Calendar of Events

   2018      

                                 Dec  

December 2018

December 4

Massachusetts (Boston) Chapter: Evolution of Lead Free Alloys, the Limitations of Today’s Common Alloys and What the Solder Industry is Offering as Next Generation Materials.  +

Location
iRobot Corpoeration in Bedford, MA



Evolution of Lead Free Alloys, the Limitations of Today’s Common Alloys and What the Solder Industry is Offering as Next Generation Materials.
By:  Timothy O’Neil Technical Marketing Manager for AIM Solder
Date: Tuesday, Dec. 4th, 2018
Time: 5:00 PM to 9:00 PM
Location: iRobot Corporation 8 Crosby Drive Bedford, MA 01730
Cost: Members $25 / Non-Members $30
 
Technical Topic:  The choices for solder alloys are expanding rapidly as new application requirements materialize. This presentation will highlight the evolution of lead free solder alloys, the limitations of today’s common alloys and what the solder industry is offering as next generation materials. Whether low temperature or high reliability alloys, attendees will gain a better understanding of how implementing these materials can impact process and affect product reliability.
Click here to download presentation
 
 
Speaker Bio:  Timothy O'Neill is the Technical Marketing Manager for AIM Solder.  AIM Solder is a leading global manufacturer of assembly materials for the electronics industry.  Mr. O’Neill who has 25 years of industry experience is a Certified IPC Specialist. 
Mr. O’Neill’s responsibilities include developing product and technical information; he is a technical writer and presenter for industry trade publications and events and has been recognized as a Speaker of Distinction by the SMTA.

Agenda:
5:00 PM Registration, Socializing, Networking
5:15 – 6:00 PM iRobot Corporation Museum Tours
6:00 – 7:00 PM Dinner
7:00 – 7:15 PM SMTA Boston Welcome, Announcement, Introduction
7:15 – 8:45 PM Technical Presentation
8:45 – 9:00 PM Questions & Answers
9:00 PM Meeting Adjourn
 
Contact Info:
President : Michael G. Jansen  (Raytheon Company)
Phone: 978-470-7598

Vice President : Louis Feinstein  (DS Solidworks)
Phone: 781-810-7261

VP of Technical Programs : Joe Kwong  (Draper Labs)
Phone: 617-258-1746



December 5

Oregon Chapter: SMTA Oregon Chapter Appreciation Dinner  +

Location
Ernesto's Italian Restaurant



Join us for a night of fellowship as we celebrate the accomplishments and contributions of our SMTA OR Chapter Members! 

Time: 5:00-7:30PM
Venue: Ernesto’s Italian Restaurant
Address: 8544 SW Apple Way, Portland, OR 97225

 
Buffet Dinner includes:
Tossed Green Salad w/dressing
Roasted Italian Chicken, Lasagna, Penne Pasta w/Alfredo Sauce.
Coffee/Tea/Soft Drinks
 
No Host Bar
 
First 20 members to RSVP will be free, guest will be 20$ each.




December 6

Carolinas (NC, SC) Chapter: Lunch & Learn with Kemet  +

Location
2835 Kemet Way, Simpsonville, SC 29681



SMTA Carolinas
Lunch & Learn
about Ceramic Constraints from
KEMET Electronics Corporation
including a tour of the Innovations Center with
Scott Carson the Sr Director of Product Management & Planning


RSVP is strongly encouraged to ensure access to the plant tour
Given the proprietary nature of event, SMTA Carolinas will respectfully decline registrations from Kemet competitors

Kemet Simpsoniville, SC


Scott Carson is Senior Director of Product Management and Central Planning for the Ceramic Business Group at KEMET.  In this role, his team is responsible for all aspects of strategic product management including product roadmaps, pricing, capacity planning and allocation.  Scott has been with KEMET for 12 years and has spent his entire career in product management functions.



December 11

SMTA Webinar: Inspecting PWB Assemblies for Defects  +


Tuesday, December 11, 2018 1:00pm to 2:30pm Eastern
Presented by: Bob Wettermann, BEST Inc.

Bob Wettermann What You Can Learn From This Course:

This webinar is designed to help the EMS and PWB builders screen for, test and develop inspectors for PCB final assembly. The people attending this session should have familiarity with the latest IPC-A-610 inspection standard. We will review some of the more common “gotchas” found in the final inspection of PWBs. The session will also discuss the options for manual inspection equipment including but not limited to lighting, magnification aids and ESD control in the inspection area. In addition, this session will go on to discuss eyesight issues, visual acuity, color siting, hand-eye coordination and testing of these attributes. This will help in the screening process for nurturing that next inspector. Finally, there will be a real time short “test” of various devices and boards with anomalies and sample defects.  

This is intended for production personnel, process engineers and QC managers trying to hire, train up and nurture the next tier of inspectors.

Instructor Bio:
Bob Wettermann is the principal of BEST Inc. a contract rework and repair facility in Chicago. His firm develops processes and products for a variety of PCB and device rework challenges. Bob is an IPC Master Instructor and has been involved in the electronics assembly and repair market for 18+ years. He holds several patents in the fields of surface science, industrial controls and PCB rework. He is a BSEE from the University of Illinois/Champaign.


December 13

Tampa Bay Chapter: SMTA Tampa Bay Chapter Meeting Notice- December 13th  +

Location
Jabil Circuit 10560 MLK Blvd St. Peterburg, FL 33716



This is a reminder to set time aside for this quarters meeting on Thursday, December 13th at 5:30 PM.
The link to register is below.

Our speaker will be Bruce Misner, principal of Advanced Technical Services, who will be discussing Tin Whiskers: Mitigation Techniques and Assessing Reliabilty.

The advent of lead free solder and the growth of pure tin component finishes have exacerbated the reemergence of tin whisker growth, increasing the potential for field failures. Many high reliability programs, especially within the aerospace realm, require varying degrees of tin whisker mitigation. This presentation will summarize the five reliability levels as defined in GEIA-STD-0005, the widely accepted industry standard for mitigating the effects of tin whiskers. Situations will be identified where whisker growth is most prominent, increasing the importance of mitigation. Conversely, situations where mitigation is of less concern will also be identified. With this knowledge, a key method for assessing reliability has been ascertained for the attendee’s knowledge. A variety of techniques for mitigating the effects of tin whiskers will be presented such that the assessed reliability can be significantly improved. Even in electronic assemblies where whisker mitigation is not required, engineers can impart reliability improvement through understanding of the reliability 
assessment, areas most at risk, and associated mitigations that can reduce that risk. 



December 23

Israel Chapter: The world of failures troubleshooting: from development to production  +

Shlomit Morad, Rafi Ouliel, Arie Maor



Diagnostics overview
Development testbench processes
Smart system for failure troubleshooting reports



Looking for a local chapter event? Check the Chapter News page for more events.
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