service providers
• Held at ventureLAB, a leading innovation hub in York Region, Canada's densest ICT cluster
• Recognition for Best Conference Paper

Tuesday 4th June @ 9:30am India Time GMT+5:30 (12:00am US Eastern Daylight Time GMT -4)

Presenter: Shantanu Joshi, Koki Solder America Inc.

Free for members - only members will get access to recorded presentation!
Non-members: USD $10 

Members must log in to register with no fee. Non-members can pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: newprojs_ankan@yahoo.com +919620075752 or Madhukar Rao: +919686098690.

Overview

In recent years, a growing number of electronic devices are being incorporated into automotive and other high reliability end products with the challenge to make these devices more reliable. The package size of the devices is largely driven by the consumer industry with their sizes getting smaller making it harder to assemble and be reliable at the same time. For automotive and other high reliability electronics product, it is of the utmost priority to secure high reliability because it directly involves human life and safety. Challenges include selecting an appropriate solder alloy and having good reliability of the solder paste flux residue with the presentation discussing ways to improve lead-free solder joint reliability/robustness. Though SnAgCu solder alloys fulfill most soldering requirements, alternative solders are needed to meet more stringent environmental regulations, requirements for greater mechanical reliability, and more demanding high temperature service environments such as under the-hood in automobiles and in avionics systems. Development was done on alternative lead-free alloys with varying percentages of tin-silver-bismuth-indium in comparison with a number of conventional lead-free solder alloys in soldering evaluations. Accelerated thermal cycling test was performed on boards assembled with various different alternative alloys and the results were compared with conventional lead-free alloys. For the solder paste flux, there is a need in automotive and other high reliability applications to have reliable and high insulation resistance even in an atmosphere of high temperature and high humidity. Development was done on a type of ‘crack free' flux paste to inhibit flux residue cracking under extreme environments making it more reliable to stringent surface insulation resistance and electro-migration criterion from automotive and other high reliability product manufacturers. Testing was done to various industry electro-migration and dew test standards.

About the Presenter

Shantanu Joshi is the Regional Sales Manager for KOKI Solder America. He has a Master of Science degree in Industrial and Systems Engineering from Binghamton University and Bachelor of Engineering degree in Production Engineering from Pune University, India. He also serves as a Secretary on SMTA Ohio Valley Chapter board.

He is currently pursuing Ph.D. in Industrial and Systems Engineering concentrating on High Reliability Lead Free Solder Alloys from Binghamton University. He is published over dozen papers in various national and international conferences over the years. His co-authored paper won the “Best of Proceedings” award in SMTA International 2013. Shantanu has also won 1st prize in the poster competition held at GE Global Research Center, Niskayuna, NY for poster titled "LGA Solder Joints with Superior Reliability".

New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA’s and PCBF’s

Event Details

• Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
• When: 11am-1pm on June 7, 2019
• Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
• Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

• FREE for New Members since prior meeting
• $10 for Committee Members
• $20 Members, employees of Corporate member companies, 1st time guests, and students
• $25 non-members, students, & guests – same price
• Cash at the door or credit card on-line

Get your tickets!

• I'll be there - paying at the door (Click here)
• Members: I'll be there - paying now for 10% Early Bird Discount (Click here)
• Non-Members: I'll be there - paying now for 10% Early Bird Discount (Click here)

Abstract

Digital Computed Tomography, or CT Scanning, has advanced in equipment and techniques to such an extent that it has now become the method of choice in many applications where workmanship, fabrication, and component defects are difficult and sometimes otherwise impossible to find.
This presentation will discuss the current state of the technology (hardware as well as software); some of the basic physics underlying the methodology; and relative strengths and weaknesses of CT Scanning versus other methods, from the standpoint of results as well as cost. Numberous examples will be shown, with emphasis on PCBA and PCBF failure analysis and defect detection.

Biography

Robert Boguski, President, Datest

1981 graduate of The University of San Francisco (BA Economics).  Robert has worked in the electronics packaging and interconnect manufacturing and testing business, primarily in management positions, since he was a teenager (1975).  22 years in the bare board business, 12 years in the EMS business, and 14 years in the testing and test engineering business (Some overlap with EMS).  Robert is the Owner and President of Datest, a test engineering and failure analysis company located in Fremont, California.  Robert and/or his Company, Datest, are members of SMTA, IPC, and IEEE.  Datest is also a member of the American Society for Nondestructive Testing (ASNT) as well as the Eurpoean Institute of Printed Circuits (EIPC).  Since 2013 Robert has co-authored the Test and Measurement column for Circuits Assembly Magazine.  Robert is also currently the President of the SMTA Silicon Valley Chapter.

Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

Topics of Discussion:

RF/Microwave Design Considerations and Options; by Yaad Elia

RF/Microwave & high-speed boards required many considerations and aspects for maximizing thermal and electrical performance. Designers for high frequency applications must understand critical parameters at the PWB stage. These parameters must be understood in order to eliminate noise, reliability, poor electrical performance, high price and low yield risks. The presenter will highlight innovative solutions, based on close cooperation between Mil/Aero designers and the PWB vendor. Actual field performance sometimes demands “beyond IPC rules/specification”, and in that respect one must provide innovative solutions such as: implementing air cavity, coin and buried passive components (resistors/ capacitors/ thermocouples/ heaters etc.), in a complex design. This is even more critical, when the hybrid/mixed materials are combined into a rigid flex stack up. Enabling designers to bring an innovation to fruition, with ALL material types in the same stack up, selective final finishes, back drill/deep cone drill/ HDI, so the compatibility between all technical requirements is optimized, will be explored during this discussion.

Thermal Mitigation Options at the Raw Card Level; by Jim Barry

Temperature is and always has been a major factor within the PCB Raw Card level. We know that the most extreme temperatures and stress facing the PCBA today, is often the reflow cycle as seen in some of the recent via stacking issues facing the industry. However, we sometimes forget the “Post Reflow” or Operating temperatures facing the product in the field; this can also be detrimental and even disastrous causing fire or catastrophic failure. The presenter will look at how the shrinkage and complexity of today’s designs are creating thermal mismatch and intense temperature. We will explore what options we have in the design, material choices and “adder options” such as heatsinks and coins to mitigate temperature. If this post thermal factor is ignored – long term effects on the operation and/or life of a product can be severely compromised. Improved thermal performance can also lead to immediate improvements and increase in performance as with thermal imaging. 

Reliability – Design for Reliability & Design for Manufacturability; by Yaad Elia & Jim Barry

The presentation will focus on two parts of the PCB Process; the first being the design and how it can directly affect the performance of the product such as a result of decisions made in the design phase. Getting your supplier(s) involved early will prevent time, save cost and provide a base for a robust design that is manufacturable. Items such as non-functional pads, via fill, stacked vs. staggered, cross-hatched grounds in Rigidflex, conductor routing, PTH preparations, pad sizes, pad/pad spacing, blind/ buried and more. The premise is to balance needs of the designer, whilst trying to maintain a reliable and robust build.

The second part of this discussion focuses on what happens to the design once it hits the PCB Manufacturer. What you specify on your design can significantly affect cost, reliability and lead-time – items such as IPC classification, compensation factors and tolerances needed and material choices. We will discuss how, as a manufacturer, processes can affect solderability issues at the assembler. Things such as DC plating vs. reverse pulse, multiple finishes, edge plating, hole placement on a rigidflex, etc.

Note about the presenters and the topics:

The goal of this technical meeting is to share our knowledge as a PCB Manufacturer, with the designer and the OEM, as well as the contract assembler (EMS).  PCB Technologies builds some of the world's most demanding designs and has nearly 40 years of manufacturing experience.  We are not presenting to sell but hoping to share our knowledge of the process and thus gain improvements in the reliability, yield and therefore cost of the products we all touch every day. 

About the Instructors:
Yaad Eliya
CTO, R&D and Technology Manager

• Working in PCB Technologies for the last 12 years
• B.Sc. Engineering at Ben-Gurion University of the Negev
• Electronic Materials Expert, especially with Rigid Flex, RADAR/Microwave and RF applications
• Process and machinery design & architecture manager, in the PCB industry
• Responsible for R&D and special application development, for Medical/Space & Military segments
• Expert as "tailor made" in design stage application, and a leader in all prototypes when move from R&D to mass production
• Background and experience - TOWER Semiconductor/Engineering & Photolithography Expert (MUV/DUV)

Jim Barry
Solutions Architect and North American Sales Manager - PCBT

• Printed Circuit Industry veteran for over 39 years - proficient within the disciplines of Engineering, Manufacturing & Sales...  PCB Technologiest including Design, Assembly and Box build...
• Experienced professional; trained in mechanical engineering, PCB applications, materials and failure analysis.  Working knowledge of IPC, MIL NADCAP, AS9100 and other applicable industry specifications
• Held various positions within the PCB Industry ranging from Manufacturing, R&D, Sales & Marketing, Engineering, as well as Corporate and Executive levels within various companies
• Today working as a lead consultant for the world's leading Israeli PCB/PCBA manufacturing operation of High-Density Electronics for Mil/Aero & medical applications

Sponsored jointly by SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine

Contact Karen Frericks at 952.920.7682 with questions.
 

