Calendar of Events
Intermountain (ID, UT) Chapter: Plexus Nampa factory tour and technical presentation +
Plexus Corp, 16399 North Franklin Blvd, Nampa Idaho 83687
Plexus Factory Tour and Technical Presentation
May 1, 2018
Sponsored by the SMTA Intermountain Chapter
What: Plexus Factory Tour and Technical Presentation – Nampa Idaho
When: May 1, 2018 (Tuesday) – 5:00- 7-00 pm
A short Plexus overview starts at 5:00.
Free Pizza and Soda will be served at 6:00 pm (during presentation)
Where: Plexus Corp, 16399 North Franklin Blvd, Nampa, Idaho 83786
New Advances In Humidification Technology, More Than Just ESD Control.
Presentation will be given by:
Richard (Ryk) Williams:
Business Development Manager – Aerospace, Defense & Electronics
|We Are Your Humidification & Evaporative Cooling Experts
MOBILE 509 628 6139 | TOLL FREE 866 NORTEC1
Click on link for full details:
Oregon Expo & Tech Forum +
14200 SW Karl Braun Dr
The cost to exhibit is $450 for a booth and $350 for a table. The cost to exhibit includes: one 5ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Please note: This year both tabletops and booths will be available. Those purchasing a table top please refrain from using banners, screens etc. A $50 discount per booth/table will be offered for multiple spots at one show or one or more in each location.
Please see the Oregon Chapter Page for More Information on Technical Sessions and Expo Materials.
Great Lakes (Chicago) Chapter: Membership Appreciation Event: “Management Overview of the Smart Factory (Industrie 4.0) Principles and affects in Electronics Manufacturing” -By Jay Gorajia +
Wednesday, May 2nd, 2018
|2400 Millbrook Drive|
|Buffalo Grove, IL 60089|
Download the presentation here!
In this workshop, we will investigate what Industrie 4.0 or “Smart Manufacturing” actually is and what the related market and technology drivers behind it that makes significant change to the PCB electronics industry inevitable. We will look at through the supply and demand chain, at what changes need to be made, starting with the consumer, the customer, to understand what their demands are, and what benefits or changes Industrie 4.0 will bring to them and the manufacturers. Manufacturing analytics is core to Industrie 4.0, and its related Cyber-Physical Systems connectivity to better manage delivery, quality and customer integration and collaboration. We look also across the breadth of the electronics manufacturing organization, to see exactly what is required to make a step-change practically possible when adopting the principles of Industrie 4.0, and the related benefits.
About the Speaker:
Jay Gorajia is Director of Consulting, PCB Design and Manufacturing Services, at Mentor Graphics. Jay works with OEMs and contract manufacturers to improve efficiency and help define cost, quality and productivity improvement solutions in design quality, design to manufacturing, manufacturing engineering and production manufacturing. For over 23 years Jay has worked with hundreds of manufacturers and design organizations around the world, resulting in real improvements through a systematic metrics-based methodology. Mr. Gorajia holds a Bachelor’s degree (B.Sc.) in Electronic Engineering and a Masters in Business Administration (MBA) in Technology Management.
He has published a number of articles and White Papers in industry leading technical magazines and industry. conferences including:
Ø"Dynamic Production Planning” - SMTA International Technical Paper - October 2011
Ø“Optimizing process performance” - Global SMT & Packaging Magazine - April 2011
Ø“Benefits of Factory Software Interoperability” - Printed Circuit Design & Fab/Circuits Assembly - August 2010
Ø“Leveraging Manufacturing Solutions with FMEA” - SMTA Technical Publications - October 2012
Ø“Deployment of Manufacturing Operations Management systems” EM Asia – China magazine, April 2007
ØCo- authored “Interoperability: The Next Big Thing in QMS/MES” Surface Mount Technology (SMT), October 28, 2009, (www.electroiq.com)
ØMost recently “Sales and Marketing in a Digital Transformation Reality” – SMT Magazine December 2016, and several more.
He is a regular speaker at SMTA regional conferences and IPC chapter workshops and meetings, and on IPC committees.
|Time:||2:00pm (Arrival & Check-In)|
|2:30 pm (Presentation)|
|3:30 pm (Questions)|
|4:00 pm (SMTA Updates/Survey Time)|
|4:30 pm (Adjourn)|
|2400 Millbrook Drive|
|Buffalo Grove, IL 60089|
|Cost:||Membership Appreciation Event|
|FREE for Members|
|$20.00 for Non-Members*|
|*FREE with registration for SMTA Membership - See link below.|
Become a Member: https://www.smta.org/membership/
RSVP to Gerri Noble at email@example.com or via the SMTA Great Lakes Chapter Webpage.
