The SMTA Capital Chapter is excited to host a Chapter Meeting on January 10^th from 5:00 PM to 7:30 PM at ZESTRON, Manassas, VA. Fred Dimock, BTU International, will be presenting “Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data.”
 
This presentation will provide an overview of the vacuum reflow process and explain the reason vacuum reflow is of interest to the electronic assembly industry.  The presentation will also include a report on preliminary data from a void reduction experiment completed at the Universal Instruments Process Laboratory.
 
Fred Dimock, Manager of Process Technology at BTU International in Massachusetts, has extensive experience in thermal processing and has assisted many companies with process refinements over the years. Fred has authored numerous articles on lead free solder, process control, and the operation of continuous furnaces. He also wrote the chapter on solder reflow for the “Handbook of Electronic Assembly and A Guide to SMTA Certification” by Dr Lasky and Jim Hall. He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard.
 
Don’t miss out on dinner and a facility tour prior to the presentation. Registration is free for members and $30 for non-members. The registration fee will be waived if you join the Capital Chapter during this event!
 
The evening is scheduled as follows:
5:00-6:00 PM Registration, Networking & Dinner
6:00-6:30 PM Facility Tour
6:30-7:30 PM Presentation
 
The SMTA Capital Chapter Meeting Location:
Zestron Corporation
11285 Assett Loop
Manassas, VA 20109

Understanding Selective Solder Technology

Event Details

• Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
• When: 11am-1pm on January 11, 2019
• Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
• Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

• FREE for New Members since prior meeting
• $10 for Committee Members
• $20 Members, employees of Corporate member companies, 1st time guests, and students
• $25 non-members, students, & guests – same price
• Cash at the door or credit card on-line

Get your tickets!

• I'll be there - paying at the door (Click here)
• Members: I'll be there - paying now for 10% Early Bird Discount (Click here)
• Non-Members: I'll be there - paying now for 10% Early Bird Discount (Click here)

Abstract

Selective soldering technology, specifically nitrogen inerted, liquid underside selective soldering has emerged as a required process in PCB manufacturing. The industry has become segmented in approach driving separate technology roadmaps that encompass, topside laser, soldering iron, mixed technology and bottom side liquid flow soldering. This presentation explains the underlying process needs and the resulting technologies required to serve those requirements as it relates to the underside liquid soldering.

Biography

Jonathan is the President of Pillarhouse USA with P&L responsibility for the Americas and is a director of the Selective Soldering Academy. He has a BSME from Western New England University and has over 20 years of selective soldering process experience. Jonathan has been published in several trade publications including, US Tech, SMT Magazine, Global SMT and Packaging, The Suit, EMS Now and others. He has received the Ford Award of Excellence for Automotive Electronics, is a member of the SMTA and EMCWA and regular contributes on the subject of selective soldering.

Monday 14th January @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Millions of crimp joints are produced every year and are used in many high reliability applications. Care in the preparation and achieving the standards of the IPC, MOD and other international standards are vital. This webinar covers the use of crimp connectors and other mechanical connection techniques. We highlight the process controls which are necessary in today's manufacturing environment along with a system to control materials and equipment to allow repeatable and reliable terminations.

Each delegate will receive a copy of all of the slides presented plus a set of posters on soldering to print on site for future training.

Topics include:

• Introduction to crimping and cable termination
• Training standards and practical skills techniques
• Cable types and striping
• Striping tools
• Establishing strip lengths
• Crimp types
• Compatibility of crimp terminations and wires
• Crimping tool operation

Practical examples covering:

• Wire preparation
• Crimping conductors
• Inspection criteria for wire and crimp joints
• Testing tools and joints
• Wire wrapping and press fit terminations
• Termination failures

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

• 2:00 to 2:15 PM - Registration
• 2:15 to 2:20 PM – SMTA announcements
• 2:50 to 3:40 PM – Clark’s Presentation
• 3:40 to 4:00 PM – Q&A
• After 4 PM – Social hour

Thanks to all chapter leaders who helped make the 2019 Mini in Minny a great event.
View a recap here with photos and copies of the presentations.

The SMTA invited all NEW Chapter Officers to the "Mini in Minny" Chapter Officer's Leadership Forum

Develop leadership skills, learn the ins and outs of running a chapter, and put faces to names at SMTA HQ at our orientation weekend for all brand new SMTA Officers. Move forward with enthusiasm and confidence as effective leaders in your chapter.

2019 SMTA Leadership Forum Agenda

January 18, Friday     DoubleTree Minneapolis Park Place

Arrivals

7:00 p.m.   Registration and Welcome Happy Hour at DoubleTree Hotel
Hors d'oeuvres, wine, and beer will be served

Sponsored by:

January 19, Saturday SMTA Office, Eden Prairie, MN

8:00 a.m.  Transfer to SMTA Office

Sponsored by 

8:30 a.m.   Breakfast

9:00 a.m.   "SMTA 101" Information Sharing Sessions
Topics covered will include:

• How is the SMTA Structured?
• Your Online Dashboard
• Annual & Long Range Planning
• Best Practices:
  o Membership
  o Meeting Planning
  o Chapter Finances
• Resources and Benefits for Officers
• Leadership Position Descriptions

12:00 p.m.   Working Lunch

1:00 p.m.     Sharing Sessions Continue

5:00 p.m.     Transfer back to DoubleTree Hotel

Evening      Fun and Games at Punch Bowl Social, Minneapolis
Dinner and entertainment included

Sponsored by:

Connecticut Chapter

January 20, Sunday

Departures

DRESS CODE:  The Forum weekend dress code is casual.

Logistics: Hotel, Travel & Events

TRAVEL ARRANGEMENTS

If you plan to attend the 2019 “Mini in Minny” Chapter Officer Leadership Forum, SMTA requests that you attend the Welcome Reception Friday, January 18, at 7:00 p.m. (PLEASE factor in baggage claim and transportation to the hotel) and be present at all events Saturday, January 19. You are free to make your return airline arrangements whenever convenient on Sunday, January 20. There are no formal SMTA events on Sunday. 

TRANSPORTATION OPTIONS:
• Super Shuttle: 612-827-7777 or 1-800-BLUE-VAN
• Bus Transportation Information: www.metrotransit.org
• Car rental with your choice of service, Uber or Lyft
SMTA will provide transfers for the events on Saturday, January 19.

HOTEL ARRANGEMENTS

DoubleTree by Hilton Minneapolis – Park Place Hotel
1500 Park Place Blvd., Minneapolis, MN 55416

Make your hotel reservations online by Friday, January 24, 2019.
The negotiated rate is $102 plus tax per night for a standard room.

