Calendar of Events

Date: February 19, 2019 @ 5pm
 
Speaker:
Aaron Caplan
Director of Marketing & Training
PACE Worldwide
 
Location:
PACENTER Training Facility
6605 Selnick Drive #C
Elkridge, MD 21075
  

• 5:30 – 6:15: Registration/Dinner
• 6:15 – 7:15: Presentation
• 7:15 – 7:45: Demonstration

 “Non-Destructive BGA/Area Array Component Rework.”
 
Abstract:
In the past 20 years, such mundane operations as soldering, desoldering and component replacement have become complicated by extreme micro-miniaturization, the use of lead-free solders, new thermally challenging pc boards, heat-sinking bottom terminated components and intricate component packages that are difficult to rework or install. One area that presents unique challenges is BGA/Area Array rework. Modern boards that use these components are more technically demanding than ever, requiring skilled operators who are highly competent at accomplishing delicate, intricate soldering and rework tasks. Unfortunately, many operators will cause more damage to the assembly or components due to his/her rework actions. As a result, many manufacturers struggle to repair or rework boards, opting to throw away lower value boards or hire outside contractors to perform the more difficult repairs. This presentation will review current techniques and procedures for performing highly reliable, high-quality rework and repair on some of the more difficult BGA packages and will include live demonstrations of BGA rework using available convective and infrared heating techniques. The presentation will address typical BGA/area array components, heating technologies (convection and infrared), the importance of bottom side preheating, flux application, solder paste stenciling, device alignment methods and thermal profiling techniques, followed by a live demonstration of BGA rework.
 
 
About the Speaker:
Aaron Caplan is the Director of Marketing & Training for PACE Worldwide, a company solely focused on providing innovative, cost-effective solutions in hands-on soldering, rework and repair of advanced electronics to companies and government around the globe for well over 50 years. Mr. Caplan has been involved in electronics manufacturing technology since the 80's and is an acknowledged expert in Miniature/Microminiature Electronics Repair. A CIT in IPC-7711/IPC 7721, he provides technical expertise in teaching of non-destructive PCB rework/repair techniques, educating industry on how to properly utilize these techniques. In addition to his marketing duties, Mr. Caplan also coordinates the Training Department and Video Production Team, providing direction for a wide variety of video production projects.
 

The review and revision to J-STD-001 on ionic cleanliness has a new protocol.  The new standard changes how we qualify the cleanliness of our assemblies.

Cleaning expert Debbie Carboni will present:

·         An overview of the new protocol

·         What the changes mean for assemblers

·         The impact on process qualification and process control

·         Generating “Objective Evidence” for level 1 and level 2 qualification

All attendees will see:

·         New test coupons for qualifying, optimizing and monitoring cleanliness

·         Passed and Failed test coupons

An open Question and Answer session will enable attendees to discuss their specific process needs and changes to gain compliance with the new standard.
 

This webinar has been cancelled!

Tuesday, February 19, 2019 1:00pm to 2:30pm Eastern
Presented by: Bob Wettermann, BEST Inc.

What You Can Learn From This Course:

This webinar is a “how to” guide for reballing intended for PCB rework and repair depots as well as device reclaimers. These sessions will take those interested in reballing devices through the entire process of setting up the equipment, developing and verifying the process. The first topic will cover the need for reballing of BGAs, CSPs and other devices. The second section will focus on the equipment set recommended for reballing and the third section the various process steps for reballing a device. A variety of different methods for both deballing and reballing will be discussed with the various advantages and disadvantages discussed to each approach.  Both plastic-packaged parts as well as ceramic parts reballing will be discussed. Inspection of the reballed components, the type of reliability testing data currently publicly available will be reviewed as well as some ideas for developing your own specifications if you want to outsource this activity.

This webinar is designed for process engineers, rework technicians and others interested in repairing electronics.

Instructor Bio:
Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.

