Calendar of Events
International Conference for Electronics Enabling Technologies 2018 +
Edward Village Markham
Markham , ON L3R 0A3 Canada
The International Conference for Electronics Enabling Technologies (ICEET), formerly ICSR, is a highly technical three-day event in Toronto, ON, Canada.
Electronics products are becoming ubiquitous in many aspects of modern life, including smart devices, internet of everything, wearables and self-driving vehicles, as well as the more established (but still growing areas) of communications, entertainment, medical devices, lighting, automotive, avionics and computing. The growth is largely driven by the continued increase in density of integrated circuits, the applications that utilize the greater functionality, and by steadily decreasing power consumption and cost.
The forerunner conference of ICEET, the International Conference for Solder and Reliability (ICSR), grew to be a premier technical conference for all aspects of solders, metallurgy and the solder interconnect process, through the period of conversion to lead-free solder, driven by RoHS and WEEE. The ICEET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, potting and other methods to achieve high reliability in aggressive environments.
SMTA Ontario Chapter Expo & Tech Forum +
Location: Edward Village Markham
50 East Valhalla Drive
Markham, ON L3R 0A3
Wednesday, June 6, 2018: 10:00am – 3:30pm
- Sponsorship Opportunities:
- Lanyard Sponsor $400/$800
- Bag Sponsor - $400/$800
- Lunch Sponsor - $800
- Refreshment Break Sponsor - $550
Register here to attend the expo only!
Technical conference and workshops not included.
Plan now to join us for free technical presentations, free lunch and the chance to network with leading suppliers to our industry!
ICEET Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.
Wednesday, June 6, 2018: 10:00am – 3:30pm
Expo attendees are invited to attend the following sessions:
Session 3: Reliability
11:00am The Relative World of Harsh Environments
Mike Konrad, Aqueous Technologies
11:30am Designing PCBs for High Reliability Applications
Kathy Nargi-Toth, Eltek USA
12:00pm Laser Projectors Field Reliability Dashboard an Effective Tool to Evaluate, Monitor and Improve Product Reliability
Monika Wieder, Christie Digital
12:30pm Lunch (Truffle Ballroom)
2:00pm The Automated and Digital Factory - Navigating Technology Disruption
Shawn Blakney, Celestica, Inc.
If you'd like to attend other sessions, paid conference registration is required.
Thank You to our Sponsor:
Carolinas (NC, SC) Chapter: SMTA Carolinas Chapter Infosession +
Ohio Valley Chapter: 3rd Annual Member Appreciation Golf Outing +
Raintree Golf Country Club, Uniontown, OH
The SMTA Ohio Valley Chapter is pleased to invite you to participate in our “3rd Annual Member Appreciation Golf Outing”. Golf format is a four person scramble with team prizes and skill awards. Skins challenge $5.00 per player ($20.00 team).
Participation is absolutely “FREE” for SMTA Members and Sponsors. Included are green fees, golf cart, practice range, sleeve of golf balls, Continental Breakfast, lunch at the turn and a Prime Rib dinner.
Winning team prizes, Skill Challenge prizes and Team Skins awards will follow dinner.
Enjoy networking with fellow SMTA members and vendors in a relaxing, fun atmosphere.
“Bring a guest.” Guest golfer - not a SMTA Member: $50.00
You may organize your own four-some or we will pair you up. When registering please use the company field (after listing your company) to enter the names of players you wish to play with.
SMTA Webtorial: SMT Process Fundamentals for Tin-Lead and Lead Free Assembly +
Two (2) 90 minute Sessions
June 14 and 15, 2018 1:00pm to 2:30pm Eastern
Presented by: S. Manian Ramkumar, Ph.D., Center for Electronics Manufacturing and Assembly
Rochester Institute of Technology
This course will provide an introductory but hollistic understanding of the surface mount and mixed technology assembly processes for lead based and lead free electronics packaging. Topics include PCBs, assembly types, component types, assembly process, assembly materials, identification of defects, troubleshooting and process control. Design for ease of manufacture and assembly will be discussed throughout the lecture. Tradeoff decisions between different materials and equipment types will also be highlighted. A comparison of lead based and lead free process will be provided, including implementation issues.
Who Should Attend:
Who should attend?
♦ People with very little or no background in SMT
♦ Process, Design, Test and Quality Engineers
♦ Process and Quality Technicians
♦ Marketing, Sales and Purchasing Staff
After completing this course, you will be able to:
1. Identify various SMT components, their terminology and nomenclature
2. Understand what a PCB is and also the need for effective thermal management
3. Identify types of mixed technology PCB assemblies and their assembly sequence
4. Understand the influence of design on the ease of manufacturing and assembly
5. Understand thoroughly the entire assembly process and the various parameters that influence it.
6. Understand the influence of various materials such as solder paste, adhesives, flux, etc.
7. Detect assembly process defects and troubleshoot them.
8. Evaluate equipment required for setting up assembly lines
9. Understand Lead Free Implementation and Issues.
Intermountain (ID, UT) Chapter: 13th Annual Utah SMTA Golf Scramble for 2018 +
Birch Creek Golf Course, Smithfield, Utah
What: 13th Annual SMTA Golf Scramble 2018
When: June 19th, Tee Time 8:00 AM Shotgun Start with lunch following
Where: Birch Creek Golf Course, Smithfield Utah
We would like to have all Team and Individual sign-ups done by Tuesday June 12th.