Book Your Hotel Here!
Just select dates and guests and click "continue" (leave default special rates section as is)
Booking via Phone: 1-800-245-9190, ask for group code "SMTA"

Reservations requested after January 4, 2019 will be accepted as long as availability permits on a first-come, first-serve basis, but will be at the higher prevailing rates versus the special group rate. You will need to guarantee the first night’s room and tax with a credit card or check advance deposit. You can cancel your reservation two days prior to your scheduled arrival without incurring any cancellation charge. Cancellations after that point and no-shows will forfeit the first night’s room and tax deposit.
Check-in time is 3:00 p.m., and check-out is 11:00 a.m. You will need 2 nights (arriving 1/18/19 and departing 1/20/19). Amenities include coffee maker, iron and ironing board, hair dryer, mini-fridge, WiFi access, as well as a warm chocolate chip cookie upon arrival and other in-room amenities.
If you choose to stay at a different hotel or make other arrangements you will need to make your own transportation arrangements to all events.

Funding & Sponsorships

$ FUNDING $

The SMTA Officer’s Leadership Forum is open to all NEW officers. All food and beverage during the duration of the program will be covered by SMTA. Entertainment and instruction is also included for all qualifying new officers.
Each officer is responsible for his or her travel to Minneapolis and hotel expenses. We have arranged a discounted room block at the DoubleTree Minneapolis Park Place of $102 plus tax per night. We hope that your employers understand the value of the benefits of SMTA membership and will support your trip. If not, Forum expenses are acceptable chapter expense items within the SMTA and Chapter Bylaws. All new officers must discuss it with your President and Treasurer before you make any non-refundable airline or hotel arrangements.
If it is impossible for your company or chapter to fund travel expenses, ask Karen (karenchapters@smta.org or 952.920.7682) about our financing assistance. We want to work with you to ensure that all new officers are able to attend.

SPONSORSHIPS

Please help us to make this important event happen. Consider becoming a sponsor and invest in your future officers.

SPONSORSHIPS AVAILABLE:

• Sponsor an officer’s travel: $100-$1000+ (multiple sponsors)
• Welcome Reception Sponsorship: $100-$350 (multiple sponsors)
• Saturday Evening Event Sponsorship: $250-$500

ANY SPONSORSHIP, ANY AMOUNT IS WELCOME!

All Forum Sponsors will be introduced at the Welcome Reception, receive verbal recognition and signage recognizing the sponsors during the event to show our appreciation of your chapter's support of your peers.

Thanks to our current chapter sponsors!

Connecticut Chapter

Wearables & Implantables:  How Technology Transforms Health Care … How Health Care Transforms Technology

Matthew K. Hudes

CEO bdlBilologx, Vancouver, Washington/USA, mhudes@bdlbio.com

Summary

Digital Health is driving the uptake of wearable and implantable devices replete with biometric sensors.  These new technologies are enabling health care to become more immediate, more effective, and more personalized.  Health care applications of technology bring greater demands for privacy, safety, and security, with corresponding regulatory oversight. In turn, health care is influencing how Digital Health technologies are developed, manufactured, and commercialized.

I. Introduction and Motivation
Wearable and implantable technology, when combined with web and email, mobile technology and social networking, data management and analytics, results in a new paradigm called “Digital Health.”  Tools that connect patients, physicians, payers, and life sciences companies can transform the delivery of health care.  But in order to realize such a fundamental transformation of the health care system, changes are required on the part not only of health care providers but also of life sciences manufacturers and of patients/consumers.  Essential technologies such as wearable and implantable devices in Digital Health become subject to medical regulations and medical technology product development processes as they are utilized not only to monitor but also to directly affect human health.
II. Technical Approach or Experimental Procedure
This presentation provides a survey of trends in Digital Health, focused on the role of wearable and implantable technology.  Consumer, market, and financial data is examined to understand how these technologies are changing health care and how health care is changing the business of developing, manufacturing and commercializing these technologies.

III. Results and Discussion
While the results are generally positive to the market opportunity for wearable and implantable technologies, there are unintended consequences and unforeseen results that are emerging as the market develops.  It is likely that further transformation is required to fully realize the potential for health care as well as for the technology business addressing these needs.
 
IV. Brief Biography

Matthew Hudes is the Founder and CEO ofbdlBiologx, a company devoted to helping the products of innovative companies reach patients more quickly. bdlBiologx provides 1) on-demand services to stimulate company growth 2) leading-edge Business Development and Licensing (BDL) processes and systems, and 3) capability-building to support the growth of a BDL function within a company. For the prior 11 years, Matthew was the BioPharma practice leader for Deloitte.  In this role, he provided guidance and direction to clients and to the firm’s Audit, Tax, Consulting, and Advisory Services practices.  Deloitte is recognized as the leading full-scope professional services firm in Life Sciences. During the course of his long career, Matthew has provided strategic professional services to leading Biotechnology, Pharmaceutical, and Medical Technology companies, as well as Academic Research Centers and regional centers for Life Sciences.  He has worked with leading Life Sciences innovation centers in the U.S. and globally.   He speaks frequently about such topics as digital health, fostering innovation, personalized medicine, the use of technology for innovating clinical research, finance transformation, manufacturing and quality, regulatory compliance, and supply chain.  He was a member of the Board of Directors of BIOCOM, a faculty member and executive sponsor of the UC Berkeley BioExec Institute, a member of the Board of Directors of the Bay Area BioEconomy Initiative, and he was the executive sponsor of Deloitte’s unique innovation collaboration with the University of California. Previously, he was the Chairman and CEO of Accélère, a software company that developed a system to find patients (and investigators) for clinical trials and to improve researchers’ access to information typically “trapped” in laboratory and medical systems. Formerly, Matthew led the global Capgemini Life Sciences Biotechnology and R&D practice.  As a former Partner with Ernst & Young LLP, he founded the firm’s Life Sciences Consulting practice and led the firm’s Biotechnology Consulting practice. He served as a strategic advisor to leading-edge companies in Life Sciences and Technology over a period of more than 17 years. Matthew received an MBA from Santa Clara University and a BA from the University of Connecticut.
 

Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

Course Outline:

The first half of the course will cover all aspects of X-Ray inspection.  We will talk about the basics of the technology, in-line, off-line and at-line comparisons, looking at the positives and negatives of each.  The latest hardware and software developments, 2D, 2.5D, and 3D (CT) will be explained and compared, together with images of demanding applications.

The second half of the event will cover all aspects of AOI Technology, from basic 2D through to advanced 3D technology and the technologies between.  We'll be looking at the latest 3D advances launched at APEX the week before this event and contrasting them to earlier systems.

We will finish with an overview of Industry 4.0 for Inspection and the related Management Information Systems which take inspection into the realm of the SMART Factory of the Future.

All those attending will have the option to download Mark's guide, "BGA and Area Array Process Defects - Causes & Cures" when it is released later in February.

About the Instructor:

Keith Bryant

A fully qualified engineer, Keith has over thirty years’ experience in Electronics Manufacturing.  He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews.

He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years’ experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years.

Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time.

