Calendar of Events

   2019      

                                   

2019

January 10

Capital (DC) Chapter: Fred Dimock, BTU International, to Present at SMTA Capital Chapter Meeting on January 10th  +

Location
Zestron



The SMTA Capital Chapter is excited to host a Chapter Meeting on January 10th from 5:00 PM to 7:30 PM at ZESTRON, Manassas, VA. Fred Dimock, BTU International, will be presenting “Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data.”
 
This presentation will provide an overview of the vacuum reflow process and explain the reason vacuum reflow is of interest to the electronic assembly industry.  The presentation will also include a report on preliminary data from a void reduction experiment completed at the Universal Instruments Process Laboratory.
 
Fred Dimock, Manager of Process Technology at BTU International in Massachusetts, has extensive experience in thermal processing and has assisted many companies with process refinements over the years. Fred has authored numerous articles on lead free solder, process control, and the operation of continuous furnaces. He also wrote the chapter on solder reflow for the Handbook of Electronic Assembly and A Guide to SMTA Certification” by Dr Lasky and Jim Hall. He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard.
 
Don’t miss out on dinner and a facility tour prior to the presentation. Registration is free for members and $30 for non-members. The registration fee will be waived if you join the Capital Chapter during this event!
 
The evening is scheduled as follows:
5:00-6:00 PM Registration, Networking & Dinner
6:00-6:30 PM Facility Tour
6:30-7:30 PM Presentation
 
The SMTA Capital Chapter Meeting Location:
Zestron Corporation
11285 Assett Loop
Manassas, VA 20109

        
 


January 11

Dallas Chapter: Understanding Selective Solder Technology  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



Understanding Selective Solder Technology

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on January 11, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!

Abstract

Selective soldering technology, specifically nitrogen inerted, liquid underside selective soldering has emerged as a required process in PCB manufacturing. The industry has become segmented in approach driving separate technology roadmaps that encompass, topside laser, soldering iron, mixed technology and bottom side liquid flow soldering. This presentation explains the underlying process needs and the resulting technologies required to serve those requirements as it relates to the underside liquid soldering.

Biography

Jonathan is the President of Pillarhouse USA with P&L responsibility for the Americas and is a director of the Selective Soldering Academy. He has a BSME from Western New England University and has over 20 years of selective soldering process experience. Jonathan has been published in several trade publications including, US Tech, SMT Magazine, Global SMT and Packaging, The Suit, EMS Now and others. He has received the Ford Award of Excellence for Automotive Electronics, is a member of the SMTA and EMCWA and regular contributes on the subject of selective soldering.




January 14

Webinar: Crimp Inspection, Quality Control in the Real World of Manufacture  +



Bob WillisMonday 14th January @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Millions of crimp joints are produced every year and are used in many high reliability applications. Care in the preparation and achieving the standards of the IPC, MOD and other international standards are vital. This webinar covers the use of crimp connectors and other mechanical connection techniques. We highlight the process controls which are necessary in today's manufacturing environment along with a system to control materials and equipment to allow repeatable and reliable terminations.

Each delegate will receive a copy of all of the slides presented plus a set of posters on soldering to print on site for future training.

Topics include:

  • Introduction to crimping and cable termination
  • Training standards and practical skills techniques
  • Cable types and striping
  • Striping tools
  • Establishing strip lengths
  • Crimp types
  • Compatibility of crimp terminations and wires
  • Crimping tool operation

Practical examples covering:

  • Wire preparation
  • Crimping conductors
  • Inspection criteria for wire and crimp joints
  • Testing tools and joints
  • Wire wrapping and press fit terminations
  • Termination failures

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


January 17

Upper Midwest (Minnesota, Iowa & Dakotas) Chapter: SMTA Upper Midwest Chapter presents Designing Flexible Circuits topic at Tin Whiskers Brewing  +

Location
Tin Whiskers Brewing



January 17th: SMTA Upper Midwest Chapter presents Designing Flexible Circuits topic at Tin Whiskers Brewing Company


Upper Mid-west Chapter is bringing in a speaker for the following topic:

Designing Flexible Circuits with Successful Assembly in Mind
Speaker: Clark Webster, Applications Engineer at All Flex Flexible Circuits & Heaters
 
Who Should Attend:
This presentation is intended for anyone that is interested in flexible circuit design, materials, assembly, and examples of challenging flexible circuit applications.

Date:     Thursday, January 17th, 2019
Cost:      $20 Members/ $30 Non-members (make checks payable to SMTA)
 
Time/Agenda:
  • 2:00 to 2:15 PM - Registration
  • 2:15 to 2:20 PM – SMTA announcements
  • 2:50 to 3:40 PM – Clark’s Presentation
  • 3:40 to 4:00 PM – Q&A
  • After 4 PM – Social hour
 
Bar snacks will be provided.
 
RSVP by January 10th to guaranty a spot for this session.
 
Address/Directions to Tin Whiskers Brewing Company:
Tin Whiskers Brewing
125 9th St E
St Paul, MN 55101

Parking:


 
Presentation Overview:
Flexible circuits were originally designed as replacements for traditional wire harnesses.  From the beginnings to the present, growth and proliferation of flexible circuit applications in all industries has increased rapidly.  Today flexible circuits can be found in all manner of devices, products, and industries across the globe.  Along with the growth of flexible circuits, the complexity of the flexible circuits and their assembly has also increased dramatically, as well as the tools, materials, and processes used in performing their component assembly.  As assembly complexity increases, new methods must be developed to deal with special material and processing considerations of working with flexible circuits.  It becomes critical to overcome these issues by designing in assembly capabilities. 
What we will cover: 
•           A brief history of flexible circuits, with emphasis on design criteria for assembly
•           Several case studies of challenging flexible circuit design applications
•           An overview of flexible circuit design considerations for modern SMT assembly
 
Clark Webster’s – Bio:
Clark is an Applications Engineer with All Flex Flexible Circuits & Heaters, primarily supporting customers in their designs to improve reliability and ensure that the final products will perform as needed.  Clark has been in circuit manufacturing industry for 53 years, working in Materials Development for flexible circuits, Product Fabrication testing for both flexible and rigid circuits, and Applications Engineering for many specialized customers, designs, and products.  Clark has excelled at and enjoyed working on difficult projects with customers to find solutions for challenging designs and applications.  Clark is a member of the IPC Flex Circuits Committees, holds three patents on flexible and rigid circuit designs, and has a wealth of knowledge of all aspects of the supply chain.  Clark’s one resounding failure to date in his last 12 years (working with All Flex) has been his inability to retire from the manufacturing industry.  
 


January 18 - 20

2019 Mini in Minny Officer's Leadership Forum  +

Location
DoubleTree Minneapolis Park Place
Minneapolis , MN


Thanks to all chapter leaders who helped make the 2019 Mini in Minny a great event.
View a recap here with photos and copies of the presentations.


The SMTA invited all NEW Chapter Officers to the "Mini in Minny" Chapter Officer's Leadership Forum

Develop leadership skills, learn the ins and outs of running a chapter, and put faces to names at SMTA HQ at our orientation weekend for all brand new SMTA Officers. Move forward with enthusiasm and confidence as effective leaders in your chapter.

View the Mini in Minny Brochure

2019 SMTA Leadership Forum Agenda

January 18, Friday     DoubleTree Minneapolis Park Place

Arrivals

7:00 p.m.   Registration and Welcome Happy Hour at DoubleTree Hotel
Hors d'oeuvres, wine, and beer will be served

Sponsored by:

Mexico - Guadalajara Chapter   Space Coast Chapter   Wisconsin Chapter

 

January 19, Saturday SMTA Office, Eden Prairie, MN

8:00 a.m.  Transfer to SMTA Office

Sponsored by West Penn Chapter

8:30 a.m.   Breakfast

9:00 a.m.   "SMTA 101" Information Sharing Sessions
Topics covered will include:

  • How is the SMTA Structured?
  • Your Online Dashboard
  • Annual & Long Range Planning
  • Best Practices:
    o Membership
    o Meeting Planning
    o Chapter Finances
  • Resources and Benefits for Officers
  • Leadership Position Descriptions

12:00 p.m.   Working Lunch

1:00 p.m.     Sharing Sessions Continue

5:00 p.m.     Transfer back to DoubleTree Hotel

Evening      Fun and Games at Punch Bowl Social, Minneapolis
Dinner and entertainment included

Sponsored by:

Connecticut Chapter

Space Coast Chapter

 

January 20, Sunday

Departures

DRESS CODE:  The Forum weekend dress code is casual.

 

Logistics: Hotel, Travel & Events

TRAVEL ARRANGEMENTS

If you plan to attend the 2019 “Mini in Minny” Chapter Officer Leadership Forum, SMTA requests that you attend the Welcome Reception Friday, January 18, at 7:00 p.m. (PLEASE factor in baggage claim and transportation to the hotel) and be present at all events Saturday, January 19. You are free to make your return airline arrangements whenever convenient on Sunday, January 20. There are no formal SMTA events on Sunday. 

TRANSPORTATION OPTIONS:
• Super Shuttle: 612-827-7777 or 1-800-BLUE-VAN
• Bus Transportation Information: www.metrotransit.org
• Car rental with your choice of service, Uber or Lyft
SMTA will provide transfers for the events on Saturday, January 19.

 

HOTEL ARRANGEMENTS

DoubleTree by Hilton Minneapolis – Park Place Hotel
1500 Park Place Blvd., Minneapolis, MN 55416

Make your hotel reservations online by Friday, January 24, 2019.
The negotiated rate is $102 plus tax per night for a standard room.

Book Your Hotel Here!
Just select dates and guests and click "continue" (leave default special rates section as is)
Booking via Phone: 1-800-245-9190, ask for group code "SMTA"

Reservations requested after January 4, 2019 will be accepted as long as availability permits on a first-come, first-serve basis, but will be at the higher prevailing rates versus the special group rate. You will need to guarantee the first night’s room and tax with a credit card or check advance deposit. You can cancel your reservation two days prior to your scheduled arrival without incurring any cancellation charge. Cancellations after that point and no-shows will forfeit the first night’s room and tax deposit.
Check-in time is 3:00 p.m., and check-out is 11:00 a.m. You will need 2 nights (arriving 1/18/19 and departing 1/20/19). Amenities include coffee maker, iron and ironing board, hair dryer, mini-fridge, WiFi access, as well as a warm chocolate chip cookie upon arrival and other in-room amenities.
If you choose to stay at a different hotel or make other arrangements you will need to make your own transportation arrangements to all events.

 

Funding & Sponsorships

$ FUNDING $

The SMTA Officer’s Leadership Forum is open to all NEW officers. All food and beverage during the duration of the program will be covered by SMTA. Entertainment and instruction is also included for all qualifying new officers.
Each officer is responsible for his or her travel to Minneapolis and hotel expenses. We have arranged a discounted room block at the DoubleTree Minneapolis Park Place of $102 plus tax per night. We hope that your employers understand the value of the benefits of SMTA membership and will support your trip. If not, Forum expenses are acceptable chapter expense items within the SMTA and Chapter Bylaws. All new officers must discuss it with your President and Treasurer before you make any non-refundable airline or hotel arrangements.
If it is impossible for your company or chapter to fund travel expenses, ask Karen (karenchapters@smta.org or 952.920.7682) about our financing assistance. We want to work with you to ensure that all new officers are able to attend.

SPONSORSHIPS

Please help us to make this important event happen. Consider becoming a sponsor and invest in your future officers.

SPONSORSHIPS AVAILABLE:

  • Sponsor an officer’s travel: $100-$1000+ (multiple sponsors)
  • Welcome Reception Sponsorship: $100-$350 (multiple sponsors)
  • Saturday Evening Event Sponsorship: $250-$500

ANY SPONSORSHIP, ANY AMOUNT IS WELCOME!

All Forum Sponsors will be introduced at the Welcome Reception, receive verbal recognition and signage recognizing the sponsors during the event to show our appreciation of your chapter's support of your peers.

 

Thanks to our current chapter sponsors!

Connecticut Chapter

Empire Chapter

Space Coast Chapter

West Penn Chapter

Wisconsin Chapter


January 24

Oregon Chapter: January Technical Meeting, Wearables & Implantables: How Technology Transforms Health Care … How Health Care Transforms Technology  +

Axiom Electronics, 9845 NE Eckert Dr. Suite 200, Hillsboro, OR 97006



Wearables & Implantables:  How Technology Transforms Health Care … How Health Care Transforms Technology

Matthew K. Hudes

CEO bdlBilologx, Vancouver, Washington/USA, mhudes@bdlbio.com

Summary

Digital Health is driving the uptake of wearable and implantable devices replete with biometric sensors.  These new technologies are enabling health care to become more immediate, more effective, and more personalized.  Health care applications of technology bring greater demands for privacy, safety, and security, with corresponding regulatory oversight. In turn, health care is influencing how Digital Health technologies are developed, manufactured, and commercialized.

I. Introduction and Motivation
Wearable and implantable technology, when combined with web and email, mobile technology and social networking, data management and analytics, results in a new paradigm called “Digital Health.”  Tools that connect patients, physicians, payers, and life sciences companies can transform the delivery of health care.  But in order to realize such a fundamental transformation of the health care system, changes are required on the part not only of health care providers but also of life sciences manufacturers and of patients/consumers.  Essential technologies such as wearable and implantable devices in Digital Health become subject to medical regulations and medical technology product development processes as they are utilized not only to monitor but also to directly affect human health.
II. Technical Approach or Experimental Procedure
This presentation provides a survey of trends in Digital Health, focused on the role of wearable and implantable technology.  Consumer, market, and financial data is examined to understand how these technologies are changing health care and how health care is changing the business of developing, manufacturing and commercializing these technologies.

III. Results and Discussion
While the results are generally positive to the market opportunity for wearable and implantable technologies, there are unintended consequences and unforeseen results that are emerging as the market develops.  It is likely that further transformation is required to fully realize the potential for health care as well as for the technology business addressing these needs.
 
IV. Brief Biography

Matthew Hudes is the Founder and CEO ofbdlBiologx, a company devoted to helping the products of innovative companies reach patients more quickly. 
bdlBiologx provides 1) on-demand services to stimulate company growth 2) leading-edge Business Development and Licensing (BDL) processes and systems, and 3) capability-building to support the growth of a BDL function within a company. For the prior 11 years, Matthew was the BioPharma practice leader for Deloitte.  In this role, he provided guidance and direction to clients and to the firm’s Audit, Tax, Consulting, and Advisory Services practices.  Deloitte is recognized as the leading full-scope professional services firm in Life Sciences. During the course of his long career, Matthew has provided strategic professional services to leading Biotechnology, Pharmaceutical, and Medical Technology companies, as well as Academic Research Centers and regional centers for Life Sciences.  He has worked with leading Life Sciences innovation centers in the U.S. and globally.   He speaks frequently about such topics as digital health, fostering innovation, personalized medicine, the use of technology for innovating clinical research, finance transformation, manufacturing and quality, regulatory compliance, and supply chain.  He was a member of the Board of Directors of BIOCOM, a faculty member and executive sponsor of the UC Berkeley BioExec Institute, a member of the Board of Directors of the Bay Area BioEconomy Initiative, and he was the executive sponsor of Deloitte’s unique innovation collaboration with the University of California. Previously, he was the Chairman and CEO of Accélère, a software company that developed a system to find patients (and investigators) for clinical trials and to improve researchers’ access to information typically “trapped” in laboratory and medical systems. Formerly, Matthew led the global Capgemini Life Sciences Biotechnology and R&D practice.  As a former Partner with Ernst & Young LLP, he founded the firm’s Life Sciences Consulting practice and led the firm’s Biotechnology Consulting practice. He served as a strategic advisor to leading-edge companies in Life Sciences and Technology over a period of more than 17 years. Matthew received an MBA from Santa Clara University and a BA from the University of Connecticut.
 




February 5

Oregon AOI & X-Ray Masterclass  +

Location
Axiom Electronics
Hillsboro , OR 97006



Instructor: Keith Bryant, SMTA Europe

February 5, 2019

8:00 a.m. - 4:00 p.m.
Axiom Electronic
9845 NE Eckert Drive
Hillsboro, OR 97006
 

Price:
  • Members: $200
  • Non-Members: $400
  • SMTA Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $80 

Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

Course Outline:

The first half of the course will cover all aspects of X-Ray inspection.  We will talk about the basics of the technology, in-line, off-line and at-line comparisons, looking at the positives and negatives of each.  The latest hardware and software developments, 2D, 2.5D, and 3D (CT) will be explained and compared, together with images of demanding applications.

The second half of the event will cover all aspects of AOI Technology, from basic 2D through to advanced 3D technology and the technologies between.  We'll be looking at the latest 3D advances launched at APEX the week before this event and contrasting them to earlier systems.

We will finish with an overview of Industry 4.0 for Inspection and the related Management Information Systems which take inspection into the realm of the SMART Factory of the Future.

All those attending will have the option to download Mark's guide, "BGA and Area Array Process Defects - Causes & Cures" when it is released later in February.


About the Instructor:Keith Bryant

Keith Bryant

A fully qualified engineer, Keith has over thirty years’ experience in Electronics Manufacturing.  He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews.

He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years’ experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years.

Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.

From 2017 to 2019, he was Global Sales Director of the leading X-ray manufacturer. Recently he reverted to a Consultancy role, allowing him more freedom to pursue other projects, including i4.0.

He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.




Contact Karen Frericks at 952-920-7682 with questions.
 


February 7

Puget Sound Chapter: February Chapter Meeting - Recent Advances in X-ray and Industry 4.0 for Inspection  +

Location
Applied Technical Services (ATS) 6300 Merrill Creek Parkway #A100 Everett, WA 98203



A fully qualified engineer, Keith has over thirty years’ experience in Electronics Manufacturing.  He started his career with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years’ experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years.
 
Keith is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles. Between 2014 and 2017 he was working as a technology consultant assisting many of the major industry names.
 
In July 2017, he joined YXLON International as Global Director Electronics Sales.
 
He has been Chairman of the SMART Group for over 10 years, this is the leading Electronics Manufacturing Technology Association in Europe.




February 11

Webinar: Solder Paste Evaluation & Simple Tricks of the Trade  +


Bob WillisMonday 11th February @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Solder paste quality and performance is significantly important and considerable engineering goes into its production. Selecting the best materials for your product and assembly process is key to high yield and your customers' satisfaction. Solder paste must be compatible with your equipment and other processes you use like cleaning, coating and electrical test. Working with suppliers to achieve the best performance is vital but so is periodic review of materials used.

There are always improvements being made to printing and jetting technology and it is important that engineers consider whether there are technical or commercial reasons to change. We look at common testing methods and some of the simple shop floor techniques used over the years to understand the different types of process failures.

Each delegate will receive a copy of all of the slides presented plus a set of posters on soldering to print on site for future training.

Topics include:

  • Solder paste type
  • Low & high temperature alloys
  • Solder beading
  • Solder slump
  • Reflow spitting
  • Flux condensation
  • Printing trials & test boards
  • Common paste & print failures

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


February 11 - 14

Pan Pacific Microelectronics Symposium 2019  +

Location
Kauai Marriott Resort
Kauai , HI


The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.


February 12

Central Texas (Austin) Chapter: CTEA Electronics Symposium at Virtex  +

Virtex Enterprises at 12234 N. I 35 & W. Yager Lane, Bldg A



Central Texas Electronics Association

 
Electronics Design, Manufacturing & Test Symposium 
Tuesday, February 12, 2019
Virtex Enterprises at 12234 N. I-35 & W. Yager Lane, Bldg A
 
Program:
 
2:00  -   Registration Begins
 
2:30  -   Welcome and Virtex Enterprises Factory Overview
 
2:35  -   Virtex Enterprises Factory Tours
 
3:35  -   " Cybersecurity Considerations in a Manufacturing Environment
               Brad Heath,  CEO,  Virtex Enterprises
                    
4:05  -   " When Artificial Intelligence (AI) Meets Human Intelligence (HI): A Road to World Wide
                Intelligence (WWI)
    Adil Dalal, Solution Architecture Director, Hitachi Global Digital Holdings   
   
4:35  -   Break & Networking
 
4:50  -   " Can Electrolytic Capacitors Meet the Demands of High Reliability Applications?
               Greg Caswell, Sr Member of Technical Staff, DfR Solutions
 
5:20  -   " Running Reliably: The World Through the Lens of a Globetrotting Reliability Engineer "
               Cheryl Tulkoff, Corporate Quality & CI Director, National Instruments
 
5:50  -   Door Prizes Drawing & Closing Remarks
 
6:00  -   Food & Refreshments Served and More Networking
 
 
Registration:
 
RSVP to Bob Baker at:  rjbakeratx@austin.rr.com
 
No charge for SMTA and IMAPS members;  $10 for all non-members >> (Cash or Check ONLY!)
                            Students can also attend for FREE!
 
 
Event Location:
 
Virtex Enterprises at 12234 North I-35 & W. Yager Lane, Bldg A, Austin, Texas
See Map at:   (Map to Virtex)
 
In Central Texas, SMTA and IMAPS work together as the Central Texas Electronics Association (CTEA)
 


February 12

Webinar: BGA and Area Array Process Defects - Causes & Cures - FREE for Members!  +


Tuesday, February 12, 2019 | 2:30pm GMT (9:30am US Eastern Time)
Keith BryantPresented by: Keith Bryant, SMTA Europe

Free for members!


What You Can Learn From This Course:

This webinar is FREE for members to attend and is provided by SMTA Europe. The webinar will be presented by Keith Bryant and will also include a brand-new guide to defects produced by Keith and available to SMTA members. During the presentation the methods of detecting defects in manufacture will be discussed and the growing need for more advanced methods.

With many years working in PCB manufacture and assembly Keith has investigated most defect types. As component and substrate technology becomes more advanced, new issues require modification to inspection methods which will be considered during the session.

The BGA & Area Array Defect Guide is a colour booklet featuring both optical and x-ray examples of common and not so common defects. The examples may be cosmetic or electrical failures found during investigation in manufacture. Each defect type is discussed with possible causes and cures. This guide is one of many guides being made available from SMTA.

 

During the webinar the following will be discussed:

  • Area Array Inspection methods
  • Inspection criteria

Selected defect types include:

  • Opens
  • Shorts
  • Voids
  • Head on Pillow
  • Solder wicking
  • Solder beads
  • PCB plating variations
  • Plating voids


February 13

San Diego Chapter: 02/13/2019 Chapter Meeting -ESD Control in the SMT Assembly EPA  +

Location
HME, 2848 Whiptail Loop Carlsbad, CA 92010



ESD Control in the SMT Assembly EPA
Presented by– Gregg Heckler -Regional Sales Manager Desco & Henry Salgado -Regional Manager SCS.
Until the invention of surface mounted electronic components and the automated equipment to place them, ESD control was mostly confined to operators sitting at a work station.  SMT devices are not only smaller, and in most cases more ESD Sensitive, but the environment in which they are handled requires more operator mobility. 
While there are multiple Technical Requirements in a complete ANSI/ESD S20.20-2014 ESD Plan, proper mobile personnel grounding, cart grounding, ionization, and ground monitoring should be a focus and is essential in an SMT EPA.  In addition, due to the greater ESD sensitivity (lower Class) and automation assembly speed, ESD Event Detection and data acquisition is also becoming a necessary to reduce ESD damage and increase yields.  You may have all or most of the ESD control you think you need, but do you know if it works?
The vendor presentation will cover the above topics and help you to not only create the best ESD control in your SMT area but verify its performance as well. 
  Gregg Heckler, Western Regional Sales Manager for Desco, has been with the company for 24 years. He was one of Desco’s independent sales reps before that. Gregg has 38 years of experience in ESD control for electronics assembly.  He has also worked for other manufacturers of static control products such as Richmond Technology, Tech Spray, and ESD Systems. Gregg is an iNARTE Certified ESD Technician who specializes in helping electronics manufacturers develop and implement ESD control programs.

Henry Salgado Regional Manager for Western US and Mexico based in Chino, CA, has been with SCS Static Control Solutions since 2016. He is a former marine and has 16 years in GI/Bill related education administrative roles.
 
 

Date: 02/13/19
Registration:
 5:30PM $5 Members and $15 Non Members (Cash or check at the event)
Dinner: 5:45PM
Presentation: 6:45PM
HME Factory Tour: 7:45PM

Location: HME 2848 Whiptail Loop Carlsbad, CA 92010

 


February 13

Heartland (Kansas, Missouri) Chapter: Voiding under BTCs / Solder Preforms  +

Location
Zarda Bar-B-Q 11931 W 87th St Pkwy, Lenexa, KS 66215



We are excited to announce the SMTA Heartland Chapter's 1st event of 2019!
It will be on Feb 13th, 2019 at Zarda BBQ in Lenexa, KS and feature guest speaker, Kim Flanagan, Technical Support Engineer at Indium Corporation. Kim will discuss two topics: Voiding under BTCs and Solder Preforms. The meeting will also include a meal catered by Zarda BBQ.

Doors will open at 5pm and the meeting will start at 5:30pm.
Price is $15 for members and $25 for non-members.
Please RSVP as soon as possible.


Speaker Bio:

Kim Flanagan is a Technical Support Engineer based at the Indium Corporation who serves customers in the South-West and South-East US, and also Eastern Canada and Puerto Rico.

Kim provides technical support, including guidance and recommendations to customers related to process steps, equipment, techniques, and materials. In addition, she delivers technical training to staff and industry partners.

Kim is a Certified SMT Process Engineer recognized by the Surface Mount Technology Association. She has a background in Physics and has held previous positions in Quality Engineering.




 


February 19

Capital (DC) Chapter: SMTA Capital Chapter Meeting - Presentation and Live Demo on “Non-Destructive BGA/Area Array Component Rework”  +

Location
PACENTER Training Facility



Date: February 19, 2019 @ 5pm
 
Speaker:
Aaron Caplan
Director of Marketing & Training
PACE Worldwide
 
Location:
PACENTER Training Facility
6605 Selnick Drive #C
Elkridge, MD 21075
  

Agenda:
  • 5:30 – 6:15: Registration/Dinner
  • 6:15 – 7:15: Presentation
  • 7:15 – 7:45: Demonstration

 “Non-Destructive BGA/Area Array Component Rework.”
 
