Calendar of Events

   2018      

                                   

2018

July 19

Rocky Mountain (Colorado) Chapter: Business After Hours at Photo Stencil  +

Location
16080 Table Mountain Parkway, Suite 100, Golden, CO 80403



SAVE THE DATE!
The SMTA Rocky Mountain Chapter
After Hours Meet & Greet Event on July 19, 2018
Hosted by:
Join us for an SMTA After Hours Meet & Greet event at Photo Stencil. See the new factory in Golden and learn about today's stencil technology and SMT printing challenges.


Established in 1979, Photo Stencil specializes in the design and manufacture of high performance stencils and tools. Photo Stencil services the following markets:
- Semiconductor
- SMT
- Defense
- Medical Devices
- Automotive

Our host for the event is Ms. Susan Holmes. Ms. Holmes has worked in the SMT stencil industry for over 30 years. During her tenure, she has experienced a number of changes and challenges in the industry - from solder paste and fluxes to special materials and adhesives. There continues to be an increased demand to print through smaller and smaller apertures onto multi-level surfaces, substrates or around densely populated components. Ms. Holmes' short presentation will look closer at these challenges as they relate to stencil pringint applications. She will also briefly touch on advancements made with nano coating technology.

Meeting Details:
Where: Photo Stencil
When: July 19, 2018
Time: 3:00 - 6:00 PM
Registration Fee: FREE for all SMTA members
Address: 16080 Table Mountain Pkwy
Golden, CO 80403
Questions: Contact Patty Chonis at 970-443-9233

Beer, wine and appetizers will be provided.

Interested in sponsoring an event? Contact Patty Chonis at patty@atekllc.com or 970-443-9233 for a listing of available opportunites.



July 19

Western Pennsylvania (Pittsburgh) Chapter: 2018 SMTA West Penn Membership Appreciation Golf Outing  +

Location
Norvelt Golf Club



THis event is cancelled.  Please look for announcements for other events soon.

2018 West Penn Chapter
SMTA Member Appreciation Golf Outing
Thursday, July 19, 2018

Norvelt Country Club
 168 Holly Pl, Mt Pleasant, PA 15666

(724) 423-5400
https://www.norveltgolfclub.com/

Location right off I-70 near PA turnpike New Stanton Exit.  

The SMTA West Penn Chapter is excited to invite you to participate in our membership appreciation golf outing.   Golf format is a four person scramble with prizes and other give aways.  Skins challenge $5.00 per player 

Event is no cost to SMTA members and sponsors.  Guest golfers and non-members are $50.  Included are green fees, golf cart, practice greens, lunch vouchers, and buffet dinner follwing the round of golf.

Please join us for a fun day of networking with fellow SMTA members and sponsors and an exicting round of golf!
 
You may come with your own four-some or we will team you up.   Each person needs to register seperately though.   

Registration Deadline July 10, 2018 - Register at:
https://www.smta.org/chapters/rsvp.cfm?BEE_ID=4501

 
Not an SMTA Member?  No problem!  You may join now or at the event!!!  Cost $95.00 a year!
Visit www.smta.org to join!

Event Schedule
 
Check In:  10:00 AM - we will give you your team, starting hole, and lunch vouchers.  Let us know at check in if you already have a team foursome.
Shotgun Start:  11:30 AM
Lunch:  Use vouchers whenever you would like throughout the round
Buffet Dinner:  Approximately 4:30 PM


Complimentary Practice Greens are open all morning
 
Skins challenge $5.00 per person for all players
 
Questions regarding the event?  Contact Shane Proud at:  sproud@pennatronics.com        
Interesting in sponsoring a hole for $150?  Contact Jason Emes at:  jasone@newpig.com  

Thank you from West Penn Chapter and we hope to see you there!

 




August 2

Upper Midwest (Minnesota, Iowa & Dakotas) Chapter: Upper Midwest Chapter's 27th Annual SMTA Golf Tournament  +

Location
The Wilds Golf Club




August 2, 2018 SMTA Golf Tournament

 
 
The 27th Annual SMTA Golf Tournament will be held at The Wilds Golf Club in Prior Lake, MN and moving back to a Thursday.  This year we’re going to have a shot gun start at 11:00AM.  The deadline to register is July 19th.  Payments must be received by July 26th to ensure your spot.  The sign-up for the golf tournament is on a first come, first served basis with a maximum of 80 golfers.  Below is all the information on this year’s tournament.
 
                                    
 
What: Twenty-Seventh Annual SMTA Golf Tournament
 
When: Thursday, August 2nd, 2018 @ 11:00AM
 

Location:
The Wilds Golf Club
3151 Wilds Ridge
Prior Lake, MN 55372
(952) 445-3500
 
Shotgun Start: 11:00AM. Please arrive by 10:00AM for check-in.  Lunch will not be provided.
 
Registration: Register by Friday, July 19th to Erik Stromberg via email at estromberg@e-tronix.com.  Include your name, company name, telephone #, and your average score for 18 holes. If you have any questions you can reach me at (612) 803-2619.
 
Fees: $65 for 18 holes. This fee includes golf, cart, prizes, and an early dinner. All fees must be received by Friday, July 26th. No-shows will be invoiced. Space is limited so please make your reservations early.
 
Checks Payable to: SMTA
 
Send Checks to:
Erik Stromberg
E-tronix
6333 Cambridge Street
Suite 201
St. Louis Park, MN 55416
 
Tournament: The tournament will consist of a four-person scramble. We will organize the teams based on your golfing caliber in order to make the teams fair. The number of suppliers and users in the four-some will also be taken into consideration. As most of you know from previous years, the tournament will be played in rain or shine unless it is lightning outside, so plan accordingly to the weather conditions.
 
Dinner:  ASM Assembly Systems and the SMTA local chapter will be sponsoring an early dinner after the tournament for everyone in the clubhouse starting at approximately 4:00 p.m. 
 
