Calendar of Events

   2018      

                                   

2018

January 25

Rocky Mountain Expo & Tech Forum  +

Location: West Club at Mile High Stadium
1701 Bryant Street
Denver, CO 80204


Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $40 per outlet. Early bird pricing ends on December 22nd, 2017! Important Exhibitor Materials:



Attendees

Online registration is now closed. Please register on site. Mark your calendars and plan to attend what is expected to be the Rocky Mountain event of the year. The SMTA Rocky Mountain Chapter is now taking registration for their 2018 Expo. We are expecting a sold out event, connecting exhibitors, and bringing the latest technology to the Rocky Mountain region while presenting impactful and meaningful technical sessions for your continued professional growth. Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Mile High Stadium Backstage Tour of Mile High Stadium
As a special treat, we will have a backstage tour of Mile High Stadium for 25 attendees. Registrations are limited so book early. Cost for the tour is $25 per person – a bargain for the opportunity to go behind the scenes of the Denver Broncos. Tour will run at 1:00pm.

Click Here for Parking Information


Free Technical Program:
8:00AM
Registration opens

A Special Thank You To Our Coffee Sponsor:






9:00am – 9:45am
Rob Chambers Electronics Going Sky-High
Rob Chambers, Lockheed Martin

Human space exploration is growing in global interest and significance, with unprecedented interest in and excitement about expanding human presence beyond low Earth orbit to the moon and on to Mars. NASA’s Orion spacecraft is at the vanguard of this effort. Designed and built by Lockheed Martin in Denver, Orion represents the state of the art for high-reliability, high-availability, robust avionics and software architectures and components for long-duration deep space missions. Chambers will provide an overview of Orion, the avionics challenges unique to flying humans out to the final frontier, and the future of humanity’s scientific exploration of our solar system.

10:00AM
Expo Opens

11:15am – 12:00pm
Greg Vance Modeling an SMT Line to Improve Throughput
Greg Vance, Rockwell Automation

One of the major challenges for an electronic assembly manufacturing engineer is determining how a SMT machine will impact throughput. Typically an SMT equipment supplier will ask for few (5-10) products to simulate the throughput capability of their machine. Unfortunately, if the engineer works in a high mix low volume environment he may need to know the impact of a new machine on a 1,000 or more products. Currently there are a lack of simulation tools to model this. This is confirmed in the IPC Technology Roadmap for Electronics Interconnections 2015 it states “In order to better deal with the demands for increased interconnection density and respond to market demands for better return on capital investment in assembly equipment, there is a need within the manufacturing industry for continued improvement in tools and software for modeling and simulation. Needs in this area include better methods of load balancing and improved machine utilization? The tools for determining the balance on assembly lines will need to be flexible to handle the mix of assembly types that manufacturers now face.”

Rockwell Automation partnered with Universal Instruments to develop a tool to model a large quantity of products and the impact of SMT line configurations. The information used for the modeling includes placement per panel information and machine components placed per hour capability. With these tools an electronic assembly plant can be modeled and analyzed to identify improvement opportunities and perform “what if” analysis to model impact of machine changes.


12:00pm - 1:00pm
Join us for a complimentary lunch and networking on the Show Floor!
A Special Thank You To Our Lunch Sponsors:











2:00pm - 2:45pm
Will Webb DfX – Design For Excellence using EMS 4.0
William E. Webb, ASTER Technologies LLC

Design for Excellence (DfX) can be used as part of an organization’s Continuous Improvement Programme to decrease product development time, product cost and manufacturing cycle time, while increasing product quality, reliability and ultimately the customer satisfaction. It will significantly decrease the overall cycle time from the design concept to customer delivery, which is a critical success factor. Design for Excellence makes it possible to implement a Lean Test approach that produces a lower cost product whilst maintaining the highest quality.

ASTER’s vision is articulated on two principles: 1) Using traceability and repair loop information in order to qualify the customer defect universe. The defects include design defects, manufacturing defects and functional defects. 2) Importing the defect opportunities and identifying the possible consequences of inadequate testability and test coverage on a new design.

3:00pm - 4:00pm
Meet and Greet with the Best in the Business! Join us after the show for Networking and Celebration at the West Club at Sports Authority Field

A Special Thank You To Our Reception Sponsor:

 


January 29

SMTA Webinar: Moving from "F" to "G"- Changes to IPC A-610/J-STD-001   +


January 29, 2018
1:00pm-2:00pm Eastern
Presented by: Norman Mier, BEST
Complimentary Webinar for Members!

Summary:
This webinar discusses at a high level the newest versions of the IPC A 610 (Acceptability of Electronic Assemblies) and the companion J-STD-001 (Requirements for Soldered Electrical and Electronic Assemblies) specifications which came out late in 2017. Heading in to the new year there will be some changes in inspection criteria and board assembly process specifications. The IPC-A-610 document is one of the most widely-circulated by the electronics assembly industry. It defines the acceptance standard for assembled boards. The companion JSTD-001 is a document describing how boards should be assembled. Both of these document shave been "up-rev'd" to version "G" from version "F" effective November 2017. Both documents most significant and important changes will be highlighted in this session. If you have already purchased your copy of revision "G" of both documents then please e-mail specific questions to Norman ahead of time so that your issue, time allotting can be addressed in this one-hour session.

Intended Audience:
Process engineers, QC inspectors, designers and procurement personnel all use the IPC-A-610 document and could find use in the review of the new documents. IPC trainers within companies will also find some good information as they prepare for their new 2018 certification classes.

Topics will include:

  • New figures in tables and acceptance criteria updates in Butt/I Connections (610)
  • Cross referenced and added applicability of both MIL and international standards for worldwide acceptance (JSTD)
  • New figures and requirements for various cable configurations (JSTD)
  • Variety of criteria for various SMT components was updated (JSTD, 610)
  • Scope and purpose sections updated as well as an objective section were added (JSTD)
  • Wiring section changes were made to variety of topics (610)
  • Changes to supported hole acceptance criteria including but not limited to solder conditions and meniscus in solder (610) Norman Mier

Bio:
Norman Mier is a U.S. Marine Corp. retired veteran with over 20 years of experience in the electronics rework and repair industry. He received his training through the Navy's Micro Miniature (2M) Electronic Repair Program. He has progressed through every level of rework and repair recognized in the industry. Norman has also earned the highest certifications awarded by IPC in electronics training, being certified as a Master Instructor in IPC A-610, IPC J-STD-001D, IPC/WHMA-A-620 and IPC 7711/7721. He has worked through BEST for several electronics industry leaders and created tailored courses for their equipment. This also includes providing training to technicians and engineers in surface mount and advanced surface mount technology. The knowledge Norm has brought to these companies has been invaluable to their process improvement efforts. His skill has also been a major factor in keeping BEST training at the forefront in the electronics-training field. He has taught several sessions at local and international conferences as part of APEX, SMTA International.


January 30

Massachusetts (Boston) Chapter: Advancement in Microelectronic Packaging for Medical Implants  +

Location
Holiday Inn Hotel & Suites, Marlborough, MA



SMTA Boston Chapter and iMAPS New England cordially invites you to attend a joint meeting on Tuesday Jan. 30, 2018 at the Holiday Inn Hotel & suites in Marlborough, MA
Advancement in Microelectronic Packaging for Medical Implants - Solving the Need for "More" with "Less" Space
By Caroline Bjune, Sr MTS, Draper
Date: Tuesday, Jan. 30, 2018
Time: 5:30 PM to 9:00 PM EST
Location: Holiday Inn Hotel & Suites , Marlborough, MA
265 Lakeside Ave.
Marlborough, MA 01752
Cost: See registration link below
Caroline will present approaches in microelectronics packaging taken for several systems, including a cranial mounted neural interface, peripheral nerve interface for advanced prosthetics, and ultra-miniaturized neural stimulator.
Click here for more details

Click here to register for this event

For questions about registration, please contact iMAPS Registration Chair: 
Matt Bracy
matt@msdsales.com
603-774-5894


January 30

SMTA Webinar: Certification Program  +

Join us for a free informational webinar on the SMTA Certification Program!


January 30, 2018
1:00pm-2:00pm Eastern
Presented by:
Jim Hall, ITM Consulting
Ronald Lasky, Ph.D., Indium Corporation/Dartmouth College
Summary:
Take advantage of this opportunity to familiarize yourself with the SMTA Certification program and learn more about the process and requirements. You will hear from Certification instructors and have the chance to ask them questions. This webinar will be recorded and made available to registered attendees afterward so even if you can't make the live event, you can access the Webinar. Sign up today to reserve your spot! Intended Audience:
The program is intended for manufacturing and process engineers. Additionally, production, design, test and quality engineering personnel, as well as SMT assembly managers who want to confirm their current competence at a fundamental level of overall process technology should also consider participating. Jim Hall Jim Hall Bio:

  • SMTA Processes Certification Instructor
  • ITM Consulting Principal Consultant
  • Over 35 years experience in electronic assembly technology
  • Experience in developing Vapor Phase and Convection reflow soldering systems
  • Engineering expertise in process development and integration, fluid and thermodynamics and computer control systems
  • Written and presented numerous technical paper and professional development workshops at SMTAI, APEX, and other industry venues
  • Co-creator of the SMTA Processes Certification program Dr. Ron Lasky Dr. Ron Lasky Bio:
  • SMTA Lean Six Sigma Green Belt Certification Instructor
  • Indium Corporation Senior Technologist and Dartmouth College Visiting Professor
  • Over 35 years in electronic and optoelectronic packaging
  • Author of 5 books and numerous technical papers
  • Holder of numerous patent disclosures
  • Developer of several new concepts in SMT processing software
  • 2003 SMTA Founder's Award Winner
  • Lean Six Sigma master black belt instructor


February 1

Ohio Valley Chapter: Solder Roundtable Technical Meeting - Southern Ohio  +

Location
Rhinegeist Brewery, Cincinnati, OH



When: February 1, 2018
Where: Rhinegeist Brewery in Cincinnati, OH (Tours available) 
(
http://www.rhinegeist.com/)

RSVP Today - Deadline to register is Jan. 26, 2018 (https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4366)


Technical and product presentations from:
  • Shea Engineering Chrys Shea presents: Stencil and solder paste inspection for miniaturized SMT components
  • Henkel Dr. Mark Currie and Dr. Neil Poole presents: Development of a solder paste test vehicle for miniaturized surface mount technology
  • Indium Corporation Brook Sandy-Smith presents: Avoiding the Pitfalls of Voiding in PCB Assemblies
  • FCT Assembly/Blue Ring Stencils Tony Lentz presents: Advantages, benefits and durability of stencil nano-coatings
  • AIM Tim O’Neill presents: Evolution of lead free solder alloys
  • Alpha Assembly Solutions Jason Fullerton presents: Cleanliness testing and its relationship to flux reliability
  • KOKI Solder America Inc. Shantanu Joshi Presents: Ultra fine-pitch printing and reflow of 03015 and 0201 metric chip components


Meeting Agenda:
8:00 AM - Registration
8:30 AM - Chrys Shea, Shea Engineering
9:15 AM - Dr. Mark Currie & Dr. Neil Poole, Henkel
10:00 AM - Break
10:15 AM - Brook Sandy-Smith, Indium Corporation
11:00 AM - Tony Lentz, FCT Assebmy/Blue Ring Stencils
11:45 AM - Lunch & Tour
1:00 PM - Tim O'Neill, AIM
1:45 PM - Jason Fullerton, Alpha Assembly Solutions
2:30 PM - Break
2:45 PM - Shantanu Joshi, Koki Solder America Inc.
3:30 PM - End


Meeting Fee:
  • Members = $35
  • Nonmembers = $55
  • Join SMTA for $95/yr and your first meeting is free.
Get Directions Here

Abstacts:
Avoiding the Pitfalls of Voiding in PCB Assemblies
Brook Sandy-Smith, Indium Corporation

Bottom termination component use has increased very quickly throughout the last decade. Typical assemblies now have many of these components, often varying types of BTCs on one assembly. What is there to do when one or more starts to show increased variation within the same process? Many investigations have been conducted to find materials that offer the lowest voiding in large ground plane solder joints. In addition, there are many process modifications that have been proposed over the last decade to alleviate voiding in BTC components. These include but are not limited to: pad design, pad patterning, stencil design, via positioning, solid solder addition, and reflow profile optimization.
Furthermore, improved pad design strategies have been proven in the industry. IPC committees are updating the recommendations for design and implementation of BTCs including big changes to the IPC-7093. This presentation will discuss these changes and how these strategies can be used to minimize voiding and ensure robust BTC assemblies.

ADVANTAGES, BENEFITS AND DURABILITY OF STENCIL NANO-COATINGS
Tony Lentz,  FCT Assembly, BlueRing Stencils

Nano-coatings have been introduced by various stencil manufacturers, with the promise of addressing some of the challenges of solder paste printing.  Stated benefits of nano-coatings include:  reduced underside cleaning, reduced bridging, improved solder paste release and improvements in yield.  With several Nano technologies already on the market and more likely to be introduced, how can the performance be quantified?  How robust are these coatings? How long do they last?  How can an assembler approach the ROI of these coatings? What hidden benefits or negative impacts should be considered?
This presentation gives a rigorous method for evaluating the performance and economic benefits of solder paste stencil nano-coatings. Criterion such as underside cleaning, bridging, solder paste deposit geometry, post-print cleaning, and abrasion resistance, durability of the coatings were all considered.  Transfer efficiencies were studied across aperture sizes ranging from 0.30 to 0.80 area ratios.  Also investigated were the effects of nano-coatings on transfer efficiencies of a variety of solder pastes.  This presentation also addresses durability of nano-coatings in relation to the number of print cycles and underside wipe cycles applied as well as materials used for the underside wipe process.  Guidelines for maximizing the life of the nano-coatings are given.

Cleanliness Testing and Its Relationship to Flux Reliability
Jason Fullerton, Customer Technical Support Engineer, Alpha Assembly Solutions     
                                                      
Cleanliness testing of printed circuit board assemblies (PCBAs) is a practice that was originally developed in the 1970s to assess the effectiveness of post-soldering cleaning processes. As no-clean soldering technology was developed in the late 1980s and into the 1990s, the practice of testing the “cleanliness” of a PCBA has been performed in an attempt to determine the acceptability of assemblies that have not been exposed to a cleaning process. This practice continue to this day.
This presentation outlines the basic theory of Surface Insulation Resistance (SIR) testing as a means of quantifying the performance of fluxes used as no-clean soldering materials. Testing of solder pastes using Resistance of Solvent Extract (ROSE) methods is compared to SIR testing of those materials, and localized extraction cleanliness testing of liquid wave soldering fluxes is compared to SIR testing of those materials.
The divergence in the pass/fail results between the cleanliness tests and SIR results for the flux materials tested is explored. Information on the proposed changes to IPC/J-STD-001 as a result of this new understanding of the relationship between cleanliness testing and flux reliability is provided.

Lead-free Solder Paste Development for Ultra Fine-Pitch Printing and Reflow of 03015 and 0201 Metric Chip Components
Shantanu Joshi, Koki Solder America Inc.

Due to the widespread popularity in mobile devices such as wearable devices and smartphones, demand for miniaturized or micro surface mount components, such as 0201 metric chip, flip chip packages, and fine-pitch surface mount land patterns to accommodate them are increasing. Consequently, solder paste is required to be compatible with this high-density surface mount technology.
When printing paste for 0402 metric chip components, stencil apertures of approximately 0.2mm diameter are used whereas for 0201 metric chip components, stencil apertures of the dimension 0.1mm diameter are needed. This presents challenges for both good printability and solderability. Conventional solder paste technology seems to be lacking in coping up with these stringent requirements.
Precise printability and optimum solder reflow parameters were evaluated on ultra-fine pitch surface mount board pads using conventional solder paste and a newly developed solder paste to understand compatibility with 0201 and 03015 metric chip components.
A test vehicle was used with 0402, 03015 and 0201 metric chip components. Type 5 (10-25um) and Type 6 (5-20um) no-clean lead-free Sn3Ag0.5Cu solder pastes were evaluated with two different stencil thicknesses,50um and 80um. The area apertures ratios varied from 0.28 to 0.94. The measurements of paste volume after printing were recorded using production solder paste inspection equipment.
After printing reflow studies were conducted on assembled 03015R and 0201C metric chip components to understand reflow behavior. The solder paste development included flux improvement to increase stencil release rate of the solder paste through the stencil apertures for the challenging stencil area aperture ratios used. The newly engineered heat resistant flux chemistry in the solder paste helped to reduce solder graping during reflow even with the small paste deposits on the board. Continual solder paste print studies as well as print to pause studies were conducted with the developed solder paste on 0201 metric and 0.3mm pitch QFP board land pads to understand the use of the solder paste in production. The results of the work will be discussed in detail.

 

SOLDER PASTE QUALIFICATION TESTING FOR EMS PRODUCTION
Chrys Shea, Shea Engineering

In the world of solder pastes, one size does not fit all, which is why so many different formulations exist. The myriad of options can be overwhelming, and matching the right product to the operation can be confusing, time consuming and costly.
When a small EMS provider determined it was time to update the SMT process chemistry, they needed to develop a test program that they could execute efficiently while keeping production running and costs under control. The result is a consolidated test plan that gauges key solder paste properties and requires less than one shift of line time per product evaluated.
This presentation reviews the test plan, data collection and analysis processes, and presents the results. It discusses some of the issues encountered during test development and their resolutions or workarounds. Finally, it interprets the findings as they apply to the operation, the product types and customer needs.   





February 5 - 8

Pan Pacific Microelectronics Symposium 2018  +

Location
Hapuna Prince Hotel
Big Island , HI


The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.


February 9

Dallas Chapter: JTAG | 1149.1 boundary scan test and beyond  +

Location
100 S Central Expy #63, Richardson, TX 75080



Speaker: 
Adam Ley, Chief Technologist - ASSET InterTech, Inc.

 

Abstract:
Even since the early days of “JTAG”, it was about more than just boundary scan test. And today’s 1149.1 is not your father’s “JTAG” … Our presentation will open with the basics of JTAG 1149.1 boundary scan, for those who need an introduction, and then go deeper to examine issues of integration, utilization and value in the sphere of assembly test. Finally, we’ll explore what’s beyond mere boundary scan as well as what’s new and next for JTAG.

Details:
Date: February 9, 2018 @ 11am
Location: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
Pricing (Includes Lunch):

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line (see below)
   

Agenda:

  • 11:00am - Check in and Networking
  • 11:30am - Lunch Begins
  • 11:45am - Chapter Announcements
  • 12:00am - Feature Presentation
  • 1:00pm - Adjourn

 

 

Speaker Bio:
Adam ensures that ASSET’s non-intrusive board test (NBT) methodologies comprise a best-in-class solution to meet the evolving need for improved coverage of board test in the face of ongoing erosion of physical access. Pursuant to ASSET’s strong support for standards, Adam is an active participant in IEEE 1149.1, having previously served terms as working group vice chair and as standard technical editor (for the 2001 revision), as well as in nearly all related standards, to include: 1149.4, 1149.5, 1149.6, 1149.7, 1149.8.1, 1149.10, 1500, 1532, 1581, iNEMI boundary-scan adoption, PICMG MicroTCA, and SJTAG (system JTAG). Adam’s experience prior to ASSET spanned over a decade at Texas Instruments, Sherman TX, where he had roles in application support for TI’s boundary-scan logic products and for test and characterization of new logic families. Adam earned the BSEE degree from Oklahoma State University, Stillwater OK, in 1986.




February 20

Upper Midwest (Minnesota, Iowa & Dakotas) Chapter: February 20th: SMTA Upper Midwest Chapter hosts  +

Location
CyberOptics Corporation



Upper Mid-west Chapter is bringing in a speaker for the following topic:

Printing in the Third Dimension; Design, Materials, Equipment & Applications in Electronics
Speaker: Charles E. Bauer, Ph.D., Senior Managing Director of TechLead Corporation
 
Date:     Tuesday, February 20th, 2018
Cost:      $30 Members/ $40 Non-members (make checks payable to SMTA)
 
Time/Agenda:
  • 1:15 to 1:30 PM - Registration
  • 1:30 to 1:35 PM – SMTA announcements
  • 1:35 to 2:30 PM – Chuck’s Presentation
  • 2:30 to 4:00 PM – CyberOptics Presentation/Tour
  • Times subject to change so please arrive before 1:15 PM.
RSVP by February 13th to guaranty a spot for this session.
 
Address/Directions to CyberOptics:
CyberOptics Corporation
5900 Golden Hills Dr.
Minneapolis, MN 55416
763-542-5000

LINK TO DIRECTIONS
https://www.google.com/maps/place/5900+Golden+Hills+Dr,+Golden+Valley,+MN+55416/@44.9737718,-93.3577447,17z/data=!3m1!4b1!4m5!3m4!1s0x52b33496b65a48e7:0xea150953fc7e2b71!8m2!3d44.973768!4d-93.355556?hl=en&authuser=0
 
Presentation Overview:
Printing in the Third Dimension;
Design, Materials, Equipment & Applications in Electronics
Excitement around 3D printing continues full speed ahead whether in electronics, consumer goods or industrial systems. Understanding the capabilities, limitations and most importantly the complexities of 3d printing remains challenging despite significant progress in both equipment and materials. While not a comprehensive tutorial on 3D printing, this presentation introduces the application of 3D printing in electronics prototyping and manufacturing including;
  1. Types of 3d printing
  2. Design tools for 3d printed products
  3. Materials selection (availability and alternatives)
  4. Equipment choices
  5. Process capabilities and constraints
Specific examples include batteries, shielding, high density capacitors, and simple circuits. Discussion also includes applications outside the electronics world to stimulate creative thought, e.g. jet engine turbines and hyperbolic airfoils.
 
Charles E. Bauer, Ph.D. – Bio:
Charles E. Bauer, Ph.D. serves as Senior Managing Director of TechLead Corporation, a technology management company specializing in the electronics packaging, interconnection and assembly industry, as well as Director of the University of Portland’s Global Executive Leadership MBA program.  Dr. Bauer focuses in the areas of strategic technology planning, market analysis and business development, particularly in the international arena. Recent foci include an emphasis on medical device applications including sensors and imaging systems.
 
Combining applications experience in implantable, surgical and diagnostic medical devices with extensive background in design and manufacturing, Dr. Bauer presents a balanced perspective between technology and practical implementation for real world products. With more than 40 years’ experience spanning the range from complex interconnection technologies (printed circuit boards, hybrid and IC metallization and fabrication) through complex packaging (multichip modules, system in package, 3D packaging) and assembly (die attach, wire bonding, flip chip, etc.) as well as nano-technology applications in electronics manufacturing, his publications exceed 250 papers, articles and columns.  He lectures throughout the world on technology, business and market topics as well as serving on several corporate boards and international corporate, government and educational institution advisory councils.
 
A Senior Member of IEEE, he remains active in the SMTA, JIEP, ASM and IMAPS Europe as well.  Dr. Bauer served on the Boards of both the SMTA and IMAPS and as President of IMAPS in 2001-2002.  Awards received include Tektronix Technical Innovation Award, Fellow of IMAPS, the International Leadership Award from the SMTA, Jesuit High School Hall of Fame, University of Portland Significant 75 Alumni and SMTA 25th Anniversary Luminary as founder of the Pan Pacific Microelectronics Symposium.

To RSVP, please click here, or copy and paste the following address into your web browser:
https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4390&BULK_EMAIL_NO=1



March 6

Massachusetts (Boston) Chapter: Developing Realistic, Non-Destructive Alternatives for Quality Assurance and Counterfeit Detection Testing of Microelectronic Components  +

Location
Boxboro Regency Hotel & Conference Center; 242 Adams Place; Boxborough, MA 01719



Date: Tuesday, March 6, 2018
Time: 5:30 PM to 9:00 PM EST
Location: Boxboro Regency Hotel & Conference Center
242 Adams Place
Boxborough, MA 01719
Cost: See registration link below - SMTA members pay member price

Presentation:  Existing measures to assure the quality and authenticity of  microelectronic hardware components are predominately destructive involving bulk package removal and invasive mechanical testing by manufacturers and consumers prior to integration or after failure.  So, tested circuits cannot be both assured and integrated as the process renders them useless. Plus, destructive tests are expensive, requiring specialized apparatus, significant time, trained users, and subject matter experts to interpret results.Our Speaker presents a non-destructive alternative involving data acquisition by 3-D X-ray tomography, file size reduction/conversion to a CAD-editable geometry, and finite element analysis.

Speaker BIO:  Joe Favata is a Ph.D. Candidate and Manager of the REFINE Laboratory at the University of Connecticut. His research pertains to multi-modality, cross-correlative microscopy and finite element modeling on the micro- and nano-scales. He studied Mechanical Engineering and Physics at Manhattan College, earning a B.S. in 2016 and, in 2017, his M.S. in Mechanical Engineering from UConn.