Abstract:
In the past 20 years, such mundane operations as soldering, desoldering and component replacement have become complicated by extreme micro-miniaturization, the use of lead-free solders, new thermally challenging pc boards, heat-sinking bottom terminated components and intricate component packages that are difficult to rework or install. One area that presents unique challenges is BGA/Area Array rework. Modern boards that use these components are more technically demanding than ever, requiring skilled operators who are highly competent at accomplishing delicate, intricate soldering and rework tasks. Unfortunately, many operators will cause more damage to the assembly or components due to his/her rework actions. As a result, many manufacturers struggle to repair or rework boards, opting to throw away lower value boards or hire outside contractors to perform the more difficult repairs. This presentation will review current techniques and procedures for performing highly reliable, high-quality rework and repair on some of the more difficult BGA packages and will include live demonstrations of BGA rework using available convective and infrared heating techniques. The presentation will address typical BGA/area array components, heating technologies (convection and infrared), the importance of bottom side preheating, flux application, solder paste stenciling, device alignment methods and thermal profiling techniques, followed by a live demonstration of BGA rework.
 
 
About the Speaker:
Aaron Caplan is the Director of Marketing & Training for PACE Worldwide, a company solely focused on providing innovative, cost-effective solutions in hands-on soldering, rework and repair of advanced electronics to companies and government around the globe for well over 50 years. Mr. Caplan has been involved in electronics manufacturing technology since the 80's and is an acknowledged expert in Miniature/Microminiature Electronics Repair. A CIT in IPC-7711/IPC 7721, he provides technical expertise in teaching of non-destructive PCB rework/repair techniques, educating industry on how to properly utilize these techniques. In addition to his marketing duties, Mr. Caplan also coordinates the Training Department and Video Production Team, providing direction for a wide variety of video production projects.
 




February 19

Webinar: BGA Reballing- Theory and Hands On  +


This webinar has been cancelled!

Tuesday, February 19, 2019 1:00pm to 2:30pm Eastern
Presented by: Bob Wettermann, BEST Inc.

Bob Wettermann What You Can Learn From This Course:

This webinar is a “how to” guide for reballing intended for PCB rework and repair depots as well as device reclaimers. These sessions will take those interested in reballing devices through the entire process of setting up the equipment, developing and verifying the process. The first topic will cover the need for reballing of BGAs, CSPs and other devices. The second section will focus on the equipment set recommended for reballing and the third section the various process steps for reballing a device. A variety of different methods for both deballing and reballing will be discussed with the various advantages and disadvantages discussed to each approach.  Both plastic-packaged parts as well as ceramic parts reballing will be discussed. Inspection of the reballed components, the type of reliability testing data currently publicly available will be reviewed as well as some ideas for developing your own specifications if you want to outsource this activity.

This webinar is designed for process engineers, rework technicians and others interested in repairing electronics.

Instructor Bio:
Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.


February 20

Carolinas (NC, SC) Chapter: SMTA Carolinas Chapter 2019 Kickoff Mixer  +

Location
Fullsteam Brewery in Durham, NC




Join your newly elected Carolinas Chapter Board of Directors as they welcome 2019 with some local craft beers and light fare. 

Thanks to the support of our sponsors, we are able to provide two (2) drink tickets and food without any cost to the attendees. 
Doors will open at 5:30 on Wednesday 20 Feb 2019
RSVP today!


What's more, this event is only two week before our first info session. 
On 06 March, the Chapter will explore Conformal Coating technologies including plasma etch, jetting, and two-part auto mixing with PVA at GMI in Mooresville, NC


More information to come...
 
Image result for gmi mfg                         Related image



February 26

Huntsville Chapter: HSV Chapter SMTA - ASQ-1503 Joint Meeting Nanotechnology Applications  +

Adtran



The Huntsville Chapter SMTA, ASQ-1503, and Adtran welcome you on Feb 26, 2019 from 5:30-7:30pm to bring a discussion on Nanotechnology Applications.
 
Speaker Info:  Ms. Jennifer Miller
Holds a BS degree in Media Communications and is working on a BS degree in Physics from UAH. She has been researching nanoparticles of materials' reflected light in order to determine material Composition and identification.
 
 
Keynote Speaker Info: 

Dr. Eugene Edwards
Rocket Scientist (Retired)/University Research Advisor/Minister
Founder, Save The Youth Inc. (Bessemer, Alabama)
 
Dr. Eugene Edwards was born in Fairfield (Alabama).  He grew up in Bessemer (Alabama) where he was a product of Charles F. Hard Elementary School and a graduate of Jackson Solomon Abrams High School.
 
Dr. Edwards received a
  • Bachelor of Science degree in Electrical Engineering Technology from Alabama A&M University (Huntsville, Alabama);
  • Master of Science degree in Electrical Engineering from Howard University (Washington, D.C.);
  • PhD in Ministerial Education from KME University (Athens, Alabama)/Freedom Bible College of Arkansas.
  • Certification in Fiber Optics Manufacturing from California State Polytechnic University (Pomona, California)
  • Certification in Optical Fiber Engineering from George Washington University (Washington, D.C.)
  • And served as a Professor of Electrical Engineering at Alabama A&M University (Huntsville, Alabama).
 
Dr. Edwards was previously a Research Fellow at NASA’s Marshall Space Flight Center (Huntsville, Alabama), and retired as a Rocket Scientist at the U.S. Army Aviation Missile Research Development and Engineering Center (Huntsville, Alabama), where he has many patents/inventions, numerous journal papers, and was co-author of two books on Nanotechnology.
 
Dr. Edwards is Founder, Pastoral Leader, and/Chief Executive Officer for Save The Youth Incorporated, Headquartered in Bessemer (Alabama), where he provides oversight for education, youth programs, and parental counseling.
 
He is a Music Director and Gospel Recording Artist that has appeared with numerous major recording artists including
  • Walter Hawkins
  • The Mississippi Mass Choir
  • Dottie Peoples
  • Luther Barnes
  • Mighty Clouds of Joy
  • Edwin Hawkins (performer of the hit song “OH HAPPY DAY”)
  • The Platters
  • and many others
Minister Edwards is part of the pastoral staff at Saint Rebecca Primitive Baptist Church, Huntsville (Alabama) where he is Associate Minister and Pulpit Conductor for Revivals & Special Programs.
  
Agenda:
5:30 – 6:00 networking
6:00 – 6:30 dinner
6:30 – 7:15 intro & presentation
7:15 – 7:30 wrap-up 

 
Location: Adtran, 901 Explorer Blvd, Huntsville, Al
ADTRAN’s Fountain View Conference (2nd Floor, East Tower)
All meeting attendees must enter through the South entrance (adjacent to shipping dock).
 
Directions from I565:
  • Take exit 14B to Al-255N/Research Park Blvd
  • Take exit Bradford Drive West
  • Turn left Explorer Blvd (heading south)
  • Turn right into parking lot, merge left and follow parking lot to pond
  • Building entrance will be on north of parking lot
 
 
Dinner:   Catered by Adtran Café:
Italian
 
Meat Lasagna
Chicken Carbonara Pasta Bake
 
Served with:
Parmesan Cheese
Caesar Salad or Toss Salad
Sautéed Squash and Zucchini
Garlic Bread
Mini Cannoli’s
Sweet tea, Un-Sweet tea, and water
 
 
SMTA Members: $10  with RSVP
SMTA Non-Members: $13 with RSVP
No RSVP – Cash at the Door - $15
 
 
For members who cannot attend in person, we would like to offer a GoToMeeting option. Please contact us at HSVSMTA@gmail.com
 
Two ways to RSVP SMTA:  
RSVP ASQ-1503:  Brian Dunbar at brianmdunbar@gmail.com


March 6

Carolinas (NC, SC) Chapter: SMTA Carolinas Infosession on Conformal Coating  +

Location
GMI Manufacturing




SAVE THE DATE

On 06 March, we will explore Conformal Coating technologies including plasma etch, jetting, and two-part auto mixing with PVA at GMI in Mooresville, NC

Doors will open at 5:30 on Wednesday 06 March 2019


Preregister and save $5 or pay at the door with credit card, check, or cash
RSVP Todaysmta.org/chapters/rsvp.cfm?BEE_ID=4654
 
East West Manufacturing
Image result for gmi mfg
Related image



March 6

University of Maryland Student Chapter Chapter: SMTA and IMAPS Student Chapter at UMD Spring Technical Symposium  +

Johns Hopkins Applied Physics Laboratory (APL), Laurel, MD



The SMTA at the University of Maryland Student Chapter cordially invites you to attend:
 
 
SMTA and IMAPS Student Chapter at UMD
Spring Technical Symposium
 1. Subramani Manoharan
 2.  Maxim Serebreni
3. Dr. Michael Fish  
 
INTRODUCTION:
 
The IMAPS Chesapeake Chapter combined with the University of Maryland student chapter of IMAPS and SMTA, will hold its Spring Technical Symposium on March 6th, 2019, at the Applied Physics Laboratory (APL) of Johns Hopkins University. The symposium will focus on emerging trends in electronics packaging and their reliability concerns. This will be the first collaborative meeting between IMAPS and SMTA student chapters, and is expected to attract people with a wide range of background hence providing great networking opportunity for students and professors.
 
The event will kick off with speeches from eminent speakers on topics covering thermal aspects of power module packaging, bi-metal interface degradation in wire bonds and trends in packaging materials and its reliability. There will also be exhibits showcasing products and services that are of importance to the electronics packaging and reliability personnel. Dinner will be served for all attendees and participants. Selected topics will be presented as posters by the students of University of Maryland during the dinner session.
 
IMPORTANT INFO:
Wednesday, March 6, 2019
3:00 p.m.-7:00 p.m.
Johns Hopkins Applied Physics Laboratory (APL), Laurel, MD

Deng Yun Chen
Dchen925@umd.edu
 
 
REGISTRATION FEE:
In Advance:
  • Students In Advance:             $10
  • Members In Advance:            $25
  • Non-Members In Advance:     $30
At the door
  • Students at the Door :             $15
  • Members at the Door:             $30
  • Non-Members at the Door:     $35
 
 
CLICK HERE: https://netforum.avectra.com/eweb/DynamicPage.aspx?Site=IMAPS&WebCode=EventDetail&evt_key=3c42beb4-5f42-4ea7-91ed-65a02cf949c8TO
 
TO REGISTER IN ADVANCE by March 6th 2019!
 
Details: https://calce.umd.edu/event/13941/smtaimaps-umd-student-chapter-spring-technical-symposium
 

 
 
 
AGENDA:
 
3:00 PM Registration and Opening Remarks
3:30 PM Interfacial Degradation of Copper Wire Bond in Combined (Thermal Aging + Cycling) Loading Condition
Subramani Manoharan, Center for Advanced Life Cycle Engineering, University of Maryland
4:00 PM The Impact of Glass Style and Orientation on the Reliability of SMT Components
Maxim Serebreni, DfR Solutions
4:30 PM Design Challenges and Opportunities in Package-Integrated Transient Thermal Mitigation
Michael Fish, Army Research Laboratory
5:00 PM Networking and Student Poster Session
5:45 PM Event Wrap up and Closing Remarks
6:00 PM Dinner
 
Speakers and Abstracts
 
Speaker: Subramani Manoharan | Presentation Title: Interfacial Degradation of Copper Wire Bond in Combined (Thermal Aging + Cycling) Loading Condition
Abstract: Copper (Cu) wire bonds have become the dominant wire material used in microelectronic packages, which has replaced gold (Au) in majority of applications. Cost savings has been the key factor to drive this transition in wire bond material, although there are other advantages to Cu such as better electrical and thermal conductivity, slower intermetallic compound (IMC) formation and reduced wire sweep during transfer molding. However, two critical reliability concerns exist with Cu wire bonds, namely, growth of electrically resistive and brittle IMCs and fatigue of bond wire, which makes them not suitable for harsh environments such as in industrial, military and automotive electronics.
A review of literature shows fracture at wire neck as the most commonly reported failure mode. However, with the growth of IMC at interface, the location of failure shifts to interfacial separation. This is studied in detail through performing thermal cycling experiments with long dwell times at high temperature that promotes interfacial IMC growth, to replicate actual use condition. Additionally, most of the work presented in literature use lab made wire-bonded specimen in their study on test packages, which may not replicate actual commercial off-the-shelf (COTS) parts which have several different geometrical and material parameters. A unique test approach is adopted to study this two part failure and model its failure time by including the myriad of factors that exists in COTS packages. Additionally, critical factors contributing to failure are identified and studied in detail to establish a physics based model to predict failure.

About the Speaker: Subramani Manoharan is a PhD student in Mechanical Engineering at the University of Maryland, College Park. His research focuses on electronics packaging with emphasis on interconnect technology such as wire bonding, lead-free solder and underfills for industrial and commercial applications. His interests also include material characterization and failure analysis of microelectronics. He is member of ASME, IMAPS and IEEE organizations and actively serves as a reviewer for some of their journals.
 
 

Speaker:Maxim Serebreni Presentation Title: The Impact of Glass Style and Orientation on the Reliability of SMT Components
Abstract: Printed circuit board (PCB) glass style and orientation can have a significant influence on thermal cycling reliability of surface mounted components.  DfR has conducted thermal cycling (-40°C to 125°C) tests on two PCB glass styles (1080 and 7628).  The in-plane and out of plane Coefficients of Thermal Expansion (CTE) were measured and found to be about 3-4ppm/°C different in the X-Y directions of the boards.  To facilitate the reliability assessment of SMT component reliability four 0-ohm resistor sizes (2512, 1206, 0602 and 0402) were mounted on each board.  Each board had 20 resistors with multiple orientations.  The overall sample size consisted of 32 resistors of each size per glass style.  In addition, the PCBs have two pad sizes.  The purpose of these experiments is to develop a model for validating fatigue life predictions for different laminate materials.  This paper will present the experimental structure, results of the stress tests and variables on the reliability of the chip components and insight into the development of appropriate models.
 
Speaker: Dr. Michael Fish  | Presentation Title: Design Challenges and Opportunities in Package-Integrated Transient Thermal Mitigation
Abstract: Phase change materials (PCMs) have attracted the attention of researchers for their promise to buffer or mitigate the effects of transient thermal pulses within electronic systems.  While widespread adoption has historically been held back by the by the low thermal conductivity of otherwise attractive materials with relevant transition temperatures, advancements in PCM enhanced composite materials, additive manufacturing, and more recent interest in low melting point metals has tipped the balance towards feasibility in highly transient systems.  One impediment to deploying PCM enhanced packaging is a lack of package-level design tools that can illustrate the tradeoffs between performance, size/weight, and cost that results from integrating phase-change materials and/or their composites.  This work exhibits the extensions made to the Army Research Laboratory’s thermal-mechanical co-design tool, ARL ParaPower, to enable both phase change transient modeling and integration into system-level design tools.  By providing rapid surveying capability within any particular design space, detailed simulation burden is reduced and the most promising demonstrators are prioritized.
 

About the Speaker: Dr. Michael Fish leads the transient thermal program as part of the Advanced Power Packaging group at the Army Research Laboratory. He has expertise in embedded thermal management, simulation, and thermal test bed development. His current effort is in the management and packaging of highly transient electronic systems, with particular focus on directed energy weapons and vehicle electrification and power conversion.  He holds a doctorate in Mechanical Engineering from the University of Maryland, College Park where he studied thermal phenomena in heterogeneously integrated systems.  He received his BS and MS from the University of Virginia, studying micro/nanoscale heat transport and metrology.
 
 
HOW YOU WILL BENEFIT:
Attendees will learn about current research in the field of electronics. Further, it is a good opportunity for student members to network with industry professionals and learn about the relevant work in the industry.
 
 
 
WHO SHOULD ATTEND:
Students and professionals interested in the field of electronic packaging
 
 
 
 
 
 
Contact Deng Yun Chen at dchen925@UMD.edu with questions.
 


March 7

Atlanta Chapter: Chapter Meeting  +

Viscom



Statistical Trends in Counterfeit Electronic Supply Chains
 
It’s been over 10 years since the industry as a whole began to address the growing threat of counterfeit product in the electronic supply chain. Numerous standards, dozens of conferences, and untold presentations have been produced in an effort to educate our industry. After all that work, has there been a quantifiable impact across the supply chain or are we trying to address the wrong root causes?
 
Presentation By: Gary Beckstedt Director of Operations Flip Electronics
 
Gary Beckstedt heads the quality and inspection labs for the company as well as managing all logistics operations. Gary’s role requires him to institute and direct all quality management programs and processes as well as performing internal audits. Among his many challenges, Gary has the responsibility to ensure that Flip Electronics’ ISO/ANSI standards and certification programs, ESD programs, inspection and counterfeit detection process, and personnel training are all in compliance with their respective requirements and procedures. Gary helps to identify and track industry changes that affect the supply chain and supports the industry as a whole by serving on the G19-D committee that is tasked with maintaining the AS6081 standard. He is the company’s principal spokesperson in matters related to quality and methods of detection and abatement of counterfeit and suspect electronic parts. Gary is a US Air Force veteran, where he began his electronics career in 1989. He operated and maintained RADAR systems to support the Desert Storm and Desert Shield campaigns. He is a graduate of the AS9100D Lead Auditor program and an IPC Certified EMS Program Manager.
 
When: March 7, 2019
Where, Viscom Incorpoated 
1775 Breckenridge Parkway, #500
Duluth GA. 30096

Sign in and networking - 4:30
Dinner - 5:00 - 6:00
Presentation - 6:00 - 7:00

RSVP HERE
 


March 11

Wisconsin Chapter: Technical Meeting / Dinner Dave Vicari & Packaging Technologies and the Alternative Methods for Assembly  +

Location
Fox Valley Technical College- DJ Bordini Center



Please Join us on March 11th for a Technical meeting and dinner at Fox Valley Technical College.   Dave Vicari from Universal Intruments wil be discussing Packaging Technologies and the Alternative Methods for Assembly.   Check in / Registration is at 5:15pm,  Dinner at 6pm,  7pm Technical meeting and 8pm FVTC Campus Tour.

The electronics design, packaging and assembly industries are being challenged to adapt to the needs of mature industry sectors such as the military/aerospace/defense segment to the fast changing requirement of the wearables, IoT segments.  The result is the revolution of new materials that may or may not suitable for its intended application.  The AREA consortium and the APL lab have characterized and implemented these new materials in novel end products along with conducting applied research to understand the impact on manufacturing techniques.  This roadmap discussion reviews and discusses the materials, alternative assembly processes and the reliability that will enable manufacturers to produce novel devices to the market.


 


March 13

San Diego Chapter: 03/13/19 San Diego Chapter Meeting -fcLGA Package Assembly Qualification for Mobile Applications  +

Location
PSemi, 9369 Carroll Park Dr San Diego, CA 92121



fcLGA Package Assembly Qualification for Mobile Applications
Presented by
 Mumtaz Bora Sr. Staff Packaging Engineer at pSemi Corporation
Flip Chip Land Grid Array (fcLGA) packages are widely used in Mobile product applications due to their thin form factor and performance. Assembly process qualification requires careful selection of materials and optimization of reflow processes to make consistent and reliable product. The fcLGA typically uses an organic substrate on which the die is reflowed instead of the copper lead frame used in QFN packages. This requires assessment of CTE mismatch and controlled reflow processes to prevent bump separation .The paper reviews the selection of substrate, optimization of assembly process and reliability testing conducted for fcLGA package qualification. 
 
Speaker: Mumtaz Y. Bora has a B.S. in Chemistry and Material Sciences from University of Mumbai, India and University of Ottawa, Canada. She has a Master of Science in Interactive Telecommunications from University of Redlands, California. She has over 25 years of PWB, SMT assembly and advanced packaging development experience at IBM Endicott and IBM Austin, TX.  She has worked in new product development, and qualification of high volume handset assemblies at Qualcomm and Kyocera-Wireless Corporation.  She has worked with suppliers and subcontractors in several parts of Asia.  She is currently a Sr. Staff Packaging Engineer at pSemi for qualification of RFIC packages for wireless, broadband Automotive and Power applications. She is a member of IPC standardization committees and contributes to the standards development. She has 18 publications and 3 patents. She is the Past President of the SMTA San Diego chapter and Co-chair of the Moisture Sensitive Devices Council. She is currently the Publicity Chair for  IMAPS San Diego Chapter and Vice President of Communications at SMTA San Diego chapter.

RSVP by: 03/11/19
Members $5, Non-Members $15 (cash or check at the meeting)
Location:                   pSemi Corporation, 9369 Carroll Park Drive, San Diego, CA, 92121     (map)
                                    858-795-0112
Registration:            5:30PM
Dinner:                      5:45PM-6:45PM
Presentation:           6:45PM


March 14

Ohio Valley Chapter: SMTA Ohio Chapter - Selective Soldering Workshop  +

Location
Crown Equipment Corporation New Bremen, OH



     
 Technical program:
  • Pillarhouse - Jonathan Wol: Understanding fluxes and how they impact the selective soldering process.
  • Kurtz Ersa - Ernie Grice: Fundamentals of the soldering process as pertained to wave and selective soldering and outline why selective soldering is poised to become the standard for thru-hole soldering versus antiquated, black art of wave soldering.      
  • Laserssel - Denis Barbini: A Novel and Enabling Solution For Reflowing Challenging Mainstream and Alternative Electronics.  Presentation will provide step-by-step process development, material compatibility, reliability and productivity of this area laser selective reflow technique for mainstream and unique electronics designs.
  • MTA Automation - Will Hunter: Induction and Micro-Flame soldering and when to use them.
  • Facility tour of Crown Equipment Corporation electronic assembly operations.



March 14

Mexico-Juarez Chapter: SMTA Juarez First Technical Seminar - 2019  +

Location
Centro de convenciones Cuatro Siglos



 

¡El Capítulo de SMTA Juárez está de vuelta! Estamos organizando una gran reunión técnica el Jueves 14 de Marzo del 2019 para celebrar y nos gustaría invitarle a USTED a asistir.

 

Los usuarios de tecnología SMT (OEM, EMS, fabricantes contratados) están especialmente invitados a asistir. Si este capítulo va a sobrevivir en el futuro, necesitaremos su apoyo.

 

INFORMACIÓN IMPORTANTE:

Fecha: Jueves, Marzo 14, 2019

Hora: 5:30-9:00 p.m.  

Nota especial: Las puertas se abrirán a las 5:00. Tendremos varios sorteos para los Miembros Usuarios. ¡Llegue temprano para aumentar sus posibilidades de ganar un premio fabuloso!

Ubicación: Centro de Convenciones Cuatro Siglos

Direccion: Boulevard Juan Pablo II (Blvd. Cuatro Siglos) y Av. Arizona.

Ciudad Juárez 32402


AGENDA

  • 5:00 p.m. - Doors Open
  • 5:30 p.m. - Welcome & 1st Raffle
  • 6:00 p.m. - 2nd Raffle
  • 6:05-6:10 p.m. – SMTA Chapter Juarez Committee Presentation  
  • 6:10-6:25 p.m. - Universidad Tecnologica - Presentation of Programs -  M.C.M. Alecia Torres, Ing. Ricardo Perez
  • 6:25-6:30 p.m. - SMTA Certification Program – Ing. Alejandro Valles / Ing. Moises Gonzalez
  • 6:30-6:50 p.m. – Presentation: "Técnica para reducción de voids en componentes QFN mediante la modificación de aperturas del esténcil” / Part 1 – Ing. David Solís
  • 6:50-7:05 p.m. - ITCJ - Nodes Program - Mtro. Mario Macario Ruiz
  • 7:05-7:20 p.m. - CIITA-CIA - Dr. Jose Mireles
  • 7:20-7:40 p.m. - Presentation "Técnica para reducción de voids en componentes QFN mediante la modificación de aperturas del esténcil “/ Part 2 – Ing. David Solís
  • 7:40-8:00 p.m. - Awards Presentation
  • 8:00-9:00 p.m. - Dinner

 



March 14

Tampa Bay Chapter: SMTA Tampa Bay Chapter Meeting- March14th  +

Location
Jabil Circuit 10560 MLK St. Petersburg, FL 33716



This is a reminder to save the date for our next chapter meeting at Jabil Circuit Inc. on 3/14/19. 
Our speaker is Axel Vargas, (see attached bio)  Senior Manufacturing Engineer at Lockheed Martin RMS Oldsmar, FL.
Axel will be discussing the following topic:

Rinsing Study Based on Inline and Batch Cleaning Processes
 
How different cleaning agents, under similar equipment, perform over time on a rinsing perspective. How often you audit your wash application performance? Does the process gets an impact on performance over time? Which are the correct tools to monitor the wash and rinse process efficiency over time?
 
All of these topics will be discussed on this presentation.

Our meeting this quarter will be held at the following address:
Jabil Circuit
10560 MLK Blvd
St. Petersburg, FL 33716

This is the four story buidling in the center of the campus.  You can enter from either Roosevelt or MLK and go to the center buidling by following the signs.

Thursday March 14th:
5:30- Registration/ Meet and Greet
5:30- Dinner
5:45- Introduction of Speaker
5:50-6:30- Topic Presentation
6:30-6:45- Question and Answer Time

Cost of Meeting:
Members- $15.00
Non-Members- $20.00

We hope to see everyone at the meeting!


 


March 18

Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects  +


Bob WillisMonday 18th March @ 2:30pm - 4:00pm GMT (10:30am - 12:00pm US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

The presentation provides a better understanding of solder paste selection and the use of stencil printing in modern fine pitch manufacture. Surface mount components are now at lead spacing of below 0.020″, only the correct selection of solder paste and specification of stencils can lead to effective printing. The session aims to provide a basic understanding of the design, production and quality control issues, both theoretical and practical issues of printing conventional surface mount and through hole for intrusive reflow.

Topics include:

  • Design of lands and apertures for fine pitch SMT & BGA
  • Through hole printing requirements
  • Selection of stencils
  • Evaluation of solder pastes
  • Practical machine set-up and trial prints
  • Elimination of board wash-off
  • Assessment of paste and stencil combinations
  • Solder paste inspection, measurement and quality control
  • Stencil Inspection and quality control
  • Cleaning stencils
  • Printed board requirements for printing fine pitch

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


March 19

Dallas Chapter: Dallas Expo and Tech Forum - March 19  +

Location
Plano Event Center



Register Now!

Click Here to Register for the Dallas Expo and Tech Forum!

Are you a...
  • Manager of Design or Manufacturing
  • Process engineer
  • Design Engineer
  • Supply Chain Professional
  • Purchasing
  • Test Engineer
  • Manufacturing or Test Technician

The Dallas Expo has everything you need to do with Design and Manufacturing of Electronics!