From 2017 to 2019, he was Global Sales Director of the leading X-ray manufacturer. Recently he reverted to a Consultancy role, allowing him more freedom to pursue other projects, including i4.0.

He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.

Contact Karen Frericks at 952-920-7682 with questions.
 

Monday 11th February @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Solder paste quality and performance is significantly important and considerable engineering goes into its production. Selecting the best materials for your product and assembly process is key to high yield and your customers' satisfaction. Solder paste must be compatible with your equipment and other processes you use like cleaning, coating and electrical test. Working with suppliers to achieve the best performance is vital but so is periodic review of materials used.

There are always improvements being made to printing and jetting technology and it is important that engineers consider whether there are technical or commercial reasons to change. We look at common testing methods and some of the simple shop floor techniques used over the years to understand the different types of process failures.

Each delegate will receive a copy of all of the slides presented plus a set of posters on soldering to print on site for future training.

Topics include:

• Solder paste type
• Low & high temperature alloys
• Solder beading
• Solder slump
• Reflow spitting
• Flux condensation
• Printing trials & test boards
• Common paste & print failures

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

Central Texas Electronics Association

Electronics Design, Manufacturing & Test Symposium 

Tuesday, February 12, 2019

Virtex Enterprises at 12234 N. I-35 & W. Yager Lane, Bldg A

Tuesday, February 12, 2019 | 2:30pm GMT (9:30am US Eastern Time)
Presented by: Keith Bryant, SMTA Europe

Free for members!

What You Can Learn From This Course:

This webinar is FREE for members to attend and is provided by SMTA Europe. The webinar will be presented by Keith Bryant and will also include a brand-new guide to defects produced by Keith and available to SMTA members. During the presentation the methods of detecting defects in manufacture will be discussed and the growing need for more advanced methods.

With many years working in PCB manufacture and assembly Keith has investigated most defect types. As component and substrate technology becomes more advanced, new issues require modification to inspection methods which will be considered during the session.

The BGA & Area Array Defect Guide is a colour booklet featuring both optical and x-ray examples of common and not so common defects. The examples may be cosmetic or electrical failures found during investigation in manufacture. Each defect type is discussed with possible causes and cures. This guide is one of many guides being made available from SMTA.

During the webinar the following will be discussed:

• Area Array Inspection methods
• Inspection criteria

Selected defect types include:

• Opens
• Shorts
• Voids
• Head on Pillow
• Solder wicking
• Solder beads
• PCB plating variations
• Plating voids

Kim Flanagan is a Technical Support Engineer based at the Indium Corporation who serves customers in the South-West and South-East US, and also Eastern Canada and Puerto Rico.

Kim provides technical support, including guidance and recommendations to customers related to process steps, equipment, techniques, and materials. In addition, she delivers technical training to staff and industry partners.

Kim is a Certified SMT Process Engineer recognized by the Surface Mount Technology Association. She has a background in Physics and has held previous positions in Quality Engineering.

Date: February 19, 2019 @ 5pm
 
Speaker:
Aaron Caplan
Director of Marketing & Training
PACE Worldwide
 
Location:
PACENTER Training Facility
6605 Selnick Drive #C
Elkridge, MD 21075
  

• 5:30 – 6:15: Registration/Dinner
• 6:15 – 7:15: Presentation
• 7:15 – 7:45: Demonstration

 “Non-Destructive BGA/Area Array Component Rework.”
 
Abstract:
In the past 20 years, such mundane operations as soldering, desoldering and component replacement have become complicated by extreme micro-miniaturization, the use of lead-free solders, new thermally challenging pc boards, heat-sinking bottom terminated components and intricate component packages that are difficult to rework or install. One area that presents unique challenges is BGA/Area Array rework. Modern boards that use these components are more technically demanding than ever, requiring skilled operators who are highly competent at accomplishing delicate, intricate soldering and rework tasks. Unfortunately, many operators will cause more damage to the assembly or components due to his/her rework actions. As a result, many manufacturers struggle to repair or rework boards, opting to throw away lower value boards or hire outside contractors to perform the more difficult repairs. This presentation will review current techniques and procedures for performing highly reliable, high-quality rework and repair on some of the more difficult BGA packages and will include live demonstrations of BGA rework using available convective and infrared heating techniques. The presentation will address typical BGA/area array components, heating technologies (convection and infrared), the importance of bottom side preheating, flux application, solder paste stenciling, device alignment methods and thermal profiling techniques, followed by a live demonstration of BGA rework.
 
 
About the Speaker:
Aaron Caplan is the Director of Marketing & Training for PACE Worldwide, a company solely focused on providing innovative, cost-effective solutions in hands-on soldering, rework and repair of advanced electronics to companies and government around the globe for well over 50 years. Mr. Caplan has been involved in electronics manufacturing technology since the 80's and is an acknowledged expert in Miniature/Microminiature Electronics Repair. A CIT in IPC-7711/IPC 7721, he provides technical expertise in teaching of non-destructive PCB rework/repair techniques, educating industry on how to properly utilize these techniques. In addition to his marketing duties, Mr. Caplan also coordinates the Training Department and Video Production Team, providing direction for a wide variety of video production projects.
 

This webinar has been cancelled!

Tuesday, February 19, 2019 1:00pm to 2:30pm Eastern
Presented by: Bob Wettermann, BEST Inc.

What You Can Learn From This Course:

This webinar is a “how to” guide for reballing intended for PCB rework and repair depots as well as device reclaimers. These sessions will take those interested in reballing devices through the entire process of setting up the equipment, developing and verifying the process. The first topic will cover the need for reballing of BGAs, CSPs and other devices. The second section will focus on the equipment set recommended for reballing and the third section the various process steps for reballing a device. A variety of different methods for both deballing and reballing will be discussed with the various advantages and disadvantages discussed to each approach.  Both plastic-packaged parts as well as ceramic parts reballing will be discussed. Inspection of the reballed components, the type of reliability testing data currently publicly available will be reviewed as well as some ideas for developing your own specifications if you want to outsource this activity.

This webinar is designed for process engineers, rework technicians and others interested in repairing electronics.

Instructor Bio:
Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.

• Bachelor of Science degree in Electrical Engineering Technology from Alabama A&M University (Huntsville, Alabama);
• Master of Science degree in Electrical Engineering from Howard University (Washington, D.C.);
• PhD in Ministerial Education from KME University (Athens, Alabama)/Freedom Bible College of Arkansas.
• Certification in Fiber Optics Manufacturing from California State Polytechnic University (Pomona, California)
• Certification in Optical Fiber Engineering from George Washington University (Washington, D.C.)
• And served as a Professor of Electrical Engineering at Alabama A&M University (Huntsville, Alabama).

