Calendar of Events
SMT Processes Certification (Eden Prairie, MN) +
Eden Prairie , MN
Instructor: Jim Hall, ITM Consulting
Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma Green Belt. The program concludes on days two and three with an open and closed book examination.
This is not an entry-level program. Basic algebra will be used in the workshop and examination. This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as "Certified" by the SMTA in SMT Processes or Six Sigma Green Belt.
Why You Should Participate
Technologies change at the speed of light, and competition and expectations are forever increasing. This comprehensive program will provide the refresher course, study materials and examination allowing you to be recognized as an SMTA Certified Process or Six Sigma Green Belt Engineer.
The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.
Wisconsin Expo & Tech Forum +
6401 S 13th St,
Milwaukee, WI 53221
The cost to exhibit is $350/$425 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$525 (early/regular).(click here for membership information).
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet.
Please contact Steve Stiller at firstname.lastname@example.org for questions or for additional information.
Please see the Wisconsin Chapter Page for More Information on Technical Sessions and Expo Materials.
2017 International Electrostatic Discharge Workshop +
Tahoe City , CA
The IEW facilitates access to and interactions with industry leaders through invited seminars, technical sessions, special interest groups (SIGs), discussion groups (DGs), and invited speakers. Participants meet in a relaxed, invigorating atmosphere and engage in discussions about the latest research and issues of interest within the EOS/ESD community.
Puget Sound Expo & Tech Forum +
15255 NE 40th Street
Redmond, WA 98052
The cost to exhibit is:
$450 for one 8'x10' booth, or $800 for 2 booths.
$350 for one 5' table, or $600 for 2 tables.
The cost to exhibit includes 2 5' X 19 ½” tables, 2 chairs, light and electricity.
Please contact Anny Zhang to register for the event.
Please see the Puget Sound Chapter Page for More Information on Technical Sessions and Expo Materials.
Two Technical Programs:
1. 2.5/3D Packaging
2. New developments in Lead free Solders, Board Level Adhesive/Underfill, and Interconnect
SMTA Webtorial: Ball Grid Array, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination +
Two (2) 90 minute Sessions
May 9 and 11, 2017
12:00pm to 1:30pm Eastern (5:00pm to 6:30pm UK)
Presented by: Bob Willis, bobwillis.co.uk
This session includes all BGA (Ball Grid Array), BMC (Bottom Mounted Components), PoP (Package On Package) component assembly and process setup with inspection methods and common failure detection and elimination. Bob's presentation comes alive with many unique process video clips on testing and failures which provide a clear understanding of the root cause of failure and corrective action. A FREE copy of Bob's e-book on PoP is available to delegates and a copy of his area array posters is provided to each engineer attending this course.
Bob produced the first training videos, interactive CDs on area array technology and the first book on PoP assembly and soldering
Topics will include:
Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Technical Committee. Although a specialist for companies implementing Surface Mount Technology Mr Willis provides training and consultancy in most areas of electronic manufacture. He has worked with the GEC Technical Directorate as Surface Mount Co-Coordinator for both the Marconi and GEC group of companies and prior to that he was Senior Process Control Engineer with Marconi Communication Systems, where he had worked since his apprenticeship. Following his time with GEC he became Technical Director of an electronics contract manufacturing company where he formed a successful training and consultancy division. As a process engineer, he was involved in all aspects of electronic production and assembly involved in setting up production processes and evaluating materials; this also involved obtaining company approval on a wide range of Marconi's processes and products including printed circuit board manufacture. During the period with Marconi, experience was gained in methods and equipment for environmental testing of components, printed boards and assemblies with an interest developed in many areas of defect analysis. Over the last 15 years he has been involved in all aspects of surface mounted assembly, both at production and quality level and during that time has been involved in training staff and other engineers in many aspects of modern production. Over the past few years Mr. Willis has travelled in the United States, Japan, China, New Zealand, Australia and the Far East looking at areas of electronics and lecturing on electronic assembly. Mr. Willis was presented with the Paul Eisler award by the IMF (Institute of Metal Finishing) for the best technical paper during their technical programmes. He has conducted SMT Training programs for Texas Instruments and is currently course leader for Reflow and Wave Soldering Workshops in the United Kingdom. Mr Willis is an IEE Registered