Event Details

  • Date: Tuesday, March 19, 2019
  • Time: Doors open at 8am
  • Location: Plano Event Center (2000 E. Sprint Creek Parkway, Plano, TX 75074)
  • Food: Complementary Lunch Buffet
  • More info: smta.org/expos/#dallas
  • Questions? Call Hannah Terhark at 952-920-7682

Technical Sessions

8:30AM
You Design & You Manufacture Complex Multilayer Circuits with 3D Printing 

Speaker: Ofer Maltiel, Nano Dimension
Bio: 
My driving passion in life is to help people succeed. The client’s goal is my first priority. Whether it's connecting them with an important contact or sharing from my 10 years’ experience as a hardware design engineer, I do whatever I can to help my clients thrive. Over the past 10 years, I've learned how to bring a product from the inception stage to life in various industries, cultivating lifelong relationships.

Abstract: The presentation will discuss innovative 3D printed electronics capabilities, including:
  • The role of additive electronics manufacturing in Industry 4.0
  • The increasing synergy between the additive manufacturing of electronics and the IoT
  • Industry timelines for production-scale 3D printed electronics
 
9:15AM
On-Going Cleanliness Testing on Production Hardware

Speaker: Mike Bixenman, Kyzen
Bio:
 Dr. Michael Bixenman (aka Dr. Mike) is known to many as the world’s leading expert in cleaning electronic circuit assemblies and advanced packages.  He is also one of the industry’s leading authorities on the design of electronic assembly, cleaning materials and process integration. In fact, Dr. Mike literally wrote the book on electronics manufacturing process cleaning standards (Cleaning & Contamination Process Guide).  
Abstract: The performance and cost advances over the past 20 years have enabled technologies to advance beyond what anyone could have imagined. In spite of these technology advances, the cleanliness standards that contractors rely on to ensure the design, production, and quality of next-generation Class 2 & 3 electronic hardware has remained unchanged. As technologies advance, the companies who build the device need guidance on what to do and how to do it.  
 
Flux residues trapped under low standoff leadless components on Pb-Free assemblies may still be active due to blocked outgassing channels, even when using a no-clean solder paste. Quantifying the risk of site-specific residues under problematic components is commonly done during the materials and process validation using chemical and electrical test methods. Process verification and validation are done to characterize and prove out the process on the materials used to build production hardware. Once the printed circuit assembly is placed into production, process control test methods to assure conformance are lacking. 


11:00AM
BGA’s, LGA
’s, QFN/DFN’s – Oh My, Can Traditional DFM Survive 
Speaker: Dale Lee, Plexus Corporation
Bio: 
Dale is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields.
Abstract: Today’s electronic product designs are rapidly increasing the use of bottom terminated components (BTC’s), whether they are collapsible/non-collapsible ball grid array (BGA), solder bump grid array (BGA?), land grid array (LGA), quad-flatpack no-lead (QFN) or dual-flatpack no-lead (DFN) component packaging technologies.  However, with some BTC package designs vary greatly in solder pad design and pitch within the same package.  This variability impacts the ability to incorporate good DFM practices and selection of applicable assembly workmanship rules for these and other standard BTC component package designs. This presentation will highlight impact elements these component technologies have on the assembly, cleaning and inspection processes and what actions can be made during the DFM and NPI process to minimize yield impacts on the manufacturing process.


1:30PM
Women in the Electronics Industry

Speaker: Billi Curtin, ITW Contamination Control Electronics
Bio: 
Women can’t be truly successful in the electronics industry, can they?  Billi Curtin sure thinks so. As a Regional Sales Manager for ITW Contamination Control Electronics, manufacturers of the Chemtronics, Techspray, and Plato brands, Billi is responsible for developing and executing the sales strategy of precision cleaners and associated consumables within the electronics market.

Abstract: It is not easy being a woman in the electronics industry.  We are strong ladies who have chosen to flaunt convention and work in a traditionally male-dominated field.  However in doing so, we often struggle with feelings of isolation, frustration, and anger. But why? Is it due to the patronizing comments from male coworkers, the gender wage gap, the lack of work-life balance, or simply because the “thick skin” you’ve had to develop over the years isn’t really that impervious?Regardless of the reasons, tapping into sources of empowerment, not blame, are key.

Completely bypassing social commentary on gender issues, this presentation will focus on tools and techniques to identify personal strengths and leverage them to neutralize gender-bias, silence your critics, avoid gender-based pitfalls without ostracism in the workplace, influence and lead (even without authority), and gain recognition and respect from your male counterparts.


3:00PM
Rework 101
Speaker:
 Viswam Puligandla
Get an exclusive look at the latest SMTA online training course, Rework 101, to close out the expo!
Bio: Industry veteran, Viswam Puligandla, Ph.D., will step through the basic rework process for both SMT and through-hole components. 
Abstract: Learn about critical temperature and moisture considerations, heating methods, types of acceptance criteria, and more. This course is intended for entry-level technicians or operators, engineers new to the industry, or even someone who has been away from the process for a while.
Topics Covered:

  • Rework, Repair and Modification Definitions
  • Rework Temperature Considerations
  • Moisture Sensitivity
  • Rework Equipment
  • Basic Process Steps
  • Rework Process Flow Chart Examples
  • Rework of Surface Mount Components
  • Rework of Insertion Mount Components
  • Board Repair
  • Acceptance Criteria
 

Thank you, sponsors!


Breakfast Sponsor - Precision Technology, Inc.


Technical Sessions Sponsor - Kurtz Ersa


Lunch Buffet Sponsor - NPI Technologies


Door Prize Sponsor - SVTronics


Tote Bag Sponsor - Element
 


March 21

Houston Chapter: Houston Expo & Tech Forum  +

Stafford Center



Please join us for our 2019 Houston SMTA Expo & Tech Forum at the Stafford Centre, 10505 Cash Road, Stafford, Texas 77477.  If you look forward to seeing the latest products and services in the industry and an opportunity to enjoy presentations by experts in our profession, you won’t want to miss this show!

 

Come see over 60 local and national tabletop exhibitors. Free lunch from 12:00 Noon to 12:45 P.M catered by Kelley's Country Cookin and lots of chances to win door prizes. We’ll also have drawings after each technical session. You must be present to win.

 

This is a free show for attendees. We are pleased to offer another outstanding technical program with information and technology presented by industry leaders to keep your skills up to date!


http://www.smta.org/chapters/files/2019_SMTA_Houston_Expo_and_Tech_Forum.pdf
 

 

To register for the show, go to http://www.smta.org/expos/#houston and register in the attendee section.








March 25

FREE Pre-Conference Webinar: Harsh Environment Failure - Causes & Cures  +

Organized by SMTA Europe Chapter


Monday 25th March at 2.30pm UK Time (10:30am US Eastern Daylight Time)

Join Keith Bryant & Bob Willis to find out more about the demands on Electronics in Harsh Environments as they showcase the  challenges faced by design and process engineers worldwide. Including some of the key issues that are faced in Power Electronics, Automotive, High Voltage, Assembly and High Reliability Products.

For the third year running SMTA Europe present the Electronics in Harsh Environments Conference and Exhibition 2-4th April in Amsterdam for more information visit: https://www.smta.org/harsh/

Still unsure if you should be in Amsterdam or need more info to convince your boss.  This is an ideal way of seeing in advance some of the people you will meet and things you will learn from industry experts, plus you will be able to show examples of what you have learned on the different failure modes in electronics.

By attending this FREE webinar, you also have the opportunity of winning a FREE pass to attend one day of the conference!

Topics include:

  • High Temperature
  • Condensing Environments
  • Water Immersion
  • Mechanical Strain
  • Corrosive Environments


March 29

Penang Chapter: SMTA Penang Chapter Free Webinar  +

Location
https://www.smta.org/webinars/#penang



Presenters: Dr. Mike Bixenman and Debbie Carboni, KYZEN Corporation
 
Overview:
Highly dense Printed Circuit Assemblies build in more functionality using leadless and bottom terminated components. As these components reduce in size, the distance between conductors narrows. Reliability of these devices requires a high level of cleanliness, especially residues that are ionic in nature. The cleanliness question has been a topic area of concern over the past five years. To address this growing concern IPC – J-STD-001G, Amendment requires objective evidence to establish acceptable and unacceptable levels of residues on production hardware.
This webinar will teach important design variables that impact electrochemical reliability of Electronic Devices. The significant elements of influencing residues levels include:
•           Flux or flux-bearing materials
•           Cleaning agents
•           Changes in manufacturing suppliers
•           Changes in solder mask
•           Changes in printed board fabrication processes or surface metallization
•           Geographic change in manufacturing location
The webinar will identify and teach methods for screening materials and processes. From these methods, the attendees will gain a better understanding toward identifying and analyzing risks associated with contamination. They will learn about advanced control measures to eliminate these risks and their effects. The webinar will teach new methods for monitoring the effectiveness of these controls.


March 29

FREE Webinar: Key Design Variables that Impact Electrochemical Reliability of Electronic Devices  +

Organized by SMTA Penang Chapter

Location
Penang Malaysia


Friday 29th March @ 11:00am Penang Time GMT+8
(Thursday, March 28 @ 11:00pm US Eastern Daylight Time GMT -4)

Presenters: Dr. Mike Bixenman and Debbie Carboni, KYZEN Corporation

Free for all – only members will get access to recorded presentation!

Overview

Highly dense Printed Circuit Assemblies build in more functionality using leadless and bottom terminated components. As these components reduce in size, the distance between conductors narrows. Reliability of these devices requires a high level of cleanliness, especially residues that are ionic in nature. The cleanliness question has been a topic area of concern over the past five years. To address this growing concern IPC – J-STD-001G, Amendment requires objective evidence to establish acceptable and unacceptable levels of residues on production hardware.

This webinar will teach important design variables that impact electrochemical reliability of Electronic Devices. The significant elements of influencing residues levels include:

  • Flux or flux-bearing materials
  • Cleaning agents
  • Changes in manufacturing suppliers
  • Changes in solder mask
  • Changes in printed board fabrication processes or surface metallization
  • Geographic change in manufacturing location

The webinar will identify and teach methods for screening materials and processes. From these methods, the attendees will gain a better understanding toward identifying and analyzing risks associated with contamination. They will learn about advanced control measures to eliminate these risks and their effects. The webinar will teach new methods for monitoring the effectiveness of these controls.

 

About the Presenters

Dr. Mike BixenmanDr. Michael Bixenman, Chief Technology Officer (CTO) and cofounder of KYZEN, has over 30 years of experience in the design of electronic assembly cleaning materials and process integration. Sharing his research, knowledge and experience is Mike’s passion as he is the author and co-author of over 100 technical papers and presentations presented all over the world. He believes in the power of collaboration, by working with others to solve problems quickly. An active member of several industry associations, he has chaired and led many committees, symposiums, and task groups that are committed to understanding the cleaning and reliability challenges of today’s ever-changing electronics industry. Dr. Bixenman holds four earned degrees, including a Doctorate in Business Administration (DBA).

 

Debbie CarboniDebbie Carboni's involvement in the electronics industry started more than 20 years ago and has encompassed a diverse set of experiences that give her a deep knowledge of cleaning chemistry, equipment and processes. Having been with KYZEN for over 10 years, Debbie is dedicated to providing customers and partners with the highest quality customer support and service as well as ensuring that they receive the best technical solutions. Her extensive real world experience helps guide engineers during qualification to ensure success in production conditions. Debbie’s dedication to the electronics industry has included a number of roles and voluntary positions in many of the industry’s leading associations, and is currently serving her second term on the SMTA Board of Directors as the Vice President of Expo. After attending Northern Arizona University, Debbie remains knowledgeable through numerous technical conferences and leading-edge research. Debbie has authored and co-authored several papers related to cleaning solutions and regularly presents at and attends industry events such as; SMTA International, Cleaning and Coating Symposium, ICSR, Apex. Always willing to share, Debbie is an excellent resource with lots of experience and passion.


April 2 - 4

Electronics in Harsh Environments Conference  +

Location
Amsterdam Netherlands


The conference will focus on building reliable electronics used in power electronics and harsh environments.


April 3

Space Coast Chapter Tutorial Program: "Solder Paste - Your SMT Line’s Gray Matter"  +

Learn what it is and how to choose it, print it, reflow it and clean it

Location
Mack Technologies
Melbourne , FL 32904



Instructors: Phil Zarrow & Chrys Shea

April 3, 2019

9:00 a.m. - 4:30 p.m.
Mack Technologies
7505 Technology Drive
Melbourne, FL 32904
(321) 725-6993
Price:
  • Members: $200
  • Non-Members: $400
  • Space Coast Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $80 

Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
 

The Chrys and Phil Show

Brought to you by two serious industry experts who don't take themselves too seriously, Phil Zarrow and Chrys Shea.  Together, they combine over six decades of SMT experience, hundreds of publications and dozens of awards.  Phil brings vast experience and insight, Chrys brings the data from independent research, and both of them like to deliver their knowledge in fun, interactive environments.

Pre-requisites:

  • Some SMT assembly process experience
  • A working sense of humor

Come to the BRAND NEW Space Coast Tutorial to learn:

Solder Paste

Solder Paste - what is it?

  • How it is made, particle size classifications
  • How it behaves - viscosity, thixotropy, rheology
  • Balancing performance properties and why every formulation is different
  • 25 paste characteristics that affect SMT line performance
  • Finding the right product for the job
  • Environmental and handling considerations

BREAK

Printing

Stencils - aperture rules (5 ball rule, area ratio...)

Stencils - techniques and materials (fine grain ss, nano, etc.)

Printing mechanics

  • Printing considerations and parameters
  • Gasketing
  • Coining
  • Support
  • Stencil cleanliness

Troubleshooting Printing Related defects

Factory Tour of BlueRing Stencils and LUNCH

Solder Paste Inspection

  • SPI Basics
  • Types of SPI technologies
  • Reasons for deploying
  • Implementation tips
  • Setting tolerances
  • Understanding thresholds

BREAK

Reflow Soldering

  • Methodologies:  Vapor phase, convection, laser
  • Profile Objective
  • Profile shapes (Straight ramp, ramp-soak-spike classic, Shoulder)
  • Solder Paste/solder behavior during reflow

Troubleshooting common defects:

  • Shorts
  • Opens
  • Solder balls
  • Tombstones
  • Head-In-Pillow
  • Voiding

Cleaning (time permitting)

  • Why clean - pictures of dendrites and corrosion
  • NC vs OA
  • Why clean the no-clean?
  • ROSE testing vs ion chromatography
  • The importance of monitoring the cleaning process

Q&A



About the Instructors:

Chrys Shea Chrys Shea
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is an SMTA “Member of Technical Distinction” and three time SMTAI “Best of Conference” award winner for her research on solder paste printing. Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees.


Phil ZarrowPhil Zarrow

Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years.  His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies.  In addition to his background in reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems.  Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throught the world.  During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.

Since forming ITM Consulting in 1993, Phil Zarrow has helped numerous clients in such areas as

  • SMT Implementation and Assembly facility set-up
  • SMT Assembly and Soldering Failure Analysis
  • EMS/Supplier Process and Quality Assessment Audits
  • Counterfeit Component Avoidance and Interception Programs
  • Manufacturing yield improvement
  • Equipment Evaluation and Selection
  • No-clean and lead-free solder paste evaluation and process implementation
  • SMT Manufacturing Process Audits and process improvement
  • On-site training for all levels of personnel
  • Design for Manufacturability (DFM) specification development
  • Reflow of Through-hole feasibility, development and implementation
  • Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
  • SMT process equipment benchmark testing and evaluation
  • SMT product development
  • Lead-free Process Implementation and Optimization
  • Technical evaluations related to business acquisitions and mergers
  • Technical assistance in legal disputes

Mr. Zarrow is a popular speaker and workshop instructor.  He has chaired anbd instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim.  He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books.  He is co-author of the book, "SMT Glossary- Terms and Definitions".  Mr. Zarrow holds two US Patents concerning PCB fabricationa dn assembly processes and audit methodologies.

Phil is a member of IPC, SMTE, IMAPS, a co-founder of ITM Consulting, and is a past national level officer and national director or the Surface Mount Technology Association (SMTA).  He was also Chairman of the Reflow Committee for SMEMA.  He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders' Award (2000).  Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forfront" and "Better Manufacturing" columms.  He is currently producer and co-host of IPC Update's "Boardtalk" audio program.

 

Contact Karen Frericks at 952-920-7682 with questions.


April 10

San Diego Chapter: 04/10/19 SMTA Chapter Meeting - Gold Planar Bumps for Challenging Flip-Chip Applications and Factory Tour of Palomar Innovation Center  +

Location
Palomar Technologies Inc. 2728 Loker Ave West, Carlsbad CA 92010



Palomar Technologies will be presenting and giving a live demo and factory tour...


Topic: Gold Planar Bumps for Challenging Flip-Chip Applications
Speaker:  Evan Hueners, Product Marketing Manager




The semiconductor packaging industry continues a relentless pursuit to make smaller packages with a higher throughput. The industry demand for smaller components requires manufacturers to adapt by developing new processes. This presentation will explore the shrinking specifications of wire bonding requirements in regards to ball bump mashed ball diameter and top heights, and how to achieve them.


Date: 04/10/19
Registration: 4:45 PM
Social/Dinner: at 5:00PM
Presentation: 5:30PM

Factory Tour: 6:30PM
$5 Members and $15 Non Members
Location: Palomar Technologies Inc., 2728 Locker Ave West, Carlsbad CA 92010
RSVP at this link:
https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4682


April 10

Long Island Chapter: Chapter Meeting  +

Courtyard Long Island MacArthur Airport, 5000 Express Drive South - Ronkonkoma, NY 11779



Wednesday, April 10th   2019  ... 5:30 PM.... see below to RSVP on Line
Courtyard Long Island MacArthur Airport
5000 Express Drive South - Ronkonkoma, NY 11779
Phone: 631-612-5000 Fax: 631-612-5001
 
SMTA Long Island Chapter Presents
 
Solder Jet Printing Technology
Presented by 
 
Gustaf Martensson 
Mycronic's
Expert on Complex Fluids
Research & Development 
 
 
Viktor Olsson 
 Mycronic's Product Manager for
Assembly Solutions
This presentation will focus on Jet Printing from an application and technological perspective. 
 
The lecture will cover the basics of jet printing, deposition and material trends, applications and specific advantages, and component variations/shortage. The course will be concluded with a look into the future with reference to what materials and technologies will be needed to fulfill the needs of the electronics industry. 
 
Meeting and Dinner Buffet (Cash Bar):
 
For Individual and Corporate Participating Members: 
$0.00...Great Deal! ...our way of saying "Thanks" for all your support!
 
Non Members:   
Dinner and meeting only without membership...$35.00
 
 Join the SMTA...Individual Membership $95
Enrollment includes 1 year SMTA membership; free attendance and dinner at this meeting... This is a great deal! 
 
 Due to room size we may be limited to 50 attendees...
Please RSVP. 
https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4685
 



April 11

Rocky Mountain (Colorado) Chapter: Business After Hours at Advanced Circuits  +

Location
21101 E. 32nd Parkway Aurora, CO 80011



SAVE THE DATE!
The SMTA Rocky Mountain Chapter
After Hours Meet & Greet Event on April 11, 2019
3:00-6:00PM
Hosted by: Advanced Circuits

  




Join us for a free SMTA After Hours Meet & Greet event at Advanced Circuits.  Enjoy a tour of the facility and a presentation by Isola Group, manufacturer of pre-pregs and laminate materials used in fabricating printed circuit boards.  Refreshments will be provided. 
Tours will start at 3:30PM and 4:45PM.



April 12

Rochester Institute of Technology Student Chapter Chapter: SMTA - RIT's Student Chapter showcase for MMET prospective students  +

RIT Campus, Louise Slaughter Hall, Room # 2210



Overview
On this event we will be showcasing our SMTA student chapter to prospective RIT students. We will talk about the types of work that we do, our Center for Electronics Manufacturing Assembly (CEMA) lab, and the benefits of being members of an industry recognized organization shuch as SMTA. 


April 16

Huntsville Chapter: Planetary/Centrifugal Mixer - April 2019 HSV Chapter Meeting - Reminder to RSVP by Thursday April 11  +

STI Electronics



               Reminder to RSVP by Thursday April 11
                                   
Huntsville Chapter SMTA and STI welcome you on April 16, 2019 from 5:30-7:30pm to a discussion and DEMO on a NEW PLANETARY/CENTRIFUGAL MIXER.
 
Abstract: 
Thinky Planetary Centrifugal Mixer in the Real World
Thinky Planetary Centrifugal Mixer was first created 35 years ago in Japan in a small shop in Tokyo.  Now over 35,000 units have been sold in over 50 countries for an extensive range of applications.  Thinky mixes, disperses, and degasses materials (0.5g to 20kg) in minutes with or without the use of vacuum.   Easy clean up, setup, and ease of use makes it the industry standard for mixing and degassing.
 
 
Speaker Info: 

 
Kosuke “Ko” Takada is V.P. of Marketing and Business Development at Thinky U.S.A. Inc.
 
He has spent the first 4 years at Thinky HQ, as the International Sales Manager and have been mainly responsible for the Southern Hemisphere and North American territories.  The past 2 years, he has been transferred to Thinky U.S.A. to build better relationships with the customer and help increase the growth of Thinky U.S.A.  Kosuke has held over 20 seminars in North America, Europe, Asia, Australia, and Africa and created new distributor channels in several countries.
 
He has graduated from Embry-Riddle Aeronautical University with a degree in Aeronautical Science.  He has his Commercial Aviation License, Certified Flight Instructor License, and have more than 10 years of experience in international sales.  As a hobby he likes to listen to music and snowboard.
 
 
Agenda:
5:30 – 6:00 networking
6:00 – 6:30 dinner
6:30 – 7:15 intro & presentation
7:15 – 7:30 wrap-up


 
Location:  STI Electronics, 261 Palmer Rd, Madison, AL 35758
Directions From I565:
  • Take the Wall-Triana Hwy exit toward Madison Blvd / Madison
  • Keep straight onto Sullivan St.
  • Turn left onto Palmer Rd
  • Arrive at 261 Palmer Rd, Madison, AL 35758
Dinner :
Meeting is free, but boxed meals from Apple Lane Farms and drinks will be available, let us know if you plan to dine with us.
$8 for SMTA Members who RSVP by Thursday April 11, 2019
$10 Non-Members who RSVP by Thursday April 11, 2019
$13 No RSVP
Cash/check at Door

Two ways to RSVP:
  • SMTA RSVP Link:
  • send email to: HSVSMTA@gmail.com

 



April 17

FREE Webinar: Flux Cleaning from PCB Assembly: Challenges, Methods and Assessment  +

Organized by SMTA India - Bangalore Chapter

Location
Bangalore India


Wednesday 17th April @ 9:30am India Time GMT+5:30 (12:00am US Eastern Daylight Time GMT -4)

Presenters: Ansuman Das, Ph.D., MacDermid Alpha Electronics Solutions

Free for members - only members will get access to recorded presentation!
Non-members: USD $10 

Members must log in to register with no fee. Non-members can pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: newprojs_ankan@yahoo.com +919620075752 or Madhukar Rao: +919686098690.

Overview

Although most of the PCB assemblies manufactured today involve no-clean process – many of the applications still demand the flux residue to be removed after soldering due to more stringent electrical requirements or due to the requirement from a downstream process. With the quantum of changes the electronics world has gone through in the past two decades, cleanability requirements for the PCB assembly have also changed to keep up with new requirements. Change in design, materials and manufacturing processes involved in assembling has also made the cleaning process more and more complex. In this presentation we will discuss the challenges faced by today's industry in terms of post soldering flux cleaning from the assembly and how to address such challenges with available methods. Discussion will explain the chemistry involved in cleaning different types of fluxes in different cleaning processes. It will also cover some of the methods to evaluate the cleanliness of the PCB assembly.

 

About the Presenter

Ansuman Das, Ph.D., is currently a formulation scientist and technology leader for MacDermid Alpha Electronics Solutions at the India Research Centre, Bangalore. He received his Ph.D. in Chemistry from University of Calcutta, India. Dr. Das has more than 14 years of experience in development of soldering fluxes and solder paste for board, substrate and wafer level applications.

 


April 18

Silicon Valley (San Jose) Chapter: SMTA TECHNICAL MEETING #1 FOR 2019  +

Intel SC 12 3600 Juliette Ln, Santa Clara, CA 95054




https://www.smta.org/chapters/files/Silicon-Valley-Logo.jpg

SMTA SILICON VALLEY CHAPTER MEMBERSHIP DRIVE & TECHNICAL PRESENTATION MEETING HELD AT INTEL CORPORATION!
 
Theme:  New Challenges and Opportunities in Packaging, Manufacturing Process for High-Density Multi-Chips
  
IMPORTANT INFO:
Date:  Thursday, April 18, 2019
Time:  Sign In/Registration:  2:15pm-3:00pm
Presentations:   3:00pm – 6:00pm(Reception to follow)
Location:  INTEL SC 12
3600 Juliette Ln, Santa Clara, 95054
(Light refreshments to be served during breaks and registration.)

SMTA Members: Free; Non-Members: $20
(By cash or check payable to ‘SMTA Silicon Valley Chapter’ at the door)


SMTA Membership 
(Individual: $95 per year, Membership sign up at www.smta.org)
This is a Membership Drive Event.  Members can bring a guest for FREE.



CLICK HERE TO REGISTER TODAY!
https://www.smta.org/chapters/rsvp.cfm?bee_id=4690


Topic 1
The Datacenter – Integrated Photonics Manufacturing and Technology
Speaker: Robert Blum
Intel Silicon Photonics
Santa Clara, CA 
Abstract:  The rapid growth in data center traffic is driving the need for increased performance and overall bandwidth of networking equipment, including optical interfaces and Ethernet switches, which are based on pluggable transceivers today. But looking just a few years ahead, bandwidth scalability challenges are looming in terms of density, cost, and power; challenges that require tighter integration of optics and networking silicon. We will review motivation for integration and the enabling technology elements, and discuss how co-packaged Silicon Photonics enables higher density, reduced power per bit, and ultimately the continued scalability of network bandwidth and performance.

BIOGRAPHY:  Robert Blum is Director of Strategic Marketing and Business Development for Intel’s Silicon Photonics Product Division. Prior to joining Intel, Robert was Director of Strategic Marketing at Oclaro Inc., and held various Director of Product Management and Marketing roles for Oclaro’s telecommunications products and consumer laser portfolio. Before joining Oclaro, Robert was Product Line Manager for optical transmission components at JDS Uniphase Corporation and held various engineering and marketing management roles at Gemfire Corporation, all in California. Robert worked at Deutsche Telekom’s research labs in Darmstadt, Germany, while completing his master’s thesis and holds a doctorate degree in Physics from the University of Technology in Hamburg. He has also studied and done research at Ecole Polytechnique Fédérale in Lausanne, Switzerland, and at Stanford University, California. 

