Virtual and Augmented Reality – New Devices and New Challenges
Speaker: Brian Toleno,Ph.D., Microsoft Corporation
Within the electronics industry we have seen the drivers of technology move from military and industrial electronics to mobile devices. Looking to the future there are a few areas that are discussed with respect to rapid growth in the electronics area: internet of things (IoT), wearable devices, and AR/VR. With over 1 Billion dollars invested in this technology in 2016 (DigiCapital) and the number of devices rising to over 100 million units by 2020 (Statista). These devices pose some unique challenges with respect to not only the optical requirements, but the electronics to drive these systems. In this presentation we will review the current devices and players in the market, explore the current technology employed to build these devices, and discuss the challenges to enable future technologies in this exciting area.
X-Ray Inspections for PCBA - Challenges and New Developments
Speaker: Elbert Suen, Flex
X-ray inspection systems are key tools for quality control, yield enhancement, and failure analysis of advanced printed circuits board assemblies (PCBA). The electronics industry has witnessed significant improvements in the X-ray inspection capabilities (AXI, 2DX, 3D CT, Large Board CT) during the last twenty years. These advancements have aided in the development of new high performance packages and PCBA processes. In many cases, X-Ray inspection is the only non-destructive technique to inspect optically hidden components and solder joints such as BGA, POP, QFN, flip chips, through holes, etc. Automated X-Ray inspection (AXI) has been available since 1999 at our manufacturing sites, and plays very important role to assure high quality SMT process. Along the way, manual X-ray systems (2DX and 3D CT) have been providing invaluable testing capabilities for verifying the AXI results, fine tuning the AXI parameters, process development, and X-ray inspection that is out of the scope of the AXI equipment.
Through the years these capabilities have been significantly improved and best practices have been developed on how to jointly use the AXI, 2DX(MXI), and 3D CT X-ray equipment to achieve best possible testing results and speed. In this paper, we will summarise the extensive experience we have accumulated while working on real problems together with our customers, X-ray inspection vendors and R&D teams. These projects include BGA HIP (head in pillow), solder charge connector, Package on Package, package 03015. In addition, we will discuss how to optimize test coverage and eliminate defect escapes during PCBA testing. These studies have been performed using variety of X-ray inspection systems at several production sites and lasted several years.
We will also discuss the X-ray inspection capabilities that are considered most important to the PCBA manufacturing process including: 1. Highest resolution X-ray images and clear distinction between good and defective pins; 2. Measurement data from inspection output; 3. Operator independent automated results for pass/fail condition; 4. Non-destructive e-cross section; 5. Easy and intuitive operation and programing; 6. Real time data feedback; 7. Flexible automated algorithms that are easily adjustable by the machine operator; 8. Zero defect escape with reasonable false call PPM.
Best Practices for Responsible, Efficient Technologies when Outsourcing Design and Manufacturing
Speaker: Pamela J. Gordon, Antea Group
When OEMs outsource product design and manufacturing, many have experienced reduced visibility to environmental compliance, slippage in Eco-Design progress, and compromises in using advanced efficient technologies. It doesn’t have to be this way. By deploying best practices and choosing suppliers well, OEMs can realize greater visibility to product compliance, higher levels of Eco-Design, and adoption of more efficient technologies. Pamela J. Gordon is a 26-year member of the SMTA and has objectively chronicled electronics outsourcing practices since 1984. In this presentation, she will lend her insights on maximizing products’ responsibility, innovation, and efficiency when outsourcing, drawing upon her experience training >1,000 electronic-product designers in meeting environmental regulations, exceeding compliance through Eco-Design, and assessing the latest resource-efficient technologies. OEM participants will gain actionable insights on how to best leverage their outsourcing suppliers, and outsourcing suppliers will have a roadmap for being the supplier of choice for providing OEMs with responsible and advanced products.
Tour of Bestronics Facility