Prizes: Each supplier donating a prize will get a sign at the tee box stating their name and what event the prize is awarded for. Prizes will be presented at the dinner at the end of the tournament. All winners must be present to receive their prize. Please direct all prize offerings to Jeff Kennedy at (612) 902-6259
 

Hole In One Contest:  A Rolex watch valued at $5000.00 is up for grabs for anyone who can put the ball in the cup.  NO MULLIGANS



August 9

Mexico - Guadalajara Chapter: REGISTRO! SMTA Tijuana Foro Tecnico y Expo  +

Location
Real Inn Tijuana, Paseo de los Héroes 9902, Zona Urbana Rio Tijuana.



Acompañanos a este gran evento, la entrada es gratuita, solo es necesario registrarse en la siguiente liga y tendras acceso a conferencias de alto nivel y a la zona de expo en donde encontraras a los proveedores mas importantes de la Industria Electronica.

¡ REGÍSTRATE AQUÍ !
 
Join us for this great event, the admission is free, you only need to register in the following link and you will have access to high level conferences and the expo area where you will find the most important suppliers of the Electronics Industry.

 REGISTER HERE !
 

Si estas interesado en reservar una mesa para la zona de expo favor de contactar a:
If you are interested on a table top, please contact:
Jaime Arreola
+52 1 (33) 3157 0636
jaime.arreola@pemtron.com
Secretary SMTA Guadalajara



August 14 - 15

South East Asia Technical Training Conference on Electronics Assembly Technologies 2018 (Rescheduled Dates)  +

Location
Eastin Hotel Penang
Penang Malaysia


The South East Asia Technical Conference on Electronics Assembly is a highly technical event that is focused on today's most important and timely issues. The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. We encourage our colleagues in Malaysia to come together to share their knowledge and their vision for addressing these challenges.

The conference is "claimable from HRDF under SBL scheme."

 

View the Technical Program Here!

 

Keynote Speaker

Recent Advances in Flip Chip, WLCSP, and FOWLP

John H. LauWednesday, August 15th
John H. Lau, ASM Pacific Technology

Recent advances in (1) flip chip such as wafer bumping, package substrate, assembly, and underfill, (2) fan-in WLCSP (wafer-level chip scale package) such as relaxation layer and under-bump metallurgy (UBM)-free WLCSP, and (3) FOWLP (fan-out wafer-level packaging) such as chip-first with die face-down, chip-fist with die face-up, and chip-last or redistribution layer (RDL)-first will be presented in this study. Emphasis is placed on the latest developments of these technologies in the past few years. Their future trends will also be discussed.

 


Professional Development Courses

 

Flip Chip, WLCSP, and FOWLP Assembly and Reliability
Tuesday, August 14
John Lau, Sr. Technical Advisor, ASM

The major trend in the electronic industry today is to make products such as smartphones, tablets, wearables, internet of things, etc. more personal by making them smarter, lighter, smaller, thinner, shorter, and faster, while at the same time making them more friendly, functional, powerful, reliable, robust, innovative, creative, and less expensive. As the trend towards miniature and compact products continues, the introduction of cool products that are more user-friendly and contain a wider variety of functions will provide growth in the market. Some of the key technologies that are helping to make these cool product design goals possible are flip chip, WLCSP (wafer-level chip scale package), and FOWLP (fan-out wafer-level packaging). Their PCB (printed circuit board) assembly and solder joint reliability will be presented and discussed in this lecture.

 

Understanding Parameters Affecting Barrel fill in Wave Soldering Process
Wednesday, August 15
AF Ng, Consultant, Techment Consultancy Sdn Bhd

Conventional Wave Soldering has been employed for soldering of boards since long time ago. The related manufacturing personnel are well aware of common encumbering defects happen erratically with this process. Some of these defects encountered daily are bridging, solder skips, solder voids and insufficient barrel fill or hole-fill. Many of us would agree that we are still facing challenges on one of the common defects – poor barrel fill. The problem is confounded with currently High density/Multilayer thick PCB and applying Lead-free soldering. It is important for the Engineering personnel to understand the root causes of the defect, as it can be contributed by factors from board design, material procurement to equipment setting and maintenance. With these numerous factors implicating, the engineers involved must be equipped with sufficient knowledge on soldering fundamentals, laminate composition, thermal demands, design geometry, wetting mechanism during wave contact and equipment maintenance. Commonly, many engineers just adopt recommendations based on DOE results and hoping to get consistent good barrel fill, but mostly to their disappointment due to erratic parameter shift. Many engineers approach the problem by tweaking process parameters on fluxing, preheating, solder pot temperature, wave height adjustment and others, it merely be just a containment and not able to achieve consistent good barrel fill. We need a practical approach in tackling this vexing problem. To do that, one needs to know the fundamentals of wettability involving molten solder. The molten solder wicks up the barrel depend critically on the surface tensions of molten solder in relation to the solder interface with component terminals and copper plated holes. Upon discovering of the root causes, then, appropriate engineering solutions are to be implemented, be it equipment upgrade, board re-design, process adjustment or material changes. The course aims to provide a concise description of these factors through simplified notes, shared experiences and interaction in class.

 



Why Should You Attend:

  • There will be adequate time to have our industry experts respond to your questions
  • Networking time will allow you to continue discussions following the presentations
  • This is one of the best ways to enhance your knowledge and your company's profitability
  • Extensive participation from experts from around the world provides for a comprehensive educational experience
  • The SMTA reputation ensures high quality technical information that can be put to use immediately

 


August 14

Austin (CTEA) Expo & Tech Forum  +

Location: Norris Conference Center
2525 West Anderson Lane
#365
Austin, TX 78757



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on July 19th, 2018!
Click here for Ad and Sponsorship opportunities!
Important Exhibitor Materials:



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

 

Free Technical Session Program:

8:30am

Attendee Registration Opens

 

9:00am

"Live Teardown of iPhone X - Steve Jobs' iPhone"

Speaker: Bill Cardoso, Ph.D., Creative Electron, Inc.