Puget Sound Expo & Tech Forum +
18740 International Boulevard
Seattle, WA 98188
Exhibit space sold out! Contact Courtney Kalb to be placed on a waitlist.
The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $40 per outlet. Early bird pricing ends on March 29th, 2019!
Please contact SMTA Expo Manager Courtney Kalb with questions or for additional information.
Important Exhibitor Materials:
If you need a hotel room, you can book one at a discounted rate here.
The venue has changed to the DoubleTree by Hilton Seattle Airport Hotel.
Please update your calendar with the new location details.
Free Technical Program & Schedule:
Thank you to our Technical Session Sponsor:
The Ups and Downs of Continuous Improvement
Speaker: Kurt Robertson, MBA, PMP, C.P.M., CPIM-F, Lean Sensei, Six Sigma MBB
From the Toyota Production System (aka Operations Excellence, Continuous Improvement, Lean, Six Sigma, JIT, etc.) to all the excuses, failures and successes that accompany its implementation, this presentation will include both a PowerPoint introduction and audience discussion on the past and future of the proven methodology to make your business better. But for sure, your business is not static; it is either progressing or regressing, and your competitors never rest.
iPhone X - Steve Jobs' iPhone
Speaker: Bill Cardoso, Ph.D., Creative Electron
It’s been 10 years since Steve Jobs introduced the iPhone to the world. Much has happened since then. Over this past decade, the iPhone became a reference design, and the object of desire of a legion of fans who wait anxiously for every launch of the Cupertino company. Undoubtedly the most advanced iPhone in the market today, the iPhone X is a technology marvel. The double stacked boards, dual battery, and a face recognition sensor bring the iPhone X to a whole different level.
In this presentation, we’ll explore these technological advances by a live teardown of the iPhone X. The teardown will be followed by a detailed coverage of the technical details of critical parts of the device. This live teardown will be accompanied by x-ray and CT images of the iPhone X, so the audience will get unprecedented insights on what makes this iPhone tick. More importantly, we will explore the assembly process utilized to put the iPhone X together. This presentation is targeted at a wide technical audience looking for a better understanding on how advance consumer electronics are designed and assembled.
Wisconsin Expo & Tech Forum +
6401 S 13th St,
Milwaukee, WI 53221
The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Please contact Steve Stiller at firstname.lastname@example.org for questions or for additional information.
Click HERE to register to exhibit!
Attendees can register on the SMTA Wisconsin Chapter page.
Please see the Wisconsin Chapter Page for More Information on Technical Sessions and Expo Materials.
Connecticut Chapter: SMTA-CT Networking and Tech Session: Thermal Management Considerations at the Raw Card Level +
Forecasts are strong for US manufacturing and electronics manufacturers are showing evidence of upswing! To celebrate, the SMTA Connecticut Chapter is kicking off our 2018 calendar of events with a fantastic evening at the Dakota Steakhouse in Rocky Hill CT.
that you simply don't want to miss!
Designers and Engineers!
Supply Chain Professionals!
Learners from all Industries!
your name will be entered in to a drawing a door prize valued at $25 or more.
(become a new SMTA member at the event, and your name will be entered twice!!)
PRESENTATION: Thermal Management Considerations at the Raw Card Level
Today's thermal challenges are more challenging than ever - because products are being manufactured smaller, faster, hotter than ever. Jim Barry of PCB Technologies Ltd., an industry veteran with nearly 40 years of engineering, manufacturing and sales in printed circuit board technogies will be presenting on the pros and cons of a variety of heat mitigation techniques. Below is a short exerpt:
"There are many creative ways to remove heat from the PCB, even at the specific component location. Traditionally, heat removal has been done at the component level with finned heat sinks placed over a specific component location. Unfortunately, this creates large, cumbersome designs and/or requires some imaginative design engineering at a box level build. The second most common methodology has been to apply a metal back to the whole PCB which can connect to the chassis and draw away some of the thermal energy. The downside of these two typical techniques is that size and weight of some of these heat removal methods can also pose a challenge, especially when the world of electronic packaging is shrinking, not growing. Smaller packaging and weight are now required for products such as night vision goggles, UAVs and soldier-worn technologies, to name a few. One of the simplest and most common ways that is often overlooked as ......."