• Walter Hawkins
• The Mississippi Mass Choir
• Dottie Peoples
• Luther Barnes
• Mighty Clouds of Joy
• Edwin Hawkins (performer of the hit song “OH HAPPY DAY”)
• The Platters
• and many others

All meeting attendees must enter through the South entrance (adjacent to shipping dock).

• Take exit 14B to Al-255N/Research Park Blvd
• Take exit Bradford Drive West
• Turn left Explorer Blvd (heading south)
• Turn right into parking lot, merge left and follow parking lot to pond
• Building entrance will be on north of parking lot

• RSVP Link: smta.org/chapters/rsvp.cfm?BEE_ID=4656
• send email to HSVSMTA@gmail.com

• Students In Advance:             $10
• Members In Advance:            $25
• Non-Members In Advance:     $30

• Students at the Door :             $15
• Members at the Door:             $30
• Non-Members at the Door:     $35

The electronics design, packaging and assembly industries are being challenged to adapt to the needs of mature industry sectors such as the military/aerospace/defense segment to the fast changing requirement of the wearables, IoT segments.  The result is the revolution of new materials that may or may not suitable for its intended application.  The AREA consortium and the APL lab have characterized and implemented these new materials in novel end products along with conducting applied research to understand the impact on manufacturing techniques.  This roadmap discussion reviews and discusses the materials, alternative assembly processes and the reliability that will enable manufacturers to produce novel devices to the market.

     

• Pillarhouse - Jonathan Wol: Understanding fluxes and how they impact the selective soldering process.
• Kurtz Ersa - Ernie Grice: Fundamentals of the soldering process as pertained to wave and selective soldering and outline why selective soldering is poised to become the standard for thru-hole soldering versus antiquated, black art of wave soldering.      
• Laserssel - Denis Barbini: A Novel and Enabling Solution For Reflowing Challenging Mainstream and Alternative Electronics.  Presentation will provide step-by-step process development, material compatibility, reliability and productivity of this area laser selective reflow technique for mainstream and unique electronics designs.
• MTA Automation - Will Hunter: Induction and Micro-Flame soldering and when to use them.
• Facility tour of Crown Equipment Corporation electronic assembly operations.

¡El Capítulo de SMTA Juárez está de vuelta! Estamos organizando una gran reunión técnica el Jueves 14 de Marzo del 2019 para celebrar y nos gustaría invitarle a USTED a asistir.

Los usuarios de tecnología SMT (OEM, EMS, fabricantes contratados) están especialmente invitados a asistir. Si este capítulo va a sobrevivir en el futuro, necesitaremos su apoyo.

INFORMACIÓN IMPORTANTE:

Fecha: Jueves, Marzo 14, 2019

Hora: 5:30-9:00 p.m.  

Nota especial: Las puertas se abrirán a las 5:00. Tendremos varios sorteos para los Miembros Usuarios. ¡Llegue temprano para aumentar sus posibilidades de ganar un premio fabuloso!

Ubicación: Centro de Convenciones Cuatro Siglos

Direccion: Boulevard Juan Pablo II (Blvd. Cuatro Siglos) y Av. Arizona.

Ciudad Juárez 32402


AGENDA

• 5:00 p.m. - Doors Open
• 5:30 p.m. - Welcome & 1st Raffle
• 6:00 p.m. - 2nd Raffle
• 6:05-6:10 p.m. – SMTA Chapter Juarez Committee Presentation  
• 6:10-6:25 p.m. - Universidad Tecnologica - Presentation of Programs -  M.C.M. Alecia Torres, Ing. Ricardo Perez
• 6:25-6:30 p.m. - SMTA Certification Program – Ing. Alejandro Valles / Ing. Moises Gonzalez
• 6:30-6:50 p.m. – Presentation: "Técnica para reducción de voids en componentes QFN mediante la modificación de aperturas del esténcil” / Part 1 – Ing. David Solís
• 6:50-7:05 p.m. - ITCJ - Nodes Program - Mtro. Mario Macario Ruiz
• 7:05-7:20 p.m. - CIITA-CIA - Dr. Jose Mireles
• 7:20-7:40 p.m. - Presentation "Técnica para reducción de voids en componentes QFN mediante la modificación de aperturas del esténcil “/ Part 2 – Ing. David Solís
• 7:40-8:00 p.m. - Awards Presentation
• 8:00-9:00 p.m. - Dinner

Monday 18th March @ 2:30pm - 4:00pm GMT (10:30am - 12:00pm US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

The presentation provides a better understanding of solder paste selection and the use of stencil printing in modern fine pitch manufacture. Surface mount components are now at lead spacing of below 0.020″, only the correct selection of solder paste and specification of stencils can lead to effective printing. The session aims to provide a basic understanding of the design, production and quality control issues, both theoretical and practical issues of printing conventional surface mount and through hole for intrusive reflow.

Topics include:

• Design of lands and apertures for fine pitch SMT & BGA
• Through hole printing requirements
• Selection of stencils
• Evaluation of solder pastes
• Practical machine set-up and trial prints
• Elimination of board wash-off
• Assessment of paste and stencil combinations
• Solder paste inspection, measurement and quality control
• Stencil Inspection and quality control
• Cleaning stencils
• Printed board requirements for printing fine pitch

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Register Now!

Click Here to Register for the Dallas Expo and Tech Forum!

Are you a...

• Manager of Design or Manufacturing
• Process engineer
• Design Engineer
• Supply Chain Professional
• Purchasing
• Test Engineer
• Manufacturing or Test Technician

The Dallas Expo has everything you need to do with Design and Manufacturing of Electronics!

Event Details

• Date: Tuesday, March 19, 2019
• Time: Doors open at 8am
• Location: Plano Event Center (2000 E. Sprint Creek Parkway, Plano, TX 75074)
• Food: Complementary Lunch Buffet
• More info: smta.org/expos/#dallas
• Questions? Call Hannah Terhark at 952-920-7682

Technical Sessions

8:30AM
You Design & You Manufacture Complex Multilayer Circuits with 3D Printing 
Speaker: Ofer Maltiel, Nano Dimension
Bio: My driving passion in life is to help people succeed. The client’s goal is my first priority. Whether it's connecting them with an important contact or sharing from my 10 years’ experience as a hardware design engineer, I do whatever I can to help my clients thrive. Over the past 10 years, I've learned how to bring a product from the inception stage to life in various industries, cultivating lifelong relationships.

• The role of additive electronics manufacturing in Industry 4.0
• The increasing synergy between the additive manufacturing of electronics and the IoT
• Industry timelines for production-scale 3D printed electronics

 
9:15AM
On-Going Cleanliness Testing on Production Hardware
Speaker: Mike Bixenman, Kyzen
Bio:

Dr. Michael Bixenman (aka Dr. Mike) is known to many as the world’s leading expert in cleaning electronic circuit assemblies and advanced packages.  He is also one of the industry’s leading authorities on the design of electronic assembly, cleaning materials and process integration. In fact, Dr. Mike literally wrote the book on electronics manufacturing process cleaning standards (Cleaning & Contamination Process Guide).  
Abstract: The performance and cost advances over the past 20 years have enabled technologies to advance beyond what anyone could have imagined. In spite of these technology advances, the cleanliness standards that contractors rely on to ensure the design, production, and quality of next-generation Class 2 & 3 electronic hardware has remained unchanged. As technologies advance, the companies who build the device need guidance on what to do and how to do it.  
 