• Bachelor of Science degree in Electrical Engineering Technology from Alabama A&M University (Huntsville, Alabama);
• Master of Science degree in Electrical Engineering from Howard University (Washington, D.C.);
• PhD in Ministerial Education from KME University (Athens, Alabama)/Freedom Bible College of Arkansas.
• Certification in Fiber Optics Manufacturing from California State Polytechnic University (Pomona, California)
• Certification in Optical Fiber Engineering from George Washington University (Washington, D.C.)
• And served as a Professor of Electrical Engineering at Alabama A&M University (Huntsville, Alabama).

• Walter Hawkins
• The Mississippi Mass Choir
• Dottie Peoples
• Luther Barnes
• Mighty Clouds of Joy
• Edwin Hawkins (performer of the hit song “OH HAPPY DAY”)
• The Platters
• and many others

All meeting attendees must enter through the South entrance (adjacent to shipping dock).

• Take exit 14B to Al-255N/Research Park Blvd
• Take exit Bradford Drive West
• Turn left Explorer Blvd (heading south)
• Turn right into parking lot, merge left and follow parking lot to pond
• Building entrance will be on north of parking lot

• RSVP Link: smta.org/chapters/rsvp.cfm?BEE_ID=4656
• send email to HSVSMTA@gmail.com

The electronics design, packaging and assembly industries are being challenged to adapt to the needs of mature industry sectors such as the military/aerospace/defense segment to the fast changing requirement of the wearables, IoT segments.  The result is the revolution of new materials that may or may not suitable for its intended application.  The AREA consortium and the APL lab have characterized and implemented these new materials in novel end products along with conducting applied research to understand the impact on manufacturing techniques.  This roadmap discussion reviews and discusses the materials, alternative assembly processes and the reliability that will enable manufacturers to produce novel devices to the market.

Co-located with Guadalajara Expo.

• March 12- Course (8:30-5pm)
• March 13- ½ day of course + exam
• March 14- All day exam (8:30-5pm)


• Instruction: English/Spanish
  Test: English
  Instructor: Ivan Castellanos

     

• Pillarhouse - Jonathan Wol: Understanding fluxes and how they impact the selective soldering process.
• Kurtz Ersa - Ernie Grice: Fundamentals of the soldering process as pertained to wave and selective soldering and outline why selective soldering is poised to become the standard for thru-hole soldering versus antiquated, black art of wave soldering.      
• Laserssel - Denis Barbini: A Novel and Enabling Solution For Reflowing Challenging Mainstream and Alternative Electronics.  Presentation will provide step-by-step process development, material compatibility, reliability and productivity of this area laser selective reflow technique for mainstream and unique electronics designs.
• MTA Automation - Will Hunter: Induction and Micro-Flame soldering and when to use them.
• Facility tour of Crown Equipment Corporation electronic assembly operations.

¡El Capítulo de SMTA Juárez está de vuelta! Estamos organizando una gran reunión técnica el Jueves 14 de Marzo del 2019 para celebrar y nos gustaría invitarle a USTED a asistir.

Los usuarios de tecnología SMT (OEM, EMS, fabricantes contratados) están especialmente invitados a asistir. Si este capítulo va a sobrevivir en el futuro, necesitaremos su apoyo.

INFORMACIÓN IMPORTANTE:

Fecha: Jueves, Marzo 14, 2019

Hora: 5:30-9:00 p.m.  

Nota especial: Las puertas se abrirán a las 5:00. Tendremos varios sorteos para los Miembros Usuarios. ¡Llegue temprano para aumentar sus posibilidades de ganar un premio fabuloso!

Ubicación: Centro de Convenciones Cuatro Siglos

Direccion: Boulevard Juan Pablo II (Blvd. Cuatro Siglos) y Av. Arizona.

Ciudad Juárez 32402

Monday 18th March @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

The presentation provides a better understanding of solder paste selection and the use of stencil printing in modern fine pitch manufacture. Surface mount components are now at lead spacing of below 0.020″, only the correct selection of solder paste and specification of stencils can lead to effective printing. The session aims to provide a basic understanding of the design, production and quality control issues, both theoretical and practical issues of printing conventional surface mount and through hole for intrusive reflow.

