Calendar of Events

   2018      

                        Sept           

September 2018


September 11 - 13

SMT Processes Certification (Querétaro, Mexico)  +

Location
Querétaro , JA Mexico


  • Day 1- Course (8:30-5pm)
  • Day 2- ½ day of course + exam
  • Day 3- All day exam (8:30-5pm)
  • Instruction: English/Spanish
    Test: English
    Instructor: Iván Castellanos, Indium Corporation


September 12

Mexico - Guadalajara Chapter: SMTA Monterrey Foro Tecnico y Expo  +

Location
Crowne Plaza Aeropuerto Monterrey



Mesas de exposicion disponibles / Table top available

Para hacer su reservación de mesa favor de contactar a:
To make the payment of you table top please contact:

Jaime Arreola
+52 1 (33) 3157 0636
jaime.arreola@pemtron.com
Secretary SMTA Guadalajara



September 12

Connecticut Chapter: 2018 SMTA New England Expo and Tech Forum  +

DCU Center, 50 Foster St., Worcester, MA 01608



COMPLEMENTARY ADMISSION and LUNCH INCLUDED!
Don't Miss Out!  Register Now!!



 

 

Free Technical Program & Schedule:

 

7:30AM

Registration Opens

 

8:30AM-9:15AM

"Nanotechnology for Advanced Electronics Packaging"

Speaker: Charles E. Bauer, Ph.D., and Herbert J. Neuhaus, Ph.D., TechLead Corporation

While often exaggerated and over-promised, nanotechnology provided vital reliability and performance enhancements to electronic systems for more than two decades. Advanced conductive adhesives and thermal interface materials pioneered nanotech adoption in electronics manufacture. Hype gives way to breakthrough as new nanotech solutions address multiple aspect of packaging, interconnect, and assembly. Leading research areas include coatings, adhesives, die attach, solder replacements, via structures, 3D printing, and novel conductors. This presentation surveys a broad range of revolutionary and disruptive nano-based technologies for electronics manufacturing, identifying practical applications and assessing the challenges and opportunities in commercial exploitation of these potential solutions.

 

9:15AM-10:00AM

"Failure Analysis: Case Studies and Implementing Practical Solutions

Speaker: Denis Barbini, Ph.D., Crucial Machines

 

10:00AM

Expo Floor Opens

 

11:15AM-12:00PM

"Management Overview of the Smart Factory (industry 4.0) Principles and Affects in Electronics Manufacturing"
Speaker: Jay Gorajia, Mentor Graphics

In this paper and presentation, we will review what Smart Manufacturing or “Industrie 4.0” actually is and the related market and technology drivers behind it that makes significant change to the PCB electronics industry inevitable.  There is no doubt skeptics abound on this topic.  A lot of the skepticism is well founded with the explosion of vendor “support” or marketing promises.  However, some skepticism may be founded in a lack of clarity of what Smart Manufacturing can do, how it may be implemented, and what it may mean. We will look through the supply and demand chain, at what changes need to be made, starting with the consumer and the customer, to understand what their demands are, and what benefits or changes Smart Manufacturing will bring to them and the manufacturers.  Manufacturing analytics is core to Smart Manufacturing, and its related Cyber-Physical Systems connectivity to better manage delivery, quality, efficiencies and customer integration and collaboration. We look also across the breadth of the electronics manufacturing organization, to see exactly what is required to make a step-change practically possible when adopting the principles of Smart Manufacturing, and the related benefits.  This paper also will highlight use-cases and real world examples to illustrate the inevitability of Smart Manufacturing in PCB electronics manufacturing and the applicable technologies and processes that made it happen.

 12:00PM
COMPLIMENTARY LUNCH PROVIDED!