Flux residues trapped under low standoff leadless components on Pb-Free assemblies may still be active due to blocked outgassing channels, even when using a no-clean solder paste. Quantifying the risk of site-specific residues under problematic components is commonly done during the materials and process validation using chemical and electrical test methods. Process verification and validation are done to characterize and prove out the process on the materials used to build production hardware. Once the printed circuit assembly is placed into production, process control test methods to assure conformance are lacking. 

11:00AM
BGA’s, LGA’s, QFN/DFN’s – Oh My, Can Traditional DFM Survive 
Speaker: Dale Lee, Plexus Corporation
Bio: 

Abstract: Today’s electronic product designs are rapidly increasing the use of bottom terminated components (BTC’s), whether they are collapsible/non-collapsible ball grid array (BGA), solder bump grid array (BGA?), land grid array (LGA), quad-flatpack no-lead (QFN) or dual-flatpack no-lead (DFN) component packaging technologies.  However, with some BTC package designs vary greatly in solder pad design and pitch within the same package.  This variability impacts the ability to incorporate good DFM practices and selection of applicable assembly workmanship rules for these and other standard BTC component package designs. This presentation will highlight impact elements these component technologies have on the assembly, cleaning and inspection processes and what actions can be made during the DFM and NPI process to minimize yield impacts on the manufacturing process.


1:30PM
Women in the Electronics Industry
Speaker: Billi Curtin, ITW Contamination Control Electronics
Bio: 

Abstract: It is not easy being a woman in the electronics industry.  We are strong ladies who have chosen to flaunt convention and work in a traditionally male-dominated field.  However in doing so, we often struggle with feelings of isolation, frustration, and anger. But why? Is it due to the patronizing comments from male coworkers, the gender wage gap, the lack of work-life balance, or simply because the “thick skin” you’ve had to develop over the years isn’t really that impervious?Regardless of the reasons, tapping into sources of empowerment, not blame, are key.

Completely bypassing social commentary on gender issues, this presentation will focus on tools and techniques to identify personal strengths and leverage them to neutralize gender-bias, silence your critics, avoid gender-based pitfalls without ostracism in the workplace, influence and lead (even without authority), and gain recognition and respect from your male counterparts.


3:00PM
Rework 101
Speaker: Viswam Puligandla
Get an exclusive look at the latest SMTA online training course, Rework 101, to close out the expo!
Bio: Industry veteran, Viswam Puligandla, Ph.D., will step through the basic rework process for both SMT and through-hole components. 
Abstract: Learn about critical temperature and moisture considerations, heating methods, types of acceptance criteria, and more. This course is intended for entry-level technicians or operators, engineers new to the industry, or even someone who has been away from the process for a while.
Topics Covered:

• Rework, Repair and Modification Definitions
• Rework Temperature Considerations
• Moisture Sensitivity
• Rework Equipment
• Basic Process Steps
• Rework Process Flow Chart Examples
• Rework of Surface Mount Components
• Rework of Insertion Mount Components
• Board Repair
• Acceptance Criteria

Thank you, sponsors!

SVTronics

Please join us for our 2019 Houston SMTA Expo & Tech Forum at the Stafford Centre, 10505 Cash Road, Stafford, Texas 77477.  If you look forward to seeing the latest products and services in the industry and an opportunity to enjoy presentations by experts in our profession, you won’t want to miss this show!

Come see over 60 local and national tabletop exhibitors. Free lunch from 12:00 Noon to 12:45 P.M catered by Kelley's Country Cookin and lots of chances to win door prizes. We’ll also have drawings after each technical session. You must be present to win.

This is a free show for attendees. We are pleased to offer another outstanding technical program with information and technology presented by industry leaders to keep your skills up to date!


http://www.smta.org/chapters/files/2019_SMTA_Houston_Expo_and_Tech_Forum.pdf
 

To register for the show, go to http://www.smta.org/expos/#houston and register in the attendee section.

Monday 25th March at 2.30pm UK Time (10:30am US Eastern Daylight Time)

Join Keith Bryant & Bob Willis to find out more about the demands on Electronics in Harsh Environments as they showcase the  challenges faced by design and process engineers worldwide. Including some of the key issues that are faced in Power Electronics, Automotive, High Voltage, Assembly and High Reliability Products.

For the third year running SMTA Europe present the Electronics in Harsh Environments Conference and Exhibition 2-4th April in Amsterdam for more information visit: https://www.smta.org/harsh/

Still unsure if you should be in Amsterdam or need more info to convince your boss.  This is an ideal way of seeing in advance some of the people you will meet and things you will learn from industry experts, plus you will be able to show examples of what you have learned on the different failure modes in electronics.

By attending this FREE webinar, you also have the opportunity of winning a FREE pass to attend one day of the conference!

Topics include:

• High Temperature
• Condensing Environments
• Water Immersion
• Mechanical Strain
• Corrosive Environments

Friday 29th March @ 11:00am Penang Time GMT+8
(Thursday, March 28 @ 11:00pm US Eastern Daylight Time GMT -4)

Presenters: Dr. Mike Bixenman and Debbie Carboni, KYZEN Corporation

Free for all – only members will get access to recorded presentation!

Overview

Highly dense Printed Circuit Assemblies build in more functionality using leadless and bottom terminated components. As these components reduce in size, the distance between conductors narrows. Reliability of these devices requires a high level of cleanliness, especially residues that are ionic in nature. The cleanliness question has been a topic area of concern over the past five years. To address this growing concern IPC – J-STD-001G, Amendment requires objective evidence to establish acceptable and unacceptable levels of residues on production hardware.

This webinar will teach important design variables that impact electrochemical reliability of Electronic Devices. The significant elements of influencing residues levels include:

• Flux or flux-bearing materials
• Cleaning agents
• Changes in manufacturing suppliers
• Changes in solder mask
• Changes in printed board fabrication processes or surface metallization
• Geographic change in manufacturing location

The webinar will identify and teach methods for screening materials and processes. From these methods, the attendees will gain a better understanding toward identifying and analyzing risks associated with contamination. They will learn about advanced control measures to eliminate these risks and their effects. The webinar will teach new methods for monitoring the effectiveness of these controls.

