Calendar of Events

   2019      

                                   

2019

February 19

Capital (DC) Chapter: SMTA Capital Chapter Meeting - Presentation and Live Demo on “Non-Destructive BGA/Area Array Component Rework”  +

Location
PACENTER Training Facility



Date: February 19, 2019 @ 5pm
 
Speaker:
Aaron Caplan
Director of Marketing & Training
PACE Worldwide
 
Location:
PACENTER Training Facility
6605 Selnick Drive #C
Elkridge, MD 21075
  

Agenda:
  • 5:30 – 6:15: Registration/Dinner
  • 6:15 – 7:15: Presentation
  • 7:15 – 7:45: Demonstration

 “Non-Destructive BGA/Area Array Component Rework.”
 
Abstract:
In the past 20 years, such mundane operations as soldering, desoldering and component replacement have become complicated by extreme micro-miniaturization, the use of lead-free solders, new thermally challenging pc boards, heat-sinking bottom terminated components and intricate component packages that are difficult to rework or install. One area that presents unique challenges is BGA/Area Array rework. Modern boards that use these components are more technically demanding than ever, requiring skilled operators who are highly competent at accomplishing delicate, intricate soldering and rework tasks. Unfortunately, many operators will cause more damage to the assembly or components due to his/her rework actions. As a result, many manufacturers struggle to repair or rework boards, opting to throw away lower value boards or hire outside contractors to perform the more difficult repairs. This presentation will review current techniques and procedures for performing highly reliable, high-quality rework and repair on some of the more difficult BGA packages and will include live demonstrations of BGA rework using available convective and infrared heating techniques. The presentation will address typical BGA/area array components, heating technologies (convection and infrared), the importance of bottom side preheating, flux application, solder paste stenciling, device alignment methods and thermal profiling techniques, followed by a live demonstration of BGA rework.
 
 
About the Speaker:
Aaron Caplan is the Director of Marketing & Training for PACE Worldwide, a company solely focused on providing innovative, cost-effective solutions in hands-on soldering, rework and repair of advanced electronics to companies and government around the globe for well over 50 years. Mr. Caplan has been involved in electronics manufacturing technology since the 80's and is an acknowledged expert in Miniature/Microminiature Electronics Repair. A CIT in IPC-7711/IPC 7721, he provides technical expertise in teaching of non-destructive PCB rework/repair techniques, educating industry on how to properly utilize these techniques. In addition to his marketing duties, Mr. Caplan also coordinates the Training Department and Video Production Team, providing direction for a wide variety of video production projects.
 




February 19

Massachusetts (Boston) Chapter: Printing and Cleaning  +

Location
ITW EAE (Electrohic Assembly Equipment; 35 Parkwood Drive, Suite 10; Hopkinton, MA 01748



SMTA Boston Chapter and iMAPS New England cordially invites you to an evening meeting on Tuesday, Feb. 19, 2019 at ITW EAE in Hopkinton, MA.
“Conquering Your Latest Challenge in Miniaturization”
Printing experts Edward Nauss and Michael Butler will present the key elements of repeatable solder paste deposition needed to successfully meet the miniaturization trend:
  • High quality stencils with nanocoatings
  • Board support and snugging
  • Proper alignment between PCB and stencil
  • Underwiping solvents and textiles
  • High quality solder paste
  • The importance of separation parameters on paste release
Attendees will see:
  • Live demonstrations of printing on the SMTA Miniaturization Test Vehicle
  • Automated Solder Paste Inspection
  • Visual inspection under a digital microscope
  • Videos of solder paste release from the stencil
Michael will describe the process development path and the statistical methods he used to define a robust 008004/0201M printing process.
Chrys Shea, of Shea Engineering Services will be available to answer questions about the new SMTA test board, the DOES embedded in it for smaller components, and update the commercial launch schedule of the board through Practical Components. 
 
“Don’t Panic: What YOUR ROSE Number Really Means

The review and revision to J-STD-001 on ionic cleanliness has a new protocol.  The new standard changes how we qualify the cleanliness of our assemblies.

Cleaning expert Debbie Carboni will present:

·         An overview of the new protocol

·         What the changes mean for assemblers

·         The impact on process qualification and process control

·         Generating “Objective Evidence” for level 1 and level 2 qualification

 

All attendees will see:

·         New test coupons for qualifying, optimizing and monitoring cleanliness

·         Passed and Failed test coupons

An open Question and Answer session will enable attendees to discuss their specific process needs and changes to gain compliance with the new standard.
 

Date: Tuesday, Feb. 19, 2019
Time: 5:00 PM to 9:00 PM
Location: 35 Parkwood Drive, Suite 10; Hopkinton, MA 01748
Cost: SMTA/iMAPS/IEEE Members $25 ($30 after Thursday, Feb. 14, 2019)
Non-Member  $30 ($35 after Thursday, Feb. 14, 2019)
Retired-Unemployed Member $20 ($25 after Thursday, Feb. 14, 2019)
Student Member $10 ($15 after Thursday, Feb. 14, 2019)
 
Meeting Agenda:
5:00 PM Registration, Socializing, Networking
5:00 – 6:00 PM Dinner, Socializing, Networking
5:45 – 6:00 PM Announcements, Future Events, and Printing Intro.
6:00 – 6:45 PM Printing Presentation (Featured 0201 Chip Size)
6:45 – 6:50 PM IPC J-STD-001 Intro.
6:50 – 7:35 PM IPC J-STD-001, Revision G, Amendment 1
7:35 – 7:45 PM Q&A
7:45 -8:30 PM
8:30 PM
Printing Demo & Tour
Adjourn

Our 2018 Expo Sponsors:
  
Contact Info:
President : Peter Bigelow (IMI Inc.)
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598
Vice President : Peter Bigelow (IMI Inc.)
Phone: 978-373-9190

VP of Technical Programs : Joe Kwong  (Draper)
Phone: 617-258-1746


Future Events:
iMAPS NE - March 12, 2019 - "Extending Copper Plating Technology to New Sturcutures in Advanced Packaging" at the Boxboroguh Regency Hotel & Conference Center, Boxborough, MA - for more info visit: http://events.r20.constantcontact.com/register/event?oeidk=a07eg3jrnszf9fc4f73&llr=dntnvbkab
SMTA - Tuesday March 19, 2019 - Photo Etch Technology, Lowell, MA

iMAPS NE - May 7, 2019 – 46th Symposium & Expo
SMTA - Tuesday Oct. 8, 2019 - 4th New England Expo



February 19

Webinar: BGA Reballing- Theory and Hands On  +


This webinar has been cancelled!

Tuesday, February 19, 2019 1:00pm to 2:30pm Eastern
Presented by: Bob Wettermann, BEST Inc.

Bob Wettermann What You Can Learn From This Course:

This webinar is a “how to” guide for reballing intended for PCB rework and repair depots as well as device reclaimers. These sessions will take those interested in reballing devices through the entire process of setting up the equipment, developing and verifying the process. The first topic will cover the need for reballing of BGAs, CSPs and other devices. The second section will focus on the equipment set recommended for reballing and the third section the various process steps for reballing a device. A variety of different methods for both deballing and reballing will be discussed with the various advantages and disadvantages discussed to each approach.  Both plastic-packaged parts as well as ceramic parts reballing will be discussed. Inspection of the reballed components, the type of reliability testing data currently publicly available will be reviewed as well as some ideas for developing your own specifications if you want to outsource this activity.

This webinar is designed for process engineers, rework technicians and others interested in repairing electronics.

Instructor Bio:
Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.


February 20

Empire (Rochester, NY) Chapter: 5th Annual Member Appreciation AHL Hockey Game  +

Location
Blue Cross Arena (Rochester, NY)



The SMTA EMPIRE Chapter has again secured tickets for "Party Deck" glass level viewing of the Rochester Americans AHL Hockey Team as they take on the Cleveland Monsters.  All tickets for this event have now been allocated and the RSVP link has been closed.

TICKET CLAIM INSTRUCTIONS FOR REGISTERED ATTENDEES:

Tickets for our registered guests can be claimed at the Blue Cross Arena entrance beginning approximately 20 minutes before game time at 6:45pm in the atrium area where the event attendants scan tickets.  A designated Empire Chapter officer will be stationed here and can be identified by the blue SMTA monogrammed pullover they will be wearing.

Time / Address:  The game begins at 7:05pm on Wednesday February 20, 2019 at the Blue Cross Arena, One War Memorial Square, Rochester, NY 14614 

Pre-Game Eats:  As we have done in previous years, for those interested in some quick bites before the game, please join us during happy hour at the Dinosaur Bar-B-Que (bar area), a convenient walk from the Blue Cross Arena across the Court Street Bridge (99 Court Street), starting around 5:30pm.  Please note this pre-game gathering is a "no host" occasion (you order, you pay).  We'll then walk over to the game as a group.

Parking:  There are several paid parking lots available around the event site.  The parking garage most convenient to the Dinosaur-Bar-B-Que is:
Court Street Garage
194 Court Street
Rochester, NY 14604
Google Maps Pluus Code: 593V+H9 Rochester, New York


Email us with your questions or comments at:  smta.empire@gmail.com
For immediate response, call Jeff at 607-222-6154
 


February 20

Carolinas (NC, SC) Chapter: SMTA Carolinas Chapter 2019 Kickoff Mixer  +

Location
Fullsteam Brewery in Durham, NC




Join your newly elected Carolinas Chapter Board of Directors as they welcome 2019 with some local craft beers and light fare. 

Thanks to the support of our sponsors, we are able to provide two (2) drink tickets and food without any cost to the attendees. 
Doors will open at 5:30 on Wednesday 20 Feb 2019
RSVP today!


What's more, this event is only two week before our first info session. 
On 06 March, the Chapter will explore Conformal Coating technologies including plasma etch, jetting, and two-part auto mixing with PVA at GMI in Mooresville, NC


More information to come...
 
Image result for gmi mfg                         Related image



February 21

Rocky Mountain Expo & Tech Forum  +

Location: West Club at Mile High Stadium
1701 Bryant Street
Denver, CO 80204



Exhibitors

The Rocky Mountain Expo & Tech Forum is SOLD OUT! Please contact Courtney Kalb to be put on a waitlist.