Click here for more details

Click here to register for this event

SMTA Event Contact:  Mike Jansen - 978-987-3716

Event Registration Contact:
Matt Bracy of iMAPS-New England

matt@msdsales.com
603-731-5631


March 6

Free Pre-Conference Webinar: Electronics in Harsh Environments  +


Tuesday, March 6, 2018 @ 2:30 PM GMT (9:30 AM US Eastern Time)

Presenter: Keith Bryant, SMTA Europe

Overview
The Electronics in Harsh Environments Conference, 24-26 April in Amsterdam, Netherlands, will focus on building reliable electronics used in power electronics and harsh environments. In advance of this event we are holding a webinar to give engineers a preview of the topics and presentation content you can expect to see at the conference.

For full information on the conference and speakers go to https://www.smta.org/harsh/

Thermal, power and signal integrity requirements can present challenges when on devices that operate within harsh environments. Component integration, paired with a growing complexity of the package architectures, larger form factors and higher interconnection densities increase the risk of in-field failures. Over powering or over heating of a device can have serious consequences including internal package failure, down-stream device errors and second level interconnect solder joint failures. Soldering residues are more problematic, and if not understood, can result in both intermittent and complete device failure.

This conference tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. Specific topics include building reliable high density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high temperature soldering, solder material advances, and new standards will be presented.

The webinar will run for approximately 60min with question and answer session. Space is limited to the first 100 delegates/companies so reserve your place now! A copy of each of the slides presented will be provided after the webinar.


March 7

SMTA Webinar: Solder Paste Qualification Testing  +


March 7, 2018
1:00pm-2:30pm Eastern
Presented by:
Chrys Shea, Shea Engineering Services
Doug Dixon, Henkel Electronic Materials

Complimentary Webinar for Members!

Is it time to upgrade your solder paste?

Many SMT operations struggle with “process issues” that are actually solder paste-related, and have been resolved in newer generations of the materials.  Nagging defects like tombstones, solder balls, excessive voids and Head-In-Pillow can often be mitigated with a change of solder paste.  Newer formulations print better, wet better, endure hot reflow cycles better, and void less than older ones.

In the world of solder pastes, one size does not fit all, which is why there are so many variants to choose from.  The myriad of options can be overwhelming, and matching the right product to any given operation can be confusing, time consuming and costly:

  • Solder paste has many conflicting properties – one that prints well may not pin test well, or one that minimizes voiding may reflow well, and tradeoffs must be considered
  • Developing test methods takes a great deal of engineering time and experience
  • Executing the tests requires engineering and production line time
  • Production boards are expensive test vehicles and may not test every property
  • Laboratory test boards often require a lot of manual setup and may not test every property, requiring multiple boards, setups and test runs

When a small EMS provider determined it was time to update the SMT process chemistry, they needed to develop a test program that they could execute efficiently while keeping production running and costs under control.  When a solder paste provider wanted to commercialize their laboratory test board and needed a beta site, a working partnership was formed.  The cooperative effort produced a consolidated test plan that gauges key solder paste properties, requires less than one shift of line time per product evaluated, and is available as a customizable, off-the-shelf kit.

This FREE 90-minute webinar reviews the initial test plan, data collection and analysis processes, and presents the results of the original study.  It discusses some of the issues encountered during test development and their resolutions or workarounds. It then interprets the findings using a scorecard method that helps the user weigh the importance of individual solder paste performance characteristics to their operation.

The webinar then details the process of turning the laboratory board that was beta tested into a production line-ready kit, based off the beta builds, including:

  • Updates to the PCB layout to improve sample sizes, embed DOEs and reduce cost
  • Full documentation on the PCB including placement and ODB++ files with included BOM for easy programming
  • An assembly configurator that calculates sample sizes and component costs as the user inputs the number of PCBs they want to print and populate
  • Stencil and PCB support designs
  • Step-by-step instructions on how to execute a test that evaluates 20+ solder paste properties in 30 prints and 4 hours of line time
  • The score card that enables the assembler to customize their selection criteria for their operation, understand the potential tradeoffs, and make a data-driven decision on their next process chemistry

Additional up-to-date information on the kit, such as availability and the status of the statistical reduction methods will also be provided, as the development work continues.

About the Presenters:
Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is a frequent speaker at industry events, and has three times received the SMTAI “Best of Conference” award for her work on solder paste printing. In 2012 she was honored with the SMTA "Member of Technical Distinction" award. Chrys earned her B.S. in Mechanical Engineering from the University of Massachusetts and her M.S. in Manufacturing Engineering from the University of Rhode Island. She is a past president of the Philadelphia SMTA chapter, and sits on numerous IPC and SMTA technical committees. Chrys launched Shea Engineering Services in 2008.

Douglass Dixon is the Marketing Communications Director for Henkel Electronic Materials LLC and is responsible for managing all of the business unit’s global marketing communication activities.  With over 20 years of electronics industry experience, Dixon has a broad skill set that includes engineering, field service, applications, product management and marketing communications expertise.  Since joining Henkel in 2001, Dixon’s role has centered on strategic communications initiatives that have significantly raised the company’s profile within the global electronics market.    During his tenure at Henkel, Dixon has also championed multiple service initiatives on behalf of the company that have made a positive impact on the communities in which Henkel Electronic Materials employees live and work.   Examples include Henkel’s work with Think Together, a California-based organization dedicated to encouraging children to stay in school; and the Tianhua Orphan Education Project, a Chinese charity that provides full educational assistance for orphaned children. Dixon holds an Engineering degree from the University of Utah and, in his current role with Henkel, is based in the company’s Irvine, California facility.  



March 9 - 11

2018 SMTA Chapter Officer's Leadership Forum  +

Location
DoubleTree by Hilton Hotel Atlanta Downtown
Atlanta , GA


March 9 to 11, 2018: US officers
March 9 to 12, 2018: Student & international officers

SMTA Officer Leadership FORUM 2018

The SMTA invites all Chapter Officers to join your peers at the 12th Chapter Officer's Leadership Forum

You will learn to:
Develop leadership skills, learn from focused breakout sessions, network with your peers and move forward with enthusiasm and confidence as effective leaders in your career, community, and as an SMTA leader.

View Full Agenda Here
View Full Agenda Here

DRESS CODE: The FORUM weekend dress code is casual.

 

 

Funding & Sponsorships

 

$ FUNDING $

The SMTA Officer’s Leadership Forum is free for all officers. The SMTA will cover two hotel rooms for two nights (4 total room nights) for officers from your chapter. International chapters are covered for two rooms for three nights (6 total room nights.) If your chapter requires more than the allotted hotel room nights, those charges will be at your own or your chapter’s expense. Rooms at the hotel are at a negotiated rate of $119 plus taxes and fees ($144.11 inclusive) per night. The hotel will charge your credit card for additional room nights upon check-in. Your credit card will also be charged by the hotel after the program for any incidental charges not covered by the SMTA (for example, gift shop charges or minibar use). Rooms are double occupancy. If you are traveling with another officer and are comfortable sharing a room, please indicate your desire on the registration form or online registration site. Sharing rooms is encouraged by the SMTA to save costs. Unused room allotments are not transferable.

Each officer (chapter) is responsible for his or her travel expenses. We hope that your employers understand the value of the benefits of SMTA membership and will support your trip. If not, Forum expenses are acceptable chapter expense items within the SMTA and Chapter Bylaws. Make all room reservations through Karen Frericks (do not go directly to the hotel) and purchase your travel tickets early. If it is impossible for your company or chapter to fund travel expenses, ask Karen (karenchapters@smta.org or 952.920.7682) about our financing assistance. We want to work with you to ensure that all chapters are represented.

 

SPONSORSHIP OPPORTUNITIES

We are looking forward to an outstanding Forum in 2018. Please make attending the Forum happen for other chapter officers, and help us bring this caliber of entertainment and education to everyone.

SPONSORSHIPS AVAILABLE

Chapter Sponsors: $100 - $1000+ (multiple sponsors)
Any amount is welcome! Help officers from international, student, and domestic chapters to attend. Please help us support those chapters whose treasuries are insufficient to send anyone to Atlanta. We want to have 100% representation from all chapters – you can help us make that happen! Contact Karen to find out more about which chapters are in need. You can direct your contribution toward a particular chapter or just donate it wherever it will do the most good.

Facility Tour Sponsor: $1500 (2 sponsorships)
Help us provide buses to take interested officers to Delta Airlines for the TechOps Tour. We have buses from two locations, so we would like sponsorships for both.

Welcome/Networking Reception Sponsorship:

  • $750 (Your chapter name will appear on one round of drink tickets at the event – 2 sponsorships)
  • $350 Photo Booth Props (1 sponsorship)
  • Help us make the Welcome Reception more fun with adult beverages or fun props in the photo booth.

    Skyline Park Sponsors:

  • Transportation Sponsorship $1500 (1 sponsorship)
  • Drink Ticket Sponsorship: $750 (2 sponsorships)
    Your chapter name will appear on one round of drink tickets at the event
  • After a long day of Breakout Meetings, our officers deserve a chance to kick back and have some fun! Please consider a sponsorship to make this a wonderful event.

    All FORUM Sponsors will be introduced at the Welcome Reception, receive verbal recognition and signage recognizing the sponsors during the event to show our appreciation of your chapter’s support of your peers.

    Your generosity will be greatly appreciated by chapters, officers, and the SMTA. Coordinate your sponsorships through the SMTA with Karen. Thank you for your consideration.
     

     

    Logistics: Hotel, Travel & Events

     

    HOTEL MEETING SITE – Reservation Information

    The American Hotel by DoubleTree, Atlanta Downtown
    160 Ted Turner Drive NW
    Atlanta, GA 30303
    www.doubletreeatlanta.com
    Make your hotel reservations through the registration website. Do NOT reserve directly with the DoubleTree!

     

    TRAVEL ARRANGEMENTS – Reservation Information

    If you plan to attend the 2018 Chapter Officer Leadership Forum, SMTA requests that you attend the Welcome Reception Friday, March 9, at 7:00 p.m. and be present at all sessions until Sunday, March 11, at 12:00 noon. Please do not make airline reservations earlier than a 2:00 p.m. departure on Sunday. If you are staying for the International/Student Focused Breakout Sessions on Sunday, you can make your departure arrangements any time after 6:00 p.m. on Sunday or anytime on Monday.

    You can arrange rental cars if you wish, but Atlanta has a city-wide train system called MARTA that will be more budget friendly. Uber or Lyft can also be used for your airport transfers. Your final trip information will include detailed instructions for all those options. SMTA will have bus transfers for all group events.
     

     

     

    SPECIAL EVENTS & SOCIAL ACTIVITIES

    Behind the Scenes Delta Airlines TechOps Facility Tour (optional)

    Delta

    Friday, March 9

    The Atlanta SMTA Chapter is graciously coordinating a behind the scenes tour of Delta TechOps offered to the first 60 people to register. Although Delta TechOps has certified aviation repair stations all around the world, you're going to tour the one located at Delta’s Atlanta Headquarters in the world's busiest airport!

    Delta TechOps is the maintenance, repair and overhaul (MRO) division of Delta Air Lines. With more than 9,600 Technical Operations employees and 51 maintenance stations worldwide, Delta TechOps is a full-service maintenance provider for the more than 750 aircraft that make up the Delta Air Lines fleet. In addition to maintaining the Delta Air Lines fleet, Delta TechOps also provides MRO solutions and support to more than 150 third-party operators around the world, making it the largest airline MRO provider in North America and the third largest worldwide.

    Delta At Delta TechOps, you will tour:

  • Jet engine repair operations
  • Air craft maintenance
  • Engine Testing

SMTA will provide bus transfers to Delta TechOps from the DoubleTree Hotel and from Atlanta Airport.

ONLY those registered and TSA-cleared can attend.
 

 

On the Flight Deck Welcome & Networking Reception:

Friday, March 9, 7pm

Get ready to board your flight into SMTA Adventure at this evening’s Welcome & Networking Reception. This evening will feature some time for you to re-connect with old friends and make new ones, along with introductions of the Board of Directors, and SMTA Staff. Come prepared with some success stories you can share with other chapters. Also be sure to get your picture taken in our photo booth area, so future generations can see all the fun that was the Chapter Officer’s Leadership Forum in 2018!
 

 

Leadership Workshop

Saturday, March 10

"Flying Through the Surface of the Future!"

Keynote Speaker: Dr. Travis S. Taylor

Most futurists give bleak visions of a future filled with overpopulation, suffering economies, and worse. Many discuss the so-called "Singularity" where humans will no longer be human and will become something different like human minds in robot bodies. Join Dr. Taylor to see a completely different and much brighter vision of the future and for humanity. See how SMT has played a part in shaping that future since the Apollo era and come along for the ride as Dr. Taylor pilots our journey across and through the surface of the future!

Dr. Travis S. Taylor was born in the Rocket City, a.k.a. Huntsville, Al, while his father was working inside the Saturn V rocket that would go to the Moon. He celebrated his 1st birthday as the Apollo 11 astronauts splashed down in the ocean on their return from the first manned lunar mission on July 24, 1969. Inspired by the great space era and his hometown, he embarked on a lifelong endeavor to explore the universe. He earned his bachelor's degree in Electrical Engineering from Auburn University, and then went on to complete Masters degrees in Physics, Mechanical and Aerospace Engineering, and Astronomy. He earned two Ph.D.s, one in Optical Science and Engineering and one in Aerospace Systems Engineering. Dr. Taylor has written two dozen best-selling science fiction novels, two text books, and two popular science books. He has appeared in, starred in, and co-produced several hit television series including “The Universe,” “Life After People,” “Rocket City Rednecks,” “3 Scientists Walk Into a Bar,” and is currently finishing up the first season for a new series on The History Channel.


 

 

Breakout Session Topics

SMTA is preparing individualized learning for you on a variety of topics you want to know about with Breakout Sessions throughout the day on Saturday. You will have the opportunity to choose the Breakout Sessions that interest you the most and tailor it to your current position and needs. We will be offering special Breakout Sessions on a "New Officer Track" for first-time officers and a "Professional Development Track" for veterans.


 

 

Saturday Evening Activity

Saturday, March 10

Fun & Games at Skyline Park Overlooking Atlanta

Located on top of the Ponce City Market, Skyline Park is a new entertainment space in Atlanta that is like no other! Skyline Park is bringing old-timey fun to the heart of Atlanta, Georgia. Perched high above the hustle and bustle of Ponce de Leon Avenue on the top of the magnificently restored Ponce City Market, Skyline Park is a premium destination for good food and great fun. Dinner, drinks, and unlimited games are provided. You’ll delight in carnival amusements and marvel at the breathtaking views of beautiful Atlanta.

Your guests are invited and the cost is $100 (FORUM attendees no charge). Please plan to pay for guest fees upon your arrival at the Friday evening Welcome & Networking Reception. Skyline Park is a short bus ride away from the American Hotel by DoubleTree. SMTA shuttle service will be provided.


 

 

"Wheels Up: Wrap Up and Closing" General Sessions and Officer Breakout Meetings

Sunday, March 11

To wrap up all you learned this weekend and to look forward to the future, we have a content-packed General Session for you this morning.

Mid-morning will feature some honest dialogue in one final round of Breakout Sessions. You will have a chance to get together with others in your same officer position to talk about obstacles and to strategize on ways to overcome them.

We will end by 12:00 noon and will serve a boxed lunch before we send you out to reach for the skies on your flights home.


 

 

International and Student Officer Focused Breakout Sessions

Sunday, March 11

We would like to extend a special invitation to our international and student officers to attend our FORUM weekend. Because of the unique needs of student and international chapters, we decided to include some special events just for those officers. After all the domestic officers depart, we are planning special one-on-one Focused Breakout Sessions. Come prepared to discuss any pressing issues or concerns you have. At this session, you will be paired with Board Members, SMTA Staff or experienced chapter officers who will work with you, making phone calls, sending emails, whatever it takes to solve your most pressing problems. After a good afternoon’s work, your reward is a special dinner at the Sun Dial Restaurant located just steps away at the top of the Westin Peachtree Plaza. A tri-level complex, The Sun Dial features an upscale restaurant, a cocktail lounge and an observatory level with a breathtaking 360-degree panorama of the magnificent skyline from 723 feet above.

Business casual attire is requested in the evening by the Sun Dial.
 

 

Thanks to our current chapter sponsors!

Central Texas Chapter

 

Dallas Chapter

 

Empire (NY) Chapter

Intermountain Chapter

Mexico - Guadalajara Chapter

Michigan Chapter

Ohio Valley Chapter
 

Penang Chapter
 

Rocky Mountain Chapter

 

Space Coast Chapter
 

Upper Midwest Chapter
 

Wisconsin Chapter
 

West Penn Chapter


 

 

Frequently Asked Questions

1. When should I arrive and depart in Atlanta?
All officers should arrive in time for our “On the Flight Deck” Welcome Reception on Friday, March 9 at 7:00 p.m. If you plan to attend the optional Facility Tour at Delta Airlines TechOps Facility, you need to be at either the DoubleTree Hotel or Atlanta Airport in time for the bus which departs at 1:15 p.m. from the Hotel and 1:45 p.m. from the Airport.

If you are a domestic officer, the conference ends at 12:00 p.m. on Sunday, March 11. Please book your return flights no earlier than a 3:00 p.m. departure. If you are a student or international officer, the conference ends after dinner Sunday evening. You can book your return flight for anytime the next morning, March 12.

2. Should I rent a car in Atlanta?
If you plan to do business or sightsee before or after the conference you may choose to rent a vehicle. If not, the MARTA train or an Uber or Lyft transfer to the DoubleTree Hotel may be more economical. Your final trip information will include detailed instructions for navigating the Airport for each of those options.

All our events with the exception of the Delta TechOps Facility Tour and our fun evening out on Saturday to Skyline Park will be held at the DoubleTree Downtown Atlanta Hotel. We will have buses to take you to the offsite events. If you are taking the bus from the Airport to the optional Delta TechOps facility, your bags will be stored on the bus during your tour.

3. 3. Should I reserve a room directly with the American Hotel by DoubleTree?
No. Please register through the link at the top of this page and let us know how many nights you need at the hotel. SMTA HQ will make all reservations at the American Hotel by DoubleTree by means of a rooming list. If you need to pay for your own hotel room nights, that will be noted on the rooming list. The hotel will charge your credit card upon arrival. If your room is paid by SMTA, it will be applied to our Master Account.

4. Can I bring a guest?
Yes. Guests are welcome to attend the “On the Flight Deck” Welcome Reception on March 9 at no charge. If you would like your guest to attend the evening at Skyline Park, the cost is $100 per guest. That amount is payable by check or credit card when you arrive. Guests are not invited to any other activities, but the Atlanta area boasts lots of great activities that they can enjoy.

5. What is my financial responsibility?
SMTA is taking care of all your food and beverage, training, and entertainment for the duration of the program. We are also paying for 2 rooms for 2 nights for domestic chapters and 2 rooms for 3 nights for international and student officers. Sharing a room with another officer is encouraged to save costs. If your chapter requires additional rooms or room nights, those will be charged to your credit card upon arrival. Our contracted room rate is $119 plus taxes and fees per night ($144.11 inclusive). We also ask that you pay for your own travel arrangements to get to Atlanta.

Your first option to obtain reimbursement for your expenses should be your employer. You will receive excellent training that will not only make you a better SMTA officer – it will make you a better employee as well. If reimbursement from your company is not possible, then you should obtain reimbursement from your chapter treasury. Please be sure to consult with your President and Treasurer to decide how many people you can send and how much you can be reimbursed for. If neither option is possible, please contact Karen Frericks at SMTA HQ. We will try to obtain sponsorship assistance from other chapters. We want to make sure all chapters are able to send at least one representative.

6. What are our sponsorship opportunities?
Please see the section on this page for some suggested sponsorship donations, but any amount, directed toward any aspect of the Forum is appreciated.

 


March 14

San Diego Chapter: 03-14-18 “Humidification Equipment Technology– How these systems improve process control and your bottom line profitability  +

Location
Creative Electron 201 Trade St. San Marcos, CA 92078



Presentation: New advances in humidification technology offer more than just ESD control, current systems improve process control and increase energy savings which directly impacts your company’s bottom line profitability. These systems are designed to provide industry recognized ideal RH levels with tightly controlled variances while helping to minimize ESD, brittle material, dimensional stability, and desoldering issues. An additional benefit that current humidification systems provide is free evaporative cooling which reduces the load on facility HVAC systems thereby significantly lowering utility costs and improving your bottom line profitability.

Speaker: Richard (Ryk) Williams Business Development Manager – Aerospace, Defense & Electronics at Nortec
Richard Williams is currently the Business Development Manager for Nortec and works with companies across the Electronics manufacturing industry as well as those in Aerospace and Defense that focus on Electronics manufacturing.


RSVP Link: smta.org/chapters/rsvp.cfm?BEE_ID=4393


Registration: 5:30PM
Dinner: at 5:45PM
Presentation: 6:45PM
Free to Members and Non Members
Location: Creative Electron 201 Trade St. San Marcos, CA 92078




March 14 & 15

SMTA Webtorial: Role of Bi in Lead-free Electronics - All You Need to Know   +


Two (2) 90 minute Sessions
March 14 and 15, 2018
1:00pm to 2:30pm Eastern
Dr. Jennie S. Hwang Presented by: Dr. Jennie S. Hwang, H-Technologies Group

Overview:
Bismuth (Bi), which is introduced either through the supply chain or by design, is becoming an inevitable element in lead-free electronic products. With the deliberation of all relevant parameters, theoretical and practical, Bi plays a “potent” role in electronic solder systems, which impact the performance and reliability of electronic package and assembly including solder joint performance, tin whisker mitigation, among others. The proper use of Bi can profoundly benefit the performance and reliability, and the improper use could degrade the performance and reliability. An adequate understanding of the property parameters of Bi is critical to product reliability. This webtorial will discuss the relevant aspects of Bi to help dispel misconceptions and to demonstrate performance criteria related to Bi. The webtorial will also highlight the distinction between Sn-based-Bi-containing alloys and Bi-based alloys. The goal is to help achieve the desired level of performance and product reliability. Your questions and issues for solutions and discussions are welcome.

Main Topics for Part 1:

  • Your issues & concerns related to Bi
  • Bi - characteristics, resources, safety data
  • Bi effects in 63Sn37Pb solder joint
         Physical properties
         Mechanical behavior
  • Effects of Bi from component coating and PCB surface finish
         Dissolving into solder joint
         Estimation of concentration of Bi in solder joint
         Effect of compositional change
  • Bi effects in SAC solder joint (SnAgCuBi)
         Compositional change
         Stress vs. strain
         Fatigue behavior
  • Bi effects in other Pb-free alloys (SnCu, SnAg, SnAgIn)
         Stress vs. strain
         Fatigue performance

 

Main Topics for Part 2:

  • Historically established Bi-containing electronic solder alloys
         Pb-containing
         Pb-free
  • Bi-containing Pb-free solder alloys
         Melting temperature range
         Compositional control level
         Physical, mechanical properties
         BGA thermal fatigue performance
  • Distincion between Sn-based-Bi-containing alloys and Bi-based alloys
  • Case study - PCB through-hole fillet-lifting vs. Bi
         Causes
         Solutions
  • Low temperature BiPbSn phase
         Presence or absence
         Thermograms
         Detectable or non-detectable effects
         General guidelines
  • Design limit in Pb-free solder joints vs. solder joint reliability
  • Concluding points

 

Who Should Attend:
The webtorial provides a working knowledge to all who are involved with or interested in solder joint reliability and system integrity with and without the presence of Bi and related issues in electronic packages and assemblies including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information on the subject.

 

About the Instructor
Dr. Hwang, a pioneer and a major contributor to the implementation of Surface Mount manufacturing since its inception as well as to lead-free electronics, brings to the webinar her 35+ years experience in hands-on production and as an advisor to OEMs, EMS and Defense programs. She has provided solutions to many challenging problems - from production yield to field failure diagnosis to high reliability issues. Among many honors/awards are the U.S. Congressional certificate of Recognition and Achievement, induction into WITI International Hall of Fame, named “R&D Star-to-Watch” by Industry Week, YWCA Women of Achievement Award; induction into the National Academy of Engineering. She is the author of 500+ publications and several ground-breaking books on SMT manufacturing and lead-free technology and manufacturing, and is an invited speaker in numerous international and national events. Additionally, she has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees. She chairs the Board of the Assessment of Army Research Laboratory of DoD, of the National Institute of Standard and Technologies, and has been an advisor and a reviewer of government programs (DoD, NASA, NIST, etc.) and various publications. She also serves on the National Manufacturing and Materials Board, National Laboratory Assessment Board, and Board of Army Science & Technology. Her formal education includes Harvard Business School Executive Program and four academic degrees (Ph.D. in Metallurgical Engineering & Materials Science, M.S. in Physical Chemistry, M.S. in Liquid Crystal Science, B.S. in Chemistry). She has held senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and International Electronic Materials Corp. She is president of H-Technologies Group and is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.