Those new to the electronics industry will appreciate Jim's conversational presentation style, while the seasoned design engineers will value the degree of technical content provided. So bring your hunger and bring your questions! It's going to be a great event!
DATE: Wednesday, May 9, 2018
4:30 Cash Bar
5:00 Dinner and Presentation
SMTA Members $35 | Non-Members $40 (payable via PayPal or Credit Card at time of registration)
LOCATION: Dakota Steakhouse, 1489 Silas Deane Highway, Rocky Hill, CT 06067
DINNER: Your choice of Top Sirloin, or Teriyaki Sirloin, or Mesquite Grilled Salmon, Wood-Grilled Chicken, Teriyaki Chicken, or Wood-Grilled Trout
With farm-fresh salad bar, one side, bread, coffee and tea
And if that wasn't enough... Mud-Bomb for dessert! (Coffee Ice Cream with Orio Crust Topped with Chocolate Fudge, Mocha Chream and Almonds)
For more information please contact Sabrina Beck, SMTA-CT Treasurer at 860 309-8501 or Sabrina.Beck@AltekElectronics.com
Or contact the undersigned
Jenny Hopewell, President and SMTA-CT VP Membership & Communications
Manufacturing Services and Solutions
Office: 508 488-6402 | Cell: 617 970-5957 | Email: Hopewell@HopewellCompanies.com | LinkedIn: http://www.linkedin.com/in/jennyhopewell/
Space Coast (Melbourne FL) Chapter: Young Professional Bowling Night Out +
Webinar: Robotic Soldering Using Laser & Iron Soldering in Production +
May 14 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)
Presenter: Bob Willis, SMTA Europe
Practical guide to the use of robotic soldering irons and laser soldering on printed board assemblies will be covered in this webinar along with the use of different alloys and substrates. Most of the work reported is covered in two NPL reports on through hole soldering. When we start to talk about high temperature electronics, it’s not just the solder, it’s all the parts that make up an electronic assembly. Substrates, components, connectors, cables, solder and all of the assembly process needs to be examined in detail. Some newer techniques of soldering can reduce the stress on boards and components and also need through put requirements of modern manufacture. Working at high temperature means between 150-200°C, however, there are many applications that have to work at much higher levels, up to 300°C. Typically, the industries affected by these hostile working conductions include, aerospace, automotive, petrochemical and military. The use of selective soldering is used with high temperature materials and more recently there is a growth in the use of robotic laser and iron soldering. These systems are being used by telecom and automotive producers with different cored wire combinations.
The webinar is a mixture of theory and practical assembly trial evaluation results with current and future technology using selective soldering plus laser and robotic iron soldering processes at NPL National Physical Laboratory. A FREE copy of the High Temperature Electronics Defect Guide will be provided to each delegate. The defect charts can be printed on site for future reference or training. A guide to major reference sources and publication on high temperature manufacture will be discussed and suppliers providing different assembly resources.
Reference books, specification and standards
Product temperature range
PCB substrate choices & specifications and design
Soldering alloy choices
Assembly & soldering options
Setting up and assessment
Process and quality control
Process failures in automated soldering
The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.
All webinar times shown are UK time – to check your local time in your countries click here
Capital (DC) Chapter: What’s New in IPC J-STD-001G and IPC-A-610G? +
By William Graver, Senior Analyst Master IPC Trainer
Mr. William Graver has over 30 years of experience in the PCB and PCA manufacturing industry. Currently, Mr. Graver is a Senior Analyst at NTS’s facility in Hunt Valley, MD (NTS-Baltimore). His main areas of focus are PCB/PCA Failure Analysis and IPC training, for which Mr. Graver holds the following certifications:
· MIT (Master IPC Trainer) IPC-A-600
· MIT (Master IPC Trainer) IPC-A-610
· MIT (Master IPC Trainer) IPC-6012
· MIT (Master IPC Trainer) IPC/WHMA-A-620
Revision G of these key industry standards, IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610 Acceptability of Electronic Assemblies, feature changes that address evolving manufacturing and soldering technologies. The new revisions include expanded hole-fill requirements, expanded SMT requirements including staking, and new certification training and proficiency requirements.