 

2:00PM-2:45PM

"Printing in the Third Dimension; Design, Materials, Equipment & Applications in Electronics"

Speaker: Charles E. Bauer, Ph.D., TechLead Corporation

Excitement around 3D printing continues full speed ahead whether in electronics, consumer goods or industrial systems. Understanding the capabilities, limitations and most importantly the complexities of 3d printing remains challenging despite significant progress in both equipment and materials. While not a comprehensive tutorial on 3D printing, this presentation introduces the application of 3D printing in electronics prototyping and manufacturing including;

1.       Types of 3D printing

2.       Design tools for 3D printed products

3.       Materials selection (availability and alternatives)

4.       Equipment choices

5.       Process capabilities and constraints

Specific examples include batteries, shielding, high density capacitors, and simple circuits. Discussion also includes applications outside the electronics world to stimulate creative thought, e.g. jet engine turbines and hyperbolic airfoils.

 

2:45PM-3:30PM

"Reflow Process Optimization Utilizing a Novel Defocused Laser for Fine Pitch Applications"

Speaker: Denis Barbini, Ph.D., Crucial Machines

 

3:45PM

Raffle Prize Drawings

 

4:00PM

Expo Floor Closes


REGISTER TODAY!  https://www.smta.org/expos/#newengland


September 12

New England Expo & Tech Forum  +

Location: DCU Center
50 Foster Street
Worcester, MA 01608



Exhibitors

The cost to exhibit for corporate members is $450/$550 (Early/Late) and $550/$650 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Early bird expires on August 24th, 2018!

All spaces will be assigned once we are sold out. If there is another exhibitor you want to be next to please let us know when you sign up. 

Exhibitor Sponsorship Opportunities

Exhibitor Hard Copy Application

Please contact SMTA Expo Manager Courtney Kalb with questions or for additional information.



Attendees

Free Technical Program & Schedule:

 

7:30AM

Registration Opens

 

Thank You to Our Technical Session Sponsor:

IMI, Inc.

 

8:30AM-9:15AM

"Nanotechnology for Advanced Electronics Packaging"

Speaker: Charles E. Bauer, Ph.D., and Herbert J. Neuhaus, Ph.D., TechLead Corporation

While often exaggerated and over-promised, nanotechnology provided vital reliability and performance enhancements to electronic systems for more than two decades. Advanced conductive adhesives and thermal interface materials pioneered nanotech adoption in electronics manufacture. Hype gives way to breakthrough as new nanotech solutions address multiple aspect of packaging, interconnect, and assembly. Leading research areas include coatings, adhesives, die attach, solder replacements, via structures, 3D printing, and novel conductors. This presentation surveys a broad range of revolutionary and disruptive nano-based technologies for electronics manufacturing, identifying practical applications and assessing the challenges and opportunities in commercial exploitation of these potential solutions.

 

9:15AM-10:00AM

"Failure Analysis: Case Studies and Implementing Practical Solutions

Speaker: Denis Barbini, Ph.D., Crucial Machines

 

10:00AM

Expo Floor Opens

 

11:15AM-12:00PM

"Management Overview of the Smart Factory (industrie 4.0) Principles and Affects in Electronics Manufacturing"
KEYNOTE Speaker: Jay Gorajia, Mentor Graphics, a Siemens Business

In this paper and presentation, we will review what Smart Manufacturing or “Industrie 4.0” actually is and the related market and technology drivers behind it that makes significant change to the PCB electronics industry inevitable.  There is no doubt skeptics abound on this topic.  A lot of the skepticism is well founded with the explosion of vendor “support” or marketing promises.  However, some skepticism may be founded in a lack of clarity of what Smart Manufacturing can do, how it may be implemented, and what it may mean. We will look through the supply and demand chain, at what changes need to be made, starting with the consumer and the customer, to understand what their demands are, and what benefits or changes Smart Manufacturing will bring to them and the manufacturers.  Manufacturing analytics is core to Smart Manufacturing, and its related Cyber-Physical Systems connectivity to better manage delivery, quality, efficiencies and customer integration and collaboration. We look also across the breadth of the electronics manufacturing organization, to see exactly what is required to make a step-change practically possible when adopting the principles of Smart Manufacturing, and the related benefits.  This paper also will highlight use-cases and real world examples to illustrate the inevitability of Smart Manufacturing in PCB electronics manufacturing and the applicable technologies and processes that made it happen.

