Calendar of Events

The SMTA Capital Chapter is excited to host a Chapter Meeting on January 10^th from 5:00 PM to 7:30 PM at ZESTRON, Manassas, VA. Fred Dimock, BTU International, will be presenting “Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data.”
 
This presentation will provide an overview of the vacuum reflow process and explain the reason vacuum reflow is of interest to the electronic assembly industry.  The presentation will also include a report on preliminary data from a void reduction experiment completed at the Universal Instruments Process Laboratory.
 
Fred Dimock, Manager of Process Technology at BTU International in Massachusetts, has extensive experience in thermal processing and has assisted many companies with process refinements over the years. Fred has authored numerous articles on lead free solder, process control, and the operation of continuous furnaces. He also wrote the chapter on solder reflow for the “Handbook of Electronic Assembly and A Guide to SMTA Certification” by Dr Lasky and Jim Hall. He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard.
 
Don’t miss out on dinner and a facility tour prior to the presentation. Registration is free for members and $30 for non-members. The registration fee will be waived if you join the Capital Chapter during this event!
 
The evening is scheduled as follows:
5:00-6:00 PM Registration, Networking & Dinner
6:00-6:30 PM Facility Tour
6:30-7:30 PM Presentation
 
The SMTA Capital Chapter Meeting Location:
Zestron Corporation
11285 Assett Loop
Manassas, VA 20109

Selective Solder

Event Details

• Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
• When: 11am-1pm on January 11, 2019
• Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
• Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

• FREE for New Members since prior meeting
• $10 for Committee Members
• $20 Members, employees of Corporate member companies, 1st time guests, and students
• $25 non-members, students, & guests – same price
• Cash at the door or credit card on-line

Get your tickets!

• I'll be there - paying at the door (Click here)
• Members: I'll be there - paying now for 10% Early Bird Discount (Click here)
• Non-Members: I'll be there - paying now for 10% Early Bird Discount (Click here)

Abstract

Coming Soon!

Biography

Jonathan Wal, President of Pillarhouse USA. Full bio coming soon! 

Monday 14th January @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Millions of crimp joints are produced every year and are used in many high reliability applications. Care in the preparation and achieving the standards of the IPC, MOD and other international standards are vital. This webinar covers the use of crimp connectors and other mechanical connection techniques. We highlight the process controls which are necessary in today's manufacturing environment along with a system to control materials and equipment to allow repeatable and reliable terminations.

Each delegate will receive a copy of all of the slides presented plus a set of posters on soldering to print on site for future training.

Topics include:

• Introduction to crimping and cable termination
• Training standards and practical skills techniques
• Cable types and striping
• Striping tools
• Establishing strip lengths
• Crimp types
• Compatibility of crimp terminations and wires
• Crimping tool operation

Practical examples covering:

• Wire preparation
• Crimping conductors
• Inspection criteria for wire and crimp joints
• Testing tools and joints
• Wire wrapping and press fit terminations
• Termination failures

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

• 2:00 to 2:15 PM - Registration
• 2:15 to 2:20 PM – SMTA announcements
• 2:50 to 3:40 PM – Clark’s Presentation
• 3:40 to 4:00 PM – Q&A
• After 4 PM – Social hour

The SMTA invites all NEW Chapter Officers to the "Mini in Minny" Chapter Officer's Leadership Forum

Develop leadership skills, learn the ins and outs of running a chapter, and put faces to names at SMTA HQ at our orientation weekend for all brand new SMTA Officers. Move forward with enthusiasm and confidence as effective leaders in your chapter.

2019 SMTA Leadership Forum Agenda

January 18, Friday     DoubleTree Minneapolis Park Place

Arrivals

7:00 p.m.   Registration and Welcome Happy Hour at DoubleTree Hotel
Hors d'oeuvres, wine, and beer will be served

Sponsored by:

January 19, Saturday SMTA Office, Eden Prairie, MN

8:00 a.m.  Transfer to SMTA Office

Sponsored by 

8:30 a.m.   Breakfast

9:00 a.m.   "SMTA 101" Information Sharing Sessions
Topics covered will include:

• How is the SMTA Structured?
• Your Online Dashboard
• Annual & Long Range Planning
• Best Practices:
  o Membership
  o Meeting Planning
  o Chapter Finances
• Resources and Benefits for Officers
• Leadership Position Descriptions

12:00 p.m.   Working Lunch

1:00 p.m.     Sharing Sessions Continue

5:00 p.m.     Transfer back to DoubleTree Hotel

Evening      Fun and Games at Punch Bowl Social, Minneapolis
Dinner and entertainment included

Sponsored by:

January 20, Sunday

Departures

DRESS CODE:  The Forum weekend dress code is casual.