Click Here for Attendee Parking Information

Click Here for Exhibitor Parking Information

 



Attendees

Attendees Register Now

Exhibit Hours:

Thursday, February 21, 2019

10:00am-3:00pm

Backstage Tour of Mile High Stadium
As a special treat, we will have a backstage tour of Mile High Stadium for 25 attendees. Registrations are limited so book early. Cost for the tour is $25 per person – a bargain for the opportunity to go behind the scenes of the Denver Broncos. Tour will run at 1:00pm.
 

THANK YOU TO OUR TOTE BAG SPONSOR:

 

Free Technical Program & Schedule:

8:30am 

Registration Opens

 

THANK YOU TO OUR REFRESHMENT SPONSOR:

 

9:00am-10:00am

Materials Selection for High-Speed PCB Stackup Design

Speaker: Bill Hargin, Z-zero

Everything that happens in the production of a PCB works against signal quality.  The purpose of this session is to introduce design teams to the process of evaluating and selecting the right laminates early in the design process, prior to signal-integrity simulation, creating PCB stackups that meet the requirements of multi-layer boards that work right the first time, with reproducible results across multiple fabricators.

Attendees will be introduced to PCB laminate tradeoffs, the laminate-materials market, and will be exposed to cost-effective strategies for controlling loss and glass-weave skew. 

 

10:00am

Expo Hall Opens

 

10:30am-11:30am 

The Impact of MicroBGA Technology on SMT Processes

Speaker: Chip Spangler, Ph.D., Aspen Microsystems, LLC

Micro BGA technology has reduced the size of the die package to be only slightly large than the die itself.  At the heart of Micro BGA technologies is a combination of advanced materials combined with more wafer-level processing.  While each of the major semiconductor assembly companies has their own variation on Micro BGA technology, many can be grouped into Fan-In or Fan-Out Wafer-Level Packaging (FI/FOWLP). The primary difference in these technologies is related to the size of the die vs the number and density of BGA solderballs. This paper reviews some of the major approaches to manufacturing MicroBGAs and discusses how these differences impact their use in an SMT process.

 

12:00pm-1:00pm

Complimentary Lunch

 

THANK YOU TO OUR LUNCH SPONSORS:

 

1:00pm

Tour of the Stadium

 

1:30pm-2:30pm

The Continuing Miniaturization of SMT

Speaker: Jason Fullerton, Alpha Assembly Solutions

As the demands from users push the electronics in the direction of “smaller, faster, better” in a number of applications, hardware designs are requiring SMT processes to use devices with continually decreasing pitch. This presentation will discuss the devices that are considered ultra-fine pitch technology, including leaded and leadless packages, area array packages, and passive devices. The effects on assembly materials and PCB technology will be discussed, as well as how these devices impact traditional SMT processes and advanced assembly processes that can be used in combination with or in lieu of traditional SMT.

 

3:00pm

Expo Hall Closes

 

3:00pm-4:00pm

Hosted Happy Hour by SMTA and the SMTA Rocky Mountain Chapter.

Cash Bar to follow from 4:00-4:30pm. Everyone is welcome!

 

Thank You to Our Diamond Vision Sponsor:

 


February 26

Huntsville Chapter: HSV Chapter SMTA - ASQ-1503 Joint Meeting Nanotechnology Applications  +

Adtran



The Huntsville Chapter SMTA, ASQ-1503, and Adtran welcome you on Feb 26, 2019 from 5:30-7:30pm to bring a discussion on Nanotechnology Applications.
 
Speaker Info:  Ms. Jennifer Miller
Holds a BS degree in Media Communications and is working on a BS degree in Physics from UAH. She has been researching nanoparticles of materials' reflected light in order to determine material Composition and identification.
 
 
Keynote Speaker Info: 

Dr. Eugene Edwards
Rocket Scientist (Retired)/University Research Advisor/Minister
Founder, Save The Youth Inc. (Bessemer, Alabama)
 
Dr. Eugene Edwards was born in Fairfield (Alabama).  He grew up in Bessemer (Alabama) where he was a product of Charles F. Hard Elementary School and a graduate of Jackson Solomon Abrams High School.
 
Dr. Edwards received a
  • Bachelor of Science degree in Electrical Engineering Technology from Alabama A&M University (Huntsville, Alabama);
  • Master of Science degree in Electrical Engineering from Howard University (Washington, D.C.);
  • PhD in Ministerial Education from KME University (Athens, Alabama)/Freedom Bible College of Arkansas.
  • Certification in Fiber Optics Manufacturing from California State Polytechnic University (Pomona, California)
  • Certification in Optical Fiber Engineering from George Washington University (Washington, D.C.)
  • And served as a Professor of Electrical Engineering at Alabama A&M University (Huntsville, Alabama).
 
Dr. Edwards was previously a Research Fellow at NASA’s Marshall Space Flight Center (Huntsville, Alabama), and retired as a Rocket Scientist at the U.S. Army Aviation Missile Research Development and Engineering Center (Huntsville, Alabama), where he has many patents/inventions, numerous journal papers, and was co-author of two books on Nanotechnology.
 
Dr. Edwards is Founder, Pastoral Leader, and/Chief Executive Officer for Save The Youth Incorporated, Headquartered in Bessemer (Alabama), where he provides oversight for education, youth programs, and parental counseling.
 
He is a Music Director and Gospel Recording Artist that has appeared with numerous major recording artists including
  • Walter Hawkins
  • The Mississippi Mass Choir
  • Dottie Peoples
  • Luther Barnes
  • Mighty Clouds of Joy
  • Edwin Hawkins (performer of the hit song “OH HAPPY DAY”)
  • The Platters
  • and many others
Minister Edwards is part of the pastoral staff at Saint Rebecca Primitive Baptist Church, Huntsville (Alabama) where he is Associate Minister and Pulpit Conductor for Revivals & Special Programs.
  
Agenda:
5:30 – 6:00 networking
6:00 – 6:30 dinner
6:30 – 7:15 intro & presentation
7:15 – 7:30 wrap-up 

 
Location: Adtran, 901 Explorer Blvd, Huntsville, Al
ADTRAN’s Fountain View Conference (2nd Floor, East Tower)
All meeting attendees must enter through the South entrance (adjacent to shipping dock).
 
Directions from I565:
  • Take exit 14B to Al-255N/Research Park Blvd
  • Take exit Bradford Drive West
  • Turn left Explorer Blvd (heading south)
  • Turn right into parking lot, merge left and follow parking lot to pond
  • Building entrance will be on north of parking lot
 
 
Dinner:   Catered by Adtran Café:
Italian
 
Meat Lasagna
Chicken Carbonara Pasta Bake
 
Served with:
Parmesan Cheese
Caesar Salad or Toss Salad
Sautéed Squash and Zucchini
Garlic Bread
Mini Cannoli’s
Sweet tea, Un-Sweet tea, and water
 
 
SMTA Members: $10  with RSVP
SMTA Non-Members: $13 with RSVP
No RSVP – Cash at the Door - $15
 
 
For members who cannot attend in person, we would like to offer a GoToMeeting option. Please contact us at HSVSMTA@gmail.com
 
Two ways to RSVP SMTA:  
RSVP ASQ-1503:  Brian Dunbar at brianmdunbar@gmail.com


March 6

Carolinas (NC, SC) Chapter: SMTA Carolinas Infosession on Conformal Coating  +

Location
GMI Manufacturing




SAVE THE DATE

On 06 March, we will explore Conformal Coating technologies including plasma etch, jetting, and two-part auto mixing with PVA at GMI in Mooresville, NC

Doors will open at 5:30 on Wednesday 06 March 2019


Preregister and save $5 or pay at the door with credit card, check, or cash
RSVP Todaysmta.org/chapters/rsvp.cfm?BEE_ID=4654
 
Image result for gmi mfg                         Related image



March 7

Atlanta Chapter: Chapter Meeting  +

Viscom



Statistical Trends in Counterfeit Electronic Supply Chains
 
It’s been over 10 years since the industry as a whole began to address the growing threat of counterfeit product in the electronic supply chain. Numerous standards, dozens of conferences, and untold presentations have been produced in an effort to educate our industry. After all that work, has there been a quantifiable impact across the supply chain or are we trying to address the wrong root causes?
 
Presentation By: Gary Beckstedt Director of Operations Flip Electronics
 
Gary Beckstedt heads the quality and inspection labs for the company as well as managing all logistics operations. Gary’s role requires him to institute and direct all quality management programs and processes as well as performing internal audits. Among his many challenges, Gary has the responsibility to ensure that Flip Electronics’ ISO/ANSI standards and certification programs, ESD programs, inspection and counterfeit detection process, and personnel training are all in compliance with their respective requirements and procedures. Gary helps to identify and track industry changes that affect the supply chain and supports the industry as a whole by serving on the G19-D committee that is tasked with maintaining the AS6081 standard. He is the company’s principal spokesperson in matters related to quality and methods of detection and abatement of counterfeit and suspect electronic parts. Gary is a US Air Force veteran, where he began his electronics career in 1989. He operated and maintained RADAR systems to support the Desert Storm and Desert Shield campaigns. He is a graduate of the AS9100D Lead Auditor program and an IPC Certified EMS Program Manager.
 
When: March 7, 2019
Where, Viscom Incorpoated 
1775 Breckenridge Parkway, #500
Duluth GA. 30096

Sign in and networking - 4:30
Dinner - 5:00 - 5:45
SMTA business and update 6:45 - 6:00
Presentation - 6:00 - 7:00

RSVP HERE
 


March 11

Wisconsin Chapter: Technical Meeting / Dinner Dave Vicari & Packaging Technologies and the Alternative Methods for Assembly  +

Location
Fox Valley Technical College- DJ Bordini Center



Please Join us on March 11th for a Technical meeting and dinner at Fox Valley Technical College.   Dave Vicari from Universal Intruments wil be discussing Packaging Technologies and the Alternative Methods for Assembly.   Check in / Registration is at 5:15pm,  Dinner at 6pm,  7pm Technical meeting and 8pm FVTC Campus Tour.

The electronics design, packaging and assembly industries are being challenged to adapt to the needs of mature industry sectors such as the military/aerospace/defense segment to the fast changing requirement of the wearables, IoT segments.  The result is the revolution of new materials that may or may not suitable for its intended application.  The AREA consortium and the APL lab have characterized and implemented these new materials in novel end products along with conducting applied research to understand the impact on manufacturing techniques.  This roadmap discussion reviews and discusses the materials, alternative assembly processes and the reliability that will enable manufacturers to produce novel devices to the market.