About the Presenters

Dr. Michael Bixenman, Chief Technology Officer (CTO) and cofounder of KYZEN, has over 30 years of experience in the design of electronic assembly cleaning materials and process integration. Sharing his research, knowledge and experience is Mike’s passion as he is the author and co-author of over 100 technical papers and presentations presented all over the world. He believes in the power of collaboration, by working with others to solve problems quickly. An active member of several industry associations, he has chaired and led many committees, symposiums, and task groups that are committed to understanding the cleaning and reliability challenges of today’s ever-changing electronics industry. Dr. Bixenman holds four earned degrees, including a Doctorate in Business Administration (DBA).

Debbie Carboni's involvement in the electronics industry started more than 20 years ago and has encompassed a diverse set of experiences that give her a deep knowledge of cleaning chemistry, equipment and processes. Having been with KYZEN for over 10 years, Debbie is dedicated to providing customers and partners with the highest quality customer support and service as well as ensuring that they receive the best technical solutions. Her extensive real world experience helps guide engineers during qualification to ensure success in production conditions. Debbie’s dedication to the electronics industry has included a number of roles and voluntary positions in many of the industry’s leading associations, and is currently serving her second term on the SMTA Board of Directors as the Vice President of Expo. After attending Northern Arizona University, Debbie remains knowledgeable through numerous technical conferences and leading-edge research. Debbie has authored and co-authored several papers related to cleaning solutions and regularly presents at and attends industry events such as; SMTA International, Cleaning and Coating Symposium, ICSR, Apex. Always willing to share, Debbie is an excellent resource with lots of experience and passion.

The conference will focus on building reliable electronics used in power electronics and harsh environments.

Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
 

The Chrys and Phil Show

Brought to you by two serious industry experts who don't take themselves too seriously, Phil Zarrow and Chrys Shea.  Together, they combine over six decades of SMT experience, hundreds of publications and dozens of awards.  Phil brings vast experience and insight, Chrys brings the data from independent research, and both of them like to deliver their knowledge in fun, interactive environments.

Pre-requisites:

• Some SMT assembly process experience
• A working sense of humor

Come to the BRAND NEW Space Coast Tutorial to learn:

Solder Paste

Solder Paste - what is it?

• How it is made, particle size classifications
• How it behaves - viscosity, thixotropy, rheology
• Balancing performance properties and why every formulation is different
• 25 paste characteristics that affect SMT line performance
• Finding the right product for the job
• Environmental and handling considerations

BREAK

Printing

Stencils - aperture rules (5 ball rule, area ratio...)

Stencils - techniques and materials (fine grain ss, nano, etc.)

Printing mechanics

• Printing considerations and parameters
• Gasketing
• Coining
• Support
• Stencil cleanliness

Troubleshooting Printing Related defects

Factory Tour of BlueRing Stencils and LUNCH

Solder Paste Inspection

• SPI Basics
• Types of SPI technologies
• Reasons for deploying
• Implementation tips
• Setting tolerances
• Understanding thresholds

BREAK

Reflow Soldering

• Methodologies:  Vapor phase, convection, laser
• Profile Objective
• Profile shapes (Straight ramp, ramp-soak-spike classic, Shoulder)
• Solder Paste/solder behavior during reflow

Troubleshooting common defects:

• Shorts
• Opens
• Solder balls
• Tombstones
• Head-In-Pillow
• Voiding

Cleaning (time permitting)

• Why clean - pictures of dendrites and corrosion
• NC vs OA
• Why clean the no-clean?
• ROSE testing vs ion chromatography
• The importance of monitoring the cleaning process

Q&A

About the Instructors:

Chrys Shea
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is an SMTA “Member of Technical Distinction” and three time SMTAI “Best of Conference” award winner for her research on solder paste printing. Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees.

Phil Zarrow

Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years.  His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies.  In addition to his background in reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems.  Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throught the world.  During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.

Since forming ITM Consulting in 1993, Phil Zarrow has helped numerous clients in such areas as

• SMT Implementation and Assembly facility set-up
• SMT Assembly and Soldering Failure Analysis
• EMS/Supplier Process and Quality Assessment Audits
• Counterfeit Component Avoidance and Interception Programs
• Manufacturing yield improvement
• Equipment Evaluation and Selection
• No-clean and lead-free solder paste evaluation and process implementation
• SMT Manufacturing Process Audits and process improvement
• On-site training for all levels of personnel
• Design for Manufacturability (DFM) specification development
• Reflow of Through-hole feasibility, development and implementation
• Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
• SMT process equipment benchmark testing and evaluation
• SMT product development
• Lead-free Process Implementation and Optimization
• Technical evaluations related to business acquisitions and mergers
• Technical assistance in legal disputes

Mr. Zarrow is a popular speaker and workshop instructor.  He has chaired anbd instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim.  He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books.  He is co-author of the book, "SMT Glossary- Terms and Definitions".  Mr. Zarrow holds two US Patents concerning PCB fabricationa dn assembly processes and audit methodologies.

Phil is a member of IPC, SMTE, IMAPS, a co-founder of ITM Consulting, and is a past national level officer and national director or the Surface Mount Technology Association (SMTA).  He was also Chairman of the Reflow Committee for SMEMA.  He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders' Award (2000).  Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forfront" and "Better Manufacturing" columms.  He is currently producer and co-host of IPC Update's "Boardtalk" audio program.

Contact Karen Frericks at 952-920-7682 with questions.

• Take the Wall-Triana Hwy exit toward Madison Blvd / Madison
• Keep straight onto Sullivan St.
• Turn left onto Palmer Rd
• Arrive at 261 Palmer Rd, Madison, AL 35758

Wednesday 17th April @ 9:30am India Time GMT+5:30 (12:00am US Eastern Daylight Time GMT -4)

Presenters: Ansuman Das, Ph.D., MacDermid Alpha Electronics Solutions

Free for members - only members will get access to recorded presentation!
Non-members: USD $10 

Members must log in to register with no fee. Non-members can pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: newprojs_ankan@yahoo.com +919620075752 or Madhukar Rao: +919686098690.

Overview

Although most of the PCB assemblies manufactured today involve no-clean process – many of the applications still demand the flux residue to be removed after soldering due to more stringent electrical requirements or due to the requirement from a downstream process. With the quantum of changes the electronics world has gone through in the past two decades, cleanability requirements for the PCB assembly have also changed to keep up with new requirements. Change in design, materials and manufacturing processes involved in assembling has also made the cleaning process more and more complex. In this presentation we will discuss the challenges faced by today's industry in terms of post soldering flux cleaning from the assembly and how to address such challenges with available methods. Discussion will explain the chemistry involved in cleaning different types of fluxes in different cleaning processes. It will also cover some of the methods to evaluate the cleanliness of the PCB assembly.

About the Presenter

Ansuman Das, Ph.D., is currently a formulation scientist and technology leader for MacDermid Alpha Electronics Solutions at the India Research Centre, Bangalore. He received his Ph.D. in Chemistry from University of Calcutta, India. Dr. Das has more than 14 years of experience in development of soldering fluxes and solder paste for board, substrate and wafer level applications.