Topics include:

• Design of lands and apertures for fine pitch SMT & BGA
• Through hole printing requirements
• Selection of stencils
• Evaluation of solder pastes
• Practical machine set-up and trial prints
• Elimination of board wash-off
• Assessment of paste and stencil combinations
• Solder paste inspection, measurement and quality control
• Stencil Inspection and quality control
• Cleaning stencils
• Printed board requirements for printing fine pitch

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Register Now!

Click Here to Register for the Dallas Expo and Tech Forum!

Are you a...

• Manager of Design or Manufacturing
• Process engineer
• Design Engineer
• Supply Chain Professional
• Purchasing
• Test Engineer
• Manufacturing or Test Technician

The Dallas Expo has everything you need to do with Design and Manufacturing of Electronics!

Event Details

• Date: Tuesday, March 19, 2019
• Time: Doors open at 8am
• Location: Plano Event Center (2000 E. Sprint Creek Parkway, Plano, TX 75074)
• Food: Complementary Lunch Buffet
• More info: smta.org/expos/#dallas
• Questions? Call Hannah Terhark at 952-920-7682

Technical Sessions

8:30AM
You Design & You Manufacture Complex Multilayer Circuits with 3D Printing 
Speaker: Ofer Maltiel, Nano Dimension
Bio: My driving passion in life is to help people succeed. The client’s goal is my first priority. Whether it's connecting them with an important contact or sharing from my 10 years’ experience as a hardware design engineer, I do whatever I can to help my clients thrive. Over the past 10 years, I've learned how to bring a product from the inception stage to life in various industries, cultivating lifelong relationships.

• The role of additive electronics manufacturing in Industry 4.0
• The increasing synergy between the additive manufacturing of electronics and the IoT
• Industry timelines for production-scale 3D printed electronics

 
9:15AM
On-Going Cleanliness Testing on Production Hardware
Speaker: Mike Bixenman, Kyzen
Bio:

Dr. Michael Bixenman (aka Dr. Mike) is known to many as the world’s leading expert in cleaning electronic circuit assemblies and advanced packages.  He is also one of the industry’s leading authorities on the design of electronic assembly, cleaning materials and process integration. In fact, Dr. Mike literally wrote the book on electronics manufacturing process cleaning standards (Cleaning & Contamination Process Guide).  
Abstract: The performance and cost advances over the past 20 years have enabled technologies to advance beyond what anyone could have imagined. In spite of these technology advances, the cleanliness standards that contractors rely on to ensure the design, production, and quality of next-generation Class 2 & 3 electronic hardware has remained unchanged. As technologies advance, the companies who build the device need guidance on what to do and how to do it.  
 
Flux residues trapped under low standoff leadless components on Pb-Free assemblies may still be active due to blocked outgassing channels, even when using a no-clean solder paste. Quantifying the risk of site-specific residues under problematic components is commonly done during the materials and process validation using chemical and electrical test methods. Process verification and validation are done to characterize and prove out the process on the materials used to build production hardware. Once the printed circuit assembly is placed into production, process control test methods to assure conformance are lacking. 

11:00AM
BGA’s, LGA’s, QFN/DFN’s – Oh My, Can Traditional DFM Survive 
Speaker: Dale Lee, Plexus Corporation
Bio: 

Abstract: Today’s electronic product designs are rapidly increasing the use of bottom terminated components (BTC’s), whether they are collapsible/non-collapsible ball grid array (BGA), solder bump grid array (BGA?), land grid array (LGA), quad-flatpack no-lead (QFN) or dual-flatpack no-lead (DFN) component packaging technologies.  However, with some BTC package designs vary greatly in solder pad design and pitch within the same package.  This variability impacts the ability to incorporate good DFM practices and selection of applicable assembly workmanship rules for these and other standard BTC component package designs. This presentation will highlight impact elements these component technologies have on the assembly, cleaning and inspection processes and what actions can be made during the DFM and NPI process to minimize yield impacts on the manufacturing process.