 


March 12 - 14

SMT Processes Certification (Guadalajara, Mexico)  +

Location
Guadalajara , JA Mexico


Co-located with Guadalajara Expo.

  • March 12- Course (8:30-5pm)
  • March 13- ½ day of course + exam
  • March 14- All day exam (8:30-5pm)

  • Instruction: English/Spanish
    Test: English
    Instructor: Ivan Castellanos


March 13

San Diego Chapter: 03/13/19 San Diego Chapter Meeting -fcLGA Package Assembly Qualification for Mobile Applications  +

Location
PSemi, 9369 Carroll Park Dr San Diego, CA 92121



fcLGA Package Assembly Qualification for Mobile Applications
Presented by
 Mumtaz Bora Sr. Staff Packaging Engineer at pSemi Corporation
Flip Chip Land Grid Array (fcLGA) packages are widely used in Mobile product applications due to their thin form factor and performance. Assembly process qualification requires careful selection of materials and optimization of reflow processes to make consistent and reliable product. The fcLGA typically uses an organic substrate on which the die is reflowed instead of the copper lead frame used in QFN packages. This requires assessment of CTE mismatch and controlled reflow processes to prevent bump separation .The paper reviews the selection of substrate, optimization of assembly process and reliability testing conducted for fcLGA package qualification. 
 
Speaker: Mumtaz Y. Bora has a B.S. in Chemistry and Material Sciences from University of Mumbai, India and University of Ottawa, Canada. She has a Master of Science in Interactive Telecommunications from University of Redlands, California. She has over 25 years of PWB, SMT assembly and advanced packaging development experience at IBM Endicott and IBM Austin, TX.  She has worked in new product development, and qualification of high volume handset assemblies at Qualcomm and Kyocera-Wireless Corporation.  She has worked with suppliers and subcontractors in several parts of Asia.  She is currently a Sr. Staff Packaging Engineer at pSemi for qualification of RFIC packages for wireless, broadband Automotive and Power applications. She is a member of IPC standardization committees and contributes to the standards development. She has 18 publications and 3 patents. She is the Past President of the SMTA San Diego chapter and Co-chair of the Moisture Sensitive Devices Council. She is currently the Publicity Chair for  IMAPS San Diego Chapter and Vice President of Communications at SMTA San Diego chapter.

RSVP by: 03/11/19
Members $5, Non-Members $15 (cash or check at the meeting)
Location:                   pSemi Corporation, 9369 Carroll Park Drive, San Diego, CA, 92121     (map)
                                    858-795-0112
Registration:            5:30PM
Dinner:                      5:45PM-6:45PM
Presentation:           6:45PM


March 14

Ohio Valley Chapter: SMTA Ohio Chapter - Selective Soldering Workshop  +

Location
Crown Equipment Corporation New Bremen, OH



     
 Technical program:
  • Pillarhouse - Jonathan Wol: Understanding fluxes and how they impact the selective soldering process.
  • Kurtz Ersa - Ernie Grice: Fundamentals of the soldering process as pertained to wave and selective soldering and outline why selective soldering is poised to become the standard for thru-hole soldering versus antiquated, black art of wave soldering.      
  • Laserssel - Denis Barbini: A Novel and Enabling Solution For Reflowing Challenging Mainstream and Alternative Electronics.  Presentation will provide step-by-step process development, material compatibility, reliability and productivity of this area laser selective reflow technique for mainstream and unique electronics designs.
  • MTA Automation - Will Hunter: Induction and Micro-Flame soldering and when to use them.
  • Facility tour of Crown Equipment Corporation electronic assembly operations.



March 14

Mexico - Juarez (Formation) Chapter: SMTA Juarez First Technical Seminar - 2019  +

Location
Centro de convenciones Cuatro Siglos,



 

¡El Capítulo de SMTA Juárez está de vuelta! Estamos organizando una gran reunión técnica el Jueves 14 de Marzo del 2019 para celebrar y nos gustaría invitarle a USTED a asistir.

 

Los usuarios de tecnología SMT (OEM, EMS, fabricantes contratados) están especialmente invitados a asistir. Si este capítulo va a sobrevivir en el futuro, necesitaremos su apoyo.

 

INFORMACIÓN IMPORTANTE:

Fecha: Jueves, Marzo 14, 2019

Hora: 5:30-9:00 p.m.  

Nota especial: Las puertas se abrirán a las 5:00. Tendremos varios sorteos para los Miembros Usuarios. ¡Llegue temprano para aumentar sus posibilidades de ganar un premio fabuloso!

Ubicación: Centro de Convenciones Cuatro Siglos

Direccion: Boulevard Juan Pablo II (Blvd. Cuatro Siglos) y Av. Arizona.

Ciudad Juárez 32402




March 18

Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects  +



Bob WillisMonday 18th March @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

The presentation provides a better understanding of solder paste selection and the use of stencil printing in modern fine pitch manufacture. Surface mount components are now at lead spacing of below 0.020″, only the correct selection of solder paste and specification of stencils can lead to effective printing. The session aims to provide a basic understanding of the design, production and quality control issues, both theoretical and practical issues of printing conventional surface mount and through hole for intrusive reflow.

Topics include:

  • Design of lands and apertures for fine pitch SMT & BGA
  • Through hole printing requirements
  • Selection of stencils
  • Evaluation of solder pastes
  • Practical machine set-up and trial prints
  • Elimination of board wash-off
  • Assessment of paste and stencil combinations
  • Solder paste inspection, measurement and quality control
  • Stencil Inspection and quality control
  • Cleaning stencils
  • Printed board requirements for printing fine pitch

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


March 19

Mexico - Querétaro Chapter: Technical Meeting - Students Chapter - SMT Processes Basics  +

Location
UTEQ



Este evento esta enfocado a estudiantes de Ingenieria, convocatoria abierta a todas las Universidades Locales.
Evento sin costo, Cupo limitado. Reserva tu asistencia !! 


March 19

Dallas Chapter: Dallas Expo and Tech Forum - March 19  +

Location
Plano Event Center



Register Now!

Click Here to Register for the Dallas Expo and Tech Forum!

Are you a...
  • Manager of Design or Manufacturing
  • Process engineer
  • Design Engineer
  • Supply Chain Professional
  • Purchasing
  • Test Engineer
  • Manufacturing or Test Technician

The Dallas Expo has everything you need to do with Design and Manufacturing of Electronics!

Event Details

  • Date: Tuesday, March 19, 2019
  • Time: Doors open at 8am
  • Location: Plano Event Center (2000 E. Sprint Creek Parkway, Plano, TX 75074)
  • Food: Complementary Lunch Buffet
  • More info: smta.org/expos/#dallas
  • Questions? Call Hannah Terhark at 952-920-7682

Technical Sessions

8:30AM
You Design & You Manufacture Complex Multilayer Circuits with 3D Printing 

Speaker: Ofer Maltiel, Nano Dimension
Bio: 
My driving passion in life is to help people succeed. The client’s goal is my first priority. Whether it's connecting them with an important contact or sharing from my 10 years’ experience as a hardware design engineer, I do whatever I can to help my clients thrive. Over the past 10 years, I've learned how to bring a product from the inception stage to life in various industries, cultivating lifelong relationships.

Abstract: The presentation will discuss innovative 3D printed electronics capabilities, including:
  • The role of additive electronics manufacturing in Industry 4.0
  • The increasing synergy between the additive manufacturing of electronics and the IoT
  • Industry timelines for production-scale 3D printed electronics
 
9:15AM
On-Going Cleanliness Testing on Production Hardware

Speaker: Mike Bixenman, Kyzen
Bio:
 Dr. Michael Bixenman (aka Dr. Mike) is known to many as the world’s leading expert in cleaning electronic circuit assemblies and advanced packages.  He is also one of the industry’s leading authorities on the design of electronic assembly, cleaning materials and process integration. In fact, Dr. Mike literally wrote the book on electronics manufacturing process cleaning standards (Cleaning & Contamination Process Guide).  
Abstract: The performance and cost advances over the past 20 years have enabled technologies to advance beyond what anyone could have imagined. In spite of these technology advances, the cleanliness standards that contractors rely on to ensure the design, production, and quality of next-generation Class 2 & 3 electronic hardware has remained unchanged. As technologies advance, the companies who build the device need guidance on what to do and how to do it.  
 
Flux residues trapped under low standoff leadless components on Pb-Free assemblies may still be active due to blocked outgassing channels, even when using a no-clean solder paste. Quantifying the risk of site-specific residues under problematic components is commonly done during the materials and process validation using chemical and electrical test methods. Process verification and validation are done to characterize and prove out the process on the materials used to build production hardware. Once the printed circuit assembly is placed into production, process control test methods to assure conformance are lacking. 


11:00AM
BGA’s, LGA
’s, QFN/DFN’s – Oh My, Can Traditional DFM Survive 
Speaker: Dale Lee, Plexus Corporation
Bio: 
Dale is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields.
Abstract: Today’s electronic product designs are rapidly increasing the use of bottom terminated components (BTC’s), whether they are collapsible/non-collapsible ball grid array (BGA), solder bump grid array (BGA?), land grid array (LGA), quad-flatpack no-lead (QFN) or dual-flatpack no-lead (DFN) component packaging technologies.  However, with some BTC package designs vary greatly in solder pad design and pitch within the same package.  This variability impacts the ability to incorporate good DFM practices and selection of applicable assembly workmanship rules for these and other standard BTC component package designs. This presentation will highlight impact elements these component technologies have on the assembly, cleaning and inspection processes and what actions can be made during the DFM and NPI process to minimize yield impacts on the manufacturing process.


1:30PM
Women in the Electronics Industry

Speaker: Billi Curtin, ITW Contamination Control Electronics
Bio: 
Women can’t be truly successful in the electronics industry, can they?  Billi Curtin sure thinks so. As a Regional Sales Manager for ITW Contamination Control Electronics, manufacturers of the Chemtronics, Techspray, and Plato brands, Billi is responsible for developing and executing the sales strategy of precision cleaners and associated consumables within the electronics market.

