Calendar of Events
Mexico - Guadalajara Chapter: REGISTRO! SMTA Tijuana Foro Tecnico y Expo +
Real Inn Tijuana, Paseo de los Héroes 9902, Zona Urbana Rio Tijuana.
¡ REGÍSTRATE AQUÍ !
REGISTER HERE !
|Habitacion||Tarifa Convenio (MXN)|
|Hab. de Lujo||$1450|
|Hab. Sencilla con Desayuno Buffet||$1610|
|Hab. Doble con Desayuno Buffet||$1770|
Habitaciones sujetas a espacio y disponibilidad
Tarifa no incluye impuestos
If you are interested on a table top, please contact:
+52 1 (33) 3157 0636
Secretary SMTA Guadalajara
South East Asia Technical Training Conference on Electronics Assembly Technologies 2018 (Rescheduled Dates) +
Eastin Hotel Penang
The South East Asia Technical Conference on Electronics Assembly is a highly technical event that is focused on today's most important and timely issues. The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.
The conference is "claimable from HRDF under SBL scheme."
Recent Advances in Flip Chip, WLCSP, and FOWLP
Wednesday, August 15th
John H. Lau, Ph.D., ASM Pacific Technology
Recent advances in (1) flip chip such as wafer bumping, package substrate, assembly, and underfill, (2) fan-in WLCSP (wafer-level chip scale package) such as relaxation layer and under-bump metallurgy (UBM)-free WLCSP, and (3) FOWLP (fan-out wafer-level packaging) such as chip-first with die face-down, chip-first with die face-up, and chip-last or redistribution layer (RDL)-first will be presented in this study. Emphasis is placed on the latest developments of these technologies in the past few years. Their future trends will also be discussed.
Professional Development Courses
Flip Chip, WLCSP, and FOWLP Assembly and Reliability
Tuesday, August 14
John Lau, Ph.D. Sr. Technical Advisor, ASM
The major trend in the electronic industry today is to make products such as smartphones, tablets, wearables, internet of things, etc. more personal by making them smarter, lighter, smaller, thinner, shorter, and faster, while at the same time making them more friendly, functional, powerful, reliable, robust, innovative, creative, and less expensive. As the trend towards miniature and compact products continues, the introduction of cool products that are more user-friendly and contain a wider variety of functions will provide growth in the market. Some of the key technologies that are helping to make these cool product design goals possible are flip chip, WLCSP (wafer-level chip scale package), and FOWLP (fan-out wafer-level packaging). Their PCB (printed circuit board) assembly and solder joint reliability will be presented and discussed in this lecture.
Understanding Parameters Affecting Barrel Fill in Wave Soldering Process
Wednesday, August 15
AF Ng, Consultant, Techment Consultancy Sdn Bhd
Conventional Wave Soldering has been employed for soldering of boards since long time ago. The related manufacturing personnel are well aware of common encumbering defects happen erratically with this process. Some of these defects encountered daily are bridging, solder skips, solder voids and insufficient barrel fill or hole-fill. Many of us would agree that we are still facing challenges on one of the common defects – poor barrel fill. The problem is confounded with currently High density/Multilayer thick PCB and applying Lead-free soldering. It is important for the Engineering personnel to understand the root causes of the defect, as it can be contributed by factors from board design, material procurement to equipment setting and maintenance. With these numerous factors implicating, the engineers involved must be equipped with sufficient knowledge on soldering fundamentals, laminate composition, thermal demands, design geometry, wetting mechanism during wave contact and equipment maintenance. Commonly, many engineers just adopt recommendations based on DOE results and hoping to get consistent good barrel fill, but mostly to their disappointment due to erratic parameter shift. Many engineers approach the problem by tweaking process parameters on fluxing, preheating, solder pot temperature, wave height adjustment and others, it merely be just a containment and not able to achieve consistent good barrel fill. We need a practical approach in tackling this vexing problem. To do that, one needs to know the fundamentals of wettability involving molten solder. The molten solder wicks up the barrel depend critically on the surface tensions of molten solder in relation to the solder interface with component terminals and copper plated holes. Upon discovering of the root causes, then, appropriate engineering solutions are to be implemented, be it equipment upgrade, board re-design, process adjustment or material changes. The course aims to provide a concise description of these factors through simplified notes, shared experiences and interaction in class.
Why Should You Attend:
- There will be adequate time to have our industry experts respond to your questions
- Networking time will allow you to continue discussions following the presentations
- This is one of the best ways to enhance your knowledge and your company's profitability
- Extensive participation from experts from around the world provides for a comprehensive educational experience
- The SMTA reputation ensures high quality technical information that can be put to use immediately
San Diego Chapter: 08-15-18 Material Management 4.0 +
NEOTech, 237 Via Vera Cruz, San Marcos, CA 92078 (760) 737-6777
Webinar: PCB Design, Fabrication and Use from an End User's Perspective +
August 20 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)
Charles Cawthorne, MBDA Systems
Ian Fox, Rolls Royce
Printed Circuit Bare Boards form the fundamental and crucial basis for most Circuit Card Assemblies. However, with the advanced electronics components that are available today, PCBs have to be complex to provide the interconnect for these component types. Given this background, what is the best approach to acquire PCBs that will work and will provide long term reliability?
