Calendar of Events

   2018      

                              Nov     

November 2018

November 1

LA/Orange County Expo & Tech Forum  +

Location: The Grand Event Center
4101 E Willow Street
Long Beach, CA 90815



Exhibitors

The LA/OC Expo is Sold Out! Please contact Courtney Kalb to be placed on the waitlist.


Click here for Ad and Sponsorship opportunities!
Important Exhibitor Materials:



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry! Exhibit Hours:
Thursday, November 1, 2018
10:00AM–3:00PM

8:00am

Registration Opens

 

Thank You to Our Coffee Sponsor:

10:00am

Expo Opens

 

11:00am-11:30am 

Material Management 4.0

Speaker: Bill Cardoso, Ph.D., Creative Electron

Over the past years the electronic assembly industry has focused on the development of Industry 4.0, a standard communication protocol that allows production equipment to dialogue. This communication protocol will be a key enabler to improve the quality and efficiency of the production line. This is achieved by creating a feedback loop between inspection and production - thus allowing problems to be identified and corrected as early as possible in the manufacturing line. As a result, the overall cost of manufacturing is reduced as yield rates increase.


In this presentation, we'll introduce Material Management 4.0. More than a set communication protocol between machines that count electronic parts and the machines that store them. From x-ray parts counters to fully automated and intelligent storage towers, Material Management 4.0 embraces the overall infrastructure that needs to be in place to realize an accurate, fast, and efficient methodology for inventory control. This investment is critical to realize the benefits in efficiency unleashed by Industry 4.0. 

 

11:45am

Complimentary Lunch

 

1:00pm-1:30pm 

Challenges in PCB Design

Speaker: Vern Wnek, C.I.D., Mentor Graphics

The PCB Design process can be as simple as drawing schematics, doing the layout of the board, and providing the fabrication information to the manufacturing vendor. In this session, we will discuss a few topics that illustrate how technology and the complexity related to the PCB Design process has evolved in recent years and how Mentor solutions can help to overcome the challenges in PCB Design. 

 

2:00pm-2:30m 

An Intelligent DFM Approach to PCB Manufacturing

Speaker: Patrick McGoff, Mentor

PCB complexity continues to accelerate. It seems we used to be able to speak in terms of a simple progression of technology, but today we know there are advances in materials, construction, manufacturing processes and component technology that multiply the complexities of PCB manufacturing. With such a myriad combination of factors, it makes for very challenging PCB design reviews for manufacturability.

However, just as the PCB technology has advanced, so has the Design for Manufacturing (DFM) software. Best practice companies use the intelligence in the PCB design data to drive their DFM analysis for more accurate, comprehensive and consistent results across users. In this session we will discuss how to use the intelligence in the design data to your PCB manufacturing advantage.

 

3:00pm

Expo Hall Closes


November 6

Ohio Valley Chapter: Solder Roundtable - North  +

Location
Corporate College East Warrensville Heights, OH




Technical and product presentations from:
  • Shea Engineering Chrys Shea presents: Stencil and solder paste inspection for miniaturized SMT components
  • Henkel Dr. Mark Currie presents: Development of a solder paste test vehicle for miniaturized surface mount technology
  • Indium Corporation Brook Sandy-Smith presents: Avoiding the Pitfalls of Voiding in PCB Assemblies
  • FCT Assembly/Blue Ring Stencils Tony Lentz presents: How does PCB surface finish affect printing
  • AIM Tim O’Neill presents: Evolution of lead free solder alloys
  • Alpha Assembly Solutions Jason Fullerton presents: Cleanliness testing and its relationship to flux reliability
  • KOKI Solder America Inc. Shantanu Joshi Presents: Solder paste for super fine pitch components



November 7

Wisconsin Chapter: Selective Soldering Workshop  +

Location
Radisson Hotel Menomonee Falls N88 W14750 MAIN ST , MENOMONEE FALLS, WI 53051



The SMTA Wisconsin cordially invites you to attend:
 
Selective Soldering Workshop
7 Speakers!!!
 

Fountain Soldering
Ernie Grice - ERSA
Jonathan Wol - Pillarhouse
Brian Czaplicki - Air-Vac Engineering
Jim Czyzewicz - ITE-EAE
 
Point to Point Soldering
Will Hunter - MTA Automation
Bill Rahn - Fancort/Japan Unix
Ken Schiffer - Apollo Seiko
 

Click HERE to RSVP

AGENDA:
8:00 AM to 8:30 AM - Registration/Coffee/Networking
8:30 AM to 8:45 AM - Introduction

 
PRICE:
 
  • SMTA Members:  $40
  • Non-Members:  $60
Cost includes a buffet style lunch
 
Payment by PayPal required in advance
 
 



November 8

Mexico - Juarez (Formation) Chapter: SMTA Mexico - Juarez Re-Formation Meeting and Technical Seminar  +

Location
Centro de Convenciones Cuatro Siglos



Hello colleagues, we are having our re-formation meeting and technical seminar this Thursday November 8th, We are working on bringing several experts in the fields of Solder Paste Printing, process and Stencil Design to speak at the meeting. We will be having a networking event right after the seminar. Please reserve your time for this exciting event.