March 15

Great Lakes (Chicago) Chapter: Chapter Meeting: Low Pressure Molding Solutions  +

Location
Low Pressure Molding Solutions, 1441 Branding Lane, Suite 110, Downers Grove, IL 60515



 
 
SMTA Great Lakes Chapter Meeting
Thursday March 15th, 2018
 
Location: Low Pressure Molding Solutions
  1441 Branding Lane, Suite 110
  Downers Grove, IL 60515
 
 
 
“Low Pressure Molding of Printed Circuits using hot melt thermoplastic adhesives and structural resins;  Materials, Equipment, Tooling Design.”
 
By Michael J. Pierce, Polymer Chemist and Vice President of Engineering for LPMS USA
 
The advancement and momentum around Low Pressure Molding sealing and encapsulation of electronics and cable assemblies continues at a frenzied pace whether in consumer, industrial, automotive, medical or aerospace applications.  Understanding the advancements and limitations of the technology along with the evolving needs of the end user remains a challenge despite the success of the past two decades.  This session introduces the Low Pressure Molding Process in electronics manufacturing including:
 
  1. Designing tooling for Low Pressure Molding
  2. Materials selection and chemistries including why one would be preferred to another
  3. Equipment choices and advancements
  4. Process capabilities and constraints
  5. Specific examples will include sensors, battery, wire harnessing, lighting and medical devices.
 
About the Speaker:
Michael serves as Vice President of Engineering and materials chemist for LPMS USA, a technology company specializing in equipment and tooling design for hot melt masking, dispense and molding of electronics.
Michael has spent his entire career in the science field beginning with a 6 year commitment to the United States Navy as a Nuclear Engineer before earning a Bachelors Degree in Chemistry and a Masters Degree in Analytical Chemistry. 
Michael’s career spanned 21 years as a chemist and sales engineer for Henkel Corporation, headquartered in Dusseldorf, Germany before emerging as a partner in LPMS USA.
Michael has presented around the globe during the growth of the technology as one of the foremost technical experts in materials.  Michael now focuses on the evolution of equipment and materials to serve the market needs for harsh environments and was a core member of team that wrote the IPC standards for Low Pressure Molding.
Michael is a member in good standing of the SMTA Great Lakes Chapter, the American Chemical Society and the Society of Plastics Engineers.
 
Time: 6:30 pm (Networking & Registration)
  7:00 pm (Dinner & Presentation)
  8:00 pm (Stations)
  9:00 pm Adjourn
Location: Low Pressure Molding Solutions
  1441 Branding Lane, Suite 110
  Downers Grove, IL 60515
Cost: $20 for Members/$30 for Non-Members
 
 
RSVP to Gerri Noble at gnoble@ntech-inc.com or via the SMTA Great Lakes Chapter Webpage.
 


March 15

Best Practices in Electronic Assembly Processes - Capital Chapter Tutorial Program  +

Location
Best Western Plus Rockville Hotel & Suites
Rockville , MD 20850



Instructor: Phil Zarrow, ITM Consulting

March 15, 2018

9:00 a.m. - 3:00 p.m.
Best Western Plus Hotel & Suites
1251 W Montgomery Ave
Rockville, MD 20850
(301) 424-4940
 
Price:
  • Members: $200
  • Non-Members: $295 (A one-year Individual SMTA Membership is included in the non-member price.)
  • Capital Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $70 (A one-year Student SMTA Membership is included in the non-member price.)


Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

Introduction:
You have the responsibility and resources to improve the productivity of an assembly operation…what do you do? This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line engineers involved in manufacturing, design and quality engineering.

Topics Covered:

  • Introduction
  • Optimization Objective
    - Getting the Most Productivity from an Existing Line
    - Definition of "Best Practices"
  • Process Characterization
  • Best Practices in the Assembly Process
    - Solder Paste Printing Process Best Practices
    - Pick and Place Best Practices
    - Reflow Soldering Best Practices
    - Wave Soldering Best Practices
    - Selective Soldering Best Practices
    - Cleaning vs No-Clean Considerations and Best Practices
  • Q & A


Who Should Attend:
This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies.


Phil Zarrow About the Instructor:

Phil Zarrow
Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world. During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.


Since forming ITM Consulting in 1993, Phil Zarrow has helped numerous clients in such areas as

  • SMT Implementation and Assembly facility set-up
  • SMT Assembly and Soldering Failure Analysis
  • EMS/Supplier Process and Quality Assessment Audits
  • Counterfeit Component Avoidance and Interception Programs
  • Manufacturing yield improvement
  • Equipment Evaluation and Selection
  • No-clean and lead-free solder paste evaluation and process implementation
  • SMT Manufacturing Process Audits and process improvement
  • On-site training for all levels of personnel
  • Design for Manufacturability (DFM) specification development
  • Reflow of Through-hole feasibility, development and implementation
  • Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
  • SMT process equipment benchmark testing and evaluation
  • SMT product development
  • Lead-free Process Implementation and Optimization
  • Technical evaluations related to business acquisitions and mergers
  • Technical assistance in legal disputes

Mr. Zarrow is a popular speaker and workshop instructor. He has chaired and instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of the book, "SMT Glossary- Terms and Definitions". Mr. Zarrow holds two US Patents concerning PCB fabrication and assembly processes and audit methodologies.
Phil is a member of IPC, SME, IMAPS, a co-founder of ITM Consulting, and is a past national level officer and national director of the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders’ Award (2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forefront" and “Better Manufacturing” columns. He is currently producer and co-host of IPC Update's “Boardtalk” audio program.

Contact Karen Frericks at 952.920.7682 with questions.
 


March 20 - 22

SMT Processes Certification (Sechan Electronics In-House)  +

Location
Sechan Electronics, Inc.
Lititz , PA 17543


Held at Sechan Electronics, Inc.
525 Furnace Hills Pike, Lititz, PA 17543
.

  • March 20 Course (8:30-5pm)
  • March 21 ½ day of course + exam
  • March 22 All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting Reduced In-House Rate: $915 for members or $970 for non-members. Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience
  • The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


March 21

Oregon Chapter: Material Management 4.0  +

Location
Axiom Electronics



Material Management 4.0
Dr. Bill Cardoso, Creative Electron
 
Over the past years, the electronic assembly industry has focused on the development of Industry 4.0, a standard communication protocol that allows production equipment to dialogue. This communication protocol will be a key enabler to improve the quality and efficiency of the production line. This is achieved by creating a feedback loop between inspection and production – thus allowing problems to be identified and corrected as early as possible in the manufacturing line. As a result, the overall cost of manufacturing is reduced as yield rates increase.
Despite the great progress in the development of the integrated production line, a critical part of the manufacturing chain still offline. Inventory rooms around the world must still operate with a far reduced level of sophistication. It is not uncommon to find thousands of reels densely packed in hundreds of linear feet of shelving space. The simple exercise of counting back reels as they come back from the production floor is not standard practice. And even when they are counted, the count is often made by hand. The lack of focus on the automation of our inventory rooms leads to an increasing loss of productivity due to line stoppages. When associated with the recent increase in lead times for electronic components, line stoppage has become a crippling problem that makes inventory accuracy a necessity.
In this presentation, we’ll introduce Material Management 4.0. More than a set communication protocol between machines that count electronic parts and the machines that store them. From x-ray parts counters to fully automated and intelligent storage towers, Material Management 4.0 embraces the overall infrastructure that needs to be in place to realize an accurate, fast, and efficient methodology for inventory control. This investment is critical to realize the benefits in efficiency unleashed by Industry 4.0.   
 
About the speaker:


Dr. Bill Cardoso, CEO
Creative Electron, Inc.
 
Bill started his first company in Brazil at age 17 and sold it a few years later when invited by the US Department of Energy to work at Fermi National Accelerator Laboratory to do nuclear and high energy physics research. As the Department Head for Systems Engineering and after a 10-year long career at Fermilab, Bill moved from Chicago to sunny California to start Creative Electron. True to the American Dream, Creative Electron quickly grew from Bill's garage to the largest US manufacturer of x-ray machines for the electronics industry (no longer in his garage). At Creative Electron Bill leads the team of engineers who designs and manufactures x-ray systems that are shipped worldwide. Starting with an associate’s degree at age 13, Bill has a BS, MS, and PhD degrees in Electrical and Computer Engineering and an MBA from The University of Chicago. Bill is the president of the SMTA San Diego chapter and member of the technical committee for SMTA International, SMTA Counterfeit Conference, and SMTA LED Conference, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium. He is an IEEE Senior member and the author of over 150 technical publications, author of 2 books, owner of a few patents, and a frequent speaker at technical conferences.
 
 
 


March 22

Mexico - Querétaro Chapter: Tercer Foro Técnico SMTA Querétaro  +

Location
CIC 4.0 UTEQ



2018 SMTA Tercer Foro Técnico
" Industria 4.0 "
Jueves 22 de Marzo, 2018
Av. Pie de la Cuesta 2501, Nacional, 76148 Santiago de Querétaro, Qro.
9:00 am – 4:00 pm
3 Conferencias !
Cupo limitado, reserva en línea tu asistencia sin costo.
*Limitado a usuarios y miembros de SMTA.
Habra Demos de Equipos Conectividad Industria 4.0

" Smart Factory "    Industry 4.0  " por  ASM - Jorge Camarena
" The Hermes Standard  "   por Pemtron - Jaime Arreola   
" Augmented Reality "  por Interlatin - Amhed Becerra  



 THANKS TO OUR SPONSORS

GOLD LEVEL

   Quiptech  STE


SILVER LEVEL

Qtek SMTVYS Inventec

BRONZE LEVEL


IF YOU WANT TO SEE YOUR COMPANY LOGO HERE, PLEASE CONTACT US



March 22

Tampa Bay Chapter: March 22, 2018 Technical Meeting  +

Location
Jabil 10560 MLK Blvd. St Petersburg, FL



Our speaker is Tim O'Neill, Technical Marketing Manager from AIM Solder.  Please see his biography attached.   

Speaker Bio: Timothy O’Neill

Timothy O'Neill is the Technical Marketing Manager for
AIM Solder. AIM Solder is a leading global
manufacturer of assembly materials for the electronics
industry with manufacturing, distribution and support
facilities located throughout the world. AIM produces
advanced solder products such as solder paste, liquid
flux, cored wire, bar solder, epoxies, lead-free and
halogen-free solder products, preforms, and specialty
alloys such as indium and gold for a broad range of
industries.
Operating out of AIM U.S. Headquarters, Mr. O'Neill is responsible for developing and
optimizing product and technical information, collaborating with complimentary
suppliers and equipment manufacturers and ensuring AIM’s products exceed the end
users expectations and meet market requirements.
Mr. O'Neill is also a technical writer and presenter for industry trade publications and
events and has been recognized as a Speaker of Distinction by the SMTA.
Mr. O’Neill is a Certified IPC Specialist, has a B.A. from Assumption College and postgraduate
studies in education. He began his career in 1994 with Nordson EFD, heading
their business development of fine pitch solder paste dispensing technology. He joined
AIM in 1997 and has since assisted many clients with production challenges, specializing
in Pb-Free process development and material selection.

Tim will cover the following topic:
 
The choices for solder alloys is expanding rapidly as new application requirements materialize revealing the limitations of existing lead-free alloys.  In this presentation attendees will gain a better understanding of the evolution of lead free solder alloys, the limitations of today’s common alloys and what the solder industry is offering as next generation materials. 

Our meeting this quarter will be held at the following address:
Jabil Circuit
10560 MLK Blvd
St. Petersburg, FL
This is the 4 story building in the center of the campus. They can enter from either Roosevelt or MLK and go to the center building by following the signs.

  
Thursday March 22nd
5:30 PM   Registration/Meet and Greet
5:30 PM - Dinner
5:45 PM - Introduction of Speaker
5:50 - 6:30 PM - Topic Presentation
6:30 - 6:45 PM - Question and Answer Time

Cost of Meeting:
Members - $15.00
Non-Members - $20.00

We hope to see everyone at the meeting!



To RSVP, please click here, or copy and paste the following address into your web browser:

https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4396&BULK_EMAIL_NO=3



March 28

Empire (Rochester, NY) Chapter: Annual Member Appreciation Hockey Game @ Rochester Amerks  +

Location
Blue Cross Arena, Rochester, NY




FREE TICKETS for our annual SMTA EMPIRE Chapter member appreciation social at Rochester Amerks are now available.  CLAIM YOURS NOW!

We have once again reserved the Party Deck section, an open patio with high tables at ice level for a great game viewing experience.  The Amerks are scheduled to play AHL North Division rivals Utica Comets.  With less than two weeks to go before this contest, the Amerks still maintain their position in 3rd place in the division, while the Comets have dropped from 2nd place to 4th over the past few weeks.  The scene is setting up well for a competivite battle as the AHL Hockey season winds down and playoff pressure builds!

Join us!!!

RSVP at: https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4395
(Upon our notification of your RSVP registration, you will receive an email from the Chapter Secretary acknowledging your ticket claim and supplied more details.)



April 4

Space Coast (Melbourne FL) Chapter: April 4, 2018  SMTA Space Coast Chapter Technical Meeting  +

Location
Mack Technologies



"April 4 2018 SMTA Space Coast Chapter Technical Meeting
 
RSVP NOW!!
Email to Jack Reinke or call (404) 290-6744
Is proud to present a Lunch and Learn Session

"Tin Whiskers: Mitigation Techniques and Accessing Reliability"
 
The advent of lead free solder and the growth of pure tin component finishes have exacerbated the re-emergence of tin whisker growth, increasing the potential for field failures. Many high reliability programs, especially within the aerospace realm, require varying degrees of tin whisker mitigation. This presentation will summarize the five reliability levels as defined in GEIA-STD-0005, the widely accepted industry standard for mitigating the effects of tin whiskers. Situations will be identified where whisker growth is most prominent, increasing the importance of mitigation. Conversely, situations where mitigation is of less concern will also be identified. With this knowledge, a key method for assessing reliability has been ascertained for the attendee’s knowledge. A variety of techniques for mitigating the effects of tin whiskers will be presented such that the assessed reliability can be significantly improved. Even in electronic assemblies where whisker mitigation is not required, engineers can impart reliability improvement through understanding of the reliability assessment, areas most at risk, and associated mitigation's that can reduce that risk.
 
The Presenter:
Bruce Misner of Advanced Technical Services
The event will be hosted by Mike Newman/Nazeeh Chaudry
 
Bruce MisnerBruce M
Bruce is the principal of Advanced Technical Services, serving the electronics industry with manufacturing engineering consulting services related to:
  • Electronic based Product, Process and Facility Development
  •  Microelectronics Packaging and Electronics Miniaturization utilizing SMT, Thick and Thin Film Hybrid, Multi-Chip Module (MCM), Chip-on-Board, Microwave Integrated Circuit (MIC), Wire Bond and Flip Chip technologies
  • Complete Failure Analysis with follow up Design, Material and Manufacturing Process Corrective Actions
  • Tin Whisker and Counterfeit Mitigation
  • High Reliability Automotive, Military, Space and Medical Applications
Mr. Misner has served as the VP of Technology Development for Engent, in Atlanta, GA after completing a 17 year career with Orbital ATK as their multi-site Subject Matter Expert in electronics manufacturing technology. This included electronics technical lead on the billion dollar AARGM missile program. He concurrently served as the Technical Director of the Orbital ATK Failure Analysis Lab based in Clearwater, FL and played a role in the successful launch of the LADEE moon mission in 2013.
Prior to ATK, Mr. Misner’ career spanned various roles in electronic and microelectronic engineering. This included the head of Electromagnetic Sciences microelectronics development and production operations (now part of Honeywell) and the VP of Operations for Hy Tec Industries. He started his career as a process development engineer for, at the time, the nation’s largest independent producer of custom hybrid circuits, Circuit Technology, Farmingdale, NY, now part of Cobham Aeroflex Corporation.
Mr. Misner has a Bachelor of Science degree from Binghamton University and was a candidate for an MBA at Cornell University. He has been an active member for multiple decades and often chapter officer in SMTA and ISHM/IMAPS, as well as affiliation with JEDEC JC13.5 as a Task Group Chairman for Space Class Hybrid Device requirements. His latest technical paper, “Validated Solder Coverage for Tin Whisker Mitigation,” was published in the Journal of Surface Mount Technology, July – Sept 2016, Volume 29, Issue 3 and can be viewed here: Link to article
 
Come join us April 4, 2018 at 11:30am at
Mack Technologies
7505 Technology Drive
Melbourne, FL 32904

(321) 725-6993

 

SCHEDULE

TIME:             11:30AM           LUNCH
                       12 -1:00PM       Presentation

                                             
Lunch is included in the admission price.
Members: $20 • Non-Members: $30
 
You can pay at the door with a credit card, check or cash or you can use PayPal button below to  pay by credit card in advance.
  
RSVP to Jack Reinke or call (404) 290-6744



April 10

Dallas Chapter: Dallas Expo and Tech Forumn - April 10  +

Location
Plano Event Center



Register Now!

Click Here to Register for the Dallas Expo and Tech Forum!

Are you a...
  • Manager of Design or Manufacturing
  • Process engineer
  • Design Engineer
  • Supply Chain Professional
  • Purchasing
  • Test Engineer
  • Manufacturing or Test Technician

The Dallas Expo has everything you need to do with Design and Manufacturing of Electronics!

Event Details

  • Date: Tuesday, April 10th, 2018
  • Time: Doors open at 8am
  • Location: Plano Event Center (2000 E. Sprint Creek Parkway, Plano, TX 75074)
  • Food: Complementary Lunch Buffet
  • More info: smta.org/expos/#dallas
  • Questions? Call Kaitlyn Schmiel at 952-920-7682

Technical Sessions

  • Material Management 4.0
  • The Quest for a Zero Defect Line
  • A Mindset for Successful Application of the Toyota Production System
  • Impact of Stencil Foil Type on Solder Paste Transfer Efficiency for Laser Cut

Thank you, sponsors!


Breakfast Sponsor - Henkel


Technical Sessions Sponsor - NCAB Group


Lunch Sponsor - NPI Technologies


Door Prize Sponsor - SVTronics
 


April 10 - 12

SMT Processes Certification (Ducommun In-House)  +

Location
Ducommun Incorporated
Appleton , WI


Held at Ducommun Incorporated
2222 E Pensar Dr, Appleton, WI 54911
.

  • April 10 Course (8:30-5pm)
  • April 11 ½ day of course + exam
  • April 12 All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting Reduced In-House Rate: $915 for members or $970 for non-members. Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience
  • The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


April 11

Heartland (Kansas, Missouri) Chapter: Re-scheduled SMTA Heartland: The Incredible Shrinking World Of Electronics – Are Traditional DFM, DFR, DFF, … Methods Obsolete?  +

Location
180 Room (11944 S Strang Line Rd, Olathe, KS 66062)



THIS MEETING HAS BEEN RE-SCHEDULED FOR WEDNESDAY, APRIL 11, 2018.

The SMTA Heartland Chapter is excited to announce our first meeting of 2018 featuring a presentation by Dale Lee (The Incredible Shrinking World Of Electronics – Are Traditional DFM, DFR, DFF, … Methods Obsolete?) and great BBQ at the renowned 180 Room next to Joe's KS BBQ!

This is sponsored in part by donations from Lorenz Sales and Kysen.

Price: $25 Non-Members, $15 Members
Please RSVP as soon as you can!

This meeting will be Wednesday evening April 11, 2018. The doors will open at 5pm and the dinner/presentation will be from 5:30pm-7:30pm. This will be a great chance to network, enjoy some great BBQ and drinks as Dale Lee presents his discussion on The Incredible Shrinking World of Electronics!  

Topic of discussion:
Today’s electronic component packaging technologies of  smaller packages (0201/01005/008003), finer lead pitch (0.4/0.35/0.3/…), bottom terminated components (QFN/LGA) and printed circuit board designs (high layer counts, finer lines, via in pad (VIP), increased copper thicknesses, copper routing, …), increased thermal sensitivity, trailing component, fabrication and assembly industry standards have impacted traditional assembly processes with addition of tight solder application, component placement, thermal management and soldering constraints.  Using traditional, simplified mass production techniques are not be sufficient to achieve a high-yielding manufacturing process.  This presentation will highlight elements of the impacts of these technologies on reliability and yield when not properly addressed in the design/assembly/inspection-test process, impacts of thermal connections on through-hole and surface soldering processes, introduce the elements of design for matched process (DFMP), and provide examples of several opportunities within the DFMP for yield improvement through manufacturing tooling design, SMT and PTH assembly process matching.  The concept of manufacturing, test, reliability by design (XBD) will be presented.
What you will learn:
•             Component packaging impacts
•             PCB design impacts and industry standards limitations
•             SMT and PTH solder design impacts
•             Components with thermal management impacts:
  1. Component design
  2. PCB Thermal balance: X, Y and Z axis
  3. Trace routing
  4. Equipment limitation/tolerance
  5. PCB array tolerance
  6. Process tooling design
•             Process control impacts
•             Paste volume, thermal shock SMT and PTH, reflow process warpage
•             Cleaning impacts
•             Compatibility issues, low stand-off components

Speaker Bio:
Dale is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields.
 
Dale has been involved in surface mount design, package & process development and production for over thirty years in various technical and managerial positions.  These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of CSP & BGA packages, PCB & PCBA support, DFM/DFX analysis of flex, rigid-flex & rigid PCB/PCBA’s including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications for consumer products, defense/aerospace and medical devices. 
 
Dale has authored, instructed and presented frequently on topics including advanced SMT packaging, PCB and SMT design, assembly, cleaning, DFM/DFX and rework.  He is a past recipient of the Surface Mount Technology Association’s “Excellence in Leadership” award.  He has been very involved with multiple industry associations and activities including SMTA, INEMI and IPC.
 
 
 
Contact Information:
 
Dale Lee
Senior Staff DFX Strategy Engineer
Plexus Engineering Solutions
 
Tel: 920.720.6579
E-mail: dale.lee@plexus.com
 
120 Main Street
Neenah, WI  54956

 


April 12

Houston Expo & Tech Forum  +

Location: Bayou City Event Center
9401 Knight Road
Houston, TX 77045


Exhibitors

The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $25 per booth. Early bird expires on March 15, 2018!
Click here for Ad and Sponsorship opportunities!

Important Exhibitor Materials:

Please contact SMTA Expo Manager Courtney Kalb with questions or for additional information.



Attendees

Free Technical Program & Schedule:

 

8:00am

Registration Opens

 

9:00am-9:45amBill Cardoso

iPhone X - Steve Jobs' iPhone

Speaker: Bill Cardoso, Ph.D., Creative Electron

It’s been 10 years since Steve Jobs introduced the iPhone to the world. Much has happened since then. Over this past decade, the iPhone become a reference design and the object of desire of a legion of fans who wait anxiously for every launch of the Cupertino company. Undoubtedly, the most advanced iPhone in the market today, the iPhone X is a technology marvel. The double stacked board, dual battery, and a face recognition sensor bring the iPhone X to a whole different level.

In this presentation, we will explore these technological advances by a live teardown of the iPhone X. The teardown will be followed by a detailed coverage of the technical details of critical parts of the device. This live teardown will be accompanied by X-ray and CT images of the iPhone X, so the audience will get unprecedented insights on what makes this iPhone tick. More importantly, we will explore the assembly process utilized to put the iPhone X together. This presentation is targeted at a wide technical audience looking for a better understanding on how advance consumer electronics are designed and assembled.

 

10:00am

Exhibit Hall Opens

 

11:00am-11:45amTim O'Neill

What the Solder Industry is Offering as Next Generation Solder Materials

Speaker: Timothy O'Neill, AIM Solder

The choices for solder alloys are expanding rapidly as new application requirements materialize revealing the limitations of existing lead-free alloys.  In this presentation, attendees will gain a better understanding of the evolution of lead free solder alloys, the limitations of today’s common alloys and what the solder industry is offering as next generation materials.

 

11:45am

Prize Drawings

Thank you to our Lunch Sponsor:

NPI Technologies

12:00pm-12:45pm

COMPLIMENTARY LUNCH

 

12:45pm

Prize Drawings

 

1:00pm-1:45pmPaul Vianco

Computational Models: A Critical Enabler of Advanced Electronics Packaging for Use in High-Reliability Applications

Speaker: Paul T. Vianco, Sandia National Laboratories

The development of advanced electronic packaging technologies – die materials, molding compounds, printed circuit board substrate, solder alloys etc. – is rapidly outpacing the capacity for empirical testing to provide adequate reliability data towards the design, manufacture, and fielding of components, printed wiring assemblies (PWAs), and next level sub-assemblies. Moreover, the increased reliance on electronics across different product lines has required reliability analyses to address a wider range of accelerated aging tests and service environments. Sandia recognized the challenges of this scenario and, as such, placed an emphasis on the development of computational models to predict the long-term reliability of advanced electronic packaging technologies. Although the expressed focus of these development efforts has been on solder joint reliability, the underlying toolset has been applied to such topics as die cracking, molding compound delamination, as well as the survivability of PWAs when exposed to shock and vibration conditions.

