Calendar of Events

   2017      

         Apr                          

April 2017

April 4

SMTA Webinar: Exploring Interferometry Sensors for Advanced Packaging Metrology Applications  +


Tuesday, April 4, 2017
11:00am-12:00pm Central
Presented by: Julia Brueckner, Ph.D., Quantum Analytics

Julia Brueckner Complimentary Webinar for Members!

Overview:
The end of node scaling is approaching. As a consequence, the need to start scaling the packages is growing constantly. Fan out wafer-level packaging (FO-WLP) offers an efficient solution due to its possibility for high IO count, thin package and short development times. The process flow to build a so called redistribution layer (RDL) requires a full lithography and plating cycle. To ensure a reliable product, all involved process steps need to be tightly monitored and controlled accurately. The challenge here: how to measure step height of pads or under bump metallization (UBM) features on structures that are not completely flat and show height variations. In this webinar, we’ll explore ways to tackle that problem and introduce the work flow of a stable algorithm to evaluate the above mentioned features automatically for different devices. We will discuss how White Light Interferometry (WLI) and Spectral Coherence Interferometry (SCI) can be used to achieve fast and accurate measurements of step heights, critical dimensions (CDs) of pads, UBM structures, as well as polymer thickness. We will share data taken from measurements - displaying full wafer maps, 3D profiles, and identifying the anomalies that are revealed.

Topics Covered:

  • White light interferometry sensor and technology
  • Spectral coherence interferometry sensor and technology
  • Measurement principles
  • Application examples in packaging
  • Data evaluation
  • Who Should Attend:

  • R&D Managers
  • Laboratory Managers
  • Operators
  • About the Presenter:
    Julia, a native of Offenbach, Germany, received her Bachelor and Master of Science degrees from Johann-Wolfgang-Goethe University, Frankfurt. In 2015, she received her Ph.D. in Chemistry from the University of Heidelberg for her dissertation: Ultrafast Triplet Formation in N-Substituted Pentacene Derivatives. During her studies she was awarded several scholarships including a Fulbright scholarship to UC Berkley, and a Procter & Gamble award for the best thesis in the Master of Chemistry studies. Upon receiving her Ph.D., Julia joined Sentronics Metrology in Mannheim, Germany as an applications scientist. In March 2016, she was requested to directly work with Quantum Analytics, the US distributor to promote Sentronics Metrology equipment in the US semiconductor industry.


    April 5

    West Penn Expo & Tech Forum  +

    Location: DoubleTree Monroeville
    101 Mall Plaza Blvd.
    Monroeville, PA 15146


    Exhibitors

    The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early bird pricing ends on March 3rd, 2017!

    Important Exhibitor Materials:

  • Advertising and Sponsorship Opportunities
  • Hard Copy of Exhibitor Reg Form

  • Exhibitor Details
  • Please contact SMTA Director of Exhibitions Emily Stuckmayer with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!


    Exhibit Hours:
    Wednesday, April 5, 2017
    10:00AM–3:00PM


    Free Technical Program & Schedule:

    More Details Coming Soon!

    8:00AM
    Registration Opens

    Special Thanks to Our Coffee Sponsor:



    8:30AM-9:30AM
    Reducing QFN Voiding
    Mario Scalzo, Indium Corporation

    9:30AM
    Expo Opens

    10:00AM – 11:00AM
    Coping with Pb-free in High Performance Engineering Design
    Anthony Rafanelli, Ph.D., Raytheon Corporation

    As Pb-free technology increasingly becomes the standard for electronic interconnects and finishes, engineers must cope with the various challenges posed by these materials both as interconnections and finishes. Summarizing at a high level, these challenges represent risks associated with 1) durability of the interconnection and 2) deleterious effects of tin whiskers. The IPC PERM Council has been the lead industry group focusing on the identification of those challenges and risks associated with use of these new materials. Their efforts have led to a significant increase in the knowledge base with respect to technical guidance and risk mitigation resulting in tools for use by the many engineering disciplines (design, manufacturing, quality, production, materials science) that comprise successful aerospace and defense product development. These tools are mostly made up of standards and handbooks focused on system performance, tin whisker risk mitigation, Pb-free product testing, technical guidance, and rework/repair. What was missing was design guidance. Accordingly, IPC Task Group 8-81D (Research Coordination and Technical Guidance), of the IPC PERM COUNCIL, has undertaken an assignment to generate an industry-wide guide to aid engineers in designing with Pb-free technology. The focus is to provide insight and information such that the design will maintain performance requirements for aerospace, defense, and high-performance (ADHP) products and systems. Having started out as a "laundry list" of Pb-free concerns and challenges identified by the ADHP industry, the guide is structured such that those “delta” considerations, i.e. technical knowledge gaps with Pb-free technology are brought to the designer’s attention. Furthermore, the guide highlights Pb-free concerns, as they are encountered in the phases which generally reflect the product development cycle used by Aerospace, Defense, and High-Performance systems industries. This paper presents an overview of the PERM Council and a summary of efforts to generate a Pb-free design guide.