It’s been 10 years since Steve Jobs introduced the iPhone to the world. Much has happened since then.  Over this past decade, the iPhone became a reference design, and the object of desire of a legion of fans who wait anxiously for every launch of the Cupertino company. Undoubtedly the most advanced iPhone in the market today, the iPhone X is a technology marvel.  The double stacked boards, dual battery, and a face recognition sensor bring the iPhone X to a whole different level.

In this presentation, we’ll explore these technological advances by a live teardown of the iPhone X. The teardown will be followed by a detailed coverage of the technical details of critical parts of the device. This live teardown will be accompanied by x-ray and CT images of the iPhone X, so the audience will get unprecedented insights on what makes this iPhone tick.  More importantly, we will explore the assembly process utilized to put the iPhone X together.  This presentation is targeted at a wide technical audience looking for a better understanding on how advance consumer electronics are designed and assembled.

 

9:30am

"Smart Autonomous Machine Platforms> IoT in Motion"

Speaker: Kwok Wu, Ph.D., NXP Semiconductors

NXP is engaged in delivering smart capabilities and features for use cases such as Autonomous self-driving cars, Smart connected Cars, and ADAS. The talk will take this approach to the next level by leveraging NXP’s Smart Machine Platform to deploy solutions for numerous smart city applications, pushing “mobile IOT” (m-IOT 4.0) to the “Edge”.

 

10:00am

Expo Hall Opens

 

11:00am

"Cybersecurity in Self-Driving Cars: Helping to Prevent Hacking"

Speaker: Paul Golata, Mouser Electronics

As autonomous vehicles start appearing on our roads, so the importance of their cybersecurity grows.  Self-driving cars and trucks are heavily dependent on communication links to operate safely and perform fundamental tasks.  These links to the outside world enable vehicles to receive over-the-air (OTA) software updates, live traffic data, navigation and road sign information, and data from other vehicles.  Unfortunately, this means exposing multiple surfaces to hackers for attack.  Everything from the wireless vehicle-to-infrastructure (V2I) and vehicle-to-vehicle (V2V) links, to a straightforward USB drive containing firmware can be vulnerable to attack, and these vulnerabilities, if not mitigated, could compromise passengers’ and other road users’ safety.

 

Thank you to our Lunch Sponsor:

 

 

12:00pm

COMPLIMENTARY LUNCH

 

1:00pm

Door Prize Drawings

 

1:30pm

"Packaging and Assembly Challenges for Advanced Driver Assistance Systems"

Speaker: Linda Bal, TechSearch International

ADAS and eventually autonomous driving require recognition of surrounding conditions by a variety of sensors, then decision-making and operation in response.  There are multiple sensors with overlap in their coverage areas.  The combinations of sensors (radar, LIDAR, ultrasonic, camera, and V2X) vary by integrator, automotive maker, and vehicle model.  What type of semiconductor packages are used for each sensor and what are the future challenges as new package types are adopted?  This presentation discusses some of the opportunities in automotive packaging and the challenges in meeting automotive specifications.

 

3:00pm

Expo Hall Closes


August 15

San Diego Chapter: 08-15-18 Material Management 4.0  +

Location
HME, 2848 Whiptail Loop W, Carlsbad, CA 92010



Abstract:
Over the past years the electronic assembly industry has focused on the development of Industry 4.0, a standard communication protocol that allows production equipment to dialogue. This communication protocol will be a key enabler to improve the quality and efficiency of the production line. This is achieved by creating a feedback loop between inspection and production – thus allowing problems to be identified and corrected as early as possible in the manufacturing line. As a result, the overall cost of manufacturing is reduced as yield rates increase.

Despite the great progress in the development of the integrated production line, a critical part of the manufacturing chain remains offline. Inventory rooms around the world still must operate with a far reduced level of sophisticated. It is not uncommon to find thousands of reels densely packed in hundreds of linear feet of shelving space. The simple exercise of counting back reels as they come back from the production floor is not standard practice. And even when they are counted, the count is often made by hand. The lack of focus on the automation of our inventory rooms leads to an increasing loss of productivity due to line stoppages. When associated with the recent increase in lead times for electronic components, line stoppage has become a crippling problem that makes inventory accuracy a necessity.

In this presentation, we’ll introduce Material Management 4.0. More than a set communication protocol between machines that count electronic parts and the machines that store them. From x-ray parts counters to fully automated and intelligent storage towers, Material Management 4.0 embraces the overall infrastructure that needs to be in place to realize an accurate, fast, and efficient methodology for inventory control. This investment is critical to realize the benefits in efficiency unleashed by Industry 4.0.

Speaker: Bill CardosoCEOCreative Electron
Bill started his first company in Brazil at age 17 and sold it a few years later when invited by the US Department of Energy to work at Fermi National Accelerator Laboratory to do nuclear and high energy physics research. As the Department Head for Systems Engineering and after a 10-year long career at Fermilab, Bill moved from Chicago to sunny California to start Creative Electron. True to the American Dream, Creative Electron quickly grew from Bill's garage to the largest US manufacturer of x-ray machines for the electronics industry (no longer in his garage). At Creative Electron Bill leads the team of engineers who designs and manufactures x-ray systems that are shipped worldwide. Starting with an associate’s degree at age 13, Bill has a BS, MS, and PhD degrees in Electrical and Computer Engineering and an MBA from The University of Chicago. Bill is the president of the SMTA San Diego chapter and member of the technical committee for SMTA International, SMTA Counterfeit Conference, and SMTA LED Conference, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium. He is an IEEE Senior member and the author of over 150 technical publications, author of 2 books, owner of a few patents, and a frequent speaker at technical conferences.