Overall IPC J-STD-001 changes that will be discussed:
- Expanded several sections including Terms and Definitions, Materials, General Soldering and Assembly
- Wires and Terminal Connection: expanded tinning, service loops, orientation
- Space Station symbol where J-STD-001GS has an effect
- Surface Mount Technology: revised criteria for critical placement and solder for some components; tighter requirements for all classes
- Product Assurance added Magnification Aid Applications for Wires and Wire Connections Table
- Wording improved and figures added to align with IPC-A-610 and IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies
- Expanded several sections such as Terms and Definitions and Hardware
- Added magnification requirements
- Clarified Wires and Terminal requirements including referenced tables
- Expanded Surface Mount requirements for several components
- More pictures and tables
- Overview of Amendments including the Space Amendment and the Cleanliness Amendments
- Status of major standards going forward
- IPC/WHMA-A-620C, IPC-A-600J, IPC-6012D
- New certification processes and requirements
Central Texas (Austin) Chapter: CTEA Tech Symposium at ARM May 15, 2018 +
ARM, Building -1, 5707 Southwest Parkway, Austin, TX
Central Texas Electronics Association (Joint Chapter of IMAPS & SMTA Members) Presents:
Electronics Design, Manufacturing & Test Symposium
Tuesday, May 15, 2018
ARM, Building-1, 5707 Southwest Parkway
3:00 - Registration Begins
3:30 - Welcome and Introductions
3:35 - " Security Is the Future of IoT > Mbed Enables the Future ”
Austin Blackstone, Developer Evangelist, ARM
4:05 - " The (Automotive) Problem with Semiconductors ”
David Price, Senior Director, Automotive Control Solutions, KLA-Tencor
4:35 - Break for Networking
4:50 - " Effects of Substrate Material and Package Pad Design on Solder-Joint Reliability of
0.8 mm Pitch BGA ”
Burt Carpenter, Package Technology Integration Lead Engineer, NXP Semiconductors
5:20 - " 14nm Chip Package Interaction (CPI) Technology Development ”
Lei Fu, Principal Member of Technical Staff, AMD
5:50 - Door Prizes Drawing & Closing Remarks
6:00 - Food & Refreshments Served and More Networking
RSVP to Bob Baker at: email@example.com
There is no charge for SMTA and IMAPS members; $10 for all non-members >> (Cash or Check ONLY!)
ARM, Bldg-1 Conference Room, 5707 SW Parkway in South Austin
Midway between MoPac and W. William Cannon Dr
Park in Parking Garage and Enter Bldg-1 from the Garage Down to Lobby
See Map at: (Map to ARM)
In Central Texas, SMTA and IMAPS work together as the Central Texas Electronics Association (CTEA)
Carolinas Expo & Tech Forum +
1707 Hillsborough Street
Raleigh, NC 27605
Exhibit Space is SOLD OUT!
Please contact SMTA Expo Manager Courtney Kalb with any questions or for additional information.
Tuesday, May 15, 2018
Free Program and Technical Schedule:
Thank you to our Breakfast Sponsor:
Speaker: Chrys Shea, Shea Engineering Services
Many SMT operations struggle with “process issues” that are actually solder paste-related, and have been resolved in newer generations of the materials. Nagging defects like tombstones, solder balls, excessive voids and Head-In-Pillow can often be mitigated with a change of solder paste. Newer formulations print better, wet better, endure hot reflow cycles better, and void less than older ones.
Exhibit Hall Opens
AI-Powered 3D Inspection Benefits
Speaker: Mr. David Suh, Koh Young America
Not long ago, 2D inspection was the industry norm, then 3D inspection quickly proved itself. Today, True 3D measurement is even more powerful than 3D inspection, especially when AI power analyzes the real data. But what is the difference between 3D inspection and 3D measurement, and how can AI improve your process?
Thank you to our Lunch Sponsor
The Smart Reflow Oven For the Industry 4.0 Factory
Speaker: MB Allen, KIC
The reflow oven is often considered the black box in the electronic assembly factory. As the industry is trending towards the smart factory to reduce cost of manufacturing while providing consistent quality and new capabilities such as full process traceability, the reflow oven is undergoing a dramatic transformation.
Speaker: John Travis, Nordson DAGE
This presentation will introduce you to some of the cutting edge technologies in Digital XRAY tubes, Detectors, 3D X ray and micro CT. We will also introduce the latest technology in 3D AOI and how those technologies translate into better more efficient defect detection.