1:30PM
Women in the Electronics Industry
Speaker: Billi Curtin, ITW Contamination Control Electronics
Bio: 

Abstract: It is not easy being a woman in the electronics industry.  We are strong ladies who have chosen to flaunt convention and work in a traditionally male-dominated field.  However in doing so, we often struggle with feelings of isolation, frustration, and anger. But why? Is it due to the patronizing comments from male coworkers, the gender wage gap, the lack of work-life balance, or simply because the “thick skin” you’ve had to develop over the years isn’t really that impervious?Regardless of the reasons, tapping into sources of empowerment, not blame, are key.

Completely bypassing social commentary on gender issues, this presentation will focus on tools and techniques to identify personal strengths and leverage them to neutralize gender-bias, silence your critics, avoid gender-based pitfalls without ostracism in the workplace, influence and lead (even without authority), and gain recognition and respect from your male counterparts.


3:00PM
Rework 101
Speaker: Viswam Puligandla
Get an exclusive look at the latest SMTA online training course, Rework 101, to close out the expo!
Bio: Industry veteran, Viswam Puligandla, Ph.D., will step through the basic rework process for both SMT and through-hole components. 
Abstract: Learn about critical temperature and moisture considerations, heating methods, types of acceptance criteria, and more. This course is intended for entry-level technicians or operators, engineers new to the industry, or even someone who has been away from the process for a while.
Topics Covered:

• Rework, Repair and Modification Definitions
• Rework Temperature Considerations
• Moisture Sensitivity
• Rework Equipment
• Basic Process Steps
• Rework Process Flow Chart Examples
• Rework of Surface Mount Components
• Rework of Insertion Mount Components
• Board Repair
• Acceptance Criteria

Thank you, sponsors!

SVTronics

• March 19 Course (8:30-5pm)
• March 20 ½ day of course + exam
• March 21 All day exam (8:30-5pm)


• Instruction: English
  Test: English
  Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
  Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
• Enhance your stature in our industry
• Increase marketing value for your company
• Obtain proof of your knowledge and experience
• The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.

Please join us for our 2019 Houston SMTA Expo & Tech Forum at the Stafford Centre, 10505 Cash Road, Stafford, Texas 77477.  If you look forward to seeing the latest products and services in the industry and an opportunity to enjoy presentations by experts in our profession, you won’t want to miss this show!

Come see over 60 local and national tabletop exhibitors. Free lunch from 12:00 Noon to 12:45 P.M catered by Kelley's Country Cookin and lots of chances to win door prizes. We’ll also have drawings after each technical session. You must be present to win.

This is a free show for attendees. We are pleased to offer another outstanding technical program with information and technology presented by industry leaders to keep your skills up to date!

To register for the show, go to http://www.smta.org/expos/#houston and register in the attendee section.

Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

Topics Covered:

• Solderability Issues from the PCB Fabrication Perspective
  - Speaker:  Yaad Eliya
  - Synopsis:
     *  The speaker will discuss the PCB Manufacturing process and how it has a direct effect on the solderability process
      *  Items such as plating technique (DC plating vs. Reverse plating), Final finished and other processes that effect the assembly
   
• Design for Reliability
  - Speaker:  Yaad Eliya
  - Synopsis:
      *  The speaker will discuss how design aspects can directly affect the reliability of the raw card at the assembly level
      *  Items such as Non-functional pads, via-fill, cross hatched grounds, conductor routing, PTH preparations, etc. -- and their effects on reliability
   
• RF/Microwave Design Considerations and Options
  - Speaker:  Yaad Eliya
  - Synopsis:
      *  The speaker will discuss the Do's and Don'ts for RF & Microwave success
      *  Items such as materials, lamination cycles, Single vs. double cavities and "Air Cavity" for varying frequencies will be discussed
   
• Thermal Mitigation Options at the Raw Card Level
  - Speaker:  Jim Barry
  - Synopsis:
      *  The speaker will discuss the options available for Thermal mitigations at the raw card level
      *  As designs get smaller and faster, high temperature is becoming a big issue - we will look at Materials, Heatsinks and Coins to help mitigate heat