 

Thank You to Our Lunch Sponsors:

 

12:00PM

COMPLIMENTARY LUNCH

 

2:00PM-2:45PM

"Printing in the Third Dimension; Design, Materials, Equipment & Applications in Electronics"

Speaker: Charles E. Bauer, Ph.D., TechLead Corporation

Excitement around 3D printing continues full speed ahead whether in electronics, consumer goods or industrial systems. Understanding the capabilities, limitations and most importantly the complexities of 3d printing remains challenging despite significant progress in both equipment and materials. While not a comprehensive tutorial on 3D printing, this presentation introduces the application of 3D printing in electronics prototyping and manufacturing including;

1.       Types of 3D printing

2.       Design tools for 3D printed products

3.       Materials selection (availability and alternatives)

4.       Equipment choices

5.       Process capabilities and constraints

Specific examples include batteries, shielding, high density capacitors, and simple circuits. Discussion also includes applications outside the electronics world to stimulate creative thought, e.g. jet engine turbines and hyperbolic airfoils.

 

2:45PM-3:30PM

"Reflow Process Optimization Utilizing a Novel Defocused Laser for Fine Pitch Applications"

Speaker: Denis Barbini, Ph.D., Crucial Machines

 

3:45PM

Raffle Prize Drawings

 

4:00PM

Expo Floor Closes


September 13

Indiana Chapter: SMTA Indiana Reformation Symposium (Hosted by Samtec)  +

Location
520 Park East Boulevard New Albany, IN 47151-1147



This year we are trying to have two tours that are mainly educational in nature. Our partners at Samtec have decided to host the first tour and they have put together plans for a very interesting day. The tour will be on September 13th, 2018 from 10AM until 2:30PM. Please feel free to contact me (Alister.McLeod@indstate.edu) if you are hoping to attend or RSVP. We need a response by August 31, 2018.Speakers & Topics


David Decker - Connector Processing Challenges

David Decker graduated with a Masters of Engineering degree in Mechanical Engineering from the University of Louisville’s Speed Scientific School in 1993 and earned his Professional Engineering license in 1998.  After beginning his career as an Injection Mold Tooling Engineer with Lexmark, Inc. and then General Electric Appliances, David moved on to Samtec where he has worked for 22 years holding positions in New Product design, Custom Product design and has been the Manager of the Interconnect Processing Group for the last 15 years.  David is also a Lieutenant in the Reserve Division of the Clark County Sheriff’s Office, where he has served for 8 years.lick here for David’s Bio

Topic Summary
 Connector Processing Challenges: Samtec’s Interconnect Processing Group, IPG, serves our customers in a variety of valuable ways.  By being intimately involved in the design process from initial concept through product release, we ensure our connectors have been designed for assembly and will integrate seamlessly into the customer’s application.  If for whatever reason there are problems during assembly, IPG’s thorough understanding of our products, gained during exhaustive process testing and development, enables us to interact with the Process Engineer to quickly diagnose the issue and get the customer back on line.  This technical topic will discuss common processing questions IPG receives. What are your connector challenges?

 

 Keith Magiera - 3D printing
Keith Magiera graduated from Purdue University with a BS in Materials Engineering in 1993.  Later in his career he also received an MBA from Purdue University and JD from John Marshall Law School, Chicago.  He began his career as a Materials Engineer in the microelectronic industry.  After many years of materials engineering in microelectronics, he then turned his focus to business development.  Recently he changed industries from electronics to 3D printing at Forecast 3D in Carlsbad CA, still focusing on materials engineering and business development.  He resides outside Chicago in northwest Indiana.lick here for David’s Bio