Semiconductor Power Electronics Applications and Associated Supply Chain
Speaker: Nick Mescia, PowerAmerica
This presentation will identify the various 14 Manufacturing Institutes, and identifying the various manufacturing institutes with electronic interests. Also identifying the everyday uses of semiconductors. What are WBG semiconductors and their properties, and their benefits over silicon semiconductor technology in power applications. Identifying the possible uses of WBG technology and the establishing an associated overview supply chain (from wafer fab, component packaging, other power required components (magnetics, power connectors, printed circuit board (PCB) fabrication with heavy copper and possible embedded heat pipes for heat dissipation) for the possible power product build of material (BOM) for the OEM to design a power product, and including both the PCBA and associated box / product build for the power users). Finally an in depth detailed supply line flow identifying both current and possible supply chain members, which is still being established.
Exhibit Hall Closes
San Diego Chapter: 05-16-18 Workforce and Economic Development Roundtable +
MIra Costa College Technology Career Institute, 2075 Las Palmas Drive Carlsbad, CA 92011
Jennifer Schoeneck | Economic Development Manager
San Diego Regional EDC |
Linda Kurokawa | Director, Community Education & Workforce Development
Mira Cost College
RSVP by 05/14/18 Link: smta.org/chapters/rsvp.cfm?BEE_ID=4415
Location: MIra Cost College Technology Career Institute, 2075 Las Palmas Drive Carlsbad, CA 92011
Best Practices in Electronic Assembly Processes - Carolinas Chapter Tutorial Program +
NC State Centennial Campus
Raleigh , NC 27606
Instructor: Phil Zarrow, ITM Consulting
Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!
You have the responsibility and resources to improve the productivity of an assembly operation…what do you do? This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line engineers involved in manufacturing, design and quality engineering.
- Optimization Objective
- Getting the Most Productivity from an Existing Line
- Definition of "Best Practices"
- Process Characterization
- Best Practices in the Assembly Process
- Solder Paste Printing Process Best Practices
- Pick and Place Best Practices
- Reflow Soldering Best Practices
- Wave Soldering Best Practices
- Selective Soldering Best Practices
- Cleaning vs No-Clean Considerations and Best Practices
- Q & A
Who Should Attend:
This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies.
About the Instructor:
Phil Zarrow has been involved with PCB fabrication and assembly for more than thirty-five years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world. During his tenure as Director of Technology Development for GSS/Array Technology, Mr. Zarrow was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.
Since forming ITM Consulting in 1993, Phil Zarrow has helped numerous clients in such areas as
- SMT Implementation and Assembly facility set-up
- SMT Assembly and Soldering Failure Analysis
- EMS/Supplier Process and Quality Assessment Audits
- Counterfeit Component Avoidance and Interception Programs
- Manufacturing yield improvement
- Equipment Evaluation and Selection
- No-clean and lead-free solder paste evaluation and process implementation
- SMT Manufacturing Process Audits and process improvement
- On-site training for all levels of personnel
- Design for Manufacturability (DFM) specification development
- Reflow of Through-hole feasibility, development and implementation
- Implementation of new component packages including QFN, BGA, CSP and Flip-Chip
- SMT process equipment benchmark testing and evaluation
- SMT product development
- Lead-free Process Implementation and Optimization
- Technical evaluations related to business acquisitions and mergers
- Technical assistance in legal disputes
Mr. Zarrow is a popular speaker and workshop instructor. He has chaired and instructed at numerous seminars and conferences in North America, Europe, and the Pacific Rim. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of the book, "SMT Glossary- Terms and Definitions". Mr. Zarrow holds two US Patents concerning PCB fabrication and assembly processes and audit methodologies.
Phil is a member of IPC, SME, IMAPS, a co-founder of ITM Consulting, and is a past national level officer and national director of the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders’ Award (2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forefront" and “Better Manufacturing” columns. He is currently producer and co-host of IPC Update's “Boardtalk” audio program.
This event is conveniently scheduled one day after the SMTA Carolinas Expo, so plan an extra day to get the most out of your trip.
If you require a hotel room, we have negotiated a block of rooms at the DoubleTree Raleigh Brownstone (the location of the Expo on 5/15, and less than a mile from NCSU) for May 14, 15, and 16. Click HERE to book your hotel room. Discounted rates expire on 4/27/18.
Contact Karen Frericks at 952.920.7682 with questions.