Topic 2
Packaging - More Choices, More Complexity
Speaker: Ken Brown
Senior Director- Packaging at Intel, Santa Clara
Abstract:  Back in the “old” days of packaging, the REALLY old days, you just had a few choices.  You went with a standard leadframe package or tooled up a custom leadframe if your volumes were high enough, dropped your chip on it, did the wirebonding and molding, and voila ! you had your packaged chip.  Or alternatively, you got a hunk of ceramic, printed a circuit on it with thick film metal and dielectric, attached and wirebonded your chips, and once again you had your product.  Not to turn this into a packaging history lesson, but then we started surface mounted packaging, at least doubling the choices with thru-hole packages and surface mount.  Next came along limited and then broad application of flip chip packaging, migration from ceramic to organic flip chip packaging, and the growth continued.  The growth of packaging has really followed the growth and diversity of the product needs for the chips.  There is no end in sight, which I guess for the packaging engineer is a good thing !  This presentation will discuss the growth, diversity, and increasing complexity of packaging.
 
BIOGRAPHY: Ken Brown is the Senior Director for Packaging at Intel’s Silicon Photonics Product Division, and splits his time between Santa Clara, California, and Chandler, Arizona.  Ken joined Intel in 1998 following Intel’s acquisition of the Digital Equipment Corporation (DEC) semiconductor business in Massachusetts.  At Intel, Ken has held a variety of positions, with 20 years in Intel’s Assembly and Test Technology Development (ATTD) group - as Director of ATTD-Asia responsible for packaging development of  Intel’s Communication and Wireless products in China, Malaysia, and the Philippines; as ATTD Senior Director of Package Design; and prior to his current role, as Senior Director of Packaging for Intel’s Custom Foundry business.  Before joining Intel, he had worked in a variety of positions over 17 years at DEC in assembly, boards, advanced development, and semiconductor packaging,  He has been in the electronic packaging field for more than 30 years.   Ken holds degrees in Mechanical Engineering and an MBA from the University of Massachusetts at Amherst and Northeastern University.  He also holds several Packaging Patents, chaired the Semiconductor Research Corporation Packaging Committee, and has authored packaging chapters for University texts.  Outside of Intel, Ken is an award winning photographer, and was fortunate enough to receive an Intel “Sustainability in Action” grant to create the world’s largest full-color, high resolution, underwater photograph of the Bloody Bay Wall reef in the Cayman Islands to highlight the reef’s changing biodiversity.

Topic 3
Changing Market Requirements Bring New Challenges and Opportunities in Packaging
Speaker: Herb Reiter
eda 2 asic Consulting, Inc.
Abstract:      The increasing demand for higher performance per Watt, integration of heterogeneous functions, smaller form-factors, lower unit and development cost as well as shorter times to profit are just a few of the reasons why the semiconductor industry is making significant changes to traditional strategies and practices.

The most visible and impactful of these changes is our focus on advanced packaging technologies. They are shifting a major part of the value creation from single-die SoCs to multi-die (sub)system solutions in a package. Unlike multi-chip modules (MCMs) in the past, today's multi-die packages are becoming more and more cost-effective and, thanks to the emerging die-package-board design flows, much easier to develop, manufacture and deploy.

This presentation outlines major market changes, explains the resulting challenges for our industry and shows how innovative companies turn these challenges into opportunities for growing revenues and profits.

BIO:   After 10 years as board-level and system designer, Herb worked for about two decades for ASIC and EDA companies in both Europe and California.    In 2002 he founded his own company " eda 2 asic Consulting, Inc." to focus on reducing the gap between the IC design and manufacturing camps.    Since 2008, when he started the GSA's 3D-IC Working Group, Herb consulted on 2.5/3D-IC design and manufacturing topics with SEMATECH, Si2 and EDAC/ESD Alliance to contribute to the industry's transition from single-die SoCs to multi-die solutions in advanced packages.    Herb frequently blogs about multi-die IC-related  topics at 3D InCites, see http://www.3dincites.com/3d-context/ .   He earned an MSEE and MBA in Austria, an MBA at San Jose State University and attended 40+ Continuing Education Courses at Stanford University.  

Topic 4
Manufacturing Process for very high density multi-chip modules utilizing Liquid Crystal Polymer in multi-layer constructions
James Rathburn
HSIO Technologies, LLC
Abstract: The company developed a new method for production of very high density multi-chip modules and circuits utilizing high performance Liquid Crystal Polymer (LCP) material sets in multi-layer constructions not possible with historical fabrication methods. The presentation describes the basic process sequences compared to conventional circuit fabrication methods, and identify unique design rules to enable much higher density and performance than previous use of LCP and like dielectric materials. Heterogeneous Integration examples aligned with the DARPA (Defense Advanced Research Projects Agency) CHIPS program will be described and demonstrated with high layer count LCP SiP substrates with sophisticated Micro-Electronics Assembly techniques extending from surface mount through embedded active semiconductors with passive device integration. A manufacturing relationship with a contract manufacturer  and  a RF Technology company focused on a RF and High Speed Design Innovation Center which will be described to illustrate the manufacturing process highlighting Test at Assembly technology highlighting the importance of Known Good Die (KGD) for any multi-die assembly especially when devices are embedded within internal layers of a high layer count substrate. The presentation will use true to industry relevant examples of high density modules developed to validate process, performance and reliability requirements for high reliability applications in the Mil/Aero/Defense/Sat/Auto and Tele/Comm/Mobile/Computing industries. Signal Integrity analysis normalized from empirical measurement data from DC to 112 gbs and 110 GHz RF will be explained to highlight the benefits of LCP versus conventional material sets.
 
BIOGRAPHY: James is the founder and President of HSIO Technologies, located in Maple Grove MN near Minneapolis. He was previously the founder of Gryphics, Inc. which was sold to Cascade Microtech in 2007. James is the author of over 80 patents related to high speed electrical interconnect and circuit fabrication and is responsible for advanced technology development at HSIO. James has over 30 years of semiconductor industry experience, and attended Marquette University's College of Engineering.



April 29

Webinar: Flexible Circuit Board Design & Assembly with Lead-Free Alloys  +


Bob WillisMonday 29th April @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Flexible circuits is another packaging technology which has seen a growing and wider acceptance in the electronics industry. The advantages of surface mount reduced weight; decreased size can be further enhanced by flexible circuitry. In many cases, it is a misconception that flexible circuits have to flex, they don't; many flexibles are designed purely to aid the circuit design and assembly into the final product. In this case the substrate is only flexed or formed once. The range of constructions for circuit manufacture are wide but the basics are similar to existing printed circuit production. The design and selection of the manufacturing methods can affect the final cost of the circuit and need to be considered in detail prior to manufacture. Where design departments have limited experience useful reference material is available to engineers worldwide with the release of Flexible Circuit Technology, Third Edition by Joe Fjelstad and other publications.

 

Topics include:

  • Flexible Design for assembly
  • Manual assembly and soldering
  • Automatic assembly process requirements
  • The need for baking flexible circuits
  • Flexible circuit pallets for automatic assembly
  • Screen printing, placement, reflow soldering & AOI
  • Manual hand soldering and de-soldering
  • Rework of conventional and surface mount
  • Solder joint Inspection
  • Process defects on flexible circuits and during assembly

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


May 3

Dallas Chapter: LED Do’s and Don’ts  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



LED Do’s and Don’ts

Speaker: Matt Osborne, Regional Territory Manager, Trans-Tec America

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on May 3, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!



Abstract

What to do and not to do with LEDs in a surface mount process including Paste printing, Stencil Design, picking, placing, Reflow, and test.

Biography

Matt Osborne
Trans-Tec America
Territory manager
  • Attended University of Delaware.
  • Worked for Motorola in Shaumburg, IL as a SMT Manufacturing Engineer.
  • Worked for Allied Signal in DOD environment as a SMT Manufacturing Engineer.
  • Worked for Quad Systems as a Field Service Engineer.
  • Engineer for Decatur Electronics in microwave radar.
  • Redesigned to Jugs professional radar gun used by Major League Baseball.
  • Opened his own contract manufacturing business, Contract Assembly Service, Inc.
  • Vice President of American Circuits located in Charlotte, NC.
  • Director of Engineering. The Light Source, Inc. – Design and manufacturing of high-end theatrical stage lighting.
  • Trans-Tec America territory manager.



May 7

Wisconsin Chapter: Milwaukee Brewers Game May 7th  +

1 Brewers Way, Milwaukee WI 53214



Wisconsin SMTA hosts an evening at Miller Park with the Milwaukee Brewers
 
Thank You to everyone who signed up for the Brewers game of May 7th!  
We are now at capacity.

  

 Our ticket package is in Section 211.  Row 8-12. 
Price per ticket is $15.00. 
Tickets will be handed out at the WI SMTA Expo on May 7th.


May 7

Wisconsin Chapter: 2019 WI SMTA Expo  +

Crown Plaza Milwaukee 6401 S. 13th Street Milwaukee, WI 53221



Join us for the WI SMTA Expo on May 7th! 
Where: Crown Plaza,  6401 S 13th Street  Milwaukee, WI 53221
Hours will be 9:00 am to 3:30pm

What to expect:
Over 50 Exhibitors,  Door Prizes,  Golf sign up,  Raffles,  Lunch,  3 Technical Speakers and more! 
Following the Expo we will have 30 seats to the Brewers 6:40pm game.  Please scroll down the webpage to secure your spot for the Brewers game.

We are pleased to announce our 3 Technical Speakers:
Chrys Shea of Shea Engineering
Michael Sevigny of CeTaQ Americas
Jason Fullerton of Alpha Assembly
 
Come for the Exhibitors and stay for lunch and Networking! We cannot wait to see everyone on May 7th!



May 7

Connecticut Chapter: Stanley Black and Decker: Innovation Center tour and tech talk  +

One Constitution Plaza, Second Floor, Hartford CT



Our first Tech Session of 2019 will include a tour of Stanley Black & Decker’s “Manufactory 4.0” Innovation Center, and include a presentation with Q&A by Eric Cowan who is the Director Industry 4.0, Automation & Robotics at Stanley Black & Decker.   

 
MAY 7, 2019
3:00 pm - 5:00 pm

Stanley Black & Decker:  Innovation Center tour and tech talk

"Industry 4.0 Robotics, Data Layer Management and SMTA Q&A"
Presented by Eric Cowan, Director Industry 4.0, Automation & Robotics at Stanley Black & Decker 

We are thrilled to be the first visitors of the new Stanley Black & Decker Innovation Center!  Stanley Black & Decker has created autonomous, off-site teams  throughout the United States to pursue new ideas and create a culture of innovation.  The state-of-the-art “Manufactory 4.0”in Hartford CT is the epicenter for Stanley Black & Deckers global Industry 4.0 “Smart Factory” and workforce upskilling initiataves – making manufacturing more efficient, productive and adaptable.


About the Speaker (bio):
An innovative leader who excels at creating sustainable processes and delivering complex solutions. Expert in business process re-engineering, project management and creating tools and systems to enhance operations. Expert coach and mentor, change agent, internal consultant, and project manager. Over 18 years experience in high volume electronics manufacturing including 15+ years as a functional manager leading teams and leading leaders in a highly matrixed global organization. A lifelong learner, passionate about continuous improvement with exceptional analytical and problem-solving skills, enjoys solving problems across a broad set of business functions. Skilled communicator with experience presenting to all levels of the organization and conferences.
Certifications: PMP, MBA, CSM, CSPO, SaSP, Jonah, Six Sigma, LEAN

COST:  $25.00 SMTA Members / $35.00 Non-Members

Map of Innovation Center
 


May 8

Mexico-Guadalajara Chapter: SMTA Expo and Tech Forum Chihuahua Edition  +

Salon Villarreal





Te esperamos, registrate en el siguiente link para poder asistir

Registro Aqui / Register Here

Evento gratuito gracias a nuestros patrocinadores, consulta proximamente el listado de empresas participantes en la zona de Expo.


Hotel Convenio: Hilton Garden Inn Chihuahua
Direccion: Av. de La Juventud 5915, Esq. Haciendas del Valle
Chihuahua, Chihuahua, C.P 31216, México
Tarifa Habitacion Estandar: $85 usd
Código de reservación: EXPAI
  • Tarifa incluye Desayuno
  • Las tarifas indicadas no incluyen impuestos (16% de IVA y 4% de Impuesto Sobre Hospedaje).
  • Precio por persona adicional $15 usd
  • Tarifas por habitación, por noche, en ocupación doble o sencilla.
  • Tarifas negociadas en dólares americanos.
  • Tarifas NO comisionables.
  • La tarifa pública está sujeta a cambio y disponibilidad sin previo aviso.
  • Ocupación máxima por habitación 2 adultos.
Contacto:
MARTIN LEDEZMA DEL RIVERO
+52 614-311-25-24     Office
+52 614-239-33-26     Mobile
martin.ledezma@hilton.com

 


May 8

Great Lakes (Chicago) Chapter: Accelerating the Solder Paste Evaluation Process - By Chrys Shea  +

Location
Plexus, 2400 Millbrook Drive, Buffalo Grove, IL 60089



Due to speaker illness, this event is canceled.  Please stay tuned for information about possible rescheduling at a later date.

SMTA Great Lakes Chapter Meeting:

Wednesday, May 8th, 2019

Time:  6:00pm – 8:30pm
Location: Plexus – 2400 Millbrook Drive, Buffalo Grove, IL  60089

ACCELERATING THE SOLDER PASTE EVALUATION PROCESS

By
Chrys Shea
Shea Engineering Services
East Greenwich, RI, USA
Chrys@sheaengineering.com

Abstract
 
Solder paste can make or break the profitability of SMT processes. Using the proper chemistry is critical to a successful operation.  Because solder pastes have so many different characteristics that affect their assembly line performance, they can be cumbersome and costly to evaluate.  As a result, many assemblers are using mature formulations that have since been improved upon, simply because they don’t have the resources to properly evaluate new, more process- or product-friendly materials.

This paper proposes a new solder paste evaluation regimen that helps engineers assess up to 25 solder paste properties on their assembly line in 5 hours or less.  It uses the new SMTA board that is available off-the-shelf from Practical Components and is part of a full kit developed specifically to help PCB assemblers choose the right solder paste for their operation, as quickly, easily and economically as possible.
 

 About the Speaker:

CHRYS SHEA
President, Shea Engineering Services

Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry.  Chrys is a frequent speaker at industry events, and has three times received the SMTAI “Best of Conference” award for her research on solder paste printing.  In 2012, she was honored with the SMTA “Member of Technical Distinction” award.  Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island.  She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees.

 
When:  Wednesday, May 8th, 2019
 
6:00 pm: Registration & Networking
6:30-7:00 pm: Dinner
7:00 - 8:00 pm: Presentation
8:00 - 8:30 pm: Questions and Adjournment
 
 

Prices for fabulous dinner meeting
$30 for Members - $35 for non-members
free for Displaced Members

You can pay onsite (Cash/Check only!) or via PayPal (a "Buy Now" button will be availble after completing the RSVP process)

and invite your friends too……….
 
RSVP to Gerri by May 7th, 2019
 
Send RSVP by the methods listed below:

Online: RSVP
 
Fax: 847-639-2489
 
e-Mail: gnoble@ntech-inc.com
 
 
(You will be charged for your visit if a No Show occurs)
 
Where: Plexus – 2400 Millbrook Drive, Buffalo Grove, IL  60089



May 14

Central Texas (Austin) Chapter: CTEA Electronics Symposium at AMD  +

AMD Bldg B500 Auditorium, 7171 Southwest Parkway, Austin, TX



Central Texas Electronics Association

 
Electronics Design, Manufacturing & Test Symposium 
Tuesday, May 14, 2019
AMD Bldg B500 Auditorium at 7171 Southwest Parkway

 
Program:
 
3:00  -   Registration Begins
 
3:30  -   Welcome and Introductions
 
3:35  -   " Packaging Technologies for Advanced Automotive Applications
                 Andrew Mawer, Reliability & Analysis Manager, NXP
                    
4:05  -   " Chip Reverse Engineering Methods
  Carlos Greaves, Sr Vice-President, i-Runway
         
4:35  -   Break for Networking
 
4:50  -   " X-ray Analysis for Electronics ” 
     Stephen Schoppe, President, Process Sciences
 
5:20  -   " Client Reliability Engineering Overview: Best Practices for Commercial PC’s
                 Ed Tinsley, Engineering Manager, Dell
 
5:50  -   Door Prizes Drawing & Closing Remarks
 
6:00  -   Food & Refreshments Served and More Networking
 
 
Registration:
 
RSVP to Bob Baker at:  rjbakeratx@gmail.com
 
No charge for SMTA & IMAPS members;  $10 for all non-members >> (Cash or Check ONLY!)
                            Students can also attend for FREE!
 
Event Location:
 
AMD Bldg B500 Auditorium at 7171 Southwest Parkway in South Austin
near SW Parkway & W. William Cannon Dr  ( Use Parking Garage (1) P300 or (2) P100 )
See Directions to:   (AMD Location)   and   See AMD Campus Map Per Attached Doc
 
In Central Texas, SMTA and IMAPS work together as the Central Texas Electronics Association (CTEA)
 


May 16

Indiana Chapter: NSWC Crane Visit  +

Location
Vistor Center @ 102 Furlong Street, Crane, IN 47522



NSWC Crane Visit of
Surface Mount Tech Association (SMTA) Indiana Chapter
16 May 2019
Purpose: To gain more understanding of NSWC Crane’s technical capabilities.
We will get a chance to tour 3 locations that cover Radar Technology, PCBs, and Failure analysis.
Transportation: 2 - 36 passenger buses
Uniform: Military – Khakis; Civilian – Business Casual
Visitor(s) will be escorted by: Mr. Dean May


To complete your registration the downloard the IDCARD/BASE pdf document. This document MUST be filled out and sent to before May  9, 2019 for citizens and by April 30, 2019 for non-citizens to Michelle Sparks via email or postal carrier using the information below:
  1. Michelle Sparks at michelle.sparks.ctr@navy.mil
  2. Michelle Sparks
Corporate Communications Office
Naval Surface Warfare Center, Crane Division (NSWC Crane)
Building 1, Code 103
300 Highway 361
Crane, IN 47522-5001

Forms must be recieived by April 25, 2019 if you are not a US citizen  and by May 2, 2019 if you are a US citizen.

At the visitor’s center you will have to show:
  1. Valid Identification
    • Show valid identification usually valid driver's license from any REAL ID compliant state.
    • Currently only 5 jurisdictions are not REAL ID compliant: Illinois, Missouri, Minnesota, Washington, and America Samoa. Visitors with driver's licenses from those states will have to present an additional form of identification such as birth certificate or passport, with the exception of visitors who have either a Washington or Minnesota Enhanced Driver's License. Enhanced Driver's Licenses will be accepted as a sole form of identification.
  2.  Show current proof of insurance and vehicle registration (Rental agreement if rented vehicle)

Directions
1. From Bloomington, take I-69 south.
2. Follow I-69 for 26.9 miles to exit 87 at US-231.
3. Take US-231 south to Highway 558. Turn left onto Highway 558.
4. Follow Highway 558 to the Visitors Center on the left.
5. After the Visitors Center follow Highway 558 to the Crane Gate and follow map on next page.
The GPS Address for the Visitor Center is 102 Furlong Street, Crane, IN 47522.



 


May 20

Webinar: Successful X-Ray & Optical Inspection in a Tin/Lead or Lead-Free Process  +



Bob WillisMonday 20th May @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Area Array Technology is part of mainstream electronics but until recently very few good inspection criteria were available in the industry. The assembly process for BGAs is fairly well understood for Tin/Lead alloys but with the move to Lead-free assembly, new QFN and LGA packages have critical issues to consider during inspection. The webinar covers optical and x-ray inspection of solder joints for both Tin/Lead and Lead-free terminations. It includes an introduction to the Lead-free assembly process with specific attention to BGA and area array devices. It provides a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces.

 

Topics include:

  • Procedures for inspection joints optically and by x-ray
  • Inspection criteria for joints
  • Identification of key joint features
  • Other indicators of possible failures
  • Common BGA & bottom mounted failures

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


May 21

Massachusetts (Boston) Chapter: Understanding the requirements of IPC-J-STD-001  +

Location
Radisson Hotel Nashua - 11 Tara Boulevard, Nashua, NH 03062



Understanding the requirements of IPC-J-STD 001 Requirements for Soldered Electrical and Electronic Assemblies click here to download slides 
Abstract:  The presentation will cover many elements of the J-STD-001 document which are problematic in the understanding of the criteria. 
For example here are a few of the most misunderstood elements of the document:
  • Understanding the definition of the requirements, especially for the differentiation of the various criteria of acceptable, process indicators, no requirements, and defective conditions.
  • Conflict resolution. As is written it is very difficult to interpret the results of an inspection if the contract states, that the product will be built and inspected to the requirements of J-STD-001. This document is a soldering document.
  • Interpretation of the differences between, conductor and wire diameter as this was a difficult concept to understand my many in the industry.
  • Review the meaning of Objective Evidence and this is a problematic area to substantiate a point and criteria.
  • In the materials section, the need to qualify the materials being used or face rejection of the product as it was not build with qualified materials.
  • The conversion to lead-free solders and other alloys and the due diligence to qualify those materials.
  • Thermal profiles and the need of such.
  • The solder connection.
  • The definition of soldering a wire to a terminal and the new explanation of the visuals.
  • Lead Trimming and the impact of cutting leads after soldering.
  • The physical soldering requirements.
  • The term discernible and what it means.
  • Component with no class 3 requirements
  • Section 8 cleaning section being re-written
 
 Speaker:  Leo Lambert – Vice President, Technical Director, Consultant – EPTAC Corporation
 Bio:  
•    B.S.M.E. Lowell Technological Institute, now University of Massachusetts, Lowell
•    Vice President/Technical Director for EPTAC Corp. Manchester, New Hampshire
 
 Publications:
        *    Text “Soldering for Electronic Assemblies”, published by Marcel Dekker 1987
        *    Published and presented numerous papers relative to the subject of Soldering and Cleaning at various Technical Seminars and Exhibitions worldwide.
        *    Edited books on soldering for Van Nonstrand Publishers, and Society of Metals,
        *    Former member of the Editorial Review board for Circuit Assembly Magazine 
        *    Develop, published and conducted seminars Deadline to Lead Free Seminars and Thriving in a RoHS/WEEE Environment.
 
Awards:
        *    IPC President Award 1989, for work conducted on solderable coatings for printed wiring boards. 
        *    TAEC chair 2008-2010
        *    IPC Hall of Fame 2019
        *    Charter member of the J-STD-001 and 610 committees
        *    Active participant in following IPC committees. 
        *    J-STD-001 and Handbook
        *    IPC-A-610 and 820 Handbook
        *    IPC-A-600
        *    IPC-6012
        *    IPC/WHMA –A-620
        *    Develop and wrote first IPC-A-600 training program
        *    Recipients of many Distinguished Committee Service Awards and Leadership Awards and Special Recognition Awards for the development of training programs
 
Other Activities:
        *    Charter Member on UNEP (United Nation Environmental Program) Technical Solvent Options Committee, overseeing worldwide activities in reducing CFC from use as cleaning material in Electronic Manufacturing. Part of Montreal Protocol
        *    Member of ICOLP (Industry Cooperative for Ozone Layer Protection)
        *    Past IPC Chairman of many committees relating to soldering and cleaning.
        *    Conducted many soldering seminars worldwide.
        *    Member of Mechanical Engineering advisory board, University of Massachusetts, Lowell MA.
        *    Member of Advisory Board for Greater Lowell Vocational School

 
“Rework and Assembly Processes for IPC-A-610 & J-STD-001” 
Abstract:  Hand soldering in the electronics industry is increasingly considered a reliability risk in electronics manufacturing.  Control over pc assembly with new software systems in placement, reflow and automated inspections has given engineering better control and traceability, improving yields and reliability.  These improvements have made the difference between automated assembly and hand soldering more apparent.   Some OEM manufactures have eliminated hand soldering by disposal of nonconforming product.  This is not practical when the pc assemblies have a high value.  
In companies with expensive assemblies there is a need to extend the control to the bench assembly.  JBC Tools has developed new software systems that work in conjunction with the soldering equipment for improving controls and providing traceability. IPC J-STD 610 sets standards for soldering that can be used as a basis for setting processes for rework and assembly. This standard can be used in the JBC QST software system; we will explain how this software can be used in the J-STD. The presentation will provide the audience with a demonstration on how the system works and give examples of how it was implemented.
 

Speaker:   Sean Torrens, US Sales Manager, Business and Engineering in LaSalle School in Barcelona & Manhattan College in New York. Sean has successfully implemented the QST system in class 3 companies all over the US; upgrading their control and traceability process for hand soldering.


Meeting Photos:
      

Sponsor for this event:


For more information visit: https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=22
 
Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598
Vice President : Peter Bigelow (IMI Inc.)
Phone: 978-373-9190

 
Future Events:
SMTA - Tuesday Oct. 8, 2019 - 4th New England Expo at the Boxboro Regency Hotel & Conference Center, Boxborough, MA

 


May 21

Medical Electronics Sponsorship and Table Top Exhibit  +

Cleveland, OH


Exhibitors

 

Sponsorship Information

Sponsoring this event will provide a valuable opportunity to promote your company brand and product/service message to attendees, while supporting your business development and positioning goals. For benefits and pricing click on the link below. For more information contact SMTA, medical@smta.org or call 952-920-7682.

View Sponsorship Benefits

 

Advertising Opportunities

Include your ad in our show directory to get more exposure for your company. Full page and half page ad space is available, black and white only. The deadline to submit your ad is April 15, 2019. *If you wish to pay through our secure server please use the "Register to Sponsor or Exhibit" button above. For a printable application form, click here.

 

Exhibiting Information

The conference will include an exhibition area featuring 25+ tabletop displays that will be open during conference breaks plus after hours.

Exhibit benefits:

  • 1 admission to symposium
  • 6 ft. Draped table
  • Two chairs
  • Attendee list
  • Company sign
  • Breakfast, Lunch & Breaks
  • Copy of the electronic conference proceedings

 

Exhibit Pricing:
Member: $550
Non-member: $650


Exhibit Hours:
May 21: 9:00am – 5:00pm


Please note that exhibit traffic will be minimal while symposium is in session. Please e-mail SMTA at medical@smta.org or +1-952-920-7682 for sponsorship or exhibitor information.