RSVP by: 08/13/18, Linksmta.org/chapters/rsvp.cfm?BEE_ID=4416
Registration: 5:30PM
Dinner: 5:45PM-6:45PM
Presentation: 6:45PM
Facility Tour: 7:45PM
Location: HME, 2848 Whiptail Loop W, Carlsbad, CA 92010




August 20

Webinar: PCB Design, Fabrication and Use from an End User's Perspective  +



August 20 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenters:
Charles Cawthorne, MBDA Systems
Ian Fox, Rolls Royce

Overview

Printed Circuit Bare Boards form the fundamental and crucial basis for most Circuit Card Assemblies. However, with the advanced electronics components that are available today, PCBs have to be complex to provide the interconnect for these component types. Given this background, what is the best approach to acquire PCBs that will work and will provide long term reliability?

This webinar, which follows on from the "Guide to Printed Circuit Board Manufacture" from March 2017, gives a more advanced insight into the Design, Test, Qualification, Inspection and Handling of PCBs from a purely high reliability end users perspective. The webinar is aimed at design/manufacturing/process engineers, technicians and trainers.

Topics include:

Definition of PCB Materials
Surface Mount Design Rules
PTH Design
Micro-via Design
Via Planarisation and Via Protection
Controlled Impedance
Surface Finishes
PCB Test
PCB Qualification
Incoming Inspection and Quality Standards
Handling of PCBs from a Drying Perspective

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here


August 20 - 22

SMT Processes Certification (PRIDE Industries)  +

Location
PRIDE Industries Foundation
Roseville , CA


Held at PRIDE Industries Foundation

10030 Foothills Blvd.
Roseville, CA 95747

  • August 20 Course (8:30-5pm)
  • August 21 ½ day of course + exam
  • August 22 All day exam (8:30-5pm)
  • Instruction: English
  • Test: English

Instructor: Jim Hall, ITM Consulting

Reduced In-House Rate: $915 for members or $970 for non-members.

Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination. This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes.

Why You Should Participate
Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.

  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience
  • The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


August 21

Intermountain (ID, UT) Chapter: Boise SMTA Golf Scramble - Aug 21, 2018  +

Location
Shadow Valley Golf Club, 15711 Highway 55, Boise Idaho



Boise SMTA Golf Scramble - Aug 21, 2018
Shadow Valley Golf Club
SMTA Intermountain Chapter
Boise Golf Scramble
What:  SMTA Shadow Valley Golf 2018 - Golf Scramble
When:  Aug. 21st Shot gun start 8:00 AM with lunch following
Where:  Shadow Valley Course - Boise, Idaho


Team and Individual sign-up deadline Aug. 14th
Team and Hole Sponsor sign-ups also due at that time
We also welcome donations for prizes like closest to the pin, longest drive and others
    
COSTS:
Team sponsor $350—fees and lunch for 4 (sponsor may provide shirts or caps) Team Sponsor sign.
Hole sponsors:  $200 and choice of available hole.  Includes one player and hole sponsor sign.
Mulligans:  $10 each, Must purchase in advance
Individuals are Welcome!!  We will sign you up to a team.  Fee is just $65.  This includes Green fees, cart, range balls and lunch.  Please Join us! 
We guarantee you will have a good time!



Contacts to RSVP and for Sponsorships:
David Bell 208-867-6006 or dcbell@q.com

Contact for details about course, map: Shadow Valley Golf Club
http://www.shadowvalley.com/directions/
15711 Highway 55, Boise Idaho.  Course Phone #208-939-6699


August 23

Mexico - Querétaro Chapter: Roundtable  +

Location
CIC 4.0 UTEQ



The SMTA Queretaro Chapter is pleased to invite you to participate in our :
Solder Roundtable Meeting - Queretaro 
Location : UTEQ , Queretaro - Mexico 
Date : August 23,2018
Speakers : If you would like to host this event please contact Guillermo Maldonado
Gmaldonado@ste-latinoamerica.com 

Meeting fee :  
  • Members = 
  • Nonmembers = 
 



August 23

Atlanta Chapter: Atlanta Chapter SMTA Meeting  +

Location
Viscom 1775 Breckinridge Pkwy #500 - Duluth, GA 30096




Fall is just around the corner and that means your Atlanta SMTA Chapter is ready to host another chapter meeting to kick off the season. The next meeting is detailed below. 

When: August 23, 2018
Where, Viscom Incorpoated. 
1775 Brekenridge Parkway, #500
Duluth GA. 30096

Sign in and networking - 4:30
Dinner - 5:00 - 5:45
SMTA business and update 6:45 - 6:00
Presentation - 6:00 - 7:00
Speaker TBD

 



August 23

Capital Expo & Tech Forum  +

Location: Johns Hopkins University/Applied Physics Lab
Kossiakoff Center
11100 Johns Hopkins Road
Laurel, MD 20723



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early Bird pricing ends Friday, July 27th, 2018!

Click here for Ad and Sponsorship opportunities!
Important Exhibitor Materials:

Click HERE for discounted hotel rates



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry! Exhibit Hours:
Thursday, August 23rd, 2018
9:00AM–3:00PM
Registration Opens at 8:00AM

Free Technical Program & Schedule:

7:30AM

Registration Opens

8:30 AM - 9:15 AM
Versatile Nanocopper Materials- System for High
Performance Printing, Assembly and Packaging

Speaker: Alfred Zinn, Kuprion, Inc.

9:00 AM
Expo Opens

9:45 AM - 10:30 AM
Additive Manufacturing Corporate Development
KEYNOTE SPEAKER: Geoffrey Doyle, Jabil Circuits, Inc.