About the Instructors:
Yaad Eliya

CTO, R&D and Technology Manager

• Working in PCB Technologies for the last 12 years
• B.Sc. Engineering at Ben-Gurion University of the Negev
• Electronic Materials Expert, with especially at Rigid Flex, RADAR/Microwave and RF applications
• Process and machinery design & architecture manager, in the PCB industry
• Responsible for R&D and special application development, for Medical/Space & Military segments
• Expert as "tailor made" in design stage application, and a leader in all prototypes when move from R&D to mass production
• Background and experience - TOWER Semiconductor/Engineering & Photolithography Expert (MUV/DUV)

Jim Barry

Solutions Architect and North American Sales Manager - PCBT

• Printed Circuit Industry veteran for over 39 years - proficient within the disciplines of Engineering, Manufacturing & Sales...  PCB Technologiest including Design, Assembly and Box build...
• Experienced professional; trained in mechanical engineering, PCB applications, materials and failure analysis.  Working knowledge of IPC, MIL NADCAP, AS9100 and other applicable industry specifications
• Held various positions within the PCB Industry ranging from Manufacturing, R&D, Sales & Marketing, Engineering, as well as Corporate and Executive levels within various companies
• Today working as a lead consultant for the world's leading Israeli PCB/PCBA manufacturing operation of High-Density Electronics for Mil/Aero & medical applications

Sponsored jointly by SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine

Contact Karen Frericks at 952.920.7682 with questions.
 

The conference will focus on building reliable electronics used in power electronics and harsh environments.

Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
 

The Chrys and Phil Show

Brought to you by two serious industry experts who don't take themselves too seriously, Phil Zarrow and Chrys She.  Together, they combine over six decades of SMT experience, hundreds of publications and dozens of awards.  Phil brings vast experience and insight, Chrys brings the data from indepndent research, and both of the like to deliver their knowledge in fun, interactive environments.

Pre-requisites:

• Some SMT assembly process experience
• A working sense of humor

Come to the BRAND NEW Space Coast Tutorial to learn:

Solder Paste

Solder Paste - what is it?

• How it is made, particle size classifications
• How it behaves - viscosity, thixotropy, rheology
• Balancing performance properties and why every formulation is different
• 25 paste characteristics that affect SMT line performance
• Finding the right product for the job
• Environmental and handling considerations

BREAK

Printing

Stencils - aperture rules (5 ball rule, area ratio...)

Stencils - techniques and materials (fine grain ss, nano, etc.)

Printing mechanics

• Printing considerations and parameters
• Gasketing
• Coining
• Support
• Stencil cleanliness

Troubleshooting Printing Related defects

Factory Tour of BlueRing Stencils and LUNCH

Solder Paste Inspection

• SPI Basics
• Types of SPI technologies
• Reasons for deploying
• Implementation tips
• Setting tolerances
• Understanding thresholds

BREAK

Reflow Soldering

• Methodologies:  Vapor phase, convection, laser
• Profile Objective
• Profile shapes (Straight ramp, ramp-soak-spike classic, Shoulder)
• Solder Paste/solder behavior during reflow

Troubleshooting common defects:

• Shorts
• Opens
• Solder balls
• Tombstones
• Head-In-Pillow
• Voiding

Cleaning (time permitting)

• Why clean - pictures of dendrites and corrosion
• NC vs OA
• Why clean the no-clean?
• ROSE testing vs ion chromatography
• The importance of monitoring the cleaning process

Q&A

About the Instructors:

Chrys Shea
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is an SMTA “Member of Technical Distinction” and three time SMTAI “Best of Conference” award winner for her research on solder paste printing. Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees.

Phil Zarrow

Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years.  His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies.  In addition to his background in reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems.  Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throught the world.  During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.