Trainer and has been responsible for training courses run by the PCIF originally one of Europe's largest printed circuit associations. Bob has conducted workshops with all the major organisations and exhibition organisers World Wide and is known for being an entertaining presenter and the only presenter to use unique process video clips during his workshops to demonstrate each point made. Bob has written two book which are free to download on line, Design & Assembly with Pin In Hole Intrusive Reflow & Package On Package Design, Assembly and Inspection Mr. Willis was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and has been elected Honorary Life President and currently holds the position of SMART Group Technical Director, he also works on BSI Standards Working Parties. He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers. Bob Willis currently writes regular features for AMT Ireland, Asian Electronics Engineer and Circuits Assembly the US magazine. He also is responsible for writing each of the SMART Group Charity Technology reports, which are sold in Europe and America by the SMTA to raise money for worthy causes. Bob ran the SMART Group PPM Monitoring Project in the United Kingdom supported by the Department of Trade and Industry. He was coordinator of the LEADOUT Project for SMART Group. LEADOUT was one of the largest EU funded projects, currently he is coordinating European projects TestPEP, uBGA and ChipCheck In September 2015 Bob voted the Best Speaker at SMTA International Conference in Chicago, USA
Carolinas Expo & Tech Forum +
6426 Burnt Poplar Rd
Greensboro, NC 27409
The Carolinas Expo & Tech Forum has SOLD OUT! Please contact Emily to be put on a wait list at email@example.com or call 952-920-7682. Thank you!
The cost to exhibit for corporate members is $375/$475 (Early/Late) and $450/$550 (Early/Late) for non-corporate members.(click here for membership information)
The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on April 14th, 2017!
Important Exhibitor Materials:
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Tuesday, May 16, 2017
Free Technical Program & Schedule:
A Special Thank You To Our Coffee Sponsor: Nortec Humidity!
Accelerating the Internet of Things Economy in NC
Bob Stennett, Business Development Manager, NC RIoT
If the 3rd industrial revolution pumped electricity into every object, the Internet of Things - coined the fourth industrial revolution - will inject intelligence into every object. The IoT market opportunity provides a rare chance for forward thinking industries, cities, states, and regions to stake a claim on this rapidly emerging market.
Here lies the problem this generation faces in the midst of a digital transformation: With such a massive overhaul of our systems on the horizon, how will businesses, towns, institutions and the workforce adapt? How can IoT become a tool for all, instead of furthering the digital divide between urban and rural communities? Who will serve as the connective tissue to bring multiple stakeholders together to capitalize on IoT’s possibilities efficiently and effectively? How will organizations efficiently leverage the technology tipping points that enable this revolution?
It’s these questions that RIoT strives to answer. Our mission: capture IoT opportunities through economic development, education, and ecosystem building in support of the Internet of Things and disruptive technologies.
11:00AM – 11:45AM
2D, 2.5D, and 3D X-Ray Inspection – What’s a “D”?
Bill Cardoso, Ph.D., Creative Electron
The use of x-ray inspection in the electronics industry has gained wide adoption in the past 20 years, driven mainly by the development and use of bottom terminated components (BTC). The use of ball grid arrays (BGA), for example, allowed the development of standards and guidelines that dictate the maximum void size in each ball. In consequence, x-ray machine manufacturers developed solutions that address these requirements to became an integral part of the quality assurance function of modern electronic manufacturers.
However, as new x-ray technologies are introduced – from new algorithms to new hardware – users are faced with a growing range of options to choose from. Users need a solid technical background to understand these options to make an educated decision when acquiring x-ray inspection capabilities. Unfortunately, x-ray companies are not always clear about the pros and cons of each option. As a result, users end up buying too much or too little capabilities. In either situation, the user is left without the right x-ray inspection solution.
The goal of this presentation is to give the audience the tools needed to avoid making mistakes when acquiring x-ray inspection capabilities. We will set the record straight and clearly define critical concepts in x-ray inspection. The different x-ray modalities, 2D, 2.5D, and 3D x-ray inspection will be explained in details at the user level – no math involved. Most importantly, this presentation will cover when each modality must be utilized for a successful quality assurance program. A rich set of images and videos will be used to illustrate the advantages and disadvantages of each x-ray inspection modality.