This presentation will describe the development of the computational modeling tools currently being used to support design decision for advanced, high-reliability electronics. The model predictions have been used to introduce bottom terminated components (BTCs) as well as stacked package components in such hardware. The numerical approach has been instrumental for documenting the long-term performance of alternative solder interconnections. An offshoot of this effort, which is currently being explored at Sandia, has been to predict the effects of Au embrittlement and Pb-contamination on solder joint performance and reliability. Several case studies will be presented to illustrate the predictions provided by computational modeling capability and its role in multiple applications.

 

3:00 pm

Expo Closes


April 17

Huntsville Chapter: April 2018 Meeting An Evolution of Lead Free Solder Alloys  +

Location
STI Electronics 261 Palmer Rd, Madison, AL 35758, USA



The Huntsville Chapter SMTA and STI welcome you on April 17, 2018 from 5:30-7:30pm to bring a discussion of the evolution of lead free solder alloys.

If you are an SMTA member and cannot join us at STI, but would like to conferenece into the discussion, please contact HSVsmta@gmail.com and we will send the meeting log-in information.


Speaker Info:
Timothy O'Neill is the Technical Marketing Manager for AIM Solder. AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries.
 
Operating out of AIM U.S. Headquarters, Mr. O'Neill is responsible for developing and optimizing product and technical information, collaborating with complimentary suppliers and equipment manufacturers and ensuring AIM’s products exceed the end users expectations and meet market requirements.
 
Mr. O'Neill is also a technical writer and presenter for industry trade publications and events and has been recognized as a Speaker of Distinction by the SMTA.
 
Mr. O’Neill is a Certified IPC Specialist, has a B.A. from Assumption College and post-graduate studies in education. He began his career in 1994 with Nordson EFD, heading their business development of fine pitch solder paste dispensing technology. He joined AIM in 1997 and has since assisted many clients with production challenges, specializing in Pb-Free process development and material selection.
 
Due to ITAR, a photo ID will be required to enter the STI Electronics facility. We will need to know in advance if you are not a US citizen.
Agenda:
5:30 – 6 networking
6 – 6:30 dinner
6:30 – 7:15 intro & presentation
7:15 – 7:30 wrap-up


Location: 261 Palmer Rd, Madison, AL 35758
Directions From I565:
  • Take the Wall-Triana Hwy exit toward Madison Blvd / Madison
  • Keep straight onto Sullivan St.
  • Turn left onto Palmer Rd
  • Arrive at 261 Palmer Rd, Madison, AL 35758

Dinner : Boxed lunches from Apple Lane Farms and drinks will be available for:
$5 for SMTA Members who RSVP by Thursday April 12, 2018
$7 for SMTA Members who Do Not RSVP by Thursday April 12, 2018
$10 Non-Members who RSVP by Thursday April 12, 2018
$12 Non-Members who Do Not RSVP by Thursday April 12, 2018
Two ways to RSVP:  



April 18 & 19

SMTA Webtorial: Stencil Printing Process and Solder Paste Inspection – An In-Depth Look   +


Two (2) 90 minute Sessions
April 18 and 19, 2018
1:00pm to 2:30pm Eastern
Presented by:  S. Manian Ramkumar, Ph.D., Center for Electronics Manufacturing and Assembly

Rochester Institute of Technology

Overview:
The stencil printing process is the most critical process in surface mount electronics assembly. It tremendously influences the quality of the final PCB assembly. This course will provide a thorough understanding of the print process for lead based and lead free solder paste print applications. Topics include an in-depth look at stencils, solder paste, squeegee, process parameters, process characteristics, inspection techniques, defect identification and corrective actions. Participants in this course are sure to acquire a sound understanding of the solder paste print process and its influence on yield. A brief discussion on the use of this process for adhesive print applications is also included.

Who Should Attend:
♦ Process, Design, Test and Quality Engineers
♦ Process and Quality Technicians
♦ Operators
♦ Managers


After completing this course, you will be able to:
1. Understand the stencil printing process and the process parameters, thoroughly.
2. Understand the importance and the influence of solder paste, flux, temperature, humidity, board support and machine setup.
3. Evaluate materials such as paste, stencil and squeegee for efficient printing
4. Understand the various solder paste constituents and types of paste
5. Specify stencils, solder paste and printer requirements for various applications
6. Understand Stencil construction and features for efficient paste transfer
7. Understand squeegees and the recent advances in print technology
8. Evaluate in-coming raw materials and procedure for qualifying vendors
9. Understand the print process for adhesive applications

 


 


April 19

Ohio Valley Chapter: Introduction to Statistics, DOE and SPC for Lean Six Sigma Meeting with Dr. Lasky  +

Location
Corporate College East, Warrensville Heights, Ohio



Meeting Outline:
  1. How the Math fits into LSS DMAIC
  2. Statistics:
    - Statistically Thinking
    - The Normal Distribution
    - Confidence Intervals
    - Hypothesis Testing
  3. Design Of Experiments (DOE):
    - The Importance of Experiments
    - Setting Up the DOE Team
    - ANOVA: The Heart of DOE
    - A Simple DOE by Hand
    - Solving DOEs with Minitab
  4. Statistical Process Control (SPC):
    - The Cost of Variation
    - Common Cause vs Special Cause Variation
    - Precision and Accuracy
    - Gage R & R
    - Control Charts
    - The Shewart Rules
    - Capability Six Pack
 
Minitab with be used with examples throughout. A free 30 day version can be downloaded from www.Minitab.com & bring your PC to work through examples.

Following the meeting a facility tour of Bird Technologies in Solon, OH will be available.
 
Speaker: Dr. Ron Lasky, Instructional Professor at Dartmouth College and a Senior Technologist at Indium Corporation.
Prior to these assignments, he had over thirty years experience in electronic and optoelectronic packaging and assembly at IBM, Universal Instruments and Cookson Electronics. 
 
He has authored or edited 6 books on science, electronics, and optoelectronics and numerous technical papers and authored articles for Scientific American.  Dr. Lasky holds numerous patent disclosures and is the developer of the several new concepts in SMT processing software relating to cost estimating, line balancing and process optimization.  He is the co-creator of engineering certification exams in electronic assembly and the Director of Dartmouth’s Six Sigma Program.  Ron was awarded the Surface Mount Technology Association’s Founder’s Award in 2003.
 
He owns four earned degrees, including a Ph.D. from Cornell University in Materials Science.  Ron is also a New York State licensed professional engineer.


Meeting Agenda:



April 23 - 26

SMTA China East Technology and Vendor Conferences 2018   +

Location
Shanghai World Expo Exhibition & Convention Center
Shanghai China


Technology Workshop: 23 April 2018
Technology Conference: 24-25 April 2018
Vendor Conference: 25-26 April 2018
Shanghai World Expo Exhibition & Convention Center

The SMTA China cordially invites you to participate in SMTA China East Conference located in Shanghai 2018. This event, held in conjunction with NEPCON China 2018, will as usual address the industry's most pressing issues in electronics assembly/ manufacturing, industry/technology roadmap, business focus, advanced packaging, practical skill development, emerging technologies, and lead-free & reliability.

 

Lin Dong

Technology Workshop on Implementation of Intelligent SMT Warehouse

Monday 23 April

On Monday 23 April 2018, renowned expert Lin Dong, Artesyn Embedded Technologies, will instruct a full-day workshop on Implementation of Intelligent SMT Warehouse. View the complete workshop description in English and Chinese.

 

View the technical conference schedule

(Tuesday 24 April and Wednesday 25 April)


April 24 - 26

Electronics in Harsh Environments Conference  +

Location
Crowne Plaza Amsterdam - Schiphol
Amsterdam 2132 HZ Netherlands


Building on the successful Contamination, Cleaning and Coating Conference in 2017, SMTA Europe will host the Electronics in Harsh Environments Conference on 24-26 April 2018 in Amsterdam, Netherlands. The conference will focus on building reliable electronics used in power electronics and harsh environments. Thermal, power and signal integrity requirements can present challenges when on devices that operate within harsh environments. Component integration, paired with a growing complexity of the package architectures, larger form factors and higher interconnection densities increase the risk of in-field failures. Over powering or over heating of a device can have serious consequences including internal package failure, down-stream device errors and second level interconnect solder joint failures. Soldering residues are more problematic, and if not understood, can result in both intermittent and complete device failure. This conference tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. Specific topics include building reliable high density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high temperature soldering, solder material advances, and new standards will be presented. Contact Tanya Martin, tanya@smta.org, with questions or comments.


April 24 - 26

Electronics in Harsh Environments Expo  +

In conjunction with the Electronics in Harsh Environments Conference

Location: Crowne Plaza Amsterdam - Schiphol
Planeetbaan 2
Amsterdam 2132 HZ


Exhibitors

Exhibit Hours:
Tuesday, April 24: Afternoon
Wednesday, April 25: Full Day
Thursday, April 26: Full Day

Exhibition sold out!

Sponsorship opportunities still available! 


Exhibit space entitles you to:

  • 6 ft. draped table
  • Two chairs
  • One technical conference pass (a $600+ value!)
  • Electronic attendee list (sent after the conference)
  • Directory listing
  • Lunches
  • Reception

Sponsorship Opportunities:

  • Reception Sponsor - $500/€425 (limit 2)
  • Lunch Sponsor - $500/€425 (limit 3)
  • Refreshment Break Sponsor - $300/€250 (limit 4)
  • Lanyard Sponsor $200/$400 (SOLD!)


April 24

Empire Expo & Tech Forum  +

Location: Holiday Inn Syracuse/Liverpool
441 Electronics Parkway
Liverpool, NY 13088


Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. 
Important Exhibitor Materials:

Click HERE for discounted hotel rates

Exhibitor Kit


Please contact SMTA Expo Manager Hannah Funk with questions or for additional information.



Attendees

Free Technical Program & Schedule:

 

8:00am

Registration Opens

9:00am - 9:30am

Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat
Speaker: Jason Fullerton, Alpha Assembly Solutions

The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases.  Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently.  Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances.  The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.

Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding.  The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact.  Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages.  The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.

A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages.  The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms.  Design and manufacturing rules developed from this work will be discussed.

 

 

9:30am - 10:00am

Identifying Defects on BTC Assemblies with X-ray Analysis
Speaker: Bill Cardoso, Ph.D., Creative ElectronBill Cardoso

The use of x-ray inspection in the electronics industry has gained wide adoption in the past 20 years, driven mainly by the development and use of bottom terminated components (BTC). The use of ball grid arrays (BGA), for example, allowed the development of standards and guidelines that dictate the maximum void size in each ball. In consequence, x-ray machine manufacturers developed solutions that address these requirements to became an integral part of the quality assurance function of modern electronic manufacturers.

However, as new x-ray technologies are introduced – from new algorithms to new hardware – users are faced with a growing range of options to choose from. Users need a solid technical background to understand these options to make an educated decision when acquiring x-ray inspection capabilities. For example, what level of resolution is necessary for a specific application? Is an open tube or sealed source the most appropriate technology to deploy?

The goal of this presentation is to give the audience the tools needed to avoid making mistakes when acquiring x-ray inspection capabilities. Instead of focusing on the x-ray technology per se, this work starts from the application needs of the electronic industry and ties it back to the available technology offerings available in the market today. The goal is to set the record straight and clearly define critical concepts in x-ray inspection. The different x-ray modalities, 2D, 2.5D, and 3D x-ray inspection will be explained in details at the user level – no math involved. Most importantly, this presentation will cover when each modality must be utilized for a successful quality assurance program. A rich set of images and videos will be used to illustrate the advantages and disadvantages of each x-ray inspection modality.

10:00am

Expo Opens

11:00am - 12:00pm

Expert Panel Discussion on BTC Challenges and Strategies
Hosts: Martin Anselm, RIT, and Kim Flanagan, Indium Corporation

12:00pm

Complimentary Lunch

1:30pm - 2:00pm

Avoiding the Pitfalls of BTC Assembly
Speaker: Kim Flanagan, Indium Corporation

Bottom termination component use has increased very quickly throughout the last decade. Typical assemblies now have many of these components, often varying types of BTCs on one assembly. What is there to do when one or more starts to show increased variation within the same process? Many investigations have been conducted to find materials that offer the lowest voiding in large ground plane solder joints. In addition, there are many process modifications that have been proposed over the last decade to alleviate voiding in BTC components. These include but are not limited to: pad design, pad patterning, stencil design, via positioning, solid solder addition, and reflow profile optimization.

Furthermore, improved pad design strategies have been proven in the industry. IPC committees are updating the recommendations for design and implementation of BTCs including big changes to the IPC-7093. This presentation will discuss these changes and how these strategies can be used to minimize voiding and ensure robust BTC assemblies.

 

2:30pm - 3:00pm

Reflow Solutions to Minimize Voiding
Speaker: Dave Heller, Heller Industires Inc.

Vacuum assisted reflow soldering is a robust process that reduces void % in SMT and die attach soldering, typically by a factor of 10X.  Thermal cycling test results have indicated that solder joint fatigue life and die life in BGAs, bottom terminated components, LEDs and power devices can be reduced by excessive solder joint voids.  Much work has been done in the past to optimize flux, pad, component metallization, and solder paste deposition but these changes have not reduced voids in a thorough and consistent manner.  This paper will review customer and lab experience in reducing voids in typical die attach and SMT applications as well as review the equipment needed for vacuum assisted reflow.  These results can be applied to existing soldering processes that may currently produce excess voids and inadequate reliability. 

4:00pm

Raffle - 4 ($25) amazon gift cards

 

Expo closes after the Raffle


April 26

Rocky Mountain (Colorado) Chapter: Design for Test and Spectrum Analysis  +

Location
Mentor Graphics Training Center







SAVE THE DATE!
The SMTA Rocky Mountain Chapter
is pleased to announce the next Technical Session:
“Design for Test and Spectrum Analysis”
April 26, 2018
Design for Test and Spectrum Analysis will be an informative technical session focusing inspection techniques and DFX. This session will explore different methodologies for testing today’s assembly packages for implementing a test strategy which best meets production process requirements.
Who should attend: Quality engineers, Manufacturing Engineers, Design Engineers, Engineering Managers, Buyers, and Engineering Students.
Meeting Details
Where:                                              Mentor Graphics, Longmont, CO
When:                                                April 26, 2018
Time:                                                  9:00  AM - 2:00 PM
RSVP:                                                 RSVP Link - Design for Test & Spectrum Analysis
Event Registration Fee:                 $35.00 - members
                                                            $45.00 - nonmembers
Payment:                                          Payment for the event can be made via PayPal in advance or at the door
 
Google Map:                          Google Maps Link to Mentor Graphics, 1811 Pike Road, Longmont

















Presentation Agenda:
9:00 – 9:45                  Registration check-in and networking opportunity
                                               Coffee and pastries sponsored by Palpilot
Pal Pilot
 
10:00 – 10:45              3D AOI     Presented by: Koh Young
Not long ago, 2D inspection was the industry norm, then 3D inspection quickly proved itself. Today, true 3D measurement is even more powerful, especially when AI power analyzes the real data. But what is the difference between 3D inspection and 3D measurement, and how can AI improve your process?

 
Koh Young Technology
 
11:00 – 11:45              Flying Probe     Presented by: Takaya
Flying Probe Test (FPT) was introduced in the mid 1980’s out of necessity to develop a test process that would be cost effective for low volume situations.  As FPT technology progressed it has evolved to provide test capabilities similar to those of In-circuit Test (ICT) Bed-of-Nails (BON).  Today’s test strategies can be developed on FPT to test for all process faults as well as providing Power-On functional test, BSCAN, ISP to simple quick turn MDAs. With the continued minimization of today’s PCB designs, and further reduction of traditional test access, FPT continues to be the preferred test platform to provide the best achievable test coverage of these assemblies. This presentation will cover the defect spectrum that flying probe test is well suited to detect, based on its in-circuit test capability and the mechanical accuracy that flying probe systems can provide.
 
Texmac Takaya
 
12:00 – 1:00 PM         Lunch Sponsored by Takaya

 2:00 – 2:45 PM           Design for Test DFX     Presented by: Mentor Graphics
Electrical test and structural inspection have evolved significantly over the past 5 years. Flying probe testers are now double sided, inspection systems are combined optical and X-ray inspection but to extract the maximum performance from these technologies requires the existing reactive test flow to become proactive. Test and inspection feedback must be considered during the design flow, and not implemented as an afterthought. Understanding the historical challenges in PCB manufacturing allows future designs to benefit from the experience to deliver the optimized test coverage for each product. This presentation will discuss these challenges and ways that they can be implemented in today’s PCB design flow.
 
 
Mentor
 
 
Thank you to our sponsors. Without you, these events would not be possible.

 
Pal Pilot    Texmac            Mentor
 
Breakfast pastries with coffee and lunch included. To ensure adequate number of meals for the event, RSVPs MUST be received no later than 4/24/2018. For special dietary needs, please also contact Patty Chonis at 970-443-9233 or email at patty@atekllc.com to ensure proper food selection.
Please note, space is limited to 50 attendees so register early!



May 1

Oregon Expo & Tech Forum  +

Location: Tektronix Building
14200 SW Karl Braun Dr
Building 38
Beaverton, OR


Exhibitors

The cost to exhibit is $450 for a booth and $350 for a table. The cost to exhibit includes: one 5ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Please note: This year both tabletops and booths will be available. Those purchasing a table top please refrain from using banners, screens etc. A $50 discount per booth/table will be offered for multiple spots at one show or one or more in each location.



Attendees
Attendees Register Now

Please see the Oregon Chapter Page for More Information on Technical Sessions and Expo Materials.


May 2 - 10

Great Lakes (Chicago) Chapter: Membership Appreciation Event: “Management Overview of the Smart Factory (Industrie 4.0) Principles and affects in Electronics Manufacturing” -By Jay Gorajia  +

Plexus Corporation, 2400 Millbrook Drive, Buffalo Grove, IL 60089



SMTA Great Lakes Chapter Meeting
Wednesday, May 2nd, 2018
 
Location: Plexus Corporation
  2400 Millbrook Drive
  Buffalo Grove, IL 60089
 
 
 
 Management Overview of the Smart Factory (Industrie 4.0) Principles and affects in Electronics Manufacturing 
 
By Jay Gorajia, Director of Consulting, PCB Design and Manufacturing Services, Mentor Graphics

Download the presentation here!
 
In this workshop, we will investigate what Industrie 4.0 or “Smart Manufacturing” actually is and what the related market and technology drivers behind it that makes significant change to the PCB electronics industry inevitable. We will look at through the supply and demand chain, at what changes need to be made, starting with the consumer, the customer, to understand what their demands are, and what benefits or changes Industrie 4.0 will bring to them and the manufacturers.  Manufacturing analytics is core to Industrie 4.0, and its related Cyber-Physical Systems connectivity to better manage delivery, quality and customer integration and collaboration. We look also across the breadth of the electronics manufacturing organization, to see exactly what is required to make a step-change practically possible when adopting the principles of Industrie 4.0, and the related benefits. 
 
About the Speaker:

 

 

Jay Gorajia is Director of Consulting, PCB Design and Manufacturing Services, at Mentor Graphics. Jay works with OEMs and contract manufacturers to improve efficiency and help define cost, quality and productivity improvement solutions in design quality, design to manufacturing, manufacturing engineering and production manufacturing.   For over 23 years Jay has worked with hundreds of manufacturers and design organizations around the world, resulting in real improvements through a systematic metrics-based methodology. Mr. Gorajia holds a Bachelor’s degree (B.Sc.) in Electronic Engineering and a Masters in Business Administration (MBA) in Technology Management. 

 

He has published a number of articles and White Papers in industry leading technical magazines and industry. conferences including: 

 

Ø"Dynamic Production Planning” - SMTA International Technical Paper - October 2011

Ø“Optimizing process performance” - Global SMT & Packaging Magazine - April 2011

ØBenefits of Factory Software Interoperability” - Printed Circuit Design & Fab/Circuits Assembly - August 2010

Ø“Leveraging Manufacturing Solutions with FMEA” - SMTA Technical Publications - October 2012

Ø“Deployment of Manufacturing Operations Management systems” EM Asia – China magazine, April 2007

ØCo- authored “Interoperability: The Next Big Thing in QMS/MES” Surface Mount Technology (SMT), October 28, 2009, (www.electroiq.com)

ØMost recently “Sales and Marketing in a Digital Transformation Reality” – SMT Magazine December 2016, and several more.

 

He is a regular speaker at SMTA regional conferences and IPC chapter workshops and meetings, and on IPC committees. 

 
Time: 2:00pm (Arrival & Check-In)
  2:30 pm (Presentation)
  3:30 pm (Questions)
  4:00 pm (SMTA Updates/Survey Time)
  4:30 pm (Adjourn)
Location: Plexus Corporation
  2400 Millbrook Drive
  Buffalo Grove, IL 60089
Cost: Membership Appreciation Event
  FREE for Members
  $20.00 for Non-Members*
  *FREE with registration for SMTA Membership - See link below.
 
 
Become a Member:  https://www.smta.org/membership/
 
RSVP to Gerri Noble at gnoble@ntech-inc.com or via the SMTA Great Lakes Chapter Webpage.



May 3

Puget Sound Expo & Tech Forum  +

Location: DoubleTree by Hilton Seattle Airport
18740 International Boulevard
Seattle, WA 98188


Exhibitors

Exhibit space sold out! Contact Courtney Kalb to be placed on a waitlist.

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $40 per outlet. Early bird pricing ends on March 29th, 2019!

Please contact SMTA Expo Manager Courtney Kalb with questions or for additional information.

Important Exhibitor Materials:

Exhibitor Application

If you need a hotel room, you can book one at a discounted rate here.



Attendees

Location Change!
The venue has changed to the DoubleTree by Hilton Seattle Airport Hotel.
Please update your calendar with the new location details. 

 

Free Technical Program & Schedule:

Thank you to our Technical Session Sponsor:

9:00am

Registration Opens

 

Thank you to our Breakfast Sponsor: 

 

10:00am

Expo Opens

 

10:45am-12:00pmKurt Robertson

The Ups and Downs of Continuous Improvement

Speaker: Kurt Robertson, MBA, PMP, C.P.M., CPIM-F, Lean Sensei, Six Sigma MBB

From the Toyota Production System (aka Operations Excellence, Continuous Improvement, Lean, Six Sigma, JIT, etc.) to all the excuses, failures and successes that accompany its implementation, this presentation will include both a PowerPoint introduction and audience discussion on the past and future of the proven methodology to make your business better.  But for sure, your business is not static; it is either progressing or regressing, and your competitors never rest.

 

Thank you to our Lunch Sponsor: 

12:00pm

COMPLIMENTARY LUNCH

 

1:00pm-2:15pm

iPhone X - Steve Jobs' iPhone

Speaker: Bill Cardoso, Ph.D., Creative Electron

It’s been 10 years since Steve Jobs introduced the iPhone to the world. Much has happened since then. Over this past decade, the iPhone became a reference design, and the object of desire of a legion of fans who wait anxiously for every launch of the Cupertino company. Undoubtedly the most advanced iPhone in the market today, the iPhone X is a technology marvel. The double stacked boards, dual battery, and a face recognition sensor bring the iPhone X to a whole different level.

In this presentation, we’ll explore these technological advances by a live teardown of the iPhone X. The teardown will be followed by a detailed coverage of the technical details of critical parts of the device. This live teardown will be accompanied by x-ray and CT images of the iPhone X, so the audience will get unprecedented insights on what makes this iPhone tick. More importantly, we will explore the assembly process utilized to put the iPhone X together. This presentation is targeted at a wide technical audience looking for a better understanding on how advance consumer electronics are designed and assembled.

 

3:00pm

Expo Closes


May 8

Wisconsin Expo & Tech Forum  +

Location: Milwaukee Airport Crowne Plaza
6401 S 13th St,
Milwaukee, WI 53221


Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Please contact Steve Stiller at steve@midwestproductionllc.com for questions or for additional information.

Click HERE to register to exhibit!



Attendees
Attendees Register Now

Attendees can register on the SMTA Wisconsin Chapter page.

Please see the Wisconsin Chapter Page for More Information on Technical Sessions and Expo Materials.


May 11

Space Coast (Melbourne FL) Chapter: Young Professional Bowling Night Out  +

Palm Bay - Shore Lanes Bowling 4851 Dairy Rd, Melbourne, FL 32904



Represent your company and meet your peers at this fun event!


May 14

Webinar: Robotic Soldering Using Laser & Iron Soldering in Production  +


Bob WillisMay 14 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Practical guide to the use of robotic soldering irons and laser soldering on printed board assemblies will be covered in this webinar along with the use of different alloys and substrates. Most of the work reported is covered in two NPL reports on through hole soldering. When we start to talk about high temperature electronics, it’s not just the solder, it’s all the parts that make up an electronic assembly. Substrates, components, connectors, cables, solder and all of the assembly process needs to be examined in detail. Some newer techniques of soldering can reduce the stress on boards and components and also need through put requirements of modern manufacture. Working at high temperature means between 150-200°C, however, there are many applications that have to work at much higher levels, up to 300°C. Typically, the industries affected by these hostile working conductions include, aerospace, automotive, petrochemical and military. The use of selective soldering is used with high temperature materials and more recently there is a growth in the use of robotic laser and iron soldering. These systems are being used by telecom and automotive producers with different cored wire combinations.