Logistics: Hotel, Travel & Events

TRAVEL ARRANGEMENTS

If you plan to attend the 2019 “Mini in Minny” Chapter Officer Leadership Forum, SMTA requests that you attend the Welcome Reception Friday, January 18, at 7:00 p.m. (PLEASE factor in baggage claim and transportation to the hotel) and be present at all events Saturday, January 19. You are free to make your return airline arrangements whenever convenient on Sunday, January 20. There are no formal SMTA events on Sunday. 

TRANSPORTATION OPTIONS:
• Super Shuttle: 612-827-7777 or 1-800-BLUE-VAN
• Bus Transportation Information: www.metrotransit.org
• Car rental with your choice of service, Uber or Lyft
SMTA will provide transfers for the events on Saturday, January 19.

HOTEL ARRANGEMENTS

DoubleTree by Hilton Minneapolis – Park Place Hotel
1500 Park Place Blvd., Minneapolis, MN 55416

Make your hotel reservations online by Friday, January 24, 2019.
The negotiated rate is $102 plus tax per night for a standard room.

Book Your Hotel Here!
Just select dates and guests and click "continue" (leave default special rates section as is)
Booking via Phone: 1-800-245-9190, ask for group code "SMTA"

Reservations requested after January 4, 2019 will be accepted as long as availability permits on a first-come, first-serve basis, but will be at the higher prevailing rates versus the special group rate. You will need to guarantee the first night’s room and tax with a credit card or check advance deposit. You can cancel your reservation two days prior to your scheduled arrival without incurring any cancellation charge. Cancellations after that point and no-shows will forfeit the first night’s room and tax deposit.
Check-in time is 3:00 p.m., and check-out is 11:00 a.m. You will need 2 nights (arriving 1/18/19 and departing 1/20/19). Amenities include coffee maker, iron and ironing board, hair dryer, mini-fridge, WiFi access, as well as a warm chocolate chip cookie upon arrival and other in-room amenities.
If you choose to stay at a different hotel or make other arrangements you will need to make your own transportation arrangements to all events.

Funding & Sponsorships

$ FUNDING $

The SMTA Officer’s Leadership Forum is open to all NEW officers. All food and beverage during the duration of the program will be covered by SMTA. Entertainment and instruction is also included for all qualifying new officers.
Each officer is responsible for his or her travel to Minneapolis and hotel expenses. We have arranged a discounted room block at the DoubleTree Minneapolis Park Place of $102 plus tax per night. We hope that your employers understand the value of the benefits of SMTA membership and will support your trip. If not, Forum expenses are acceptable chapter expense items within the SMTA and Chapter Bylaws. All new officers must discuss it with your President and Treasurer before you make any non-refundable airline or hotel arrangements.
If it is impossible for your company or chapter to fund travel expenses, ask Karen (karenchapters@smta.org or 952.920.7682) about our financing assistance. We want to work with you to ensure that all new officers are able to attend.

SPONSORSHIPS

Please help us to make this important event happen. Consider becoming a sponsor and invest in your future officers.

SPONSORSHIPS AVAILABLE:

• Sponsor an officer’s travel: $100-$1000+ (multiple sponsors)
• Welcome Reception Sponsorship: $100-$350 (multiple sponsors)
• Saturday Evening Event Sponsorship: $250-$500

ANY SPONSORSHIP, ANY AMOUNT IS WELCOME!

All Forum Sponsors will be introduced at the Welcome Reception, receive verbal recognition and signage recognizing the sponsors during the event to show our appreciation of your chapter's support of your peers.

Thanks to our current chapter sponsors!

Monday 11th February @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Solder paste quality and performance is significantly important and considerable engineering goes into its production. Selecting the best materials for your product and assembly process is key to high yield and your customers satisfaction. Solder paste must be compatible with your equipment and other processes you use like, cleaning, coating and electrical test. Working with suppliers to achieve the best performance is vital but so is periodic review of materials used.

There are always improvements being made to printing and jetting technology and its important that engineers consider are there technical or commercial reason to change. We look at common testing methods and some of the simple shop floor techniques used over the years to understand the different types of process failures.

Each delegate will receive a copy of all of the slides presented plus a set of posters on soldering to print on site for future training.

Topics include:

• Solder paste type
• Low & high temperature alloys
• Solder beading
• Solder slump
• Reflow spitting
• Flux condensation
• Printing trials & test boards
• Common paste & print failures

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

Tuesday, February 12, 2019 | 2:30pm GMT (9:30am US Eastern Time)
Presented by: Keith Bryant, SMTA Europe

Free for members!

What You Can Learn From This Course:

This webinar is FREE to attend and is provided by SMTA Europe. The webinar will be presented by Keith Bryant and will also include a brand-new guide to defects produced by Keith and available to SMTA members. During the presentation the methods of detecting defects in manufacture will be discussed and the growing need for more advanced methods.