Abstract: It is not easy being a woman in the electronics industry.  We are strong ladies who have chosen to flaunt convention and work in a traditionally male-dominated field.  However in doing so, we often struggle with feelings of isolation, frustration, and anger. But why? Is it due to the patronizing comments from male coworkers, the gender wage gap, the lack of work-life balance, or simply because the “thick skin” you’ve had to develop over the years isn’t really that impervious?Regardless of the reasons, tapping into sources of empowerment, not blame, are key.

Completely bypassing social commentary on gender issues, this presentation will focus on tools and techniques to identify personal strengths and leverage them to neutralize gender-bias, silence your critics, avoid gender-based pitfalls without ostracism in the workplace, influence and lead (even without authority), and gain recognition and respect from your male counterparts.


3:00PM
Rework 101
Speaker:
 Viswam Puligandla
Get an exclusive look at the latest SMTA online training course, Rework 101, to close out the expo!
Bio: Industry veteran, Viswam Puligandla, Ph.D., will step through the basic rework process for both SMT and through-hole components. 
Abstract: Learn about critical temperature and moisture considerations, heating methods, types of acceptance criteria, and more. This course is intended for entry-level technicians or operators, engineers new to the industry, or even someone who has been away from the process for a while.
Topics Covered:

  • Rework, Repair and Modification Definitions
  • Rework Temperature Considerations
  • Moisture Sensitivity
  • Rework Equipment
  • Basic Process Steps
  • Rework Process Flow Chart Examples
  • Rework of Surface Mount Components
  • Rework of Insertion Mount Components
  • Board Repair
  • Acceptance Criteria
 

Thank you, sponsors!


Breakfast Sponsor - Precision Technology, Inc.


Technical Sessions Sponsor - Kurtz Ersa


Lunch Buffet Sponsor - NPI Technologies


Door Prize Sponsor - SVTronics


Tote Bag Sponsor - Element
 


March 19 - 21

SMT Processes Certification (Dallas, TX)  +

Location
Plano Center
Plano , TX 75074


  • March 19 Course (8:30-5pm)
  • March 20 ½ day of course + exam
  • March 21 All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience
  • The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


March 19

Dallas Expo & Tech Forum  +

Location: Plano Event Center
2000 E. Spring Creek Pkwy
Plano, TX 75074


Exhibitors

The Dallas Expo & Tech Forum is SOLD OUT! Please contact Expo Manager, Hannah Terhark, to be placed on the waitlist. 

The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. 

Important Exhibitor Materials:


Plano Convention Center - Dallas See You at the Plano Centre! 2000 E. Spring Creek Pkwy, Plano, TX 75074

 

 

Book a discounted room rate at the Hilton Garden Inn Dallas/Allen by February 25, 2019.

705 Central Expressway South, Allen, Texas, 75013, USA

Group Code: SMTA GROUP

214-547-1700

Book Rooms Today!  



Attendees

Free Technical Program & Schedule:

7:30am

Registration Opens

8:30am

You Design & You Manufacture Complex Multilayer Circuits with 3D Printing

Ofer Maltiel, Nano Dimension

Bio: My driving passion in life is to help people succeed. The client’s goal is my first priority. Whether it's connecting them with an important contact or sharing from my 10 years’ experience as a hardware design engineer, I do whatever I can to help my clients thrive. Over the past 10 years, I've learned how to bring a product from the inception stage to life in various industries, cultivating lifelong relationships.


Abstract: The presentation will discuss innovative 3D printed electronics capabilities, including:

  • The role of additive electronics manufacturing in Industry 4.0
  • The increasing synergy between the additive manufacturing of electronics and the IoT
  • Industry timelines for production-scale 3D printed electronics

 

9:15am

On-Going Cleanliness Testing on Production Hardware

Mike Bixenman, Kyzen

Bio: Dr. Michael Bixenman (aka Dr. Mike) is known to many as the world’s leading expert in cleaning electronic circuit assemblies and advanced packages.  He is also one of the industry’s leading authorities on the design of electronic assembly, cleaning materials and process integration. In fact, Dr. Mike literally wrote the book on electronics manufacturing process cleaning standards (Cleaning & Contamination Process Guide).  


Abstract: The performance and cost advances over the past 20 years have enabled technologies to advance beyond what anyone could have imagined. In spite of these technology advances, the cleanliness standards that contractors rely on to ensure the design, production, and quality of next-generation Class 2 & 3 electronic hardware has remained unchanged. As technologies advance, the companies who build the device need guidance on what to do and how to do it.  
 
Flux residues trapped under low standoff leadless components on Pb-Free assemblies may still be active due to blocked outgassing channels, even when using a no-clean solder paste. Quantifying the risk of site-specific residues under problematic components is commonly done during the materials and process validation using chemical and electrical test methods. Process verification and validation are done to characterize and prove out the process on the materials used to build production hardware. Once the printed circuit assembly is placed into production, process control test methods to assure conformance are lacking. 

 

10:00am

Expo Opens

 

11:00am

BGA’s, LGA’s, QFN/DFN’s – Oh My, Can Traditional DFM Survive  

Dale Lee, Plexus Corporation 

Bio: Dale is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields.


Abstract: Today’s electronic product designs are rapidly increasing the use of bottom terminated components (BTC’s), whether they are collapsible/non-collapsible ball grid array (BGA), solder bump grid array (BGA?), land grid array (LGA), quad-flatpack no-lead (QFN) or dual-flatpack no-lead (DFN) component packaging technologies.  However, with some BTC package designs vary greatly in solder pad design and pitch within the same package.  This variability impacts the ability to incorporate good DFM practices and selection of applicable assembly workmanship rules for these and other standard BTC component package designs. This presentation will highlight impact elements these component technologies have on the assembly, cleaning and inspection processes and what actions can be made during the DFM and NPI process to minimize yield impacts on the manufacturing process.

12:00pm

Lunch Buffet

 

1:30pm

Women in the Electronics Industry

Billi Curtin, ITW Contamination Control Electronics 

Bio:  Women can’t be truly successful in the electronics industry, can they?  Billi Curtin sure thinks so. As a Regional Sales Manager for ITW Contamination Control Electronics, manufacturers of the Chemtronics, Techspray, and Plato brands, Billi is responsible for developing and executing the sales strategy of precision cleaners and associated consumables within the electronics market.

Abstract: It is not easy being a woman in the electronics industry.  We are strong ladies who have chosen to flaunt convention and work in a traditionally male-dominated field.  However in doing so, we often struggle with feelings of isolation, frustration, and anger. But why? Is it due to the patronizing comments from male coworkers, the gender wage gap, the lack of work-life balance, or simply because the “thick skin” you’ve had to develop over the years isn’t really that impervious?Regardless of the reasons, tapping into sources of empowerment, not blame, are key.

Completely bypassing social commentary on gender issues, this presentation will focus on tools and techniques to identify personal strengths and leverage them to neutralize gender-bias, silence your critics, avoid gender-based pitfalls without ostracism in the workplace, influence and lead (even without authority), and gain recognition and respect from your male counterparts.

3:00pm

Expo Closes

3:00pm
Rework 101

Viswam Puligandla 


Get an exclusive look at the latest SMTA online training course, Rework 101, to close out the expo!


Bio: Industry veteran, Viswam Puligandla, Ph.D., will step through the basic rework process for both SMT and through-hole components. 


Abstract: Learn about critical temperature and moisture considerations, heating methods, types of acceptance criteria, and more. This course is intended for entry-level technicians or operators, engineers new to the industry, or even someone who has been away from the process for a while.


Topics Covered:

  • Rework, Repair and Modification Definitions
  • Rework Temperature Considerations
  • Moisture Sensitivity
  • Rework Equipment
  • Basic Process Steps
  • Rework Process Flow Chart Examples
  • Rework of Surface Mount Components
  • Rework of Insertion Mount Components
  • Board Repair
  • Acceptance Criteria

Thank you to our Breakfast Sponsor:

PTI

Thank you to our Technical Sessions Sponsor:

Thank you to our Door Prize Sponsor:

Thank You to Our Lunch Sponsor:

 

Thank You to Our Tote Bag Sponsor:

Element Materials


March 21

Houston Chapter: Houston Expo & Tech Forum  +

Stafford Center



Please join us for our 2019 Houston SMTA Expo & Tech Forum at the Stafford Centre, 10505 Cash Road, Stafford, Texas 77477.  If you look forward to seeing the latest products and services in the industry and an opportunity to enjoy presentations by experts in our profession, you won’t want to miss this show!

 

Come see over 60 local and national tabletop exhibitors. Free lunch from 12:00 Noon to 12:45 P.M catered by Kelley's Country Cookin and lots of chances to win door prizes. We’ll also have drawings after each technical session. You must be present to win.

 

This is a free show for attendees. We are pleased to offer another outstanding technical program with information and technology presented by industry leaders to keep your skills up to date!

 

To register for the show, go to http://www.smta.org/expos/#houston and register in the attendee section.




March 21

Houston Expo & Tech Forum  +

Location: The Stafford Centre
10505 Cash Road
Stafford, TX 77477



Exhibitors

The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $50 per booth. Early bird expires on February 21, 2019!

 

 

Discounted Hotel Rooms - Available Here:

Hampton Inn Stafford - SMTA Expo Houston



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Thursday, March 21, 2019
10:00AM–3:00PM

 

8:00am

Registration Opens

 

10:00am

Expo Hall Opens

 

11:00am-11:45am

"What is Additive Manufacturing of Electronics? What Can Be Done Today? How Does it Enable the Electronics of Tomorrow?"

Speaker: Simon Fried, Nano Dimension USA

The presentation will introduce innovative precision 3D printed electronics capabilities, including: The potentially revolutionary role of additive manufacturing of electronic circuits and electromechanical parts.  The ‘factory in a box’ allows for rapid in-house iterations and manufacturing saving time, allowing for completely new design freedoms and ensuring that IP security is total. Learn about how additive can allow designers to make the unmakeable.

 

12:00pm

COMPLIMENTARY Lunch

 

Thank You to Our Lunch Sponsor:

 

1:00pm-1:45pm 

"On-Going Cleanliness Testing on Production Hardware."

Speaker: Mike Bixenman, KYZEN Corporation

The performance and cost advances over the past 20 years have enabled technologies to advance beyond what anyone could have imagined. In spite of these technology advances, the cleanliness standards that contractors rely on to ensure the design, production, and quality of next-generation Class 2 & 3 electronic hardware has remained unchanged. As technologies advance, the companies who build
the device need guidance on what to do and how to do it.

