Calendar of Events
Space Coast (Melbourne FL) Chapter: April 4, 2018 SMTA Space Coast Chapter Technical Meeting +
Dallas Chapter: Dallas Expo and Tech Forumn - April 10 +
Plano Event Center
Click Here to Register for the Dallas Expo and Tech Forum!
Are you a...
- Manager of Design or Manufacturing
- Process engineer
- Design Engineer
- Supply Chain Professional
- Test Engineer
- Manufacturing or Test Technician
The Dallas Expo has everything you need to do with Design and Manufacturing of Electronics!
- Date: Tuesday, April 10th, 2018
- Time: Doors open at 8am
- Location: Plano Event Center (2000 E. Sprint Creek Parkway, Plano, TX 75074)
- Food: Complementary Lunch Buffet
- More info: smta.org/expos/#dallas
- Questions? Call Kaitlyn Schmiel at 952-920-7682
- Material Management 4.0
- The Quest for a Zero Defect Line
- A Mindset for Successful Application of the Toyota Production System
- Impact of Stencil Foil Type on Solder Paste Transfer Efficiency for Laser Cut
Thank you, sponsors!
Breakfast Sponsor - Henkel
Technical Sessions Sponsor - NCAB Group
Lunch Sponsor - NPI Technologies
Door Prize Sponsor - SVTronics
SMT Processes Certification (Ducommun In-House) +
Appleton , WI
- April 10 Course (8:30-5pm)
- April 11 ½ day of course + exam
- April 12 All day exam (8:30-5pm)
- Instruction: English
Instructor: Jim Hall, ITM Consulting Reduced In-House Rate: $915 for members or $970 for non-members. Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
- Enhance your stature in our industry
- Increase marketing value for your company
- Obtain proof of your knowledge and experience
- The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.
Heartland (Kansas, Missouri) Chapter: Re-scheduled SMTA Heartland: The Incredible Shrinking World Of Electronics – Are Traditional DFM, DFR, DFF, … Methods Obsolete? +
180 Room (11944 S Strang Line Rd, Olathe, KS 66062)
THIS MEETING HAS BEEN RE-SCHEDULED FOR WEDNESDAY, APRIL 11, 2018.
The SMTA Heartland Chapter is excited to announce our first meeting of 2018 featuring a presentation by Dale Lee (The Incredible Shrinking World Of Electronics – Are Traditional DFM, DFR, DFF, … Methods Obsolete?) and great BBQ at the renowned 180 Room next to Joe's KS BBQ!
This is sponsored in part by donations from Lorenz Sales and Kysen.
Price: $25 Non-Members, $15 Members
Please RSVP as soon as you can!
This meeting will be Wednesday evening April 11, 2018. The doors will open at 5pm and the dinner/presentation will be from 5:30pm-7:30pm. This will be a great chance to network, enjoy some great BBQ and drinks as Dale Lee presents his discussion on The Incredible Shrinking World of Electronics!
Topic of discussion:
Today’s electronic component packaging technologies of smaller packages (0201/01005/008003), finer lead pitch (0.4/0.35/0.3/…), bottom terminated components (QFN/LGA) and printed circuit board designs (high layer counts, finer lines, via in pad (VIP), increased copper thicknesses, copper routing, …), increased thermal sensitivity, trailing component, fabrication and assembly industry standards have impacted traditional assembly processes with addition of tight solder application, component placement, thermal management and soldering constraints. Using traditional, simplified mass production techniques are not be sufficient to achieve a high-yielding manufacturing process. This presentation will highlight elements of the impacts of these technologies on reliability and yield when not properly addressed in the design/assembly/inspection-test process, impacts of thermal connections on through-hole and surface soldering processes, introduce the elements of design for matched process (DFMP), and provide examples of several opportunities within the DFMP for yield improvement through manufacturing tooling design, SMT and PTH assembly process matching. The concept of manufacturing, test, reliability by design (XBD) will be presented.
What you will learn:
• Component packaging impacts
• PCB design impacts and industry standards limitations
• SMT and PTH solder design impacts
• Components with thermal management impacts:
- Component design
- PCB Thermal balance: X, Y and Z axis
- Trace routing
- Equipment limitation/tolerance
- PCB array tolerance
- Process tooling design
• Paste volume, thermal shock SMT and PTH, reflow process warpage
• Cleaning impacts
• Compatibility issues, low stand-off components
Dale is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields.
Dale has been involved in surface mount design, package & process development and production for over thirty years in various technical and managerial positions. These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of CSP & BGA packages, PCB & PCBA support, DFM/DFX analysis of flex, rigid-flex & rigid PCB/PCBA’s including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications for consumer products, defense/aerospace and medical devices.
Dale has authored, instructed and presented frequently on topics including advanced SMT packaging, PCB and SMT design, assembly, cleaning, DFM/DFX and rework. He is a past recipient of the Surface Mount Technology Association’s “Excellence in Leadership” award. He has been very involved with multiple industry associations and activities including SMTA, INEMI and IPC.
Senior Staff DFX Strategy Engineer
Plexus Engineering Solutions
120 Main Street
Neenah, WI 54956
Houston Expo & Tech Forum +
9401 Knight Road
Houston, TX 77045
The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $25 per booth. Early bird expires on March 15, 2018!
Click here for Ad and Sponsorship opportunities!
Important Exhibitor Materials:
Please contact SMTA Expo Manager Courtney Kalb with questions or for additional information.
Free Technical Program & Schedule:
Speaker: Bill Cardoso, Ph.D., Creative Electron
It’s been 10 years since Steve Jobs introduced the iPhone to the world. Much has happened since then. Over this past decade, the iPhone become a reference design and the object of desire of a legion of fans who wait anxiously for every launch of the Cupertino company. Undoubtedly, the most advanced iPhone in the market today, the iPhone X is a technology marvel. The double stacked board, dual battery, and a face recognition sensor bring the iPhone X to a whole different level.
In this presentation, we will explore these technological advances by a live teardown of the iPhone X. The teardown will be followed by a detailed coverage of the technical details of critical parts of the device. This live teardown will be accompanied by X-ray and CT images of the iPhone X, so the audience will get unprecedented insights on what makes this iPhone tick. More importantly, we will explore the assembly process utilized to put the iPhone X together. This presentation is targeted at a wide technical audience looking for a better understanding on how advance consumer electronics are designed and assembled.
Exhibit Hall Opens
Speaker: Timothy O'Neill, AIM Solder
The choices for solder alloys are expanding rapidly as new application requirements materialize revealing the limitations of existing lead-free alloys. In this presentation, attendees will gain a better understanding of the evolution of lead free solder alloys, the limitations of today’s common alloys and what the solder industry is offering as next generation materials.
Thank you to our Lunch Sponsor:
Speaker: Paul T. Vianco, Sandia National Laboratories
The development of advanced electronic packaging technologies – die materials, molding compounds, printed circuit board substrate, solder alloys etc. – is rapidly outpacing the capacity for empirical testing to provide adequate reliability data towards the design, manufacture, and fielding of components, printed wiring assemblies (PWAs), and next level sub-assemblies. Moreover, the increased reliance on electronics across different product lines has required reliability analyses to address a wider range of accelerated aging tests and service environments. Sandia recognized the challenges of this scenario and, as such, placed an emphasis on the development of computational models to predict the long-term reliability of advanced electronic packaging technologies. Although the expressed focus of these development efforts has been on solder joint reliability, the underlying toolset has been applied to such topics as die cracking, molding compound delamination, as well as the survivability of PWAs when exposed to shock and vibration conditions.