Medical Electronics Symposium 2018 +
University of Dallas
Dallas , TX
SMTA, INEMI, and MEPTEC have joined forces to again host this international conference, focusing on advances in electronic technologies and advanced manufacturing, specifically targeting medical and bioscience applications. Last year's conference attracted about 200 attendees and more than 30 exhibitors. Prior to last year, MEPTEC's and SMTA's conferences were held in Phoenix, Arizona and Milpitas, CA, respectively, drawing technology experts, entrepreneurs and service providers that work in this niche technology space. Typical applications within this space involve implantable defibrillators, neurostimulators and drug delivery, interventional catheters, pillcams, ultrasound transducers, hearing aids, biosensors, microfluidics, wireless communications, as well as future diagnostic and treatment solutions that may use stretchable electronics, microelectromechanical systems (MEMS) or nanoelectromechanical systems (NEMS).
Click here to view the program.
Panel Discussion: Challenges and Opportunities
Thursday, May 17 | 12:05pm
E. Jan Vardaman, TechSearch International
Chuck Richardson, iNEMI
Distinguished panel members include:
- Dale Lee, Plexus
- Don Banks, Abbott
- Peter Tortorici, Ph.D., Medtronic
- Robert Rennaker, Ph.D., The University of Texas at Dallas
- Walter Voit, Ph.D., The University of Texas at Dallas
Join us for complimentary UT Dallas Facility Tours!
Wednesday, May 16 | 6:00-7:00pm
Sign up when you register for the conference. More information and details to follow.
Sensorizing and Connecting Medical Devices
Cory Forbes, CTO, Nypro
The digital revolution is upon us and Connected Devices have become ubiquitous, medical devices are quickly catching up. Integrating the hardware into evolving product form factors and streamlining the data collection and the analytics layers of the IoT ecosystem across different domains (smart retail, hospitality, healthcare, safety, etc.) can help enhance the ROI of the solution. A complete IOT ecosystem consists of Users, Organizations, Devices, Sensors, Gateways, Data and Analytics wrapped in a seamless user experience. The success of such an ecosystem depends on innovative and intelligent integration of these components and effective deployment driving meaningful output. Some examples of such integration are discussed in this presentation to provide a window into the opportunities to integrate sensors into previously passive or non-sensorized medical devices. While there are several subsystem components the presentation outlines opportunities and challenges for enabling electronics integration leveraging current and future technologies supporting digitization of healthcare devices and enhancing related services.
Cory Forbes serves as the Chief Technology Officer of Nypro, A Jabil Company and leads the global product development, technology and program management teams. Nypro’s teams engage with the worlds leading OEM’s in the Diagnostic, Medical Device, Pharmaceutical, Test & Measurement and Consumer Health product domains. Cory has been with Jabil for more than 14 years and has held leadership positions in manufacturing, business management, supply chain, environmental design and product development. He received his Bachelors of Science Degree in Mechanical Engineering from the University of Alberta and has worked professionally in Canada, Brazil and the United States for Nortel Networks, Jabil and Nypro.
Robotic Surgery: Where Are the Opportunities?
Kemp H. Kernstine, Sr., M.D., Ph.D., Division of Thoracic Surgery, UT Southwestern Medical Center
Abstract to follow.
Sensors for Medical Applications: Unlocking the Value
John Burnes, Medtronic Technical Fellow and the Director of Implantable Core Teams, Cardiac Patient Monitoring and Diagnostics, Medtronic
This presentation will review the landscape of sensor technology and potential applications to healthcare. New sensor technology for medical and wellness applications has grown exponentially through both implantable and external form factors. These sensors provide a valuable first step to improving health outcomes. Systems incorporating these sensors will be reviewed to highlight the role of not only sensors, but also information technology, patients, clinicians, clinical evidence, and payers in creating solutions that are widely adopted and can improve health outcomes. True value that improves health, better manages chronic disease, and/or guides clinical action will come from systems that guide action with minimal patient or clinician interaction.
John Burnes is a Medtronic Technical Fellow and the Director of Implantable Core Teams in the Medtronic Cardiac Patient Monitoring and Diagnostics division. He received his PhD in Biomedical Engineering from Case Western Reserve University with his thesis on Electrocardiographic Imaging for Interpretation of the Electrical Activity of Diseased Hearts. He has worked at Medtronic for 17 years in Research and Development roles where he has developed new algorithms for cardiac resynchronization therapy and has led programs focused on new heart failure therapies, obesity therapies, and implantable cardiac monitoring for dialysis patients. John is currently leading the development of the next generation of Insertable Cardiac Monitors.