Monday 29th April @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Flexible circuits is another packaging technology which has seen a growing and wider acceptance in the electronics industry. The advantages of surface mount reduced weight; decreased size can be further enhanced by flexible circuitry. In many cases, it is a misconception that flexible circuits have to flex, they don't; many flexibles are designed purely to aid the circuit design and assembly into the final product. In this case the substrate is only flexed or formed once. The range of constructions for circuit manufacture are wide but the basics are similar to existing printed circuit production. The design and selection of the manufacturing methods can affect the final cost of the circuit and need to be considered in detail prior to manufacture. Where design departments have limited experience useful reference material is available to engineers worldwide with the release of Flexible Circuit Technology, Third Edition by Joe Fjelstad and other publications.

Topics include:

• Flexible Design for assembly
• Manual assembly and soldering
• Automatic assembly process requirements
• The need for baking flexible circuits
• Flexible circuit pallets for automatic assembly
• Screen printing, placement, reflow soldering & AOI
• Manual hand soldering and de-soldering
• Rework of conventional and surface mount
• Solder joint Inspection
• Process defects on flexible circuits and during assembly

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

LED Do’s and Don’ts

Event Details

• Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
• When: 11am-1pm on May 3, 2019
• Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
• Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

• FREE for New Members since prior meeting
• $10 for Committee Members
• $20 Members, employees of Corporate member companies, 1st time guests, and students
• $25 non-members, students, & guests – same price
• Cash at the door or credit card on-line

Get your tickets!

• I'll be there - paying at the door (Click here)
• Members: I'll be there - paying now for 10% Early Bird Discount (Click here)
• Non-Members: I'll be there - paying now for 10% Early Bird Discount (Click here)

Abstract

What to do and not to do with LEDs in a surface mount process including Paste printing, Stencil Design, picking, placing, Reflow, and test.

Biography

• Attended University of Delaware.
• Worked for Motorola in Shaumburg, IL as a SMT Manufacturing Engineer.
• Worked for Allied Signal in DOD environment as a SMT Manufacturing Engineer.
• Worked for Quad Systems as a Field Service Engineer.
• Engineer for Decatur Electronics in microwave radar.
• Redesigned to Jugs professional radar gun used by Major League Baseball.
• Opened his own contract manufacturing business, Contract Assembly Service, Inc.
• Vice President of American Circuits located in Charlotte, NC.
• Director of Engineering. The Light Source, Inc. – Design and manufacturing of high-end theatrical stage lighting.
• Trans-Tec America territory manager.

Central Texas Electronics Association

Electronics Design, Manufacturing & Test Symposium 

Tuesday, May 14, 2019

AMD Bldg B500 Auditorium at 7171 Southwest Parkway

1. Michelle Sparks at michelle.sparks.ctr@navy.mil
2. Michelle Sparks

1. Valid Identification
   • Show valid identification usually valid driver's license from any REAL ID compliant state.
   • Currently only 5 jurisdictions are not REAL ID compliant: Illinois, Missouri, Minnesota, Washington, and America Samoa. Visitors with driver's licenses from those states will have to present an additional form of identification such as birth certificate or passport, with the exception of visitors who have either a Washington or Minnesota Enhanced Driver's License. Enhanced Driver's Licenses will be accepted as a sole form of identification.
2.  Show current proof of insurance and vehicle registration (Rental agreement if rented vehicle)

Monday 20th May @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Area Array Technology is part of mainstream electronics but until recently very few good inspection criteria were available in the industry. The assembly process for BGAs is fairly well understood for Tin/Lead alloys but with the move to Lead-free assembly, new QFN and LGA packages have critical issues to consider during inspection. The webinar covers optical and x-ray inspection of solder joints for both Tin/Lead and Lead-free terminations. It includes an introduction to the Lead-free assembly process with specific attention to BGA and area array devices. It provides a step by step guide to the procedure of inspection for optical and x-ray showing you how to do it. Inspection criteria are included for x-ray and visual criteria on different lead-free terminations and pad surfaces.

Topics include:

• Procedures for inspection joints optically and by x-ray
• Inspection criteria for joints
• Identification of key joint features
• Other indicators of possible failures
• Common BGA & bottom mounted failures

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

• Understanding the definition of the requirements, especially for the differentiation of the various criteria of acceptable, process indicators, no requirements, and defective conditions.
• Conflict resolution. As is written it is very difficult to interpret the results of an inspection if the contract states, that the product will be built and inspected to the requirements of J-STD-001. This document is a soldering document.
• Interpretation of the differences between, conductor and wire diameter as this was a difficult concept to understand my many in the industry.
• Review the meaning of Objective Evidence and this is a problematic area to substantiate a point and criteria.
• In the materials section, the need to qualify the materials being used or face rejection of the product as it was not build with qualified materials.
• The conversion to lead-free solders and other alloys and the due diligence to qualify those materials.
• Thermal profiles and the need of such.
• The solder connection.
• The definition of soldering a wire to a terminal and the new explanation of the visuals.
• Lead Trimming and the impact of cutting leads after soldering.
• The physical soldering requirements.
• The term discernible and what it means.
• Component with no class 3 requirements
• Section 8 cleaning section being re-written

Meeting Photos:
      

Sponsor for this event:

This year's technical program was absolutely outstanding and our exhibiting companies saw a considerable amount of face to face interaction with our expo and conference attendees! 

Sincere appreciation to our hard working technical committee for bringing together these spectacular presentations!

The most respected sign of approval in the electronics assembly industry 

Each SMTA Certification program is a three-day offering consisting of a 1.5-day workshop on topics in SMT Processes or Lean Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination (SMT Processes) and open book examination (Lean Six Sigma Green Belt.)

This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Lean Six Sigma Green Belt.

Why You Should Participate

• Enhance your stature in our industry
• Increase marketing value for your company
• Obtain proof of your knowledge and experience

The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level. The title earned by Certified SMT Process Engineers is CSMTPE or Lean Six Sigma Green Belt Engineer for Six Sigma.

​​​​​Duracion: Del 28 al 30 de Mayo, 2019.
Lenguaje: Ingles/Español 
Examen: Ingles 
Instructores: Jim Hall, ITM Consulting e Ivan Castellanos, Indium Corporation  

• 11:30 AM to 12:00 PM - Registration
• 12:00 PM to 12:30 PM – Lunch
• 12:30 PM to 1:30 PM – Presentation
• 1:30 PM to 3:30 PM – Q&A / Tour

Tuesday 4th June @ 9:30am India Time GMT+5:30 (12:00am US Eastern Daylight Time GMT -4)

Presenter: Shantanu Joshi, Koki Solder America Inc.