Attendees

 

Exhibit Hall Hours:

May 21: 10:00am – 5:00pm
To Register for the technical conference, click here.


May 21 - 22

Medical Electronics Symposium  +

Location
The Tudor Arms Hotel Cleveland
Cleveland , OH 44106


This year's technical program was absolutely outstanding and our exhibiting companies saw a considerable amount of face to face interaction with our expo and conference attendees! 

Sincere appreciation to our hard working technical committee for bringing together these spectacular presentations!

Crystal Ballroom


May 28 - 30

Mexico-Guadalajara Chapter: Programa de Certificación SMTA - SMTA Program Certification  +

Location
Hotel RIU, Guadalajara.



The most respected sign of approval in the electronics assembly industry 

Each SMTA Certification program is a three-day offering consisting of a 1.5-day workshop on topics in SMT Processes or Lean Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination (SMT Processes) and open book examination (Lean Six Sigma Green Belt.)

This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Lean Six Sigma Green Belt.


Why You Should Participate

Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Lean Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience

The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level. The title earned by Certified SMT Process Engineers is CSMTPE or Lean Six Sigma Green Belt Engineer for Six Sigma.


​​​​​Duracion: Del 28 al 30 de Mayo, 2019.
Lenguaje: Ingles/Español 
Examen: Ingles 
Instructores: Jim Hall, ITM Consulting e Ivan Castellanos, Indium Corporation  





May 30

Upper Midwest (Minnesota, Iowa & Dakotas) Chapter: May 30th: SMTA Upper Midwest Chapter presents “What Worked Yesterday Won’t Work Tomorrow” At John Deere Electronic Solutions – Fargo, ND  +

Location
John Deere Electronic Solutions, Fargo, ND




Upper Mid-west Chapter is hosting a “You Drive, We Buy” event for the following topic:

“What Worked Yesterday Won’t Work Tomorrow”
Speaker: James A. Springer – Manager, Quality, Product Environmental and Safety Compliance – John Deere Electronic Solutions
 
Presentation Overview: 
Join many of your colleagues to hear tales from yesterday that worked, some that didn’t and some of the big changes over the years in technology and why what worked then won’t work now, or will it. From wave solder machines with foam fluxers, bottom only preheat into thin air and a wave that kind-a rolled as the assembled board pushed through the molten solder to wave solder machines where every parameter is controlled to very tight tolerances, the process has advanced but the principles remain the same. Many Engineers have overcome new manufacturing needs with various on the fly DOE’s, trial and error efforts, and other tricks to do new things. That may have worked in the past but will not today. The need for process control, Gage R&R’s and use of six sigma tools have never been more important. Join us for some history, present day knowledge and one leader’s opinion of where the future may go and why he believes the best days of technology are still to come. 
 
Date:     Thursday, May 30th, 2019
Cost:      FREE for Members / $20 Non-members (make checks payable to SMTA)
                        (Also FREE for non-members who become a Member at the Event!!)
 
Time/Agenda:
  • 11:30 AM to 12:00 PM - Registration
  • 12:00 PM to 12:30 PM – Lunch
  • 12:30 PM to 1:30 PM – Presentation
  • 1:30 PM to 3:30 PM – Q&A / Tour
 
Lunch will be provided by the SMTA Upper Midwest Chapter.
 
RSVP by May 27th to guarantee a spot for this session.
 
Address/Directions to John Deere Electronic Solutions:
John Deere Electronic Solutions
1441 44th St. NW
Fargo, ND 58102


James Springer Biography: 
 
Manager, Quality, Product Environmental and Safety Compliance
John Deere Electronic Solutions 
 
Education: 
1979 – Electronics Technology, Hesston Jr. College
1980 – General Studies, Goshen College
1986 – Computer Programming and Operations, Control Data Institute
 
Career Highlights:
2010   John Deere Electronic Solutions
           Manager, Quality, Product Environmental and Safety Compliance
2006   John Deere Electronic Solutions
           Quality Assurance Manager
2002   John Deere Electronic Solutions
           Manager, Advanced Technology
1999   Phoenix International - Springfield
           Operations Manager
1999   Phoenix International - Springfield
           Manager Advanced Technology
1999   Phoenix International
           Manager Manufacturing Engineering
            
Career Highlights:
           Installing first automated SMT line in Kansas City area - 1985
           Innovation Award Nomination and Patent for Heatsink Attachment to PCB
           Starting the MS-Lab – 2002




May 30

Silicon Valley (San Jose) Chapter: SMTA Silicon Valley Chapter Meeting May 30th  +

COMET GROUP LAB ONE 3055 Orchard Drive., Suite 150, San Jose, CA 95134






https://www.smta.org/chapters/files/Silicon-Valley-Logo.jpg
cordially invites you to attend:
 
 TECHNICAL PRESENTATION MEETING HELD AT
COMET GROUP LAB ONE 
Theme:  5G ASSEMBLY PROCESSES
 
 
IMPORTANT INFO:
 
Date:  Thursday, May 30, 2019
Time:  Sign In/Registration:  2:15pm-3:00pm
Presentations:   3:00pm – 6:00pm
Location:  Comet Group Lab One
3055 Orchard Dr., Suite 150, San Jose, CA 95134
(Light refreshments to be served during breaks and registration.)
Note: Topic 4 has been added

SMTA Members: Free; Non-Members: $20
(By cash or check payable to ‘SMTA Silicon Valley Chapter’ at the door)


SMTA Membership 
(Individual: $95 per year, Membership sign up at www.smta.org)

CLICK HERE TO REGISTER TODAY!
https://www.smta.org/chapters/rsvp.cfm?bee_id=4690


https://www.smta.org/news/smta_calendar/calendar.cfm?YEAR=2018&MONTH=11 
 
 
Topic 1
Two Materials, One Board: High Frequency Hybrid Constructions

Speaker:  Jonathan Weldon – Principal Investigator, Du Pont Electronics and Imaging
 

 

Abstract: The ever-increasing demand for higher data rates and higher operating frequencies in traditional applications has pushed PCB materials to their performance limit.  Additionally, introduction of advanced technologies such as phased array antennas or millimeter wave radars into the consumer market has created a plethora of similar performance, cost, and supply chain challenges.  Technical concerns such as high latency (high dielectric constant), skew (glass reinforcement), and high insertion loss (high loss tangent and copper roughness) are just some of the issues that must be overcome when designing with traditional laminates.  Solving these problems often requires either high cost materials, yield losses in manufacturing, or a complete redesign of the high frequency PCB section; all of which is highly undesirable in a cost sensitive application.  The question at hand then, is not just how do we solve these problems, but how do we solve these problems without breaking the bank or designing something not manufacturable?  To that end, this topic will discuss design concepts and material choices for hybrid PCB constructions that will not only satisfy performance requirements but also help minimize cost through deliberate combination of both high performance and commodity grade materials.
 
Biography:  Jonathan Weldon is a Principal Investigator in DuPont’s Electronics and Imaging business.  In this role, he focuses on the characterization of high frequency materials along with the design of RF systems and interconnects.  Jonathan received his B.S. in Electrical Engineering from Texas Christian University and his M.S. in Electrical Engineering from Wright State University. He has more than a decade of experience in the development of radio frequency (RF) systems for defense applications through his time as an officer in the United States Air Force and an engineer at Sandia National Laboratories.
 

 
Topic 2
Materials and Techniques for Soldering in 5G Architecture 

Speaker: Seth Homer – Indium
 

 
Abstract:- This presentation discusses key soldering material selections as well as techniques that are critical to the performance and reliability of 5G architecture. Topics to be discussed include paste and preform selections and a hybrid solution for QFN voiding.
 
 
 

Biography:  Seth Homer has worked with Indium Corporation for more than 25 years, serving in both manufacturing operations and marketing roles. He is responsible for many of the products within the engineered solders product offering especially as it relates to RF Infrastructure and Power Electronics industries. He travels to customer sites globally to gain industry insight and works closely with Indium Corporation’s manufacturing teams to help support current production demand and future product development.
 
Topic 3
5G - Tackling some real life problems
 Speaker: Eran Dor – CEO of CRadar.Ai
 
 

 
Abstract: The 5th generation of cellular communications holds countless promises that many people are looking forward to. However, once the hype fades away and the dust settles, it will be time to deliver on these promises and scrutinize the tradeoffs. This talk will examine the pro's and con's associated with the different frequency bands in terms of RF performance, the risks and benefits of drastically increasing the amount of 5G base stations / small cells as well as examining how PCB manufacturing and SMT assembly may influence RF performance.
 
Biography:  Entrepreneur, wireless enthusiast, mentor and tirelessly curious synergy creator, Eran Dor has spent more than 20 years driving innovation in various wireless industry verticals and is currently the CEO of CRadar.Ai, revolutionizing how Radars see the world. In addition, Eran serves on advisory boards of other startups. Eran previously led large scale complex multi-radio designs for Wi-Fi/IoT networks, Point-to-Point radio links and Satellite payloads valued at over $1B. Eran also studies and practices leadership and mentoring skills with the goal of bringing out the best in people and teams.

 
Topic 4
5G Challenges for Inspection Systems
 Speaker: Keith Bryant Chairman SMTA Europe
 
Abstract: TBA
Biography:
  
Keith Bryant Bio, May 2019
 
A fully qualified engineer, Keith has over thirty years’ experience in Electronics Manufacturing.  He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews.
 
He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years’ experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years.
 
Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.
from 2017 to 2019 he was Global Sales Director of the leading X-ray manufacturer. Recently reverting to a Consultancy role allowing him more freedom to pursue other projects, including i4.0.
 
He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.
 


 
 



June 4 - 6

Ontario Chapter: International Conference for Electronics Enabling Technologies (ICEET)  +

Location
ventureLAB which is located inside of the IBM Markham Convergence Centre.



I would like to personally invite you to the upcoming International Conference for Electronics Enabling Technologies (ICEET) taking place on June 4-6 in Markham, Ontario.
We have a new location this year!  The conference will be held at ventureLAB which is located inside of the IBM Markham Convergence Centre.  
 
This conference will host multiple learning and networking opportunities at one event, all for one price!
The speaker lineup includes experts from many highly-notable companies, such as: Collins Aerospace, Celestica, ON Semi, Indium Corporation, among others.
This year, Professional Development Courses are INCLUDED with your registration that will be held by industry professionals from: MuAnalysis Inc., Celestica, and Plexus Corp.
You will also have the opportunity to visit the expo, network with industry colleagues, and enjoy FREE lunch!
View the exhibitor list.
 
To gain more information on the event and promote it on your own channels, please see the attached postcard.
REGISTER TODAY!
I would greatly appreciate your support and attendance at the event and hope to see you there!
 



June 4

FREE Webinar: Improving Reliability of Assemblies from a Soldering Materials Development Standpoint  +

Organized by SMTA India - Bangalore Chapter

Location
Bangalore India


Tuesday 4th June @ 9:30am India Time GMT+5:30 (12:00am US Eastern Daylight Time GMT -4)

Presenter: Shantanu Joshi, Koki Solder America Inc.

Free for members - only members will get access to recorded presentation!
Non-members: USD $10 

Members must log in to register with no fee. Non-members can pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: newprojs_ankan@yahoo.com +919620075752 or Madhukar Rao: +919686098690.

Overview

In recent years, a growing number of electronic devices are being incorporated into automotive and other high reliability end products with the challenge to make these devices more reliable. The package size of the devices is largely driven by the consumer industry with their sizes getting smaller making it harder to assemble and be reliable at the same time. For automotive and other high reliability electronics product, it is of the utmost priority to secure high reliability because it directly involves human life and safety. Challenges include selecting an appropriate solder alloy and having good reliability of the solder paste flux residue with the presentation discussing ways to improve lead-free solder joint reliability/robustness. Though SnAgCu solder alloys fulfill most soldering requirements, alternative solders are needed to meet more stringent environmental regulations, requirements for greater mechanical reliability, and more demanding high temperature service environments such as under the-hood in automobiles and in avionics systems. Development was done on alternative lead-free alloys with varying percentages of tin-silver-bismuth-indium in comparison with a number of conventional lead-free solder alloys in soldering evaluations. Accelerated thermal cycling test was performed on boards assembled with various different alternative alloys and the results were compared with conventional lead-free alloys. For the solder paste flux, there is a need in automotive and other high reliability applications to have reliable and high insulation resistance even in an atmosphere of high temperature and high humidity. Development was done on a type of ‘crack free' flux paste to inhibit flux residue cracking under extreme environments making it more reliable to stringent surface insulation resistance and electro-migration criterion from automotive and other high reliability product manufacturers. Testing was done to various industry electro-migration and dew test standards.

 

About the Presenter

Shantanu Joshi is the Regional Sales Manager for KOKI Solder America. He has a Master of Science degree in Industrial and Systems Engineering from Binghamton University and Bachelor of Engineering degree in Production Engineering from Pune University, India. He also serves as a Secretary on SMTA Ohio Valley Chapter board.

He is currently pursuing Ph.D. in Industrial and Systems Engineering concentrating on High Reliability Lead Free Solder Alloys from Binghamton University. He is published over dozen papers in various national and international conferences over the years. His co-authored paper won the “Best of Proceedings” award in SMTA International 2013. Shantanu has also won 1st prize in the poster competition held at GE Global Research Center, Niskayuna, NY for poster titled "LGA Solder Joints with Superior Reliability".

 


June 5

Long Island Chapter: Long Island SMTA Presents: The “DEADLY SINS” OF SMT ASSEMBLY Presented by Phil Zarrow  +

Location
Courtyard Long Island MacArthur Airport, 5000 Express Drive South - Ronkonkoma, NY 11779



Everyone has heard of the “7 Deadly Sins” that will, supposedly, lead one to Hell.  There are also the “Deadly Sins” of SMT - there are more than just 7 – and they can make your assembly process a “hell on earth”.
 
During the course of ITM’s assembly process audits and troubleshooting work, we tend to see trends in the types of errors and problems.  In other words, a lot of people are making the same mistakes.  The resulting process problems wreak havoc with an impact on assembly yields ranging from 5 to 20%.  In addition to this direct cost, there is also additional financial impact with regard to time spent reworking and repairing, the on corrective action by QC, Engineering and Management, and, of course, “do-over”.
 
This workshop identifies the “deadly sins” of SMT assembly, both for Pb-free and “leaded” processes.  Besides the symptoms and consequences of each type of error, root-cause, rectification and prevention techniques will be presented.  Best Practices will be discussed for each of the key process steps. The workshop will, thus, provide the participant with an understanding of how to identify and correct the most common SMT assembly problems.  It will include identification of vendor and source problems including components and materials as well as design related problems.
6/5/19 | Courtyard Long Island MacArthur Airport, 5000 Express Drive South - Ronkonkoma, NY 11779



June 6

Western Pennsylvania (Pittsburgh) Chapter: West Penn Technical Webinar Sessions  +

Web-Based Webinar



SMTA West Penn is pleased to announce a web-based series of two technical sessions!

Thursday June 6, 2019 - 2 sessions: 8:00AM to 10:00AM and 3:00PM to 5:00PM.  View either session or both, up to you!

Session 1 (8:00 AM to 10:00 AM) - Conformal coating selection, application & cure, testing coatings, inspecting coatings, and the future of coating technology.  Speaker is Doug Pauls, Collins Aerospace.
Session 2 (3:00 PM to 5:00 PM) - Moisture Sensitivity (MSL) overview, managing MSL devices,  conforming to J-STD-033, long and short duration exposure, double sided PCBA, baking and packaging.   Speaker is Greg Benoit, Cogiscan.   

This will be a live web-based event.  Registerants will recieve links to log in and view the presentation with ability to ask questions in real time.

No cost to SMTA members!   $20 for non-members.   RSVP at the link below.   View one or both sessions - up to you!  You will receive login information about a week before the sessions.  

Thanks!
Jason Emes, West Penn President


June 11

Ohio Valley Chapter: 4th Annual SMTA Member Appreciation Golf Outing  +

Location
Raintree Golf & Event Center, Uniontown, Ohio



The SMTA Ohio Valley Chapter is pleased to invite you to participate in our “4th Annual Member Appreciation Golf Outing”.  Golf format is a four person scramble with team prizes and skill awards.  Skins challenge $5.00 per player ($20.00 team).

Participation is absolutely “FREE” for SMTA Members and Sponsors.  Included are green fees, golf cart, practice range, sleeve of golf balls, Continental Breakfast, lunch at the turn and a Prime Rib dinner.

Winning team prizes, Skill Challenge prizes and Team Skins awards will follow dinner.

Hotel: Cambria Hotel & Suites in Uniontown, OH. 
Room cost is $109.00 a night for the night of June 10th.  For those wishing to stay an additional night , the price will be the same.  To make reservations, contact Cambria Hotel at the number below and mention Ohio Valley SMTA Chapter. 
Hotel information:
Cambria Hotel & Suites
1787 Thorne Drive
Uniontown, OH  44685
330-899-1990

Enjoy networking with fellow SMTA members and vendors in a relaxing, fun atmosphere.
 
“Bring a guest.”  Guest golfer - not a SMTA Member: $50.00

Not a golfer, no problem. Join us for the day, enjoy riding around the course visiting with the golfers and dinner afterwards.

 
You may organize your own four-some or we will pair you up.  When registering please use the company field
(after listing your company) to enter the names of players you wish to play with.

 


June 13

Atlanta Chapter: ********POSTPONED**********Chapter Meeting********POSTPONED**********  +

ASM 3975 Lakefield Ct suite 106, Suwanee, GA 30024



*************PLEASE NOTE THIS MEETING HAS BEEN POSTPONED***************
Leading Successful Change

Organizations today must have targeted strategies for leading change both within their company as well as in their marketplace. There is no place for merely throwing out ideas and seeing what sticks.
Leadership must practice more than wishful thinking and dreaming. They must have more than a vision and direction. Leading successful change requires a strategy driven by a clear understanding of the current reality coupled with the resources to build for the future.
Leadership is tasked with making a difference from the inside-out. This requires a measured, proven methodology. Strategies for leading and communicating successful change initiatives are the centerpiece of this presentation.
 
Presented By: Don R. Witzel
Don R. Witzel is an independent organization development coach with over 40 years’ experience. He has held key leadership positions in the public and private sectors on a nationwide basis with responsibilities for the development and performance improvement of people and organizations. Don has a Bachelor of Arts degree in Communications, a Master of Arts degree in Adult Education, and a Doctor of Education degree in Adult Learning. In addition to the above, Don has extensive experience in managing and leading large, dynamic organizations through complex change and growth.
Don received his Quality Management System training from Georgia Institute of Technology. Don has helped numerous companies or divisions obtain their QMS credentials during their first certification audit. Don also serves as an outsourced internal auditor for several organizations. In addition to the above training, Don received his training and certification as ISO Lead Auditor from Georgia Technical Institute as well as AS9100 Internal Auditor training and certification.
Some companies with which Don has coached and consulted are: BellSouth, Gwinnett County Public Schools, Gwinnett County Tax Commissioner, AMI Technologies, EMS Technologies, CIBA Vision, Lucent Technologies, Rooms To Go, Johnson & Johnson, Verizon Telecommunications, Volt Information Sciences, Marriott Hotel Properties and with work in many other industries.
 
 When: June 13, 2019
 Where:  ASM

3975 Lakefield Ct suite 106,
Suwanee, GA 30024

Sign in and networking - 4:30
Dinner - 5:00 - 5:45
SMTA business and update 5:45 - 6:00
Presentation - 6:00 - 7:00

RSVP HERE 



June 13

Mexico-Juarez Chapter: SMTA Juarez - Technical seminar  +

Location
Centro de Convenciones Cuatro Siglos






¡Anunciamos el próximo evento SMTA-Juarez!
 
Información importante:

Fecha: Jueves, Junio 13, 2019
Hora: 5:30-9:00 p.m.  
Ubicación: Centro de Convenciones Cuatro Siglos
Dirección: Boulevard Juan Pablo II (Blvd. Cuatro Siglos) y Av. Arizona. Ciudad Juárez 32402
Conferencias:
a) Inspeccion de Rayos X en 3D para BGA y QFN
        Paolino Dominguez, Omron Services
 b)  Head in Pillow y evitar voids en BGA y QFN
       Luis Garcia, Rehm Thermal Services

Agenda completa:
17:00   Apertura y Registro.
17:30   Bienvenida y primera rifa.
18:00   Presentacion comite SMTA.
18:10   Presentación del tema “3D X Ray inspection on BGA and QFN”
            Paolino Dominguez, Omron Services.
18:50   Rifa / Networking.
19:00   Presentación del tema “Head in Pillow and avoid voids in BGA and QFN”
            Luis Garcia, Rehm Thermal Systems.
19:50   Presentación de Premios por trayectoria en Industria SMT.
20:00   Cena / Networking.
21:00   Clausura del evento.


Más información:
smtajrz@gmail.com

 




June 14

Dallas Chapter: Vapor Phase Technology & Vacuum Soldering  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



Vapor Phase Technology & Vacuum Soldering

Speaker: JB Byers, Managing Member, Technical Services, A-Tek LLC

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on June 14, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!

Abstract

Voids in solder joints are largely a function of differential pressure between vapor pressure of the gases inside of the joint and environmental conditions.  By entering joints still in their liquid state into decompression chambers, voids can be eliminated.  Equipment has been developed to achieve void-free joints under these conditions utilizing modern condensation reflow technology.

Biography

JB Byers, Managing Member, Technical Services, A-Tek LLC


JB Byers is co-founder and managing partner of A-Tek Systems Group. He has more than 20 years experience
in SMT manufacturing and is well versed in vapor phase reflow technology.

 

JB graduated in 1991 from Colorado Aero Tech with a degree in aviation electronics.  He is the primary liaison between Asscon Systemtechnik-Elektronik GmbH, the vapor phase equipment manufacturer and innovative technology leader, and the customer. He is well respected by his peers for his process knowledge and his customer service aptitude.


 



June 17

University of Texas at Arlington Student Chapter Chapter: SMTA UT Arlington Student Chapter Speaker Event  +

Location
Nedderman Hall, Room 100, The University of Texas at Arlington; Address: 701 S Nedderman Dr, Arlington, TX 76019



Title: 3D Xray Techniques for Field Failure Analysis

Pricing:      FREE for all 
 

RSVP now,  request no later than 6/14/2019 to this link: https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4681

Please forward this invitation to others.

 

Speaker:
Steven Kummerl
Analog Packaging R&D & 
WW SMT Customer Support
Texas Instruments
Bio: Steven Kummerl received his B.S. degree in Mechanical Engineering from University of Texas El Paso. He is a member of technical staff at Texas Instruments supporting semiconductor packaging and has worked in the field of high volume/high mix surface mount assemblies and more recently at TI supporting sensor packaging R&D.  He holds over eighteen patents in the field of package design and has authored multiple publications focused in packaging design, SMT package assembly, & reliability.

Parking: Parking details will be sent after RSVP. 




June 17

Webinar: Lead-Free Selective Soldering, Design, Quality Control & Practical Defect Solutions  +


Bob WillisMonday 17th June @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

For many organisations through hole components will remain a reality for many years. More and more surface mount components are used in design, through hole is in decline, however the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products. So what is the most reliable and cost effective solution to through hole soldering in a lead-free environment? Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities with lead-free and high temperature solder alloys.

 

Topics include:

  • Why use selective soldering
  • PCB design rules for selective soldering
  • Flux requirements for selective soldering
  • Compatibility of solder masks and lead-free solder
  • Setting up lead-free profiles, you must profile a selective process!!!
  • Solder alloy choices
  • Copper dissolution with selective
  • Soldering defects on selective – Causes and Cures

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


June 18 - 20

SMT Processes Certification (Mequon, WI)  +

Location
Rockwell Automation
Mequon , WI 53092-4400


Hosted at Rockwell Automation

  • June 18- Course (8:30-5pm)
  • June 19- ½ day of course + exam
  • June 20- All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall


June 20

Houston Chapter: Houston Chapter Meeting  +

Magseis-Fairfield 1111 Gillingham Lane Sugarland, TX 77478



Presentation Schedule:
5:00        Welcome Attendees
5:20        Dinner
6:10        Tour SMT Room
6:30        SMT Technical Presentation, Q&A
7:20        Clean-up
7:45        Adjourn
 
 



June 20 - 21

eSMART Factory Conference  +

Location
The Dearborn Inn
Dearborn , MI 48124


Software Systems & Processes • Robotics • 3D Printing

eSMART Factory 2019 conference will bring together the key technologies shaping the electronics manufacturing industry and addressed by EMS companies, OEMs and Contract Manufacturers.

 


June 25

FREE Webinar: Practical Guidelines in Handling Moisture Sensitivity of SMT Packages  +


Tuesday 25th June @ 1:00pm-2:00pm US Eastern Time (10:00am-11:00am US Pacific Time)

Presenter: Mumtaz Bora, pSemi

Free for members - only members will get access to recorded presentation!
Non-members: USD $25 

Members must log in to register with no fee. Non-members can pay by credit card online by clicking the "Register Now" button above. 

Overview

Handling of moisture sensitive packages is an ongoing learning process in volume manufacturing. Improperly handled and stored MSDs can impact yields and reliability. The presentation will cover a review of the industry standards for MSDs ( J-STD-020, J-STD 033 and J-STD 075) and their applications in moisture control. PWBs used for assembly also require controlled storage and handling. Board surface finishes, storage and baking guidelines will be reviewed per the IPC 1601 standard.  Handling of MSDs from receipt to use at reflow  will be reviewed, including practical guidelines in labelling, tracking, packing and storage.

 

About the Presenter

Mumtaz Y. Bora has a B.S. in Chemistry and Material Sciences from University of Mumbai, India and University of Ottawa, Canada. She has a Master of Science in Interactive Telecommunications from University of Redlands, California. She has over 25 years of PWB, SMT assembly and advanced packaging development experience at IBM Endicott and IBM Austin, TX.  She has worked in new product development, and qualification of high volume handset assemblies at Qualcomm and Kyocera-Wireless Corporation.  She has worked with suppliers and subcontractors in several parts of Asia.  She is currently a Sr. Staff Packaging Engineer at pSemi for qualification of RFIC packages for wireless, broadband and Automotive applications. She is a member of IPC standardization committees and contributes to the standards development. She has 16 publications and 3 patents. She is the Past President of the SMTA San Diego chapter and Co-chair of the Moisture Sensitive Devices Council. She is currently on the Board for the IMAPS San Diego Chapter and Vice President of Communications at  SMTA San Diego chapter.