The webinar is a mixture of theory and practical assembly trial evaluation results with current and future technology using selective soldering plus laser and robotic iron soldering processes at NPL National Physical Laboratory. A FREE copy of the High Temperature Electronics Defect Guide will be provided to each delegate. The defect charts can be printed on site for future reference or training. A guide to major reference sources and publication on high temperature manufacture will be discussed and suppliers providing different assembly resources.

Topics include:

Reference books, specification and standards
Product temperature range
Component compatibility
PCB substrate choices & specifications and design
Soldering alloy choices
Assembly & soldering options
Setting up and assessment
Process and quality control
Process failures in automated soldering

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.

All webinar times shown are UK time – to check your local time in your countries click here


May 15

Capital (DC) Chapter: What’s New in IPC J-STD-001G and IPC-A-610G?  +

EIT Leesburg, VA



By William Graver, Senior Analyst Master IPC Trainer
NTS 

BIOGRAPHY:

Mr. William Graver has over 30 years of experience in the PCB and PCA manufacturing industry. Currently, Mr. Graver is a Senior Analyst at NTS’s facility in Hunt Valley, MD (NTS-Baltimore). His main areas of focus are PCB/PCA Failure Analysis and IPC training, for which Mr. Graver holds the following certifications:
· MIT (Master IPC Trainer) IPC-A-600
· MIT (Master IPC Trainer) IPC-A-610
· MIT (Master IPC Trainer) IPC-6012
· MIT (Master IPC Trainer) IPC/WHMA-A-620 

Revision G of these key industry standards, IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610 Acceptability of Electronic Assemblies, feature changes that address evolving manufacturing and soldering technologies. The new revisions include expanded hole-fill requirements, expanded SMT requirements including staking, and new certification training and proficiency requirements. 

Overall IPC J-STD-001 changes that will be discussed:
  • Expanded several sections including Terms and Definitions, Materials, General Soldering and Assembly
  • Wires and Terminal Connection: expanded tinning, service loops, orientation
  • Space Station symbol where J-STD-001GS has an effect 
  • Surface Mount Technology: revised criteria for critical placement and solder for some components; tighter requirements for all classes
  • Product Assurance added Magnification Aid Applications for Wires and Wire Connections Table
  • Wording improved and figures added to align with IPC-A-610 and IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies
Overall IPC-A-610 changes that will be discussed:
  • Expanded several sections such as Terms and Definitions and Hardware
  • Added magnification requirements
  • Clarified Wires and Terminal requirements including referenced tables
  • Expanded Surface Mount requirements for several components
  • More pictures and tables
Also discussed:
  • Overview of Amendments including the Space Amendment and the Cleanliness Amendments
  • Status of major standards going forward
  • IPC/WHMA-A-620C, IPC-A-600J, IPC-6012D
  • New certification processes and requirements



May 15

Carolinas Expo & Tech Forum  +

Location: DoubleTree Raleigh Brownstone
1707 Hillsborough Street
Raleigh, NC 27605



Exhibitors

Exhibit Space is SOLD OUT! 

Please contact SMTA Expo Manager Courtney Kalb with any questions or for additional information.

 

Click HERE for discounted hotel rates



Attendees

Exhibit Hours:
Tuesday, May 15, 2018
10:00AM–4:00PM

Free Program and Technical Schedule:

Thank you to our Breakfast Sponsor: 

8:00am

Registration Opens

 

9:15am-10:00am 

Paste Qualifications for EMS Production

Speaker: Chrys Shea, Shea Engineering Services

Many SMT operations struggle with “process issues” that are actually solder paste-related, and have been resolved in newer generations of the materials.  Nagging defects like tombstones, solder balls, excessive voids and Head-In-Pillow can often be mitigated with a change of solder paste.  Newer formulations print better, wet better, endure hot reflow cycles better, and void less than older ones.

 

10:00am

Exhibit Hall Opens

 

10:30am-11:15am 

AI-Powered 3D Inspection Benefits

Speaker: Mr. David Suh, Koh Young America

Not long ago, 2D inspection was the industry norm, then 3D inspection quickly proved itself. Today, True 3D measurement is even more powerful than 3D inspection, especially when AI power analyzes the real data. But what is the difference between 3D inspection and 3D measurement, and how can AI improve your process?

 

11:30am

COMPLIMENTARY LUNCH

Thank you to our Lunch Sponsor

 

12:30pm-1:15pm

The Smart Reflow Oven For the Industry 4.0 Factory

Speaker: MB Allen, KIC

The reflow oven is often considered the black box in the electronic assembly factory. As the industry is trending towards the smart factory to reduce cost of manufacturing while providing consistent quality and new capabilities such as full process traceability, the reflow oven is undergoing a dramatic transformation.

 

1:45pm-2:30pm 

AXI and MXI; How They Complement Each Other

Speaker: John Travis, Nordson DAGE

This presentation will introduce you to some of the cutting edge technologies in Digital XRAY tubes, Detectors, 3D X ray and micro CT.  We will also introduce the latest technology in 3D AOI and how those technologies translate into better more efficient defect detection.

 

3:00pm-3:45pm

Semiconductor Power Electronics Applications and Associated Supply Chain

Speaker: Nick Mescia, PowerAmerica

This presentation will identify the various 14 Manufacturing Institutes, and identifying the various manufacturing institutes with electronic interests. Also identifying the everyday uses of semiconductors. What are WBG semiconductors and their properties, and their benefits over silicon semiconductor technology in power applications. Identifying the possible uses of WBG technology and the establishing an associated overview supply chain (from wafer fab, component packaging, other power required components (magnetics, power connectors, printed circuit board (PCB) fabrication with heavy copper and possible embedded heat pipes for heat dissipation) for the possible power product build of material (BOM) for the OEM to design a power product, and including both the PCBA and associated box / product build for the power users). Finally an in depth detailed supply line flow identifying both current and possible supply chain members, which is still being established.

 

4:00pm

Exhibit Hall Closes



May 16

Best Practices in Electronic Assembly Processes - Carolinas Chapter Tutorial Program  +

Location
NC State Centennial Campus
Raleigh , NC 27606



Instructor: Phil Zarrow, ITM Consulting

May 16, 2018

8:00 a.m. - 4:00 p.m.
PowerAmerica
Venture Place Building
NC State Centennial Campus
930 Main Campus Dr.; Suite 200
Raleigh, NC 27606
(919) 513-6013

 

Price:

  • Members: $200
  • Non-Members: $295 (A one-year Individual SMTA Membership is included in the non-member price.)
  • Carolinas Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $70 (A one-year Student SMTA Membership is included in the non-member price.)

Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

Introduction:
You have the responsibility and resources to improve the productivity of an assembly operation…what do you do? This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line engineers involved in manufacturing, design and quality engineering.

Topics Covered:

  • Introduction
  • Optimization Objective
    - Getting the Most Productivity from an Existing Line
    - Definition of "Best Practices"
  • Process Characterization
  • Best Practices in the Assembly Process
    - Solder Paste Printing Process Best Practices
    - Pick and Place Best Practices
    - Reflow Soldering Best Practices
    - Wave Soldering Best Practices
    - Selective Soldering Best Practices
    - Cleaning vs No-Clean Considerations and Best Practices
  • Q & A


Who Should Attend:
This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies.


Phil Zarrow About the Instructor:

Phil Zarrow
Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world. During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.


Since forming ITM Consulting in 1993, Phil Zarrow has helped numerous clients in such areas as

  • SMT Implementation and Assembly facility set-up
  • SMT Assembly and Soldering Failure Analysis
  • EMS/Supplier Process and Quality Assessment Audits
  • Counterfeit Component Avoidance and Interception Programs
  • Manufacturing yield improvement
  • Equipment Evaluation and Selection
  • No-clean and lead-free solder paste evaluation and process implementation
  • SMT Manufacturing Process Audits and process improvement
  • On-site training for all levels of personnel
  • Design for Manufacturability (DFM) specification development
  • Reflow of Through-hole feasibility, development and implementation
  • Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
  • SMT process equipment benchmark testing and evaluation
  • SMT product development
  • Lead-free Process Implementation and Optimization
  • Technical evaluations related to business acquisitions and mergers
  • Technical assistance in legal disputes

Mr. Zarrow is a popular speaker and workshop instructor. He has chaired and instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of the book, "SMT Glossary- Terms and Definitions". Mr. Zarrow holds two US Patents concerning PCB fabrication and assembly processes and audit methodologies.
Phil is a member of IPC, SME, IMAPS, a co-founder of ITM Consulting, and is a past national level officer and national director of the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders’ Award (2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forefront" and “Better Manufacturing” columns. He is currently producer and co-host of IPC Update's “Boardtalk” audio program.

 

This event is conveniently scheduled one day after the SMTA Carolinas Expo, so plan an extra day to get the most out of your trip.

Hotel:

If you require a hotel room, we have negotiated a block of rooms at the DoubleTree Raleigh Brownstone (the location of the Expo on 5/15, and less than a mile from NCSU) for May 14, 15, and 16.  Click HERE to book your hotel room.  Discounted rates expire on 4/27/18.


Contact Karen Frericks at 952.920.7682 with questions.
 


May 16 - 17

Medical Electronics Symposium 2018  +

Location
University of Dallas
Dallas , TX


Details for 2019 symposium coming soon...

 

SMTA, INEMI, and MEPTEC have joined forces to again host this international conference, focusing on advances in electronic technologies and advanced manufacturing, specifically targeting medical and bioscience applications. Last year's conference attracted about 200 attendees and more than 30 exhibitors. Prior to last year, MEPTEC's and SMTA's conferences were held in Phoenix, Arizona and Milpitas, CA, respectively, drawing technology experts, entrepreneurs and service providers that work in this niche technology space. Typical applications within this space involve implantable defibrillators, neurostimulators and drug delivery, interventional catheters, pillcams, ultrasound transducers, hearing aids, biosensors, microfluidics, wireless communications, as well as future diagnostic and treatment solutions that may use stretchable electronics, microelectromechanical systems (MEMS) or nanoelectromechanical systems (NEMS).

 

Technical Program
Click here to view the program.
Medical Electronics Symposium Agenda

 

Panel Discussion: Challenges and Opportunities

Thursday, May 17 | 12:05pm

Moderators: 

E. Jan Vardaman, TechSearch International

Chuck Richardson, iNEMI

Distinguished panel members include:

  • Dale Lee, Plexus
  • Don Banks, Abbott
  • Peter Tortorici, Ph.D., Medtronic
  • Robert Rennaker, Ph.D., The University of Texas at Dallas
  • Walter Voit, Ph.D., The University of Texas at Dallas

 

Join us for complimentary UT Dallas Facility Tours!

Wednesday, May 16 | 6:00-7:00pm

Sign up when you register for the conference. More information and details to follow.

 

Keynote Speakers

Sensorizing and Connecting Medical Devices

Cory Forbes Cory Forbes, CTO, Nypro

The digital revolution is upon us and Connected Devices have become ubiquitous, medical devices are quickly catching up. Integrating the hardware into evolving product form factors and streamlining the data collection and the analytics layers of the IoT ecosystem across different domains (smart retail, hospitality, healthcare, safety, etc.) can help enhance the ROI of the solution. A complete IOT ecosystem consists of Users, Organizations, Devices, Sensors, Gateways, Data and Analytics wrapped in a seamless user experience. The success of such an ecosystem depends on innovative and intelligent integration of these components and effective deployment driving meaningful output. Some examples of such integration are discussed in this presentation to provide a window into the opportunities to integrate sensors into previously passive or non-sensorized medical devices. While there are several subsystem components the presentation outlines opportunities and challenges for enabling electronics integration leveraging current and future technologies supporting digitization of healthcare devices and enhancing related services.

Cory Forbes serves as the Chief Technology Officer of Nypro, A Jabil Company and leads the global product development, technology and program management teams. Nypro’s teams engage with the worlds leading OEM’s in the Diagnostic, Medical Device, Pharmaceutical, Test & Measurement and Consumer Health product domains. Cory has been with Jabil for more than 14 years and has held leadership positions in manufacturing, business management, supply chain, environmental design and product development. He received his Bachelors of Science Degree in Mechanical Engineering from the University of Alberta and has worked professionally in Canada, Brazil and the United States for Nortel Networks, Jabil and Nypro.
 

 

Robotic Surgery: Where Are the Opportunities?

Kemp H. Kernstine Kemp H. Kernstine, Sr., M.D., Ph.D., Division of Thoracic Surgery, UT Southwestern Medical Center

Abstract to follow.
 

 

 

Sensors for Medical Applications: Unlocking the Value

John Burnes John Burnes, Medtronic Technical Fellow and the Director of Implantable Core Teams, Cardiac Patient Monitoring and Diagnostics, Medtronic

This presentation will review the landscape of sensor technology and potential applications to healthcare.  New sensor technology for medical and wellness applications has grown exponentially through both implantable and external form factors.   These sensors provide a valuable first step to improving health outcomes.  Systems incorporating these sensors will be reviewed to highlight the role of not only sensors, but also information technology, patients, clinicians, clinical evidence, and payers in creating solutions that are widely adopted and can improve health outcomes.  True value that improves health, better manages chronic disease, and/or guides clinical action will come from systems that guide action with minimal patient or clinician interaction.

John Burnes is a Medtronic Technical Fellow and the Director of Implantable Core Teams in the Medtronic Cardiac Patient Monitoring and Diagnostics division.  He received his PhD in Biomedical Engineering from Case Western Reserve University with his thesis on Electrocardiographic Imaging for Interpretation of the Electrical Activity of Diseased Hearts.  He has worked at Medtronic for 17 years in Research and Development roles where he has developed new algorithms for cardiac resynchronization therapy and has led programs focused on new heart failure therapies, obesity therapies, and implantable cardiac monitoring for dialysis patients.  John is currently leading the development of the next generation of Insertable Cardiac Monitors. 

 

 


May 17 & 18

SMTA Webtorial: Tin Whisker – All You Should Know   +


Two (2) 90 minute Sessions
May 17 and 18, 2018

1:00pm to 2:30pm Eastern
Dr. Jennie S. Hwang Presented by: Dr. Jennie S. Hwang, H-Technologies Group

Overview:

For the recent years, concerns about tin whiskers have been intensifying although tin whisker issue and its potential mishaps have been recognized for more than six decades in electronic, electrical and industrial applications. The webtorial provides a holistic coverage on relevant aspects of tin whiskers from both physical/phenomenal occurrence and fundamental scientific perspectives. The webtorial also explains why the tin whisker propensity under a study should be concluded with a specific alloy composition in conjunction with a specific system; and why a reference point is needed. Tin whisker mitigating measures and their relative effectiveness will be highlighted. Your questions and issues for solutions and discussions are welcome.

Main Topics for Part 1:

  • Definition & clarification;
  • Physical phenomena;
  • Reference point;
  • Causes and factors;
  • Concerns & impact;
  • Case Study.

Main Topics for Part 2:

  • Reliability;
  • Test conditions;
  • Mitigation remedies;
  • Relative effectiveness of mitigating measures;
  • Plausible mechanism;
  • Tin whisker vs. tin pest;
  • Summary.

Who Should Attend:
The webtorial provides a working knowledge to all who are concerned with or interested in tin whisker and related issues in electronic packages and assemblies including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.

About the Instructor:
Dr. Hwang, a pioneer and a major contributor to the implementation of Surface Mount manufacturing since its inception as well as to lead-free electronics, brings to the webinar her 35+ years experience in hands-on production and as an advisor to OEMs, EMS and Defense programs. She has provided solutions to many challenging problems - from production yield to field failure diagnosis to high reliability issues. Among many honors/awards are the U.S. Congressional certificate of Recognition and Achievement, induction into WITI International Hall of Fame, named “R&D Star-to-Watch” by Industry Week, YWCA Women of Achievement Award; induction into the National Academy of Engineering. She is the author of 500+ publications and several ground-breaking books on SMT manufacturing and lead-free technology and manufacturing, and is an invited speaker in numerous international and national events. Additionally, she has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees. She chairs the Board of the Assessment of Army Research Laboratory of DoD, of the National Institute of Standard and Technologies, and has been an advisor and a reviewer of government programs (DoD, NASA, NIST, etc.) and various publications. She also serves on the National Manufacturing and Materials Board, National Laboratory Assessment Board, and Board of Army Science & Technology. Her formal education includes Harvard Business School Executive Program and four academic degrees (Ph.D. in Metallurgical Engineering & Materials Science, M.S. in Physical Chemistry, M.S. in Liquid Crystal Science, B.S. in Chemistry). She has held senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and International Electronic Materials Corp. She is president of H-Technologies Group and is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.


May 22

South East Asia Technical Training Conference on Electronics Assembly Technologies 2018  +

Co-located with Semicon Southeast Asia

Location
MITEC
Kuala Lumpur Malaysia


Conference Rescheduled

Due to the announcement from the Malaysian government regarding election day being held on May 9th the SEMICON Southeast Asia Show, and subsequently the SMTA SEA Technical Conference on Electronics Assembly, has been postponed. We sincerely apologize for any inconvenience this may have caused.

Rescheduled Event Dates:

May 22, 2018 - SMTA One-Day Program at SEMICON Southeast Asia

Semicon 2018

Click here to view the one-day program.

 

August 14-16, 2018 - SMTA SEA Technical Conference on Electronics Assembly (Three-Day Program) co-located with SMTA Penang Expo

Program and Registration to follow.

The Southeast Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues. The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

The conference is "claimable from HRDF under SBL scheme."

 



Why Should You Attend:

  • There will be adequate time to have our industry experts respond to your questions
  • Networking time will allow you to continue discussions following the presentations
  • This is one of the best ways to enhance your knowledge and your company's profitability
  • Extensive participation from experts from around the world provides for a comprehensive educational experience
  • The SMTA reputation ensures high quality technical information that can be put to use immediately

 


May 23

Silicon Valley (San Jose) Chapter: Printed Electronics/ Flex Hybrid/ Wearables/ E-Textiles  +

Location
NextFlex: 2244 Blach Pl Suite 150, San Jose, CA 95131



DATE
: Wednesday, May 23, 2018 
 
PLACE: NextFlex
2244 Blach Pl Suite 150, San Jose, CA 95131
TIME
Sign In/Registration: 2:30pm-3:00pm 
PRESENTATIONS: 3:00pm-5:30pm 

SMTA Members: Free; Non-Members: $20
(By cash or check payable to ‘SMTA Silicon Valley Chapter’ at the door)

SMTA Membership 
(Individual: $75 per year, Membership sign up at 
www.smta.org)
 
Printed Electronics/ Flex Hybrid/ Wearables/ E-Textiles
 
Speaker: Dr. Brian J. Toleno, Principal Material Scientist, Microsoft
 
Abstract: Within the electronics industry we have seen the drivers of technology move from military and industrial electronics to mobile devices. Looking to the future there are a few areas that are discussed with respect to rapid growth in the electronics area: internet of things (IoT), wearable devices, and AR/VR. With over 1 Billion dollars invested in this technology in 2016 (DigiCapital) and the number of devices rising to over 100 million units by 2020 (Statista), these devices pose some unique challenges with respect to not only the optical requirements, but the electronics to drive these systems. In this presentation we will review the current devices and players in the market, explore the current technology employed to build these devices, and discuss the challenges to enable future technologies in this exciting area. 

Biography:  Brian J. Toleno, Ph.D. is currently a Principal Material Scientist at Microsoft working on mixed reality devices, in Mountain View, California.  In this role Brian works with the design teams in evaluating and selecting materials for use in these next generation devices.  Prior to this role Brian was the Director of Global Product Management for Henkel Electronic Materials, LLC in Irvine, California where he managed the underfill and encapsulant business. Brian obtained a Ph.D. in analytical chemistry from Penn State University, and his B.S. in chemistry from Ursinus College.  Brian is an active member of and is also a frequent speaker and contributor to SMTA. Brian has written courses on underfill materials, Pb-free soldering, and failure analysis., and two chapters for electronic engineering handbooks on adhesives and materials.
 
 
iPhone X Teardown – Advanced Packaging
A Review
Speaker: Dr. Bill Cardoso, CEO, Creative Electron
 
Abstract: It has been 10 years since Steve Jobs introduced the iPhone to the world. Much has happened since then. Over this past decade, the iPhone became a reference design, and the object of desire of a legion of fans who wait anxiously for every launch of the company. The most advanced iPhone in the market today, the iPhone X has double stacked boards, dual battery, and a face recognition sensor bringing the phone to a whole different level.
The presentation will explore these technological advances by a live teardown of the iPhone X. The teardown will be followed by a detailed coverage of the technical details of critical parts of the device. This live teardown will be accompanied by x-ray and CT images of the phone, so the audience will get unprecedented insights on what makes the phone tick. The assembly process utilized to put the product together will be explored. This presentation is targeted at an audience looking for a better understanding on how advanced consumer electronics are designed and assembled.
 
 
Biography: Bill Cardoso started his first company at 17 in Brazil. He later worked at the Fermi National Accelerator Laboratory (Fermilab) for 10 years, then started his X-ray manufacturer systems company in the US where he leads a team of engineers who design and manufacture the systems. He has BS, MS, and PhD in Electrical and Computer Engineering and a MBA from University of Chicago. He is a recipient of the Outstanding Alumnus Award from IIT, and sits on the technical committees of SMTAI, SMTA Counterfeit Conference, and SMTA LED Conference, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium. Bill has written two books and over 150 technical publications.
 
 
Flexible Hybrid Electronics: I’ve Got Some Good News and I’ve Got Some Bad News
A Review
Speaker: Andy Behr, Technology Manager, Panasonic Electronics Materials Division.
 
Abstract: Flexible Hybrid Electronics (FHE) have garnered a significant amount of attention recently. While there’s ample hype, there’s also a degree of perplexity regarding the current state of technology and it’s future potential. For example: What exactly constitutes an FHE device? Where is it used (a.k.a. what’s the “killer app?) And, of specific interest to SMTA members, how are they assembled (profitably) in high volume? This presentation tackles both the opportunities and challenges of the emerging FHE field by exploring market drivers and technology developments with emphasis on addressing constraints to high volume manufacturing (HVM). 

Biography:  Andy Behr is a Technology Manager with Panasonic Electronic Materials Division. He leads a research and marketing team based in Silicon Valley that that develops leading-edge materials for electronics and other emerging applications. A significant portion of his role is technology and business scouting which involves “triangulating” strategic level market demands, business drivers and technology advancements to direct enabling materials development. Andy holds a bachelor degree in biology and a master’s degree in business. He has more than twenty-five years of experience in material technologies such as photo resists, adhesives, encapsulants, conductive materials, fluoro-chemicals, abrasives, films and tapes. Andy began his career in research and has subsequently held positions in marketing and leadership.
 


May 24

eSmart Factory Conference   +

Location
Plug and Play Tech Center
Sunnyvale , CA 94085


eSmart Factory conference will be held on May 24, 2018 at the Plug 'n Play Tech Center in Sunnyvale, CA, USA.

Software Systems & Process • Robotics & Cobots • 3D Printing & Additive Manufacturing

Call for Participation

You are invited to share your research at the conference. Abstracts are due in February of 2018. Presentations will be due in April.

Upload an Abstract.

Strategically located and easily accessible from most of the major intersections, Plug and Play Tech Center in Sunnyvale serves as the model on which our outstanding brand and reputation has been built.


May 31

Tampa Bay Chapter: SMTA Membership Drive and Appreciation Night- May 31st  +

Location
Threshers Ball Park- Spectrum Field- Clearwater, FL



Come join us for a Membership Drive and Appreciation Night at Spectrum Field in Clearwater on May 31st to watch the Threshers take on the Fort Myers Miracle.   All non-members attending will receive a ticket when they register at the meeting. From those tickets we will pull one and the non-member holder of that ticket will be given an SMTA Membership free of charge.

 



Image result for clearwater threshers logo


  Tim O'Neill (see biography here) from AIM solder will be giving his paper on the following topic:
 The choices for solder alloys is expanding rapidly as new application requirements materialize revealing the limitations of existing lead-free alloys.  In this presentation attendees will gain a better understanding of the evolution of lead free solder alloys, the limitations of today’s common alloys and what the solder industry is offering as next generation materials. 

The meeting will begin promptly at 5:45 pm, the game starts at 7pm.

Price for event is $25.  This includes tech session, food, drink, and adult beverages as well as ticket to the Clearwater Threshers vs Fort Myers Miracle game from a sky box.

We hope to see you all on May 31st!




 


June 5 - 7

International Conference for Electronics Enabling Technologies 2018  +

Location
Edward Village Markham
Markham , ON L3R 0A3 Canada


The International Conference for Electronics Enabling Technologies (ICEET), formerly ICSR, is a highly technical three-day event in Toronto, ON, Canada.

Electronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.

The forerunner conference of ICEET, the International Conference for Solder and Reliability (ICSR), grew to be a premier technical conference for all aspects of solders, metallurgy and the solder interconnect process, through the period of conversion to lead-free solder, driven by RoHS and WEEE. The ICEET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, potting and other methods to achieve high reliability in aggressive environments.


June 6

SMTA Ontario Chapter Expo & Tech Forum  +

In conjunction with the International Conference for Electronics Enabling Technologies (ICEET)

Location: Edward Village Markham
50 East Valhalla Drive
Markham, ON L3R 0A3


Exhibitors

Exhibit Hours:
Wednesday, June 6, 2018: 10:00am – 3:30pm

 

  • Sponsorship Opportunities:
  • Lanyard Sponsor $400/$800
  • Bag Sponsor - $400/$800
  • Lunch Sponsor - $800
  • Refreshment Break Sponsor - $550

 



Attendees

Register here to attend the expo only!
Technical conference and workshops not included.

Plan now to join us for free technical presentations, free lunch and the chance to network with leading suppliers to our industry!
ICEET Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.

Exhibit Hours:
Wednesday, June 6, 2018: 10:00am – 3:30pm

 

Expo attendees are invited to attend the following sessions: 

Session 3: Reliability

11:00am The Relative World of Harsh Environments
Mike Konrad, Aqueous Technologies

11:30am Designing PCBs for High Reliability Applications
Kathy Nargi-Toth, Eltek USA

12:00pm Laser Projectors Field Reliability Dashboard an Effective Tool to Evaluate, Monitor and Improve Product Reliability
Monika Wieder, Christie Digital

Lunch
12:30pm Lunch (Truffle Ballroom)

Keynote
2:00pm The Automated and Digital Factory - Navigating Technology Disruption
Shawn Blakney, Celestica, Inc.

If you'd like to attend other sessions, paid conference registration is required.

 

Thank You to our Sponsor:



June 14 & 15

SMTA Webtorial: SMT Process Fundamentals for Tin-Lead and Lead Free Assembly   +


Two (2) 90 minute Sessions
June 14 and 15, 2018
1:00pm to 2:30pm Eastern
Presented by:  S. Manian Ramkumar, Ph.D., Center for Electronics Manufacturing and Assembly

Rochester Institute of Technology

Overview:
This course will provide an introductory but hollistic understanding of the surface mount and mixed technology assembly processes for lead based and lead free electronics packaging. Topics include PCBs, assembly types, component types, assembly process, assembly materials, identification of defects, troubleshooting and process control. Design for ease of manufacture and assembly will be discussed throughout the lecture. Tradeoff decisions between different materials and equipment types will also be highlighted. A comparison of lead based and lead free process will be provided, including implementation issues.

Who Should Attend:
Who should attend?
♦ People with very little or no background in SMT
♦ Process, Design, Test and Quality Engineers
♦ Process and Quality Technicians
♦ Operators
♦ Marketing, Sales and Purchasing Staff
♦ Managers


After completing this course, you will be able to:
1. Identify various SMT components, their terminology and nomenclature
2. Understand what a PCB is and also the need for effective thermal management
3. Identify types of mixed technology PCB assemblies and their assembly sequence
4. Understand the influence of design on the ease of manufacturing and assembly
5. Understand thoroughly the entire assembly process and the various parameters that influence it.
6. Understand the influence of various materials such as solder paste, adhesives, flux, etc.
7. Detect assembly process defects and troubleshoot them.
8. Evaluate equipment required for setting up assembly lines
9. Understand Lead Free Implementation and Issues.


June 19

Intermountain (ID, UT) Chapter: 13th Annual Utah SMTA Golf Scramble for 2018  +

Location
Birch Creek Golf Course, Smithfield, Utah



SMTA Golf Scramble
What: 13th Annual SMTA Golf Scramble 2018
When: June 19th, Tee Time 8:00 AM Shotgun Start with lunch following
Where: Birch Creek Golf Course, Smithfield Utah


We would like to have all Team and Individual sign-ups done by Tuesday June 12th.
Team and Hole Sponsor sign-ups also due at that time.
If you need a sponsor sign made please send a graphics file of your company logo.


Costs: Team sponsor $375. Includes Golf and Lunch for 4 players, and Team Sponsor Sign Hole sponsors: $175. Includes Golf and Lunch for 1 player, and Hole Sponsor Sign. Prize Hole sponsors for Long Drive (Men and Women), Closest to the Hole (Men and Women), and Straightest Drive. Please Provide Prizes for these special holes.
Mulligans: $10 each, Can Purchase Before or At the event.
Individuals are Welcome!! We will sign you up to a team. Fee is just $75.
This includes Green fees, cart, and lunch.


Please Join us! Contacts to RSVP and for Sponsorships:
Gordan Jackman at 435-227-9659 e-mail gordan@campbellsci.com or Robert Winter at 801- 594-7435 e-mail rwinter@q.com

Contact for details about course, map: Birch Creek Golf, Smithfield, Utah 435-563-6825 www.birchcreekgolf.com

 


June 20

Free SMTA Webinar: Consider the options-How should I mask for Conformal Coating?  +


June 20, 2018
1:00pm-2:00pm Eastern
Presented by: Bob Wetterman, MIT, BEST Inc.

Complimentary Webinar for Members!

There are numerous masking options available when conformal coating a PCB. The question is: which one should I chose? The answer lies in optimizing a variety of variables including the time it takes, the economics of the build, the material compatibility and the process of coating being employed.

There are several masking options available to process engineers and technicians when it comes to masking of the PCB prior to conformal coating:

  • Silicone rubber boots
  • 3D printed boots
  • Masking tape
  • Custom tape dots
  • Custom cut tape shapes
  • Peelable mask

In addition to comparing and contrasting these various options this “lunch and learn” webinar will address the various considerations a process engineer or technician would have to make when it comes to choosing the best conformal coating masking alternative. One of the considerations is the amount of labor content in the masking technique. The labor content will drive the lead time and cost included to mask and damask the conformal coating keep out areas. Another consideration is material compatibility. Does natural silicone have any impact on the laminate being used? Is the viscosity of the conformal coating material as it is applied allow it to leach underneath the mask? Does the adhesive on the tape leave behind a residue that will be harmful to the long term reliability of the assembly? Another issue is one of process compatibility. Certain masking techniques work with certain conformal coat application methods and others do not. These and other questions will be considered in this lunch time session.

This FREE 60-minute webinar reviews the reasons for masking, the types of masking methods, the “gotchas” in masking for conformal coating and the compatibility with different application methods.

The webinar will be sprinkled with practical application tips to help guide you towards the right masking process for a variety of conformal coating work ahead of you.

 

About the Presenter:Bob Wetterman
Bob Wetterman is the principal at BEST Inc. a rework/repair services company in Chicago, IL.  BEST Inc. is a contract rework/repair services provider, solder training and certification center as well as manufacturing a variety of rework/repair/assembly tools such as stencils and reballing preforms. Bob is a BSEE from the University of Illinois and holds several patents in the fields of surface science, industrial controls and PCB rework. He is also a master instructor of IPC-A-610 and is a member of SMTA having been active in several Midwest chapters.


June 26

Huntsville Chapter: Reminder to RSVP - June 2018 Meeting Electrochemical migration (ECM)  +

Adtran



The Huntsville Chapter SMTA and Adtran welcome you on June 26, 2018 from 5:30-7:30pm to bring a discussion of Electro-chemical migration (ECM) and dendritic growth.
 
Abstract:
Electrochemical migration (ECM), and dendritic growth are becoming more of an issue as electronic assemblies decrease in size while increasing in complexity.  While the terms “ECM” and “dendritic growth” are known to many in the industry, the explanation behind them is generally lacking in depth.  This presentation will focus on the fundamentals of the ECM and dendritic growth process, and will apply both chemistry and electrical engineering principles to the phenomenon.  Understanding these processes better allows one to design and manufacture electronic assemblies that are more robust and reliable.
 
 
Speaker Info:  David Lober
Education: Bachelor of Chemistry from Rensselaer Polytechnic Institute 2009 Troy, NY
Job Title: Process Chemist
Length of time at Kyzen: 8
 
David Lober holds a Bachelor of Chemistry from Rensselaer Polytechnic Institute in Troy, Ny (2009).  He has been the Process Chemist at Kyzen for 8 years.  In his position he does research and development work relating to assessing cleanliness, reliability, corrosion, and chemical analysis primarily in the electronics segment, but some semiconductor work.  He has published over 10 papers on these topics, and has several patents in the area of critical cleaning.  He is an active member of the IPC and chairs the 5-32c Bare Boards Cleanliness Assessment Task Group, is the vice chair of the 5-32a Ionic Cleanliness Assessment Task Group, and has been involved with the 5-33a ROSE Task Group which has completely revised the Cleanliness Section (Section 8) of JSTD-001 which is currently under ballot.  He also is an active participant in several other IPC committees. 
 
Agenda:
5:30 – 6:00 networking
6:00 – 6:30 dinner
6:30 – 7:15 intro & presentation
7:15 – 7:30 wrap-up

 
Location: Adtran, 901 Explorer Blvd, Huntsville, Al
Lakeland CR on the 2nd floor of the East Tower (Mark C. Smith Conference Center).
All meeting attendees must enter through the South entrance (adjacent to shipping dock).
 http://www.smta.org/chapters/files/Adtran_Map.docx
Directions From I565:
  • Take exit 14B to Al-255N/Research Park Blvd
  • Take exit Bradford Drive West
  • Turn left Explorer Blvd (heading south)
  • Turn right into parking lot, merge left and follow parking lot to pond
  • Building entrance will be on north of parking lot
Dinner : Boxed lunches from Apple Lane Farms and drinks will be available.
$5 for SMTA Members who RSVP by Thursday June 21, 2018
$7 for SMTA Members who Do Not RSVP by Thursday June 21, 2018
$10 Non-Members who RSVP by Thursday June 21, 2018
$12 Non-Members who Do Not RSVP by Thursday June 21, 2018
 
For members who cannot attend in person, we would like to offer a GoToMeeting option. Please contact us at HSVSMTA@gmail.com

Two ways to RSVP:


June 26 - 27

Symposium on Counterfeit Parts and Materials-Tabletop Exhibition  +

Location: College Park Marriott Hotel and Conference Center
3501 University Blvd East
Hyattsville, MD 20783



Exhibitors

Sponsorship Opportunities:

**All Sponsorships require an exhibit booth reservation**

Lanyard Sponsor (Limit 1) -$400 (if provided by company/$800 if provided by SMTA) SOLD!
Provide 150 lanyards and they will be the official lanyard for the conference. If you would like us to provide the lanyards, it will be an extra $400. You will receive logo recognition in the show directory, conference website and signage.

Tote Bag Sponsorship (Limit 1)-$400 (if provided by company/$800 if provided by SMTA) SOLD!
Provide your logo on all of the conference attendee bags! If you would like SMTA to provide the tote bags, it will be an extra $400. There will also be recognition in the show directory and website.

Lunch Sponsorship Day 1 or Day 2 (Limit 2)-$500
Signage upon entrance to exhibit hall lunch and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

Refreshment Sponsorship Day 1 or Day 2 (Limit 2)-$350 SOLD!
Signage during PM refreshment breaks upon entrance to exhibit hall and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.

 

 

Exhibitor Information:

Contact Jenny Ng for available booth space. 952-920-7682 or jenny@smta.org Please note that exhibit traffic will be minimal while symposium is in session.


Click here to view floor plan.

Exhibit space entitles you to:

 

  • 6 ft. Draped table
  • One conference pass
  • Attendee list
  • Breakfast, Lunch & Breaks
  • One copy of the conference proceedings
  • Download a hard copy of the registration form

    Cost to exhibit:
    Rates increase $100 after May 31, 2018
    Booth type CALCE/SMTA Members Non-Members
    One table
    includes access to Electrical Outlet
    $550 $650
    One table
    no access to Electrical Outlet
    $500 $600

     

 



Attendees

Exhibit Attendees: 

Come and visit the exhibits for FREE! Plan to network with leading suppliers working to stop the proliferation of counterfeit parts in the electronics supply chain.

Show Hours Each Day: 10:00am - 3:00pm

Your expo pass gives you access to:

  • FREE Panel Discussion "How is AS6171 Being Flowed Down? Challenges with AS671 Accreditation--Can it Handle Obsolete Parts?" (Tuesday, June 26 @12:00pm)
  • FREE Lunch
  • FREE Refreshment Breaks


    If you would like to attend other conference sessions, please register for the conference here.

Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.


June 26 - 28

Symposium on Counterfeit Parts and Materials 2018  +

Location
College Park Marriott Hotel & Conference Center
College Park , MD


Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

 

Technical Program Announced!

Technical session topics include:

  • What is being Counterfeited - Within and Beyond electronics?
  • Are the Standards Adequate to Protect You?
  • Panel Discussion - Challenges with AS671 Accreditation--Can it Handle Obsolete Parts?
  • Technological Solutions: Tagging, Tracing, Authenticating
  • How the US Government Agencies are Reacting
  • How to Detect Counterfeit Parts with Confidence
  • Bringing Information Security in the Solution Space
  • Impacts on Industry and Society

View the program
 



The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.


July 12

Ohio Expo & Tech Forum  +

Location: Embassy Suites Cleveland Rockside
5800 Rockside Woods Boulevard
Independence (Cleveland), OH 44131


Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early registration pricing ends on June 21st, 2018!
Important Exhibitor Materials:

 



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Thursday, July 12, 2018
9:00AM-2:30PM

Free Technical Program & Schedule:

 

Thank you to our Breakfast Sponsor:

 

8:00AM

Registration Opens

 

Thank you to our Coffee Sponsor:

 

Thank you to our Technical Session Sponsor:

 

9:00AM

Material Management 4.0

Speaker: Bill Cardoso, Ph.D., Creative Electron, Inc.

In this presentation, we’ll introduce Material Management 4.0. More than a set communication protocol between machines that count electronic parts and the machines that store them. From x-ray parts counters to fully automated and intelligent storage towers, Material Management 4.0 embraces the overall infrastructure that needs to be in place to realize an accurate, fast, and efficient methodology for inventory control. This investment is critical to realize the benefits in efficiency unleashed by Industry 4.0.   

 

9:00AM

Expo Hall Opens

 

Thank you to our Lunch Sponsor:

 

11:30AM

Complimentary Lunch

 

2:30PM

Printing in the Third Dimension

Speaker: Charles Bauer, Ph.D., TechLead Corporation

Excitement around 3D printing continues full speed ahead whether in electronics, consumer goods or industrial systems. Understanding the capabilities, limitations and most importantly the complexities of 3d printing remains challenging despite significant progress in both equipment and materials. While not a comprehensive tutorial on 3D printing, this presentation introduces the application of 3D printing in electronics prototyping and manufacturing including;

1.             Types of 3d printing

2.             Design tools for 3d printed products

3.             Materials selection (availability and alternatives)

4.             Equipment choices

5.             Process capabilities and constraints

 

2:30PM

Expo Hall Closes


July 16

Webinar: Solder Ball Elimination – In Wave, Selective & Reflow  +


Bob WillisJuly 16 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Solder balls and solder beading have been a process issue for many years and they may not cause product failure or quality problems but they are not desirable. Solder balls are caused by a variety of factors in different processes and should be resolved to eliminate a poorly defined process or a process and materials which are out of control. With over 40 years in industry and 30 solving process problems for industry, Bob Willis explains the causes and cures for solder balls.

This webinar features many unique process video clips on testing and failures providing a much better understanding of the root cause of failure and corrective action.

Topics include:

What are solder beads & balls?
What causes these defects?
Why does PCB design & specification matter?
Solder process & materials
Tin/lead v Lead-Free
Solder ball & bead formation
Causes/cures for random & designer balls
Inspection criteria

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here


July 17 - 19

SMT Processes Certification (ACCURATE TECHNOLOGIES INC.)  +

Location
ACCURATE TECHNOLOGIES INC
Novi , MI


Held at ACCURATE TECHNOLOGIES INC.

26999 Meadowbrook Road

Novi, Michigan 48377

  • July 17 Course (8:30-5pm)
  • July 18 ½ day of course + exam
  • July 19 All day exam (8:30-5pm)
  • Instruction: English
  • Test: English

Instructor: Jim Hall, ITM Consulting

Reduced In-House Rate: $915 for members or $970 for non-members.

Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes.

Why You Should Participate
Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.

  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience
  • The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


July 19

Rocky Mountain (Colorado) Chapter: Business After Hours at Photo Stencil  +

Location
16080 Table Mountain Parkway, Suite 100, Golden, CO 80403



SAVE THE DATE!
The SMTA Rocky Mountain Chapter
After Hours Meet & Greet Event on July 19, 2018
Hosted by:
Join us for an SMTA After Hours Meet & Greet event at Photo Stencil. See the new factory in Golden and learn about today's stencil technology and SMT printing challenges.


Established in 1979, Photo Stencil specializes in the design and manufacture of high performance stencils and tools. Photo Stencil services the following markets:
- Semiconductor
- SMT
- Defense
- Medical Devices
- Automotive

Our host for the event is Ms. Susan Holmes. Ms. Holmes has worked in the SMT stencil industry for over 30 years. During her tenure, she has experienced a number of changes and challenges in the industry - from solder paste and fluxes to special materials and adhesives. There continues to be an increased demand to print through smaller and smaller apertures onto multi-level surfaces, substrates or around densely populated components. Ms. Holmes' short presentation will look closer at these challenges as they relate to stencil pringint applications. She will also briefly touch on advancements made with nano coating technology.

Meeting Details:
Where: Photo Stencil
When: July 19, 2018
Time: 3:00 - 6:00 PM
Registration Fee: FREE for all SMTA members
Address: 16080 Table Mountain Pkwy
Golden, CO 80403
Questions: Contact Patty Chonis at 970-443-9233

Beer, wine and appetizers will be provided.

Interested in sponsoring an event? Contact Patty Chonis at patty@atekllc.com or 970-443-9233 for a listing of available opportunites.



July 19

Western Pennsylvania (Pittsburgh) Chapter: 2018 SMTA West Penn Membership Appreciation Golf Outing  +

Location
Norvelt Golf Club



THis event is cancelled.  Please look for announcements for other events soon.

2018 West Penn Chapter
SMTA Member Appreciation Golf Outing
Thursday, July 19, 2018

Norvelt Country Club
 168 Holly Pl, Mt Pleasant, PA 15666

(724) 423-5400
https://www.norveltgolfclub.com/

Location right off I-70 near PA turnpike New Stanton Exit.  

The SMTA West Penn Chapter is excited to invite you to participate in our membership appreciation golf outing.   Golf format is a four person scramble with prizes and other give aways.  Skins challenge $5.00 per player 

Event is no cost to SMTA members and sponsors.  Guest golfers and non-members are $50.  Included are green fees, golf cart, practice greens, lunch vouchers, and buffet dinner follwing the round of golf.

Please join us for a fun day of networking with fellow SMTA members and sponsors and an exicting round of golf!
 
You may come with your own four-some or we will team you up.   Each person needs to register seperately though.   

Registration Deadline July 10, 2018 - Register at:
https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4501

 
Not an SMTA Member?  No problem!  You may join now or at the event!!!  Cost $95.00 a year!
Visit www.smta.org to join!

Event Schedule
 
Check In:  10:00 AM - we will give you your team, starting hole, and lunch vouchers.  Let us know at check in if you already have a team foursome.
Shotgun Start:  11:30 AM
Lunch:  Use vouchers whenever you would like throughout the round
Buffet Dinner:  Approximately 4:30 PM


Complimentary Practice Greens are open all morning
 
Skins challenge $5.00 per person for all players
 
Questions regarding the event?  Contact Shane Proud at:  sproud@pennatronics.com        
Interesting in sponsoring a hole for $150?  Contact Jason Emes at:  jasone@newpig.com  

Thank you from West Penn Chapter and we hope to see you there!

 




August 9

Mexico - Guadalajara Chapter: REGISTRO! SMTA Tijuana Foro Tecnico y Expo  +

Location
Real Inn Tijuana, Paseo de los Héroes 9902, Zona Urbana Rio Tijuana.



Acompañanos a este gran evento, la entrada es gratuita, solo es necesario registrarse en la siguiente liga y tendras acceso a conferencias de alto nivel y a la zona de expo en donde encontraras a los proveedores mas importantes de la Industria Electronica.

¡ REGÍSTRATE AQUÍ !
 
Join us for this great event, the admission is free, you only need to register in the following link and you will have access to high level conferences and the expo area where you will find the most important suppliers of the Electronics Industry.

 REGISTER HERE !
 
Tarifa convenio con el hotel Real Inn Tijuana:
 
Habitacion Tarifa Convenio (MXN)
Hab. de Lujo $1450
Hab. Sencilla con Desayuno Buffet $1610
Hab. Doble con Desayuno Buffet $1770
Hab. Ejecutiva $2000

Referencia: SMTA
Habitaciones sujetas a espacio y disponibilidad
Tarifa no incluye impuestos
Internet incluido

 
Si estas interesado en reservar una mesa para la zona de expo favor de contactar a:
If you are interested on a table top, please contact:
Jaime Arreola
+52 1 (33) 3157 0636
jaime.arreola@pemtron.com
Secretary SMTA Guadalajara



August 14 - 15

South East Asia Technical Training Conference on Electronics Assembly Technologies 2018 (Rescheduled Dates)  +

Location
Eastin Hotel Penang
Penang Malaysia


The South East Asia Technical Conference on Electronics Assembly is a highly technical event that is focused on today's most important and timely issues. The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

The conference is "claimable from HRDF under SBL scheme."

 

View the Technical Program Here!

 

Keynote Speaker

Recent Advances in Flip Chip, WLCSP, and FOWLP

John H. LauWednesday, August 15th
John H. Lau, Ph.D., ASM Pacific Technology

Recent advances in (1) flip chip such as wafer bumping, package substrate, assembly, and underfill, (2) fan-in WLCSP (wafer-level chip scale package) such as relaxation layer and under-bump metallurgy (UBM)-free WLCSP, and (3) FOWLP (fan-out wafer-level packaging) such as chip-first with die face-down, chip-first with die face-up, and chip-last or redistribution layer (RDL)-first will be presented in this study. Emphasis is placed on the latest developments of these technologies in the past few years. Their future trends will also be discussed.

 


Professional Development Courses

 

Flip Chip, WLCSP, and FOWLP Assembly and Reliability
Tuesday, August 14
John Lau, Ph.D. Sr. Technical Advisor, ASM

The major trend in the electronic industry today is to make products such as smartphones, tablets, wearables, internet of things, etc. more personal by making them smarter, lighter, smaller, thinner, shorter, and faster, while at the same time making them more friendly, functional, powerful, reliable, robust, innovative, creative, and less expensive. As the trend towards miniature and compact products continues, the introduction of cool products that are more user-friendly and contain a wider variety of functions will provide growth in the market. Some of the key technologies that are helping to make these cool product design goals possible are flip chip, WLCSP (wafer-level chip scale package), and FOWLP (fan-out wafer-level packaging). Their PCB (printed circuit board) assembly and solder joint reliability will be presented and discussed in this lecture.

 

Understanding Parameters Affecting Barrel Fill in Wave Soldering Process
Wednesday, August 15
AF Ng, Consultant, Techment Consultancy Sdn Bhd

AF Ng

Conventional Wave Soldering has been employed for soldering of boards since long time ago. The related manufacturing personnel are well aware of common encumbering defects happen erratically with this process. Some of these defects encountered daily are bridging, solder skips, solder voids and insufficient barrel fill or hole-fill. Many of us would agree that we are still facing challenges on one of the common defects – poor barrel fill. The problem is confounded with currently High density/Multilayer thick PCB and applying Lead-free soldering. It is important for the Engineering personnel to understand the root causes of the defect, as it can be contributed by factors from board design, material procurement to equipment setting and maintenance. With these numerous factors implicating, the engineers involved must be equipped with sufficient knowledge on soldering fundamentals, laminate composition, thermal demands, design geometry, wetting mechanism during wave contact and equipment maintenance. Commonly, many engineers just adopt recommendations based on DOE results and hoping to get consistent good barrel fill, but mostly to their disappointment due to erratic parameter shift. Many engineers approach the problem by tweaking process parameters on fluxing, preheating, solder pot temperature, wave height adjustment and others, it merely be just a containment and not able to achieve consistent good barrel fill. We need a practical approach in tackling this vexing problem. To do that, one needs to know the fundamentals of wettability involving molten solder. The molten solder wicks up the barrel depend critically on the surface tensions of molten solder in relation to the solder interface with component terminals and copper plated holes. Upon discovering of the root causes, then, appropriate engineering solutions are to be implemented, be it equipment upgrade, board re-design, process adjustment or material changes. The course aims to provide a concise description of these factors through simplified notes, shared experiences and interaction in class.