    Complimentary Hot Lunch

    Special Thanks to Our Lunch Sponsor:



    12:30PM – 1:30PM
    Why Reball BGA’s
    Brian Watson, SemiPack Services

    Why BGA Reballing? There are multiple reasons to Reball BGA's. From design aspects to life span to EOL components that have oxidized to quality and yield improvement, BGA Reballing is an essential part of non commercial applications. We will review thee aspects, plus best practice and the options available to reball components. A brief overview will also be given on this subject.

    I . Support of Sn/Pb for Military and Space designs
      a. Designs that were qualified as tin/lead cannot be switched to lead-free without re qualification.
      b. If additional hardware is needed years later everything must be converted to tin lead.
      c. Typical programs require a 20 year spare parts purchase at the end of production.
      d. Electronic parts acquired 10-20 years ago often require some kind of re-tinning.
      e. Building new hardware with refinished components will increase quality and yields.

    II . Reliability
      a. Tin whiskers have been discovered on SAC 305 BGAs.
      b. Electronic failures from tin whiskers can be intermittent and difficult to trouble shoot. (Hughes Satellite lost spacecraft due to tin whiskers)
      c. Solder joint life for tin lead has been studied for many more years than lead-free.
      d. The long term life of lead-free solders is still to be determined in actual use.


    2:30PM – 3:30PM
    Stencil Nano-coating: Filtering the Fact from the Fiction
    Speaker TBA, StenTech

    Stencil nano-coating has been promoted in the US for more than 4 years… but many questions remain as to when and where these techniques and products can and should be implemented. As a key figure who helped to promote and bring attention to this technology in the USA, Eric Moen hopes to answer many questions as to the benefits, uses, and effectiveness of utilizing stencil nano-coating for improving solder paste printing yields. What are the optimal conditions for nano-coating? When should nano-coating not be used? Where is the proof of the effectiveness of nano-coating? How long will the nano-coating last? The purpose of this presentation is to help in answering these and many other questions relevant to the topic of stencil nano-coating.

    4:00PM
    Expo Closes


    April 18

    Puget Sound Defect Resolution Chapter Tutorial Program  +

    Location
    Astronics AES
    Kirkland , WA 98034



    Instructor: Jim Hall, ITM Consulting

    April 18, 2017
    8:30 a.m. - 4:00 p.m.
    Astronics AES
    12950 Willows Road NE
    Kirkland, WA 98034


    Price:
  • Members: $200
  • Non-Members: $275 (A one-year Individual SMTA Membership is included in the non-member price.)
  • SMTA Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $70 (A one-year Student SMTA Membership is included in the non-member price.)
  • Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    Introduction:
    We don’t assemble electronics in “perfect world”. Defects happen! This course examines Failure and Root Cause analysis of PCBA defects, starting with clear definition of the generic types of defects and their impact, such as non-function, reduced reliability, etc. Detection and determination methodologies and procedures will be discussed. Cause and effect of defects relative to specific processes and equipment centers as well as materials are presented. Key causes of assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing Failure and Root Cause analysis and defect resolution including managers, engineers and others in manufacturing, quality and design.

    Course Outline:
    Part 1

  • Introduction
    - Prevention: Process Development and Validation
    - Variation (Common Cause)
    - Continuous Improvement
  • Defect Definition
    - Failure – PCBA does not function
    - Repair or Scrap
    - Escapes – Identified by customer
    - Reduced Reliability
    - Process Indicator
    - Special Cause vs. Common Cause
  • Defect Identification
    - Inspection
        * Manual
        * AOI
        * X-Ray
    - Test
        * ICT
        * Functional
        * Contamination
    - False Calls / Escapes

  • Causes of Defects
    - Special Cause vs. Common Cause
    - Variability (repeatability)
    - Accuracy
    - Process not Optimized
  • Root Cause Analysis
    - “5 Whys”
    - Cause and Effect Diagram
        * 6 M’s
        * Levels: Specific Processes vs Interactions

  • Process Relationships
    - Incoming Materials
    - Handling
    - Process Problems
        * Wrong Process
        * Degraded Process
        * Poor Process (common cause defects)

