Calendar of Events



April 2018

April 4

Space Coast (Melbourne FL) Chapter: April 4, 2018  SMTA Space Coast Chapter Technical Meeting  +

Mack Technologies

"April 4 2018 SMTA Space Coast Chapter Technical Meeting
Email to Jack Reinke or call (404) 290-6744
Is proud to present a Lunch and Learn Session

"Tin Whiskers: Mitigation Techniques and Accessing Reliability"
The advent of lead free solder and the growth of pure tin component finishes have exacerbated the re-emergence of tin whisker growth, increasing the potential for field failures. Many high reliability programs, especially within the aerospace realm, require varying degrees of tin whisker mitigation. This presentation will summarize the five reliability levels as defined in GEIA-STD-0005, the widely accepted industry standard for mitigating the effects of tin whiskers. Situations will be identified where whisker growth is most prominent, increasing the importance of mitigation. Conversely, situations where mitigation is of less concern will also be identified. With this knowledge, a key method for assessing reliability has been ascertained for the attendee’s knowledge. A variety of techniques for mitigating the effects of tin whiskers will be presented such that the assessed reliability can be significantly improved. Even in electronic assemblies where whisker mitigation is not required, engineers can impart reliability improvement through understanding of the reliability assessment, areas most at risk, and associated mitigation's that can reduce that risk.
The Presenter:
Bruce Misner of Advanced Technical Services
The event will be hosted by Mike Newman/Nazeeh Chaudry
Bruce MisnerBruce M
Bruce is the principal of Advanced Technical Services, serving the electronics industry with manufacturing engineering consulting services related to:
  • Electronic based Product, Process and Facility Development
  •  Microelectronics Packaging and Electronics Miniaturization utilizing SMT, Thick and Thin Film Hybrid, Multi-Chip Module (MCM), Chip-on-Board, Microwave Integrated Circuit (MIC), Wire Bond and Flip Chip technologies
  • Complete Failure Analysis with follow up Design, Material and Manufacturing Process Corrective Actions
  • Tin Whisker and Counterfeit Mitigation
  • High Reliability Automotive, Military, Space and Medical Applications
Mr. Misner has served as the VP of Technology Development for Engent, in Atlanta, GA after completing a 17 year career with Orbital ATK as their multi-site Subject Matter Expert in electronics manufacturing technology. This included electronics technical lead on the billion dollar AARGM missile program. He concurrently served as the Technical Director of the Orbital ATK Failure Analysis Lab based in Clearwater, FL and played a role in the successful launch of the LADEE moon mission in 2013.
Prior to ATK, Mr. Misner’ career spanned various roles in electronic and microelectronic engineering. This included the head of Electromagnetic Sciences microelectronics development and production operations (now part of Honeywell) and the VP of Operations for Hy Tec Industries. He started his career as a process development engineer for, at the time, the nation’s largest independent producer of custom hybrid circuits, Circuit Technology, Farmingdale, NY, now part of Cobham Aeroflex Corporation.
Mr. Misner has a Bachelor of Science degree from Binghamton University and was a candidate for an MBA at Cornell University. He has been an active member for multiple decades and often chapter officer in SMTA and ISHM/IMAPS, as well as affiliation with JEDEC JC13.5 as a Task Group Chairman for Space Class Hybrid Device requirements. His latest technical paper, “Validated Solder Coverage for Tin Whisker Mitigation,” was published in the Journal of Surface Mount Technology, July – Sept 2016, Volume 29, Issue 3 and can be viewed here: Link to article
Come join us April 4, 2018 at 11:30am at
Mack Technologies
7505 Technology Drive
Melbourne, FL 32904

(321) 725-6993



TIME:             11:30AM           LUNCH
                       12 -1:00PM       Presentation

Lunch is included in the admission price.
Members: $20 • Non-Members: $30
You can pay at the door with a credit card, check or cash or you can use PayPal button below to  pay by credit card in advance.
RSVP to Jack Reinke or call (404) 290-6744

April 10

Dallas Chapter: Dallas Expo and Tech Forumn - April 10  +

Plano Event Center

Register Now!

Click Here to Register for the Dallas Expo and Tech Forum!