June 25 - 27

Symposium on Counterfeit Parts and Materials 2019  +

Location
College Park Marriott Hotel & Conference Center
College Park , MD


Thank you for attending the 2019 Symposium on Counterfeit Parts and Materials. 

Technical Symposium and Expo: June 25-26, 2019 
Workshops: June 27, 2019 

College Park Marriott Hotel & Conference Center
College Park, MD

Attendees at the 2019 Symposium on Counterfeit Parts and Materials

 

The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.

 

Counterfeit Symposium Panel Discussion

Dr. Michael Azarian, CALCE, speaks during the panel discussion 'How is AS6171 Being Flowed Down? Challenges with AS671 Accreditation--Can it Handle Obsolete Part?' at the 2018 Symposium.

 


 

Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

 


 

 


June 25 - 26

Symposium on Counterfeit Parts and Materials-Tabletop Exhibition  +

Location: College Park Marriott Hotel and Conference Center
3501 University Blvd East
Hyattsville, MD 20783



Exhibitors

Sponsorship Opportunities:

**All sponsorships require an exhibit booth reservation**
 

Lanyard Sponsorship (Limit 1) - $500 - Company to provide lanyards SOLD!
Provide your company lanyards and they will be the official lanyard for the conference. You will receive logo recognition in the show directory, conference website and signage.

Tote Bag Sponsorship (Limit 1) - $400 (if provided by company/$800 if produced by SMTA) SOLD!
Provide your logo on all of the conference attendee bags! If you would like SMTA to produce the tote bags, it will be an extra $400. There will also be recognition in the show directory and website.

Lunch Sponsorship Day 1 or Day 2 (Limit 2)-$750 SOLD!
Signage upon entrance to exhibit hall lunch and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

Refreshment Sponsorship Day 1 or Day 2 (Limit 2)-$750
Signage during PM refreshment breaks upon entrance to exhibit hall and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

 

Exhibitor Information:

Contact SMTA for available booth space. 952-920-7682 or counterfeit@smta.org Please note that exhibit traffic will be minimal while symposium is in session.



Exhibit space entitles you to:

  • 6 ft. Draped table
  • One conference pass
  • Attendee list
  • Breakfast, Lunch & Breaks
  • One copy of the conference proceedings


Download a hard copy of the registration form


Cost to exhibit:
Rates increase $100 after May 31, 2019

Booth type CALCE/SMTA Members Non-Members
One table
includes access to Electrical Outlet
$550 $650
One table
no access to Electrical Outlet
$500 $600


 

 



Attendees

Exhibit Attendees: 

Come and visit the exhibits for FREE! Plan to network with leading suppliers working to stop the proliferation of counterfeit parts in the electronics supply chain.

Show Hours Each Day: 10:00am - 3:00pm

Your expo pass gives you access to:

  • FREE Panel Discussion
  • FREE Lunch
  • FREE Refreshment Breaks


    If you would like to attend other conference sessions, please register for the conference here.

Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.


June 27

Upper Midwest (Minnesota, Iowa & Dakotas) Chapter: 2019 SMTA Upper Midwest Expo & Tech Forum  +

Location
DoubleTree by Hilton Minneapolis - Park Place Minneapolis, MN 55416



 
 
Upper Midwest 
Expo & Tech Forum
Your local electronics assembly and manufacturing trade show!
 
June 27th, 2019
DoubleTree by Hilton Minneapolis - Park Place
Minneapolis, MN 55416
 
 
 
 
Plan Now to Join us at the 
SMTA Upper Midwest Expo & Tech Forum!
 
- 3 Great Technical Presentations
- FREE Lunch
- Networking with Exhibitors
 
 
ALL FREE but you must RSVP to reserve your spot!
 
 
 
 
Technical Program & Schedule
8:00 am:
Registration Opens
9:00am:
Expo Opens
9:00am-10:00am:
Advanced Inspection and Automation Solutions for Today’s Smarter Factory
Speaker: Brad Ward, Omron
11:00am-12:00pm:
How to Buy PCBs Better & Smarter
Speaker: Greg Papandrew, Better Board Buyer
12:00pm:
Complimentary Lunch
1:30pm-2:30pm:
Impact of Storage Conditions on the Integrity of a No Clean Solder Paste
Speaker: Dave Sbiroli, Indium Corp
2:30pm:
Awards, Door Prize Drawing, & Announcements
3:00pm:
Expo Closes
 
 
 

Any Questions?
Please contact 
Hannah Terhark
SMTA Expo Manager
952-920-7682
 
We Look Forward to 
Seeing you in June!
 
 
The SMTA Upper Midwest Chapter
 
 



June 27

Connecticut Chapter: GreenSource PCB Fabrication Tour (Lunch Included)  +

99 Ceda Rd., Charlestown NH 03603



This event is canceled due to unforeseen circumstances at GreenSource Fabrications.  We apologize for the inconvenience. 

Please join us at our next event at a local brewery – details to come soon! The SMTA-CT chapter would like to offer you a free drink ticket for this inconvenience when you register for our next event.
We look forward to seeing you soon!
 

SMTA-CT Chapter is pleased to facilitate a light luncheon followed by a tour of GreenSource Fabrication LLC located in Charlestown, NH.  The facility tour will cover all the processes involved in PCB production from panel lay-up to depanel and testing.  We are limited to 40 attendees only, and we expect to max out quickly – so please RSVP your place today!! The Connecticut Chapter Officers are pleased to offer bus transportation for our Connecticut attendees.  Additional details below.
 
Green Source PCB Fabrication Tour (lunch included)
Thursday, June 27th
11:45 – 2:30 pm
GreenSource Fabrication LLC
Charlestown, NH
**** This event is limited to a maximum of 40 attendees only!! ****
 
It was previously thought that labor costs, environmental regulations, and access to the best-in-class technologies prohibit US companies from competing on the world stage for PCB manufacturing.  GreenSource changes everything!

Climate change is undeniable which is why GreenSource Fabrication LLC is committed to limiting their impact on the environment.   GreenSource was born from the world’s leading Emergency Warning Manufacturer and is at the forefront of the most advanced PCB manufacturing innovations:
  • The first and only “green” fabricator of PCBs
  • First of its kind chemical recycling program
  • Results in no wastewater discharge, toxic air emissions, or hazardous waste
GreenSource is the most advanced fabrication facility in North America with zero discharge effluent requiring no state permits.   Sustainability is a component of every part of their business and responsibility at the core of everything they do! 
GreenSource capability firsts:
  • High-end production-grade quality to do short runs
  • The fastest cycle time capability in the industry for complex HDI, SI and Flex/Rigid-Flex products
For more information about GreenSource, please visit their website at https://greensourcefab.com/
 
BUS TRANSPORT AVAILABLE!!   For our Connecticut based attendees, we’re excited to offer the convenience of bus transportation to/from the event.   As part of our investment in your continuing education and participation, the Connecticut Chapter is bearing a significant portion of the costs for securing a 30-person bus for this event, requiring only a modest co-pay of $15 per person (cheaper than gas and tolls).  So why not leave the car at home, and enjoy a little friendly conversation with some of the other attendees!!   
 
                Bus departure:  9:30 am (please be sure to get there early, as the bus is leaving at 9:30)
                Bus location:   Park & Ride at Rt 159 Windsor Ave. at Corey St. in Windsor (across from Wilson Pizza Palace 340 Windsor Ave.)
                Bus arrival:  approx 11:30 am (traffic dependent)
 
EVENT AGENDA
Arrival / Registration:     11:30-11:45 am
Lunch:   11:45 – 12:15 pm
Tour:     12:30 – 1:30 pm
Q&A / Recognitions:  1:30 – 2:30 pm
Adjourn: 2:30 pm
 
                 Bus Departs:  2:30 pm
                 Bus Arrival:  approx 4:30 (traffic dependent)
 
When:  June 27, 2019
Where:  GreenSource Fabrication LLC, 99 Ceda Rd., Charlestown NH  03603
Cost:    No-Bus Option:  $25 SMTA Members / $35 Non-Members
             Bus Option:  $40 SMTA Members / $50 Non-Members
NOTE:  GreenSource Fabrication LLC is an ITAR Registered facility.  The facility tour is only available to US Citizens (passport or other evidence of Citizenship required).

SPACE IS LIMITED SO PLEASE RSVP TODAY!! RSVP Link: smta.org/chapters/rsvp.cfm?BEE_ID=4736
 
For more information, please contact the undersigned.
Jenny Hopewell, VP Communications
Email:  Hopewell@hopewellcompanies.com 

 
 


July 10

San Diego Chapter: SMTA San Diego Chapter Meeting  +

Location
Creative Electron, 201 Trade St., San Marcos, CA 92078



Topic:  Industry 4.0 the Next Industrial Revolution - The Smart Factory
Speaker:  MB Allen, KIC

Industry 4.0, IIoT, IoT, Smart Factory, Made in China 2025. It’s all the buzz but what are these trends?
Do they relate to me and my manufacturing environment? Is this something we Must implement? What would the benefit be to my company? How does it all come together?
These questions and more will be covered during this presentation and will include an example of ‘Smart Factory’ technology.

MB Allen Bio -
MB Allen is a Manager for KIC’s Applications & Sales in the Americas and Europe.  Formerly as Product Manager she coordinated the advancement of new products and features to accommodate customer needs as KIC added to its portfolio for the electronics industry. Her technical expertise, relationships with valued partners and customers, and many years of sales experience aid KIC in the future development, improvement and sales of the company's product offerings.
MB has worked in the electronics industry for 31 years and been associated with KIC for 30 years with both national and international positions.

Registration:  4:45 PM   
Social/Dinner:  5:00 PM
Technical Session:  5:30 PM


We're trying somethign new!
This meeting will be streamed live online. Register for the virtual meeting here.


 


July 15

Webinar: Vapour Phase & Convection Reflow with Lead Free – Selecting the Reflow Process  +


Bob WillisMonday 15th July @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Having grown up with IR and Vapour Phase Soldering (VPS) during the introduction of surface mount technology it's safe to say that some processes never die, they just get better. Convection reflow took over from IR technology and changed the way industry looked at vapour phase but now it's back. For some companies VPS never went away, a simple one profile process. In Japan, high-end application used VPS during the introduction of lead-free technology.

Both convection and vapour phase can produce reliable lead-free assemblies, there are advantages and disadvantages to any technology, but they both work well and can be very cost effective, that is what our surveys have said. We also bring ten years of experience with lead-free using both techniques.

In this webinar the instructor will look at all aspects of the different processes, soldering performance and yield from different joint terminations, solder finishes and joint structures. Each delegate will also receive a FREE set of Bob Willis Inspection Wall Charts covering reflow soldering of lead-free terminations and common defects found in manufacture.

 

Topics include:

  • Vapour phase and convection reflow overview
  • Process parameters
  • Nitrogen/inert environment myths
  • Advantages & disadvantages of the process options
  • Design and layout considerations for VP
  • PCB solder finishes for VP & convection
  • Vapour phase materials and cost
  • Batch or inline operation
  • User experiences with VP materials and equipment
  • Profiling boards assemblies in both processes
  • Solder paste requirements
  • Comparing single and double sided reflow yields
  • Soldering flexible assemblies
  • Inspection results for reflow soldering

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


July 17

Space Coast (Melbourne FL) Chapter: Moisture Sensitivity Considerations in Surface Mount Processing  +

Mack Technologies



"July 17, 2019 SMTA Space Coast Chapter Technical Meeting
View this email in your browser
 
 
SMTA Space Coast Chapter
Is proud to present a Technical Meeting

"Moisture Sensitivity Considerations in Surface Mount Processing"
 
 
As electronics packaging rapidly advances, novel device packaging and materials are being introduced at unprecedented rates.  Thus, more than ever before mitigation of the risks associated with “moisture sensitivity”, the potential for damage to components, printed circuit cards, and circuit card assemblies due to trapped moisture during solder reflow operations, must be integral to any robust surface mount assembly process.  Guidance for these practices for handling, storage and drying are provided in various industry specifications, but adapting these to the surface mount assembly process are not trivial.  This tech session will review the factors affecting material sensitivity in electronics packaging, highlight the most essential best practices for managing moisture sensitive components, and present a case study involving the investigation of a surprising source of moisture-related failures.
 
The Presenter:

Jeffrey M. Jennings, PhD
Materials & Processes Laboratory, Harris Corporation
 
 
 
 
 
 
Come join us July 17, 2019 at 11:00am at

(321) 725-6993
7505 Technology Drive
Melbourne, FL 32904

Mack Technologies
 
Lunch is included in the admission price.

BEST DEAL PRICING
Members in Advance: $15 • Non-Members in Advance: $25
AT THE DOOR PRICING
Members: $20 • Non-Members: $30

Registration fee will be waived if you join SMTA during this event.
Click Here to Join!!!
 
                                        SCHEDULE

                  TIME:             11:30AM                     LUNCH
                                          12-1:00PM                  Presentation           
                                             
For options of payment, please read the section below for details.
 
RSVP to Jack Reinke or call (404) 290-6744



July 18

Tampa Bay Chapter: SMTA Tampa Bay Chapter Meeting- July18th  +

Location
Jabil Circuit 10560 MLK Blvd St. Petersburg, FL 33716



Save the date for our next chapter meeting on July 18th, 2019.

Our speaker will be Gregory K. Arslanian,
Global Segment Manager, Electronics Packaging, Assembly and Test (EPAT).
Gregory will be presenting on the “Benefits of Inert Atmospheres for Electronics Assemblies”.


Our chapter meeting will be held at:
Jabil Circuit 10560 MLK Blvd St. Ptersburg, FL 33716
Thursday, July 18, 2019
5:30- Registration/ Meet and Greet
5:30 Dinner
5:45- Introduction of speaker
5:50-6:30 Topic Presentation

6:30- 6:45 Question and Answer Time

Cost of Meeting:
Members-$15.00
Non-Members- $20.00

We hope to see everyone at the meeting!



 



July 25

Rocky Mountain (Colorado) Chapter: Summer Technical Session 2019  +

Location
1811 Pike Rd # 2F, Longmont, CO 80501



So, you have to clean your board?

Join us on July 25, 2019 from 9:00 AM-3:00 PM for the Rocky Mountain Chapter's 2019 Summer Technical Meeting.  The meeting will revolve around PCBA Cleaning.  How do you do it well?  Which chemistries work best?  How do you tell if a product is clean enough?  These questions and more will be answered by our three expert presenters.

9:30 AM – 10:30 AM - J-STD001G Amendment 1 is now active. What's New? What Stays the Same?
Presenter: Mike Konrad - President of Aqueous Technologies
Cleanliness quantification requirements have largely remained the same for over forty years. The historical pass/fail limits assigned to circuit assemblies have long been incompatible with long-term reliability.
IPC has recently released an amendment to J-STD001-G which dramatically changes the cleanliness testing requirements for post-reflow circuit assemblies. Gone are the historical pass/fail limits. The new cleanliness testing requirements require ionic process monitoring backed by an objective evidence standard.
This presentation will outline the reasons behind the new cleanliness testing standard by presenting modern residue-related failure mechanisms and the environmental and physical factors which may influence an assembly’s residue tolerance. This presentation will also outline the major elements of the new cleanliness testing standard and how it affects everyday production. This presentation will reference J-STD001-G, Amendment 1 and IPC-WP-019A.
 
About Mike:
Mike Konrad is an industry expert on the removal of contamination from circuit assemblies. Mike has been part of the electronic assembly cleaning industry for the past 33 years. Mike has designed several automated cleaning and cleanliness testing machines, has published scores of technical articles on the subject of cleaning and cleanliness assessment has been a member of Editorial Boards for several industry publications.
Mike served on the US Navy’s EMPF manufacturer’s committee and is a featured speaker at industry events and technical workshops worldwide. Mike was honored with Distinguished Speaker status from the SMTA in 2017.
Mike has served as a court-approved Expert Witness in civil litigation matters concerning post-reflow cleanliness assessment and contamination-related failure mechanisms. Mike is the founder of Aqueous Technologies; a manufacturer of automated cleaning and cleanliness testing systems designed for the electronic assembly industry and has served as its CEO/CTO since 1992.
Mike is the host of the Reliability Matters podcast, available on iTunes, Spotify, and iHeart Radio.
 
11:00 AM – 12:00 AM – Cleaning Process Do's and Don’ts.  Avoiding common pitfalls...
Presenter: Debbie Carboni - Global Product Line Manager (Electronics), KYZEN Corporation
The standard cleaning approach and technology continues to evolve to meet the changes of in market.  The last 10 years has brought new challenges and improved practices.    What once was common may not be enough to meet the new standards, or new form factors.   Mastering the capabilities of your cleaning process is critical to establishing complete process stability.  
Cleaning expert Debbie Carboni will present:
  • Modern Cleaning and Equipment
  • Board Design Considerations
  • Overcoming Environmental Challenges
  • Common machine set up blunders
  • Common Process Control blunders.
  • Common board fixturing blunders
  • Is your rinse effective enough?
  • How to effectively clean to meet the new standards, be reliable and prove it.
Attendees will see:
  • Videos illustrating different nozzle configurations and pressures and their impact on the cleaning rate.
  • New test assemblies for qualifying, optimizing and monitoring cleanliness
  • Passed and Failed test coupons 
An open Question and Answer session will enable attendees to discuss their specific process needs and changes to successfully implement or maintain a robust cleaning process.
About Debbie:
Debbie Carboni’s involvement in the electronics industry started more than 20 years ago and has encompassed a diverse set of experiences that give her a deep knowledge of cleaning chemistry, equipment and processes. Having been with KYZEN for over 10 years, Debbie is dedicated to providing customers and partners with the highest quality customer support and service as well as ensuring that they receive the best technical solutions. Her extensive real-world experience helps guide engineers during qualification to ensure success in production conditions. Debbie’s dedication to the electronics industry has included a number of roles and voluntary positions in many of the industry’s leading associations. She is currently serving her second term on the SMTA Board of Directors as the Vice President of Expo. After attending Northern Arizona University, Debbie remains knowledgeable through numerous technical conferences and leading-edge research. Debbie has authored and coauthored several papers related to cleaning solutions and regularly presents at and attends industry events such as; SMTA International, Cleaning and Coating Symposium, ICSR, Apex. Always willing to share, Debbie is an excellent resource with lots of experience and passion.
 
1:00 PM – 2:00 PM - pH Neutral & Alkaline Cleaning Agents – Market Expectation & Field Performance
Presenter: Kalyan Nukala, M.S.Ch.E. - Application Engineer, ZESTRON Americas
In recent years, significant changes in solder paste formulations and assembly processes have occurred. Post reflow residues are now more difficult to remove.  While modern aqueous alkaline cleaning agents effectively remove these flux residues, achieving satisfactory results often requires an increase in temperature, exposure time, chemical concentration, and mechanical energy. Are pH Neutral cleaning agents a solution?
This presentation details cleanliness test results of a two-phase DOE comparing pH Neutral and Alkaline cleaning agents. In Phase 1, the material compatibility effect of the cleaning agents was assessed for exposure under the worst-case scenarios with particularly sensitive materials. In Phase 2, cleanliness performance of each cleaning agent was assessed utilizing industry standard and IPC-B-52 tests vehicles populated with numerous low standoff components that have been soldered with commonly used leaded and lead-free solder pastes.  A customer case study is also presented.
 
About Kalyan:
Kalyan Nukala, M.S.Ch.E., is an Application Engineer at ZESTRON Americas, the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry.
Mr. Nukala is an active member of the SMTA as well as the IPC and has presented the findings of ZESTRON’s research papers at numerous industry events.
Furthermore, Mr. Nukala has contributed to multiple case studies performed in collaboration with major cleaning equipment manufacturers. He was instrumental in the extensive technical paper series “DI-Water vs. Chemistry” as well as the lead-free and eutectic screening series completed at ZESTRON’s Technical and Analytical Center in Manassas, VA.
Mr. Nukala graduated with a bachelor’s degree in Chemical Engineering from Jawaharlal Nehru Technological University, India, and a master’s degree in Chemical & Natural Gas Engineering from Texas A&M University, Kingsville, TX. Prior to joining ZESTRON, he worked as a Process Engineer for Usha Chemicals. He has been with ZESTRON America since 2009.


August 1

Mexico-Guadalajara Chapter: SMTA Expo and Tech Forum - Tijuana Edition  +

Location
Grand Hotel Tijuana BC



AGENDA


                                                   

Tarifa Convenio Grand Hotel Tijuana

Codigo de reservación: SMTA

Tel. (664) 681 7000    ext. 4170 o ext. 4180
Lada sin costo México 01 800 026 60 07
reservaciones@grandhoteltj.com  /   reservaciones1@grandhoteltj.com


August 6

Central Texas (Austin) Chapter: CTEA Electronics Symposium at TyRex  +

TyRex Group at 12317 Technology Blvd., #100, Austin, TX



Central Texas Electronics Association (Joint Chapter of IMAPS & SMTA Members) Presents:
Electronics Design, Manufacturing & Test Symposium
Wednesday, August 7, 2019
TyRex Group at 12317 Technology Blvd, #100, in NW Austin
 
Program:
 
2:00  -   Registration Begins
 
2:30  -   Welcome to TyRex by Andrew Cooper, CEO
 
2:35  -   TyRex Factory Tours
 
3:35  -   "Additive Manufacturing for the Electronics Industry”
               Martin Johnson,  Executive Vice President,  TyRex Group
                    
4:05  -   "You Want to Analyze What?  Insights into Materials Characterization from an
     Analysis Services Broker"
               Scott Baumann,  Founder,  Materials Characterization Services
       
4:35  -   Break & Networking
 
4:50  -   "Electronics Supply Chain Challenges and Solutions - Allocations and
     Obsolescence and Poor Quality, Oh My!”
               Jason Jowers,  President,  CTrends
 
5:20  -   "How to Manage UL Listings and Get Your Products Certified"
               Steve Barcik Amstel,  CEO,  High Tech Design Safety
 
5:50  -   Closing Remarks and Door Prizes Drawing
 
6:00  -   Food & Refreshments Served with More Networking
 
 
Registration:
 
RSVP to Bob Baker at:  rjbakeratx@gmail.com
 
No charge for SMTA & IMAPS members;  $10 for all non-members >> (Cash or Check ONLY!)
 
 
Event Location:
 
TyRex Group at 12317 Technology Blvd, #100, in NW Austin
See Directions to:   (TyRex Location)   and   See TyRex Site Map Per Attached Doc
 
 
In Central Texas, SMTA and IMAPS work together as the
Central Texas Electronics Association (CTEA)
 
 


August 6

Central Texas (Austin) Chapter: CTEA Electronics Symposium at TyRex  +

TyRex Group at 12317 Technology Blvd, #100, Austin, TX



Central Texas Electronics Association (Joint Chapter of IMAPS & SMTA Members) Presents:
Electronics Design, Manufacturing & Test Symposium
Wednesday, August 7, 2019
TyRex Group at 12317 Technology Blvd, #100, in NW Austin
 
Program:
 
2:00  -   Registration Begins
 
2:30  -   Welcome to TyRex by Andrew Cooper, CEO
 
2:35  -   TyRex Factory Tours
 
3:35  -   "Additive Manufacturing for the Electronics Industry”
               Martin Johnson,  Executive Vice President,  TyRex Group
                    
4:05  -   "You Want to Analyze What?  Insights into Materials Characterization from an
     Analysis Services Broker"
               Scott Baumann,  Founder,  Materials Characterization Services
       
4:35  -   Break & Networking
 
4:50  -   "Electronics Supply Chain Challenges and Solutions - Allocations and
     Obsolescence and Poor Quality, Oh My!”
               Jason Jowers,  President,  CTrends
 
5:20  -   "How to Manage UL Listings and Get Your Products Certified"
               Steve Barcik Amstel,  CEO,  High Tech Design Safety
 
5:50  -   Closing Remarks and Door Prizes Drawing
 
6:00  -   Food & Refreshments Served with More Networking
 
 
Registration:
 
RSVP to Bob Baker at:  rjbakeratx@gmail.com
 
No charge for SMTA & IMAPS members;  $10 for all non-members >> (Cash or Check ONLY!)
 
 
Event Location:
 
TyRex Group at 12317 Technology Blvd, #100, in NW Austin
See Directions to:   (TyRex Location)   and   See TyRex Site Map Per Attached Doc
 
 
In Central Texas, SMTA and IMAPS work together as the
Central Texas Electronics Association (CTEA)
 
 


August 7

Central Texas (Austin) Chapter: CTEA at Tyrex  +

Tyrex Group, 12317 Technology Blvd, #100, Austin, TX



Central Texas Electronics Association (Joint Chapter of IMAPS & SMTA Members) Presents:
Electronics Design, Manufacturing & Test Symposium
Wednesday, August 7, 2019
TyRex Group at 12317 Technology Blvd, #100, in NW Austin
 
Program:
 
2:00  -   Registration Begins
 
2:30  -   Welcome to TyRex by Andrew Cooper, CEO
 
2:35  -   TyRex Factory Tours
 
3:35  -   "Additive Manufacturing for the Electronics Industry”
               Martin Johnson,  Executive Vice President,  TyRex Group
                    
4:05  -   "You Want to Analyze What?  Insights into Materials Characterization from an
     Analysis Services Broker"
               Scott Baumann,  Founder,  Materials Characterization Services
       
4:35  -   Break & Networking
 
4:50  -   "Electronics Supply Chain Challenges and Solutions - Allocations and
     Obsolescence and Poor Quality, Oh My!”
               Jason Jowers,  President,  CTrends
 
5:20  -   "How to Manage UL Listings and Get Your Products Certified"
               Steve Barcik Amstel,  CEO,  High Tech Design Safety
 
5:50  -   Closing Remarks and Door Prizes Drawing
 
6:00  -   Food & Refreshments Served with More Networking
 
 
Registration:
 
RSVP to Bob Baker at:  rjbakeratx@gmail.com
 
No charge for SMTA & IMAPS members;  $10 for all non-members >> (Cash or Check ONLY!)
 
 
Event Location:
 
TyRex Group at 12317 Technology Blvd, #100, in NW Austin
See Directions to:   (TyRex Location)   and   See TyRex Site Map Per Attached Doc
 
 
In Central Texas, SMTA and IMAPS work together as the
Central Texas Electronics Association (CTEA)
 
 


August 7

Webinar: Recent Advances in X-Ray Technology  +

Organized by SMTA India - Bangalore Chapter

Location
Bangalore India


Wednesday 7th August @ 10:00am India Time GMT+5:30 (12:30am US Eastern Daylight Time GMT -4)

Presenter: Keith Bryant, SMTA Europe

Only members will get access to the recorded presentation!
Members: USD $10 
Non-members: USD $20 

Members must log in to register at the member rate. Pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: smtaindiachapter@gmail.com +919620075752 or Madhukar Rao: +919686098690.