November 11 - 13

SMT Processes Certification (Guadalajara, Mexico)  +

Must be registered and paid by October 6th to participate in this course

Location
Guadalajara , JA Mexico


Co-located with Guadalajara Expo.

  • November 11- Course (8:30-5pm)
  • November 12- ½ day of course + exam
  • November 13- All day exam (8:30-5pm)

  • Instruction: English/Spanish
    Test: English
    Instructor: Ivan Castellanos


November 13

Oregon Chapter: What Does Clean Really Mean and How Can It Be Achieved?  +

Location
Axiom Electronics



What Does Clean Really Mean and How Can It Be Achieved?
Date: Nov 13th, 2018
Time: 4:30-7:00PM
Place: Axiom Electronics [9845 NE Eckert Drive Suite 200, Hillsboro, OR 97006 ]
 
Abstract
The definition of clean has changed with time and usage application. 
 
The definition of clean varies with the application that it is in reference.  With electronic assemblies, this definition has evolved with component packaging technologies, solder methods, flux chemistries, cleaning solvents, legislative and end use applications.  Early electrical soldering chemicals were based on soldering technologies developed over the centuries for non-electrical products and definition of clean was determined by visual inspection of residue.  As electrical assembly processes and end product applications evolved, so has the definition for clean.  Today, the definition of clean is measured in many different ways depending on what is required by the end use application.  Over the years, producibility, manufacturability, testability, inspectability and reliability methods have been incorporated into product development methods with cleanability provide minimal thought if any at all. 
 
With increased design densities, component packaging technologies, higher electrical performance requirements/restrictions, not addressing cleanliness requirements into the design and the method of cleanliness of the product can have detrimental impacts to customers and/or equipment providers.  This presentation will discuss design for cleaning guideline options to meet a proposed definition for clean of electronic assemblies


Dale Lee - Bio
Dale is a Senior Staff DFX Strategy Engineer with Plexus Corporation primarily involved with DFX analysis, root cause failure analysis and definition/correlation of design, process and tooling impacts on assembly processes and manufacturing yields.
 
Dale has been involved in surface mount design, package & process development and production for over thirty years in various technical and managerial positions.  These activities have included research, development and implementation of advanced manufacturing technologies and interconnect techniques, design and development of CSP & BGA packages, PCB & PCBA support, DFM/DFX analysis of flex, rigid-flex & rigid PCB/PCBA’s including supply chain, process qualification and new process introduction for domestic and foreign low, medium and high volume production applications for consumer products, defense/aerospace and medical devices. 
 
Dale has authored, instructed and presented globally on topics including advanced SMT packaging, PCB and SMT design, assembly, cleaning, DFM/DFX and rework.  He is a past recipient of the Surface Mount Technology Association’s “Excellence in Leadership” award.  He has been very involved with multiple industry associations and activities including SMTA, INEMI and IPC.
 


November 13 - 15

SMTA-IPC High Reliability Cleaning and Conformal Coating Conference  +

Location
Chicago Marriott
Schaumburg , IL


Organized by SMTA and IPC

November 13-15, 2018
Chicago Marriott
Schaumburg, IL

"How clean is clean?" is more challenging to answer as conductors and circuit traces become narrower. What is acceptably clean for one industry segment may be unacceptable in others. Brought to you by IPC and SMTA, the High-Reliability Cleaning and Conformal Coating Conference will cover technological developments in all areas of cleaning and coating applied to electronics assemblies. The event will include a technical conference, two half-day tutorials, networking activities and tabletop exhibits. Tutorials will provide practical information on materials, equipment and methodologies at the basic-to-intermediate levels. The technical conference will feature advanced-level presentations from subject-matter experts, emphasizing case studies of real-world problems along with solutions.

 


Call for Participation

 


November 14 - 15

Guadalajara Expo & Tech Forum  +

Location: Expo Guadalajara
Guadalajara


Exhibitors

Please see the Guadalajara Chapter Page for More Information on Expo Materials.

The Guadalajara Expo is SOLD OUT! Please contact Courtney Kalb or Hannah Funk to be placed on our waitlist.

 

 

Click Here for the Guadalajara Hotel Room Block

Group Name: SMTA Nov 2018

Group Code: SMT



Attendees

Attendee Registration is Now Open! Click Here to Register.

Please see the Guadalajara Chapter Page for more information on technical sessions.
 