Are you a...
  • Manager of Design or Manufacturing
  • Process engineer
  • Design Engineer
  • Supply Chain Professional
  • Purchasing
  • Test Engineer
  • Manufacturing or Test Technician

The Dallas Expo has everything you need to do with Design and Manufacturing of Electronics!

Event Details

  • Date: Tuesday, April 10th, 2018
  • Time: Doors open at 8am
  • Location: Plano Event Center (2000 E. Sprint Creek Parkway, Plano, TX 75074)
  • Food: Complementary Lunch Buffet
  • More info:
  • Questions? Call Kaitlyn Schmiel at 952-920-7682

Technical Sessions

  • Material Management 4.0
  • The Quest for a Zero Defect Line
  • A Mindset for Successful Application of the Toyota Production System
  • Impact of Stencil Foil Type on Solder Paste Transfer Efficiency for Laser Cut

Thank you, sponsors!

Breakfast Sponsor - Henkel

Technical Sessions Sponsor - NCAB Group

Lunch Sponsor - NPI Technologies

Door Prize Sponsor - SVTronics

April 10 - 12

SMT Processes Certification (Ducommun In-House)  +

Ducommun Incorporated
Appleton , WI

Held at Ducommun Incorporated
2222 E Pensar Dr, Appleton, WI 54911

  • April 10 Course (8:30-5pm)
  • April 11 ½ day of course + exam
  • April 12 All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting Reduced In-House Rate: $915 for members or $970 for non-members. Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt. Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience
  • The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.

April 11

Heartland (Kansas, Missouri) Chapter: Re-scheduled SMTA Heartland: The Incredible Shrinking World Of Electronics – Are Traditional DFM, DFR, DFF, … Methods Obsolete?  +

180 Room (11944 S Strang Line Rd, Olathe, KS 66062)


The SMTA Heartland Chapter is excited to announce our first meeting of 2018 featuring a presentation by Dale Lee (The Incredible Shrinking World Of Electronics – Are Traditional DFM, DFR, DFF, … Methods Obsolete?) and great BBQ at the renowned 180 Room next to Joe's KS BBQ!

This is sponsored in part by donations from Lorenz Sales and Kysen.

Price: $25 Non-Members, $15 Members
Please RSVP as soon as you can!

This meeting will be Wednesday evening April 11, 2018. The doors will open at 5pm and the dinner/presentation will be from 5:30pm-7:30pm. This will be a great chance to network, enjoy some great BBQ and drinks as Dale Lee presents his discussion on The Incredible Shrinking World of Electronics!  

Topic of discussion:
Today’s electronic component packaging technologies of  smaller packages (0201/01005/008003), finer lead pitch (0.4/0.35/0.3/…), bottom terminated components (QFN/LGA) and printed circuit board designs (high layer counts, finer lines, via in pad (VIP), increased copper thicknesses, copper routing, …), increased thermal sensitivity, trailing component, fabrication and assembly industry standards have impacted traditional assembly processes with addition of tight solder application, component placement, thermal management and soldering constraints.  Using traditional, simplified mass production techniques are not be sufficient to achieve a high-yielding manufacturing process.  This presentation will highlight elements of the impacts of these technologies on reliability and yield when not properly addressed in the design/assembly/inspection-test process, impacts of thermal connections on through-hole and surface soldering processes, introduce the elements of design for matched process (DFMP), and provide examples of several opportunities within the DFMP for yield improvement through manufacturing tooling design, SMT and PTH assembly process matching.  The concept of manufacturing, test, reliability by design (XBD) will be presented.
What you will learn:
•             Component packaging impacts
•             PCB design impacts and industry standards limitations
•             SMT and PTH solder design impacts
•             Components with thermal management impacts:
  1. Component design
  2. PCB Thermal balance: X, Y and Z axis
  3. Trace routing
  4. Equipment limitation/tolerance
  5. PCB array tolerance
  6. Process tooling design
•             Process control impacts
•             Paste volume, thermal shock SMT and PTH, reflow process warpage
•             Cleaning impacts
•             Compatibility issues, low stand-off components