Since forming ITM Consulting in 1993, Phil Zarrow has helped numerous clients in such areas as

• SMT Implementation and Assembly facility set-up
• SMT Assembly and Soldering Failure Analysis
• EMS/Supplier Process and Quality Assessment Audits
• Counterfeit Component Avoidance and Interception Programs
• Manufacturing yield improvement
• Equipment Evaluation and Selection
• No-clean and lead-free solder paste evaluation and process implementation
• SMT Manufacturing Process Audits and process improvement
• On-site training for all levels of personnel
• Design for Manufacturability (DFM) specification development
• Reflow of Through-hole feasibility, development and implementation
• Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
• SMT process equipment benchmark testing and evaluation
• SMT product development
• Lead-free Process Implementation and Optimization
• Technical evaluations related to business acquisitions and mergers
• Technical assistance in legal disputes

Mr. Zarrow is a popular speaker and workshop instructor.  He has chaired anbd instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim.  He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books.  He is co-author of the book, "SMT Glossary- Terms and Definitions".  Mr. Zarrow holds two US Patents concerning PCB fabricationa dn assembly processes and audit methodologies.

Phil is a member of IPC, SMTE, IMAPS, a co-founder of ITM Consulting, and is a past national level officer and national director or the Surface Mount Technology Association (SMTA).  He was also Chairman of the Reflow Committee for SMEMA.  He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders' Award (2000).  Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forfront" and "Better Manufacturing" columms.  He is currently producer and co-host of IPC Update's "Boardtalk" audio program.

Contact Karen Frericks at 952-920-7682 with questions.

• BGA Solder Joints
• Bottom Terminated Components
• Voids
• Mixed Lead Free and Tin Lead Soldering
• New Cleanliness Standards, J-STD-001 Requirements 

Monday 29th April @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Flexible circuits is another packaging technology which has seen a growing and wider acceptance in the electronics industry. The advantages of surface mount reduced weight; decreased size can be further enhanced by flexible circuitry. In many cases, it is a misconception that flexible circuits have to flex, they don't; many flexibles are designed purely to aid the circuit design and assembly into the final product. In this case the substrate is only flexed or formed once. The range of constructions for circuit manufacture are wide but the basics are similar to existing printed circuit production. The design and selection of the manufacturing methods can affect the final cost of the circuit and need to be considered in detail prior to manufacture. Where design departments have limited experience useful reference material is available to engineers worldwide with the release of Flexible Circuit Technology, Third Edition by Joe Fjelstad and other publications.

Topics include:

• Flexible Design for assembly
• Manual assembly and soldering
• Automatic assembly process requirements
• The need for baking flexible circuits
• Flexible circuit pallets for automatic assembly
• Screen printing, placement, reflow soldering & AOI
• Manual hand soldering and de-soldering
• Rework of conventional and surface mount
• Solder joint Inspection
• Process defects on flexible circuits and during assembly

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

LED Do’s and Don’ts

Event Details

• Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
• When: 11am-1pm on May 3, 2019
• Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
• Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

• FREE for New Members since prior meeting
• $10 for Committee Members
• $20 Members, employees of Corporate member companies, 1st time guests, and students
• $25 non-members, students, & guests – same price
• Cash at the door or credit card on-line

Get your tickets!

• I'll be there - paying at the door (Click here)
• Members: I'll be there - paying now for 10% Early Bird Discount (Click here)
• Non-Members: I'll be there - paying now for 10% Early Bird Discount (Click here)

Abstract

What to do and not to do with LEDs in a surface mount process including Paste printing, Stencil Design, picking, placing, Reflow, and test.

Biography

• Attended University of Delaware.
• Worked for Motorola in Shaumburg, IL as a SMT Manufacturing Engineer.
• Worked for Allied Signal in DOD environment as a SMT Manufacturing Engineer.
• Worked for Quad Systems as a Field Service Engineer.
• Engineer for Decatur Electronics in microwave radar.
• Redesigned to Jugs professional radar gun used by Major League Baseball.
• Opened his own contract manufacturing business, Contract Assembly Service, Inc.
• Vice President of American Circuits located in Charlotte, NC.
• Director of Engineering. The Light Source, Inc. – Design and manufacturing of high-end theatrical stage lighting.
• Trans-Tec America territory manager.