SMTA Webtorial: Tin Whisker – All You Should Know +
Two (2) 90 minute Sessions
May 17 and 18, 2018
1:00pm to 2:30pm Eastern
Presented by: Dr. Jennie S. Hwang, H-Technologies Group
For the recent years, concerns about tin whiskers have been intensifying although tin whisker issue and its potential mishaps have been recognized for more than six decades in electronic, electrical and industrial applications. The webtorial provides a holistic coverage on relevant aspects of tin whiskers from both physical/phenomenal occurrence and fundamental scientific perspectives. The webtorial also explains why the tin whisker propensity under a study should be concluded with a specific alloy composition in conjunction with a specific system; and why a reference point is needed. Tin whisker mitigating measures and their relative effectiveness will be highlighted. Your questions and issues for solutions and discussions are welcome.
Main Topics for Part 1:
- Definition & clarification;
- Physical phenomena;
- Reference point;
- Causes and factors;
- Concerns & impact;
- Case Study.
Main Topics for Part 2:
- Test conditions;
- Mitigation remedies;
- Relative effectiveness of mitigating measures;
- Plausible mechanism;
- Tin whisker vs. tin pest;
Who Should Attend:
The webtorial provides a working knowledge to all who are concerned with or interested in tin whisker and related issues in electronic packages and assemblies including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.
About the Instructor:
Dr. Hwang, a pioneer and a major contributor to the implementation of Surface Mount manufacturing since its inception as well as to lead-free electronics, brings to the webinar her 35+ years experience in hands-on production and as an advisor to OEMs, EMS and Defense programs. She has provided solutions to many challenging problems - from production yield to field failure diagnosis to high reliability issues. Among many honors/awards are the U.S. Congressional certificate of Recognition and Achievement, induction into WITI International Hall of Fame, named “R&D Star-to-Watch” by Industry Week, YWCA Women of Achievement Award; induction into the National Academy of Engineering. She is the author of 500+ publications and several ground-breaking books on SMT manufacturing and lead-free technology and manufacturing, and is an invited speaker in numerous international and national events. Additionally, she has served on the Board of NYSE Fortune 500 companies, and on various civic, government and university boards and committees. She chairs the Board of the Assessment of Army Research Laboratory of DoD, of the National Institute of Standard and Technologies, and has been an advisor and a reviewer of government programs (DoD, NASA, NIST, etc.) and various publications. She also serves on the National Manufacturing and Materials Board, National Laboratory Assessment Board, and Board of Army Science & Technology. Her formal education includes Harvard Business School Executive Program and four academic degrees (Ph.D. in Metallurgical Engineering & Materials Science, M.S. in Physical Chemistry, M.S. in Liquid Crystal Science, B.S. in Chemistry). She has held senior executive positions with Lockheed Martin Corp., SCM Corp, Sherwin Williams Co, and International Electronic Materials Corp. She is president of H-Technologies Group and is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.
South East Asia Technical Training Conference on Electronics Assembly Technologies 2018 +
Kuala Lumpur Malaysia
Due to the announcement from the Malaysian government regarding election day being held on May 9th the SEMICON Southeast Asia Show, and subsequently the SMTA SEA Technical Conference on Electronics Assembly, has been postponed. We sincerely apologize for any inconvenience this may have caused.
Rescheduled Event Dates:
May 22, 2018 - SMTA One-Day Program at SEMICON Southeast Asia
August 14-16, 2018 - SMTA SEA Technical Conference on Electronics Assembly (Three-Day Program) co-located with SMTA Penang Expo
Program and Registration to follow.
The Southeast Asia Technical Conference on Electronics Assembly is a highly technical three-day event that is focused on today's most important and timely issues. The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.
The conference is "claimable from HRDF under SBL scheme."
Why Should You Attend:
- There will be adequate time to have our industry experts respond to your questions
- Networking time will allow you to continue discussions following the presentations
- This is one of the best ways to enhance your knowledge and your company's profitability
- Extensive participation from experts from around the world provides for a comprehensive educational experience
- The SMTA reputation ensures high quality technical information that can be put to use immediately
Silicon Valley (San Jose) Chapter: Printed Electronics/ Flex Hybrid/ Wearables/ E-Textiles +
NextFlex: 2244 Blach Pl Suite 150, San Jose, CA 95131
Biography: Brian J. Toleno, Ph.D. is currently a Principal Material Scientist at Microsoft working on mixed reality devices, in Mountain View, California. In this role Brian works with the design teams in evaluating and selecting materials for use in these next generation devices. Prior to this role Brian was the Director of Global Product Management for Henkel Electronic Materials, LLC in Irvine, California where he managed the underfill and encapsulant business. Brian obtained a Ph.D. in analytical chemistry from Penn State University, and his B.S. in chemistry from Ursinus College. Brian is an active member of and is also a frequent speaker and contributor to SMTA. Brian has written courses on underfill materials, Pb-free soldering, and failure analysis., and two chapters for electronic engineering handbooks on adhesives and materials.