Overview

Taking x-ray images goes back over 100 years. Since then, there have been numerous advances in x-ray technology and these have been increasingly applied in helping the manufacturing of electronic components and assemblies, as well as in their failure analysis.

Most recently, this has been rapidly driven by the reduction in device and feature size and the movement to using newer, lower density materials within the structures, such as copper wire replacing gold wire as the interconnection material of choice within components. Another driver for developments is the engineering of single 3D packages with multiple chips stacked vertically one on top of the other, which results in smaller and more efficient packaging of devices.

In order to meet these challenges and those in the future, there have been a number of recent key improvements to the vital components within x-ray systems.

The choice of available technologies, however, means selecting the tube/detector combination, which is optimum for a particular electronics inspection application, is no longer so clear-cut. For example, one configuration may provide certain benefits that are applicable for one area of electronics inspection, whilst being less valid for others. This webinar will review the various x-ray tube and detector types that are available and explain the implications of these choices for electronics inspection in terms of what they provide for inspection regarding image resolution, magnification, tube power, detector pixel size and the effects of detector radiation damage, amongst others.

 

Keith BryantAbout the Presenter

A fully qualified engineer, Keith has over thirty years’ experience in Electronics Manufacturing.  He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews.

He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years’ experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years.

Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.

Since 2017 he has been Global Sales Director of the leading X-ray manufacturer. He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe.



August 12

Webinar: Conformal Coating - Successful Implementation & Quality Control  +


Bob WillisMonday 12th August @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Conformal coating has provided benefits to industry for many years either in the high reliability market sector or where products have to deal with extreme environmental conditions. Different industries like telecommunications, automotive and consumer products benefit from the use of selective coating.

This session will provide a simple guide to the use of coatings, their application and process, product benefits, inspection and quality control. A practical session will also allow delegates to examine coated boards using different materials and inspect the coating application. Bob Willis will outline the most common coating problems, solutions and address your specific issues in this webinar session.

 

Topics include:

  • Why Conformal Coat
  • Coating Process Options
  • Cost of coating assemblies
  • Correct design for coating
  • Inspection & Quality Control of Coating
  • In-house or Contracting Services
  • Inspection of coatings & methods

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


August 20

Intermountain (ID, UT) Chapter: SMTA Intermountain Boise Golf Tournament  +

Shadow Valley Golf Course



 
Shadow Valley Golf Club
Intermountain Chapter

SMTA Golf Scramble Aug 20, 2019

 
What:  SMTA Shadow Valley Golf 2019 Golf Scramble
When:  Aug. 20th Shot gun start 8:00 AM with lunch following Where:  Shadow Valley Course - Boise, Idaho

Team and Individual sign-up deadline Aug. 14th
Team and Hole Sponsor sign-ups due Aug. 7th
We also welcome donations for prizes like closest to the pin, longest drive and drawing prizes.

COSTS:
Team sponsor $350—fees and lunch for 4 (sponsor may provide shirts or caps) Team Sponsor sign.
Hole sponsors:  $200 and choice of available hole.  Includes one player and hole sponsor sign.
Mulligans:  $10 each, Must purchase in advance
Individuals are Welcome!!  We will sign you up to a team.  Fee is just $65.  This includes Green fees, cart, range balls and lunch.  Please Join us!  We guarantee you will have a good time!

Contacts to RSVP and for Sponsorships:  David Bell 208-867-6006 or dcbell@q.com
Contact for details about course, map: Shadow Valley Golf Club
http://www.shadowvalley.com/directions/
15711 Highway 55, Boise Idaho   208-939-6699

 

Photos from 2019 Golf Scrable in Boise
2019 Overall Golf Score Sheet





August 21

Wisconsin Chapter: WI SMTA 2nd Annual Golf Outing is set for Wednesday August 21st!  +

Brown Deer Park Golf Course 7625 N Range Line Rd Milwaukee, WI 53209



Hello SMTA Members and Friends,
Please join us for our 2
nd Annual Golf Outing on Wednesday August 21st
The event will be at the beautiful Brown Deer Park Golf Course again.
18 holes of golf, raffle prizes, lunch, awards for closest to the pin, longest drive and more!
The fee this year is $45.00 per golfer.
Please email your Team Name and 4-some information to Josh Casper
jcasper@horizonsales.com

RSVP and pay via paypal link to secure your spot(s)

We cannot wait to see you all on August 21st, 2019!

 


August 22

Capital (DC) Chapter: SMTA Capital Expo & Tech Forum  +

Johns Hopkins University/Applied Physics Lab



The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road,
Laurel, MD 20723, on Thursday, August 22nd

 
The SMTA Expo provides attendees with valuable technical information, as well as the chance to meet leading suppliers and other electronic professionals in your region while providing an intimate setting to network and gain knowledge about current advancements within the electronics world. This year we are pleased to host technical presentations by Vi TECHNOLOGIES, ZESTRON Corporation, KYZEN Corporation and KIC.
 
Please join us for this great networking and educational event. Registration opens at 7:30 AM and the first technical presentation will start at 8:30 AM. A complimentary lunch in included on the show floor and exhibits are open from 9:00 AM until 3:00 PM.
 
7:30 AM                              Registration
8:30 – 9:15 AM                 Technical Presentation – Yan Manissadjian, Vi TECHNOLOGY (The Role of SMT Inspection in Industry 4.0 Implementation)
9:00 AM                             Exhibits Open
9:45 – 10:30 AM               Technical Presentation – Ravi Parthasarathy, ZESTRON Corporation (Jet Printed Solder Paste and Cleaning Challenges)
11:00 – 11:45 AM            Technical Presentation – Debbie Carboni, KYZEN (The “Who…What…Why…and How of Cleaning”)
12:00 – 1:00 PM               Complimentary Lunch and Door Prizes
1:30 – 2:15 PM                 Technical Presentation – MB Allen, KIC (Optimization of The Reflow Profile To Minimize Voiding)
2:45 PM                              Partner/Exhibitor Recognition and Bingo Door Prizes
3:00 PM                              Exhibits Close
 

To register online to attend or exhibit, please visit https://www.smta.org/expos/#capital




September 10

Webinar: Electronic Hardware Corrosion  +

Organized by SMTA India - Bangalore Chapter

Location
Bangalore India


Tuesday 10th September @ 9:30am India Time GMT+5:30 (12:00am US Eastern Daylight Time GMT -4)

Presenter: PJ Singh, Ph.D., IBM Corporation

Only members will get access to the recorded presentation!
Members: USD $10 
Non-members: USD $20 

Members must log in to register at the member rate. Pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: smtaindiachapter@gmail.com +919620075752 or Madhukar Rao: +919686098690.

Overview

Corrosion-related electronic hardware failures manifest themselves as electrical opens or shorts. The common modes of corrosion are: (a) electrical opens due to the corrosion of silver terminations in surface-mount resistors; and (b) electrical shorts on printed-circuit boards due to creep corrosion. An ASHRAE conducted survey of data centers concluded that these failures generally occurred when the air quality in data centers was such that the copper and silver corrosion rates were greater than 300 and 200 angstroms/month, respectively. Recent design corrective actions have significantly reduced these failures. Ion migration, another common corrosion-related failure mode that causes electrical shorts, occurs under high humidity condition, even in environments relatively free of gaseous contamination. Yet another failure mode, somewhat related to corrosion, that is becoming quite common is the deliquescence of deposited particulate matter short circuiting neighboring features on printed-circuit boards when the relative humidity in a data center is greater than the deliquescence relative humidity of the settled particulate matter.  The webinar will present these and related topics in detail.

PJ Singh, Ph.D.About the Presenter

Prabjit Singh is a Senior Technical Staff Member in the Materials and Processes Department in IBM Poughkeepsie, New York, with 40 years of experience in the metallurgical engineering aspects of mainframe computer power, packaging, cooling and reliability. He has 76 issued patents, and is an IBM Master Inventor.

PJ Singh received a B. Tech. from the Indian Institute of Technology, Kharagpur, a MS and Ph.D. from the Stevens Institute of Technology, all in the field of metallurgical engineering. Recently, he received a MS in micro-electronic manufacturing from RPI and a MS in electrical engineering from the National Technological University.

PJ Singh is active in ASHRAE, iNEMI and IPC technical societies researching printed circuit board creep corrosion and the acceptable limits of air contamination in mission-critical data centers. He is an adjunct professor of electrical engineers at the State University of New York at New Paltz.


September 11

Mexico-Guadalajara Chapter: 1° Seminario Técnico  +

Location
Hotel RIU Gdl




                                             
¿Te gustaria ser patrocinador de la Cena que se ofrecera a los asistentes del evento?

Informes: 
Iván Román (ivan.roman@continental-corporation.com)
Zoe Anguiano (zoe.anguiano@smartsol.mx)



September 12

Western Pennsylvania (Pittsburgh) Chapter: 2019 SMTA West Penn Membership Appreciation Golf Outing  +

Location
Norvelt Golf Club



THis event is cancelled.  Please look for announcements for other events soon.

2019 West Penn Chapter
SMTA Member Appreciation Golf Outing
Thursday, September 12, 2019

Norvelt Golf Club
 168 Holly Pl, Mt Pleasant, PA 15666

(724) 423-5400
https://www.norveltgolfclub.com/

Location right off I-70 near PA turnpike New Stanton Exit.  

The SMTA West Penn Chapter is excited to invite you to participate in our membership appreciation golf outing.   Golf format is a four person scramble with prizes and other give aways.  Skins challenge $5.00 per player 

Event is no cost to SMTA members and sponsors.  Guest golfers and non-members are $50.  Included are green fees, golf cart, practice greens, lunch vouchers, and buffet dinner follwing the round of golf.

Please join us for a fun day of networking with fellow SMTA members and sponsors and an exicting round of golf!
 
You may come with your own four-some or we will team you up.   Each person needs to register seperately though.   

Registration Deadline September 9, 2019 - Register at:
https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4501

 
Not an SMTA Member?  No problem!  You may join now or at the event!!!  Cost $95.00 a year!
Visit www.smta.org to join!

Event Schedule
 
Check In:  10:00 AM - we will give you your team, starting hole, and lunch vouchers.  Let us know at check in if you already have a team foursome.
Shotgun Start:  11:30 AM
Lunch:  Use vouchers whenever you would like throughout the round
Buffet Dinner:  Approximately 4:30 PM


Complimentary Practice Greens are open all morning
 
Skins challenge $5.00 per person for all players
 
Questions regarding the event?  Contact Shane Proud at:  Shane.Proud@intervala.com    
Interesting in sponsoring a hole for $150?  Contact Jason Emes at:  jasone@newpig.com  

Thank you from West Penn Chapter and we hope to see you there!

 





September 12

Wisconsin Chapter: WI SMTA 2019 Social Event- Brat and Beer Edelweiss Cruise, RSVP by Monday 9/9  +

Edelweiss Main Dock at 205 W. Highland Ave. Milwaukee WI




Hello SMTA Members,

All Aboard!

The WI SMTA Officers team would like to thank our members for a great 2019!  We have decided to offer a fun event this September and we hope everyone can make it.  We will be hosting an Edelweiss Brat and Beer cruise for all current WI SMTA Members on Thursday September 12th at 5:30pm.  This gives us all a chance to relax in a fun and enjoyable atmosphere while getting to know other members.  Cost is nothing for current WI SMTA members!  Please RSVP to let us know that you you will be there.  Spouses and significant others are welcome to this event for $25.00 and you can sign them up and pay at the attached link below. The link below is RSVP and payment for (Non-SMTA members and guests)
https://www.edelweissboats.com/join-group/5698c31e-6154-4dac-ade0-ad78d29c071c


Details are as follows:  The Cruise is on Thursday September 12th and begins at 5:30pm but please be there at 5pm to check in.

Milwaukee Beer and Brat Cruises depart from the Edelweiss Main Dock at 205 W. Highland Ave.
This 1.5 hour cruise includes: complimentary local Milwaukee microbrews, and Usinger brats.  A cash bar is also available for the duration of the cruise.
This relaxing cruise is perfect for enjoying the sights of Milwaukee with family, friends and co-workers.  This cruise is general admission with the majority of the boat being standing room only. 

Please RSVP to the link below by Monday 9/9 to reserve your spot.    Again cost for WI SMTA Members is $0.00.Jana Esselmann
WI SMTA Secretary
262-305-0568





September 16

Michigan Chapter: Michigan Chapter SMTA Golf Outing & Technical Meeting  +

Location
Oak Pointe Country Club



Monday September 16, 2019
9:30 AM
Oak Pointe Country Club
4500 Club Drive Brighton, MI 48116
 
The Michigan Chapter of the SMTA is hosting a FREE technical meeting and golf outing for SMTA members.
Costs:
SMTA MEMBERS/USERS: ABSOLUTELY FREE!
NON-SMTA MEMBERS: $25, (this will also get you a 1 year SMTA membership)
SALES ASSOCIATES: $75 (unless you purchase a sponsor sign, click for sponsor details below) 
 
This is one of the LARGEST technical meeting/golf outing events of any SMTA Chapter in America!
Held at Oak Pointe Country Club, one of Michigan’s most exclusive private clubs, this is the event everyone raves about!
 
Please join us for a morning meeting, a spectacular round of golf on the Honors course, followed by a fantastic BBQ dinner on the clubhouse patio overlooking the crystal clear waters of Crooked Lake.
 
Schedule
9:30AM-Registration
10:00AM-Technical Meeting in Clubhouse 
“Electronic Assembly Data Insights Enabled by Digital Transformation & Industry 4.0”- Gregory Vance
12:00PM- Shotgun start (boxed lunch provided)
Following Golf: BBQ Dinner & Awards/Door Prizes

Oak Pointe Country Club is a Private upscale country club.
Appropriate golf attire please.
Collared shirts required, (must be tucked in),
no denim or cargo shorts.
Hats facing forward only please. Soft spikes only.
 
*SPONSORS* 
CLICK HERE TO REGISTER AS A SPONSOR FOR THE OUTING
------->SPONSOR REGISTRATION FORM<-------

 
Please use the RSVP button below to register ALL golfers, then contact Rachel at RMarino@horizonsales.com with your foursome requests.



September 16

Webinar: Manual Cleaning of PCB Assemblies – Successful Tricks of the Trade  +


Bob WillisMonday 16th September @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

After rework, modification or second stage assembly cleaning may need to be considered. Ideally a no clean flux, gel or solder paste should be used to avoid the need to clean selected areas. If manual cleaning is to be conducted every effort should be made to use materials or application methods that result in the minimum residues from the soldering process.

Planning and training staff in manual cleaning are very important to get the best possible result visually and to maintain product reliability. This is one of the first training sessions to cover manual cleaning of board assemblies, highlighting the problems and solutions to manual cleaning.

Topics include:

  • Why clean
  • Material selection
  • Manual cleaning techniques
  • Testing cleanliness
  • Inspection requirements
  • Component compatibility
  • Reliability test techniques

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here



September 18

San Diego Chapter: SMTA San Diego Chapter Meeting  +

Location
Technology Career Institute 2075 Las Palmas Drive Carlsbad, CA 92011



Topic:   Understanding the New IPC J-STD 001-G Amendment 1 Cleanliness Testing Standard
Speaker:  Mike Konrad, Aqueous Technologies


The widely anticipated revised cleanliness testing standard is now active. What’s next? This presentation will cover the requirements of the new IPC J-STD001-G Amendment 1 cleanliness testing standard. What’s new, what stays the same? This presentation will uncover the details of the new standard, especially the “Objective Evidence” requirement of the new specification.

Mike's Bio:
Mike served on the US Navy’s EMPF manufacturer’s committee and is a featured speaker at industry events and technical workshops worldwide. Mike was honored with Distinguished Speaker status from the Surface Mount Technology Association (SMTA) in 2017.

Mike has served as a court-approved Expert Witness in civil litigation matters concerning post-reflow cleanliness assessment and contamination-related failure mechanisms. Mike is the founder of Aqueous Technologies, a manufacturer of automated cleaning and cleanliness testing systems designed for the electronic assembly industry and has served as its CEO/CTO since 1992. Mike is also the host of the Reliability Matters podcast, available on iTunes, Spotify, and Spreaker.com.

Registration:  4:45 PM
Social/Dinner:  5:00 PM
Technical Session:  5:30 PM

Can't join us in Carlsbad? Sign up for our virtual meeting!




September 18

Connecticut Chapter: SMTA on Tap!  +

City Steam Brewery, 942 Main St., Hartford CT



        



Calling all beer lovers!  Wine or mixed drink lovers too!
 

Come join the SMTA-Nutmeg chapter for a fun evening of drinks, games and networking with your fellow SMTA industry peers. The City Steam Brewery in downtown Hartford is a historical building that now brews beer with – you guess it – steam! With your event registration we are offering a brewery tour, a City Steam brew (beer or wine), heavy hors d/oeuvres and the chance to win some great door prizes simply by completing a quick survey to help plan future events that would be of interest to you! 

When: Wednesday September 18, 2019 at 5:30pm-8:00 pm (approx)

Where: City Steam Brewery, 942 Main St, Hartford, CT  06103

Registration:  SMTA Members $20 / Non-SMTA Members or expired memberships $25
REGISTER NOW AT:  https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4751


A few other important notes:

·         Must bring valid ID to be served alcohol at the brewery

·         Must be 21 or older to be granted a complementary drink ticket (wine/beer only)

·         Cash Bar available for additional libations

·         Park at Market Street Garage or Temple Street Garage (both within a short walk of brewery)

It’s sure to be an evening of fun and friendships, so mark your calendars and take a moment to register now at     https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4751
 

We look forward to seeing you soon - please feel free to contact the undersigned with any questions.


Best regards,
Jenny Hopewell, President

HOPEWELL COMPANIES

Manufacturing Services and Solutions
Office: 508 488-6402 | Cell:  617 970-5957 | Email:  Hopewell@HopewellCompanies.com | LinkedIn: http://www.linkedin.com/in/jennyhopewell/

 

  

 





September 22 - 26

SMTA International 2019  +

Location
Donald E Stephens Convention Center
Rosemont , IL


Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering manufacturing and assembly of electronics, advanced packaging/components, inspection technologies, processes, substrates/PCB technology, soldering, quality and reliability.


September 24 - 26

SMT Processes Certification (SMTA International - Rosemont, IL)  +

Location
Donald Stephens Convention Center
Rosemont , IL


Co-located with SMTA International Conference.

  • September 24 - Course (8:30-5pm)
  • September 25 - ½ day of course + exam
  • September 26 - All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


September 25 - 26

Arizona-Sonora Chapter: Double Feature Meeting with Phil Zarrow and Facility Tour  +

Tucson, AZ & Tempe, AZ




SAVE THE DATE!
The SMTA Arizona/Sonora Chapter invites you to attend
Double Feature:
Presentation and Facility Tour
Join us for our first meeting of the year, hosted by
DATAFORTH INC. in Tucson and MEDTRONIC INC. in Tempe.
World-renowned speaker Phil Zarrow from
ITM Consulting will present “The Deadly Sins of SMT”.
We will tour the facilities and dinner will be provided.

 
Wednesday, Sept. 25th, 2019
4:00pm
DATAFORTH INC.
3331 E. Hemisphere Loop
Tucson, AZ, 85706

Thursday, Sept. 26th, 2019
4:00pm
MEDTRONIC INC.
2343 W. Medtronic Way
Tempe, AZ 85281

 
More details to follow.



October 4

Dallas Chapter: Understanding the New IPC J-STD 001-G Amendment 1 Cleanliness Testing Standard  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



Understanding the New IPC J-STD 001-G Amendment 1 Cleanliness Testing Standard

Speaker: Mike Konrad, Founder and President, Aqueous Technologies

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on October 4, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!

Abstract

This presentation covers the requirements of the new IPC J-STD001-G Amendment 1 cleanliness testing standard. What’s new, what stays the same. This webinar will uncover the details of the new standard, especially the “Objective Evidence” requirement of the new specification.

Biography

Mike Konrad, Founder and President, Aqueous Technologies
 

Mike Konrad is an industry expert on the removal of contamination from circuit assemblies. Mike has been part of the electronic assembly cleaning industry for the past 34 years. Mike has designed several automated cleaning and cleanliness testing machines, has published scores of technical articles on the subject of cleaning and cleanliness assessment has been a member of Editorial Boards for several industry publications.
Mike served on the US Navy’s EMPF manufacturer’s committee and is a featured speaker at industry events and technical workshops worldwide. Mike was honored with Distinguished Speaker status from the electronic assembly trade association’s Surface Mount Technology Association (SMTA) in 2017.
 
Mike has served as a court-approved Expert Witness in civil litigation matters concerning post-reflow cleanliness assessment and contamination-related failure mechanisms. Mike is the founder of Aqueous Technologies, a manufacturer of automated cleaning and cleanliness testing systems designed for the electronic assembly industry and has served as its CEO/CTO since 1992.
 
Mike is the Founder and President of Aqueous Technologies and is also the host of the Reliability Matters podcast, available on iTunes, Spotify, and iHeart Radio, Reliability.fm
 




October 8

Wisconsin Chapter: WI SMTA Technical Meeting and SMT Facility Tour- JW Speaker Corporation  +

JW Speaker N120W19434 Freistadt Rd. Germantown, WI 53022



 WI SMTA Technical Meeting and Tour at JW Speaker 

Please join the WI SMTA as Eric Van Cuyk of Circuit Check
will be presenting on Function Testing Simplification / Flexibility
Cost is $20.00 per SMTA member / $25.00 non- members

 Schedule as follows: 
4:15pm-  Registration
5:00pm-  Welcome / Dinner
6:00pm- Presentation
7:00pm- Facility & Mfg Tour
8:00pm- Meeting Adjourned

RSVP and pay by Tuesday October 1st!   
**Anyone who signs up we ask them to bring (if available) ESD Smock, safety glasses, and ESD shoes or heel grounders.**


 


October 10

Tampa Bay Chapter: SMTA Tampa Bay Chapter Meeting: Operations Factory Tour: Lockheed Martin RMS, Oldsmar, FL  +

Location
Oldsmar, FL



********The Tampa Bay Chapter is sorry to announce that we are closing out the RSVP link for this event.  We have overextended our capacity.  Sorry for any inconvenience this may have caused.  If you have RSVP'ed, please remember to bring your government issued identification to the event.  We will send out an reminder email prior to October 10th.  Thank you for your support!**************



SMTA Tampa Bay Chapter presents
Lockheed Martin RMS Oldsmar, FL Operations Factory Tour
Providing affordable CCA’s, Cables, Rack Integration, and Consoles for over 45 years.

Axel Vargas  (Bio link) will be discussing: 

“pH Neutral Cleaning Agents: Technology and Performance”

pH neutral chemistry cleaning process development and performance review over time in production conditions.

 
Our meeting this quarter will be held at the following address:
Lockheed Martin
3655 Tampa Rd.
Oldsmar, FL 34677


Thursday October 10th:
5:30- Registration/ Meet and Greet
5:30- Dinner
5:45- 6:00-  Introduction factory overview presentation.
6:00-7:00- Factory Tour Presentation
7:15-7:30- Question and answer wrap up.

Cost of Meeting:
Members- $15.00
Non-Members- $20.00

We hope to see everyone at the meeting!



  ******RSVPs required in advance, attendees must be US Citizens or US Permanent Residents.  (Deadline to register is 10/7/19 at 5PM)  All participants will have to bring a government issued photo ID for entry.  The following forms of Photo ID are permissable:  Passport, US Permanent Resident Photo ID, US State Issued Driver’s License or US State issued ID card.  We can not accept any student IDs, company issued IDs or library cards. No walk-ups will be permitted. ******



 




October 10

Capital (DC) Chapter: SMTA Capital Chapter Meeting - October 10, 2019  +

The Test Connection Inc.



The SMTA Capital Chapter is hosting a Chapter Meeting on January 10th from 5:00 PM to 7:30 PM at The Test Connection Inc., Hunt Valley, MD. Will Webb, Aster Technologies, will be presenting “Enhanced Manufacturing Services 4.0.” 
 
This presentation will provide an overview of the opportunities for test data to be gathered and looked at from design, manufacturing inspection, manufacturing process test, and functional validation testing. This processes yield some great sources of process feedback that design and production with connection of machines, sensors, devices and people. We will look at convert data into information and explore the Digital Simulation: Create a virtual copy of the physical world. Play with “Whatif” scenarios in the virtual word in order to identify the optimized physical flow. Use theoretical results to control the physical world. Finally, we will aggregate raw data from cyber-physical systems to build and visualize comprehensive information that allow humans to make decisions based on facts.

Will Webb has worked in the manufacturing test industry for over 20 years and is now employed by ASTER Technologies as the Technical Director of the ASTER USA office. Will is responsible for technical support and creating new business opportunities for the ‘TestWay’ Electrical DFT and Fault Coverage Analysis tools. Prior to working for Aster Technologies, Will has worked for a number of different OEMs and CM’s in the manufacturing test field, responsible for DFT analysis, test coverage analysis, test development and overseas deployment of manufacturing tests.

The evening is scheduled as follows:
5:00-6:00 PM Registration, Networking & Dinner
6:00-6:30 PM Facility Tour
6:30-7:30 PM Presentation

The SMTA Capital Chapter Meeting Location:

The Test Connection Inc.
112 Lakefront Drive
Hunt Valley, MD 21030

Register NOW!


 


October 14

Webinar: Practical Failure Analysis Methods in Printed Board Assembly  +


Bob WillisMonday 14th October @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Different levels of failure analysis exist, from the very basic with virtually no equipment, to the use of a full failure analysis laboratory. Often simple analysis methods can point engineers in the right direction, but proving the root cause of failure often needs the electronic pathologist with all his investigation tools. When conducting any failure analysis, it is important the results prove the cause of the fault. The true reason for failure needs to be clear and proven with hard facts, not just opinions.