This webinar, which follows on from the "Guide to Printed Circuit Board Manufacture" from March 2017, gives a more advanced insight into the Design, Test, Qualification, Inspection and Handling of PCBs from a purely high reliability end users perspective. The webinar is aimed at design/manufacturing/process engineers, technicians and trainers.
Definition of PCB Materials
Surface Mount Design Rules
Via Planarisation and Via Protection
Incoming Inspection and Quality Standards
Handling of PCBs from a Drying Perspective
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar
All webinar times shown are UK time – to check your local time in your countries click here
SMT Processes Certification (PRIDE Industries) +
PRIDE Industries Foundation
Roseville , CA
Held at PRIDE Industries Foundation
10030 Foothills Blvd.
Roseville, CA 95747
- August 20 Course (8:30-5pm)
- August 21 ½ day of course + exam
- August 22 All day exam (8:30-5pm)
- Instruction: English
- Test: English
Instructor: Jim Hall, ITM Consulting
Reduced In-House Rate: $915 for members or $970 for non-members.
Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes.
Why You Should Participate
Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
- Enhance your stature in our industry
- Increase marketing value for your company
- Obtain proof of your knowledge and experience
- The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.
Intermountain (ID, UT) Chapter: Boise SMTA Golf Scramble - Aug 21, 2018 +
Shadow Valley Golf Club, 15711 Highway 55, Boise Idaho
Boise SMTA Golf Scramble - Aug 21, 2018
Shadow Valley Golf Club
SMTA Intermountain Chapter
What: SMTA Shadow Valley Golf 2018 - Golf Scramble
When: Aug. 21st Shot gun start 8:00 AM with lunch following
Where: Shadow Valley Course - Boise, Idaho
Team and Individual sign-up deadline Aug. 14th
Team and Hole Sponsor sign-ups also due at that time
We also welcome donations for prizes like closest to the pin, longest drive and others
Team sponsor $350—fees and lunch for 4 (sponsor may provide shirts or caps) Team Sponsor sign.
Hole sponsors: $200 and choice of available hole. Includes one player and hole sponsor sign.
Mulligans: $10 each, Must purchase in advance
Individuals are Welcome!! We will sign you up to a team. Fee is just $65. This includes Green fees, cart, range balls and lunch. Please Join us!
We guarantee you will have a good time!
Contacts to RSVP and for Sponsorships:
David Bell 208-867-6006 or firstname.lastname@example.org
Contact for details about course, map: Shadow Valley Golf Club
15711 Highway 55, Boise Idaho. Course Phone #208-939-6699
SMTA China South Technology and Vendor Conferences 2018 +
Shenzhen Convention & Exhibition Center
The SMTA China cordially invites you to participate in SMTA China South Conference located in Shenzhen 2018. This event, held in conjunction with NEPCON China 2018, will as usual address the industry's most pressing issues in electronics assembly/ manufacturing, industry/technology roadmap, business focus, advanced packaging, practical skill development, emerging technologies, and lead-free & reliability.
Wisconsin Chapter: Wisconsin Chapter - Golf Scramble +
Brown Deer Golf Course: 7625 N Range Line Rd, Glendale, WI 53209
Please RSVP before making Payment!
Click HERE to RSVP Now!!
- Tuesday August 28, 2018 at 8:00 am
- Brown Deer Golf Course: 7625 N Range Line Rd, Glendale, WI 53209
- Description: “Brown Deer Golf Course is a classically designed 18 hole facility with bent grass fairways, tees and greens that has hosted an annual PGA tour event, USGA national championships and now hosts an LPGA Symetra Tour event, the PHC Classic. You can always expect the course conditions to reflect those high standards. The golf courses unique and individual holes are carved out masterfully with a river running throughout the entire course. The course was originally designed by George Hansen and founded in 1929 and was partially redesigned by Andy North and Roger Packard. Brown Deer is truly a must play for any golf lover!
- $40 SMTA Members and $60 for non-SMTA Members
- Scramble: Teams of 4. Each players drive will need to be used at least once. Any threesomes will have option for 1 player to tee off twice. 2 putt maximum to keep up rate of play.
- First Place prize
- 1 Mens and 1 Womens longest drive, closest to the pin, and one longest put.
- 72 Spots available: Please confirm through Josh Casper (email@example.com) or Jana Esselman (firstname.lastname@example.org) if you have a team and you would like to play together. All other teams will be put together by SMTA Staff.
Food and Drink:
- Each player will be provided with 2 complimentary drink tickets.
- Coffee and Donuts provided upon arrival.
- Complimentary Lunch following the Scramble-Vendor Sponsorships: