Calendar of Events



January 2018

January 25

Rocky Mountain Expo & Tech Forum  +

Location: West Club at Mile High Stadium
1701 Bryant Street
Denver, CO 80204


The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $40 per outlet. Early bird pricing ends on December 22nd, 2017! Important Exhibitor Materials:


Online registration is now closed. Please register on site. Mark your calendars and plan to attend what is expected to be the Rocky Mountain event of the year. The SMTA Rocky Mountain Chapter is now taking registration for their 2018 Expo. We are expecting a sold out event, connecting exhibitors, and bringing the latest technology to the Rocky Mountain region while presenting impactful and meaningful technical sessions for your continued professional growth. Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Mile High Stadium Backstage Tour of Mile High Stadium
As a special treat, we will have a backstage tour of Mile High Stadium for 25 attendees. Registrations are limited so book early. Cost for the tour is $25 per person – a bargain for the opportunity to go behind the scenes of the Denver Broncos. Tour will run at 1:00pm.

Click Here for Parking Information

Free Technical Program:
Registration opens

A Special Thank You To Our Coffee Sponsor:

9:00am – 9:45am
Rob Chambers Electronics Going Sky-High
Rob Chambers, Lockheed Martin

Human space exploration is growing in global interest and significance, with unprecedented interest in and excitement about expanding human presence beyond low Earth orbit to the moon and on to Mars. NASA’s Orion spacecraft is at the vanguard of this effort. Designed and built by Lockheed Martin in Denver, Orion represents the state of the art for high-reliability, high-availability, robust avionics and software architectures and components for long-duration deep space missions. Chambers will provide an overview of Orion, the avionics challenges unique to flying humans out to the final frontier, and the future of humanity’s scientific exploration of our solar system.

Expo Opens

11:15am – 12:00pm
Greg Vance Modeling an SMT Line to Improve Throughput
Greg Vance, Rockwell Automation

One of the major challenges for an electronic assembly manufacturing engineer is determining how a SMT machine will impact throughput. Typically an SMT equipment supplier will ask for few (5-10) products to simulate the throughput capability of their machine. Unfortunately, if the engineer works in a high mix low volume environment he may need to know the impact of a new machine on a 1,000 or more products. Currently there are a lack of simulation tools to model this. This is confirmed in the IPC Technology Roadmap for Electronics Interconnections 2015 it states “In order to better deal with the demands for increased interconnection density and respond to market demands for better return on capital investment in assembly equipment, there is a need within the manufacturing industry for continued improvement in tools and software for modeling and simulation. Needs in this area include better methods of load balancing and improved machine utilization? The tools for determining the balance on assembly lines will need to be flexible to handle the mix of assembly types that manufacturers now face.”

Rockwell Automation partnered with Universal Instruments to develop a tool to model a large quantity of products and the impact of SMT line configurations. The information used for the modeling includes placement per panel information and machine components placed per hour capability. With these tools an electronic assembly plant can be modeled and analyzed to identify improvement opportunities and perform “what if” analysis to model impact of machine changes.

12:00pm - 1:00pm
Join us for a complimentary lunch and networking on the Show Floor!
A Special Thank You To Our Lunch Sponsors:

2:00pm - 2:45pm
Will Webb DfX – Design For Excellence using EMS 4.0
William E. Webb, ASTER Technologies LLC

Design for Excellence (DfX) can be used as part of an organization’s Continuous Improvement Programme to decrease product development time, product cost and manufacturing cycle time, while increasing product quality, reliability and ultimately the customer satisfaction. It will significantly decrease the overall cycle time from the design concept to customer delivery, which is a critical success factor. Design for Excellence makes it possible to implement a Lean Test approach that produces a lower cost product whilst maintaining the highest quality.

ASTER’s vision is articulated on two principles: 1) Using traceability and repair loop information in order to qualify the customer defect universe. The defects include design defects, manufacturing defects and functional defects. 2) Importing the defect opportunities and identifying the possible consequences of inadequate testability and test coverage on a new design.

3:00pm - 4:00pm
Meet and Greet with the Best in the Business! Join us after the show for Networking and Celebration at the West Club at Sports Authority Field

A Special Thank You To Our Reception Sponsor:


January 29

SMTA Webinar: Moving from "F" to "G"- Changes to IPC A-610/J-STD-001   +

January 29, 2018
1:00pm-2:00pm Eastern
Presented by: Norman Mier, BEST
Complimentary Webinar for Members!

This webinar discusses at a high level the newest versions of the IPC A 610 (Acceptability of Electronic Assemblies) and the companion J-STD-001 (Requirements for Soldered Electrical and Electronic Assemblies) specifications which came out late in 2017. Heading in to the new year there will be some changes in inspection criteria and board assembly process specifications. The IPC-A-610 document is one of the most widely-circulated by the electronics assembly industry. It defines the acceptance standard for assembled boards. The companion JSTD-001 is a document describing how boards should be assembled. Both of these document shave been "up-rev'd" to version "G" from version "F" effective November 2017. Both documents most significant and important changes will be highlighted in this session. If you have already purchased your copy of revision "G" of both documents then please e-mail specific questions to Norman ahead of time so that your issue, time allotting can be addressed in this one-hour session.