 

11:00 AM - 11:45 AM
Industry 4.0 the Next Industrial Revolution -
The Smart Factory

Speaker: MB Allen, KIC

12:00 PM

Complimentary Lunch

1:30 PM - 2:15 PM
Avoiding the Pitfalls of Voiding in PCB Assemblies
Speaker: Kim Flanagan, Indium Corporation


3:00 PM
Expo Closes


August 27 - 30

SMTA China South Technology and Vendor Conferences 2018   +

Location
Shenzhen Convention & Exhibition Center
Shenzhen China


SMTA China South
27-30 August 2018
Shenzhen Convention & Exhibition Center, Shenzhen, PR China

The SMTA China cordially invites you to participate in SMTA China South Conference located in Shenzhen 2018. This event, held in conjunction with NEPCON China 2018, will as usual address the industry's most pressing issues in electronics assembly/ manufacturing, industry/technology roadmap, business focus, advanced packaging, practical skill development, emerging technologies, and lead-free & reliability.


August 28

Wisconsin Chapter: Wisconsin Chapter - Golf Scramble  +

Location
Brown Deer Golf Course: 7625 N Range Line Rd, Glendale, WI 53209



Please RSVP before making Payment!
Click HERE to RSVP Now!!


When:
  • Tuesday August 28, 2018 at 8:00 am

Where:
  • Brown Deer Golf Course: 7625 N Range Line Rd, Glendale, WI 53209
  • Description: “Brown Deer Golf Course is a classically designed 18 hole facility with bent grass fairways, tees and greens that has hosted an annual PGA tour event,  USGA national championships and now hosts an LPGA Symetra Tour event, the PHC Classic.  You can always expect the course conditions to reflect those high standards.  The golf courses unique and individual holes are carved out masterfully with a river running throughout the entire course. The course was originally designed by George Hansen and founded in 1929 and was partially redesigned by Andy North and Roger Packard. Brown Deer is truly a must play for any golf lover!
 
Price:
  • $40 SMTA Members and $60 for non-SMTA Members
 
Format:
  • Scramble: Teams of 4. Each players drive will need to be used at least once. Any threesomes will have option for 1 player to tee off twice. 2 putt maximum to keep up rate of play.
  • First Place prize
  • 1 Mens and 1 Womens longest drive, closest to the pin, and one longest put.
  • 72 Spots available: Please confirm through Josh Casper (jcasper@horizonsales.com) or Jana Esselman (jesselmann@identco.com) if you have a team and you would like to play together. All other teams will be put together by SMTA Staff.

Food and Drink:
  • Each player will be provided with 2 complimentary drink tickets.
  • Coffee and Donuts provided upon arrival.
  • Complimentary Lunch following the Scramble-Vendor Sponsorships:
  • $200 Sponsorship opportunities available: Includes tee box Logo Sign, 1 round of golf, 2 drink tickets and Lunch.
_____________________________________
Do you want to sponsor a hole?
Click Here to Sponsor a Hole

______________________________________




September 11 - 13

SMT Processes Certification (Querétaro, Mexico)  +

Location
Querétaro , JA Mexico


  • September 11- Course (8:30-5pm)
  • September 12- ½ day of course + exam
  • September 13- All day exam (8:30-5pm)

  • Instruction: English/Spanish
    Test: English
    Instructor: Iván Castellanos, Indium Corporation


September 12

Mexico - Guadalajara Chapter: SMTA Monterrey Foro Tecnico y Expo  +

Location
Crowne Plaza Aeropuerto Monterrey



Mesas de exposicion disponibles / Table top available

Para hacer su reservación de mesa favor de contactar a:
To make the payment of you table top please contact:

Jaime Arreola
+52 1 (33) 3157 0636
jaime.arreola@pemtron.com
Secretary SMTA Guadalajara




September 12

New England Expo & Tech Forum  +

Location: DCU Center
50 Foster Street
Worcester, MA 01608



Exhibitors

The cost to exhibit for corporate members is $450/$550 (Early/Late) and $550/$650 (Early/Late) for non-corporate members.(click here for membership information)

The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Early bird expires on August 10th, 2018!

All spaces will be assigned once we are sold out. If there is another exhibitor you want to be next to please let us know when you sign up. 

Exhibitor Sponsorship Opportunities

Exhibitor Hard Copy Application

Please contact SMTA Expo Manager Courtney Kalb with questions or for additional information.



Attendees

September 13

Indiana Chapter: SMTA Indiana Reformation Symposium (Hosted by Samtec)  +

Location
520 Park East Boulevard New Albany, IN 47151-1147



This year we are trying to have two tours that are mainly educational in nature. Our partners at Samtec have decided to host the first tour and they have put together plans for a very interesting day. The tour will be on September 13th, 2018 from 10AM until 2:30PM. Please feel free to contact me (Alister.McLeod@indstate.edu) if you are hoping to attend or RSVP. We need a response by August 31, 2018.Speakers & Topics


David Decker - Connector Processing Challenges

David Decker graduated with a Masters of Engineering degree in Mechanical Engineering from the University of Louisville’s Speed Scientific School in 1993 and earned his Professional Engineering license in 1998.  After beginning his career as an Injection Mold Tooling Engineer with Lexmark, Inc. and then General Electric Appliances, David moved on to Samtec where he has worked for 22 years holding positions in New Product design, Custom Product design and has been the Manager of the Interconnect Processing Group for the last 15 years.  David is also a Lieutenant in the Reserve Division of the Clark County Sheriff’s Office, where he has served for 8 years.lick here for David’s Bio

Topic Summary
 Connector Processing Challenges: Samtec’s Interconnect Processing Group, IPG, serves our customers in a variety of valuable ways.  By being intimately involved in the design process from initial concept through product release, we ensure our connectors have been designed for assembly and will integrate seamlessly into the customer’s application.  If for whatever reason there are problems during assembly, IPG’s thorough understanding of our products, gained during exhaustive process testing and development, enables us to interact with the Process Engineer to quickly diagnose the issue and get the customer back on line.  This technical topic will discuss common processing questions IPG receives. What are your connector challenges?

 

 Keith Magiera - 3D printing
Keith Magiera graduated from Purdue University with a BS in Materials Engineering in 1993.  Later in his career he also received an MBA from Purdue University and JD from John Marshall Law School, Chicago.  He began his career as a Materials Engineer in the microelectronic industry.  After many years of materials engineering in microelectronics, he then turned his focus to business development.  Recently he changed industries from electronics to 3D printing at Forecast 3D in Carlsbad CA, still focusing on materials engineering and business development.  He resides outside Chicago in northwest Indiana.lick here for David’s Bio

Topic Summary
3D printing is the different processes used where material is joined or solidified under computer control creating a three-dimensional object. During these processes, a material is added together being fused together from liquid molecules, powder grains or filament wire.  Unlike material removed from a stock in the conventional machining process, 3D printing builds three-dimensional objects from CAD models, usually by successively adding material layer by layer.  3D printing is used in both rapid prototyping and additive manufacturing (AM).  Objects can be of almost any shape or geometry and typically are produced using digital model data.  There are many different technologies, like stereolithography (SLA) or fused deposit modeling (FDM), Selective Laser Sintering (SLS), PolyJet, Multi Jet Fusion (MJF) and Direct Metal Laser Sintering (DMLS). 3D printing technology continues to advance, breathing life into designs that were previous difficult/impossible to make.  It also supplies support tooling/fixtures with reduced leadtime and cost and can even help solve obsolescence issued faced by many industries. It is often claimed that 3D printing signals the beginning of a third industrial revolution, succeeding the production line assembly that dominated manufacturing starting in the late 19th century



September 17

Webinar: Manual Cleaning of Printed Board Assemblies – Step By Step Guide  +



Bob WillisSeptember 17 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

After rework, modification or second stage assembly cleaning may need to be considered. Ideally a no clean flux, gel or solder paste should be used to avoid the need to clean selected areas. If manual cleaning is to be conducted every effort should be made to use materials or application methods that result in the minimum residues from the soldering process.

Planning and training staff in manual cleaning is very important to get the best possible result visually and to maintain product reliability. This is one of the first training sessions to cover manual cleaning of board assemblies, highlighting the problems and solutions to manual cleaning.

Topics include:

Why clean
Material selection
Manual cleaning techniques
Testing cleanliness
Inspection requirements
Component compatibility
Reliability test techniques

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here


September 19

San Diego Chapter: 09-19-2018 3D Packaging for the SMT Specialist  +

TBD



Topic: 3D Packaging for the SMT Specialist

Speaker: Charles Bauer, Ph.D. -TechLead Corporation
Educated at Oregon Graduate Center - 1980 Doctor of Philosophy in Materials Science and Engineering, Ohio State University 1975 Master of Science degree in Metallurgical Engineering and Stanford University, 1972 Bachelor of Science in Materials Science and Engineering, his current position is Senior Managing Director of TechLead. He is working on areas of strategic technology planning, market analysis and international business development. Chuck has more than 35 years experience ranging from printed circuit board and hybrid fabrication, through complex IC metallization, multilayer packaging, multichip modules, system in package, 3D packaging, flat panel display packaging and assembly, as well as nano-technology. Past employment includes Coors Advanced Electronics Group in Golden, Colorado (1989-1990) and Tektronix in Beaverton, Oregon (1978-1989).
Awards/Associations
Dr. Bauer lectures throughout the world on technology, business and market topics as well as serving on several corporate boards and international corporate, government andeducational institution advisory councils. A Senior Member of IEEE, he remains active in theSMTA, JIEP, ASM and IMAPS as well. Dr. Bauer served on the Boards of both the SMTA and IMAPS and as President of IMAPS in 2001-2002. He currently serves as the International Development Chair for the SMTA. Awards received include Tektronix Technical Innovation Award, Fellow of IMAPS, and the International Leadership Award from the SMTA, Jesuit High School Hall of Fame, University of Portland Significant 75 Alumni and SMTA 25th Anniversary Luminary as founder of the Pan Pacific Microelectronics Symposium. He holds Patents and has published more than 150 papers.

Stay tuned for the abstract and meeting location....


September 20

Intermountain Utah Expo & Tech Forum  +

Location: University of Utah
A. Ray Olpin University Union - Saltair Room
200 S Central Campus Drive
Salt Lake City, UT 84112



Exhibitors

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on August 31st, 2018!

Click here for Ad and Sponsorship opportunities!
Important Exhibitor Materials:



Attendees

Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Exhibit Hours:
Thursday, September 20, 2018
10:00AM–3:00PM

 


October 4

Long Island Expo & Tech Forum  +

Location: Melville Marriott Long Island
1350 Walt Whitman Road
Melville, NY 11747


Exhibitors

Please contact Sharon Dietrich with questions or for additional information.



Attendees

Please see the Long Island Chapter Page for More Information on Technical Sessions and Expo Materials.

 


October 8

Webinar: Wave Soldering Lead-Free – Setting up Your Process Parameters  +



Bob WillisOctober 8 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

Presenter: Bob Willis, SMTA Europe

Overview

Do we have all the answers to successful lead-free wave soldering? No, and to quote a well-known soldering metallurgist, we often don’t even know all the questions. Lead-free is new to many and the wave soldering process is the most affected by the change of materials with cost increase in alloy, solder bath and copper erosion plus increased temperatures all make process change demanding. During this presentation we will look at the practical experience to date and try to provide answers to as many questions that have come to light during early introduction. The presenter has produced training video and interactive CD-ROMs on wave soldering and conducted the Electrovert “Workshop of Machine Soldering” for over 10 years with theory and hands on sessions worldwide.