A Special Thank You To Our Coffee Sponsor:General Microcircuits, Inc!
1:00PM – 1:45PM
IPC-1782 Standard for Traceability of Critical Items Based On Risk
Cameron Shearon, Lead Quality Engineer, AT&T
Traceability has grown from being a specialized need for certain safety critical segments of the industry, to now being a recognized need for the industry as a whole, especially those companies who use remote EMS partners. The perception of traceability data collection persists as it being a burden to manufacturing, then providing value only when the most rare and disastrous of events take place. Different requirements for traceability have evolved in the industry, dictated mainly by OEM companies, which create confusion. In addition, counterfeit materials are now being seen as being a growing epidemic in the industry, creating significant additional costs for inspection as well as rework and recall, with no way currently to successfully assign responsibility.
Traceability, as defined by the IPC-1782 standard, is the first such standard for the electronics assembly industry, and represents the opportunity to resolve all of these issues, creating a single flexible traceability specification that can be adopted for all company sizes and sectors across the industry. The scope includes support for the most demanding instances for detail and data integrity such as those required by critical safety systems, all the way through to situations where only basic traceability, such as for simple generic consumer products, is required.
In this presentation, we will illustrate applications and examples of how traceability can be of continuous value and benefit to manufacturing itself, as well as being insurance against any serious market defect. The effectiveness of traceability against counterfeit will also be shown.
Traceability, as defined by the IPC-1782 standard represents the most effective quality and anti-counterfeit tool available, becoming an intrinsic part of the best practice “Smart factory” operation.
2:15PM – 3:00PM
What Can You Do In A Smart Factory?
Zac Elliott, Technical Marketing Engineer, Mentor Graphics
We hear a lot these days about “Smart Factories”, including such buzzwords as “Industry 4.0”. But mostly, we hear questions. What makes a factory “Smart”? Do I need a massive solution from a certain provider, or can the overall solution be built up from functions provided by different providers? How would they all work together? What are the components to make an existing factory into a “Smart” one so as to avoid capital expense? Is there an affordable “Smart” Solution for smaller companies?
Answering all of these questions is very important, as in a competitive market, opportunity has been seen to be fading away over the last few years, in favour of manufacturing in remote locations around the world. Today however, the tables are turning, and for some have already turned. With greater tax incentives for on-shored manufacturing on the horizon, improved automation and robotics technology, there is a renewed feeling of optimism in the industry, but rewards only for those who embrace the latest industry expectations.
This presentation shows how the Smart factory is closely related to on-shoring, and the technologies that are necessary to bring access to the Smart factory within reach of everyone, to existing factories today.
Contamination, Cleaning and Coating Conference +
Radisson Blu Hotel Amsterdam Airport Schiphol
Organized by and
May 22-24, 2017
Radisson Blu Hotel Amsterdam Airport Schiphol
Thank you for attending!
SMTA and SMART Group thank you for being part of their first-ever co-organized conference in Europe. The conference focus was on contamination, cleaning and conformal coating in the manufacture of electronics. We hope to see you next year for this two-day event featuring presentations, workshops, and a panel discussion.
Thank you exhibiting companies!Foresite
Conference OrganizersConference Chair:
Mike Bixenman, KYZEN Corporation
Contamination, Cleaning and Coating Expo +
Location: Radisson Blu Hotel Amsterdam Airport Schiphol
Monday, May 22: 2:30 p.m. - 6:00 p.m.
Tuesday, May 23: 8:30 a.m. - 5:30 p.m.
Wednesday, May 24: 8:30 a.m. - 3:00 p.m.
For a hard copy of the sponsorship and exhibits form in USD, click here.
For a hard copy of the sponsorship and exhibits form in Pounds Sterling or Euro, click here.
Exhibit space entitles you to:
Register here to attend the expo only!
Technical conference and workshops not included.
Plan now to join us for free lunch and the chance to network with leading suppliers to our industry!