Calendar of Events

The International Conference for Electronics Enabling Technologies (ICEET), formerly ICSR, is a highly technical three-day event in Toronto, ON, Canada.

Electronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.

The forerunner conference of ICEET, the International Conference for Solder and Reliability (ICSR), grew to be a premier technical conference for all aspects of solders, metallurgy and the solder interconnect process, through the period of conversion to lead-free solder, driven by RoHS and WEEE. The ICEET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, potting and other methods to achieve high reliability in aggressive environments.

Two (2) 90 minute Sessions
June 14 and 15, 2018 1:00pm to 2:30pm Eastern
Presented by:  S. Manian Ramkumar, Ph.D., Center for Electronics Manufacturing and Assembly

Rochester Institute of Technology

Overview:
This course will provide an introductory but hollistic understanding of the surface mount and mixed technology assembly processes for lead based and lead free electronics packaging. Topics include PCBs, assembly types, component types, assembly process, assembly materials, identification of defects, troubleshooting and process control. Design for ease of manufacture and assembly will be discussed throughout the lecture. Tradeoff decisions between different materials and equipment types will also be highlighted. A comparison of lead based and lead free process will be provided, including implementation issues.

Who Should Attend:
Who should attend?
♦ People with very little or no background in SMT
♦ Process, Design, Test and Quality Engineers
♦ Process and Quality Technicians
♦ Operators
♦ Marketing, Sales and Purchasing Staff
♦ Managers

After completing this course, you will be able to:
1. Identify various SMT components, their terminology and nomenclature
2. Understand what a PCB is and also the need for effective thermal management
3. Identify types of mixed technology PCB assemblies and their assembly sequence
4. Understand the influence of design on the ease of manufacturing and assembly
5. Understand thoroughly the entire assembly process and the various parameters that influence it.
6. Understand the influence of various materials such as solder paste, adhesives, flux, etc.
7. Detect assembly process defects and troubleshoot them.
8. Evaluate equipment required for setting up assembly lines
9. Understand Lead Free Implementation and Issues.

June 20, 2018
1:00pm-2:00pm Eastern
Presented by: Bob Wetterman, MIT, BEST Inc.

Complimentary Webinar for Members!

There are numerous masking options available when conformal coating a PCB. The question is: which one should I chose? The answer lies in optimizing a variety of variables including the time it takes, the economics of the build, the material compatibility and the process of coating being employed.

There are several masking options available to process engineers and technicians when it comes to masking of the PCB prior to conformal coating:

• Silicone rubber boots
• 3D printed boots
• Masking tape
• Custom tape dots
• Custom cut tape shapes
• Peelable mask

In addition to comparing and contrasting these various options this “lunch and learn” webinar will address the various considerations a process engineer or technician would have to make when it comes to choosing the best conformal coating masking alternative. One of the considerations is the amount of labor content in the masking technique. The labor content will drive the lead time and cost included to mask and damask the conformal coating keep out areas. Another consideration is material compatibility. Does natural silicone have any impact on the laminate being used? Is the viscosity of the conformal coating material as it is applied allow it to leach underneath the mask? Does the adhesive on the tape leave behind a residue that will be harmful to the long term reliability of the assembly? Another issue is one of process compatibility. Certain masking techniques work with certain conformal coat application methods and others do not. These and other questions will be considered in this lunch time session.

This FREE 60-minute webinar reviews the reasons for masking, the types of masking methods, the “gotchas” in masking for conformal coating and the compatibility with different application methods.

The webinar will be sprinkled with practical application tips to help guide you towards the right masking process for a variety of conformal coating work ahead of you.

About the Presenter:
Bob Wetterman is the principal at BEST Inc. a rework/repair services company in Chicago, IL.  BEST Inc. is a contract rework/repair services provider, solder training and certification center as well as manufacturing a variety of rework/repair/assembly tools such as stencils and reballing preforms. Bob is a BSEE from the University of Illinois and holds several patents in the fields of surface science, industrial controls and PCB rework. He is also a master instructor of IPC-A-610 and is a member of SMTA having been active in several Midwest chapters.

• Take exit 14B to Al-255N/Research Park Blvd
• Take exit Bradford Drive West
• Turn left Explorer Blvd (heading south)
• Turn right into parking lot, merge left and follow parking lot to pond
• Building entrance will be on north of parking lot

• RSVP Link: bottom of this email
• send email to HSVSMTA@gmail.com

Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.

Technical Program Announced!

Technical session topics include:

• What is being Counterfeited - Within and Beyond electronics?
• Are the Standards Adequate to Protect You?
• Panel Discussion - Challenges with AS671 Accreditation--Can it Handle Obsolete Parts?
• Technological Solutions: Tagging, Tracing, Authenticating
• How the US Government Agencies are Reacting
• How to Detect Counterfeit Parts with Confidence
• Bringing Information Security in the Solution Space
• Impacts on Industry and Society

View the program
 

The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.