Free for members - only members will get access to recorded presentation!
Non-members: USD $10 

Members must log in to register with no fee. Non-members can pay by credit card online by clicking the "Register Now" button above. To pay by wire transfer directly to SMTA India - Bangalore Chapter, contact chapter president Ankan Mitra: newprojs_ankan@yahoo.com +919620075752 or Madhukar Rao: +919686098690.

Overview

In recent years, a growing number of electronic devices are being incorporated into automotive and other high reliability end products with the challenge to make these devices more reliable. The package size of the devices is largely driven by the consumer industry with their sizes getting smaller making it harder to assemble and be reliable at the same time. For automotive and other high reliability electronics product, it is of the utmost priority to secure high reliability because it directly involves human life and safety. Challenges include selecting an appropriate solder alloy and having good reliability of the solder paste flux residue with the presentation discussing ways to improve lead-free solder joint reliability/robustness. Though SnAgCu solder alloys fulfill most soldering requirements, alternative solders are needed to meet more stringent environmental regulations, requirements for greater mechanical reliability, and more demanding high temperature service environments such as under the-hood in automobiles and in avionics systems. Development was done on alternative lead-free alloys with varying percentages of tin-silver-bismuth-indium in comparison with a number of conventional lead-free solder alloys in soldering evaluations. Accelerated thermal cycling test was performed on boards assembled with various different alternative alloys and the results were compared with conventional lead-free alloys. For the solder paste flux, there is a need in automotive and other high reliability applications to have reliable and high insulation resistance even in an atmosphere of high temperature and high humidity. Development was done on a type of ‘crack free' flux paste to inhibit flux residue cracking under extreme environments making it more reliable to stringent surface insulation resistance and electro-migration criterion from automotive and other high reliability product manufacturers. Testing was done to various industry electro-migration and dew test standards.

About the Presenter

Shantanu Joshi is the Regional Sales Manager for KOKI Solder America. He has a Master of Science degree in Industrial and Systems Engineering from Binghamton University and Bachelor of Engineering degree in Production Engineering from Pune University, India. He also serves as a Secretary on SMTA Ohio Valley Chapter board.

He is currently pursuing Ph.D. in Industrial and Systems Engineering concentrating on High Reliability Lead Free Solder Alloys from Binghamton University. He is published over dozen papers in various national and international conferences over the years. His co-authored paper won the “Best of Proceedings” award in SMTA International 2013. Shantanu has also won 1st prize in the poster competition held at GE Global Research Center, Niskayuna, NY for poster titled "LGA Solder Joints with Superior Reliability".

¡Anunciamos el próximo evento SMTA-Juarez!
 
Información importante:

Fecha: Jueves, Junio 13, 2019
Hora: 5:30-9:00 p.m.  
Ubicación: Centro de Convenciones Cuatro Siglos
Dirección: Boulevard Juan Pablo II (Blvd. Cuatro Siglos) y Av. Arizona. Ciudad Juárez 32402
Conferencias:
a) Inspeccion de Rayos X en 3D para BGA y QFN
        Paolino Dominguez, Omron Services
 b)  Head in Pillow y evitar voids en BGA y QFN
       Luis Garcia, Rehm Thermal Services

Agenda completa:
17:00   Apertura y Registro.
17:30   Bienvenida y primera rifa.
18:00   Presentacion comite SMTA.
18:10   Presentación del tema “3D X Ray inspection on BGA and QFN”
            Paolino Dominguez, Omron Services.
18:50   Rifa / Networking.
19:00   Presentación del tema “Head in Pillow and avoid voids in BGA and QFN”
            Luis Garcia, Rehm Thermal Systems.
19:50   Presentación de Premios por trayectoria en Industria SMT.
20:00   Cena / Networking.
21:00   Clausura del evento.

Más información:
smtajrz@gmail.com
 

Vapor Phase Technology & Vacuum Soldering

Event Details

• Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
• When: 11am-1pm on June 14, 2019
• Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
• Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

• FREE for New Members since prior meeting
• $10 for Committee Members
• $20 Members, employees of Corporate member companies, 1st time guests, and students
• $25 non-members, students, & guests – same price
• Cash at the door or credit card on-line

Get your tickets!

• I'll be there - paying at the door (Click here)
• Members: I'll be there - paying now for 10% Early Bird Discount (Click here)
• Non-Members: I'll be there - paying now for 10% Early Bird Discount (Click here)

Abstract

Voids in solder joints are largely a function of differential pressure between vapor pressure of the gases inside of the joint and environmental conditions.  By entering joints still in their liquid state into decompression chambers, voids can be eliminated.  Equipment has been developed to achieve void-free joints under these conditions utilizing modern condensation reflow technology.

Biography

JB Byers, Managing Member, Technical Services, A-Tek LLC

JB Byers is co-founder and managing partner of A-Tek Systems Group. He has more than 20 years experience
in SMT manufacturing and is well versed in vapor phase reflow technology.

JB graduated in 1991 from Colorado Aero Tech with a degree in aviation electronics.  He is the primary liaison between Asscon Systemtechnik-Elektronik GmbH, the vapor phase equipment manufacturer and innovative technology leader, and the customer. He is well respected by his peers for his process knowledge and his customer service aptitude.

RSVP now,  request no later than 6/14/2019 to this link: https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4681

Please forward this invitation to others.

Steven Kummerl
Analog Packaging R&D & 

WW SMT Customer Support

Texas Instruments

Bio: Steven Kummerl received his B.S. degree in Mechanical Engineering from University of Texas El Paso. He is a member of technical staff at Texas Instruments supporting semiconductor packaging and has worked in the field of high volume/high mix surface mount assemblies and more recently at TI supporting sensor packaging R&D.  He holds over eighteen patents in the field of package design and has authored multiple publications focused in packaging design, SMT package assembly, & reliability.

Parking: Parking details will be sent after RSVP. 

Monday 17th June @ 2:30pm - 4:00pm UK Time (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

For many organisations through hole components will remain a reality for many years. More and more surface mount components are used in design, through hole is in decline, however the reality is connectors, transformers, switches, LCD displays and electrolytic capacitors are still necessary in many products. So what is the most reliable and cost effective solution to through hole soldering in a lead-free environment? Selective soldering has become more popular in the last few years for small and large companies alike. Selective wave and point soldering are both options but what are the realities with lead-free and high temperature solder alloys.

Topics include:

• Why use selective soldering
• PCB design rules for selective soldering
• Flux requirements for selective soldering
• Compatibility of solder masks and lead-free solder
• Setting up lead-free profiles, you must profile a selective process!!!
• Solder alloy choices
• Copper dissolution with selective
• Soldering defects on selective – Causes and Cures

In preparation for the event and to ensure you are equipped to get maximum benefit from the event, read our Webinar Guide.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

Hosted at Rockwell Automation

• June 18- Course (8:30-5pm)
• June 19- ½ day of course + exam
• June 20- All day exam (8:30-5pm)


• Instruction: English
  Test: English
  Instructor: Jim Hall