Monday 20th May @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Area Array Technology is part of mainstream electronics but until recently very few good inspection criteria were available in the industry. The assembly process for BGAs is fairly well understood for Tin/Lead alloys but with the move to Lead-free assembly, new QFN and LGA packages have critical issues to consider during inspection. The webinar covers optical and x-ray inspection of solder joints for both Tin/Lead and Lead-free terminations. It includes an introduction to the Lead-free assembly process with specific attention to BGA and area array devices. It provides a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces.

Topics include:

• Procedures for inspection joints optically and by x-ray
• Inspection criteria for joints
• Identification of key joint features
• Other indicators of possible failures
• Common BGA & bottom mounted failures

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

The human body is an extremely complex "electrical (neurological) system", with companies continuing their quest to understand and improve capability as related to neural interface, basically connecting the human body directly into computers! There is no question, capabilities in smart phone/watch technologies connected to the internet erases any doubt of the potential to connect people to computers.

With the brain being the human equivalent of the "MicroProcessor", semiconductor companies such as IBM, Intel, MicroChip and MicroSemi have been well aware of potential for connectivity. Others have taken knowledge of neural interface to help humans manage their internal electrical systems, including Medtronic, Philips and Abbott, with a range of pacemakers, defibrillators and neural therapies.

Expanding the potential scope of linking the brain to computers and to the internet has attracted the likes of Amazon, Apple, Facebook, Google, MicroSoft, Neuralink and others, adding to the list that already includes J&J, G.E., T.I., Stryker, and Edwards. MicroProcessors and other ASIC Chips, coupled with MEMS and Sensors, are now seen as the “next big thing” over the next 5 years looking at the Internet of Things.

This event will bring together experts to cover topics such as:

* Forecasting and Analytics

* MEMS, Sensors and Integrated Circuits

* Implantable Devices and Neural Interface

* Medical Robotics, Equipment, and Prosthetics

* Advanced Materials and Reliability

The International Conference for Electronics Enabling Technologies (ICEET), formerly ICSR, is a highly technical three-day event in Toronto, ON, Canada.

Electronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.

Value Proposition for Participation

• Broaden your knowledge of the wider enabling technologies
• Deepen your skills on traditional soldering and electronics
• Access to local engineering and science talent
• Opportunities for cross-sector collaboration/innovation
• Industry exposure to your work – generate interest, support, awareness & excitement
• Build network and local-ecosystem that aligns various needs and service providers
• Access to IBM ventureLAB 
• Recognition for Best Conference Paper

New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA’s and PCBF’s

Event Details

• Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
• When: 11am-1pm on June 7, 2019
• Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
• Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

• FREE for New Members since prior meeting
• $10 for Committee Members
• $20 Members, employees of Corporate member companies, 1st time guests, and students
• $25 non-members, students, & guests – same price
• Cash at the door or credit card on-line

Get your tickets!

• I'll be there - paying at the door (Click here)
• Members: I'll be there - paying now for 10% Early Bird Discount (Click here)
• Non-Members: I'll be there - paying now for 10% Early Bird Discount (Click here)

Abstract

Digital Computed Tomography, or CT Scanning, has advanced in equipment and techniques to such an extent that it has now become the method of choice in many applications where workmanship, fabrication, and component defects are difficult and sometimes otherwise impossible to find.
This presentation will discuss the current state of the technology (hardware as well as software); some of the basic physics underlying the methodology; and relative strengths and weaknesses of CT Scanning versus other methods, from the standpoint of results as well as cost. Numberous examples will be shown, with emphasis on PCBA and PCBF failure analysis and defect detection.

Biography

Robert Boguski, President, Datest

1981 graduate of The University of San Francisco (BA Economics).  Robert has worked in the electronics packaging and interconnect manufacturing and testing business, primarily in management positions, since he was a teenager (1975).  22 years in the bare board business, 12 years in the EMS business, and 14 years in the testing and test engineering business (Some overlap with EMS).  Robert is the Owner and President of Datest, a test engineering and failure analysis company located in Fremont, California.  Robert and/or his Company, Datest, are members of SMTA, IPC, and IEEE.  Datest is also a member of the American Society for Nondestructive Testing (ASNT) as well as the Eurpoean Institute of Printed Circuits (EIPC).  Since 2013 Robert has co-authored the Test and Measurement column for Circuits Assembly Magazine.  Robert is also currently the President of the SMTA Silicon Valley Chapter.