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

Topics include:

Checking key aspects in design
Copper erosion problems
Effect of tin-lead on joint reliability
Equipment settings, pre heat, fluxer, wave settings
Inert soldering
Effect of bath contaminates
Quality control checks
Common soldering defects, causes and cures

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

All webinar times shown are UK time – to check your local time in your countries click here


October 14 - 18

SMTA International 2018  +

Location
Donald E Stephens Convention Center
Rosemont , IL


Join your industry colleagues from around the globe this Fall for SMTA International, the electronics assembly industry's best technical conference. Get the latest in-depth technical information you need to be successful in your workplace. SMTA International offers educational opportunities covering manufacturing and assembly of electronics, advanced packaging/components, inspection technologies, processes, substrates/PCB technology, soldering, quality and reliability.


October 16 - 18

SMT Processes Certification (SMTA International 2017 - Rosemont, IL)  +

Location
Donald Stephens Convention Center
Rosemont , IL


Co-located with SMTA International Conference.
  • October 16- Course (8:30-5pm)
  • October 17- ½ day of course + exam
  • October 18 All day exam (8:30-5pm)

  • Instruction: English
    Test: English
    Instructor: Jim Hall, ITM Consulting

    Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination.

    This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.

    Why You Should Participate
    Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.

  • Enhance your stature in our industry
  • Increase marketing value for your company
  • Obtain proof of your knowledge and experience

    The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.


  • October 16 - 17

    SMTA International Electronics Exhibition  +

    Location: Donald E. Stephens Convention Center
    Rosemont, IL


    Exhibitors Register Now
    Exhibitors

    SMTA International delivers value to you and your organization through our goal to bring our members and visitors together to focus, exchange ideas and share the newest technologies. Last year we welcomed over 1600 attendees from 21 different countries.


    October 23 - 25

    International Wafer-Level Packaging Conference  +

    Driving an Interconnected World

    Location
    DoubleTree San Jose Airport Hotel
    San Jose , CA


    IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.


    October 23 - 24

    International Wafer-Level Packaging Conference Exhibition  +

    Location: Double Tree Hotel
    2050 Gateway Place
    San Jose, CA 95110



    Exhibitors

    Sponsorship and Exhibitor Information

     


    Dates: October 23-24, 2018
    Location: DoubleTree by Hilton Hotel, San Jose, CA

    Monday, October 22

    Move in: 10:00am-4:00pm

     

    Tuesday, October 23

    10:00am-4:30pm

    4:30pm-6:00pm (Networking Reception)

     

    Wednesday, October 24

    10:00am-4:00pm

    Move out: 4:00pm-7:00pm


    IWLPC Expo 2017 Application

     

    View the exhibitor prospectus and application for 2018!

     

    How Much is it to Exhibit?

      Early Registration
    Before/On July 30th
    Regular Registration
    After July 30th
    One Booth
    (8' D x 10' W)
    $1500 $1700
    One Table
    (6' Table)
    $1100 $1300

    More information will be available about the Exhibition soon.

    Why Exhibit at IWLPC?

    * Reach a focused international audience
    * Generate Exposure in this highly competitive marketplace
    * Share New Products and concepts to the market
    * Enhance Relationships with existing customers and generate new leads
     

    What type of attendees will be there?

    Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!

    Click here to view the floor plan!

    IWLPC Floorplan

     



    Attendees

    Note - If you already registered for the IWLPC conference you do not need to register separately to attend the expo.


    October 24

    San Diego Chapter: 10-24-18 Octoberfest  +

    A Local Micro Brewery TBD



    If you would like to have an Octoberfest this year, let us know. We are looking for your input on this!
    Location:  A local micro brewery
    Time: 5:30PM
     


    November 1

    LA/Orange County Expo & Tech Forum  +

    Location: The Grand Event Center
    4101 E Willow Street
    Long Beach, CA 90815



    Exhibitors

    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 6th, 2018!
    Click here for Ad and Sponsorship opportunities!
    Important Exhibitor Materials:



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry! Exhibit Hours:
    Thursday, November 1, 2018
    10:00AM–3:00PM

    8:00am

    Registration Opens

     

    10:00am

    Expo Opens

     

    11:00am-11:30am 

    Material Management 4.0

    Speaker: Bill Cardoso, Ph.D., Creative Electron

    Over the past years the electronic assembly industry has focused on the development of Industry 4.0, a standard communication protocol that allows production equipment to dialogue. This communication protocol will be a key enabler to improve the quality and efficiency of the production line. This is achieved by creating a feedback loop between inspection and production - thus allowing problems to be identified and corrected as early as possible in the manufacturing line. As a result, the overall cost of manufacturing is reduced as yield rates increase.


    In this presentation, we'll introduce Material Management 4.0. More than a set communication protocol between machines that count electronic parts and the machines that store them. From x-ray parts counters to fully automated and intelligent storage towers, Material Management 4.0 embraces the overall infrastructure that needs to be in place to realize an accurate, fast, and efficient methodology for inventory control. This investment is critical to realize the benefits in efficiency unleashed by Industry 4.0. 

     

    11:45am

    Complimentary Lunch

     

    1:00pm-1:30pm 

    Challenges in PCB Design

    Speaker: Vern Wnek, C.I.D., Mentor Graphics

    The PCB Design process can be as simple as drawing schematics, doing the layout of the board, and providing the fabrication information to the manufacturing vendor. In this session, we will discuss a few topics that illustrate how technology and the complexity related to the PCB Design process has evolved in recent years and how Mentor solutions can help to overcome the challenges in PCB Design. 

     

    2:00pm-2:30m 

    An Intelligent DFM Approach to PCB Manufacturing

    Speaker: Patrick McGoff, Mentor

    PCB complexity continues to accelerate. It seems we used to be able to speak in terms of a simple progression of technology, but today we know there are advances in materials, construction, manufacturing processes and component technology that multiply the complexities of PCB manufacturing. With such a myriad combination of factors, it makes for very challenging PCB design reviews for manufacturability.