 

2:00pm-2:45pm 

"The X-Factor - How X-Ray Technology is Improving the Electronics Assembly Process."

Speaker: Bill Cardoso, Ph.D., Creative Electron, Inc.

It was 1895 when Wilhelm Roentgen discovered a mysterious light that allowed him to see through things – and called it x-rays. Since then, x-rays have been adopted in a wide range of applications in the electronics assembly process. Instead of taking a “deep-dive” in one aspect of x-ray inspection, in this presentation we’ll cover a broad range of applications:

-          Electronic component inspection and failure analysis.

-          Component counting and material management.

-          Reverse engineering.

-          Counterfeit detection.

-          Real-time defect verification.

-          Computed tomography (CT) techniques and how to differentiate between 2D, 2.5D, and 3D x-ray inspection.

-          Design for manufacturing (DFM) and design for x-ray inspection (DFXI).

-          Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC).

We will also discuss how artificial intelligence (AI) is changing the way we think about x-ray inspection. Things we would never dream of doing just a few years ago are now reality by combining AI and x-ray inspection. Moreover, we will show you a series of real-life cases on how our team of AI scientists is using AI to solve the most challenging applications in x-ray inspection. And beyond x-ray inspection, we’ll examine how AI is forever changing the way we manufacture and inspect things.

 

3:00pm

Expo Closes


March 26

Intermountain (Boise) Expo & Tech Forum  +

Location: Boise State University
Student Union Building - Jordan D Ballroom
1910 University Drive
Boise, ID 83725



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on Feburary 22nd, 2019!

Important Exhibitor Materials:



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
 


March 28

Capital Chapter Tutorial Program - "Supporting High Reliability at the OEM: A PCB Perspective"  +

Location
Country Inn & Suites
Linthicum Heights , MD 21090



Instructors: Yaad Eliya and Jim Barry, PCB Techologies

March 28, 2019

9:00 a.m. - 3:00 p.m.
Country Inn & Suites
1717 West Nursery Road
Linthicum Heights, MD 21090
(443) 577-1036
 
Price:
  • Members: $200
  • Non-Members: $400
  • Capital Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $80


Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

Topics Covered:

  • Solderability Issues from the PCB Fabrication Perspective
    - Speaker:  Yaad Eliya
    - Synopsis:
       *  The speaker will discuss the PCB Manufacturing process and how it has a direct effect on the solderability process
        *  Items such as plating technique (DC plating vs. Reverse plating), Final finished and other processes that effect the assembly
     
  • Design for Reliability
    - Speaker:  Yaad Eliya
    - Synopsis:
        *  The speaker will discuss how design aspects can directly affect the reliability of the raw card at the assembly level
        *  Items such as Non-functional pads, via-fill, cross hatched grounds, conductor routing, PTH preparations, etc. -- and their effects on reliability
     
  • RF/Microwave Design Considerations and Options
    - Speaker:  Yaad Eliya
    - Synopsis:
        *  The speaker will discuss the Do's and Don'ts for RF & Microwave success
        *  Items such as materials, lamination cycles, Single vs. double cavities and "Air Cavity" for varying frequencies will be discussed
     
  • Thermal Mitigation Options at the Raw Card Level
    - Speaker:  Jim Barry
    - Synopsis:
        *  The speaker will discuss the options available for Thermal mitigations at the raw card level
        *  As designs get smaller and faster, high temperature is becoming a big issue - we will look at Materials, Heatsinks and Coins to help mitigate heat


About the Instructors:
Yaad Eliya

CTO, R&D and Technology Manager

  • Working in PCB Technologies for the last 12 years
  • B.Sc. Engineering at Ben-Gurion University of the Negev
  • Electronic Materials Expert, with especially at Rigid Flex, RADAR/Microwave and RF applications
  • Process and machinery design & architecture manager, in the PCB industry
  • Responsible for R&D and special application development, for Medical/Space & Military segments
  • Expert as "tailor made" in design stage application, and a leader in all prototypes when move from R&D to mass production
  • Background and experience - TOWER Semiconductor/Engineering & Photolithography Expert (MUV/DUV)

Jim Barry

Solutions Architect and North American Sales Manager - PCBT

  • Printed Circuit Industry veteran for over 39 years - proficient within the disciplines of Engineering, Manufacturing & Sales...  PCB Technologiest including Design, Assembly and Box build...
  • Experienced professional; trained in mechanical engineering, PCB applications, materials and failure analysis.  Working knowledge of IPC, MIL NADCAP, AS9100 and other applicable industry specifications
  • Held various positions within the PCB Industry ranging from Manufacturing, R&D, Sales & Marketing, Engineering, as well as Corporate and Executive levels within various companies
  • Today working as a lead consultant for the world's leading Israeli PCB/PCBA manufacturing operation of High-Density Electronics for Mil/Aero & medical applications

 

Sponsored jointly by SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine

SMTA Capital Chapter    Circuits Assembly


Contact Karen Frericks at 952.920.7682 with questions.
 


April 1 - 4

Electronics in Harsh Environments Conference  +

Location
Amsterdam Netherlands


The conference will focus on building reliable electronics used in power electronics and harsh environments.


April 2 - 4

Electronics in Harsh Environments Expo  +

In conjunction with the Electronics in Harsh Environments Conference

Location: Radisson Blu Hotel Amsterdam Airport
Boeing Avenue 2
Schiphol-Rijk
Amsterdam NL-1119 PB



Exhibitors

Exhibit Hours:Download the Application

Tuesday, April 2: Afternoon

Wednesday, April 3: Full Day

Thursday, April 4: Morning

 

Exhibitor Table Top Options:

(Inside the Conference Room - Limit 9)
$1550 | €1350 (+21% Dutch VAT)

  • Utilize your time the best by being inside the room! Get in front of our attendees the whole conference and make sure you don’t miss out on the action!
  • Includes: one 3m draped table, two chairs, company table tent, lunch, program listing, and electricity.
  • One complimentary conference registration (a €725 value!)

(In the Foyer – Limit 10)
$1225 | € 1050 (+21% Dutch VAT)

  • Promote your company in our private foyer! All refreshment breaks as well as the reception take place here.
  • Includes: one 3m draped table, two chairs, company table tent, lunch, program listing, and electricity.
  • One complimentary conference registration ( a €725 value!)

Sponsorship Opportunities:

  • Premier Conference Sponsor - $2000/€1780 (limit 2)
  • Reception Sponsor - $1700/€1525 (limit 2)
  • Keynotes Sponsor -  $700/€625 (limit 1)  SOLD OUT
  • Lunch Sponsor - $500/€425 (limit 3)
  • Refreshment Break Sponsor - $500/€425 (limit 4)
  • Lanyard Sponsor $200/$400 (limit 1)


April 2

West Penn Expo & Tech Forum  +

Location: DoubleTree Monroeville
101 Mall Plaza Blvd.
Monroeville, PA 15146



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on March 1, 2019!
 

 

Discounted Hotel Rooms - Available Here:

DoubleTree by Hilton - Monroeville



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Tuesday, April 2, 2019
10:00AM–3:00PM

 

Thank You to our Lunch & Refreshment Sponsor:


April 3

Space Coast Chapter Tutorial Program: "Solder Paste - Your SMT Line’s Gray Matter"  +

Learn what it is and how to choose it, print it, reflow it and clean it

Location
Mack Technologies
Melbourne , FL 32904



Instructors: Phil Zarrow & Chrys Shea

April 3, 2019

9:00 a.m. - 4:30 p.m.
Mack Technologies
7505 Technology Drive
Melbourne, FL 32904
(321) 725-6993

Registration Deadline is March 15!
Price:
  • Members: $200
  • Non-Members: $400
  • Space Coast Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $80 

Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
 

The Chrys and Phil Show

Brought to you by two serious industry experts who don't take themselves too seriously, Phil Zarrow and Chrys She.  Together, they combine over six decades of SMT experience, hundreds of publications and dozens of awards.  Phil brings vast experience and insight, Chrys brings the data from indepndent research, and both of the like to deliver their knowledge in fun, interactive environments.

Pre-requisites:

  • Some SMT assembly process experience
  • A working sense of humor

Come to the BRAND NEW Space Coast Tutorial to learn:

Solder Paste

Solder Paste - what is it?

  • How it is made, particle size classifications
  • How it behaves - viscosity, thixotropy, rheology
  • Balancing performance properties and why every formulation is different
  • 25 paste characteristics that affect SMT line performance
  • Finding the right product for the job
  • Environmental and handling considerations

BREAK

Printing

Stencils - aperture rules (5 ball rule, area ratio...)

Stencils - techniques and materials (fine grain ss, nano, etc.)

Printing mechanics

  • Printing considerations and parameters
  • Gasketing
  • Coining
  • Support
  • Stencil cleanliness

Troubleshooting Printing Related defects

Factory Tour of BlueRing Stencils and LUNCH

Solder Paste Inspection

  • SPI Basics
  • Types of SPI technologies
  • Reasons for deploying
  • Implementation tips
  • Setting tolerances
  • Understanding thresholds

BREAK

Reflow Soldering

  • Methodologies:  Vapor phase, convection, laser
  • Profile Objective
  • Profile shapes (Straight ramp, ramp-soak-spike classic, Shoulder)
  • Solder Paste/solder behavior during reflow

Troubleshooting common defects:

  • Shorts
  • Opens
  • Solder balls
  • Tombstones
  • Head-In-Pillow
  • Voiding

Cleaning (time permitting)

  • Why clean - pictures of dendrites and corrosion
  • NC vs OA
  • Why clean the no-clean?
  • ROSE testing vs ion chromatography
  • The importance of monitoring the cleaning process

Q&A



About the Instructors:

Chrys Shea Chrys Shea
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is an SMTA “Member of Technical Distinction” and three time SMTAI “Best of Conference” award winner for her research on solder paste printing. Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees.

Phil Zarrow

Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years.  His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies.  In addition to his background in reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems.  Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throught the world.  During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.