Speaker Bio:
Dale is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields.
Dale has been involved in surface mount design, package & process development and production for over thirty years in various technical and managerial positions.  These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of CSP & BGA packages, PCB & PCBA support, DFM/DFX analysis of flex, rigid-flex & rigid PCB/PCBA’s including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications for consumer products, defense/aerospace and medical devices. 
Dale has authored, instructed and presented frequently on topics including advanced SMT packaging, PCB and SMT design, assembly, cleaning, DFM/DFX and rework.  He is a past recipient of the Surface Mount Technology Association’s “Excellence in Leadership” award.  He has been very involved with multiple industry associations and activities including SMTA, INEMI and IPC.
Contact Information:
Dale Lee
Senior Staff DFX Strategy Engineer
Plexus Engineering Solutions
Tel: 920.720.6579
120 Main Street
Neenah, WI  54956


April 12

Houston Expo & Tech Forum  +

Location: Bayou City Event Center
9401 Knight Road
Houston, TX 77045


The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $25 per booth. Early bird expires on March 15, 2018!
Click here for Ad and Sponsorship opportunities!

Important Exhibitor Materials:

Please contact SMTA Expo Manager Courtney Kalb with questions or for additional information.


Free Technical Program & Schedule:



Registration Opens


9:00am-9:45amBill Cardoso

iPhone X - Steve Jobs' iPhone

Speaker: Bill Cardoso, Ph.D., Creative Electron

It’s been 10 years since Steve Jobs introduced the iPhone to the world. Much has happened since then. Over this past decade, the iPhone become a reference design and the object of desire of a legion of fans who wait anxiously for every launch of the Cupertino company. Undoubtedly, the most advanced iPhone in the market today, the iPhone X is a technology marvel. The double stacked board, dual battery, and a face recognition sensor bring the iPhone X to a whole different level.

In this presentation, we will explore these technological advances by a live teardown of the iPhone X. The teardown will be followed by a detailed coverage of the technical details of critical parts of the device. This live teardown will be accompanied by X-ray and CT images of the iPhone X, so the audience will get unprecedented insights on what makes this iPhone tick. More importantly, we will explore the assembly process utilized to put the iPhone X together. This presentation is targeted at a wide technical audience looking for a better understanding on how advance consumer electronics are designed and assembled.



Exhibit Hall Opens


11:00am-11:45amTim O'Neill

What the Solder Industry is Offering as Next Generation Solder Materials

Speaker: Timothy O'Neill, AIM Solder

The choices for solder alloys are expanding rapidly as new application requirements materialize revealing the limitations of existing lead-free alloys.  In this presentation, attendees will gain a better understanding of the evolution of lead free solder alloys, the limitations of today’s common alloys and what the solder industry is offering as next generation materials.



Prize Drawings

Thank you to our Lunch Sponsor:

NPI Technologies





Prize Drawings


1:00pm-1:45pmPaul Vianco

Computational Models: A Critical Enabler of Advanced Electronics Packaging for Use in High-Reliability Applications

Speaker: Paul T. Vianco, Sandia National Laboratories

The development of advanced electronic packaging technologies – die materials, molding compounds, printed circuit board substrate, solder alloys etc. – is rapidly outpacing the capacity for empirical testing to provide adequate reliability data towards the design, manufacture, and fielding of components, printed wiring assemblies (PWAs), and next level sub-assemblies. Moreover, the increased reliance on electronics across different product lines has required reliability analyses to address a wider range of accelerated aging tests and service environments. Sandia recognized the challenges of this scenario and, as such, placed an emphasis on the development of computational models to predict the long-term reliability of advanced electronic packaging technologies. Although the expressed focus of these development efforts has been on solder joint reliability, the underlying toolset has been applied to such topics as die cracking, molding compound delamination, as well as the survivability of PWAs when exposed to shock and vibration conditions.

This presentation will describe the development of the computational modeling tools currently being used to support design decision for advanced, high-reliability electronics. The model predictions have been used to introduce bottom terminated components (BTCs) as well as stacked package components in such hardware. The numerical approach has been instrumental for documenting the long-term performance of alternative solder interconnections. An offshoot of this effort, which is currently being explored at Sandia, has been to predict the effects of Au embrittlement and Pb-contamination on solder joint performance and reliability. Several case studies will be presented to illustrate the predictions provided by computational modeling capability and its role in multiple applications.