 

Topics include:

  • Optical and X-ray inspection
  • Solder joint crack detection
  • Microsectioning
  • Component opening techniques
  • Surface analysis
  • Shear testing
  • Question and answer session

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of the slides will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


October 15

SMTA Europe Selective Soldering Workshop  +

Location
Henkel
Hemel Hempstead UK



October 16

Massachusetts (Boston) Chapter: Joint Meeting ESD and Fires and Explosions at BAE Systems in Nashua, NH  +

Location
BAE Systems, 65 Spit Brook Road, Nashua, New Hampshire 03060



SMTA Boston Chapter, ESDA, IEEE Rel Chapter, and iMAPS jointly cordially invites you to an evening meeting on Wednesday, Oct. 16, 2019 at BAE Systems in Nashua, NH.
“ESD AND FIRES AND EXPLOSIONS”
 
Abstract:  Many of us understand the hazards of electrostatic discharge to electronics. This talk covers the basics of electrostatic ignition, its sources and methods for prevention. It will also cover the issues of personnel comfort/ dangers around extreme charging situations such as moving webs. Case studies of fires, explosions and personnel injuries will be included. It is intended to present the issues of dangers from ESD. The result of attending this talk should be a safer environment both in the workplace and at home.

Speaker: Stephen L. Fowler of Fowler Associates, Inc.
Bio:   Stephen L. Fowler - President, Fowler Associates, Inc.
With over 50 years of electrical engineering experience, 45 years of radiation engineering experience and 35 years of electrostatic engineering experience.  Mr. Fowler is considered a leading international expert in electrical engineering, radiation processing technology, radiation safety, electrostatic control and packaging.  He attended the University of South Carolina and graduated, cum laude, with a BS in Electrical Engineering.  Mr. Fowler served with the United States Air Force during the Vietnam War in electronic communications.
 
He has published papers, given speeches, seminars and lectures on radiation engineering, radiation safety, packaging, static control and static test methods. He is used by several television programs (such as Inside Edition and Dateline) as an expert in electrical and radiation engineering.
 
Mr. Fowler was previously the Electrostatic Plastics Marketing Manager for the Cryovac Division of W.R. Grace and Company.  He was also the Manager of Radiation Engineering for Cryovac.
 
Mr. Fowler is the holder of several patents. He is or has been a member of the ASTM, EIA, ESD Association, AATCC and the Health Physics Society.  He is Chairman of the AATCC Static Committee (RA-32) and Past Chairman of the Electronic Industries Association's Packaging ESD Committee (PEPS)
 
Mr. Fowler holds registrations in North Carolina, South Carolina, New Jersey and Oregon to provide radiation consultation and training. He is a NARTE Certified ESD Control
Engineer no. ESD-00010-NE, a Registered Radiation Protection Technologist (NRRPT) and a Registered Radiation Safety Officer (IRRSO)
 
Steve has been used by media outlets as an expert in electrical, electrostatic and radiation issues:
Dateline: Russian Spy Death from Polonium 210, Gasoline Refueling Fire
 
Inside Edition:
Gasoline Refueling Fires
Electrocutions in the Streets
Cell Phone Electrocutions in the Bath Tub
E-Cigarette Explosion
Hover Board Fires
Foot Bath Fakes
Night Hawk Minerals Radioactive Rocks Cure for Cancer
Hand Sanitizer Burns in the Hospital
Lights in Children Shoes Fires
 
Date: Wednesday, Oct. 16, 2019
Time: 5:00 PM to 8:00 PM
Location: BAE Systems
65 Split Brook Road, Nashua, NH 03060
Meeting Agenda:
5:30 PM Registration, Networking, and Refreshments
6:00 PM Opening and Announcements
6:10 – 7:45 PM Technical Presentation
7:45 – 8:00 PM Q&A
8:00 PM Adjourn
 
Our 2019 Expo Sponsors:


For more information visit: https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=22

This event is open to active members only and please have your membership number handy when you register for this event.
(if your membership expires between and the event, please renew your membership before this event or your registeration will be rejected)
To register for this event visit: click here to register for this event or copy this URL to your browser:  https://events.vtools.ieee.org/event/register/203485
Note:  Registration is required and no walk-ins are allowed at this event.  Event is being held in the un-secure area of BAE Systems so any active member can attend this event but registration is required for all visitors.  Seating is limited to 80 seats so each engineering organization are limited to 20 seats each first come first served.
 
Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598
Vice President : Peter Bigelow (IMI Inc.)
Phone: 978-373-9190


Future Events:

Sept. 30 to Oct. 3, 2019  iMAPS – 52nd International Symposium on Microelectronics at the Boston Hynes Convention Center, Boston, MA.  http://www.imaps.org/imaps2019/

SMTA – Tuesday, Oct. 8, 2019 – New England Expo & Tech Forum at the Boxboro Regency, Boxborough, MA   https://www.smta.org/expos/#newengland
iMAPS NE – Tuesday Oct. 11, 2019 – at the Boxboro Regency Hotel & Conference Center, Boxborough, MA




October 21

Georgia Institute of Technology Student Chapter Chapter: GT Student Chapter Meeting  +

GTMI 401



Meeting to discuss what SMTA is all about and the benefits of being a member.
Open to active members or anyone interested in becoming a member but not sure if its worth it.



October 22

Huntsville Chapter: FARO Arm Demonstration  +

Adtran




Huntsville Chapter SMTA and Adtran welcome you on Oct 22, 2019 from 5:30-7:30pm for a DEMO of the FARO Arm, a portable 3D Measurement Arm.
 
Abstract: 
 
Feel free to bring your own parts, CAD, or anything that want to see measured.  The system will demonstrate both inspection, probing, scanning, and reverse engineering. 
 
FARO is the world’s most trusted source for 3D measurement technology. The Company develops and markets computer-aided measurement and imaging devices and software. Technology from FARO permits high-precision 3D measurement, imaging and comparison of parts and compound structures within production and quality assurance processes. The devices are used for inspecting components and assemblies, production planning, documenting large volume spaces or structures in 3D, surveying and construction, as well as for investigation and reconstruction of accident sites or crime scenes.
www.faro.com

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Speaker Info: 
 
Alex Green is a seasoned professional in the 3D measurement and digitization industry.   With over 10 years of experience, Alex has quickly become a well-known and respected expert of the industry.  He specializes in CAD to part comparisons, GD&T inspections, Reverse Engineering, project planning and training in the aerospace, automotive, military and defense sector as well as various other high precision industries.
 
Alex has been with FARO® Technologies for over 6 years. 
 
Agenda:
 
  • Arrive / Set up from 5:30 – 6:00.
  • Demo / question and answer 6:00-7:00.
  • Pack up and out by 7:30.
 
 
 
Location: Adtran, 901 Explorer Blvd, Huntsville, Al
 
ADTRAN’s Waterside Conference Room in the Mark C. Smith Conference Center.
 Conference (2nd Floor, East Tower)
 
Very Important!
All attendees should park in the area on the South side of the East Tower (taller L-shaped building) – see red circle on map, and enter through the South entrance (as in times before). Turn right at security desk, and go up the stairs, then follow the arrows to the room as shown below.
 


 
 
Hors d'oeuvres :
Cheese/Meat tray
Fruit/dessert tray
Canned Drinks
 
The meeting is Free, but if you would like to snack with us. Let us know for planning purposes.
$5 SMTA Members
$8 Non-Members
Cash/check at Door
 
Two ways to RSVP:
  • SMTA RSVP Link:
  • send email to HSVSMTA@gmail.com 
    Since this is a Demo, for members who cannot attend in person, we will not be able to offer a GoToMeeting option. Please contact us at HSVSMTA@gmail.com

 


October 22

Oregon Chapter: SMTA Oregon Chapter: October Technical Meeting. Evaluation for 3D Printed Resins: Applications in Engineering and Manufacturing  +

Axiom Electronics, 9845 NE Eckert Dr. Suite 200, Hillsboro, OR 97006



This study aims to characterize 3D printed Resins from an applications perspective within engineering and manufacturing. 3D printing technology has grown enormously over the past decade, and is starting to make a transition from being a prototype technology to one that can be used in everyday applications around the factory floor. With the increase in technology and expansion of materials that can be used, the range for applications has increased dramatically. The aim of this study was to help create a selection guide of materials to use, by characterizing each resulting resin with the appropriate mechanical properties. A multi factorial Design of Experiments was used in order to optimize the post processing settings, to achieve maximum desired mechanical properties (Ultimate Tensile Strength, Hardness, Impact, etc…). I end goal is to provide both engineering and manufacturing another option for fabrication, as well as having an easy selection and processing guide for materials used in the factory.


Speaker: Andrew Daya - BIO:
Andrew started his journey into electronics manufacturing under the mentorship of Dr. S. Manian Ramkumar at the Rochester Institute of Technology in Rochester, New York. The research he did at RIT, was recognized by the SMTA in 2013, where Andrew was awarded the Charles Hutchin’s Educational Grant for his research on Package on Package Technology. After graduating, Andrew moved to Houston, Texas and joined Schlumberger as an eDFM engineer. After a couple years, Andrew moved to Salem, Oregon to join Garmin in his current role as a Process Engineer in their Aviation Segment. Andrew’s interests are 3D Printing, Hiking with his Dog Lucy, and exploring new areas (to him) around the Pacific Northwest.
 


October 22 - 24

International Wafer-Level Packaging Conference  +

Advanced Packaging in the New Connected World

Location
DoubleTree San Jose Airport Hotel
San Jose , CA


SMTA and Chip Scale Review are pleased to announce the 16th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.


October 24

San Diego Chapter: Octoberfest  +

Location
KARL STRAUSS BREWING COMPANY-SORRENTO MESA 9675 Scranton Rd San Diego, CA 92121




Join

SMTA San Diego Chapter
 
IPC Designers Council San Diego Chapter
&
IMAPS San Diego Chapter
at
Octoberfest
KARL STRAUSS BREWING COMPANY-SORRENTO MESA
Thursday, October 24, 2019 | 5:30-7:30 PM
Re-connect with old friends and make new connections in San Diego electronics industry!  Look for the SMTA/IPC/IMAPS sign to find us.
 
This is a “No-Host -Pay Your Own Way” event.
RSVP HERE 
 



October 24

Additive Electronics Conference: PCB Scale to IC Scale  +

Location
DoubleTree by Hilton San Jose
San Jose , CA 95110


Today's increasingly sophisticated electronics challenge designers and fabricators to push the limits of traditional design, fabrication and assembly and think outside of the box. Additive manufacturing enables environmental advantages, opens up design capabilities and end use advantages such as weight reduction, miniaturization and 3 dimensional design. This conference is designed to not only showcase options and processes intended to enable line width and space from .003" to 5 microns, but also to provide information on supporting materials and processes that are being developed to serve all market segments and expose attendees to other new advanced technologies intended to meet the ever increasing challenges of smaller, lighter and  more powerful electronic devices. 


October 29

Great Lakes (Chicago) Chapter: SMTA Great Lakes Solder Paste Roundtable Event  +

Location
Plexus, 2400 Millbrook Drive, Buffalo Grove, IL 60089







 
SMTA Great Lakes Chapter Meeting
Tuesday, October 29th, 2019
 
Location: Plexus
  2400 Millbrook Drive
  Buffalo Grove, IL  60089
 
 
Time:  
5:00-5:30 pm Registration/Networking
5:30-6:00 pm Dinner
6:00-7:30 pm Presentations
7:30-8:00 pm Adjournment
   
Cost:  
Members $30.00
Non-Members $35.00
   
  **Pay via Cash/Check (onsite) or Credit Card (via PayPal - see button during RSVP process)
 
 
 
SMTA Great Lakes Solder Paste Roundtable Event
 
 
“Development of a Solder Paste Test Vehicle for Miniaturized Surface Mount Technology”
 
By Dr. Mark Currie – Henkel Corporation
Authors and acknowledgements to:
Dr. Neil Poole/Doug Dixon (Henkel Electronic Materials, Irvine, CA, USA)
Chrys Shea (Shea Engineering Services)
 
 
Consumer demand has accelerated the pace of the electronics miniaturization trend, compelling assemblers to develop robust capabilities for 01005 components and 0.3 mm pitch array packages to remain competitive.  The process of acquiring these capabilities can be complex, as they involve numerous interactive factors.  To optimize the stencil printing and reflow portions of SMT assembly given the challenging new realities, a process evaluation tool has been developed that provides a turnkey solution for solder paste performance testing.
 
The evaluation toolkit incorporates PCB design, a complete and costed bill of materials, full documentation for programming, setup and test methods, and step-by-step directions for a designed experiment.  It is the product of a cooperative effort among industry specialists that draws on their materials expertise, statistical know-how and process engineering skills, and was specifically developed to make solder paste testing as easy as possible for the PCB assembler.
 
This paper details the development of the turnkey solder paste evaluation concept from a laboratory test vehicle to the complete off-the-shelf kit.  It discusses:
 
•             Component selection to reflect the current state of the market and support a 2-3 year miniaturization roadmap
•             Sample size consideration for statistical significance
•             DFM of the PCB to manage costs
•             Design for solder paste inspection (SPI)
•             Nesting of tests to evaluate 22 paste properties in 4 hours or less
•             Stencil design considerations
•             Full database for programming entire SMT line
•             PCB support design, development and testing
 
The discussion details both user and supplier perspectives on testing methods and highlights key considerations for assemblers.  It concludes with opportunities and plans for potential future developments to expand the kit’s analytical capabilities.
 
“Lead-free Solder Paste Development for Ultra Fine-Pitch Printing and Reflow of 03015 and 0201 Metric Chip Components”
 
By Shantanu Joshi - Koki Solder America Inc.
 
 
Due to the widespread popularity in mobile devices such as wearable devices and smartphones, demand for miniaturized or micro surface mount components, such as 0201 metric chip, flip chip packages, and fine-pitch surface mount land patterns to accommodate them are increasing. Consequently, solder paste is required to be compatible with this high-density surface mount technology.
 
When printing paste for 0402 metric chip components, stencil apertures of approximately 0.2mm diameter are used whereas for 0201 metric chip components, stencil apertures of the dimension 0.1mm diameter are needed. This presents challenges for both good printability and solderability. Conventional solder paste technology seems to be lacking in coping up with these stringent requirements.
 
Precise printability and optimum solder reflow parameters were evaluated on ultra-fine pitch surface mount board pads using conventional solder paste and a newly developed solder paste to understand compatibility with 0201 and 03015 metric chip components.
 
A test vehicle was used with 0402, 03015 and 0201 metric chip components. Type 51 (10-25um) and Type 6 (5-20um) no-clean lead-free Sn3Ag0.5Cu solder pastes were evaluated with two different stencil thicknesses,50um and 80um. The area apertures ratios varied from 0.28 to 0.94. The measurements of paste volume after printing were recorded using production solder paste inspection equipment.
 
After printing reflow studies were conducted on assembled 03015R and 0201C metric chip components to understand reflow behavior. The solder paste development included flux improvement to increase stencil release rate of the solder paste through the stencil apertures for the challenging stencil area aperture ratios used. The newly engineered heat resistant flux chemistry in the solder paste helped to reduce solder graping during reflow even with the small paste deposits on the board. Continual solder paste print studies as well as print to pause studies were conducted with the developed solder paste on 0201 metric and 0.3mm pitch QFP board land pads to understand the use of the solder paste in production. The results of the work will be discussed in detail.
 
 
“The Effects of Surface Finish on Solder Paste Performance”
 
By Tony Lentz – FCT Assembly
 
The surface finishes commonly used on printed circuit boards (PCBs) have an effect on solder paste performance in the surface mount process (SMT).  Some surface finishes are non-planar like hot air solder level (HASL) which can lead to inconsistencies in solder paste printing.  Other surface finishes are difficult to wet during reflow like organic solderability preservative (OSP).  What is the overall effect of surface finish on solder paste performance?  Which solder paste is best for each surface finish?  It is the goal of this paper to answer these questions.
 
In the initial work, several different surface finishes were tested in the surface mount process including:  HASL, OSP, electroless nickel immersion gold (ENIG), immersion tin, and immersion silver.  Several different types of solder pastes were tested along with each surface finish including:  lead-free no-clean and water soluble, and leaded no-clean and water-soluble solder pastes.  Each combination of surface finish and solder paste was evaluated for print performance, wetting, solder balling, graping, and voiding.  The results of this testing were quantified and summarized.  Recommendations pairing the optimal solder paste with each surface finish were given.    
 
Subsequent work explored some of the surface finish & solder paste combinations in more detail with an expanded set of SMT parameters.  Three surface finishes were studied including electroless nickel immersion gold (ENIG), organic solderability preservative (OSP), and immersion silver (ISilver).  Two solder pastes were used including a no clean SAC305 solder paste and a water soluble SAC305 solder paste.  Three different reflow conditions were tested including a ramp-to-spike (RTS) profile, a ramp-soak-spike (RSS) profile, and simulation of the double-sided surface mount process by reflowing two times through a RTS profile.  Print speeds were varied at 25, 50, and 100 mm/second and printed solder paste volumes were measured.  Reflow performance was measured and quantified including wetting, solder balling, and graping data.  Quad flat no lead (QFN) components were placed and voiding was measured in the solder joints of the QFN thermal pads. 
 
All of the test results, including data from the first study, are summarized, compared and contrasted.  Discussion of the strengths and weaknesses of each combination of surface finish and solder paste are given with respect to the various SMT parameters.  Recommendations are made for optimal combinations of surface finish and solder paste.
 
 
About the Speakers:
 
 
Dr. Mark Currie – Henkel Corporation
 
Mark works at Henkel Corporation, and is based in Irvine California as Global Business Director for Solder, and is responsible for their technical development direction across all focus market electronic assembly sectors - dealing with Global OEM’s, Tier 1 and EMS accounts. Mark draws from his experience of having visited over 1000 customers, lived in 7 different countries, presented at many established international conferences since 1993, and authored over 100 papers. Mark graduated with both a Manufacturing Engineering degree and PhD from the University of Salford, UK. His undergraduate final year project introduced him to solder, which enticed him to follow with ESPRC industry funded Phd on the same subject matter.  As such, Mark has been familiar with solder for 28years.  In that period, Mark joined Multicore (soon thereafter to be Henkel) and has gone from Academia, to a Research Scientist, to a Process Engineer, and then onto Global Technical, Marketing, Product and Business development positions with Henkel.
 
 
Shantanu Joshi - Koki Solder America Inc.
 
Shantanu Joshi is the Regional Sales Manager for KOKI Solder America. He has a Master of Science degree in Industrial and Systems Engineering from State University of New York at Binghamton and Bachelor of Engineering degree in Production Engineering from Pune University, India. He is currently pursuing Ph.D in Industrial and Systems Engineering concentrating on High Reliability Lead Free Solder Alloys from State University of New York at Binghamton. He is published over dozen papers in various national and international conferences over the years. His current work extends from optimizing printing parameters for the stencil printing process to root cause analysis of complex electronic assemblies by understanding the material science of lead-free solder alloys.
 
 
Tony Lentz – FCT Assembly
 
Tony Lentz has worked in the electronics industry since 1994.  He entered the industry as a process engineer at a circuit board manufacturer and worked there for 5 years.  Since 1999, Tony has worked for FCT Companies as a chemical laboratory manager, production facility manager, and most recently a field application engineer.  Since 2013, Tony has focused on field application and R&D for FCT Assembly solder and stencil products.  Tony has extensive experience doing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards.  He has published and presented many papers at industry events.  Tony is a speaker of distinction with SMTA.  Tony holds B.S. and M.B.S. degrees in Chemistry.  
 
 
 
RSVP to Gerri Noble at gnoble@ntech-inc.com or via the SMTA Great Lakes Chapter Webpage or by clicking HERE.



October 30

FREE Webinar: Advances in X-Ray for Demanding Applications  +

Organized by SMTA Penang Chapter

Location
Penang Malaysia


Wednesday 30th October @ 2:00pm Penang Time UTC+8
(2:00am US Eastern Time UTC-4)

Presenter: Keith Bryant, Chairman SMTA Europe

Free for all – only members will get access to slides and recorded presentation!

Overview

The taking of x-ray images goes back over 100 years, since then there have been numerous advances in x-ray tube and detector technology and these have been increasingly applied into helping with the manufacturing of electronic components and assemblies, as well as in their failure analysis. Most recently, this has been driven partly by the continued reduction in circuit board, device and feature size and the movement to using lower density materials within the structures, such as copper wire replacing gold wire as the interconnection material of choice within components.

However, due to the solar and battery advances, where heat transfer is critical and voiding is a huge problem, we are also seeing an increasing amount of high-density and thick materials which need to be imaged and worse still, low-density materials in combination with high-density ones. In order to meet these most recent challenges and those in the future, there have been a number of key improvements to the vital components within x-ray systems, which will be covered in the presentation.
 
The choice of available technologies, however, means selecting the tube/detector combination, which is optimum for electronics inspection is no longer so clear-cut. For example, one configuration may provide certain benefits that are applicable for one area of electronics inspection, whilst being less valid for others. This presentation will look at both ends of the spectrum of demanding applications, low-power applications using LED's as a subject and high-power applications showcasing IGBTs. 

 

About the Presenter

Keith Bryant

A fully qualified engineer, Keith has over thirty years' experience in Electronics Manufacturing.  He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews. 

He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years' experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years. 

Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.
from 2017 to 2019 he was Global Sales Director of the leading X-ray manufacturer. Recently reverting to a Consultancy role allowing him more freedom to pursue other projects, including i4.0.

He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.


November 1

Dallas Chapter: New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA’s and PCBF’s  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA's and PCBF's

Speaker: Robert Boguski, President, Datest

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on November 1, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!

HERE

Abstract

Digital Computed Tomography, or CT Scanning, has advanced in equipment and techniques to such an extent that it has now become the method of choicein many applications where workmanship, fabrication, and component defects are difficult and sometimes otherwise impossible to find.

This presentation will discuss the current state of the technology (hardware as well as software); some of the basic physics underlying the methodology; and relative strengths and weaknesses of CT Scanning versus other methods, from the standpoint of results as well as cost. Numerous examples will be shown, with an emphasis on PCBA and PCBF failure analysis and defect detection. 


Biography

Robert Boguski, President, Datest
 

1981 graduate of The University of San Francisco (BA Economics).  Robert has worked in the electronics packaging and interconnect manufacturing and testing business, primarily in management positions, since he was a teenager (1975).  22 years in the bare board business, 12 years in the EMS business, and 14 years in the testing and test engineering business (Some overlap with EMS). Robert is the Owner and President of Datest, a test engineering and failure analysis company located in Fremont, California.  Robert and/or his Company, Datest, are members of SMTA, IPC, and IEEE. Datest is also a member of the American Society for Nondestructive Testing (ASNT) as well as the Eurpoean Institute of Printed Circuits (EIPC). Since 2013 Robert has co-authored the Test and Measurement column for Circuits Assembly Magazine.  Robert is also currently the President of the SMTA Silicon Valley Chapter.

 




November 6

Wisconsin Chapter: WI SMTA comes to Madison area ! Pro Active Engineering hosts Dale Lee on Wednesday November 6th  +

The Round Table 1611 N. Bristol St. Sun Prairie, WI 53590



Hello WI SMTA Members and Friends,

The WI SMTA Officer team is excited to be bringing a technical presentation and tour to the Madison area!  Please join us on Wednesday November 6th when we welcome Dale Lee to present on BGA’s, LGA’s, QFN/DFN’s – Oh My, Can Traditional DFM Survive .  

The  detailed agenda is below.  Please note that dinner and the technial presentation  is off site from Pro Active at The Round Table and the facility tour will take place after (around 7pm)
  • 4:30pm    Registration and Networking
  • 5:00 pm   Welcome and Dinner
  • 6:00pm   BGA’s, LGA’s, QFN/DFN’s – Oh My, Can Traditional DFM Survive, Presented by Dale Lee
  • 7:00 pm   Facility Tour at Pro Active Engineering (350 Business Park Dr.  Sun Prairie WI)
  • 8:00 pm   Meeting adjourned

Please spread the word for this great Technical Presenter and come see the Pro Active Engineering facility!
 


November 6

Ohio Valley Chapter: Encapsulates and Coatings Technical Meeting  +

Location
Lorain County Community College (DEC 132 A/B - 151 Innovation Dr, Elyria, OH 44035)



Building: Desich Entrepreneurship Innovation Center
Room: DEC 132 A/B
Date: Wednesday, November 6th 2019

https://www.lorainccc.edu/about/map-and-directions-to-lccc/

Proposed Schedule:
- 9:00 am - 9:30 am      Registration Check-in
- 9:30 am - 10:30 am    Mike Skinner of Dow : General Overview of Tech. in Coatings
- 10:30 am - 11:30 am  Jeff Bowin of Henkel:  Low Pressure over mold
- 11:30 am - 12:30 pm  Lunch
- 12:30 pm - 1:30 pm   Jim Stockhausen of ELANTAS PDG Inc: Trends and Developments in Electronic Protection Materials
- 1:30 pm - 2:00 pm     Johnny Vanderford : MEMS Programs and Updates
- 2:00 pm - 3:00 pm     Facility Tour: LCCC Electronic Assembly Manufacturing Center (Sneak Peak)

Hotels and Accomodations:
- Homewood Suites by Hilton on RT 254, just call reservation and mention you are visiting LCCC. 
- The Hampton Inn & Suites by the old Midway Mall is a sister property of the Homewood Suites so they may offer extended pricing for LCCC involved travelers.  Mention -LCCC they should receive our rate or if they are a public organization a government rate may be available. 
- A more ‘active’ area the DoubleTree by Hilton in Westlake provides good rates we work with Kim Barker and she can be reached at kim.barker@hilton.com or 440-617-2361. 
- Stocker Center uses the Country Inn & Suites (Griswold Rd) for performers and they can be reached at cx_elyr@contryinn.com or 440-324-0099.


November 6

Massachusetts (Boston) Chapter: Evening Meeting at Raytheon Company in Andover, MA  +

Location
Raytheon Company, 350 Lowell Street, Andover, MA 01810



SMTA Boston Chapter, IEEE Reliability Chapter, and IMAPs NE cordially invites you to an evening meeting on Wednesday, Nov. 6th, 2019 at Raytheon in Andover, MA.
Secure Location Logistics: Pre-registration is required (remember to use full name include middle name as appear on ID when registering) to attend this event and open to US citizens only, no walk-ins are allowed.  Must have either state issued driver’s license or passport to gain access to facility.  Last factory tour starts at 5:15 PM and must be in the café by this time so arrive early if you plan on attending the factory tour (visitor are required to wear closed toe and heel footwear are required for the tour).  Must arrive at the security gate at Raytheon, Andover by 5:45 PM or will be turned away.
 
Date: Wednesday, November 6, 2019
Time: 4:00 PM to 9:00 PM
Location: Rayth