Team and Hole Sponsor sign-ups also due at that time.
If you need a sponsor sign made please send a graphics file of your company logo.
Costs: Team sponsor $375. Includes Golf and Lunch for 4 players, and Team Sponsor Sign Hole sponsors: $175. Includes Golf and Lunch for 1 player, and Hole Sponsor Sign. Prize Hole sponsors for Long Drive (Men and Women), Closest to the Hole (Men and Women), and Straightest Drive. Please Provide Prizes for these special holes.
Mulligans: $10 each, Can Purchase Before or At the event.
Individuals are Welcome!! We will sign you up to a team. Fee is just $75.
This includes Green fees, cart, and lunch.
Please Join us! Contacts to RSVP and for Sponsorships:
Gordan Jackman at 435-227-9659 e-mail email@example.com or Robert Winter at 801- 594-7435 e-mail firstname.lastname@example.org
Contact for details about course, map: Birch Creek Golf, Smithfield, Utah 435-563-6825 www.birchcreekgolf.com
Free SMTA Webinar: Consider the options-How should I mask for Conformal Coating? +
June 20, 2018
Presented by: Bob Wetterman, MIT, BEST Inc.
Complimentary Webinar for Members!
There are numerous masking options available when conformal coating a PCB. The question is: which one should I chose? The answer lies in optimizing a variety of variables including the time it takes, the economics of the build, the material compatibility and the process of coating being employed.
There are several masking options available to process engineers and technicians when it comes to masking of the PCB prior to conformal coating:
- Silicone rubber boots
- 3D printed boots
- Masking tape
- Custom tape dots
- Custom cut tape shapes
- Peelable mask
In addition to comparing and contrasting these various options this “lunch and learn” webinar will address the various considerations a process engineer or technician would have to make when it comes to choosing the best conformal coating masking alternative. One of the considerations is the amount of labor content in the masking technique. The labor content will drive the lead time and cost included to mask and damask the conformal coating keep out areas. Another consideration is material compatibility. Does natural silicone have any impact on the laminate being used? Is the viscosity of the conformal coating material as it is applied allow it to leach underneath the mask? Does the adhesive on the tape leave behind a residue that will be harmful to the long term reliability of the assembly? Another issue is one of process compatibility. Certain masking techniques work with certain conformal coat application methods and others do not. These and other questions will be considered in this lunch time session.
This FREE 60-minute webinar reviews the reasons for masking, the types of masking methods, the “gotchas” in masking for conformal coating and the compatibility with different application methods.
The webinar will be sprinkled with practical application tips to help guide you towards the right masking process for a variety of conformal coating work ahead of you.
About the Presenter:
Bob Wetterman is the principal at BEST Inc. a rework/repair services company in Chicago, IL. BEST Inc. is a contract rework/repair services provider, solder training and certification center as well as manufacturing a variety of rework/repair/assembly tools such as stencils and reballing preforms. Bob is a BSEE from the University of Illinois and holds several patents in the fields of surface science, industrial controls and PCB rework. He is also a master instructor of IPC-A-610 and is a member of SMTA having been active in several Midwest chapters.
Huntsville Chapter: Reminder to RSVP - June 2018 Meeting Electrochemical migration (ECM) +
The Huntsville Chapter SMTA and Adtran welcome you on June 26, 2018 from 5:30-7:30pm to bring a discussion of Electro-chemical migration (ECM) and dendritic growth.
Electrochemical migration (ECM), and dendritic growth are becoming more of an issue as electronic assemblies decrease in size while increasing in complexity. While the terms “ECM” and “dendritic growth” are known to many in the industry, the explanation behind them is generally lacking in depth. This presentation will focus on the fundamentals of the ECM and dendritic growth process, and will apply both chemistry and electrical engineering principles to the phenomenon. Understanding these processes better allows one to design and manufacture electronic assemblies that are more robust and reliable.
Speaker Info: David Lober
Education: Bachelor of Chemistry from Rensselaer Polytechnic Institute 2009 Troy, NY
Job Title: Process Chemist
Length of time at Kyzen: 8
David Lober holds a Bachelor of Chemistry from Rensselaer Polytechnic Institute in Troy, Ny (2009). He has been the Process Chemist at Kyzen for 8 years. In his position he does research and development work relating to assessing cleanliness, reliability, corrosion, and chemical analysis primarily in the electronics segment, but some semiconductor work. He has published over 10 papers on these topics, and has several patents in the area of critical cleaning. He is an active member of the IPC and chairs the 5-32c Bare Boards Cleanliness Assessment Task Group, is the vice chair of the 5-32a Ionic Cleanliness Assessment Task Group, and has been involved with the 5-33a ROSE Task Group which has completely revised the Cleanliness Section (Section 8) of JSTD-001 which is currently under ballot. He also is an active participant in several other IPC committees.