3:00 pm

Expo Closes

April 17

Huntsville Chapter: April 2018 Meeting An Evolution of Lead Free Solder Alloys  +

STI Electronics 261 Palmer Rd, Madison, AL 35758, USA

The Huntsville Chapter SMTA and STI welcome you on April 17, 2018 from 5:30-7:30pm to bring a discussion of the evolution of lead free solder alloys.

If you are an SMTA member and cannot join us at STI, but would like to conferenece into the discussion, please contact and we will send the meeting log-in information.

Speaker Info:
Timothy O'Neill is the Technical Marketing Manager for AIM Solder. AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries.
Operating out of AIM U.S. Headquarters, Mr. O'Neill is responsible for developing and optimizing product and technical information, collaborating with complimentary suppliers and equipment manufacturers and ensuring AIM’s products exceed the end users expectations and meet market requirements.
Mr. O'Neill is also a technical writer and presenter for industry trade publications and events and has been recognized as a Speaker of Distinction by the SMTA.
Mr. O’Neill is a Certified IPC Specialist, has a B.A. from Assumption College and post-graduate studies in education. He began his career in 1994 with Nordson EFD, heading their business development of fine pitch solder paste dispensing technology. He joined AIM in 1997 and has since assisted many clients with production challenges, specializing in Pb-Free process development and material selection.
Due to ITAR, a photo ID will be required to enter the STI Electronics facility. We will need to know in advance if you are not a US citizen.
5:30 – 6 networking
6 – 6:30 dinner
6:30 – 7:15 intro & presentation
7:15 – 7:30 wrap-up

Location: 261 Palmer Rd, Madison, AL 35758
Directions From I565:
  • Take the Wall-Triana Hwy exit toward Madison Blvd / Madison
  • Keep straight onto Sullivan St.
  • Turn left onto Palmer Rd
  • Arrive at 261 Palmer Rd, Madison, AL 35758

Dinner : Boxed lunches from Apple Lane Farms and drinks will be available for:
$5 for SMTA Members who RSVP by Thursday April 12, 2018
$7 for SMTA Members who Do Not RSVP by Thursday April 12, 2018
$10 Non-Members who RSVP by Thursday April 12, 2018
$12 Non-Members who Do Not RSVP by Thursday April 12, 2018
Two ways to RSVP:  

April 18 & 19

SMTA Webtorial: Stencil Printing Process and Solder Paste Inspection – An In-Depth Look   +

Two (2) 90 minute Sessions
April 18 and 19, 2018
1:00pm to 2:30pm Eastern
Presented by:  S. Manian Ramkumar, Ph.D., Center for Electronics Manufacturing and Assembly

Rochester Institute of Technology

The stencil printing process is the most critical process in surface mount electronics assembly. It tremendously influences the quality of the final PCB assembly. This course will provide a thorough understanding of the print process for lead based and lead free solder paste print applications. Topics include an in-depth look at stencils, solder paste, squeegee, process parameters, process characteristics, inspection techniques, defect identification and corrective actions. Participants in this course are sure to acquire a sound understanding of the solder paste print process and its influence on yield. A brief discussion on the use of this process for adhesive print applications is also included.

Who Should Attend:
♦ Process, Design, Test and Quality Engineers
♦ Process and Quality Technicians
♦ Operators
♦ Managers

After completing this course, you will be able to:
1. Understand the stencil printing process and the process parameters, thoroughly.
2. Understand the importance and the influence of solder paste, flux, temperature, humidity, board support and machine setup.
3. Evaluate materials such as paste, stencil and squeegee for efficient printing
4. Understand the various solder paste constituents and types of paste
5. Specify stencils, solder paste and printer requirements for various applications
6. Understand Stencil construction and features for efficient paste transfer
7. Understand squeegees and the recent advances in print technology
8. Evaluate in-coming raw materials and procedure for qualifying vendors
9. Understand the print process for adhesive applications



April 19

Ohio Valley Chapter: Introduction to Statistics, DOE and SPC for Lean Six Sigma Meeting with Dr. Lasky  +