Since forming ITM Consulting in 1993, Phil Zarrow has helped numerous clients in such areas as

  • SMT Implementation and Assembly facility set-up
  • SMT Assembly and Soldering Failure Analysis
  • EMS/Supplier Process and Quality Assessment Audits
  • Counterfeit Component Avoidance and Interception Programs
  • Manufacturing yield improvement
  • Equipment Evaluation and Selection
  • No-clean and lead-free solder paste evaluation and process implementation
  • SMT Manufacturing Process Audits and process improvement
  • On-site training for all levels of personnel
  • Design for Manufacturability (DFM) specification development
  • Reflow of Through-hole feasibility, development and implementation
  • Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
  • SMT process equipment benchmark testing and evaluation
  • SMT product development
  • Lead-free Process Implementation and Optimization
  • Technical evaluations related to business acquisitions and mergers
  • Technical assistance in legal disputes

Mr. Zarrow is a popular speaker and workshop instructor.  He has chaired anbd instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim.  He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books.  He is co-author of the book, "SMT Glossary- Terms and Definitions".  Mr. Zarrow holds two US Patents concerning PCB fabricationa dn assembly processes and audit methodologies.

Phil is a member of IPC, SMTE, IMAPS, a co-founder of ITM Consulting, and is a past national level officer and national director or the Surface Mount Technology Association (SMTA).  He was also Chairman of the Reflow Committee for SMEMA.  He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders' Award (2000).  Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forfront" and "Better Manufacturing" columms.  He is currently producer and co-host of IPC Update's "Boardtalk" audio program.

 

Contact Karen Frericks at 952-920-7682 with questions.



April 9

Empire (Rochester, NY) Chapter: SMTA EMPIRE Chapter EXPO 2019  +

Location
Holiday Inn Syracuse-Liverpool (I-90 Exit 37)



DATE CONFIRMED!

IPC Hall of Famers Dave Hillman and Doug Pauls from Rockwell Collins will be the featured speakers at our 2019 EMPIRE Expo Event!  Their electronics assembly topics of wisdom include:                                                                        
  • BGA Solder Joints
  • Bottom Terminated Components
  • Voids
  • Mixed Lead Free and Tin Lead Soldering
  • New Cleanliness Standards, J-STD-001 Requirements 

Your vote counts!  Please participate in our online survey where you get to choose the technical program topics you want to hear about.  https://www.surveymonkey.de/r/9WLTBDT

To register as an attendee or exhibitor, please visit:
https://www.smta.org/expos/#empire


Stay tuned to the SMTA Empire Chapter website for posted updates regarding this event!


April 9

Empire Expo & Tech Forum  +

Location: Holiday Inn Syracuse/Liverpool
441 Electronics Parkway
Liverpool, NY 13088



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early registration expires on March 8th, 2019!

Important Exhibitor Materials:

Book a discounted room rate at the Holiday Inn Syracuse-Liverpool by March 9, 2019.

Group Code: SMTA

315-457-1122

Book Rooms Today!  



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Wednesday, April 9, 2019
10:00AM–4:00PM

 


April 10

San Diego Chapter: 04/13/19 SMTA Chapter Meeting  +

Location
Palomar Technologies Inc. 2728 Loker Ave West, Carlsbad CA 92010



Palomar Techologies will be presenting a white paper with a live demo and factory tour...
Date: 04/10/19
Registration: 5:30PM
Dinner: at 5:45PM
Presentation: 6:45PM

$5 Members and $15 Non Members
Location: Palomar Technologies Inc., 2728 Locker Ave West, Carlsbad CA 92010
 


April 11

Atlanta Chapter: Atlanta SMTA 23RD Annual EXPO  +

Location
*******NEW LOCATION***** TECH PARK ATLANTA 107 Technology Pkwy NW, Peachtree Corners, GA 30092 *******NEW LOCATION*****



SMTA EXPO, April 11, 2019
For 22 years the SMTA Atlanta Chapter has worked very hard to organize a best-in-class event for our local and regional  SMTA exhibitors and visitors. Our chapter is well known for many reasons and our Expo has always been on top of the list. Every year Atlanta SMTA chapter officers and volunteers put their heads together to try and create a show with something for everyone. The combination of business and networking opportunities is a proven recipe for success  - and this year will be no different.
 
Our traditional venue at the Infinite Energy Center is going through some major renovations and for that reason, among others, we are relocating in 2019 to Atlanta Tech Park.  Conveniently located in the Peachtree Corners/Norcross area where “Atlanta high-tech” began back in the 70's, the facility is new and spacious. Exciting new features for exhibitors include video monitors throughout the show floor where your ads can be running continuously during the show. 

The new venue also allows us to choose our own catering company which means a hot buffet lunch and a beer/wine reception at the end of the show. No more box lunches.
 
We are finalizing the technical program and should have details soon. Pete Waddell will be back with his Designers Round Table plus more technical sessions to be announced.


We are very excited about our local charity partner this year. Canine Assistance has been training service dogs for over 27 years in Alpharetta. They have an incredible history and story to tell. Come to the Expo to meet some of their beautiful furry students!  

 
The following sponsorship opportunities still exist.
5 Reception Sponsorships - $100,00. Included: Signage in your booth and on digital as well as mention on SMTA website and in show guide.

  https://www.smta.org/chapters/files/SMTApostcardrev3.pdf
 
 


April 11

Rocky Mountain (Colorado) Chapter: Business After Hours at Advanced Circuits  +

Location
21101 E. 32nd Parkway Aurora, CO 80011



SAVE THE DATE!
The SMTA Rocky Mountain Chapter
After Hours Meet & Greet Event on April 11, 2019
3:00-6:00PM
Hosted by: Advanced Circuits

  




Join us for an SMTA After Hours Meet & Greet event at Advanced Circuits.  Enjoy a tour of the facility and a presentation by Isola Group, manufacturer of pre-pregs and laminate materials used in fabricating printed circuit boards.  Refreshments will be provided.  More information to follow.



April 11

Atlanta Expo  +

Location: *NEW LOCATION* Atlanta Technology Park
107 Technology Parkway
Peachtree Corners, GA 30092



Exhibitors

The cost to exhibit for corporate members is $375/$475 (Early/Late) and $450/$550 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Early registration expires on March 8th, 2019!

Important Exhibitor Materials:

Book a discounted room rate at the Hyatt Place by March 13, 2019.

5600 Peachtree Parkway Norcross, Georgia, United States, 30092

Group Code: SMTA 

770-416-7655

Book Rooms Today!  



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

 

THANK YOU TO OUR REFRESHMENT BREAK SPONSOR:

 

THANK YOU TO OUR LUNCH SPONSOR: 

ITS

THANK YOU TO OUR SNACK SPONSOR:

 

THANK YOU TO OUR RECEPTION SPONSOR: 


April 29

Webinar: Flexible Circuit Board Design & Assembly with Lead-Free Alloys  +



Bob WillisMonday 29th April @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Flexible circuits is another packaging technology which has seen a growing and wider acceptance in the electronics industry. The advantages of surface mount reduced weight; decreased size can be further enhanced by flexible circuitry. In many cases, it is a misconception that flexible circuits have to flex, they don't; many flexibles are designed purely to aid the circuit design and assembly into the final product. In this case the substrate is only flexed or formed once. The range of constructions for circuit manufacture are wide but the basics are similar to existing printed circuit production. The design and selection of the manufacturing methods can affect the final cost of the circuit and need to be considered in detail prior to manufacture. Where design departments have limited experience useful reference material is available to engineers worldwide with the release of Flexible Circuit Technology, Third Edition by Joe Fjelstad and other publications.

 

Topics include:

  • Flexible Design for assembly
  • Manual assembly and soldering
  • Automatic assembly process requirements
  • The need for baking flexible circuits
  • Flexible circuit pallets for automatic assembly
  • Screen printing, placement, reflow soldering & AOI
  • Manual hand soldering and de-soldering
  • Rework of conventional and surface mount
  • Solder joint Inspection
  • Process defects on flexible circuits and during assembly

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


May 2

Carolinas Expo & Tech Forum  +

Location: DoubleTree by Hilton - Research Triangle Park
4810 Page Creek Lane
Durham, NC 27703



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on April 1, 2019!

 

 

Discounted Hotel Rooms - Available Here:

DoubleTree by Hilton - Research Triangle Park



Attendees

Exhibit Hours:
Thursday, May 2, 2019
10:00AM–3:00PM

Free Program and Technical Schedule Coming Soon!

 


May 3

Dallas Chapter: LED Do’s and Don’ts  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



LED Do’s and Don’ts

Speaker: Matt Osborne, Regional Territory Manager, Trans-Tec America

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on May 3, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!



Abstract

What to do and not to do with LEDs in a surface mount process including Paste printing, Stencil Design, picking, placing, Reflow, and test.

Biography

Matt Osborne
Trans-Tec America
Territory manager
  • Attended University of Delaware.
  • Worked for Motorola in Shaumburg, IL as a SMT Manufacturing Engineer.
  • Worked for Allied Signal in DOD environment as a SMT Manufacturing Engineer.
  • Worked for Quad Systems as a Field Service Engineer.
  • Engineer for Decatur Electronics in microwave radar.
  • Redesigned to Jugs professional radar gun used by Major League Baseball.
  • Opened his own contract manufacturing business, Contract Assembly Service, Inc.
  • Vice President of American Circuits located in Charlotte, NC.
  • Director of Engineering. The Light Source, Inc. – Design and manufacturing of high-end theatrical stage lighting.
  • Trans-Tec America territory manager.



May 7

Wisconsin Expo & Tech Forum  +

Location: Milwaukee Airport Crowne Plaza
6401 S 13th St,
Milwaukee, WI 53221


Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Please contact Steve Stiller at steve@midwestproductionllc.com for questions or for additional information.



Attendees

Attendees can register on the SMTA Wisconsin Chapter page.

Please see the Wisconsin Chapter Page for More Information on Technical Sessions and Expo Materials.


May 9

Huntsville Expo & Tech Forum  +

Location: Stone Event Center/ Campus 805
2620 Clinton Avenue
Huntsville, AL 35805



Exhibitors

The cost to exhibit for corporate members is $375/$475 (early/late) and $450/$550 (early/late) for non-corporate members. The cost to exhibit includes: one 6ft draped table, two chairs, company sign, directory listing and attendee list. Electricity is an additional $30 per outlet. Earlybird pricing expires April 12th, 2019! 

Important Exhibitor Materials:

Book a discounted room rate at the Springhill Suites by Huntsville Downtown  by April 17, 2019.

 745 Constellation Place Drive SW, Huntsville, Alabama 35801 USA

Group Code: SMTA 

256-512-0188

Book Rooms Today!  