 



Why Should You Attend:

  • There will be adequate time to have our industry experts respond to your questions
  • Networking time will allow you to continue discussions following the presentations
  • This is one of the best ways to enhance your knowledge and your company's profitability
  • Extensive participation from experts from around the world provides for a comprehensive educational experience
  • The SMTA reputation ensures high quality technical information that can be put to use immediately

 


August 15

San Diego Chapter: 08-15-18 Material Management 4.0  +

Location
NEOTech, 237 Via Vera Cruz, San Marcos, CA 92078 (760) 737-6777



Bill CardosoCEOCreative Electron

Over the past years the electronic assembly industry has focused on the development of Industry 4.0, a standard communication protocol that allows production equipment to dialogue. This communication protocol will be a key enabler to improve the quality and efficiency of the production line. This is achieved by creating a feedback loop between inspection and production – thus allowing problems to be identified and corrected as early as possible in the manufacturing line. As a result, the overall cost of manufacturing is reduced as yield rates increase.

Despite the great progress in the development of the integrated production line, a critical part of the manufacturing chain remains offline. Inventory rooms around the world still must operate with a far reduced level of sophisticated. It is not uncommon to find thousands of reels densely packed in hundreds of linear feet of shelving space. The simple exercise of counting back reels as they come back from the production floor is not standard practice. And even when they are counted, the count is often made by hand. The lack of focus on the automation of our inventory rooms leads to an increasing loss of productivity due to line stoppages. When associated with the recent increase in lead times for electronic components, line stoppage has become a crippling problem that makes inventory accuracy a necessity.

In this presentation, we’ll see that material management is more than a set communication protocols between machines that count electronic parts and the machines that store them. From x-ray parts counters to fully automated and intelligent storage towers, material management 4.0 embraces the overall infrastructure that needs to be in place to realize an accurate, fast, and efficient methodology for inventory control. This investment is critical to realize the benefits unleashed by Industry 4.0.

Speaker:
Bill Cardoso started his first company in Brazil at age 17 and sold it a few years later when invited by the US Department of Energy to work at Fermi National Accelerator Laboratory to do nuclear and high energy physics research. As the Department Head for Systems Engineering, after a 10-year long career at Fermilab, Bill moved from Chicago to sunny California to start CreBill Cardosoative Electron. True to the American Dream, Creative Electron quickly grew from Bill's garage to the largest US manufacturer of x-ray machines for the electronics industry (no longer in his garage). At Creative Electron Bill leads the team of engineers who design and manufacture x-ray systems that are shipped worldwide. Starting with an associate’s degree at age 13, Bill has a BS, MS, and PhD degrees in Electrical and Computer Engineering and an MBA from The University of Chicago. Bill, past President and current Chair of Publicity for the SMTA San Diego Chapter, is a member of the technical committees for SMTA International, SMTA Counterfeit Conference,  SMTA LED Conference, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium. He is an IEEE Senior member and the author of over 150 technical publications, author of 2 books, owner of a few patents, and a frequent speaker at technical conferences.

RSVP by: 08/14/18, Linksmta.org/chapters/rsvp.cfm?BEE_ID=4416
Members Free, Non-Members $5 (Cash or Check)
Registration: 5:30PM
Dinner: 5:45PM-6:45PM
Presentation: 6:45PM
NEOtech Facility Tour: 7:30PM
Location: 
NEOTech, 237 Via Vera Cruz, San Marcos, CA 92078 (760) 737-6777




August 20

Webinar: PCB Design, Fabrication and Use from an End User's Perspective  +


August 20 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenters:
Charles Cawthorne, MBDA Systems
Ian Fox, Rolls Royce

Overview

Printed Circuit Bare Boards form the fundamental and crucial basis for most Circuit Card Assemblies. However, with the advanced electronics components that are available today, PCBs have to be complex to provide the interconnect for these component types. Given this background, what is the best approach to acquire PCBs that will work and will provide long term reliability?

This webinar, which follows on from the "Guide to Printed Circuit Board Manufacture" from March 2017, gives a more advanced insight into the Design, Test, Qualification, Inspection and Handling of PCBs from a purely high reliability end users perspective. The webinar is aimed at design/manufacturing/process engineers, technicians and trainers.

Topics include:

Definition of PCB Materials
Surface Mount Design Rules
PTH Design
Micro-via Design
Via Planarisation and Via Protection
Controlled Impedance
Surface Finishes
PCB Test
PCB Qualification
Incoming Inspection and Quality Standards
Handling of PCBs from a Drying Perspective

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here


August 20 - 22

SMT Processes Certification (PRIDE Industries)  +

Location
PRIDE Industries Foundation
Roseville , CA


Held at PRIDE Industries Foundation

10030 Foothills Blvd.
Roseville, CA 95747

  • August 20 Course (8:30-5pm)
  • August 21 ½ day of course + exam
  • August 22 All day exam (8:30-5pm)
  • Instruction: English
  • Test: English

Instructor: Jim Hall, ITM Consulting

Reduced In-House Rate: $915 for members or $970 for non-members.

Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes.

Why You Should Participate
Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.

  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience
  • The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


August 27 - 30

SMTA China South Technology and Vendor Conferences 2018   +

Location
Shenzhen Convention & Exhibition Center
Shenzhen China


SMTA China South
27-30 August 2018
Shenzhen Convention & Exhibition Center, Shenzhen, PR China

The SMTA China cordially invites you to participate in SMTA China South Conference located in Shenzhen 2018. This event, held in conjunction with NEPCON China 2018, will as usual address the industry's most pressing issues in electronics assembly/ manufacturing, industry/technology roadmap, business focus, advanced packaging, practical skill development, emerging technologies, and lead-free & reliability.


August 28

Wisconsin Chapter: Wisconsin Chapter - Golf Scramble  +

Location
Brown Deer Golf Course: 7625 N Range Line Rd, Glendale, WI 53209



Please RSVP before making Payment!
Click HERE to RSVP Now!!


When:
  • Tuesday August 28, 2018 at 8:00 am

Where:
  • Brown Deer Golf Course: 7625 N Range Line Rd, Glendale, WI 53209
  • Description: “Brown Deer Golf Course is a classically designed 18 hole facility with bent grass fairways, tees and greens that has hosted an annual PGA tour event,  USGA national championships and now hosts an LPGA Symetra Tour event, the PHC Classic.  You can always expect the course conditions to reflect those high standards.  The golf courses unique and individual holes are carved out masterfully with a river running throughout the entire course. The course was originally designed by George Hansen and founded in 1929 and was partially redesigned by Andy North and Roger Packard. Brown Deer is truly a must play for any golf lover!
 
Price:
  • $40 SMTA Members and $60 for non-SMTA Members
 
Format:
  • Scramble: Teams of 4. Each players drive will need to be used at least once. Any threesomes will have option for 1 player to tee off twice. 2 putt maximum to keep up rate of play.
  • First Place prize
  • 1 Mens and 1 Womens longest drive, closest to the pin, and one longest put.
  • 72 Spots available: Please confirm through Josh Casper (jcasper@horizonsales.com) or Jana Esselman (jesselmann@identco.com) if you have a team and you would like to play together. All other teams will be put together by SMTA Staff.

Food and Drink:
  • Each player will be provided with 2 complimentary drink tickets.
  • Coffee and Donuts provided upon arrival.
  • Complimentary Lunch following the Scramble-Vendor Sponsorships:
 




September 7

Dallas Chapter: Industry 4.0, Application of Industrial IOT in PCBA  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



Back to the Future

Industry 4.0, Application of Industrial IOT in PCBA assembly

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on September 7, 2018
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

10% Early-bird Discount for paying on-line before 5:00pm on February 7th!

Get your tickets!

Abstract

To fully realize the productivity and quality benefits of an automated factory, the operational ecosystem must be governed by a reactive, decision-making framework. Visibility and insight from the entire end to end process is required to enable real-time operational intelligence to proactively avoid the generation of product defects or machine downtime.

Many machine learning methods can be used to develop analytic models to enable predictive or prescriptive direction to the manufacturing line. To positively impact manufacturing key operating indices in real-time, an industrial IOT is required as the foundation for the analytics framework, connecting traditionally isolated machines and processes. One common business application for this IOT analytics solution is the predictive modeling of SMT defects. Key topics to be presented are as follows:

  • Building blocks for an industrial IOT SMT line
  • Acquisition of real-time machine and process data
  • Use of advanced analytics to predict product defects
  • Implementation of action through real-time machine to machine feedback

Biography

Rafael Gomez is Director of Product Strategy for a newly launched startup company named Autolabs.ai, focused on providing full stack Industry 4.0 solutions. Autolabs is a Flextronics sponsored venture, inaugurated in 2018 with 300 employees based in Americas, Europe and Asia. Before Autolabs, Rafael has previously worked at Intel, Xetel and Flextronics. Throughout his 20 years in the PCBA industry, Rafael has been focused on software and hardware applications development related to SMT and Post-SMT PCBA processes.

Rafael graduated with a Mechanical Engineering degree from Texas A&M Class of 1995. In his spare time, he enjoys traveling with his family, performing with his rock band, and trying to avoid injuries on the soccer field, golf course and tennis court.






September 12

Connecticut Chapter: 2018 SMTA New England Expo and Tech Forum  +

DCU Center, 50 Foster St., Worcester, MA 01608



COMPLEMENTARY ADMISSION and LUNCH INCLUDED!
Don't Miss Out!  Register Now!!



 

 

Free Technical Program & Schedule:

 

7:30AM

Registration Opens

 

8:30AM-9:15AM

"Nanotechnology for Advanced Electronics Packaging"

Speaker: Charles E. Bauer, Ph.D., and Herbert J. Neuhaus, Ph.D., TechLead Corporation

While often exaggerated and over-promised, nanotechnology provided vital reliability and performance enhancements to electronic systems for more than two decades. Advanced conductive adhesives and thermal interface materials pioneered nanotech adoption in electronics manufacture. Hype gives way to breakthrough as new nanotech solutions address multiple aspect of packaging, interconnect, and assembly. Leading research areas include coatings, adhesives, die attach, solder replacements, via structures, 3D printing, and novel conductors. This presentation surveys a broad range of revolutionary and disruptive nano-based technologies for electronics manufacturing, identifying practical applications and assessing the challenges and opportunities in commercial exploitation of these potential solutions.

 

9:15AM-10:00AM

"Failure Analysis: Case Studies and Implementing Practical Solutions

Speaker: Denis Barbini, Ph.D., Crucial Machines
When reviewed in conjunction with research, failures provide a unique perspective on design for manufacturability and reliability.  From fine pitch printing, to PoP, 01005 defects, and high Tg laminate failures, this presentation will provide valuable lessons learned from practical experience through discussion of material selection, current electronics research and failure analysis case studies.  Design considerations for advanced assembly processes and analytical techniques for materials characterization as well as discussing types of analytical techniques that can be sued for material characterization.

 

10:00AM

Expo Floor Opens

 

11:15AM-12:00PM

"Management Overview of the Smart Factory (industry 4.0) Principles and Affects in Electronics Manufacturing"
Speaker: Jay Gorajia, Mentor Graphics

In this paper and presentation, we will review what Smart Manufacturing or “Industrie 4.0” actually is and the related market and technology drivers behind it that makes significant change to the PCB electronics industry inevitable.  There is no doubt skeptics abound on this topic.  A lot of the skepticism is well founded with the explosion of vendor “support” or marketing promises.  However, some skepticism may be founded in a lack of clarity of what Smart Manufacturing can do, how it may be implemented, and what it may mean. We will look through the supply and demand chain, at what changes need to be made, starting with the consumer and the customer, to understand what their demands are, and what benefits or changes Smart Manufacturing will bring to them and the manufacturers.  Manufacturing analytics is core to Smart Manufacturing, and its related Cyber-Physical Systems connectivity to better manage delivery, quality, efficiencies and customer integration and collaboration. We look also across the breadth of the electronics manufacturing organization, to see exactly what is required to make a step-change practically possible when adopting the principles of Smart Manufacturing, and the related benefits.  This paper also will highlight use-cases and real world examples to illustrate the inevitability of Smart Manufacturing in PCB electronics manufacturing and the applicable technologies and processes that made it happen.

 12:00PM
COMPLIMENTARY LUNCH PROVIDED!

 

2:00PM-2:45PM

"Printing in the Third Dimension; Design, Materials, Equipment & Applications in Electronics"

Speaker: Charles E. Bauer, Ph.D., TechLead Corporation

Excitement around 3D printing continues full speed ahead whether in electronics, consumer goods or industrial systems. Understanding the capabilities, limitations and most importantly the complexities of 3d printing remains challenging despite significant progress in both equipment and materials. While not a comprehensive tutorial on 3D printing, this presentation introduces the application of 3D printing in electronics prototyping and manufacturing including;

1.       Types of 3D printing

2.       Design tools for 3D printed products

3.       Materials selection (availability and alternatives)

4.       Equipment choices

5.       Process capabilities and constraints

Specific examples include batteries, shielding, high density capacitors, and simple circuits. Discussion also includes applications outside the electronics world to stimulate creative thought, e.g. jet engine turbines and hyperbolic airfoils.

 

2:45PM-3:30PM

"Reflow Process Optimization Utilizing a Novel Defocused Laser for Fine Pitch Applications"

Speaker: Denis Barbini, Ph.D., Crucial Machines

The electronics design, packaging and assembly industries are being challenged to adapt to the needs of all industry sectors from consumer and retail to military/aerospace/defense segments based on the fast-changing requirements of the novel enabling technologies.  The result is the revolution of new materials and assembly techniques that require significant investigation.  This research focuses on the development, characterization and implementation of a novel soldering process that enables the end user to apply localized heating while maintaining the throughput of conventional reflow processes.  This stepwise discussion reviews and discusses the materials, alternative assembly processes and the reliability that will enable manufacturers to produce the aforementioned devices to the market.
 

3:45PM

Raffle Prize Drawings

 

4:00PM

Expo Floor Closes


REGISTER TODAY!  https://www.smta.org/expos/#newengland


September 12

Upper Midwest (Minnesota, Iowa & Dakotas) Chapter: SMTA Upper Midwest Chapter’s Membership Appreciation on Sept. 12th  +

Location
Target Field




2018 Upper Midwest Chapter’s membership appreciation event is at Target Field on September 12th.

Minnesota Twins
 
VS
NY Yankees

@ Target Field – Minneapolis, 7:10 PM


 
 
Game Date/Time: Wednesday, September 12th, 2018, 7:10 PM
Cost:                   $15 Members to reserve each ticket (limited tickets available – first come first serve).

 
To reserve a ticket, click RVSP below and we will let you know if tickets are still available. Details will be provided later for ticket pickup and payment.
 
Address/Directions to Target Field:
1 Twins Way Minneapolis, MN 55403
 
From the East (St. Paul, Woodbury, Hudson)
Travel westbound on I-94 and exit on Olson Memorial Highway (Highway 55). Turn right (East) after exiting then another right onto North 7th Street (Highway 55). You will see Target Field on your left.

From the West (Wayzata, Litchfield, Willmar)
Travel East on I-394 and exit on either 6th Street North or 4th Street North. You will find yourself a couple blocks from Target Field and ample parking in ramps and surface lots in the area.

From the North (Forest Lake, Hinckley, Duluth)
Travel southbound on I-35 and follow I-35W at the divide. Merge onto I-94 West and exit on Olson Memorial Highway (Highway 55). Turn right (East) after exiting then another right onto North 7th Street (Highway 55). You will see Target Field on your left.

From the South (Lakeville, Owatonna, Albert Lea)
Travel northbound on I-35 and follow I-35W at the divide. Take the downtown exit and follow once it turns into 5th Ave S. Turn left at 7th Street S. and Target Field will be just beyond the Target Center and numerous parking ramps.

From the Northwest (Elk River, St. Cloud, Alexandria)
Travel eastbound on I-94 and exit on Olson Memorial Highway (Highway 55). Turn left (East) after exiting then another right onto North 7th Street (Highway 55). You will see Target Field on your left.

From the Southwest (Shakopee, St. Peter, Mankato)
Travel North on 169 and take I-394 East. Exit on either 6th Street North or 4th Street North. You will find yourself a couple blocks from Target Field and ample parking in ramps and surface lots in the area.
 
Parking:
There are several options for parking in downtown Minneapolis including 7,000 parking spaces conveniently adjacent to Target Field in the ABC/Hawthorne ramps, nearly 25,000 parking spaces parking lots/ramps and metered street parking spaces throughout downtown. Keep in mind that parking further away from Target Field may provide a quicker overall exit from an event. Also keep in mind that the parking lot or ramp you have always used for US Bank Stadium events may serve very well for Target Field events.

Thanks for being our member,

Ed Knutson
Upper Midwest Chapter President


September 13

Indiana Chapter: SMTA Indiana Reformation Symposium (Hosted by Samtec)  +

Location
520 Park East Boulevard New Albany, IN 47151-1147



This year we are trying to have two symposiums that are mainly educational in nature. Our partners at Samtec have decided to host the first tour and they have put together plans for a very interesting day. The symposium will be on September 13th, 2018 from 10AM until 2:30PM. 



Come learn more about:
  • 3D printing and material deposition technology
  • Connector processing challenges and Design for Manufacturability
  • How SMTA can help you in your career
SMTA Indiana Reformation Symposium hosted by Samtec
Event Presenter   Duration Time Slot
Arrival/Welcome Mike Young   5 minutes 9:45 - 9:50 am
SMTA HQ Welcome Karen Frericks   15 Minutes 9:50 - 10:05 am
Samtec - Who We Are Justin Roehm   15 Minutes 10:05 - 10:20 am
Samtec Tour Samtec - Multiple   55 Minutes 10:20 - 11:15 am
Break     15 Minutes 11:15 - 11:30 am
PPT#1: IPG - Connector Processing Challenges Samtec - David Decker   30 Minutes 11:30 am - 12:00 pm
Lunch Combined with PPT#2: 3D Printing Indiana State University - Alister McLeod   90 Minutes 12:00 - 1:30 pm
Break     15 Minutes 1:30 - 1:45 pm
Maker Mobile Tour Samtec - John Riley   30 Minutes 1:45 - 2:15 pm
Q&A/Close Mike Young   15 Minutes 2:15 - 2:30 pm
 
PRESENTATIONS:

David Decker - Connector Processing Challenges

David Decker graduated with a Masters of Engineering degree in Mechanical Engineering from the University of Louisville’s Speed Scientific School in 1993 and earned his Professional Engineering license in 1998.  After beginning his career as an Injection Mold Tooling Engineer with Lexmark, Inc. and then General Electric Appliances, David moved on to Samtec where he has worked for 22 years holding positions in New Product design, Custom Product design and has been the Manager of the Interconnect Processing Group for the last 15 years.  David is also a Lieutenant in the Reserve Division of the Clark County Sheriff’s Office, where he has served for 8 years.ck here for Dd’s Bio


Topic Summary
 Connector Processing Challenges: Samtec’s Interconnect Processing Group, IPG, serves our customers in a variety of valuable ways.  By being intimately involved in the design process from initial concept through product release, we ensure our connectors have been designed for assembly and will integrate seamlessly into the customer’s application.  If for whatever reason there are problems during assembly, IPG’s thorough understanding of our products, gained during exhaustive process testing and development, enables us to interact with the Process Engineer to quickly diagnose the issue and get the customer back on line.  This technical topic will discuss common processing questions IPG receives. What are your connector challenges?

Alister McLeod - 3D printing

Alister McLeod earned a PhD in Industrial Technology and a MS in Electronics Technology both from Purdue University. Dr. McLeod is an Associate Professor of Manufacturing Engineering Technology and Program Coordinator in the department of Applied Engineering Technology Management at Indiana State University. His research interest is the adoption of productivity improvement techniques and machinery in small to medium size manufacturers. In Dr. McLeod’s Simulated Manufacturing Lab, the application and usage of 3D printing technology has been investigated for over six years. This lab is equipped with three 3D printers, including an industrial grade printer. Dr. McLeod consults with companies and educational institutions in the Vigo county region on issues surrounding 3D printing.

Topic Summary
3D printing is the different processes used where material is joined or solidified under computer control creating a three-dimensional object. During these processes, a material is added together being fused together from liquid molecules, powder grains or filament wire.  Unlike material removed from a stock in the conventional machining process, 3D printing builds three-dimensional objects from CAD models, usually by successively adding material layer by layer.  3D printing is used in both rapid prototyping and additive manufacturing (AM).  Objects can be of almost any shape or geometry and typically are produced using digital model data.  There are many different technologies, like stereolithography (SLA) or fused deposit modeling (FDM), Selective Laser Sintering (SLS), PolyJet, Multi Jet Fusion (MJF) and Direct Metal Laser Sintering (DMLS). 3D printing technology continues to advance, breathing life into designs that were previous difficult/impossible to make.  It also supplies support tooling/fixtures with reduced leadtime and cost and can even help solve obsolescence issued faced by many industries. It is often claimed that 3D printing signals the beginning of a third industrial revolution, succeeding the production line assembly that dominated manufacturing starting in the late 19th century.
 



September 13

Tampa Bay Chapter: SMTA Tampa Bay Chapter Meeting Notice- September 13th  +

Location
Jabil Circuit 10560 MLK Blvd St. Petersburg, FL



Hello Everyone,

This is a reminder to set time aside for our quarterly meeting on Thursday, September 13th at 5:30 PM.  The link to register is below.
Matt Osborne
LEDs- the Do's and the Dont's
Presented by: Matt Osborne, Trans-Tec America.
The presentation will cover placement, conformal coatings, and potting.

Our meeting will be held at:
Jabil Circuit

10560 MLK Blvd
St. Petersburg, FL  33716

*Look for the 4 story building in the center of campus.  You may enter from either Roosevelt or MLK and go to the center building by following the SMTA signs.

Agenda for Thursday, September 13th
5:30PM    Registration, Meet and Greet
5:30PM    Dinner
5:45PM    Introduction of Speaker
5:50-6:30PM- Topic Presentation
6:30-6:45PM- Question and Answer Time

Cost of Meeting
Members- $15.00
Non- Members $20.00

We hope to see everyone at the meeting!
 


September 13

Capital (DC) Chapter: Member Appreciation Event  +

Location
Heavy Seas Taproom



The SMTA Capital Chapter is holding a Member Appreciation Event at Heavy Seas Taproom, 4615 Hollins Ferry Rd., Halethorpe, MD 21227, on Thursday, September 13th.
 
Grab your friends and join us at Heavy Seas Taproom from 4– 7pm in celebrating our awesome chapter members! Heavy Seas is a simple, local microbrewery with a beer-centric taproom. Members are FREE and non-members are $20 (fee waived if you sign up to join our amazing chapter)! The event will include a private brewery tour, a beer tasting, souvenir glass, food and door prizes.
 
Please join us for this great networking and social event. RSVP now to reserve your spot!
 


September 17

Michigan Chapter: Michigan SMTA Member Appreciation Golf Outing & Technical Meeting  +

Location
Oak Pointe Country Club



Michigan SMTA Member Appreciation Golf Outing & Technical Meeting
Monday September 17, 2018
9:30 AM
Oak Pointe Country Club
4500 Club Drive Brighton, MI 48116
 
The Michigan Chapter of the SMTA is hosting a FREE technical meeting and golf outing for SMTA members.
This is one of the LARGEST technical meeting/golf outing events of any SMTA Chapter in America! Held at Oak Pointe Country Club, one of Michigan’s most exclusive private clubs, this is the event everyone raves about!
Please join us for a morning meeting, a spectacular round of golf on the Honors course, followed by a fantastic BBQ dinner on the clubhouse patio overlooking the crystal clear waters of Crooked Lake.

 
Costs:
SMTA MEMBERS/USERS: ABSOLUTELY FREE!
NON-SMTA MEMBERS: $25, (this will also get you a 1 year SMTA membership)
SALES ASSOCIATES: $75 (unless you purchase a sponsor sign, see details below)

 
Please register all players via the blue RSVP button below.
Once you have registered contact Rachel at RMarino@horizonsales.com with your foursome requests. 

Schedule
9:30AM-Registration
10:00AM-Technical Meeting in Clubhouse
Topic: Traceability Speakers: Greg Benoit, Cogiscan & Paul Price, Aegis
12:00PM- Shotgun start (boxed lunch provided)
Following Golf: BBQ Dinner & Awards/Door Prizes

 
Oak Pointe is a Private upscale country club.
Appropriate golf attire please. Collared shirts required, (must be tucked in), no denim or cargo shorts. Hats facing forward only please. Soft spikes only. Oak Pointe Country Club
 
A fun, free day of golf.
Courtesy of your Michigan SMTA


Sponsor Details
Sponsor a Hole for $200.00
All Sponsors Receive:

Signage on the course/at Keg & at the Clubhouse
One Free Round of golf during the outing
Continental Breakfast
Lunch
Beer
Dinner

 
If you'd like to sponsor a hole, please email RMarino@horizonsales.com with this completed form to sign up!
Click Here for Sponsor Registration Form
 


September 17

Webinar: Manual Cleaning of Printed Board Assemblies – Step By Step Guide  +


Bob WillisSeptember 17 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

After rework, modification or second stage assembly cleaning may need to be considered. Ideally a no clean flux, gel or solder paste should be used to avoid the need to clean selected areas. If manual cleaning is to be conducted every effort should be made to use materials or application methods that result in the minimum residues from the soldering process.