With many years working in PCB manufacture and assembly Keith has investigated most defect types. As component and substrate technology becomes more advanced, new issues require modification to inspection methods which will be considered during the session.

The BGA & Area Array Defect Guide is a colour booklet featuring both optical and x-ray examples of common and not so common defects. The examples may be cosmetic or electrical failures found during investigation in manufacture. Each defect type is discussed with possible causes and cures. This guide is one of many guides being made available from SMTA.

During the webinar the following will be discussed:

• Area Array Inspection methods
• Inspection criteria

Selected defect types include:

• Opens
• Shorts
• Voids
• Head on Pillow
• Solder wicking
• Solder beads
• PCB plating variations
• Plating voids

This is a Surface Mount Technology Event for Government Specification Industry Organizations, Engineers, Sales, Production Control, Marketing, and Manufacturing.

Its our pleasure to invite you to our Surface Mount Technology Event on February 19th 2019 at PACE.  You will get to see a live demonstration as well as an excellent presentation.  There will also be great food!  Do not miss this event.  Do not hesitate to get in touch with us should you have any questions.  We hope to see you there.

SMTA Capital Chapter Team!!!


Non-Destructive BGA/Area Array Component Rework

Abstract: In the past 20 years, such mundane operations as soldering, desoldering and component replacement have become complicated by extreme micro-miniaturization, the use of lead-free solders, new thermally challenging pc boards, heat-sinking bottom terminated components and intricate component packages that are difficult to rework or install. One area that presents unique challenges is BGA/Area Array rework. Modern boards that use these components are more technically demanding than ever, requiring skilled operators who are highly competent at accomplishing delicate, intricate soldering and rework tasks. Unfortunately, many operators will cause more damage to the assembly or components due to his/her rework actions. As a result, many manufacturers struggle to repair or rework boards, opting to throw away lower value boards or hire outside contractors to perform the more difficult repairs. This presentation will review current techniques and procedures for performing highly reliable, high-quality rework and repair on some of the more difficult BGA packages, and will include live demonstrations of BGA rework using available convective and infrared heating techniques. The presentation will address typical BGA/area array components, heating technologies (convection and infrared), the importance of bottom side preheating, flux application, solder paste stenciling, device alignment methods and thermal profiling techniques, followed by a live demonstration of BGA rework.

Aaron Caplan Biography: Aaron Caplan is the Director of Marketing & Training for PACE Worldwide, a company solely focused on providing innovative, cost-effective solutions in hands-on soldering, rework and repair of advanced electronics to companies and government around the globe for well over 50 years. Mr. Caplan has been involved in electronics manufacturing technology since the 80's and is an acknowledged expert in Miniature/Microminiature Electronics Repair. A CIT in IPC-7711/IPC 7721, he provides technical expertise in teaching of non-destructive PCB rework/repair techniques, educating industry on how to properly utilize these techniques. In addition to his marketing duties, Mr. Caplan also coordinates the Training Department and Video Production Team, providing direction for a wide variety of video production projects.

Tuesday, February 19, 2019 1:00pm to 2:30pm Eastern
Presented by: Bob Wettermann, BEST Inc.

What You Can Learn From This Course:

This webinar is a “how to” guide for reballing intended for PCB rework and repair depots as well as device reclaimers. These sessions will take those interested in reballing devices through the entire process of setting up the equipment, developing and verifying the process. The first topic will cover the need for reballing of BGAs, CSPs and other devices. The second section will focus on the equipment set recommended for reballing and the third section the various process steps for reballing a device. A variety of different methods for both deballing and reballing will be discussed with the various advantages and disadvantages discussed to each approach.  Both plastic-packaged parts as well as ceramic parts reballing will be discussed. Inspection of the reballed components, the type of reliability testing data currently publicly available will be reviewed as well as some ideas for developing your own specifications of you want to outsource this activity.

This webinar is designed for process engineers, rework technicians and others interested in repairing electronics.

Instructor Bio:
Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.

Co-located with Guadalajara Expo.

• March 12- Course (8:30-5pm)
• March 13- ½ day of course + exam
• March 14- All day exam (8:30-5pm)


• Instruction: English/Spanish
  Test: English
  Instructor: Ivan Castellanos

Monday 18th March @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

The presentation provides a better understanding of solder paste selection and the use of stencil printing in modern fine pitch manufacture. Surface mount components are now at lead spacing of below 0.020″, only the correct selection of solder paste and specification of stencils can lead to effective printing. The session aims to provide a basic understanding of the design, production and quality control issues, both theoretical and practical issues of printing conventional surface mount and through hole for intrusive reflow.