Intended Audience:
Process engineers, QC inspectors, designers and procurement personnel all use the IPC-A-610 document and could find use in the review of the new documents. IPC trainers within companies will also find some good information as they prepare for their new 2018 certification classes.

Topics will include:

  • New figures in tables and acceptance criteria updates in Butt/I Connections (610)
  • Cross referenced and added applicability of both MIL and international standards for worldwide acceptance (JSTD)
  • New figures and requirements for various cable configurations (JSTD)
  • Variety of criteria for various SMT components was updated (JSTD, 610)
  • Scope and purpose sections updated as well as an objective section were added (JSTD)
  • Wiring section changes were made to variety of topics (610)
  • Changes to supported hole acceptance criteria including but not limited to solder conditions and meniscus in solder (610) Norman Mier

Norman Mier is a U.S. Marine Corp. retired veteran with over 20 years of experience in the electronics rework and repair industry. He received his training through the Navy's Micro Miniature (2M) Electronic Repair Program. He has progressed through every level of rework and repair recognized in the industry. Norman has also earned the highest certifications awarded by IPC in electronics training, being certified as a Master Instructor in IPC A-610, IPC J-STD-001D, IPC/WHMA-A-620 and IPC 7711/7721. He has worked through BEST for several electronics industry leaders and created tailored courses for their equipment. This also includes providing training to technicians and engineers in surface mount and advanced surface mount technology. The knowledge Norm has brought to these companies has been invaluable to their process improvement efforts. His skill has also been a major factor in keeping BEST training at the forefront in the electronics-training field. He has taught several sessions at local and international conferences as part of APEX, SMTA International.

January 30

Massachusetts (Boston) Chapter: Advancement in Microelectronic Packaging for Medical Implants  +

Holiday Inn Hotel & Suites, Marlborough, MA

SMTA Boston Chapter and iMAPS New England cordially invites you to attend a joint meeting on Tuesday Jan. 30, 2018 at the Holiday Inn Hotel & suites in Marlborough, MA
Advancement in Microelectronic Packaging for Medical Implants - Solving the Need for "More" with "Less" Space
By Caroline Bjune, Sr MTS, Draper
Date: Tuesday, Jan. 30, 2018
Time: 5:30 PM to 9:00 PM EST
Location: Holiday Inn Hotel & Suites , Marlborough, MA
265 Lakeside Ave.
Marlborough, MA 01752
Cost: See registration link below
Caroline will present approaches in microelectronics packaging taken for several systems, including a cranial mounted neural interface, peripheral nerve interface for advanced prosthetics, and ultra-miniaturized neural stimulator.
Click here for more details

Click here to register for this event

For questions about registration, please contact iMAPS Registration Chair: 
Matt Bracy

January 30

SMTA Webinar: Certification Program  +

Join us for a free informational webinar on the SMTA Certification Program!

January 30, 2018
1:00pm-2:00pm Eastern
Presented by:
Jim Hall, ITM Consulting
Ronald Lasky, Ph.D., Indium Corporation/Dartmouth College
Take advantage of this opportunity to familiarize yourself with the SMTA Certification program and learn more about the process and requirements. You will hear from Certification instructors and have the chance to ask them questions. This webinar will be recorded and made available to registered attendees afterward so even if you can't make the live event, you can access the Webinar. Sign up today to reserve your spot! Intended Audience:
The program is intended for manufacturing and process engineers. Additionally, production, design, test and quality engineering personnel, as well as SMT assembly managers who want to confirm their current competence at a fundamental level of overall process technology should also consider participating. Jim Hall Jim Hall Bio:

  • SMTA Processes Certification Instructor
  • ITM Consulting Principal Consultant
  • Over 35 years experience in electronic assembly technology
  • Experience in developing Vapor Phase and Convection reflow soldering systems
  • Engineering expertise in process development and integration, fluid and thermodynamics and computer control systems
  • Written and presented numerous technical paper and professional development workshops at SMTAI, APEX, and other industry venues
  • Co-creator of the SMTA Processes Certification program Dr. Ron Lasky Dr. Ron Lasky Bio:
  • SMTA Lean Six Sigma Green Belt Certification Instructor
  • Indium Corporation Senior Technologist and Dartmouth College Visiting Professor
  • Over 35 years in electronic and optoelectronic packaging
  • Author of 5 books and numerous technical papers
  • Holder of numerous patent disclosures
  • Developer of several new concepts in SMT processing software
  • 2003 SMTA Founder's Award Winner
  • Lean Six Sigma master black belt instructor

Looking for a local chapter event? Check the Chapter News page for more events.
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