This presentation will describe the development of the computational modeling tools currently being used to support design decision for advanced, high-reliability electronics. The model predictions have been used to introduce bottom terminated components (BTCs) as well as stacked package components in such hardware. The numerical approach has been instrumental for documenting the long-term performance of alternative solder interconnections. An offshoot of this effort, which is currently being explored at Sandia, has been to predict the effects of Au embrittlement and Pb-contamination on solder joint performance and reliability. Several case studies will be presented to illustrate the predictions provided by computational modeling capability and its role in multiple applications.
Huntsville Chapter: April 2018 Meeting An Evolution of Lead Free Solder Alloys +
STI Electronics 261 Palmer Rd, Madison, AL 35758, USA
The Huntsville Chapter SMTA and STI welcome you on April 17, 2018 from 5:30-7:30pm to bring a discussion of the evolution of lead free solder alloys.
If you are an SMTA member and cannot join us at STI, but would like to conferenece into the discussion, please contact HSVsmta@gmail.com and we will send the meeting log-in information.
Timothy O'Neill is the Technical Marketing Manager for AIM Solder. AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries.
Operating out of AIM U.S. Headquarters, Mr. O'Neill is responsible for developing and optimizing product and technical information, collaborating with complimentary suppliers and equipment manufacturers and ensuring AIM’s products exceed the end users expectations and meet market requirements.
Mr. O'Neill is also a technical writer and presenter for industry trade publications and events and has been recognized as a Speaker of Distinction by the SMTA.
Mr. O’Neill is a Certified IPC Specialist, has a B.A. from Assumption College and post-graduate studies in education. He began his career in 1994 with Nordson EFD, heading their business development of fine pitch solder paste dispensing technology. He joined AIM in 1997 and has since assisted many clients with production challenges, specializing in Pb-Free process development and material selection.
Due to ITAR, a photo ID will be required to enter the STI Electronics facility. We will need to know in advance if you are not a US citizen.
5:30 – 6 networking
6 – 6:30 dinner
6:30 – 7:15 intro & presentation
7:15 – 7:30 wrap-up
Location: 261 Palmer Rd, Madison, AL 35758
Directions From I565:
- Take the Wall-Triana Hwy exit toward Madison Blvd / Madison
- Keep straight onto Sullivan St.
- Turn left onto Palmer Rd
- Arrive at 261 Palmer Rd, Madison, AL 35758
Dinner : Boxed lunches from Apple Lane Farms and drinks will be available for:
$5 for SMTA Members who RSVP by Thursday April 12, 2018
$7 for SMTA Members who Do Not RSVP by Thursday April 12, 2018
$10 Non-Members who RSVP by Thursday April 12, 2018
$12 Non-Members who Do Not RSVP by Thursday April 12, 2018
Two ways to RSVP:
SMTA Webtorial: Stencil Printing Process and Solder Paste Inspection – An In-Depth Look +
Two (2) 90 minute Sessions
April 18 and 19, 2018 1:00pm to 2:30pm Eastern
Presented by: S. Manian Ramkumar, Ph.D., Center for Electronics Manufacturing and Assembly
Rochester Institute of Technology
The stencil printing process is the most critical process in surface mount electronics assembly. It tremendously influences the quality of the final PCB assembly. This course will provide a thorough understanding of the print process for lead based and lead free solder paste print applications. Topics include an in-depth look at stencils, solder paste, squeegee, process parameters, process characteristics, inspection techniques, defect identification and corrective actions. Participants in this course are sure to acquire a sound understanding of the solder paste print process and its influence on yield. A brief discussion on the use of this process for adhesive print applications is also included.
Who Should Attend:
♦ Process, Design, Test and Quality Engineers
♦ Process and Quality Technicians
After completing this course, you will be able to:
1. Understand the stencil printing process and the process parameters, thoroughly.
2. Understand the importance and the influence of solder paste, flux, temperature, humidity, board support and machine setup.