Corporate College East, Warrensville Heights, Ohio

Meeting Outline:
  1. How the Math fits into LSS DMAIC
  2. Statistics:
    - Statistically Thinking
    - The Normal Distribution
    - Confidence Intervals
    - Hypothesis Testing
  3. Design Of Experiments (DOE):
    - The Importance of Experiments
    - Setting Up the DOE Team
    - ANOVA: The Heart of DOE
    - A Simple DOE by Hand
    - Solving DOEs with Minitab
  4. Statistical Process Control (SPC):
    - The Cost of Variation
    - Common Cause vs Special Cause Variation
    - Precision and Accuracy
    - Gage R & R
    - Control Charts
    - The Shewart Rules
    - Capability Six Pack
Minitab with be used with examples throughout. A free 30 day version can be downloaded from & bring your PC to work through examples.

Following the meeting a facility tour of Bird Technologies in Solon, OH will be available.
Speaker: Dr. Ron Lasky, Instructional Professor at Dartmouth College and a Senior Technologist at Indium Corporation.
Prior to these assignments, he had over thirty years experience in electronic and optoelectronic packaging and assembly at IBM, Universal Instruments and Cookson Electronics. 
He has authored or edited 6 books on science, electronics, and optoelectronics and numerous technical papers and authored articles for Scientific American.  Dr. Lasky holds numerous patent disclosures and is the developer of the several new concepts in SMT processing software relating to cost estimating, line balancing and process optimization.  He is the co-creator of engineering certification exams in electronic assembly and the Director of Dartmouth’s Six Sigma Program.  Ron was awarded the Surface Mount Technology Association’s Founder’s Award in 2003.
He owns four earned degrees, including a Ph.D. from Cornell University in Materials Science.  Ron is also a New York State licensed professional engineer.

Meeting Agenda:

April 23 - 26

SMTA China East Technology and Vendor Conferences 2018   +

Shanghai World Expo Exhibition & Convention Center
Shanghai China

Technology Workshop: 23 April 2018
Technology Conference: 24-25 April 2018
Vendor Conference: 25-26 April 2018
Shanghai World Expo Exhibition & Convention Center

The SMTA China cordially invites you to participate in SMTA China East Conference located in Shanghai 2018. This event, held in conjunction with NEPCON China 2018, will as usual address the industry's most pressing issues in electronics assembly/ manufacturing, industry/technology roadmap, business focus, advanced packaging, practical skill development, emerging technologies, and lead-free & reliability.


Lin Dong

Technology Workshop on Implementation of Intelligent SMT Warehouse

Monday 23 April

On Monday 23 April 2018, renowned expert Lin Dong, Artesyn Embedded Technologies, will instruct a full-day workshop on Implementation of Intelligent SMT Warehouse. View the complete workshop description in English and Chinese.


View the technical conference schedule

(Tuesday 24 April and Wednesday 25 April)

April 24 - 26

Electronics in Harsh Environments Conference  +

Crowne Plaza Amsterdam - Schiphol
Amsterdam 2132 HZ Netherlands

Building on the successful Contamination, Cleaning and Coating Conference in 2017, SMTA Europe will host the Electronics in Harsh Environments Conference on 24-26 April 2018 in Amsterdam, Netherlands. The conference will focus on building reliable electronics used in power electronics and harsh environments. Thermal, power and signal integrity requirements can present challenges when on devices that operate within harsh environments. Component integration, paired with a growing complexity of the package architectures, larger form factors and higher interconnection densities increase the risk of in-field failures. Over powering or over heating of a device can have serious consequences including internal package failure, down-stream device errors and second level interconnect solder joint failures. Soldering residues are more problematic, and if not understood, can result in both intermittent and complete device failure. This conference tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. Specific topics include building reliable high density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high temperature soldering, solder material advances, and new standards will be presented. Contact Tanya Martin,, with questions or comments.

April 24 - 26

Electronics in Harsh Environments Expo  +

In conjunction with the Electronics in Harsh Environments Conference

Location: Crowne Plaza Amsterdam - Schiphol
Planeetbaan 2
Amsterdam 2132 HZ


Exhibit Hours:
Tuesday, April 24: Afternoon
Wednesday, April 25: Full Day
Thursday, April 26: Full Day

Exhibition sold out!