    Part 2

  • Specific Processes
    - General: wrong process, material, etc.
    - Printing
    - Placement
    - Soldering
    - Singulation
    - Coating
    - Mechanical Assembly
    - Testing

  • Specific Defect Examples and Causes
    - Wrong Part
    - Damaged Parts
    - Shorts
    - Opens
    - Poor Wetting
    - Insufficient
    - Contamination
    - New Specific Defects
        * HiP
        * Graping
    - Pad Cratering
    - CAF

  • Conclusion
  • Questions

    Jim Hall About the Instructor:

    Jim Hall
    Jim Hall is a Principal Consultant and resident Lean Six Sigma Master Black Belt with ITM Consulting (Springfield, TN). His area of responsibility includes working with OEM’s, Contract Assemblers, and Equipment Manufacturers to solve design and assembly problems, optimize facility operations, as well as teaching basic and new technologies in private and public forums throughout the industry, world-wide. He is one of the featured “Assembly Brothers” on the audio feature “Board Talk” hosted on the Circuit Insight online magazine. Since joining ITM in 2001, Mr. Hall has helped numerous clients in such areas as:

  • SMT implementation and assembly facility set-up
  • SMT manufacturing process audits and process improvement
  • Manufacturing yield improvement
  • Productivity analysis and optimization
  • On-site training for all levels of personnel
  • Design for Manufacturability (DFM) specification development
  • Equipment evaluation and selection
  • SMT process equipment benchmark testing and evaluation
  • SMT product development

    Jim is one of the authors of the highly acclaimed SMTA Process Certification Course, along with Dr. Ron Lasky and Phil Zarrow. From its introduction in September 2002, he has served as the program’s principal instructor, certifying over 500 engineers in the US, Canada, Mexico, Malaysia, Hong Kong, and China. Mr. Hall, coordinates and implements all updates and improvements to the exams and course materials.

    As ITM’s resident Lean Six Sigma Master Black Belt, Jim is a strong proponent of in-process data capture and analysis for all assembly and related operations and other continuous improvement techniques. He participates as an instructor in the Lean – Six Sigma programs offered through the Thayer Engineering School, Dartmouth College, presenting units on subjects including:

  • LEAN
  • FMEA
  • DFM
  • DMAIC
  • Cost Estimating
  • Failure Analysis

    Mr. Hall, one of the pioneers of reflow technology, has been actively involved in electronic assembly technology for over 35 years. Jim’s expertise lies in process development and integration, fluid and thermodynamics, and computer control systems. He has delivered numerous papers and workshops on surface mount technology at technical seminars around the world including those for SMTA, IPC, and IMAPS.


    Contact Karen Frericks at 952-920-7682 with questions.


  • April 19

    Atlanta 21st Annual Expo  +

    Location: Infinite Energy Center (Formerly Gwinnett Center)
    6400 Sugarloaf Parkway
    Duluth, GA 30097


    Exhibitors


    The Atlanta Expo & Tech Forum has SOLD OUT! Please contact Emily to be put on a wait list at emily@smta.org or call 952-920-7682. Thank you!

    The cost to exhibit is $450/$550 (early/regular) for corporate members. The cost to exhibit for non corporate members is $550/$650 (early/regular).(click here for membership information).

    The cost to exhibit includes: one 8x10 pipe-and-draped booth, one 6ft draped table, two chairs, company sign, lunch, directory listing and registrant list. Electricity is an additional $55 per booth. Early bird expires on March 8th, 2017!

    Click here for Ad and Sponsorship opportunities!

    Important Exhibitor Materials:

  • Hard Copy of Exhibitor Reg Form
  • Map to Infinite Energy Center Loading Docks

  • Please contact SMTA Expo Manager Emily Stuckmayer with questions or for additional information.



    Attendees

    Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

    Show Hours: 10:00AM – 3:00PM


    Special Thanks to Our Coffee Sponsor:


    AM Technical Sessions 10:30AM - 11:30AM:
    Contamination and Cleaning Forum
    Moderated by Doug Philbrick, I. Technical Services


    A panel of three industry representatives and two local manufacturers will discuss current cleaning and contamination challenges pertaining to electronics assemblies and stencils.