5:30 – 6:00 networking
6:00 – 6:30 dinner
6:30 – 7:15 intro & presentation
7:15 – 7:30 wrap-up
Location: Adtran, 901 Explorer Blvd, Huntsville, Al
Lakeland CR on the 2nd floor of the East Tower (Mark C. Smith Conference Center).
All meeting attendees must enter through the South entrance (adjacent to shipping dock).
Directions From I565:
- Take exit 14B to Al-255N/Research Park Blvd
- Take exit Bradford Drive West
- Turn left Explorer Blvd (heading south)
- Turn right into parking lot, merge left and follow parking lot to pond
- Building entrance will be on north of parking lot
$5 for SMTA Members who RSVP by Thursday June 21, 2018
$7 for SMTA Members who Do Not RSVP by Thursday June 21, 2018
$10 Non-Members who RSVP by Thursday June 21, 2018
$12 Non-Members who Do Not RSVP by Thursday June 21, 2018
For members who cannot attend in person, we would like to offer a GoToMeeting option. Please contact us at HSVSMTA@gmail.com
Two ways to RSVP:
- RSVP Link: bottom of this email
- send email to HSVSMTA@gmail.com
Symposium on Counterfeit Parts and Materials-Tabletop Exhibition +
3501 University Blvd East
Hyattsville, MD 20783
**All Sponsorships require an exhibit booth reservation**
Lanyard Sponsor (Limit 1) -$400 (if provided by company/$800 if provided by SMTA) SOLD!
Provide 150 lanyards and they will be the official lanyard for the conference. If you would like us to provide the lanyards, it will be an extra $400. You will receive logo recognition in the show directory, conference website and signage.
Tote Bag Sponsorship (Limit 1)-$400 (if provided by company/$800 if provided by SMTA) SOLD!
Provide your logo on all of the conference attendee bags! If you would like SMTA to provide the tote bags, it will be an extra $400. There will also be recognition in the show directory and website.
Day 1 or Day 2 (Limit 2)-$500
Signage upon entrance to exhibit hall lunch and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.
Refreshment Sponsorship Day 1 or Day 2 (Limit 2)-$350 SOLD!
Signage during PM refreshment breaks upon entrance to exhibit hall and on table tents featured throughout the room. There will also be recognition in the show directory and conference website.
Contact Jenny Ng for available booth space. 952-920-7682 or email@example.com Please note that exhibit traffic will be minimal while symposium is in session.
Click here to view floor plan.
Exhibit space entitles you to:
- 6 ft. Draped table
- One conference pass
- Attendee list
- Breakfast, Lunch & Breaks
- One copy of the conference proceedings
- Download a hard copy of the registration form
Cost to exhibit:
Rates increase $100 after May 31, 2018
Booth type CALCE/SMTA Members Non-Members One table
includes access to Electrical Outlet
$550 $650 One table
no access to Electrical Outlet
Come and visit the exhibits for FREE! Plan to network with leading suppliers working to stop the proliferation of counterfeit parts in the electronics supply chain.
Show Hours Each Day: 10:00am - 3:00pm
Your expo pass gives you access to:
- FREE Panel Discussion "How is AS6171 Being Flowed Down? Challenges with AS671 Accreditation--Can it Handle Obsolete Parts?" (Tuesday, June 26 @12:00pm)
- FREE Lunch
- FREE Refreshment Breaks
If you would like to attend other conference sessions, please register for the conference here.
Conference attendees do NOT need to register for the Expo, your conference registration includes the Expo entrance.
Symposium on Counterfeit Parts and Materials 2018 +
College Park Marriott Hotel & Conference Center
College Park , MD
Changes in electronic supply chain had been fast and furious in the last decades and its impact on the practices of companies is still evolving. It is well understood that, the scourge of counterfeit electronic parts is related to the changes in supply chain but it is only one of the many impacts. This symposium will provide a forum to cover all aspects of changes in the electronic parts supply chain on how an organization performs part selection and management through whole life cycle of the parts. Going beyond anecdotes and examples of counterfeit parts, this symposium focuses on the solutions that are available and are under development by all sectors of the industry.
Technical session topics include:
- What is being Counterfeited - Within and Beyond electronics?
- Are the Standards Adequate to Protect You?
- Panel Discussion - Challenges with AS671 Accreditation--Can it Handle Obsolete Parts?
- Technological Solutions: Tagging, Tracing, Authenticating
- How the US Government Agencies are Reacting
- How to Detect Counterfeit Parts with Confidence
- Bringing Information Security in the Solution Space
- Impacts on Industry and Society
The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA. This symposium is a valuable resource for quality and reliability managers, supply chain managers, brand protection specialists, inspectors, marketing and procurement policy makers, contracts and legal management, security specialists and government agencies. Our focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future.