Sponsorship opportunities still available! 

Exhibit space entitles you to:

  • 6 ft. draped table
  • Two chairs
  • One technical conference pass (a $600+ value!)
  • Electronic attendee list (sent after the conference)
  • Directory listing
  • Lunches
  • Reception

Sponsorship Opportunities:

  • Reception Sponsor - $500/€425 (limit 2)
  • Lunch Sponsor - $500/€425 (limit 3)
  • Refreshment Break Sponsor - $300/€250 (limit 4)
  • Lanyard Sponsor $200/$400 (SOLD!)

April 24

Empire Expo & Tech Forum  +

Location: Holiday Inn Syracuse/Liverpool
441 Electronics Parkway
Liverpool, NY 13088


The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. 
Important Exhibitor Materials:

Click HERE for discounted hotel rates

Exhibitor Kit

Please contact SMTA Expo Manager Hannah Funk with questions or for additional information.


Free Technical Program & Schedule:



Registration Opens

9:00am - 9:30am

Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat
Speaker: Jason Fullerton, Alpha Assembly Solutions

The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases.  Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently.  Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances.  The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.

Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding.  The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact.  Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages.  The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.

A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages.  The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms.  Design and manufacturing rules developed from this work will be discussed.



9:30am - 10:00am

Identifying Defects on BTC Assemblies with X-ray Analysis
Speaker: Bill Cardoso, Ph.D., Creative ElectronBill Cardoso

The use of x-ray inspection in the electronics industry has gained wide adoption in the past 20 years, driven mainly by the development and use of bottom terminated components (BTC). The use of ball grid arrays (BGA), for example, allowed the development of standards and guidelines that dictate the maximum void size in each ball. In consequence, x-ray machine manufacturers developed solutions that address these requirements to became an integral part of the quality assurance function of modern electronic manufacturers.

However, as new x-ray technologies are introduced – from new algorithms to new hardware – users are faced with a growing range of options to choose from. Users need a solid technical background to understand these options to make an educated decision when acquiring x-ray inspection capabilities. For example, what level of resolution is necessary for a specific application? Is an open tube or sealed source the most appropriate technology to deploy?

The goal of this presentation is to give the audience the tools needed to avoid making mistakes when acquiring x-ray inspection capabilities. Instead of focusing on the x-ray technology per se, this work starts from the application needs of the electronic industry and ties it back to the available technology offerings available in the market today. The goal is to set the record straight and clearly define critical concepts in x-ray inspection. The different x-ray modalities, 2D, 2.5D, and 3D x-ray inspection will be explained in details at the user level – no math involved. Most importantly, this presentation will cover when each modality must be utilized for a successful quality assurance program. A rich set of images and videos will be used to illustrate the advantages and disadvantages of each x-ray inspection modality.


Expo Opens

11:00am - 12:00pm

Expert Panel Discussion on BTC Challenges and Strategies
Hosts: Martin Anselm, RIT, and Kim Flanagan, Indium Corporation


Complimentary Lunch

1:30pm - 2:00pm

Avoiding the Pitfalls of BTC Assembly
Speaker: Kim Flanagan, Indium Corporation

Bottom termination component use has increased very quickly throughout the last decade. Typical assemblies now have many of these components, often varying types of BTCs on one assembly. What is there to do when one or more starts to show increased variation within the same process? Many investigations have been conducted to find materials that offer the lowest voiding in large ground plane solder joints. In addition, there are many process modifications that have been proposed over the last decade to alleviate voiding in BTC components. These include but are not limited to: pad design, pad patterning, stencil design, via positioning, solid solder addition, and reflow profile optimization.

Furthermore, improved pad design strategies have been proven in the industry. IPC committees are updating the recommendations for design and implementation of BTCs including big changes to the IPC-7093. This presentation will discuss these changes and how these strategies can be used to minimize voiding and ensure robust BTC assemblies.


2:30pm - 3:00pm

Reflow Solutions to Minimize Voiding
Speaker: Dave Heller, Heller Industires Inc.