    Industry Representatives

  • Kalyan Nukala, ZESTRON Americas
  • Fernando Rueda, KYZEN Corporation

    Local Manufacturers
  • Patrick Dorsch
    Staff Process Development Engineer
    L3 Aviation Products
    1355 Bluegrass Lakes Parkway
    Alpharetta, GA 30004
    Phone: 770-752-7000

  • Paul N. Houston
    Director of Engineering
    Engent, Inc.
    3140 Northwoods Pkwy. Suite 300A
    Norcross, GA 30071
    Phone: 678-990-3320

    Hidden Gems: Emerging Tools, Techniques, and Technologies for Achieving Higher Yields, Optimized ROI, and Minimizing Defects in Your Electronics Assembly Process
    Jeff Mogensen, President, Utopia Sales Partners

    Mogensen

    Jeff Mogensen will discuss a host of new tools and technologies that will help achieve higher yields and maximize ROI in the areas of stencils, solder paste printing and inspection, reflow, and metrology. The goal of this technical session is to acquaint the attendee with a summary of many new products and processes throughout the assembly process that are helping to propel our industry toward “zero defects.”

    Special Thanks to Our Lunch Sponsor:




    PM Technical Sessions 1:00PM – 2:00PM

    Industry Roundtable
    Moderated by Pete Waddell, Technical Editor, PRINTED CIRCUIT DESIGN & FAB/CIRCUITS ASSEMBLY; President of UP Media Group

    Pete Waddell

    Hosted and moderated by Pete Waddell, Technical Editor, PRINTED CIRCUIT DESIGN & FAB and a PCB designer for 20 years, this informal discussion will focus on the world of PCB design, its challenges, its future, with a focus on how to facilitate communication with the entire PCB supply chain, including fabrication and assembly. If you're a PCB designer or engineer, provide EDA software or just want to understand how to better work with a design group, join us for a casual conversation that promises to be a lively look at the world of PCB design...and beyond.


    Solder Paste and Voiding Challenges
    Tim O’Neill, Technical Marketing Manager, AIM Solder

    ONeill
    Tim O’Neill will present the salient details of two separate presentations: “Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction,” which was presented at Apex 2017, and his white paper “A Practical Guide to Optimizing Solder Paste Performance for Ultra-Fine Feature Printing.”

    Special Thanks to Our Snack Sponsor:



    Join us after the Expo at Tin Lizzy's Cantina for a networking happy hour with light appetizers and drinks!
    Special Thanks to Our Happy Hour Sponsor:


    NEW! The 2017 Atlanta Expo will feature an Equipment Showcase with functioning machines right on the show floor! Don't miss the chance to see live demonstrations from some of the area’s leading suppliers!

    Special Thanks to Our Equipment Showcase Participants:









    2017 CHARITY RAFFLE INFORMATION

    The Atlanta Chapter is holding a charity raffle again this year with drawings for great prizes throughout the day.

    Special Kneads and Treats Special Kneads and Treats, a non-profit specialty bake shop, provides free birthday cakes to children in our community that cannot afford them while providing Special Needs adults in the same community a place to learn a skill and develop a sense of accountability and pride. Our program gives special needs adults the opportunity to serve those less fortunate or in need. Profits from standard sales go back into community programs promoting Special Needs awareness, research and other areas of need.

    Click Here to See the List of Prizes!

    Exhibitors are invited to donate raffle prizes. Raffle tickets will be sold the day of the Expo, with all proceeds benefiting Special Kneads and Treats. For information on how to donate contact SMTA Expo Manager Emily Stuckmayer at emily@smta.org!


  • April 19

    Oregon Defect Resolution Chapter Tutorial Program  +

    Location
    Axiom Electronics
    Beaverton , OR 97006



    Instructor: Jim Hall, ITM Consulting

    April 19, 2017
    8:30 a.m. - 4:00 p.m.
    Axiom Electronic
    19545 NW Von Neumann Drive
    Beaverton, OR 97006


    Price:
  • Members: $200
  • Non-Members: $275 (A one-year Individual SMTA Membership is included in the non-member price.)
  • SMTA Chapter Officers: $100
  • Student Chapter Members: $50
  • Student Non-Members $70 (A one-year Student SMTA Membership is included in the non-member price.)
  • Great Value! Half the cost of a tutorial at SMTA International and offered right in your backyard. Lunch, coffee breaks, course handouts, and a certificate of completion are all included in the cost, along with instruction by one of our best!

    Introduction:
    We don’t assemble electronics in “perfect world”. Defects happen! This course examines Failure and Root Cause analysis of PCBA defects, starting with clear definition of the generic types of defects and their impact, such as non-function, reduced reliability, etc. Detection and determination methodologies and procedures will be discussed. Cause and effect of defects relative to specific processes and equipment centers as well as materials are presented. Key causes of assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing Failure and Root Cause analysis and defect resolution including managers, engineers and others in manufacturing, quality and design.