Topic Summary
3D printing is the different processes used where material is joined or solidified under computer control creating a three-dimensional object. During these processes, a material is added together being fused together from liquid molecules, powder grains or filament wire.  Unlike material removed from a stock in the conventional machining process, 3D printing builds three-dimensional objects from CAD models, usually by successively adding material layer by layer.  3D printing is used in both rapid prototyping and additive manufacturing (AM).  Objects can be of almost any shape or geometry and typically are produced using digital model data.  There are many different technologies, like stereolithography (SLA) or fused deposit modeling (FDM), Selective Laser Sintering (SLS), PolyJet, Multi Jet Fusion (MJF) and Direct Metal Laser Sintering (DMLS). 3D printing technology continues to advance, breathing life into designs that were previous difficult/impossible to make.  It also supplies support tooling/fixtures with reduced leadtime and cost and can even help solve obsolescence issued faced by many industries. It is often claimed that 3D printing signals the beginning of a third industrial revolution, succeeding the production line assembly that dominated manufacturing starting in the late 19th century



September 17

Michigan Chapter: Michigan SMTA Member Appreciation Golf Outing & Technical Meeting  +

Location
Oak Pointe Country Club



Michigan SMTA Member Appreciation Golf Outing & Technical Meeting
Monday September 17, 2018
9:30 AM
Oak Pointe Country Club
4500 Club Drive Brighton, MI 48116
 
The Michigan Chapter of the SMTA is hosting a FREE technical meeting and golf outing for SMTA members.
This is one of the LARGEST technical meeting/golf outing events of any SMTA Chapter in America! Held at Oak Pointe Country Club, one of Michigan’s most exclusive private clubs, this is the event everyone raves about!
Please join us for a morning meeting, a spectacular round of golf on the Honors course, followed by a fantastic BBQ dinner on the clubhouse patio overlooking the crystal clear waters of Crooked Lake.

 
Costs:
SMTA MEMBERS/USERS: ABSOLUTELY FREE!
NON-SMTA MEMBERS: $25, (this will also get you a 1 year SMTA membership)
SALES ASSOCIATES: $75 (unless you purchase a sponsor sign, see details below)

 
Please register all players via the blue RSVP button below.
Once you have registered contact Rachel at RMarino@horizonsales.com with your foursome requests. 

Schedule
9:30AM-Registration
10:00AM-Technical Meeting in Clubhouse - Topic: Traceability (speaker TBD)
12:00PM- Shotgun start (boxed lunch provided)
Following Golf: BBQ Dinner & Awards/Door Prizes

 
Oak Pointe is a Private upscale country club.
Appropriate golf attire please. Collared shirts required, (must be tucked in), no denim or cargo shorts. Hats facing forward only please. Soft spikes only. Oak Pointe Country Club
 
A fun, free day of golf.
Courtesy of your Michigan SMTA


Sponsor Details
Sponsor a Hole for $200.00
All Sponsors Receive:

Signage on the course/at Keg & at the Clubhouse
One Free Round of golf during the outing
Continental Breakfast
Lunch
Beer
Dinner

 
If you'd like to sponsor a hole, please email RMarino@horizonsales.com with this completed form to sign up!
Click Here for Sponsor Registration Form
 


September 17

Webinar: Manual Cleaning of Printed Board Assemblies – Step By Step Guide  +



Bob WillisSeptember 17 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

After rework, modification or second stage assembly cleaning may need to be considered. Ideally a no clean flux, gel or solder paste should be used to avoid the need to clean selected areas. If manual cleaning is to be conducted every effort should be made to use materials or application methods that result in the minimum residues from the soldering process.

Planning and training staff in manual cleaning is very important to get the best possible result visually and to maintain product reliability. This is one of the first training sessions to cover manual cleaning of board assemblies, highlighting the problems and solutions to manual cleaning.

Topics include:

Why clean
Material selection
Manual cleaning techniques
Testing cleanliness
Inspection requirements
Component compatibility
Reliability test techniques

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here


September 18

Oregon Chapter: INTEGRATED INTELLIGENT TRANSPORTATION AND KEY ENABLERS  +

Location
Axiom Electronics



INTEGRATED INTELLIGENT TRANSPORTATION AND KEY ENABLERS
 
Abstract
 
Connectivity and Sensors for Autonomous Vehicles and Intelligent Transportation Systems
 
The evolution of automotive technologies toward full autonomous driving vehicles has commanded most of the attention in public, industry and academic circles.  To make autonomous driving practical, vehicles must be constantly aware of immediate, nearby and distant surroundings.  Sensors must serve as the eyes and ears.  Connectivity between vehicles and infrastructure must provide information well beyond sensor range.  This presentation discusses the importance of connectivity and sensor technologies in the evolution and deployment of autonomous vehicles and intelligent transportation systems.
 