3. Evaluate materials such as paste, stencil and squeegee for efficient printing
4. Understand the various solder paste constituents and types of paste
5. Specify stencils, solder paste and printer requirements for various applications
6. Understand Stencil construction and features for efficient paste transfer
7. Understand squeegees and the recent advances in print technology
8. Evaluate in-coming raw materials and procedure for qualifying vendors
9. Understand the print process for adhesive applications
Ohio Valley Chapter: Introduction to Statistics, DOE and SPC for Lean Six Sigma Meeting with Dr. Lasky +
Corporate College East, Warrensville Heights, Ohio
SMTA China East Technology and Vendor Conferences 2018 +
Shanghai World Expo Exhibition & Convention Center
Technology Workshop: 23 April 2018
Technology Conference: 24-25 April 2018
Vendor Conference: 25-26 April 2018
Shanghai World Expo Exhibition & Convention Center
The SMTA China cordially invites you to participate in SMTA China East Conference located in Shanghai 2018. This event, held in conjunction with NEPCON China 2018, will as usual address the industry's most pressing issues in electronics assembly/ manufacturing, industry/technology roadmap, business focus, advanced packaging, practical skill development, emerging technologies, and lead-free & reliability.
Monday 23 April
On Monday 23 April 2018, renowned expert Lin Dong, Artesyn Embedded Technologies, will instruct a full-day workshop on Implementation of Intelligent SMT Warehouse. View the complete workshop description in English and Chinese.
(Tuesday 24 April and Wednesday 25 April)
Electronics in Harsh Environments Conference +
Crowne Plaza Amsterdam - Schiphol
Amsterdam 2132 HZ Netherlands
Building on the successful Contamination, Cleaning and Coating Conference in 2017, SMTA Europe will host the Electronics in Harsh Environments Conference on 24-26 April 2018 in Amsterdam, Netherlands. The conference will focus on building reliable electronics used in power electronics and harsh environments. Thermal, power and signal integrity requirements can present challenges when on devices that operate within harsh environments. Component integration, paired with a growing complexity of the package architectures, larger form factors and higher interconnection densities increase the risk of in-field failures. Over powering or over heating of a device can have serious consequences including internal package failure, down-stream device errors and second level interconnect solder joint failures. Soldering residues are more problematic, and if not understood, can result in both intermittent and complete device failure. This conference tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. Specific topics include building reliable high density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high temperature soldering, solder material advances, and new standards will be presented. Contact Tanya Martin, email@example.com, with questions or comments.
Electronics in Harsh Environments Expo +
Location: Crowne Plaza Amsterdam - Schiphol
Amsterdam 2132 HZ
Tuesday, April 24: Afternoon
Wednesday, April 25: Full Day
Thursday, April 26: Full Day
Exhibition sold out!
Sponsorship opportunities still available!
Exhibit space entitles you to:
- 6 ft. draped table
- Two chairs
- One technical conference pass (a $600+ value!)
- Electronic attendee list (sent after the conference)
- Directory listing
- Reception Sponsor - $500/€425 (limit 2)
- Lunch Sponsor - $500/€425 (limit 3)
- Refreshment Break Sponsor - $300/€250 (limit 4)
Lanyard Sponsor $200/$400(SOLD!)
Empire Expo & Tech Forum +
441 Electronics Parkway
Liverpool, NY 13088
The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet.
Important Exhibitor Materials:
Click HERE for discounted hotel rates
Please contact SMTA Expo Manager Hannah Funk with questions or for additional information.
Free Technical Program & Schedule:
9:00am - 9:30am
Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat
Speaker: Jason Fullerton, Alpha Assembly Solutions
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.
Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.
A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
9:30am - 10:00am
Identifying Defects on BTC Assemblies with X-ray Analysis
Speaker: Bill Cardoso, Ph.D., Creative Electron
The use of x-ray inspection in the electronics industry has gained wide adoption in the past 20 years, driven mainly by the development and use of bottom terminated components (BTC). The use of ball grid arrays (BGA), for example, allowed the development of standards and guidelines that dictate the maximum void size in each ball. In consequence, x-ray machine manufacturers developed solutions that address these requirements to became an integral part of the quality assurance function of modern electronic manufacturers.