Monday 17th June @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

For many organisations through hole components will remain a reality for many years. More and more surface mount components are used in design, through hole is in decline, however the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products. So what is the most reliable and cost effective solution to through hole soldering in a lead-free environment? Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities with lead-free and high temperature solder alloys.

Topics include:

• Why use selective soldering
• PCB design rules for selective soldering
• Flux requirements for selective soldering
• Compatibility of solder masks and lead-free solder
• Setting up lead-free profiles, you must profile a selective process!!!
• Solder alloy choices
• Copper dissolution with selective
• Soldering defects on selective – Causes and Cures

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Software Systems & Standards • Robotics • 3D Printing

eSMART Factory 2019 conference will bring together the key technologies shaping the electronics manufacturing industry and addressed by EMS companies, OEMs and Contract Manufacturers.

2019 call for abstracts and registration is now open. The program will be finalized in Spring 2019. 

Dr. Michael Azarian, CALCE, speaks during the panel discussion 'How is AS6171 Being Flowed Down? Challenges with AS671 Accreditation--Can it Handle Obsolete Part?' at the 2018 Symposium.

Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.

Monday 15th July @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Having grown up with IR and Vapour Phase Soldering VPS during the introduction of surface mount technology its fail to say that some processes never die they just get better. Convection reflow took over from IR technology and changed the way industry looked at vapour phase but now its back. For some companies VPS never went away a simple one profile process, in Japan high end application used VPS during the introduction of lead-free technology

Both convection and vapour phase can produce reliable lead-free assemblies, there are advantages and disadvantage to any technology but they both work well and can be very cost effective that is what our surveys have said. We also bring ten years of experience with lead-free using both techniques to the conference

In this webinar the instructor will look at all aspects of the different processes, soldering performance and yield from different joint terminations, solder finishes and joint structures. Each delegate will also receive a FREE set of Bob Willis Inspection Wall Charts covering reflow soldering of lead-free terminations and common defects found in manufacture 

Topics include:

• Vapour phase and convection reflow overview
• Process parameters
• Nitrogen/inert environment myths
• Advantages & disadvantages of the process options
• Design and layout considerations for VP
• PCB solder finishes for VP & convection
• Vapour phase materials and cost
• Batch or inline operation
• User experiences with VP materials and equipment
• Profiling boards assemblies in both processes
• Solder paste requirements
• Comparing single and double sided reflow yields
• Soldering flexible assemblies
• Inspection results for reflow soldering

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Monday 12th August @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Conformal coating has provided benefits to industry for many years either in the high reliability market sector or where products have to deal with extreme environmental conditions. Different industries like telecommunications, automotive and consumer products benefit from the use of selective coating.

This session will provide a simple guide to the use of coatings, their application and process, product benefits, inspection and quality control. A practical session will also allow delegates to examine coated boards using different materials and inspect the coating application. Bob Willis will outline the most common coating problems, solutions and address your specific issues in this webinar session.

Topics include:

• Why Conformal Coat
• Coating Process Options
• Cost of coating assemblies
• Correct design for coating
• Inspection & Quality Control of Coating
• In-house or Contracting Services
• Inspection of coatings & methods

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering manufacturing and assembly of electronics, advanced packaging/components, inspection technologies, processes, substrates/PCB technology, soldering, quality and reliability.

Co-located with SMTA International Conference.

• September 24 - Course (8:30-5pm)
• September 25 - ½ day of course + exam
• Spemteber 26 - All day exam (8:30-5pm)


• Instruction: English
  Test: English
  Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
  Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
• Enhance your stature in our industry
• Increase marketing value for your company
• Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.

SMTA and Chip Scale Review are pleased to announce the 16th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.