 



November 19

Webinar: Hand Soldering & De-Soldering with Lead-Free Solder  +



Bob WillisNovember 19 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Hand soldering and de-soldering with lead-free solders does requires higher process temperatures. This material change can impact on the printed circuit board and components used. It can also impact on the tooling leading to increased cost and maintenance in your facility.  Soldering with lead-free can be simpler than you think if staff are provided with the correct procedures and a better understanding of the process and the type of joints they will be producing.  Changes to material and processes in your factory is an ideal time to eliminate poor practices that have been used for many years leading to extra rework and cost.

Each delegate will receive a copy of all of the slides presented plus a set of posters on soldering to print on site for future training.

Topics include:

Soldering theory and what is different
Cored solder wire
Soldering operation
Soldering iron care
Tip corrosion issues with lead-free
De-soldering techniques
Lead-free inspection criteria
Typical lead-free defects

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here


November 26

Webinar: ESD Electrostatic Discharge Guide for Everyone  +



November 26 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenters: Jeremy Smallwood & Charles Cawthorne from SMTA Europe Explain All

Overview

When handling most of today’s electronic components, printed circuit assemblies (PCAs) or equipment that contains electronics, special consideration must be given to the potential damaging consequences resulting from static electricity. Electrostatic discharge (ESD) can result in PCAs or higher level equipment failing test in the factory, or worse still, it can result in latent defects that can cause subsequent failure in the field. So what is electrostatic discharge and how is electrostatic discharge damage prevented?

This webinar provides an elementary guide to the principles of ESD control, looking at the basic theory behind the subject and the practical methods that can be adopted used to enable components, PCAs and equipment to be handled without the risk of incurring electrostatic related damage. The webinar is aimed at personnel who are new to the industry, including design and process / manufacturing engineers, technicians, trainers and also at those who support manufacturing indirectly (i.e. purchasing, account managers, sales staff, etc.)

Topics include:

  • What is ESD and why is it important
  • How static charges are generated
  • How static charges can be transferred to electronic components
  • Illustration of the damage that can be sustained by electronic components following electrostatic discharge
  • What is an Electrostatic discharge Protected Area (EPA)
  • How to set up an EPA within a factory
  • What practical controls are required to prevent electrostatic damage
  • How to store / transport electrostatic sensitive components / PCAs
  • How to handle electrostatic sensitive equipment out in the field

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here


November 28

Silicon Valley Expo & Tech Forum  +

Location: Bestronics Box Build Facility
2243 Lundy Avenue
San Jose, CA 95131



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 26th, 2018!

Click here for Ad and Sponsorship opportunities! Important Exhibitor Materials:

 



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Wednesday, November 28, 2018
10:00AM-3:00PM

Free Technical Program & Schedule:
8:30AM
Registration opens

9:30AM – 10:15AM
The Journey Towards Industry 4.0
Speaker: Hassan Aluraibi, Flex


Abstract: With ever-growing demand from customers and consumers, manufacturers are taking a closer look at the innovations that have shaped industries around them, and planning for the forthcoming, 4th industrial revolution, also known as Industry 4.0. This industry wide initiative seeks to integrate the latest in digital and manufacturing technologies, across a wide variety of solutions relating to simulation, machine communication, cloud computing and 3D printing, revolutionizing the way we manufacture. We’ll share a high-level view of this initiative, define key technologies, use cases and opportunities for growth as we usher in this exciting new initiative.

10:00AM
Expo Opens


11:15AM-12:00PM
Electronics and Textiles – Partners in Ubiquity
Speaker: Stephanie Rodgers, Apex Mills


Abstract: It’s happening folks! Successful outcomes of the first and third industrial revolutions are converging together as we begin the fourth; a hybrid of technology and humanity through textile applications.  Yarn has become the next invention and electronics are a topic of laundering performance and next level ubiquity.  Learn about the building blocks of advanced e-textile development, best practices for success, standards development and participation in Manufacturing USA.


12:00PM
Complimentary Lunch


1:30PM-2:15PM
X-ray and CT Scanning in the Context of Industry 4.0
Speaker: Rahul Alreja, VJ Technologies


Abstract: In today’s world, delivering quality products to end-users is absolutely critical.  Social media and the internet have made knowledge instantaneous and pervasive, and a misstep or flaw can cause catastrophic damage to a company – reputations that have taken years to make can come crashing down in days, if not hours.  The challenge is that maintaining quality is not easy – there are too many variables at play, even in the cleanest of environments.  And conditions can change almost instantaneously.  The trick, then, is to be adaptable, and emerging technologies (such as Big Data and Blockchain) are being adopted and harnesses to dynamically (and automatically) alter quality.  Drawing upon some real-world examples from different industries, this session will explore the future of quality and the role that NDE, and more specifically, x-ray plays in it.

3:00PM
Expo Closes 

3:00PM-4:00PM
Reception


Looking for a local chapter event? Check the Chapter News page for more events.
SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone 952.920.7682
Fax 952.926.1819