However, as new x-ray technologies are introduced – from new algorithms to new hardware – users are faced with a growing range of options to choose from. Users need a solid technical background to understand these options to make an educated decision when acquiring x-ray inspection capabilities. For example, what level of resolution is necessary for a specific application? Is an open tube or sealed source the most appropriate technology to deploy?
The goal of this presentation is to give the audience the tools needed to avoid making mistakes when acquiring x-ray inspection capabilities. Instead of focusing on the x-ray technology per se, this work starts from the application needs of the electronic industry and ties it back to the available technology offerings available in the market today. The goal is to set the record straight and clearly define critical concepts in x-ray inspection. The different x-ray modalities, 2D, 2.5D, and 3D x-ray inspection will be explained in details at the user level – no math involved. Most importantly, this presentation will cover when each modality must be utilized for a successful quality assurance program. A rich set of images and videos will be used to illustrate the advantages and disadvantages of each x-ray inspection modality.
11:00am - 12:00pm
Expert Panel Discussion on BTC Challenges and Strategies
Hosts: Martin Anselm, RIT, and Kim Flanagan, Indium Corporation
1:30pm - 2:00pm
Avoiding the Pitfalls of BTC Assembly
Speaker: Kim Flanagan, Indium Corporation
Bottom termination component use has increased very quickly throughout the last decade. Typical assemblies now have many of these components, often varying types of BTCs on one assembly. What is there to do when one or more starts to show increased variation within the same process? Many investigations have been conducted to find materials that offer the lowest voiding in large ground plane solder joints. In addition, there are many process modifications that have been proposed over the last decade to alleviate voiding in BTC components. These include but are not limited to: pad design, pad patterning, stencil design, via positioning, solid solder addition, and reflow profile optimization.
Furthermore, improved pad design strategies have been proven in the industry. IPC committees are updating the recommendations for design and implementation of BTCs including big changes to the IPC-7093. This presentation will discuss these changes and how these strategies can be used to minimize voiding and ensure robust BTC assemblies.
2:30pm - 3:00pm
Reflow Solutions to Minimize Voiding
Speaker: Dave Heller, Heller Industires Inc.
Vacuum assisted reflow soldering is a robust process that reduces void % in SMT and die attach soldering, typically by a factor of 10X. Thermal cycling test results have indicated that solder joint fatigue life and die life in BGAs, bottom terminated components, LEDs and power devices can be reduced by excessive solder joint voids. Much work has been done in the past to optimize flux, pad, component metallization, and solder paste deposition but these changes have not reduced voids in a thorough and consistent manner. This paper will review customer and lab experience in reducing voids in typical die attach and SMT applications as well as review the equipment needed for vacuum assisted reflow. These results can be applied to existing soldering processes that may currently produce excess voids and inadequate reliability.
Raffle - 4 ($25) amazon gift cards
Expo closes after the Raffle
Rocky Mountain (Colorado) Chapter: Design for Test and Spectrum Analysis +
Mentor Graphics Training Center
SAVE THE DATE!
The SMTA Rocky Mountain Chapter
is pleased to announce the next Technical Session:
“Design for Test and Spectrum Analysis”
April 26, 2018
Design for Test and Spectrum Analysis will be an informative technical session focusing inspection techniques and DFX. This session will explore different methodologies for testing today’s assembly packages for implementing a test strategy which best meets production process requirements.
Who should attend: Quality engineers, Manufacturing Engineers, Design Engineers, Engineering Managers, Buyers, and Engineering Students.
Where: Mentor Graphics, Longmont, CO
When: April 26, 2018
Time: 9:00 AM - 2:00 PM
RSVP: RSVP Link - Design for Test & Spectrum Analysis
Event Registration Fee: $35.00 - members
$45.00 - nonmembers
Payment: Payment for the event can be made via PayPal in advance or at the door