Monday 17th June @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

For many organisations through hole components will remain a reality for many years. More and more surface mount components are used in design, through hole is in decline, however the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products. So what is the most reliable and cost effective solution to through hole soldering in a lead-free environment? Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities with lead-free and high temperature solder alloys.

Topics include:

• Why use selective soldering
• PCB design rules for selective soldering
• Flux requirements for selective soldering
• Compatibility of solder masks and lead-free solder
• Setting up lead-free profiles, you must profile a selective process!!!
• Solder alloy choices
• Copper dissolution with selective
• Soldering defects on selective – Causes and Cures

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Hosted at Rockwell Automation

• June 18- Course (8:30-5pm)
• June 19- ½ day of course + exam
• June 20- All day exam (8:30-5pm)


• Instruction: English
  Test: English
  Instructor: Jim Hall

Software Systems & Processes • Robotics • 3D Printing

eSMART Factory 2019 conference will bring together the key technologies shaping the electronics manufacturing industry and addressed by EMS companies, OEMs and Contract Manufacturers.

The technical program is posted and registration is now open!

Dr. Michael Azarian, CALCE, speaks during the panel discussion 'How is AS6171 Being Flowed Down? Challenges with AS671 Accreditation--Can it Handle Obsolete Part?' at the 2018 Symposium.

Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

About the Symposium

The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.

Monday 15th July @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Having grown up with IR and Vapour Phase Soldering VPS during the introduction of surface mount technology its fail to say that some processes never die they just get better. Convection reflow took over from IR technology and changed the way industry looked at vapour phase but now its back. For some companies VPS never went away a simple one profile process, in Japan high end application used VPS during the introduction of lead-free technology

Both convection and vapour phase can produce reliable lead-free assemblies, there are advantages and disadvantage to any technology but they both work well and can be very cost effective that is what our surveys have said. We also bring ten years of experience with lead-free using both techniques to the conference

In this webinar the instructor will look at all aspects of the different processes, soldering performance and yield from different joint terminations, solder finishes and joint structures. Each delegate will also receive a FREE set of Bob Willis Inspection Wall Charts covering reflow soldering of lead-free terminations and common defects found in manufacture 

Topics include:

• Vapour phase and convection reflow overview
• Process parameters
• Nitrogen/inert environment myths
• Advantages & disadvantages of the process options
• Design and layout considerations for VP
• PCB solder finishes for VP & convection
• Vapour phase materials and cost
• Batch or inline operation
• User experiences with VP materials and equipment
• Profiling boards assemblies in both processes
• Solder paste requirements
• Comparing single and double sided reflow yields
• Soldering flexible assemblies
• Inspection results for reflow soldering

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Monday 12th August @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Conformal coating has provided benefits to industry for many years either in the high reliability market sector or where products have to deal with extreme environmental conditions. Different industries like telecommunications, automotive and consumer products benefit from the use of selective coating.

This session will provide a simple guide to the use of coatings, their application and process, product benefits, inspection and quality control. A practical session will also allow delegates to examine coated boards using different materials and inspect the coating application. Bob Willis will outline the most common coating problems, solutions and address your specific issues in this webinar session.

Topics include:

• Why Conformal Coat
• Coating Process Options
• Cost of coating assemblies
• Correct design for coating
• Inspection & Quality Control of Coating
• In-house or Contracting Services
• Inspection of coatings & methods

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering manufacturing and assembly of electronics, advanced packaging/components, inspection technologies, processes, substrates/PCB technology, soldering, quality and reliability.

Co-located with SMTA International Conference.

• September 24 - Course (8:30-5pm)
• September 25 - ½ day of course + exam
• Spemteber 26 - All day exam (8:30-5pm)


• Instruction: English
  Test: English
  Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
  Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
• Enhance your stature in our industry
• Increase marketing value for your company
• Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.

SMTA and Chip Scale Review are pleased to announce the 16th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.

Today's increasingly sophisticated electronics challenge designers and fabricators to push the limits of traditional design, fabrication and assembly and think outside of the box.  Additive manufacturing enables environmental advantages, open up design capabilities and end use advantages such as weight reduction, miniaturization and 3 dimensional design.   This conference is designed to not only showcase options and processes intended to enable line width and space from .003" to 5 micron, but also provide information on supporting materials and processes that are being developed to serve all market segments and expose attendees other new advanced technologies intended to meet the ever increasing challenges of smaller, lighter and  more powerful electronic devices.