    However, just as the PCB technology has advanced, so has the Design for Manufacturing (DFM) software. Best practice companies use the intelligence in the PCB design data to drive their DFM analysis for more accurate, comprehensive and consistent results across users. In this session we will discuss how to use the intelligence in the design data to your PCB manufacturing advantage.

     

    3:00pm

    Expo Hall Closes


    November 11 - 13

    SMT Processes Certification (Guadalajara, Mexico)  +

    Must be registered and paid by October 6th to participate in this course

    Location
    Guadalajara , JA Mexico


    Co-located with Guadalajara Expo.

    • November 11- Course (8:30-5pm)
    • November 12- ½ day of course + exam
    • November 13- All day exam (8:30-5pm)

    • Instruction: English/Spanish
      Test: English
      Instructor: Ivan Castellanos


    November 13 - 15

    SMTA-IPC High Reliability Cleaning and Conformal Coating Conference  +

    Location
    Chicago Marriott
    Schaumburg , IL


    Organized by SMTA and IPC

    November 13-15, 2018
    Chicago Marriott
    Schaumburg, IL

    "How clean is clean?" is more challenging to answer as conductors and circuit traces become narrower. What is acceptably clean for one industry segment may be unacceptable in others. Brought to you by IPC and SMTA, the High-Reliability Cleaning and Conformal Coating Conference will cover technological developments in all areas of cleaning and coating applied to electronics assemblies. The event will include a technical conference, two half-day tutorials, networking activities and tabletop exhibits. Tutorials will provide practical information on materials, equipment and methodologies at the basic-to-intermediate levels. The technical conference will feature advanced-level presentations from subject-matter experts, emphasizing case studies of real-world problems along with solutions.

     


    Call for Participation

     


    November 14 - 15

    Guadalajara Expo & Tech Forum  +

    Location: Expo Guadalajara
    Guadalajara



    Exhibitors

    Please see the Guadalajara Chapter Page for More Information on Expo Materials.

    The Guadalajara Expo is SOLD OUT! Please contact Courtney Kalb or Hannah Funk to be placed on our waitlist.

     

     

    Click Here for the Guadalajara Hotel Room Block

    Group Name: SMTA Nov 2018

    Group Code: SMT



    Attendees

    Attendee registration is not yet open. Check back soon. 

    Please see the Guadalajara Chapter Page for more information on technical sessions.
     

    Click HERE for current floorplan!


    November 19

    Webinar: Hand Soldering & De-Soldering with Lead-Free Solder  +



    Bob WillisNovember 19 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

    Presenter: Bob Willis, SMTA Europe

    Overview

    Hand soldering and de-soldering with lead-free solders does requires higher process temperatures. This material change can impact on the printed circuit board and components used. It can also impact on the tooling leading to increased cost and maintenance in your facility.  Soldering with lead-free can be simpler than you think if staff are provided with the correct procedures and a better understanding of the process and the type of joints they will be producing.  Changes to material and processes in your factory is an ideal time to eliminate poor practices that have been used for many years leading to extra rework and cost.

    Each delegate will receive a copy of all of the slides presented plus a set of posters on soldering to print on site for future training.

    Topics include:

    Soldering theory and what is different
    Cored solder wire
    Soldering operation
    Soldering iron care
    Tip corrosion issues with lead-free
    De-soldering techniques
    Lead-free inspection criteria
    Typical lead-free defects

    The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

    All webinar times shown are UK time – to check your local time in your countries click here


    November 26

    Webinar: ESD Electrostatic Discharge Guide for Everyone  +



    November 26 @ 2:30pm - 4:00pm GMT (9:30am - 11:00am US Eastern Time)

    Presenters: Jeremy Smallwood & Charles Cawthorne from SMTA Europe Explain All

    Overview

    When handling most of today’s electronic components, printed circuit assemblies (PCAs) or equipment that contains electronics, special consideration must be given to the potential damaging consequences resulting from static electricity. Electrostatic discharge (ESD) can result in PCAs or higher level equipment failing test in the factory, or worse still, it can result in latent defects that can cause subsequent failure in the field. So what is electrostatic discharge and how is electrostatic discharge damage prevented?

    This webinar provides an elementary guide to the principles of ESD control, looking at the basic theory behind the subject and the practical methods that can be adopted used to enable components, PCAs and equipment to be handled without the risk of incurring electrostatic related damage. The webinar is aimed at personnel who are new to the industry, including design and process / manufacturing engineers, technicians, trainers and also at those who support manufacturing indirectly (i.e. purchasing, account managers, sales staff, etc.)

    Topics include:

    • What is ESD and why is it important
    • How static charges are generated
    • How static charges can be transferred to electronic components
    • Illustration of the damage that can be sustained by electronic components following electrostatic discharge
    • What is an Electrostatic discharge Protected Area (EPA)
    • How to set up an EPA within a factory
    • What practical controls are required to prevent electrostatic damage
    • How to store / transport electrostatic sensitive components / PCAs
    • How to handle electrostatic sensitive equipment out in the field

    The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar

    All webinar times shown are UK time – to check your local time in your countries click here


    November 28

    Silicon Valley Expo & Tech Forum  +

    Location: Bestronics Box Build Facility
    2243 Lundy Avenue
    San Jose, CA 95131



    Exhibitors

    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).
    The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on October 26th, 2018!

    Click here for Ad and Sponsorship opportunities! Important Exhibitor Materials:

     



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Exhibit Hours:
    Wednesday, November 28, 2018
    9:00AM-3:00PM

     

    Technical session program to follow...


    Looking for a local chapter event? Check the Chapter News page for more events.
    SMTA Headquarters
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    Phone 952.920.7682
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