The Empire Expo & Tech Forum has SOLD OUT! Please contact Kaitlyn to be put on a wait list at firstname.lastname@example.org or call 952-920-7682. Thank you!
The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information). The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $30 per outlet. Early bird pricing ends on May 19, 2017!
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Important Exhibitor Materials:
Hard Copy of Exhibitor Application
Please contact SMTA Expo Manager Kaitlyn Gherity with questions or for additional information.
Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!
Free Technical Program & Schedule:
Special Thanks to our Coffee Break Sponsor, Nortec Humidity!
9:00AM – 10:00AM
Investigating Test Methods for Electrochemical Consistency in PCB Assembly Processes
Speaker: Brook Sandy-Smith, Indium Corporation
There are several industry accepted methods for determining the electrochemical reliability for electronic assemblies. These methods are typically designed to either simulate humid environments in accelerated lifetime testing, or assess the species of ionic residues present on surfaces. Some can be used to test prototypes, or test boards; some are more applicable for quality and consistency testing in a production environment. The increasing complexity of high density assemblies, along with low standoff components, imposes greater associated challenges related to assessing electrochemical reliability. This has led to development and adoption of new methods for testing ionic residues that can lead to electrochemical migration. This paper will review traditional and emerging methods to characterize flux residues and cleanliness of finished assemblies, including surface insulation resistance, electrochemical migration, ROSE extraction and other emerging test methods. Data will be shared showing how different methods can detect process variations in different ways, and compare the results.
11:00AM – 12:00PM
Cleanliness Process Design Considerations
Speaker: Debbie Carboni, KYZEN Corporation
Cleanliness is a product of design, including component density, standoff, height and design for flow. As space and weight continue to be reduced, size, pitch between conductors and standoff height reduce. Smaller components are more susceptible to contamination effects due to low standoff gaps. Residues trapped under the body of the component can still be active due to poor outgassing channels as well the potential to shield the soldering area from receiving flux heat in reflow, which creates pools of activated flux residue. Residues can be mobilized with moisture, create leakage currents, bridge power and ground, or act as seed points for dendrite growth or corrosion events. Residues on printed circuit boards are directly related to the reliability of the final product. How Clean is Clean enough requires test methods to determine the activity of residues trapped under the bottom termination. Site specific test methods can be an effective tool to help the assembler determine how clean is clean enough. These test methods allow the assembler to design a reliable assembly process by testing design factors, the selection of soldering materials, characterizing reflow conditions and cleaning processes.
1:30PM – 2:30PM
Chemical Data vs. Electrical Data is One A Better Reliability Predictor?
Speaker: Mark Northrup, IEC Electronics
The goal of this study was to correlate IPC Chemical and Electrical CAF test results. The electrical testing utilized for the test coupons was found within the PCQR2 Database document. The chemical testing of the coupons utilized Ion Chromatography (IC) testing in accordance with IPC-TM- 650, method 2.3.28.