Speaker: Dr. Bill Cardoso, CEO, Creative Electron
Abstract: It has been 10 years since Steve Jobs introduced the iPhone to the world. Much has happened since then. Over this past decade, the iPhone became a reference design, and the object of desire of a legion of fans who wait anxiously for every launch of the company. The most advanced iPhone in the market today, the iPhone X has double stacked boards, dual battery, and a face recognition sensor bringing the phone to a whole different level.
The presentation will explore these technological advances by a live teardown of the iPhone X. The teardown will be followed by a detailed coverage of the technical details of critical parts of the device. This live teardown will be accompanied by x-ray and CT images of the phone, so the audience will get unprecedented insights on what makes the phone tick. The assembly process utilized to put the product together will be explored. This presentation is targeted at an audience looking for a better understanding on how advanced consumer electronics are designed and assembled.
Biography: Bill Cardoso started his first company at 17 in Brazil. He later worked at the Fermi National Accelerator Laboratory (Fermilab) for 10 years, then started his X-ray manufacturer systems company in the US where he leads a team of engineers who design and manufacture the systems. He has BS, MS, and PhD in Electrical and Computer Engineering and a MBA from University of Chicago. He is a recipient of the Outstanding Alumnus Award from IIT, and sits on the technical committees of SMTAI, SMTA Counterfeit Conference, and SMTA LED Conference, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium. Bill has written two books and over 150 technical publications.
Abstract: Flexible Hybrid Electronics (FHE) have garnered a significant amount of attention recently. While there’s ample hype, there’s also a degree of perplexity regarding the current state of technology and it’s future potential. For example: What exactly constitutes an FHE device? Where is it used (a.k.a. what’s the “killer app?) And, of specific interest to SMTA members, how are they assembled (profitably) in high volume? This presentation tackles both the opportunities and challenges of the emerging FHE field by exploring market drivers and technology developments with emphasis on addressing constraints to high volume manufacturing (HVM).
Biography: Andy Behr is a Technology Manager with Panasonic Electronic Materials Division. He leads a research and marketing team based in Silicon Valley that that develops leading-edge materials for electronics and other emerging applications. A significant portion of his role is technology and business scouting which involves “triangulating” strategic level market demands, business drivers and technology advancements to direct enabling materials development. Andy holds a bachelor degree in biology and a master’s degree in business. He has more than twenty-five years of experience in material technologies such as photo resists, adhesives, encapsulants, conductive materials, fluoro-chemicals, abrasives, films and tapes. Andy began his career in research and has subsequently held positions in marketing and leadership.
eSmart Factory Conference +
Plug and Play Tech Center
Sunnyvale , CA 94085
eSmart Factory conference will be held on May 24, 2018 at the Plug 'n Play Tech Center in Sunnyvale, CA, USA.
Software Systems & Process • Robotics & Cobots • 3D Printing & Additive Manufacturing
Call for Participation
You are invited to share your research at the conference. Abstracts are due in February of 2018. Presentations will be due in April.
Strategically located and easily accessible from most of the major intersections, Plug and Play Tech Center in Sunnyvale serves as the model on which our outstanding brand and reputation has been built.
Tampa Bay Chapter: SMTA Membership Drive and Appreciation Night- May 31st +
Threshers Ball Park- Spectrum Field- Clearwater, FL
Come join us for a Membership Drive and Appreciation Night at Spectrum Field in Clearwater on May 31st to watch the Threshers take on the Fort Myers Miracle. All non-members attending will receive a ticket when they register at the meeting. From those tickets we will pull one and the non-member holder of that ticket will be given an SMTA Membership free of charge.
Tim O'Neill (see biography here) from AIM solder will be giving his paper on the following topic:
The choices for solder alloys is expanding rapidly as new application requirements materialize revealing the limitations of existing lead-free alloys. In this presentation attendees will gain a better understanding of the evolution of lead free solder alloys, the limitations of today’s common alloys and what the solder industry is offering as next generation materials.
The meeting will begin promptly at 5:45 pm, the game starts at 7pm.
Price for event is $25. This includes tech session, food, drink, and adult beverages as well as ticket to the Clearwater Threshers vs Fort Myers Miracle game from a sky box.
We hope to see you all on May 31st!