Dwight Howard - Bio

Dwight is presently Manager of Electrical Engineering, Product Development with Delphi Automotive Systems, Electronics and Safety Division.  In this position, he has led over 17 years of electrical design/development for numerous automotive applications across the major automotive OEMs which include the very first commercial XM and Sirius satellite receivers, a number of advanced automotive navigation/radio receivers, rear-seat entertainment systems, telematics systems, and advanced smart receivers.  His recent activities are focused on the advanced development of emerging vehicle-to-vehicle (V2V)/vehicle-to-infrastructure (V2I) applications, Driver Monitoring and Gesture Control vision systems, and numerous advanced automotive receivers and entertainment systems programs for a range of automotive OEMs around the world. 

Dwight began his engineering career in consumer electronics, transitioning to telecommunications, and later moved into military and commercial vehicle power-train control systems development.  In these experiences, he worked on and managed major emerging technologies and new product advancements.  Dwight has spent the last 29 years in engineering management.   Dwight Howard holds a BSEE from Purdue University and an Executive MBA from Indiana University.
Dwight has also served many technical forums in the U.S., Europe, and Asia, as keynote speaker, technical presenter, and technical panelist.
 


September 19

San Diego Chapter: 09-19-2018 3D Packaging for the SMT Specialist  +

TBD



Topic: 3D Packaging for the SMT Specialist

Speaker: Charles Bauer, Ph.D. -TechLead Corporation
Educated at Oregon Graduate Center - 1980 Doctor of Philosophy in Materials Science and Engineering, Ohio State University 1975 Master of Science degree in Metallurgical Engineering and Stanford University, 1972 Bachelor of Science in Materials Science and Engineering, his current position is Senior Managing Director of TechLead. He is working on areas of strategic technology planning, market analysis and international business development. Chuck has more than 35 years experience ranging from printed circuit board and hybrid fabrication, through complex IC metallization, multilayer packaging, multichip modules, system in package, 3D packaging, flat panel display packaging and assembly, as well as nano-technology. Past employment includes Coors Advanced Electronics Group in Golden, Colorado (1989-1990) and Tektronix in Beaverton, Oregon (1978-1989).
Awards/Associations
Dr. Bauer lectures throughout the world on technology, business and market topics as well as serving on several corporate boards and international corporate, government andeducational institution advisory councils. A Senior Member of IEEE, he remains active in theSMTA, JIEP, ASM and IMAPS as well. Dr. Bauer served on the Boards of both the SMTA and IMAPS and as President of IMAPS in 2001-2002. He currently serves as the International Development Chair for the SMTA. Awards received include Tektronix Technical Innovation Award, Fellow of IMAPS, and the International Leadership Award from the SMTA, Jesuit High School Hall of Fame, University of Portland Significant 75 Alumni and SMTA 25th Anniversary Luminary as founder of the Pan Pacific Microelectronics Symposium. He holds Patents and has published more than 150 papers.

Stay tuned for the abstract and meeting location....


September 20

Intermountain Utah Expo & Tech Forum  +

Location: University of Utah
A. Ray Olpin University Union - Saltair Room
200 S Central Campus Drive
Salt Lake City, UT 84112



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on August 31st, 2018!

Click here for Ad and Sponsorship opportunities!
Important Exhibitor Materials:



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Exhibit Hours:
Thursday, September 20, 2018
10:00AM–3:00PM

 


September 27

Rocky Mountain (Colorado) Chapter: Rocky Mountain Oktoberfest  +

Location
Vance Brand Airport - Longmont CO



Join us for Membership Appreciation Oktoberfest celebration at Longmont Vance Brand Airport. Network with your peers, enjoy traditional Bavarian food and beer, and enjoy the sights and sounds at Longmont Vance Brand Airport.
 


Looking for a local chapter event? Check the Chapter News page for more events.
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819