Topics include:

• Design of lands and apertures for fine pitch SMT & BGA
• Through hole printing requirements
• Selection of stencils
• Evaluation of solder pastes
• Practical machine set-up and trial prints
• Elimination of board wash-off
• Assessment of paste and stencil combinations
• Solder paste inspection, measurement and quality control
• Stencil Inspection and quality control
• Cleaning stencils
• Printed board requirements for printing fine pitch

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here

• Solderability Issues from the PCB Fabrication Perspective
  • Speaker – Yaad Eliya
    • Synopsis:
      • The speaker will discuss the PCB Manufacturing process and how it has a direct effect on the solderability process.
      • Items such as plating technique (DC plating vs. Reverse plating), Final finished and other processes that effect the assembly.  
• Design for Reliability
  • Speaker – Yaad Eliya
    • Synopsis:
      • The speaker will discuss how design aspects can directly affect the reliability of the raw card at the assembly level
      • Items such as Non-functional pads, via-fill, cross hatched grounds, conductor routing, PTH preparations etc.… and their effects on reliability  
• RF/Microwave Design Considerations and Options
  • Speaker – Yaad Eliya
    • Synopsis:
      • The speaker will discuss the Do’s and Don’ts for RF & Microwave success -
      • Items such as materials, lamination cycles, Single vs. double cavities and “Air Cavity” for varying frequencies will be discussed. 
• Thermal Mitigation Options at the Raw Card Level
  • Speaker – Jim Barry
    • Synopsis:
      • The speaker will discuss the options available for Thermal mitigations at the raw card level.
      • As designs get smaller and faster, high temperature is becoming a big issue – we will look at Materials, Heatsinks and Coins to help mitigate heat. 
• DFM at the PWB Stage
  • Speaker – Shlomi Danino
    • Synopsis:
      • The speaker will discuss what happens with the PCB Design once it reaches the PWB Manufacturer – the “upfront process”
      • We will review how design decisions can affect reliability, IPC Classifications, cost and lead-time. 

• Enhanced Flex Materials
• Cavity Applications
• Improved PCB Processing tools
• Stacked Via process and reliability

• March 19 Course (8:30-5pm)
• March 20 ½ day of course + exam
• March 21 All day exam (8:30-5pm)


• Instruction: English
  Test: English
  Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
  Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
• Enhance your stature in our industry
• Increase marketing value for your company
• Obtain proof of your knowledge and experience
• The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.

The conference will focus on building reliable electronics used in power electronics and harsh environments.

• BGA Solder Joints
• Bottom Terminated Components
• Voids
• Mixed Lead Free and Tin Lead Soldering
• New Cleanliness Standards, J-STD-001 Requirements 

The human body is an extremely complex "electrical (neurological) system", with companies continuing their quest to understand and improve capability as related to neural interface, basically connecting the human body directly into computers! There is no question, capabilities in smart phone/watch technologies connected to the internet erases any doubt of the potential to connect people to computers.

With the brain being the human equivalent of the "MicroProcessor", semiconductor companies such as IBM, Intel, MicroChip and MicroSemi have been well aware of potential for connectivity. Others have taken knowledge of neural interface to help humans manage their internal electrical systems, including Medtronic, Philips and Abbott, with a range of pacemakers, defibrillators and neural therapies.

Expanding the potential scope of linking the brain to computers and to the internet has attracted the likes of Amazon, Apple, Facebook, Google, MicroSoft, Neuralink and others, adding to the list that already includes J&J, G.E., T.I., Stryker, and Edwards. MicroProcessors and other ASIC Chips, coupled with MEMS and Sensors, are now seen as the “next big thing” over the next 5 years looking at the Internet of Things.

This event will bring together experts to cover topics such as:

* Forecasting and Analytics

* MEMS, Sensors and Integrated Circuits

* Implantable Devices and Neural Interface

* Medical Robotics, Equipment, and Prosthetics

* Advanced Materials and Reliability

The International Conference for Electronics Enabling Technologies (ICEET), formerly ICSR, is a highly technical three-day event in Toronto, ON, Canada.

Electronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.

The forerunner conference of ICEET, the International Conference for Solder and Reliability (ICSR), grew to be a premier technical conference for all aspects of solders, metallurgy and the solder interconnect process, through the period of conversion to lead-free solder, driven by RoHS and WEEE. The ICEET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, potting and other methods to achieve high reliability in aggressive environments.

Thanks for attending the Symposium on Counterfeit Parts and Materials June 26-28, 2018. Plans are underway for the 2019 event. Check back here for details.

Dr. Michael Azarian, CALCE, speaks during the panel discussion 'How is AS6171 Being Flowed Down? Challenges with AS671 Accreditation--Can it Handle Obsolete Part?' at the 2018 Symposium.

Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.

Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering manufacturing and assembly of electronics, advanced packaging/components, inspection technologies, processes, substrates/PCB technology, soldering, quality and reliability.

SMTA and Chip Scale Review are pleased to announce the 16th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.