    Course Outline:
    Part 1

  • Introduction
    - Prevention: Process Development and Validation
    - Variation (Common Cause)
    - Continuous Improvement
  • Defect Definition
    - Failure – PCBA does not function
    - Repair or Scrap
    - Escapes – Identified by customer
    - Reduced Reliability
    - Process Indicator
    - Special Cause vs. Common Cause
  • Defect Identification
    - Inspection
        * Manual
        * AOI
        * X-Ray
    - Test
        * ICT
        * Functional
        * Contamination
    - False Calls / Escapes

  • Causes of Defects
    - Special Cause vs. Common Cause
    - Variability (repeatability)
    - Accuracy
    - Process not Optimized
  • Root Cause Analysis
    - “5 Whys”
    - Cause and Effect Diagram
        * 6 M’s
        * Levels: Specific Processes vs Interactions

  • Process Relationships
    - Incoming Materials
    - Handling
    - Process Problems
        * Wrong Process
        * Degraded Process
        * Poor Process (common cause defects)

    Part 2

  • Specific Processes
    - General: wrong process, material, etc.
    - Printing
    - Placement
    - Soldering
    - Singulation
    - Coating
    - Mechanical Assembly
    - Testing

  • Specific Defect Examples and Causes
    - Wrong Part
    - Damaged Parts
    - Shorts
    - Opens
    - Poor Wetting
    - Insufficient
    - Contamination
    - New Specific Defects
        * HiP
        * Graping
    - Pad Cratering
    - CAF

  • Conclusion
  • Questions

    Jim Hall About the Instructor:

    Jim Hall
    Jim Hall is a Principal Consultant and resident Lean Six Sigma Master Black Belt with ITM Consulting (Springfield, TN). His area of responsibility includes working with OEM’s, Contract Assemblers, and Equipment Manufacturers to solve design and assembly problems, optimize facility operations, as well as teaching basic and new technologies in private and public forums throughout the industry, world-wide. He is one of the featured “Assembly Brothers” on the audio feature “Board Talk” hosted on the Circuit Insight online magazine. Since joining ITM in 2001, Mr. Hall has helped numerous clients in such areas as:

  • SMT implementation and assembly facility set-up
  • SMT manufacturing process audits and process improvement
  • Manufacturing yield improvement
  • Productivity analysis and optimization
  • On-site training for all levels of personnel
  • Design for Manufacturability (DFM) specification development
  • Equipment evaluation and selection
  • SMT process equipment benchmark testing and evaluation
  • SMT product development

    Jim is one of the authors of the highly acclaimed SMTA Process Certification Course, along with Dr. Ron Lasky and Phil Zarrow. From its introduction in September 2002, he has served as the program’s principal instructor, certifying over 500 engineers in the US, Canada, Mexico, Malaysia, Hong Kong, and China. Mr. Hall, coordinates and implements all updates and improvements to the exams and course materials.

    As ITM’s resident Lean Six Sigma Master Black Belt, Jim is a strong proponent of in-process data capture and analysis for all assembly and related operations and other continuous improvement techniques. He participates as an instructor in the Lean – Six Sigma programs offered through the Thayer Engineering School, Dartmouth College, presenting units on subjects including:

  • LEAN
  • FMEA
  • DFM
  • DMAIC
  • Cost Estimating
  • Failure Analysis

    Mr. Hall, one of the pioneers of reflow technology, has been actively involved in electronic assembly technology for over 35 years. Jim’s expertise lies in process development and integration, fluid and thermodynamics, and computer control systems. He has delivered numerous papers and workshops on surface mount technology at technical seminars around the world including those for SMTA, IPC, and IMAPS.


    Contact Karen Frericks at 952-920-7682 with questions.


  • April 25 - 27

    SMTA China East Technology and Vendor Conferences 2017   +

    Location
    Shanghai World Expo Exhibition & Convention Center
    Shanghai China



    Technology Conference: 25-26 April 2017
    Vendor Conference: 25-27 April 2017
    Shanghai World Expo Exhibition & Convention Center

    The SMTA China cordially invites you to participate in SMTA China East Conference located in Shanghai 2017. This event, held in conjunction with NEPCON China 2017, will as usual address the industry's most pressing issues in electronics assembly/ manufacturing, industry/technology roadmap, business focus, advanced packaging, practical skill development, emerging technologies, and lead-free & reliability.


    Looking for a local chapter event? Check the Chapter News page for more events.
    SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344 USA

    Phone 952.920.7682
    Fax 952.926.1819