Planning and training staff in manual cleaning is very important to get the best possible result visually and to maintain product reliability. This is one of the first training sessions to cover manual cleaning of board assemblies, highlighting the problems and solutions to manual cleaning.

Topics include:

Why clean
Material selection
Manual cleaning techniques
Testing cleanliness
Inspection requirements
Component compatibility
Reliability test techniques

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here


September 19

San Diego Chapter: 09-19-2018 Practical Guidelines for Handling Moisture Sensitive SMT Packages  +

Location
pSemi Corporation, 9369 Carroll Park Drive, San Diego, CA, 92121



Presented by Mumtaz BoraSr. Staff Packaging Engineer at pSemi Corporation
 
Handling of moisture sensitive packages is an ongoing learning process in volume manufacturing. Improperly handled and stored MSDs can impact yields and reliability. The presentation will cover a review of the industry standards for MSDs (J-STD-020, J-STD 033 and J-STD 075) and their applications in moisture control. PWBs used for assembly also require controlled storage and handling. Board surface finishes, storage and baking guidelines will be reviewed per the IPC 1601 Standard.  Handling of MSDs from receipt to use at reflow will be reviewed, including practical guidelines in labelling, tracking, packing and storage.

Speaker: Mumtaz Y. Bora has a B.S. in Chemistry and Material Sciences from University of Mumbai, India and University of Ottawa, Canada. She has a Master of Science in Interactive Telecommunications from University of Redlands, California. She has over 25 years of PWB, SMT assembly and advanced packaging development experience at IBM Endicott and IBM Austin, TX.  She has worked in new product development, and qualification of high volume handset assemblies at Qualcomm and Kyocera-Wireless Corporation.  She has worked with suppliers and subcontractors in several parts of Asia.  She is currently a Sr. Staff Packaging Engineer at pSemi, specializing in qualification of RFIC packages for wireless, broadband and automotive applications. She is a member of IPC standardization committees and contributes to the standards development. She has 16 publications and 3 patents. She is the Past President of the SMTA San Diego chapter and Co-chair of the Moisture Sensitive Devices Council. She is currently on the Board for the IMAPS San Diego Chapter and Vice President of Technical Programs at SMTA San Diego Chapter

RSVP by: 09/18/18  RSVP Link: smta.org/chapters/rsvp.cfm?BEE_ID=4561

Members $5, Non-Members $10 (cash or check)
Location:                   pSemi Corporation, 9369 Carroll Park Drive, San Diego, CA, 92121     (map)

Registration:            5:30PM
Dinner:                      5:45PM-6:45PM

Presentation:           6:45PM


September 20

Puget Sound Chapter: INTEGRATED INTELLIGENT TRANSPORTATION AND KEY ENABLERS  +

Location
Applied Technical Services




The SMTA Puget Sound Chapter cordially invites you to attend:
 
INTEGRATED INTELLIGENT TRANSPORTATION
AND KEY ENABLERS
Speaker:  Dwight Howard, Delphi Automotive Systems
 
 
IMPORTANT INFO:
Date:  Thursday, September 20, 2018
Time:  12:00-3:00 p.m.
Location:    Applied Technical Services
                    6300 Merrill Creek Parkway A100
                    Everett, WA  98203

 
CLICK HERE TO RSVP
FOR THIS FREE EVENT TODAY!
 
 
 
AGENDA:
  • 12:00-12:30 – Meet and Greet
  • 12:30-1:00 – Refreshments
  • 1:00-2:30 – Presentation
  • 2:30-3:00 – Questions and answers
 
 
This outstanding professional development program was made possible with support from SMTA Puget Sound Chapter and Applied Technical Services.

“Connectivity and Sensors for Autonomous Vehicles and Intelligent Transportation Systems"
  
INTRODUCTION:
The evolution of automotive technologies toward full autonomous driving vehicles has commanded most of the attention in public, industry and academic circles.  To make autonomous driving practical, vehicles must be constantly aware of immediate, nearby and distant surroundings.  Sensors must serve as the eyes and ears.  Connectivity between vehicles and infrastructure must provide information well beyond sensor range.  This presentation discusses the importance of connectivity and sensor technologies in the evolution and deployment of autonomous vehicles and intelligent transportation systems.
  

ABOUT DWIGHT HOWARD:

Dwight is presently Manager of Electrical Engineering, Product Development with Delphi Automotive Systems, Electronics and Safety Division.  In this position, he has led over 17 years of electrical design/development for numerous automotive applications across the major automotive OEMs which include the very first commercial XM and Sirius satellite receivers, a number of advanced automotive navigation/radio receivers, rear-seat entertainment systems, telematics systems, and advanced smart receivers.  His recent activities are focused on the advanced development of emerging vehicle-to-vehicle (V2V)/vehicle-to-infrastructure (V2I) applications, Driver Monitoring and Gesture Control vision systems, and numerous advanced automotive receivers and entertainment systems programs for a range of automotive OEMs around the world. 

Dwight began his engineering career in consumer electronics, transitioning to telecommunications, and later moved into military and commercial vehicle power-train control systems development.  In these experiences, he worked on and managed major emerging technologies and new product advancements.  Dwight has spent the last 29 years in engineering management.   Dwight Howard holds a BSEE from Purdue University and an Executive MBA from Indiana University.  Dwight has also served many technical forums in the U.S., Europe, and Asia, as keynote speaker, technical presenter, and technical panelist.

 
Contact smtapugetsound@gmail.com with questions.



September 20

Western Pennsylvania (Pittsburgh) Chapter: Rock Bottom Brewery Technical Meeting and Round Table  +

Location
Rock Bottom Brewery, Homestead PA (171 East Bridge St, Homestead, PA 15120)



Rock Bottom Brewery Technical Meeting, Round Table Discussion, and optional brewery tour and beer tasting.

9:30am – check-in and continental breakfast 
10am to 11:30am – first topic – Ryk Williams Nortec Humidity
11:30 to 12pm –  SMTA announcements
Noon to 1pm – lunch (Rock Bottom menus)
1pm to 2:30pm – second topic – TBD
2:30 – 3:15 – open round table (open topics)
3:30 – 4:30pm – optional brewery tour and beer tasting

Cost is $35 for non-members and $20 for members.



 


September 25

Free Webinar! How to Effectively Communicate Your Ideas for Improvement within Your Organization   +


September 25 @ 1:00pm - 2:00pm US Eastern Time

Ryan CarlsonPresenter: Ryan Carlson, Next Mile IoT

 

Overview

Some of the best ideas within an organization never get acted on because they were not properly communicated or were missing key pieces of information. When a supervisor, manager, or executive is presented with an unclear or incomplete idea it’s unlikely to go anywhere. Whether you know it or not, engineers and operators are in sales too, they just don’t always think of it that way. Having a basic communication strategy can make all the difference when it comes to creating visibility for your ideas.

 

Example outcomes/learnings:

1. Understand the common characteristics of incomplete ideas and strategies for avoiding them.
2. Learn what business stakeholders are often looking for in an idea and what information they often need to make a decision
3. Gain familiarity with basic communication skills that can turn your ideas into clear and actionable recommendations

The webinar will run for between 30-60 minutes with the question and answer session. 

 

About the Presenter

Ryan Carlson is an 18-year veteran of connected product development, consulting, electronics manufacturing, product marketing, and user-centered design. As co-founder of Next Mile IoT his in-depth experience is put to use working with business leaders as they explore the business value of IoT, validate it's overall feasibility, and enable them to win the savings, revenue, and new opportunities unlocked by connected technology.

 


September 27

Rocky Mountain (Colorado) Chapter: Rocky Mountain Oktoberfest  +

Location
Vance Brand Airport - Longmont CO





The SMTA Rocky Mountain Chapter has final clearance for landing at Vance Brand Airport in Longmont, CO for this year's annual Oktoberfest. Beer, Brats, and Bavarian snacks and lots of networking opportunities will be provided.

Meet Vance Brand Airport Manager David Slayter, who will join us to talk about the airport's vision and how it serves the commercial, business, and aviation sectors for postitive economic impact to the community and the state.

Our second presenter will be Jon Vermillion from Ball Aerospace. Jon will discuss IPC standards as they relate to electronics manufacturing in aerospace and other high-reliability end uses.

As part of the event, we have partnered with Mile High Skydiving to offer tandem jumps at a group rate. Please note that there are two RSVP links below. One is for the Oktoberfest Event and the other is for the skydiving opportunity. The final price for jumping out of a perfectly good airplane will depend on how many of your co-workers and fellow SMTA members sign up. The deadline to register for this opportunity is 8/31/2018. Jon Ashton will confirm pricing and scheduling at that time (not to exceed $200 per person).

Finally we will be raffling off great prizes, including a 1-hour flight along the Front Range, piloted by Don Dolce.

You don't want to miss out. Make sure and RSVP today!
 
Time 4:30 - 7:00 PM
(skydiving may start as early as 10:00 AM to get everyone on the ground in time)
Date 9/27/2018
Location Longmont Vance Brand Airport
229 Airport Road
Longmont, CO 80503
Cost to attend FREE for all members
$15 for non-members (fee will be reimbursed with membership registration)
Contact Dave Levine at (720) 431-4349 or dlevine@texmacusa.com for membership information
Event RSVP

https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4559

Skydiving RSVP Jon Ashton, jashton@vergentproducts.com
   

Interested in sponsoring food, drinks or door prizes? Contact Robb Zippo at (720) 879-1218 or email him at robz@nexuspcb.com for options.




October 8

Webinar: Wave Soldering Lead-Free – Setting up Your Process Parameters  +


Bob WillisOctober 8 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Do we have all the answers to successful lead-free wave soldering? No, and to quote a well-known soldering metallurgist, we often don’t even know all the questions. Lead-free is new to many and the wave soldering process is the most affected by the change of materials with cost increase in alloy, solder bath and copper erosion plus increased temperatures all make process change demanding. During this presentation we will look at the practical experience to date and try to provide answers to as many questions that have come to light during early introduction. The presenter has produced training video and interactive CD-ROMs on wave soldering and conducted the Electrovert “Workshop of Machine Soldering” for over 10 years with theory and hands on sessions worldwide.

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

Topics include:

Checking key aspects in design
Copper erosion problems
Effect of tin-lead on joint reliability
Equipment settings, pre heat, fluxer, wave settings
Inert soldering
Effect of bath contaminates
Quality control checks
Common soldering defects, causes and cures

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here


October 9

Connecticut Chapter: SMTA-CT Tech Session: Tour of Altek Electronics Inc. and presentation of LEAN initiatives  +

Altek Electronics, 89 Commercial Blvd., Torrington CT 06790



Please join us on October 9th at Altek Electronics (Torrington CT) for a presentation of LEAN initiatives and the resulting efficiencies/benefits. 

Date:   October 9th, 2018
Location:   Altek Electronics, Inc.
Address:   89 Commercial Blvd., Torrington, CT  06790
Time:  8:30 – 11:00 a.m.

Agenda:  
8:30 a.m. Registration, networking and continental breakfast
9:00 a.m.  Presentation on LEAN/Continuous Improvement at Altek
9:45 a.m.  Factory Tour – examples of LEAN and Continuous Improvement initiatives
11:00 a.m. Depart

Price:     SMTA member: $25   Non-member: $35

Special Notations or Instructions from Company/Location:  Altek can accommodate 30 attendees—registration will be closed when 30 people have registered.  Parking is tight—there are some spots in the Visiting Nurse parking lot next door (please do not park directly in front of the Visiting Nurse building).   Closed toed shoes must be worn during the factory tour.

===========================


"LEAN in Action"

Learn how the adoption of LEAN supports Altek’s long-term objectives of remaining an independent family business in Connecticut, providing growth opportunities for employees and ensuring business sustainability through LEAN and Green initiatives.
 
We’ll discuss how transitioning from a “push” approach to a “pull” approach improves flow and links more directly to short term customer demand.  We’ll also talk about how this ongoing transition challenges our ideas of macro and micro shop floor layout and questions the conventional manufacturing mindset of economic order quantity and batch production.

Attendees will see examples on both the manufacturing floor as well as administrative functions where teams are improving safety and efficiency through formal workplace organization, identifying waste through process mapping, improving communication through visual management, improving flow through kaizen, reducing set up times through set up reduction activities, and addressing gaps through root cause problem solving.

Attendees will have the opportunity to hear from Altek employees who are actively engaged in leading and managing change and talk to staff members who are contributing their ideas and efforts to identifying opportunities and implementing change.


About the speakers: 

Tim Suydam is a seasoned Lean Business System, Manufacturing, Logistics, and Sourcing leader with over 20 years of experience focusing on operational excellence, both as an operations leader as well as a continuous process improvement leader.

Tim joined Altek Electronics in June of 2018. In his current role as Director of Continuous Improvement, he provides leadership, training, and hands on support in the implementation of Lean principles and practices.  A key responsibility is to challenge the status quo and assist management in their journey to lead in our developing Lean environment, delivering value to our customers and engaging every employee.

Tim’s earlier experience includes progressive roles in Procurement, Materials Management, Distribution, Planning, Quality Control and Operations Management.  His Lean journey began in 1996, as a member of the management team at the Ensign-Bickford Company, implementing a Lean system that resulted in four company facilities receiving the Shingo Prize.

Tim holds a lifetime Certification in Production and Inventory Management (CPIM) and holds a lifetime Purchasing Management Certification (C.P.M.).  He is a long tenured member of the Shingo Prize Board of Examiners and is a past mentor for students enrolled in the Shingo MBA program at Utah State University.

Ravi Kailan has over 16 years of experience in the world of manufacturing. He’s held various leadership positions in different manufacturing industries ranging from photovoltaic (solar) module manufacturing, to high-performance plastics extrusion for the automotive and medical industries. 
 
Ravi joined Altek Electronics in 2016.  In his current role of Director of Operations, Ravi is responsible for 145 employees working in the areas of Receiving, Manufacturing, Test, Engineering, Shipping and Facilities.  Ravi oversees the manufacture of over 900 different assemblies, and under his leadership throughput has increased 27% and NCMR scrap has decreased 35%.
 
Prior to working at Altek, Ravi was the Sr. Operations Manager for a multi-site defense contractor which designs and manufactures instrumentation and other systems for the Armed Forces. Ravi also served in the Marines for five years.
 
Ravi holds an MBA from Albertus Magnus College, Six Sigma Black Belt Certification from Central Connecticut State University and a Lean Leadership Certification.
 
POC for questions:  Sabrina Beck Sabrina.beck@altekelectronics.com (860) 309-8501

 


October 14 - 18

SMTA International 2018  +

Location
Donald E Stephens Convention Center
Rosemont , IL


Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering manufacturing and assembly of electronics, advanced packaging/components, inspection technologies, processes, substrates/PCB technology, soldering, quality and reliability.


October 16

Massachusetts (Boston) Chapter: SMTA Boston Chapter, IEEE & iMAPS New England Joint Meeting: 2D and 3D Printing; Changing Form Factors in Microwave Electronics  +

Location
Boxboro Regency Hotel & Conference Center 242 Adams Place, Boxborough, Massachusetts



You are cordially invited to attend technical presentation on
"2D and 3D Printing; Changing Form Factors in Microwave Electronics” 

Speaker:  Craig Armiento, Ph.D., Director, Printed Electronics Research Collaborative (PERC) & Raytheon-UMass Lowell Research Institute

 

Meeting Agenda:
5:00 PM Registration, Socializing, Networking & Cash Bar
6:00 PM Dinner Buffet with Pasta Bolognese & Chicken Piccata
6:45 PM  Student Technical Presentations
7:30 PM Featured Technical Presentation


FEATURING iMAPS New England 2018-19 Education Initiative

Graduate Students from SUNY Binghamtom, Worcester Polytechnic Institute, and UMASS Lowell, for an INTERACTIVE POSTER SESSION and Individual Presentations...!!!

Technical Presentation Summary: The University of Massachusetts Lowell is home to PERC, the center for development of Printed Electronics with a focus on RF/Microwave Applications. This research effort is a strategic partnership between industry, university and government, including companies of all sizes, public and private universities, and U.S. Department of Defense. New England partners strengthen and expand the region’s capabilities in printed and flexible electronics. We will also discuss the Raytheon-U Mass Lowell Research Institute (RURI) and will describe work on printed antennas and frequency selective surfaces developed over the last three years.

Speaker Bio: Craig Armiento is a Professor in the Electrical and Computer Engineering (ECE) Department at the University of Massachusetts Lowell. In addition to directing Printed Electronics Research Collaborative (PERC), he is also Director of the Center for Photonics, Electromagnetics and Nanoelectronics (CPEN). He is a founder and Co-Director of the Raytheon-UMass Lowell Research Institute (RURI). Prof. Armiento served as ECE Department Chair from 2005-2011. Prof. Armiento’s current research interests are printed electronics and antennas, photonic devices, advanced packaging, Flex-Hybrid integration and RFIDs.

 
Cost: (with dinner) SMTA/IEEE/iMAPS members $25 ($30 after Thursday, Oct. 11, 2018)
  Non-members $30 ($35 after Thursday, Oct. 11, 2018)
  Retired-Unemployed Member $20 ($25 after Thursday, Oct. 11, 2018)
  Student Member $10 ($15 after Thursday, Oct. 11, 2018)
Cost: (without dinner) No Charge

For more information:
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October 16 - 18

SMT Processes Certification (SMTA International - Rosemont, IL)  +

Location
Donald Stephens Convention Center
Rosemont , IL


Co-located with SMTA International Conference.

  • October 16- Course (8:30-5pm)
  • October 17- ½ day of course + exam
  • October 18 All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


October 23

Oregon Chapter: Reflow Process Optimization Utilizing a Novel Defocused Laser for Fine Pitch Applications  +

Location
Axiom Electronics



Reflow Process Optimization Utilizing a Novel Defocused Laser for Fine Pitch Applications
Date: October 23rd, 2018
Time: 4:30-7:00PM
Place: Axiom Electronics [9845 NE Eckert Drive Suite 200, Hillsboro, OR 97006 ]
 
Abstract
The electronics design, packaging, and assembly industries are being challenged to adapt to the needs of all industry sectors from consumer and retail to military/aerospace/defense segments based on the fast changing requirements of the novel enabling technologies.  The result is the revolution of new materials and assembly techniques that require significant investigation.  This research focuses on the development, characterization, and implementation of a novel soldering process that enables the end user to apply localized heating while maintaining the throughput of conventional reflow processes.  This stepwise discussion reviews and discusses the materials, alternative assembly processes and the reliability that will enable manufacturers to produce the aforementioned devices to the market.

 
Denis C. Barbini, Ph.D - Bio
Denis is the General Manager of Crucial Machines, USA.  Denis has traveled the electronics manufacturing world visiting over 30 countries over the past 20 years providing solutions to people and companies designing and manufacturing a vast array of devices.  Denis’ current focus is to provide these companies with the ability to implement cost-effective, reliable and robust processes that deliver the specified functionality and reliability.
 


October 23

Carolinas (NC, SC) Chapter: SMTA Carolinas Infosession  +

7628 Thorndike Road, Greensboro, NC 27409



Join us in Greensboro at
QORVO
to learn from
ASM
about improving SMT process
for PCBA with 0201mm microchips 




When: Tuesday October 23, 2018 - Doors open at 5:30, followed by dinner at 6:00 & presentation at 6:30
Where: Qorvo Headquarters at 
7628 Thorndike Road, Greensboro, NC 27409
What: Dinner and Discussion, followed by PCBA with Microchips by ASM
Why: Understand how leading suppliers can help your SMT process


Tom Foley is the Quality Manager for ASM Assembly Systems. Having over 25 years of surface mount industry experience, Tom has previously held positions in product management, marketing, and application engineering. Tom has also served on industry committees such as IPC-9851, iNEMI Roadmap, and is a certified Six Sigma Black Belt.

Special thanks to our host QORVO and speaker ASM

Qorvo: All Around You
Image result for asm logo



October 23 - 25

International Wafer-Level Packaging Conference  +

Driving an Interconnected World

Location
DoubleTree San Jose Airport Hotel
San Jose , CA


IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.


October 24

San Diego Chapter: 10-24-18 Octoberfest  +

Location
Indian Joe Brewing



Join us in the tasting room and take a tour of Indian Joe Brewing


AGENDA:
5:30 – 6:00PM   Registration Check-in
5:45 – 8:00PM   Food and Drinks Mixer
7:00PM              Brewery Tour
 
COST:
  • Members $10, Non-Members $15
  • Cash or Check only
Price includes one drink ticket and one food ticket for “The Food Dood”

RSVP by Clicking this Link or go to the RSVP link on SMTA.org “San Diego Chapter News”
 
 
LOCATION:       Indian Joe Brewing, 2123 Industrial Ct., Vista, CA 92081
                           https://www.indianjoebrewing.com/
                           (760) 295-394
 
 
A special “Thankyou” to our 10/24/18 Octoberfest Sponsors KNS and Excelta for helping cover costs for this event:
 

For a printable event flyer click here
 


October 29 - 31

SMT Processes Certification - October 29-31, 2018 (Querétaro, Mexico)  +

Location
Querétaro , JA Mexico


  • Day 1- Course (8:30-5pm)
  • Day 2- ½ day of course + exam
  • Day 3- All day exam (8:30-5pm)
  • Instruction: English/Spanish
    Test: English
    Instructor: Iván Castellanos, Indium Corporation


Oct 31 - Nov 1

Embedded Systems Conference (ESC) Minneapolis  +

The Midwest's Only Embedded Systems Conference

Location
Minneapolis Convention Center
Minneapolis , MN


Embedded Systems Conference (ESC) Minneapolis is the premier conference for chip, board and systems design engineers, deep dive into testing and measurement equipment, system boards, debugging software tools, security products, and more. 

Save 20% on the All-Access Conference pass by using promo code: SMTA

Get details and register here!

ESC 2018



November 2

Dallas Chapter: An Insider's Guide to the Analytical Lab  +

Location
Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080



Back to the Future

An Insider's Guide to the Analytical Lab

Event Details

  • Who: SMTA Members, Non-members, Students, and Guests are welcome - forward to others!
  • When: 11am-1pm on November 2, 2018
  • Where: Aboca’s Italian Grill, 100 S Central Expy #63, Richardson, TX 75080
  • Why: Meet others in the industry to help solve your technical problems. Come to the meeting, even if this isn’t a key topic of yours, the problem solving networking is great!

Pricing

  • FREE for New Members since prior meeting
  • $10 for Committee Members
  • $20 Members, employees of Corporate member companies, 1st time guests, and students
  • $25 non-members, students, & guests – same price
  • Cash at the door or credit card on-line

10% Early-bird Discount for paying on-line before 5:00pm on November 31st!

Get your tickets!

Abstract

Manufacturing of Printed Circuit Assemblies involves many complex processes. Failures can and do occur at any step in building of the product, as well in service with the customer.

Root cause analysis and corrective action can often be challenging, with significant impacts on recovery costs and production schedules. These impacts can be minimized through assistance from an Analytical Services Lab with extensive applicable knowledge of materials, processes, and analytical equipment.

The decision to contact a lab for assistance can present many questions and concerns. In this presentation we will deal with some of these, and offer recommendations for successful failure analysis and resolution.

Biography

Stephen Schoppe is the co-founder of Process Sciences, Inc. (PSI) which provides rework/repair and laboratory services to the electronic assembly industry. During his 25 years of service to PSI, he has served as process engineer, sales manager and is currently the President.

Stephen has given presentations at SMTA International and other events on the topics of BGA rework and X-ray inspection. He has also presented talks on laboratory analysis techniques at local organizational meetings and for captive customer audiences.




November 6

Ohio Valley Chapter: Solder Roundtable - North  +

Location
Corporate College East Warrensville Heights, OH




Technical and product presentations from:
  • Shea Engineering Chrys Shea presents: Evaluating the Next Generation of Stencil Stepping Technologies along with Video Analysis of Evaluating Snap Off Speed and Impact of Dry vs. Vacuum Wipe
  • Henkel Dr. Mark Currie presents: Development of a solder paste test vehicle for miniaturized surface mount technology
  • Indium Corporation Brook Sandy-Smith presents: Avoiding the Pitfalls of Voiding in PCB Assemblies
  • FCT Assembly/Blue Ring Stencils Tony Lentz presents: How does PCB surface finish affect printing
  • AIM Tim O’Neill presents: Evolution of lead free solder alloys
  • Alpha Assembly Solutions Jason Fullerton presents: Cleanliness testing and its relationship to flux reliability
  • KOKI Solder America Inc. Shantanu Joshi Presents: Solder paste for super fine pitch components