 



Attendees

Free Technical Program & Schedule:
8:00AM
Registration opens
 

More information to follow...

 

THANK YOU TO OUR REFRESHMENT BREAK SPONSOR:


May 16

Puget Sound Expo & Tech Forum  +

Location: DoubleTree by Hilton Seattle Airport
18740 International Boulevard
Seattle, WA 98188



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $40 per outlet. Early bird pricing ends on April 12, 2019!

 

 

Discounted Hotel Rooms - Available Here:

DoubleTree by Hilton Seattle Airport



Attendees

May 20

Webinar: Successful X-Ray & Optical Inspection in a Tin/Lead or Lead-Free Process  +



Bob WillisMonday 20th May @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Area Array Technology is part of mainstream electronics but until recently very few good inspection criteria were available in the industry. The assembly process for BGAs is fairly well understood for Tin/Lead alloys but with the move to Lead-free assembly, new QFN and LGA packages have critical issues to consider during inspection. The webinar covers optical and x-ray inspection of solder joints for both Tin/Lead and Lead-free terminations. It includes an introduction to the Lead-free assembly process with specific attention to BGA and area array devices. It provides a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces.

 

Topics include:

  • Procedures for inspection joints optically and by x-ray
  • Inspection criteria for joints
  • Identification of key joint features
  • Other indicators of possible failures
  • Common BGA & bottom mounted failures

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


May 21

Medical Electronics Sponsorship and Table Top Exhibit  +

Elyria, OH



Exhibitors

Reasons to Participate

Click here to see why you should participate!

 

Sponsorship Information

Sponsoring this event will provide a valuable opportunity to promote your company brand and product/service message to attendees, while supporting your business development and positioning goals. For benefits and pricing click on the link below. For more information contact SMTA, medical@smta.org or call 952-920-7682.

View Sponsorship Benefits

 

Advertising Opportunities

Include your ad in our show directory to get more exposure for your company. Full page and half page ad space is available, black and white only. The deadline to submit your ad is April 15, 2019. *If you wish to pay through our secure server please use the "Register to Sponsor or Exhibit" button above. For a printable application form, click here.

 

Exhibiting Information

The conference will include an exhibition area featuring 25+ tabletop displays that will be open during conference breaks plus after hours.

Exhibit benefits:

  • 1 admission to symposium
  • 6 ft. Draped table
  • Two chairs
  • Attendee list
  • Company sign
  • Breakfast, Lunch & Breaks
  • Copy of the electronic conference proceedings

 

View the floorplan!

Floor Plan for Medical Electronics Symposium Tabletop Expo 2019

 

Exhibit Pricing:
Member* (*MEPTEC/SMTA): $550
Non-member: $650


Exhibit Hours:
May 21: 10:00am – 5:00pm


Please note that exhibit traffic will be minimal while symposium is in session. Please e-mail SMTA at medical@smta.org or +1-952-920-7682 for sponsorship or exhibitor information.



Attendees

 

Exhibit Hall Hours:

May 21: 10:00am – 5:00pm
To Register for the technical conference, click here.


May 21 - 22

Medical Electronics Symposium 2019  +

Location
Lorain County Community College
Elyria , OH


2019 Symposium Details Coming Soon

The human body is an extremely complex "electrical (neurological) system", with companies continuing their quest to understand and improve capability as related to neural interface, basically connecting the human body directly into computers! There is no question, capabilities in smart phone/watch technologies connected to the internet erases any doubt of the potential to connect people to computers.

With the brain being the human equivalent of the "MicroProcessor", semiconductor companies such as IBM, Intel, MicroChip and MicroSemi have been well aware of potential for connectivity. Others have taken knowledge of neural interface to help humans manage their internal electrical systems, including Medtronic, Philips and Abbott, with a range of pacemakers, defibrillators and neural therapies.

Expanding the potential scope of linking the brain to computers and to the internet has attracted the likes of Amazon, Apple, Facebook, Google, MicroSoft, Neuralink and others, adding to the list that already includes J&J, G.E., T.I., Stryker, and Edwards. MicroProcessors and other ASIC Chips, coupled with MEMS and Sensors, are now seen as the “next big thing” over the next 5 years looking at the Internet of Things.

 

This event will bring together experts to cover topics such as:

* Forecasting and Analytics

* MEMS, Sensors and Integrated Circuits

* Implantable Devices and Neural Interface

* Medical Robotics, Equipment, and Prosthetics

* Advanced Materials and Reliability

 



June 4 - 6

International Conference for Electronics Enabling Technologies 2019  +

Location
Markham , ON Canada


The International Conference for Electronics Enabling Technologies (ICEET), formerly ICSR, is a highly technical three-day event in Toronto, ON, Canada.

Electronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.

 

Value Proposition for Participation

  • Broaden your knowledge of the wider enabling technologies
  • Deepen your skills on traditional soldering and electronics
  • Access to local engineering and science talent
  • Opportunities for cross-sector collaboration/innovation
  • Industry exposure to your work – generate interest, support, awareness & excitement
  • Build network and local-ecosystem that aligns various needs and service providers
  • Access to IBM ventureLAB 
  • Recognition for Best Conference Paper


June 5

SMTA Ontario Chapter Expo & Tech Forum  +

In conjunction with the International Conference for Electronics Enabling Technologies (ICEET)

Location: Venture Lab
3600 Steeles Ave. East
C-C106
Markham, ON L3R 927



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on May 3, 2019!  

 



Attendees

 


June 7

Dallas Chapter: New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA’s and PCBF’s  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBA’s and PCBF’s

Speaker: Robert Boguski, President, Datest

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on June 7, 2019
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

Get your tickets!

Abstract

Digital Computed Tomography, or CT Scanning, has advanced in equipment and techniques to such an extent that it has now become the method of choice in many applications where workmanship, fabrication, and component defects are difficult and sometimes otherwise impossible to find.
This presentation will discuss the current state of the technology (hardware as well as software); some of the basic physics underlying the methodology; and relative strengths and weaknesses of CT Scanning versus other methods, from the standpoint of results as well as cost. Numberous examples will be shown, with emphasis on PCBA and PCBF failure analysis and defect detection.


Biography

Robert Boguski, President, Datest

1981 graduate of The University of San Francisco (BA Economics).  Robert has worked in the electronics packaging and interconnect manufacturing and testing business, primarily in management positions, since he was a teenager (1975).  22 years in the bare board business, 12 years in the EMS business, and 14 years in the testing and test engineering business (Some overlap with EMS).  Robert is the Owner and President of Datest, a test engineering and failure analysis company located in Fremont, California.  Robert and/or his Company, Datest, are members of SMTA, IPC, and IEEE.  Datest is also a member of the American Society for Nondestructive Testing (ASNT) as well as the Eurpoean Institute of Printed Circuits (EIPC).  Since 2013 Robert has co-authored the Test and Measurement column for Circuits Assembly Magazine.  Robert is also currently the President of the SMTA Silicon Valley Chapter.




June 17

Webinar: Lead-Free Selective Soldering, Design, Quality Control & Practical Defect Solutions  +



Bob WillisMonday 17th June @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

For many organisations through hole components will remain a reality for many years. More and more surface mount components are used in design, through hole is in decline, however the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products. So what is the most reliable and cost effective solution to through hole soldering in a lead-free environment? Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities with lead-free and high temperature solder alloys.

 

Topics include:

  • Why use selective soldering
  • PCB design rules for selective soldering
  • Flux requirements for selective soldering
  • Compatibility of solder masks and lead-free solder
  • Setting up lead-free profiles, you must profile a selective process!!!
  • Solder alloy choices
  • Copper dissolution with selective
  • Soldering defects on selective – Causes and Cures

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here



June 20 - 21

eSmart Factory Conference  +

Location
Crystal Gardens
Howell , MI 48843


Software Systems & Standards • Robotics • 3D Printing

eSMART Factory 2019 conference will bring together the key technologies shaping the electronics manufacturing industry and addressed by EMS companies, OEMs and Contract Manufacturers.

 


June 25 - 27

Symposium on Counterfeit Parts and Materials 2019  +

Location
College Park Marriott Hotel & Conference Center
College Park , MD


2019 call for abstracts and registration is now open. The program will be finalized in Spring 2019. 

 

Counterfeit Symposium Panel Discussion

Dr. Michael Azarian, CALCE, speaks during the panel discussion 'How is AS6171 Being Flowed Down? Challenges with AS671 Accreditation--Can it Handle Obsolete Part?' at the 2018 Symposium.

 


 

Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

 



The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.


June 25 - 26

Symposium on Counterfeit Parts and Materials-Tabletop Exhibition  +

Location: College Park Marriott Hotel and Conference Center
3501 University Blvd East
Hyattsville, MD 20783



Exhibitors

Sponsorship Opportunities:

**All Sponsorships require an exhibit booth reservation**
 

Lanyard Sponsorship (Limit 1) - $500 - Company to provide lanyards

Provide your company lanyards and they will be the official lanyard for the conference.

You will receive logo recognition in the show directory, conference website and signage.


 

Tote Bag Sponsorship (Limit 1) - $400 (if provided by company/$800 if produced by SMTA)

Provide your logo on all of the conference attendee bags! If you would like SMTA to produce the tote bags, it will

 be an extra $400. There will also be recognition in the show directory and website.



Lunch Sponsorship Day 1 or Day 2 (Limit 2)-$750
Signage upon entrance to exhibit hall lunch and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

Refreshment Sponsorship Day 1 or Day 2 (Limit 2)-$750
Signage during PM refreshment breaks upon entrance to exhibit hall and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

 

Exhibitor Information:

Contact Jenny Ng for available booth space. 952-920-7682 or jenny@smta.org Please note that exhibit traffic will be minimal while symposium is in session.


Click here to view floor plan.

Exhibit space entitles you to:

 

  • 6 ft. Draped table
  • One conference pass
  • Attendee list
  • Breakfast, Lunch & Breaks
  • One copy of the conference proceedings
  • Download a hard copy of the registration form

    Cost to exhibit:
    Rates increase $100 after May 31, 2019
    Booth type CALCE/SMTA Members Non-Members
    One table
    includes access to Electrical Outlet
    $550 $650
    One table
    no access to Electrical Outlet
    $500 $600

     

 



Attendees

Exhibit Attendees: 

Come and visit the exhibits for FREE! Plan to network with leading suppliers working to stop the proliferation of counterfeit parts in the electronics supply chain.