Vacuum assisted reflow soldering is a robust process that reduces void % in SMT and die attach soldering, typically by a factor of 10X.  Thermal cycling test results have indicated that solder joint fatigue life and die life in BGAs, bottom terminated components, LEDs and power devices can be reduced by excessive solder joint voids.  Much work has been done in the past to optimize flux, pad, component metallization, and solder paste deposition but these changes have not reduced voids in a thorough and consistent manner.  This paper will review customer and lab experience in reducing voids in typical die attach and SMT applications as well as review the equipment needed for vacuum assisted reflow.  These results can be applied to existing soldering processes that may currently produce excess voids and inadequate reliability. 


Raffle - 4 ($25) amazon gift cards


Expo closes after the Raffle

April 26

Rocky Mountain (Colorado) Chapter: Design for Test and Spectrum Analysis  +

Mentor Graphics Training Center

The SMTA Rocky Mountain Chapter
is pleased to announce the next Technical Session:
“Design for Test and Spectrum Analysis”
April 26, 2018
Design for Test and Spectrum Analysis will be an informative technical session focusing inspection techniques and DFX. This session will explore different methodologies for testing today’s assembly packages for implementing a test strategy which best meets production process requirements.
Who should attend: Quality engineers, Manufacturing Engineers, Design Engineers, Engineering Managers, Buyers, and Engineering Students.
Meeting Details
Where:                                              Mentor Graphics, Longmont, CO
When:                                                April 26, 2018
Time:                                                  9:00  AM - 2:00 PM
RSVP:                                                 RSVP Link - Design for Test & Spectrum Analysis
Event Registration Fee:                 $35.00 - members
                                                            $45.00 - nonmembers
Payment:                                          Payment for the event can be made via PayPal in advance or at the door
Google Map:                          Google Maps Link to Mentor Graphics, 1811 Pike Road, Longmont

Presentation Agenda:
9:00 – 9:45                  Registration check-in and networking opportunity
                                               Coffee and pastries sponsored by Palpilot
Pal Pilot
10:00 – 10:45              3D AOI     Presented by: Koh Young
Not long ago, 2D inspection was the industry norm, then 3D inspection quickly proved itself. Today, true 3D measurement is even more powerful, especially when AI power analyzes the real data. But what is the difference between 3D inspection and 3D measurement, and how can AI improve your process?

Koh Young Technology
11:00 – 11:45              Flying Probe     Presented by: Takaya
Flying Probe Test (FPT) was introduced in the mid 1980’s out of necessity to develop a test process that would be cost effective for low volume situations.  As FPT technology progressed it has evolved to provide test capabilities similar to those of In-circuit Test (ICT) Bed-of-Nails (BON).  Today’s test strategies can be developed on FPT to test for all process faults as well as providing Power-On functional test, BSCAN, ISP to simple quick turn MDAs. With the continued minimization of today’s PCB designs, and further reduction of traditional test access, FPT continues to be the preferred test platform to provide the best achievable test coverage of these assemblies. This presentation will cover the defect spectrum that flying probe test is well suited to detect, based on its in-circuit test capability and the mechanical accuracy that flying probe systems can provide.
Texmac Takaya
12:00 – 1:00 PM         Lunch Sponsored by Takaya

 2:00 – 2:45 PM           Design for Test DFX     Presented by: Mentor Graphics
Electrical test and structural inspection have evolved significantly over the past 5 years. Flying probe testers are now double sided, inspection systems are combined optical and X-ray inspection but to extract the maximum performance from these technologies requires the existing reactive test flow to become proactive. Test and inspection feedback must be considered during the design flow, and not implemented as an afterthought. Understanding the historical challenges in PCB manufacturing allows future designs to benefit from the experience to deliver the optimized test coverage for each product. This presentation will discuss these challenges and ways that they can be implemented in today’s PCB design flow.
Thank you to our sponsors. Without you, these events would not be possible.

Pal Pilot    Texmac            Mentor
Breakfast pastries with coffee and lunch included. To ensure adequate number of meals for the event, RSVPs MUST be received no later than 4/24/2018. For special dietary needs, please also contact Patty Chonis at 970-443-9233 or email at to ensure proper food selection.
Please note, space is limited to 50 attendees so register early!

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