Show Hours Each Day: 10:00am - 3:00pm

Your expo pass gives you access to:

  • FREE Panel Discussion
  • FREE Lunch
  • FREE Refreshment Breaks


    If you would like to attend other conference sessions, please register for the conference here.

Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.


June 27

Upper Midwest Expo & Tech Forum  +

Location: DoubleTree by Hilton Minneapolis - Park Place
Park Ballroom
1500 Park Place Blvd.
Minneapolis, MN 55416



Exhibitors

The cost to exhibit for corporate members is $375/$475 (Early/Late) and $450/$550 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Early registration expires on May 31, 2019!

Important Exhibitor Materials:

 



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Free Technical Program & Schedule:
Exhibit Hours:
Thursday, June 27th, 2019
9:00AM–3:00PM

 

 


July 11

Queretaro Expo & Tech Forum  +

Location: Misión Grand Juriquilla, Queretaro
Blvd Villas Del Meson 56
Juriquilla, QR 76230



Exhibitors

The cost to exhibit is $450/$550 (early/regular) for corporate members. The cost to exhibit for non corporate members is $550/$650 (early/regular).(click here for membership information).


The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $55 per outlet. Early registration pricing ends on June 10th, 2019!

Important Exhibitor Materials:

 

 

Booths are assigned in the order they are received. 

Important Exhibitor Materials:

  •  In the case of bank transfers, the dollar exchange rate must be calculated on the basis of the interbank purchase price and not the selling price. All transfers require an additional $50 USD.    
  • To pay by wire transfer please contact SMTA HQ. 1-952-920-7682 or hannah@smta.org
  • Please contact SMTA Expo Manager Hannah Funk with questions or for additional information.



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Please see the Queretaro Chapter Page for More Information on Technical Sessions.

Free Technical Program & Schedule:
Exhibit Hours:
Thursday, July 11, 2019
11:00AM–6:00PM

 


July 15

Webinar: Vapour Phase & Convection Reflow with Lead Free – Selecting the Reflow Process  +



Bob WillisMonday 15th July @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Having grown up with IR and Vapour Phase Soldering VPS during the introduction of surface mount technology its fail to say that some processes never die they just get better. Convection reflow took over from IR technology and changed the way industry looked at vapour phase but now its back. For some companies VPS never went away a simple one profile process, in Japan high end application used VPS during the introduction of lead-free technology

Both convection and vapour phase can produce reliable lead-free assemblies, there are advantages and disadvantage to any technology but they both work well and can be very cost effective that is what our surveys have said. We also bring ten years of experience with lead-free using both techniques to the conference

In this webinar the instructor will look at all aspects of the different processes, soldering performance and yield from different joint terminations, solder finishes and joint structures. Each delegate will also receive a FREE set of Bob Willis Inspection Wall Charts covering reflow soldering of lead-free terminations and common defects found in manufacture 

 

Topics include:

  • Vapour phase and convection reflow overview
  • Process parameters
  • Nitrogen/inert environment myths
  • Advantages & disadvantages of the process options
  • Design and layout considerations for VP
  • PCB solder finishes for VP & convection
  • Vapour phase materials and cost
  • Batch or inline operation
  • User experiences with VP materials and equipment
  • Profiling boards assemblies in both processes
  • Solder paste requirements
  • Comparing single and double sided reflow yields
  • Soldering flexible assemblies
  • Inspection results for reflow soldering

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


July 18

Heartland Expo & Tech Forum  +

Location: Marriott Kansas City Overland Park
10800 Metcalf Avenue
Overland Park, KS 66210



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on June 7, 2019!

 



Attendees


August 8

Ohio Expo & Tech Forum  +

Location: Holiday Inn Cleveland Strongsville
15471 Royalton Road
Strongsville, OH 44136



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early registration pricing ends on July 8, 2019!
 



Attendees

August 12

Webinar: Conformal Coating - Successful Implementation & Quality Control  +



Bob WillisMonday 12th August @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Conformal coating has provided benefits to industry for many years either in the high reliability market sector or where products have to deal with extreme environmental conditions. Different industries like telecommunications, automotive and consumer products benefit from the use of selective coating.

This session will provide a simple guide to the use of coatings, their application and process, product benefits, inspection and quality control. A practical session will also allow delegates to examine coated boards using different materials and inspect the coating application. Bob Willis will outline the most common coating problems, solutions and address your specific issues in this webinar session.

 

Topics include:

  • Why Conformal Coat
  • Coating Process Options
  • Cost of coating assemblies
  • Correct design for coating
  • Inspection & Quality Control of Coating
  • In-house or Contracting Services
  • Inspection of coatings & methods

 

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here



August 22

Capital Expo & Tech Forum  +

Location: Johns Hopkins University/Applied Physics Lab
Kossiakoff Center
11100 Johns Hopkins Road
Laurel, MD 20723



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early Bird pricing ends August 2nd, 2019!

Important Exhibitor Materials:



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry! Exhibit Hours:
Thursday, August 22nd, 2019
9:00AM–3:00PM
Registration Opens at 8:00AM
 



September 22 - 26

SMTA International 2019  +

Location
Donald E Stephens Convention Center
Rosemont , IL


Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering manufacturing and assembly of electronics, advanced packaging/components, inspection technologies, processes, substrates/PCB technology, soldering, quality and reliability.


September 24 - 25

SMTA International Electronics Exhibition  +

Location: Donald E. Stephens Convention Center
Rosemont, IL


Exhibitors Register Now
Exhibitors

SMTA International delivers value to you and your organization through our goal to bring our members and visitors together to focus, exchange ideas and share the newest technologies. Last year we welcomed over 1600 attendees from 21 different countries.


September 24 - 26

SMT Processes Certification (SMTA International - Rosemont, IL)  +

Location
Donald Stephens Convention Center
Rosemont , IL


Co-located with SMTA International Conference.

  • September 24 - Course (8:30-5pm)
  • September 25 - ½ day of course + exam
  • Spemteber 26 - All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


October 8

New England Expo & Tech Forum  +

Location: Boxboro Regency Hotel & Conference Center
242 Adams Place
Boxboro, MA 01719



Exhibitors

The cost to exhibit for corporate members is $450/$550 (Early/Late) and $550/$650 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 8ft pipe & draped table, two chairs, company sign, lunch, directory listing and registrant list. Early bird rates expire on September 13, 2019!

All spaces will be assigned once we are sold out. If there is another exhibitor you want to be next to please let us know when you sign up. 

 



Attendees

Free Technical Program & Schedule Coming Soon!

 

 



October 15

Austin (CTEA) Expo & Tech Forum  +

Location: Norris Conference Center
2525 West Anderson Lane
#365
Austin, TX 78757



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on September 15, 2019!



Attendees

October 22 - 24

International Wafer-Level Packaging Conference  +

Location
DoubleTree San Jose Airport Hotel
San Jose , CA


SMTA and Chip Scale Review are pleased to announce the 16th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.


October 23 - 24

Guadalajara Expo & Tech Forum  +

Location: Expo Guadalajara
Av. Mariano Otero
#1449, CP
Verde Valle, Guadalajara, Jal. 44550



Exhibitors

Exhibitor Information: 

Prices below are per 3x3 Meter Booth:

  Before April 30, 2019 After April 30, 2019
Corporate Member $1,000 USD / $20,000 MXN $1,350 USD / $27,000 MXN
Non-Corporate Member $1,200 USD / $24,000 MXN $1,500 USD / $30,000 MXN

 

Please Contact Expo Manager, Courtney Kalb, with questions or for additional information.


October 23 - 24

International Wafer-Level Packaging Conference Exhibition  +

Location: Double Tree Hotel
2050 Gateway Place
San Jose, CA 95110



Exhibitors

Sponsorship and Exhibitor Information


Dates: October 22-23, 2019
Location: DoubleTree by Hilton Hotel, San Jose, CA

Monday, October 21
Move in: 12:00pm-5:00pm

Tuesday, October 22
10:00am-4:30pm
4:30pm-6:00pm (Networking Reception)

Wednesday, October 23
10:00am-4:00pm
Move out: 4:00pm-7:00pm

Click here for the latest floorplan


IWLPC Expo Prospectus

 

How Much is it to Exhibit?

  Early Registration
Before/On July 30th
Regular Registration
After July 30th
One Booth
(8' D x 10' W)
$1500 $1700
One Table
(6' Table)
$1100 $1300


Why Exhibit at IWLPC?

* Reach a focused international audience
* Generate Exposure in this highly competitive marketplace
* Share New Products and concepts to the market
* Enhance Relationships with existing customers and generate new leads
 

What type of attendees will be there?

Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
 



Attendees

Note - If you already registered for the IWLPC conference you do not need to register separately to attend the expo.


October 28

Intermountain (ID, UT) Chapter: SMTA Intermountain Chapter Utah Expo  +

TBD



Utah Vendor Expo actual date and location TBD.  Will not be at U of U this year.


November 5

San Diego Expo & Tech Forum  +

Location: California Center for the Arts Escondido
340 N. Escondido Blvd.
Escondido, CA 92025



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 7, 2019!



November 7

LA/Orange County Expo & Tech Forum  +

Location: The Grand Event Center
4101 E Willow Street
Long Beach, CA 90815



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 7, 2019!


November 20

Space Coast Expo & Tech Forum  +

Location: Melbourne Auditorium
625 East Hibiscus Blvd
Melbourne, FL



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).


The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list.Electricity is an additional $30 per outlet. Early bird pricing ends on October 15th, 2019!

Important Exhibitor Materials:

 

 



Attendees

Exhibit Hours:
Wednesday, November 20, 2019
Technical Sessions: 9:00AM-4:00PM
Expo: 10:00AM–4:00PM
Registration: Opens at 8:00AM


Free Technical Program & Schedule:
 


December 4

Silicon Valley Expo & Tech Forum  +

San Jose, CA 95131



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on November 15th, 2019!

For more information please contact Hannah Terhark, Hannah@smta.org or 952-920-7682

 



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Wednesday, December 4, 2019
10:00AM-3:00PM

Free Technical Program & Schedule:
Information to follow...



Looking for a local chapter event? Check the Chapter News page for more events.
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819